Two-stage liquid splashing monitoring system and method and computer readable medium

Abstract

The invention discloses a two-stage liquid splashing monitoring system and method and a computer readable medium, the two-stage liquid splashing monitoring system comprises a protective cover, a wafer clamp, a liquid supply unit, a visual acquisition unit, a sensor unit and a control unit, and the protective cover is provided with an opening and a containing cavity; the wafer clamp is positioned in the accommodating cavity and is used for driving the wafer to rotate; the liquid supply unit is used for supplying chemical liquid to the wafer in the accommodating cavity through the opening; the visual acquisition unit is used for acquiring first liquid splashing data of the chemical liquid in an acquisition area including the opening; the sensor unit comprises a first detection module which is used for detecting second liquid splashing data of the chemical liquid splashed out of the accommodating cavity through the opening; and the control unit is in communication connection with the visual acquisition unit and the sensor unit, and is used for executing different levels of control operations based on the first liquid splashing data and the second liquid splashing data. According to the invention, two-stage liquid splashing monitoring can be realized, wafer scrapping is reduced, the cost is further reduced, and the economic benefit is remarkably improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and particularly to a dual-stage splash monitoring system, a dual-stage splash monitoring method, and a computer-readable medium storing computer program code. Background Art

[0002] In a wet process, a single-wafer high-temperature SPM (Sulfuric Acid Hydrogen Peroxide Mixture) cleaning device is used to supply SPM chemical liquid to the surface of a wafer to clean organic substances and etching residues on the wafer surface. The single-wafer high-temperature SPM cleaning device includes a protective cover, a wafer chuck, and a liquid supply unit. The protective cover has an opening and a receiving cavity. The wafer chuck is located in the receiving cavity and is used to drive the wafer to rotate. The liquid supply unit is used to supply chemical liquid to the wafer in the receiving cavity through the opening, thereby performing a high-temperature SPM cleaning process on the wafer.

[0003] During the high-temperature SPM cleaning process, the chemical liquid on the wafer will be thrown towards the protective cover under the action of centrifugal force and collected and discharged by the protective cover. There may also be some chemical liquid splashing outside the receiving cavity of the protective cover, including but not limited to splashing to the top opening of the protective cover and the liquid supply unit. During the process, the chemical liquid accumulated on the top opening of the protective cover and the liquid supply unit will fall onto the wafer surface due to the up and down movement of the protective cover or the swing of the liquid supply unit. The splashed chemical liquid will also cause the wafer surface to be contaminated by particles, resulting in the problem of wafer scrapping. Summary of the Invention

[0004] The purpose of the present application is to solve the problem of how to monitor splash in the prior art to reduce wafer scrapping.

[0005] To solve the above problems, a first aspect of the present application proposes a dual-stage splash monitoring system, including:

[0006] A protective cover having an opening and a receiving cavity;

[0007] A wafer chuck located in the receiving cavity and used to drive the wafer to rotate;

[0008] A liquid supply unit used to supply chemical liquid to the wafer in the receiving cavity through the opening;

[0009] A visual acquisition unit used to acquire first splash data of chemical liquid in an acquisition area including the opening;

[0010] A sensor unit including a first detection module used to detect second splash data of chemical liquid splashing outside the receiving cavity through the opening; and

[0011] A control unit, communicatively connected to a vision acquisition unit and a sensor unit respectively, for performing control operations of different levels based on first splash data and second splash data.

[0012] A second aspect of the present application provides a two-stage splash monitoring method, including the following steps:

[0013] Supply a chemical liquid to a wafer rotating in a receiving cavity of a protective cover;

[0014] Collect first splash data of the chemical liquid in an acquisition area including an opening of the protective cover through a vision acquisition unit;

[0015] Detect second splash data of the chemical liquid splashing outside the receiving cavity through the opening by a sensor unit;

[0016] Perform control operations of different levels based on the first splash data and the second splash data.

[0017] A third aspect of the present application provides a computer-readable medium storing computer program code, and the computer program code implements the above two-stage splash monitoring method when executed by a processor.

