Wafer cleaning equipment and wafer cleaning method

Abstract

The invention discloses wafer cleaning equipment and a wafer cleaning method, and belongs to the technical field of wafer cleaning. The groove type cleaning machine and the single-piece scrubbing machine are arranged side by side, so that after cleaned wafers are conveyed to the material waiting station through the first wafer taking assembly, the second wafer taking assembly in the single-piece scrubbing machine conveys the wafers to the scrubbing and spin-drying assembly through the wafer inlet and the wafer outlet to be further cleaned and dried. Namely, the groove-type cleaning machine and the single-piece brushing machine are integrated and linked to clean and dry the wafer, and the technological process that the wafer subjected to groove-type cleaning is manually carried into wafer drying equipment and then the dried wafer is manually carried into the single-piece brushing machine in the related technology can be omitted. Therefore, the instability of wafer conveying by personnel is reduced while the equipment investment cost is reduced, the risk caused by possible misoperation of the personnel is reduced, the wafer cleaning efficiency and the cleaning process capability are improved, and the yield of integrated wafer products is ensured.

Description

Technical Field

[0001] This application relates to the technical field of wafer cleaning, and particularly to a wafer cleaning device and a wafer cleaning method. Background Art

[0002] A wafer refers to the basic raw material used for manufacturing semiconductor devices. For example, it is a wafer obtained on materials such as silicon, sapphire, silicon carbide, gallium nitride, gallium oxide, lithium tantalate, and lithium niobate, and is used in fields such as photovoltaic devices, LED lighting elements, and power devices. After the ingot is ground, polished, and sliced, a wafer is formed, that is, a wafer. The main processing methods of wafers are sheet processing and batch processing, that is, processing 1 wafer or multiple wafers simultaneously. Currently, in the wafer processing technology, the cleaning process is the most important process step affecting the cleanliness of the wafer surface. Therefore, there is an urgent need to provide an efficient wafer cleaning device. Summary of the Invention

[0003] Embodiments of this application provide a wafer cleaning device, which can solve the problem of the urgent need for an efficient wafer cleaning device in the prior art. The technical solutions are as follows: On the one hand, a wafer cleaning device is provided. The wafer cleaning device includes: A tank cleaning machine and a single wafer brush machine arranged side by side; The tank cleaning machine includes: a first housing, a first wafer picking component and two groups of wafer gripping and transferring components installed in the first housing, and two chemical liquid tanks, two transfer stations, and at least one cleaning water tank distributed between the first wafer picking component and the two groups of wafer gripping and transferring components. The chemical liquid tank and the cleaning water tank both have a plurality of vertically arranged tanks; the transfer station has a horizontally arranged support position; one side of the first housing close to the single wafer brush machine has a wafer outlet and is provided with a waiting station located between the first wafer picking component and the wafer outlet. The single wafer brush machine includes: a second housing, a second wafer picking component and at least one brush and spin-drying component installed in the second housing. One side of the second housing close to the first housing has a wafer inlet. Among them, the first wafer picking component is used to: grab a single wafer to be washed and transfer it to the support position; each group of wafer gripping and transferring components is used to: grab a single wafer to be washed on the support position, flip it by a target angle and place it in the chemical liquid tank, or, grab the wafer washed in the chemical liquid tank to the cleaning water tank, or, grab the wafer in the cleaning water tank, flip it by the target angle and place it on the support position; the first wafer picking component is also used to: grab the washed wafer on the support position to the waiting station; the second wafer picking component is used to: transfer the wafer on the waiting station to the brush and spin-drying component through the wafer inlet and the wafer outlet. Optionally, the first housing and the second housing are arranged in a first direction; the two liquid medicine tanks are arranged in the first direction, the two transfer platforms are located between the two liquid medicine tanks, and the at least one cleaning water tank is located between the two transfer platforms; Wherein, the arrangement direction of the second wafer picking assembly and the brushing and drying assembly is parallel to the arrangement direction of the first wafer picking assembly and the two groups of wafer gripping and transferring assemblies, the first wafer picking assembly and the two groups of wafer gripping and transferring assemblies are arranged in a second direction, and the second direction is perpendicular to the first direction.

[0004] Optionally, the wafer gripping and transferring assembly includes: a translation mechanism, a lifting mechanism, a rotation driving member, a clamping arm driving member, and two clamping arms arranged in parallel. The translation mechanism is installed at the bottom of the first housing and extends along the first direction; the lifting mechanism is slidably connected to the translation mechanism and extends along a third direction; the rotation driving member is installed on the lifting mechanism, and the rotation axis of the rotation driving member is fixedly connected to the clamping arm driving member; the third direction is perpendicular to both the first direction and the second direction; One ends of the two clamping arms are both connected to the clamping arm driving member. One end of one clamping arm, which is away from the clamping arm driving member, has two first limiting clamping protrusions arranged oppositely, and one end of the other clamping arm, which is away from the clamping arm driving member, has two second limiting clamping protrusions arranged oppositely. A clamping space is formed between the two first limiting clamping protrusions and the two second limiting clamping protrusions; Wherein, the rotation driving member is configured to: drive the clamping arm driving member to rotate by the target angle around the rotation axis of the rotation driving member; the clamping arm driving member is configured to: drive the two clamping arms to move relatively, so as to drive the two first limiting clamping protrusions and the two second limiting clamping protrusions to move towards each other or away from each other.

[0005] Optionally, one clamping arm is a U-shaped clamping arm, and a part of the other clamping arm extends into the hollow area of the U-shaped clamping arm and is fixedly connected to the clamping arm driving member; wherein, the two first limiting clamping protrusions are respectively located at two ends of the U-shaped clamping arm, and the two second limiting clamping protrusions are located at one end of the other clamping arm, which is away from the clamping arm driving member.

[0006] Optionally, the first wafer picking component includes: a first translation mechanism, a first lifting mechanism, a first rotation driving member, a translation driving member, and a wafer clamping mechanism, which are sequentially arranged along the bottom away from the first housing. The first translation mechanism is installed at the bottom of the first housing and extends along the first direction. The first lifting mechanism is installed on the first translation mechanism and extends along the third direction. The first rotation driving member is installed on the first lifting mechanism, and the rotation axis of the first rotation driving member is fixedly connected to the translation driving member. The wafer clamping mechanism is installed on the translation driving member. Wherein, the translation driving member is configured to: drive the wafer clamping mechanism to pick up the unwashed wafer and transport it to the support position, or transport the wafer at the support position to the waiting material station. The first rotation driving member is configured to: drive the translation driving member and the wafer clamping mechanism to rotate synchronously.

[0007] Optionally, the wafer clamping mechanism includes: a fixed support plate, a clamping support plate, and a support plate driving member. One end of the fixed support plate is fixedly connected to the translation driving member. The support plate driving member is fixed on the translation driving member, and the telescopic shaft of the support plate driving member is fixedly connected to one end of the clamping support plate. Wherein, the other end of the fixed support plate has a first bearing arc surface, and the other end of the clamping support plate has a second bearing surface. The support plate driving member is configured to: drive the clamping support plate to move in a direction close to or away from the other end of the fixed support plate.

[0008] Optionally, the number of the wafer clamping mechanisms and the number of the translation driving members are both at least two, and the fixed support plates, the clamping support plates, and the support plate driving members in the at least two wafer clamping mechanisms are stacked.

[0009] Optionally, the transfer table has a set of multiple first limit support protrusions distributed in a ring at the support position, and a set of multiple second limit support protrusions distributed in a ring. The multiple first limit support protrusions are distributed in the ring area surrounded by the multiple second limit support protrusions. Wherein, the top of the second limit support protrusion protrudes from the top of the first limit support protrusion. The multiple first limit support protrusions are used to support the first type of wafer, and the multiple second limit support protrusions are used to support the second type of wafer.

[0010] Optionally, the transfer table includes: a first table body, and a second table body distributed around the first table body. The multiple first limit support protrusions are arranged on the first table body, and the multiple second limit support protrusions are arranged on the second table body. The tank cleaning machine further comprises: a second lifting mechanism and a second rotating driving member, wherein the second lifting mechanism is connected to the first housing, the second rotating driving member is mounted on the second lifting mechanism, and the rotating shaft of the second rotating driving member is connected to the first platform; the second platform is connected to the second lifting mechanism; The second rotating driving member is configured to: drive the first platform to rotate while driving the first type of wafer to rotate a certain angle, so that the positioning edge of the first type of wafer is staggered with the clamping space.

[0011] Optionally, the first position-limiting support protrusion and the second position-limiting support protrusion both include: a support column and a position-limiting column, the bottom of the support column is fixed on the transfer table, the diameter of the position-limiting column is smaller than the diameter of the support column, and the position-limiting column is fixed to the central area of ​​the top of the support column; the edge area of ​​the top of the support column has a support surface; Wherein, the supporting surface is used for cooperating and contacting with the chamfered surface of the edge of the wafer.

[0012] On the other hand, an embodiment of the present application further provides a wafer cleaning method, which is applied to any of the wafer cleaning devices described above.

[0013] The first wafer picking component grabs a single wafer to be cleaned and transfers it to a support position, and the wafer grabbing and transferring component grabs a single wafer to be cleaned on the support position, flips it to a target angle, and then places it in a liquid medicine tank; The grabbing and transferring assembly grabs the cleaned wafers in the liquid medicine tank and transfers them to the cleaning water tank; The grabbing and transferring assembly grabs the wafer in the cleaning water tank, leaves the cleaning water tank, flips the wafer to the target angle, and places the wafer at the supporting position; The first wafer picking assembly grabs the cleaned wafer on the support position and moves it to the material waiting position; The second wafer taking assembly transfers the wafers on the waiting station to the scrubbing and drying assembly through the wafer outlet of the first shell and the wafer inlet of the second shell.

[0014] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least: By arranging the slot cleaning machine and the single - wafer brushing machine side by side, the first housing in the slot cleaning machine and the second housing in the single - wafer brushing machine respectively have a wafer output port and a wafer input port. In this way, after the cleaned wafers are transported to the waiting station by the first wafer - picking component, the second wafer - picking component in the single - wafer brushing machine transports the wafers on the waiting station to the brushing and drying component in the single - wafer brushing machine through the input port and the output port for further cleaning and drying. That is to say, integrating and linking the slot cleaning machine and the single - wafer brushing machine to achieve the cleaning and drying of wafers can omit the process in the related technology of manually transporting the wafers after slot cleaning to the wafer drying equipment and then manually transporting the dried wafers to the single - wafer brushing machine. In this way, while reducing the equipment investment cost, it also reduces the instability of manual wafer transfer, greatly reduces a series of risks caused by possible misoperations of employees, and improves the cleaning efficiency of wafers. In addition, since both the slot cleaning machine and the single - wafer brushing machine can perform flow - through cleaning of wafers, the number of cleaning tanks can be relatively reduced, and the required tank capacity can also be relatively reduced. Therefore, the amount of water used and the amount of chemicals used are relatively small, and even the power consumption is reduced, achieving the purpose of energy conservation and emission reduction.

[0015] For example, by arranging the slot cleaning machine and the single - wafer brushing machine side by side, and reducing the number of liquid medicine tanks and cleaning water tanks in the slot cleaning machine, the equipment manufacturing cost is lower, and the occupied space of the equipment is expected to be reduced by 50% in the clean room; compared with the prior art, the usage amount of chemicals in the liquid medicine tank is reduced by 50% and the waste liquid discharge is reduced by 60%, greatly improving the environmental friendliness; the wafer yield of the integrated equipment composed of the slot cleaning machine and the single - wafer brushing machine is increased by 3% - 8% compared with the wafer yield of the existing multi - machine independent setting; from the existing situation of one person operating one machine in multiple machines to one person controlling the integrated equipment in this application, the labor cost is saved by more than 40%. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 is the front view of a wafer cleaning device provided by an embodiment of the present application; Figure 2 is Figure 1 the internal top view of the wafer cleaning device shown; Figure 3 is Figure 2 the top view of a partial structure of the wafer cleaning device shown; Figure 4It is a partial structural schematic diagram of a slot cleaning machine provided by an embodiment of the present application; Figure 5 It is a partial structural schematic diagram of a slot cleaning machine provided by an embodiment of the present application; Figure 6 It is a partial structural schematic diagram of another slot cleaning machine provided by an embodiment of the present application; Figure 7 It is a partial structural schematic diagram of yet another slot cleaning machine provided by an embodiment of the present application; Figure 8 It is Figure 7 A structural schematic diagram of a perspective shown; Figure 9 It is Figure 7 A partial enlarged schematic diagram of the partial structure shown; Figure 10 It is a side view of a first wafer picking component provided by an embodiment of the present application; Figure 11 It is a partial structural schematic diagram of still another slot cleaning machine provided by an embodiment of the present application; Figure 12 It is Figure 11 A partial enlarged schematic diagram of the structure shown; Figure 13 It is an internal top view of a slot cleaning machine provided by an embodiment of the present application; Figure 14 It is an exploded schematic diagram of a stage and a wafer cassette provided by an embodiment of the present application; Figure 15 It is Figure 14 An assembled schematic diagram of the wafer cassette shown; Figure 16 It is a structural schematic diagram of a wafer waiting device provided by an embodiment of the present application; Figure 17 It is Figure 16 A front view of the wafer waiting device shown; Figure 18 It is a structural schematic diagram of another wafer waiting device provided by an embodiment of the present application; Figure 19 It is Figure 18 A partial structural schematic diagram of the wafer waiting device shown; Figure 20 It is Figure 19 A partial structural schematic diagram of the wafer waiting device shown.

[0018] Among them, the trough-type cleaning machine 100, single-piece brushing machine 200, wafer A, first housing 101, first wafer picking component 102, wafer gripping and transferring component 103, liquid medicine tank 104, transfer table 105, cleaning water tank 106, tank body a1, support position W, wafer outlet b1, waiting material station D, second housing 201, second wafer picking component 202, brushing and drying component 203, wafer inlet b2, auxiliary protection tank 300, protection cover 400, flipping mechanism 500, connecting rod member 501, driving cylinder 502, first direction f1, translation mechanism 103a, lifting mechanism 103b, rotation driving member 103c, clamp arm driving member 103d, two clamp arms 103e, second direction f2, third direction f3, first limiting and clamping convex part B1, second limiting and clamping convex part B2, first translation mechanism 102a, first lifting mechanism 102b, first rotation driving member 102c, translation driving member 102d, wafer clamping mechanism 102e, fixed support plate C1, clamping support plate C2, support plate driving member C3, first bearing arc surface m1, second bearing surface m2, buffer screw 102f, first limiting and supporting convex part D1, second limiting and supporting convex part D2, first table body 1051, second table body 1052, second lifting mechanism 600, second rotation driving member 700, support column D11, limiting column D12, stand 107, wafer cassette 108, first positioning and clamping part 107a, second positioning and clamping part 108a, first type of clamping part 107a1, second type of clamping part 107a2, position sensor 109, wafer waiting material device 110, cleaning water tank shell 111, support frame 112, lifting driving member 113, wafer limiting member 114, driving member 115, inlet p1, outlet p2, accommodation cavity p3, annular limiting groove X, circulation hole k1, adapter plate 114a, wafer limiting rod 114b, outer frame 1121, support plate 1122, third limiting and supporting convex part T, first supporting surface m4, first type of supporting convex part T1, second type of supporting convex part T2, first translation driving member 116, translation driving cylinder 1161, moving slider 1162, mounting frame 1131, driving motor 1132, transmission lead screw 1133, lifting connecting frame 1134.

[0019] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed Embodiments

[0020] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the drawings.

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, the appearances of "in one embodiment" or "in an embodiment" throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0023] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , Figure 1 which is a front view of a wafer cleaning device provided by an embodiment of the present application, Figure 2 is Figure 1 the internal top view of the wafer cleaning device shown, Figure 3 is Figure 2 the top view of a partial structure of the wafer cleaning device shown, Figure 4 which is a schematic diagram of a partial structure of a tank cleaning machine provided by an embodiment of the present application. The wafer cleaning device may include: a tank cleaning machine 100 and a single wafer scrubber 200 arranged side by side.