[0018] In the present application, a vision acquisition unit and a sensor unit are provided to detect the splash situation of the chemical liquid during the process. The vision acquisition unit collects first splash data of the chemical liquid in an acquisition area including an opening of the protective cover, and the first detection module of the sensor unit detects second splash data of the chemical liquid splashing outside the receiving cavity through the opening. The two-stage detection device composed of the vision acquisition unit and the sensor unit performs synchronous detection with high detection accuracy. In addition, when one of the vision acquisition unit and the sensor unit fails, the other can perform detection and send the detected splash data to the control unit, and the control unit timely performs control operations of different levels, reducing the problem of wafer scrapping, thereby reducing costs and significantly improving economic benefits.

[0019] Other features and corresponding beneficial effects of the present application are described and explained in the following part of the specification, and it should be understood that at least some of the beneficial effects are obvious from the description in the specification of the present application. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the chamber structure of a wet process equipment for an embodiment;

[0021] Figure 2a It is a schematic cross-sectional structure diagram of a two-stage splash monitoring system according to an embodiment of the present application;

[0022] Figure 2b It is Figure 2a A partial enlarged view of part A in

[0023] Figure 3 A top view structural schematic diagram of a two-stage splash monitoring system according to an embodiment of the present application;

[0024] Figure 4 A top view structural schematic diagram of a two-stage splash monitoring system according to another embodiment of the present application; and

[0025] Figure 5 A flowchart schematic diagram of a two-stage splash monitoring method according to an embodiment of the present application. Detailed implementation manners

[0026] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0027] Figure 1 A schematic diagram of the chamber structure of a wet process equipment for an embodiment. Taking the wet process equipment as a high-temperature SPM cleaning equipment as an example, the reasons for splash during the process and the problems caused by splash are described. Reasons for splash: First, the SPM chemical solution is likely to crystallize on the clamping pins 21' of the wafer fixture, causing the clamping pins 21' to jam, resulting in the clamping pins 21' being unable to firmly clamp the wafer 70', and the wafer 70' slips, causing the chemical solution to splash. Second, the SPM chemical solution is not fully mixed, resulting in chemical solution splashing when supplied to the surface of the wafer 70'. Third, during the process of the wafer fixture driving the wafer 70' to rotate, it shakes due to the influence of part processing accuracy and assembly accuracy, causing the chemical solution to splash. Problems caused by splash: First, during the process of the chemical solution splashing from the accommodation chamber 12' of the protective cover 10' to the chamber 80', the chemical solution will accumulate at the top opening of the protective cover 10'. When continuously pumping air in the chamber 80' to remove the acid gas in the chamber 80', the chemical solution accumulated at the top opening of the protective cover 10' will form crystals. When the protective cover 10' is lifted or lowered, the crystals or chemical solution at the top opening of the protective cover 10' are likely to rebound onto the surface of the wafer 70', causing the problem of particle contamination on the surface of the wafer 70'. Second, when the splash situation is serious or the pumping of the chamber 80' is insufficient, the chamber 80' is continuously in an acidic gas atmosphere, and the acidic gas will corrode the surface of the wafer 70'. Third, the splashed chemical solution will accumulate in the liquid supply unit 30'. When the liquid supply unit 30' swings above the wafer 70' for the next process, the chemical solution accumulated in the liquid supply unit 30' will drop onto the surface of the wafer 70', causing the problem of particle contamination on the surface of the wafer 70'.

[0028] Regarding the problems caused by the above splashing, the present application proposes a dual-stage splashing monitoring system. The dual-stage splashing monitoring system proposed by the present application is applicable to high-temperature SPM cleaning equipment, or other wet cleaning and etching equipment that requires splashing detection.

[0029] Figure 2a It is a schematic cross-sectional structure diagram of a dual-stage splashing monitoring system according to an embodiment of the present application. Figure 3 It is a schematic top view structure diagram of a dual-stage splashing monitoring system according to an embodiment of the present application.

[0030] Reference Figure 2a and Figure 3 , the dual-stage splashing monitoring system includes a protective cover 10, a wafer chuck 20, a liquid supply unit 30, a vision acquisition unit 40, a sensor unit 50, and a control unit 60. The protective cover 10 has an opening 11 and a receiving cavity 12. The wafer chuck 20 is located in the receiving cavity 12 and is used to drive the wafer 70 to rotate. The liquid supply unit 30 is used to supply chemical liquid to the wafer 70 in the receiving cavity 12 through the opening 11 to perform a cleaning process on the wafer 70. Among them, there is at least one protective cover 10. During the process, at least one protective cover 10 is raised to a predetermined position to collect the chemical liquid that is centrifugally thrown outside the wafer 70 on the surface of the wafer 70. The wafer chuck 20 has clamping pins 21 for clamping and releasing the wafer 70. The liquid supply unit 30 includes a swing arm 31 and a nozzle 32. The first end of the swing arm 31 is connected to the nozzle 32. The first end of the swing arm 31 rotates around the second end of the swing arm 31 to drive the nozzle 32 to rotate above the wafer 70 or rotate outside the receiving cavity 12. The vision acquisition unit 40 is used to acquire first splashing data of the chemical liquid in the acquisition area including the opening 11 of the protective cover 10. The sensor unit 50 includes a first detection module for detecting second splashing data of the chemical liquid splashing outside the receiving cavity 12 through the opening 11. The control unit 60 is communicatively connected to the vision acquisition unit 40 and the sensor unit 50 respectively, and is used to perform control operations of different levels based on the first splashing data and the second splashing data.

[0031] In the embodiments of the present application, a visual acquisition unit 40 and a sensor unit 50 are provided to detect the splashing of chemical liquid during the process. The visual acquisition unit 40 acquires first splashing data of the chemical liquid in the acquisition area including the opening 11 of the protective cover 10, and the first detection module of the sensor unit 50 detects second splashing data of the chemical liquid splashing outside the accommodation cavity 12 through the opening 11. The dual-stage detection device composed of the visual acquisition unit 40 and the sensor unit 50 performs synchronous detection with high detection accuracy. In addition, when one of the visual acquisition unit 40 and the sensor unit 50 fails, the other can perform detection and send the detected splashing data to the control unit 60. The control unit 60 timely executes control operations of different levels, reduces the problem of wafer 70 scrapping, thereby reducing costs, and significantly improving economic benefits.

[0032] Reference Figure 2a and Figure 3 , in some embodiments, both the first splashing data and the second splashing data include the splashing duration and the splashing times, and the splashing preset value includes a duration preset value and a times preset value. The control operations of different levels executed by the control unit 60 include a first-level control operation and a second-level control operation, and the level of the first-level control operation is higher than that of the second-level control operation. The first-level control operation includes: the control unit 60 issues a first-level alarm signal and stops the current process on the wafer 70. The second-level control operation includes: the control unit 60 issues a second-level alarm signal and stops the next process after the current process on the wafer 70 is completed.

[0033] Specifically, when the first splashing data or the second splashing data is greater than or equal to the corresponding splashing preset value, the first-level control operation is executed. That is,

[0034] the splashing duration ≥ the duration preset value, execute the first-level control operation;

[0035] the splashing times ≥ the times preset value, execute the first-level control operation.

[0036] In response to at least one of the above splashing detection results, the control unit 60 executes the first-level control operation.

[0037] When the first splashing data or the second splashing data is less than the corresponding splashing preset value, the second-level control operation is executed. That is,

[0038] the splashing duration < the duration preset value, execute the second-level control operation;

[0039] the splashing times < the times preset value, execute the second-level control operation.

[0040] In response to at least one of the above splash detection results, the control unit 60 performs a secondary control operation. The splash preset value corresponding to the first splash data and the splash preset values corresponding to the second splash data respectively may be the same or different, which is specifically determined and adjusted according to actual process requirements.

[0041] Figure 2b For Figure 2a the partial enlarged view of part A in Figure 2b the dashed arrow in Figure 2b indicates the splashing chemical liquid. With reference to

[0042] When the vision acquisition unit 40 and the sensor unit 50 detect that the first splash data or the second splash data is greater than or equal to the corresponding splash preset value, the splashing chemical liquid will bring back the chemical liquid and crystals that have cleaned the surface dirt of the wafer 70 to the surface of the wafer 70 at the top opening 11 of the protective cover 10, causing wafer defects. Therefore, a primary control operation needs to be performed. When the vision acquisition unit 40 and the sensor unit 50 detect that the first splash data or the second splash data is less than the corresponding splash preset value, it can be considered that the first splash data or the second splash data is within the acceptable range of the process requirements, and the liquid film covering the surface of the wafer 70 can basically block the impact of the splash on the surface of the wafer 70. Therefore, a secondary control operation is performed. It can be understood that the acquisition area including the opening 11 of the protective cover 10 also includes the liquid supply unit 30, and the liquid supply unit 30 is above the wafer 10. Therefore, when the vision acquisition unit 40 and the sensor unit 50 detect that the first splash data or the second splash data is greater than or equal to the corresponding splash preset value, the splashing chemical liquid will also bring back the chemical liquid and crystals that have cleaned the surface dirt of the wafer 70 on the liquid supply unit 30 to the surface of the wafer 70, causing wafer defects.