[0024] The slot-type cleaning machine 100 may include: a first housing 101, a first wafer picking component 102 installed in the first housing 101, and two groups of wafer gripping and transferring components 103, as well as two chemical solution tanks 104, two transfer tables 105, and at least one cleaning water tank 106 distributed between the first wafer picking component 102 and the two groups of wafer gripping and transferring components 103. Each chemical solution tank 104 and each cleaning water tank 106 may have a plurality of vertically arranged tank bodies a1. Each transfer table 105 may have a horizontally arranged support position W. One side of the first housing 101 close to the single wafer brushing machine 200 may have a wafer outlet b1, and a waiting material station D located between the first wafer picking component 102 and the wafer outlet b1 may be provided in the first housing 101. Here, the number of cleaning water tanks 106 may be two. The two chemical solution tanks 104 may correspond to the two cleaning water tanks 106 respectively, and the two groups of wafer gripping and transferring components 103 may correspond to the two chemical solution tanks 104 respectively. Each tank body a1 in the chemical solution tank 104 may be used to place a single wafer, and each tank body a1 in the cleaning water tank 106 may be used to place a single wafer. By way of example, the number of tank bodies a1 in the chemical solution tank 104 may be 5 to 15, and the number of tank bodies a1 in the cleaning water tank 106 may be 3 to 10. It should be noted that each chemical solution tank 104 may introduce different cleaning solutions or the same cleaning solution according to the actual cleaning needs of the user, and no specific limitation is made here.

[0025] The single wafer brushing machine 200 may include: a second housing 201, a second wafer picking component 202 installed in the second housing 201, and at least one brushing and drying component 203. One side of the second housing 201 close to the first housing 101 may have a wafer inlet b2.

[0026] Among them, the first wafer picking component 102 in the slot-type cleaning machine 100 may be used to: grab a single wafer A to be washed, flip it by a target angle and place it in the chemical solution tank 104, or grab the wafer A after cleaning in the chemical solution tank 104 to the cleaning water tank 106, or grab the wafer A in the cleaning water tank 106, flip it by a target angle and place it on the support position W of the transfer table 105. The first wafer picking component 102 may also be used to: grab the washed wafer on the support position W of the transfer table 105 to the waiting material station D in the first housing 101. The second wafer picking component 202 in the single wafer brushing machine 200 may be used to: transfer the wafer A at the waiting material station D to the brushing and drying component 203 through the wafer inlet b2 on the second housing 201 and the wafer outlet b1 in the first housing 101.

[0027] Exemplarily, the process flow of the wafer cleaning and drying by the wafer cleaning equipment is schematically described herein: First, the first wafer picking component 102 can pick up a single wafer A to be washed each time and transfer it to the support position W of any transfer station 105; then, the wafer picking and transferring component 103 picks up a single horizontally placed wafer A at the support position W each time, rotates the wafer by a target angle, and then vertically places it into the chemical liquid tank 104 for cleaning; then, after the wafer A is cleaned, the wafer picking and transferring component 103 takes out the vertically placed wafer A from the corresponding chemical liquid tank 104 again and places the wafer in the cleaning water tank 106 to clean the residual chemical liquid. Then, the wafer picking and transferring component 103 picks up the vertically placed wafer A, takes it out of the cleaning water tank 106, rotates it by the target angle, and then horizontally places it at the support position W; then, the first wafer picking component 102 places the washed wafer A at the support position W on the waiting material station D; finally, the second wafer picking component 202 picks up the wafer A at the waiting material station D and transfers it to the brushing and drying component 203 for further cleaning and drying.

[0028] Here, the brushing and drying component 203 in the single wafer brushing machine 200 can include a single-sided brushing machine and / or a double-sided brushing machine, and the brushing and drying component 203 can clean and dry one wafer each time.

[0029] In the embodiment of the present application, the tank type cleaning machine 100 and the single wafer brushing machine 200 are arranged side by side, and the first housing 101 in the tank type cleaning machine 100 and the second housing 201 in the single wafer brushing machine 200 respectively have a wafer output port b1 and a wafer input port b2. In this way, after the first wafer picking component 102 transports the washed wafer A to the waiting material station D, the second wafer picking component 202 in the single wafer brushing machine 200 transports the wafer A at the waiting material station D to the brushing and drying component 203 in the single wafer brushing machine 200 through the wafer input port b2 and the wafer output port b1 for further cleaning and drying. That is, the tank type cleaning machine 100 and the single wafer brushing machine 200 are integrated and linked to realize the automatic cleaning and drying of the wafer A, which can omit the process flow in the related art of manually transporting the wafer after tank type cleaning into the wafer drying equipment and then manually transporting the dried wafer into the single wafer brushing machine. In this way, while reducing the equipment investment cost, the instability of personnel wafer transfer is also reduced, the series of risks caused by possible misoperations of employees are greatly reduced, the cleaning efficiency of the wafer and the process ability of the cleaning are improved, and the yield of the integrated wafer product is ensured. In addition, since both the tank type cleaning machine 100 and the single wafer brushing machine 200 can perform circulating cleaning on the wafer, the number of cleaning tanks can be relatively reduced, and the required tank capacity can also be relatively reduced. Therefore, the amount of water used and the amount of chemicals used are relatively small, and even the power consumption is reduced, achieving the purpose of energy conservation and emission reduction.

[0030] In summary, the embodiment of the present application provides a wafer cleaning device, which may include: a tank cleaning machine and a single wafer scrubber arranged side by side. By arranging the tank cleaning machine and the single wafer scrubber side by side, and the first housing in the tank cleaning machine and the second housing in the single wafer scrubber respectively have a wafer output port and a wafer input port. In this way, after the wafer after cleaning is transported to the waiting station by the first wafer picking component, the second wafer picking component in the single wafer scrubber transports the wafer on the waiting station to the scrubbing and drying component in the single wafer scrubber through the input port and the output port for further cleaning and drying. That is, the tank cleaning machine and the single wafer scrubber are integrated and linked to realize the cleaning and drying of the wafer, which can omit the process flow in the related art of manually transporting the wafer after tank cleaning into the wafer drying device and then manually transporting the dried wafer into the single wafer scrubbing machine. In this way, while reducing the equipment investment cost, the instability of manual wafer transfer is also reduced, and a series of risks caused by possible misoperations of employees are greatly reduced, and the wafer cleaning efficiency and the cleaning process capability are improved, ensuring the yield of the integrated wafer products. In addition, since both the tank cleaning machine and the single wafer scrubber can perform flow-through cleaning on the wafer, the number of cleaning tanks can be relatively reduced, and the required tank capacity can also be relatively reduced, so the amount of water and chemical agents used is relatively small, including the consumption of electric energy is also reduced, achieving the purpose of energy conservation and emission reduction.

[0031] In the present application, as Figure 4 shown, the wafer cleaning device may further include: two auxiliary protection tanks 300, and these two auxiliary protection tanks 300 may correspond to the two chemical solution tanks 104 respectively. Among them, the chemical solution tank 104 may be installed in the tank body of the corresponding auxiliary protection tank 300. By way of example, the material of the chemical solution tank 104 may be quartz, and the material of the auxiliary protection tank 300 may be polyvinyl chloride (English: Polyvinyl chloride; Abbreviation: PVC).

[0032] It should be noted that, in order to ensure the sealing performance of the chemical solution tank 104 when cleaning the wafer, please refer to Figure 5 , Figure 5It is a partial structural schematic diagram of a slot cleaning machine provided by an embodiment of the present application. The wafer cleaning device may further include: a protective cover 400 corresponding to the opening of the liquid medicine tank 104, and a flipping mechanism 500 respectively connected to the protective cover 400 and the first housing 101. Wherein, the flipping mechanism 500 may be configured to: drive the protective cover 400 to flip to cover the opening of the liquid medicine tank 104, or drive the protective cover 400 to flip and separate from the opening of the liquid medicine tank 104. By way of example, the flipping mechanism 500 may include: a connecting rod member 501 and a driving cylinder 502. The driving cylinder 502 may be located on the outer side surface of the liquid medicine tank 104, and the telescopic shaft of the driving cylinder 502 may be connected to the connecting rod member 501. The end of the connecting rod member 501 away from the driving cylinder 502 may be fixedly connected to the protective cover 400. In this way, during the telescopic process of the telescopic shaft of the driving cylinder 502, the protective cover 400 can be driven to flip through the connecting rod member 501.

[0033] Optionally, as Figure 2 shown, the first housing 101 in the slot cleaning machine 100 and the second housing 201 in the single wafer brushing machine 200 may be arranged along the first direction f1. The two liquid medicine tanks 104 may be arranged along the first direction f1. The two transfer stations 105 may be distributed between the two liquid medicine tanks 104. At least one cleaning water tank 106 may be located between the two transfer stations 105. Wherein, the arrangement direction of the second wafer picking component 202 and the brushing and drying component 203 may be translated parallel to the arrangement direction of the first wafer picking component 102 and the two groups of wafer gripping and transferring components 103. And the first wafer picking component 102 and the two groups of wafer gripping and transferring components 103 may be arranged along the second direction f2. Here, the second direction f2 may be perpendicular to the first direction f1. In this case, the first housing 101 in the slot cleaning machine 100 and the second housing 201 in the single wafer brushing machine 200 are arranged along the first direction f1. The first wafer picking component 102 and the two groups of wafer gripping and transferring components 103 in the first housing 101, and the second wafer picking component 202 and the brushing and drying component 203 in the second housing 201 may all be arranged along the second direction f2 perpendicular to the first direction f1. In this way, the arrangement manner of multiple components can effectively reduce the overall external dimension of the wafer cleaning device.

[0034] In the embodiment of the present application, please refer to Figure 6 , Figure 6It is a partial structural schematic diagram of another slot cleaning machine provided by an embodiment of the present application. Each wafer gripping and transferring component 103 may include: a translation mechanism 103a, a lifting mechanism 103b, a rotation driving member 103c, a clamping arm driving member 103d, and two clamping arms 103e arranged in parallel. The translation mechanism 103a may be installed at the bottom of the first housing 101 and extend along the first direction f1. The lifting mechanism 103b may be slidably connected to the translation mechanism 103a and extend along the third direction f3, and the third direction f3 may be perpendicular to both the first direction f1 and the second direction f2. The rotation driving member 103c may be installed on the lifting mechanism 103b, and the rotation axis of the rotation driving member 103c may be fixedly connected to the clamping arm driving member 103d. One end of each of the two clamping arms 103e may be fixedly connected to the clamping arm driving member 103d. One end of one clamping arm 103e away from the clamping arm driving member 103d may have two first limiting clamping protrusions B1 arranged oppositely, and one end of the other clamping arm 103e away from the clamping arm driving member 103d may have two second limiting clamping protrusions B2 arranged oppositely. A clamping space may be formed between the two first limiting clamping protrusions B1 and the two second limiting clamping protrusions B2.

[0035] Wherein, the rotation driving member 103c may be configured to: drive the clamping arm driving member 103d to rotate a target angle around the rotation axis of the rotation driving member 103c. The clamping arm driving member 103d may be configured to: drive the two clamping arms 103e to move relatively, so as to drive the two first limiting clamping protrusions B1 and the two second limiting clamping protrusions B2 to move towards or away from each other.

[0036] Exemplarily, the translation mechanism 103a in the wafer gripping and transferring component 103 may drive the lifting mechanism 103b, the rotation driving member 103c, the clamping arm driving member 103d, and the two clamping arms 103e to move integrally along the first direction f1, so that the two clamping arms 103e are arranged to match the positions of the liquid medicine tank 104 and the cleaning water tank 106. The lifting mechanism 103b may drive the rotation driving member 103c, the clamping arm driving member 103d, and the two clamping arms 103e to lift simultaneously along the third direction f3. The rotation driving member 103c may drive the clamping arm driving member 103d and the two clamping arms 103e to rotate a target angle simultaneously, so as to switch the wafer A between a horizontal state and a vertical state. When the translation mechanism 103a drives the two clamping arms 103e to extend to the bottom surface of the wafer A, the clamping arm driving member 103d may drive the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2 on the two clamping arms 103e to move towards each other, so as to clamp the horizontally placed wafer A in the clamping space formed between the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2. In addition, the clamping arm driving member 103d may drive the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2 on the two clamping arms 103e to move away from each other, so as to release the wafer A.

[0037] For example, the arrangement direction of the two first limit clamping protrusions B1 can be parallel to the arrangement direction of the two second limit clamping protrusions B2, and the arrangement direction of the two first limit clamping protrusions B1 can be perpendicular to the arrangement direction of the first limit clamping protrusions B1 and the second limit clamping protrusions B2, and the arrangement direction of the two second limit clamping protrusions B2 can be perpendicular to the arrangement direction of the first limit clamping protrusions B1 and the second limit clamping protrusions B2.

[0038] For example, the translation mechanism 103a may include: a driving motor and a driving screw (not shown in the figure), the lifting mechanism 103b may be connected to the driving screw in a transmission manner; the lifting mechanism 103b may include a lifting cylinder or a transmission assembly of a driving motor and a driving screw; the clamp arm driving member 103d may include a slider cylinder, and the rotation driving member 103c may include a driving motor. It should be noted that the transmission methods of the above-mentioned mechanisms are not specifically limited.

[0039] Optional, such as Figure 6 As shown, one clamp arm 103e can be a U-shaped clamp arm, and a portion of the other clamp arm 103e can extend into the hollow area of ​​the U-shaped clamp arm and be fastened to the clamp arm driving member 103d. Among them, the two first limit clamping protrusions B1 can be respectively located at the two ends of the U-shaped clamp arm, and the two second limit clamping protrusions B2 can be located at one end of the other clamp arm 103e away from the clamp arm driving member 103d. In this case, by setting one clamp arm 103e as a U-shaped clamp arm, and a portion of the other clamp arm 103e extending into the hollow area of ​​the U-shaped clamp arm, the two clamp arms 103e are flushly arranged, so that the structure of the two clamp arms 103e is relatively compact, which is convenient for the miniaturization design of the tank cleaning machine 100.

[0040] Optional, please refer to Figure 7 , Figure 8 and Figure 9 , Figure 7 It is a partial structural diagram of another tank cleaning machine provided in an embodiment of the present application. Figure 8 yes Figure 7 A structural schematic diagram of a perspective is shown. Figure 9 yes Figure 7Schematic diagram of a partial structure shown with local magnification. The first wafer picking component 102 may include: a first translation mechanism 102a, a first lifting mechanism 102b, a first rotation driving member 102c, a translation driving member 102d, and a wafer clamping mechanism 102e, which are sequentially arranged along the bottom away from the first housing 101. The first translation mechanism 102a may be installed at the bottom of the first housing 101 and extend along the first direction f1. The first lifting mechanism 102b may be installed on the first translation mechanism 102a and may extend along the third direction f3. The first rotation driving member 102c may be installed on the first lifting mechanism 102b, and the rotation axis of the first rotation driving member 102c may be fixedly connected to the translation driving member 102d. The wafer clamping mechanism 102e may be installed on the translation driving member 102d. Among them, the translation driving member 102d may be configured to: drive the wafer clamping mechanism 102e to pick up the unwashed wafer and transport it to the support position W, or transport the wafer A at the support position W to the waiting material station D in the first housing 101. The first rotation driving member 102c may be configured to: drive the translation driving member 102d and the wafer clamping mechanism 102e to rotate synchronously.

[0041] Exemplarily, the first translation mechanism 102a may drive the first lifting mechanism 102b, the first rotation driving member 102c, the translation driving member 102d, and the wafer clamping mechanism 102e to move simultaneously along the first direction f1 to cooperate with the arrangement positions of the two transfer stations 105 and the waiting material station D. The first lifting mechanism 102b may drive the first rotation driving member 102c, the translation driving member 102d, and the wafer clamping mechanism 102e to lift simultaneously along the third direction f3 to enable the wafer clamping mechanism 102e to grasp wafers to be washed at different heights. The first rotation driving member 102c may drive the translation driving member 102d and the wafer clamping mechanism 102e to rotate simultaneously, so that the wafer clamping mechanism 102e can grasp the wafer to be cleaned and transport it to the support position W of the transfer station 105, or transport the washed wafer at the support position W to the waiting material station D. The translation driving member 102d may drive the wafer clamping mechanism 102e to move closer to the wafer to be cleaned, or closer to the support position W of the transfer station 105, or closer to the waiting material station D, so that the wafer clamping mechanism 102e can smoothly pick up the wafer A. Here, the first translation mechanism 102a may include the transmission cooperation of a driving motor and a driving lead screw. The first lifting mechanism 102b may include a lifting cylinder. The first rotation driving member 102c may include a rotation motor. The translation driving member 102d may include a telescopic electric cylinder. It should be noted that the embodiments of the present application do not make specific limitations on the transmission methods of the above mechanisms.

[0042] In the embodiments of the present application, as Figures 7 to 9As shown, the collet mechanism 102e may include: a fixed support plate C1, a clamping support plate C2, and a support plate driving member C3. One end of the fixed support plate C1 may be fixedly connected to the translation driving member 102d. The support plate driving member C3 may be fixed on the translation driving member 102d, and the telescopic shaft of the support plate driving member C3 may be fixedly connected to one end of the clamping support plate C2. Wherein, the other end of the fixed support plate C1 has a first bearing arc surface m1, the other end of the clamping support plate C2 may have a second bearing surface m2, and the support plate driving member C3 may be configured to: drive the clamping support plate C2 to move in a direction close to or away from the other end of the fixed support plate C1.