[0042] In some embodiments, in the primary control operation, after the control unit 60 issues a primary alarm signal and stops the current process, it immediately supplies a rinsing liquid to the surface of the wafer 70 for rinsing, and then dries the wafer 70 to protect the wafer 70. Finally, the operator performs maintenance processing to prevent the next wafer from being affected. Among them, exemplarily, when the chemical liquid used in the process is a hydrofluoric acid solution, deionized water is sprayed onto the surface of the wafer 70 for rinsing, and then drying is performed. When the chemical liquid used in the process is an SPM solution, hydrogen peroxide is first sprayed onto the surface of the wafer 70, then rinsed with deionized water, and finally dried.

[0043] In the secondary control operation, the control unit 60 issues a secondary alarm signal, and after the current process is completed, the operator performs maintenance processing to prevent the next wafer from being affected.

[0044] In some embodiments, the visual acquisition unit 40 includes a high-speed camera, which can achieve dynamic monitoring of splashing liquid. The high-speed camera captures the movement process of the splashing chemical liquid at an extremely high frame rate (such as thousands of frames per second or even higher) and forms a captured video. By analyzing the captured video, the splashing duration and the number of splashing times can be calculated.

[0045] In some embodiments, the first detection module of the sensor unit 50 includes a photoelectric liquid sensor, a capacitive sensor, a pressure sensor, or an ultrasonic sensor. By way of example, the photoelectric liquid sensor detects the presence of the chemical liquid through the photoelectric effect (such as light scattering, absorption, etc.). When the chemical liquid splashes into the detection area of the photoelectric liquid sensor, it will change the propagation path or intensity of the light. The photoelectric liquid sensor calculates the splashing duration and the number of splashing times by detecting these changes, such as the change in light intensity. The capacitive sensor senses the chemical liquid by detecting the change in capacitance. When the chemical liquid splashes onto the surface of the capacitive sensor, it will change the capacitance value of the capacitive sensor. The capacitive sensor can calculate the splashing duration and the number of splashing times of the chemical liquid by detecting the change frequency and duration of the capacitance value.

[0046] Reference Figure 2a and Figure 3 and, in some embodiments, the dual-stage splashing monitoring system further includes a chamber 80, and the protective cover 10, the wafer chuck 20, and the liquid supply unit 30 are all located inside the chamber 80. The visual acquisition unit 40 is disposed in the chamber 80 and is located obliquely above the opening 11 of the protective cover 10. The structure of the sensor unit 50 can be a patch type and is mounted on the side wall 81 of the chamber 80. Preferably, as Figure 2a shown, the sensor unit 50 is disposed in the upper part of the side wall 81 of the chamber 80, which is beneficial to detecting the splashing situation of the chemical liquid in the accommodation chamber 12 splashing outside the accommodation chamber 12 through the opening 11. Among them, since a wafer transfer gate (not shown in the figure) for transferring the wafer 70 is provided on the side wall 81 of the chamber 80, when installing the sensor unit 50 and the visual acquisition unit 40, it should be considered to avoid the wafer transfer gate. In Figure 3 the illustrated example, there are multiple sensor units 50, which are spaced apart and distributed on three side walls 81 of the chamber 80, and the visual acquisition unit 40 is disposed on the fourth side wall 81. Figure 4 is a top view structural schematic diagram of the dual-stage splashing monitoring system according to another embodiment of the present application; in Figure 4 the illustrated example, the sensor units 50 are annularly distributed on the four side walls 81 of the chamber 80, and the visual acquisition unit 40 is disposed on one of the side walls 81.