[0043] In this case, the translation driving member 102d may drive the fixed support plate C1 in the collet mechanism 102e to extend under the wafer A, and the wafer is located between the other end of the fixed support plate C1 and the other end of the clamping support plate C2. The support plate driving member C3 drives the clamping support plate C2 to move, so that the second bearing surface m2 in the clamping support plate C2 and the first bearing arc surface m1 in the fixed support plate C1 clamp the wafer A. After the wafer is placed, the support plate driving member C3 may drive the clamping support plate C2 to contract to release the wafer.

[0044] Exemplarily, in order to further ensure the safety performance of the fixed support plate C1 and the clamping support plate C2 when clamping the wafer, as Figure 9 shown, the first wafer picking component 102 may further include: a buffer screw 102f with two ends respectively connected to the clamping support plate C2 and the translation driving member 102d, and the buffer screw can generate a certain buffering effect when the other end of the clamping support plate C2 approaches the other end of the fixed support plate C1.

[0045] In the present application, please refer to Figure 10 , Figure 10 is a side view of a first wafer picking component provided by an embodiment of the present application. The number of the collet mechanisms 102e and the number of the translation driving members 102d may both be at least two, and the fixed support plates C1, the clamping support plates C2, and the support plate driving members C3 in at least two collet mechanisms 102e may be respectively stacked. In this case, by setting a plurality of collet mechanisms 102e, the efficiency of wafer transportation is effectively improved, and further the cleaning efficiency of multiple wafers is improved. For example, the lengths of the fixed support plates C1 of two collet mechanisms 102e among at least two collet mechanisms are different. The length of the fixed support plate C1 in one collet mechanism 102e may be greater than the length of the fixed support plate C1 in another collet mechanism 102e, so that the two collet mechanisms 102e can flexibly adapt to wafers of different sizes, and further improve the flexibility of use of the collet mechanism 102e. During use, the upper collet mechanism 102e may be used to pick up the cleaned wafers, and the lower collet mechanism 102e may be used to pick up the wafers to be cleaned.

[0046] In the embodiments of the present application, please refer to Figure 11 and Figure 12 , Figure 11 which is a partial structural schematic diagram of another slot cleaning machine provided by the embodiments of the present application, Figure 12 and Figure 11 is a partial enlarged schematic diagram of the structure shown. Each transfer table 105 may have a set of multiple first limit support protrusions D1 distributed in a ring at the support position W, and a set of multiple second limit support protrusions D2 distributed in a ring. The multiple first limit support protrusions D1 may be distributed within the area surrounded by the multiple second limit support protrusions D2. Among them, the top of the second limit support protrusion D2 may protrude above the top of the first limit support protrusion D1. The multiple first limit support protrusions D1 may be used to support the first type of wafers, and the multiple second limit support protrusions D2 may be used to support the second type of wafers. In this way, by providing a set of first limit support protrusions D1 and a set of second limit support protrusions D2 at the support position W of each support table 105, in this way, different sizes of wafers can be supported by the two types of limit support protrusions. For example, the size of the first type of wafers supported by the multiple first limit support protrusions D1 may be smaller than the size of the second type of wafers supported by the multiple second limit support protrusions D2. It should be noted that the heights of the multiple first limit support protrusions D1 may be the same, and the heights of the multiple second limit support protrusions D2 may also be the same.

[0047] In the present application, as Figure 11 and Figure 12 shown, the transfer table 105 may include: a first table body 1051, and a second table body 1052 distributed around the first table body 1051. The multiple first limit support protrusions D1 may be provided on the first table body 1051, and the multiple second limit support protrusions D2 may be provided on the second table body 1052. The slot cleaning machine may further include: a second lifting mechanism 600 and a second rotation driving member 700. The second lifting mechanism 600 may be connected to the first housing 101. The second rotation driving member 700 may be installed on the second lifting mechanism 600, and the rotation axis of the second rotation driving member 700 may be connected to the bottom of the first table body 1051. The second table body 1052 may be fixedly connected to the second lifting mechanism 600.

[0048] Among them, the second rotation driving member 700 may be configured to: drive the first table body 1051 to rotate while driving the first type of wafers to rotate by a certain angle, so that the positioning edge of the first type of wafers is staggered from the clamping space formed between the two first limit clamping protrusions B1 and the two second limit clamping protrusions B2. Exemplarily, the second lifting mechanism 600 may include a lifting cylinder, and the second rotation driving member 700 may include a rotation cylinder.

[0049] In this case, the transfer table 105 is provided with a first platform 1051 and a second platform 1052 separated, a plurality of first position-limiting support protrusions D1 are provided on the first platform 1051, and the second rotary drive member 700 is connected to the first platform 1051. In this way, after the plurality of first position-limiting support protrusions D1 support the first type of wafers, the second rotary drive member 700 can drive the first platform 1051 to rotate while driving the first type of wafers to rotate a certain angle, so that the positioning edge of the first type of wafer is staggered with the clamping space, so as to prevent the wafer from falling out of the clamping space after being flipped to a vertical state.

[0050] It should be noted that the length of the positioning edge of the first type of wafer is greater than that of the positioning edge of the second type of wafer.

[0051] For example, Figure 11 and Figure 12 As shown, the first position-limiting support protrusion D1 and the second position-limiting support protrusion D2 may include: a support column D11 and a position-limiting column D12, the bottom of the support column D11 may be fixed on the turntable 105, the diameter of the position-limiting column D12 may be smaller than the diameter of the support column D11, and the position-limiting column D12 may be fixed in the central area of ​​the top of the support column D11. The edge area of ​​the top of the support column D11 may have a support surface m3. Among them, the support surface in the support column D11 may be in contact with the chamfered surface of the edge of the wafer. For example, the support surface m3 may be an arc-shaped conical surface. In this case, taking the first position-limiting support protrusion D1 as an example, the first position-limiting support protrusion D1 is provided with a support column D11 and a position-limiting column D12 that are interconnected, the position-limiting column D12 may be fixed in the central area of ​​the support column D11, and the edge area of ​​the top of the support column D11 is provided with a support surface m3. In this way, the chamfered surface of the wafer edge can contact and cooperate with the supporting surface m3 of the supporting column D11, effectively ensuring the cleanliness requirements of the wafer and reducing the risk of wafer contamination, and the limiting column D12 can play a certain horizontal limiting role on the wafer.

[0052] Optional, please refer to Figure 13 , Figure 14 and Figure 15 , Figure 13 This is a top view of the interior of a tank cleaning machine provided by an embodiment of the present application. Figure 14 is an exploded schematic diagram of a stand and a wafer box provided in an embodiment of the present application, Figure 15 yes Figure 14Schematic diagram of the assembly of the wafer cassette shown. The cassette washer may further include: a gantry 107 and a wafer cassette 108. The gantry 107 may be fixed within the first housing 101 and may be located on the side of the first wafer pickup assembly 102 away from the wafer gripping and transfer assembly 103. The top of the gantry 107 may have a first positioning and clamping portion 107a detachably connected thereto. Among them, the bottom of the wafer cassette 108 may have a second positioning and clamping portion 108a that cooperates with the first positioning and clamping portion 107a. The wafer cassette 108 may be used to place wafers to be cleaned. In this case, the wafer cassette 108 may be connected to the gantry 107 by mating the second positioning and clamping portion 108a with the first positioning and clamping portion 107a in the gantry 107 to facilitate the installation of the wafer cassette 108 on the gantry 107.

[0053] It should be noted that the first positioning and clamping portion 107a may include: a first type of clamping portion 107a1 and a second type of clamping portion 107a2. The first type of clamping portion 107a1 and the second type of clamping portion 107a2 may be adapted to the second positioning and clamping portions 108a in different wafer cassettes 108. It should be noted that different wafer cassettes 108 may accommodate different numbers of wafers and / or wafers of different sizes, which can be actually designed according to the needs of users.

[0054] In the embodiments of the present application, as Figure 14 shown, the cassette washer may further include: a position sensor 109 mounted on the gantry 107. The position sensor 109 may be electrically connected to the pallet drive C3. Among them, the position sensor may be used to detect the position of the wafer cassette 108 on the gantry 107 and send the detected position signal to the pallet drive C3 to control whether the pallet drive C3 is in a working state. In this way, after the position sensor 109 detects that the wafer cassette 108 is properly installed on the gantry 107, it may send a position detection signal to the pallet drive C3 to control the pallet drive C3 to be in a normal working state to grip the wafers to be cleaned in the wafer cassette 108. Exemplarily, the position sensor 109 may include: a microswitch, a reed switch or a Hall switch. The embodiments of the present application do not make specific limitations thereto.

[0055] Optionally, please refer to Figure 13 、 Figure 16 and Figure 17 , Figure 16 is a schematic structural diagram of a wafer waiting device provided by the embodiments of the present application, Figure 17 is Figure 16 the front view of the wafer waiting device shown. The cassette washer 100 may further include: a wafer waiting device 110 installed at the waiting station D. The wafer waiting device 110 may include: a cleaning water tank housing 111, a support frame 112, a lifting drive 113, a wafer limiting member 114 and a drive 115.

[0056] The cleaning water tank housing 111 in the wafer waiting device 110 may have a tank body for carrying cleaning water.

[0057] The support frame 112 in the wafer waiting device 110 may have an inlet p1 and an outlet p2 that are relatively arranged, and a plurality of horizontal accommodating chambers p3 that are stacked and arranged between the inlet p1 and the outlet p2, and each accommodating chamber p3 may be used to accommodate the wafer A that has been cleaned by the tank cleaning machine 100. Here, the wafer cleaned by the tank cleaning machine 100 may enter the accommodating chamber p3 from the inlet p1 of the support frame 112, and the outlet p2 of the support frame 112 may be used to transfer the wafer to a subsequent single-wafer scrubber. It should be noted that in order to facilitate the smooth entry and exit of the wafer in the accommodating chamber p3, the height of the accommodating chamber p3 may be greater than the thickness of the wafer.

[0058] The lifting drive 113 in the wafer waiting device 110 can be connected to the support frame 112, and the lifting drive 113 can be configured to: drive the support frame 112 to descend into the tank body of the cleaning water tank shell 111 to clean the wafers, or drive the support frame 112 to leave the tank body of the cleaning water tank shell 111.

[0059] The side surface of the wafer limiter 114 in the wafer waiting device 110 may have a plurality of annular limit grooves X distributed along the axial direction of the wafer limiter 114 , and the plurality of annular limit grooves X may correspond one-to-one to the multi-layer accommodating cavities p3 in the support frame 112 , and each annular limit groove X may extend along the radial direction of the wafer limiter 114 .

[0060] The driving member 115 in the wafer waiting device 110 can be installed on the lifting driving member 113, and the driving member 115 can be connected to the wafer stopper 114. The driving member can be configured to: drive the wafer stopper 114 to move to the inlet p1 or outlet p2 of the support frame 112, so that the annular stopper groove X is aligned with the corresponding accommodating cavity p3 in the support frame 112, or drive the wafer stopper 114 to move to stagger with the inlet p1 or outlet p2 of the support frame 112.

[0061] For example, in one case, the number of groups of wafer stopper 114 and driving member 115 is one group, and the driving member 115 can drive the wafer stopper 114 to move to the entrance p1 or the exit p2, which is determined in combination with the setting positions of the driving member 115 and the wafer stopper 114. In another case, the number of groups of wafer stopper 114 and driving member is two groups, and one group of driving members can be used to drive one wafer stopper 114 to move to the entrance p1 of the support frame 112, so that the annular limiting groove X in the wafer stopper 114 is aligned with the corresponding accommodating cavity p3; or, drive the wafer stopper 114 to move to be offset from the entrance p1 of the support frame 112. Another set of driving members can be used to drive another wafer stopper 114 to move to the exit p2 of the support frame 112, so that the annular stopper groove X in the wafer stopper 114 is aligned with the corresponding accommodating cavity p3; or, the wafer stopper 114 is driven to move to be offset from the exit p2 of the support frame 112. Here, the wafer stopper 114 is driven to be offset from the entrance p1 of the support frame 112 to prevent the wafer A from interfering with the wafer stopper 114 during the process of entering the accommodating cavity p3 of the support frame 112. The wafer stopper 114 is driven to be offset from the exit p2 of the support frame 112 to prevent the wafer from interfering with the wafer stopper 114 during the process of being transported out of the accommodating cavity p3 of the support frame 112.

[0062] Among them, after the wafer A is in the accommodating cavity p3 in the support frame 112, a part of the edge of the wafer A can be located in the annular limiting groove X in the wafer limiting member 114 corresponding to the accommodating cavity p3.

[0063] In this case, by providing a cleaning water tank housing 111 for holding cleaning water in the wafer waiting device 110, a plurality of horizontal receiving cavities p3 are provided in the support frame 112. In this way, the wafer A after being cleaned by the tank cleaning machine can be placed in the receiving cavity p3 of the support frame 112 from the inlet p1 of the support frame 112; then the driving member can drive the wafer limiting member 114 to move to the inlet p1 of the support frame 112 (or the outlet p2 of the support frame 112) so that the annular limiting groove X on the wafer limiting member 114 is aligned with the receiving cavity p3, and it is ensured that a part of the edge of the wafer A located in the receiving cavity p3 is located in the annular limiting groove X; thereafter, the lifting driving member 113 drives to drive the driving member and the support frame 112 to move synchronously into the tank body of the cleaning water tank housing 111, so that the wafer A carried in the receiving cavity p3 of the support frame 112 can be immersed in the cleaning water in the tank body. In this way, during the cleaning process cycle between the tank cleaning machine integrated with the wafer waiting device 110 and the single wafer cleaning machine, the wafer waiting device 110 can still ensure the cleanliness of the wafer A, further improving the manufacturing yield of the wafer A. In addition, after the wafer A is immersed in the cleaning water in the tank body, the wafer A will be affected by the buoyancy of the cleaning water. Here, the annular limiting groove X in the wafer limiting member 114 will exert a certain limiting effect on the wafer A, ensuring the stable position of the wafer A in the receiving cavity p3 of the support frame 112, and thus ensuring the efficiency and reliability when the wafer A is taken out from the outlet p2 subsequently.

[0064] It should be noted that when it is necessary to convey the wafer A to the single wafer cleaning machine, the lifting driving member 113 drives the support frame 112 to move away from the tank body of the cleaning water tank housing 111, and rises to a certain height so that the wafer A can leave the tank body.

[0065] Exemplarily, as Figure 17 shown, the support frame 112 in the wafer waiting device 110 can have a circulation hole k1 for the circulation of cleaning water. Here, the circulation hole k1 in the support frame 112 can communicate with the receiving cavity p3.

[0066] Optionally, please refer to Figure 16 and Figure 18 , Figure 18It is a schematic structural diagram of another wafer waiting device provided by an embodiment of the present application. The driving member 115 in the wafer waiting device 110 can be a rotary driving member, and the rotation axis of the rotary driving member can be connected to the wafer limiting member 114. The central axis of the wafer limiting member 114 can be parallel and non-coaxial with the rotation axis of the rotary driving member. The rotary driving member can be configured to: drive the wafer limiting member 114 to rotate a target angle around the rotation axis. In this case, the wafer limiting member 114 is driven by the rotary driving member to rotate in a direction close to or away from the support frame 112, so that the structure of the mechanism composed of the rotary driving member and the wafer limiting member 114 is simple and relatively compact, facilitating the miniaturized design of the slot cleaning machine. Here, the target angle is the angle by which the wafer limiting member 114 rotates from the initial position to the entrance p1 or the exit p2 of the support frame 112 and a part of the edge of the wafer A in the accommodation cavity p3 is located in the annular limiting groove X in the wafer limiting member 114.

[0067] In an embodiment of the present application, as Figure 18 shown, the wafer limiting member 114 can include: an adapter plate 114a and a wafer limiting rod 114b. The extending direction of the adapter plate 114a can be perpendicular to the axial direction of the rotation axis of the rotary driving member. The first end of the adapter plate 114a can be fixedly connected to the rotation axis of the rotary driving member, and the second end of the adapter plate 114a can be fixedly connected to one end of the wafer limiting rod 114b. Among them, a plurality of annular limiting grooves X in the wafer limiting member 114 can be provided on the wafer limiting rod 114b.

[0068] In the present application, the wafer waiting device 110 can further include: an angle sensor (not shown in the figure) provided in the rotary driving member. The angle sensor can detect the rotation angle of the rotation axis in the rotary driving member and generate an angle detection signal for output to a control component (not shown in the figure). The control component can generate an electrical signal and output it to the rotary driving member. In this case, by providing a position sensor in the rotary driving member, the position sensor can be used to detect the rotation angle of the rotation axis to the target angle and then generate an angle detection signal for output to the control component. The control component generates an electrical signal according to the angle detection signal and then outputs it to the rotary driving member to control the rotary driving member to be in a stopped working state.

[0069] Exemplarily, the control component can include a PLC control system and a signal converter. The angle sensor can be communicatively connected to the signal converter, the signal converter can be communicatively connected to the PLC control system, and the rotary driving member can be communicatively connected to the PLC control system. The angle sensor can be a Hall sensor or a magnetic reed switch, etc., and the rotary driving member can be a rotary cylinder or a servo motor, etc. The embodiments of the present application do not make specific limitations in this regard.

[0070] It should be noted that the control component in the wafer cleaning device can be electrically connected to other components separately. For example, the control component can be connected to mechanisms such as the flipping mechanism 500, the translation mechanism 103a, the lifting mechanism 103b, the rotation driving part 103c, the clamping arm driving part 103d, the first translation mechanism 102a, the first lifting mechanism 102b, the first rotation driving part 102c, the translation driving part 102d, and the wafer clamping mechanism 102e respectively to control these mechanisms to perform corresponding actions.

[0071] Optionally, please refer to Figure 18 、 Figure 19 and Figure 20 , Figure 19 is Figure 18 a partial structural schematic diagram of the wafer waiting device shown, Figure 20 is Figure 19 a partial structural schematic diagram of the wafer waiting device shown. The support frame 112 in the wafer waiting device 110 may include: an outer frame 1121, and multiple groups of support plates 1122 fixedly arranged in an array within the outer frame 1121. A receiving cavity p3 can be formed between adjacent two layers of support plates 1122. And each group of support plates 1122 may include multiple support plates. Among them, the end of each support plate 1122 may have a third limit support protrusion T, and the top of the third limit support protrusion T may have a first support surface m4 that contacts and cooperates with the chamfered surface of the edge portion of the wafer A. For example, the first support surface m4 may be an arc-shaped conical surface. In this case, after the wafer A is placed in the receiving cavity p3, it can be supported by the third limit support protrusions T on each group of support plates 1122, and the chamfered surface of the edge portion of the wafer A contacts and cooperates with the first support surface m4 at the top of the third limit support protrusion T, effectively reducing the probability of damage to the front and back surfaces of the wafer A.

[0072] In the embodiments of the present application, as Figure 19As shown, multiple support plates in each group of support plates 1122 can be arranged in two rows. The third limit support protrusion T in each row of support plates 1122 can include at least two first-type support protrusions T1 and at least two second-type support protrusions T2. The space surrounded by the first-type support protrusions T1 in the two rows of support plates 1122 can be distributed within the space surrounded by the second-type support protrusions T2. Among them, the top of the second-type support protrusion T2 can protrude relative to the support plate 1122 compared to the top of the first-type support protrusion T1. In this case, the first-type support protrusion T1 can be used to support the wafer A with a smaller area, and the second-type support protrusion T2 can be used to support the wafer A with a larger area. In this way, the loading flexibility of the support frame 112 for the wafer A is effectively improved. For example, the number of the first-type support protrusions T1 in each layer of support plates 1122 can be six, and the six first-type support protrusions T1 can be distributed in a ring shape; the number of the second-type support protrusions T2 can be four, and the four second-type support protrusions T2 can be distributed in a square shape.

[0073] It should be noted that, as Figure 18 and Figure 19 shown, when the third limit support protrusion T in each layer of support plates 1122 includes the first-type support protrusion T1 and the second-type support protrusion T2, the number of the annular limit grooves X corresponding to each accommodation cavity p3 in the wafer limit member 114 can be two. One annular limit groove X can be used to limit the wafer A supported by the first-type support protrusion T1; the other annular limit groove X can be used to limit the wafer A supported by the second-type support protrusion T2. In addition, when the area of the wafer A supported by the first-type support protrusion T1 is small, in order to ensure that part of the edge of the wafer A can be located in the annular limit groove X in the wafer limit member 114 that cooperates with the first-type support protrusion T1, the opening of the annular limit groove X that cooperates with the first-type support protrusion T1 can be made closer to the support frame 112 compared to the opening of the annular limit groove X that cooperates with the second-type support protrusion T2.

[0074] In other possible implementation manners, as Figure 19 shown, the wafer waiting device 110 can further include: a first translation driving member 116. The first translation driving member 116 can be respectively connected to the lifting driving member 113 and the rotation driving member, and the first translation driving member 116 is configured to: when the wafer limit member 114 rotates to the target position (the inlet p1 or the outlet p2 of the support frame 112), drive the rotation driving member and the wafer limit member 114 to move synchronously in the direction close to the wafer A supported by the first-type support protrusion T1, so that part of the edge of the wafer A supported by the first-type support protrusion T1 is located in the annular limit groove X in the wafer limit member 114.

[0075] Exemplarily, the first translation driving member 116 may include a translation driving cylinder 1161 and a moving slider 1162 that are drivingly connected. The translation driving cylinder 1161 may be connected to the lifting driving member 113, and the rotation driving member may be mounted on the moving slider 1162. Among them, the translation driving cylinder 1161 may drive the moving slider 1162 to perform translation.

[0076] Optionally, as Figure 18 shown, the lifting driving member 113 in the wafer waiting device 110 may include a mounting frame 1131, a driving motor 1132, a transmission lead screw 1133, and a lifting connection frame 1134. The driving motor 1132 may be fixed on the mounting frame 1131, and the transmission lead screw 1133 may be mounted on the mounting frame 1131 and the axial direction of the transmission lead screw 1133 may be parallel to the lifting direction of the support frame 112. The lifting connection frame 1134 may be drivingly connected to the transmission lead screw 1133, and both the support frame 112 and the driving member 115 may be fixedly connected to the lifting connection frame 1134. And the output shaft of the driving motor 1132 may be connected to one end of the transmission lead screw 1133. Among them, the driving motor 1132 may be configured to drive the lifting connection frame 1134 to move along the axial direction of the transmission lead screw 1133 through the transmission lead screw 1133, so as to drive the support frame 112 to lift synchronously.

[0077] Exemplarily, the mounting frame 1131 may be fixed in the tank cleaning machine 100. When the driving motor 1132 is in a working state, it drives the transmission lead screw 1133 to rotate, and then drives the lifting connection frame 1134 to lift along the axial direction of the transmission lead screw 1133, so as to drive the support frame 112 and the wafer limiting member 114 to lift and move synchronously.

[0078] It should be noted that, as Figure 18 and Figure 19 shown, in the case where the first translation driving member 116 includes a translation driving cylinder 1161 and a moving slider 1162, the translation driving cylinder 1161 may be mounted on the lifting connection frame 1134.

[0079] The embodiment of the present application also provides a wafer cleaning method, and this wafer cleaning method may be applied to any of the above-mentioned wafer cleaning devices.

[0080] Step 1: The first wafer picking component in the tank cleaning machine of the wafer cleaning device may grab a single wafer to be washed and transfer it to the support position.

[0081] Step 2: The wafer grabbing and transferring component in the tank cleaning machine of the wafer cleaning device grabs a single wafer to be washed on the support position each time, flips it by a target angle, and then places it in the liquid medicine tank. Here, wafers are placed in the tank body of the liquid medicine tank, or after placing any number of wafers, the wafers can be cleaned with liquid medicine.

[0082] Step 3: The wafer gripping and transferring component can grip the washed wafer in the liquid medicine tank and transfer it to the cleaning water tank for cleaning.

[0083] Step 4: The wafer gripping and transferring component can grip the wafer in the cleaning water tank, leave the cleaning water tank, flip it by a target angle, and place it on the support position of the transfer table.

[0084] Step 5: The first wafer picking component can pick up the washed wafer on the support position of the transfer table and transfer it to the waiting station.

[0085] Step 6: The second wafer picking component in the single wafer brushing machine of the wafer cleaning equipment can transfer the wafer on the waiting station to the brushing and drying component through the wafer outlet of the first housing of the tank cleaning machine and the wafer inlet of the second housing of the single wafer brushing machine. Here, the brushing and drying component can further brush and dry the wafer.

[0086] The embodiments of the wafer cleaning equipment and the embodiments of the wafer cleaning method provided by the embodiments of the present invention can be referred to each other, and the embodiments of the present invention will not be elaborated here.

[0087] The embodiments of the wafer cleaning equipment and the embodiments of the usage method of the wafer cleaning equipment provided by the embodiments of the present invention can be referred to each other, and the embodiments of the present invention will not be elaborated here.

[0088] In the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "plurality" means two or more, unless otherwise clearly defined.

[0089] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer cleaning device, characterized in that: include: Tank washers and single-sheet scrubbers arranged side by side; The tank cleaning machine comprises: a first shell, a first sheet picking assembly and two groups of sheet grabbing and transferring assemblies installed in the first shell, and two liquid medicine tanks, two transfer tables and at least one cleaning water tank distributed between the first sheet picking assembly and the two groups of sheet grabbing and transferring assemblies, wherein the liquid medicine tank and the cleaning water tank both have a plurality of tank bodies arranged vertically; the transfer table has a support position arranged horizontally; the first shell has a sheet outlet on one side close to the single-sheet scrubber and is provided with a material waiting station located between the first sheet picking assembly and the sheet outlet; The single-sheet scrubber comprises: a second shell, a second sheet taking assembly installed in the second shell, and at least one scrubbing and drying assembly, wherein the second shell has a sheet inlet on one side close to the first shell; Among them, the first sheet picking component is used to: grab a single wafer to be washed and transfer it to the supporting position; each group of the sheet grabbing and transferring components is used to: grab a single wafer to be washed on the supporting position, flip it to a target angle and place it in the liquid medicine tank, or grab the wafer cleaned in the liquid medicine tank and put it into the clean water tank, or grab the wafer in the clean water tank and flip it to the target angle and place it in the supporting position; the first sheet picking component is also used to: grab the washed wafer on the supporting position to the waiting station; the second sheet picking component is used to: transfer the wafer on the waiting station to the brushing and drying component through the sheet inlet and the sheet outlet.

2. The wafer cleaning device according to claim 1, characterized in that: The first shell and the second shell are arranged along a first direction; the two liquid medicine tanks are arranged along the first direction, the two transfer tables are located between the two liquid medicine tanks, and the at least one cleaning water tank is located between the two transfer tables; Among them, the arrangement direction of the second sheet picking assembly and the brushing and drying assembly is parallel to the arrangement direction of the first sheet picking assembly and the two groups of grabbing sheet transfer assemblies, and the first sheet picking assembly and the two groups of grabbing sheet transfer assemblies are arranged along the second direction, and the second direction is perpendicular to the first direction.

3. The wafer cleaning device according to claim 2, characterized in that: The grab piece transfer assembly comprises: a translation mechanism, a lifting mechanism, a rotation drive member, a clamp arm drive member and two clamp arms arranged in parallel, the translation mechanism is installed at the bottom of the first shell and extends along the first direction; the lifting mechanism is slidably connected to the translation mechanism and extends along a third direction; the rotation drive member is installed on the lifting mechanism, and the rotation axis of the rotation drive member is tightly connected to the clamp arm drive member; the third direction is perpendicular to both the first direction and the second direction; One end of each of the two clamp arms is connected to the clamp arm driving member, an end of one of the clamp arms away from the clamp arm driving member has two first position-limiting clamping protrusions arranged opposite to each other, and an end of the other clamp arm away from the clamp arm driving member has two second position-limiting clamping protrusions arranged opposite to each other, and a clamping space is formed between the two first position-limiting clamping protrusions and the two second position-limiting clamping protrusions; Wherein, the rotating driving member is configured to: drive the clamping arm driving member to rotate the target angle around the rotating axis of the rotating driving member; the clamping arm driving member is configured to: drive the two clamping arms to move relative to each other, so as to drive the two first limit clamping protrusions and the two second limit clamping protrusions to move toward or away from each other.

4. The wafer cleaning device according to claim 3, characterized in that: One of the clamp arms is a U-shaped clamp arm, and a portion of the other clamp arm extends into the hollow area of ​​the U-shaped clamp arm and is fastened to the clamp arm driving member; wherein the two first limit clamping protrusions are respectively located at the two ends of the U-shaped clamp arm, and the two second limit clamping protrusions are located at the end of the other clamp arm away from the clamp arm driving member.

5. The wafer cleaning device according to claim 3, characterized in that: The first film-taking assembly comprises: a first translation mechanism, a first lifting mechanism, a first rotation driving member, a translation driving member and a clip mechanism which are sequentially arranged along the bottom away from the first shell, the first translation mechanism is mounted on the bottom of the first shell and extends along the first direction, the first lifting mechanism is mounted on the first translation mechanism and extends along the third direction, the first rotation driving member is mounted on the first lifting mechanism, and the rotation axis of the first rotation driving member is fastened to the translation driving member; the clip mechanism is mounted on the translation driving member; Among them, the translation drive member is configured to: drive the clamping mechanism to clamp the uncleaned wafer and transport it to the supporting position, or transport the wafer on the supporting position to the waiting position; the first rotation drive member is configured to: drive the translation drive member and the clamping mechanism to rotate synchronously.

6. The wafer cleaning device according to claim 5, characterized in that: The clip mechanism comprises: a fixed pallet, a clamping pallet and a pallet driver, one end of the fixed pallet is fastened to the translation driver, the pallet driver is fixed to the translation driver, and the telescopic shaft of the pallet driver is fastened to one end of the clamping pallet; Among them, the other end of the fixed pallet has a first supporting arc surface, the other end of the clamping pallet has a second supporting surface, and the pallet driving component is configured to drive the clamping pallet to move in a direction close to the other end of the fixed pallet or away from the other end of the fixed pallet.

7. The wafer cleaning device according to claim 6, characterized in that: The number of the clamping mechanisms and the number of the translation driving members are both at least two, and the fixed pallets, the clamping pallets and the pallet driving members in the at least two clamping mechanisms are all stacked.

8. The wafer cleaning device according to any one of claims 3 to 7, characterized in that: The transfer platform has a group of annularly distributed multiple first position-limiting support protrusions and a group of annularly distributed multiple second position-limiting support protrusions, and the multiple first position-limiting support protrusions are distributed in an annular area surrounded by the multiple second position-limiting support protrusions. The top of the second position-limiting support protrusion protrudes beyond the top of the first position-limiting support protrusion, the plurality of first position-limiting support protrusions are used to support first-type wafers, and the plurality of second position-limiting support protrusions are used to support second-type wafers.

9. The wafer cleaning device according to claim 8, characterized in that: The transfer platform comprises: a first platform body, and a second platform body distributed around the first platform body, the plurality of first position-limiting support protrusions are arranged on the first platform body, and the plurality of second position-limiting support protrusions are arranged on the second platform body; The tank cleaning machine further comprises: a second lifting mechanism and a second rotating driving member, wherein the second lifting mechanism is connected to the first housing, the second rotating driving member is mounted on the second lifting mechanism, and the rotating shaft of the second rotating driving member is connected to the first platform; the second platform is connected to the second lifting mechanism; The second rotating driving member is configured to: drive the first platform to rotate while driving the first type of wafer to rotate a certain angle, so that the positioning edge of the first type of wafer is staggered with the clamping space.

10. The wafer cleaning device according to claim 8, characterized in that: The first position-limiting support protrusion and the second position-limiting support protrusion both include: a support column and a position-limiting column, the bottom of the support column is fixed on the transfer table, the diameter of the position-limiting column is smaller than the diameter of the support column, and the position-limiting column is fixed to the central area of ​​the top of the support column; the edge area of ​​the top of the support column has a support surface; Wherein, the supporting surface is used for cooperating and contacting with the chamfered surface of the edge of the wafer.

11. A wafer cleaning method, characterized in that: The wafer cleaning method is applied to the wafer cleaning device described in any one of claims 1 to 10 above; The first wafer picking component grabs a single wafer to be cleaned and transfers it to the support position; The wafer grabbing and transferring component grabs the single wafer to be cleaned on the supporting position, flips it to a target angle, and then places it in the chemical solution tank; The grabbing and transferring assembly grabs the cleaned wafers in the liquid medicine tank and transfers them to the cleaning water tank; The grabbing and transferring assembly grabs the wafer in the cleaning water tank, leaves the cleaning water tank, flips the wafer to the target angle, and places the wafer at the supporting position; The first wafer picking assembly grabs the cleaned wafer on the supporting position and moves it to the material waiting position; The second wafer taking assembly transfers the wafers on the waiting station to the scrubbing and drying assembly through the wafer outlet of the first shell and the wafer inlet of the second shell.

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