[0047] Reference Figure 2a, in some embodiments, the acquisition area of the visual acquisition unit 40 further includes the top wall 82 of the chamber 80 directly above the opening 11 of the protective cover 10. The visual acquisition unit 40 is further configured to acquire the first gas condensation data on the top wall 82, and the control unit 60 is further configured to perform corresponding control operations based on the first gas condensation data. When the first gas condensation data indicates condensation, a primary control operation is performed. In the actual process, the generated gas, such as acidic gas, will rise and mainly concentrate on the top wall 82. If it is detected that the first gas condensation data indicates condensation, it at least shows that there is a large amount of acidic gas above the wafer 70 and it has not been pumped out of the chamber 80. The acidic gas will corrode the surface of the wafer 70, causing wafer defects. Therefore, the primary control operation is performed. In this embodiment, in the primary control operation, after the control unit 60 issues a primary alarm signal and stops the current process, a flushing liquid is immediately supplied to the surface of the wafer 70 for flushing, and then the wafer 70 is dried to protect the wafer 70. Finally, the operator performs maintenance on the top wall 82 of the chamber 80. The liquid beads formed by gas condensation may not directly drip. By the operator timely maintaining the top wall 82 of the chamber 80, the possibility of the liquid beads formed by gas condensation falling onto the surface of the next wafer can be eliminated. Taking the visual acquisition unit 40 including a high-speed camera as an example, the high-speed camera can record the formation process or dynamic behavior of gas condensation (such as the rolling and sliding of liquid beads on the surface of the top wall 82) at an extremely high frame rate (such as thousands of frames per second or even higher) to infer the condensation state.

[0048] In some embodiments, the acquisition area of the visual acquisition unit 40 further includes the swing arm 31 of the liquid supply unit 30. The splash liquid data and gas condensation data on the swing arm 31 can be detected by the visual acquisition unit 40.

[0049] In some embodiments, the sensor unit 50 further includes at least one second detection module for detecting the second gas condensation data and / or gas concentration data in the chamber 80, and the control unit 60 is further configured to perform corresponding control operations based on the second gas condensation data and / or gas concentration data. When the second gas condensation data indicates condensation, a primary control operation is performed. In the actual process, the generated gas, such as acidic gas, will rise. In addition to concentrating on the top wall 82, it will also be distributed on the side wall of the chamber 80. If it is detected that the second gas condensation data indicates condensation, it means that there is a large amount of acidic gas in the chamber 80 and it has not been pumped out of the chamber 80. The acidic gas will corrode the surface of the wafer 70, causing wafer defects. Therefore, the primary control operation is performed. When the gas concentration data reaches the concentration preset value, and the gas concentration data is within the acceptable range of the process requirements, it can be considered that no condensation has occurred, and a secondary control operation is performed. The concentration preset value can be determined and adjusted according to the actual process requirements.

[0050] In some embodiments, the second detection module for detecting the second gas condensation data may be a humidity sensor, a resistive sensor, or the like. The humidity sensor determines whether the gas condenses by detecting the water vapor content in the chamber 80. When the water vapor in the gas condenses on the sensitive material of the resistive sensor, the sensitive material absorbs moisture, causing a change in its resistance value. The resistive sensor detects whether there is a gas condensation phenomenon based on the change in the resistance value. The second detection module for detecting the gas concentration data may be a gas concentration sensor. By detecting the second gas condensation data or the gas concentration data in the chamber 80, the acidic gas atmosphere in the chamber 80 can be prevented from affecting the surface of the wafer 70 in a timely manner.

[0051] According to the foregoing, the visual acquisition unit 40 is used to dynamically monitor the splashed chemical liquid, and the sensor unit 50 is used to statically monitor the splashed chemical liquid. By combining the dynamic monitoring and the static monitoring, once in response to one or more of the first splashing liquid data being greater than or equal to the corresponding splashing liquid preset value, the first splashing liquid data being less than the splashing liquid preset value, the second splashing liquid data being greater than or equal to the corresponding splashing liquid preset value, the second splashing liquid data being less than the splashing liquid preset value, the first gas condensation data being condensed, the second gas condensation data being condensed, and the gas concentration data reaching the concentration preset value, the control unit 60 timely executes control operations at different levels to reduce the scrapping of the wafer 70, thereby reducing costs and significantly improving economic benefits.

[0052] In addition, it can avoid the problem that a large amount of chemical liquid splashes into the chamber 80 and flows into the internal drainage pipeline, resulting in an exothermic reaction that causes parts such as the drainage pipeline to rupture, causing chemical liquid leakage and generating safety risks.

[0053] Figure 5 It is a schematic flow chart of a two-stage splashing liquid monitoring method according to an embodiment of the present application.

[0054] Refer to Figure 5 , the present application also proposes a two-stage splashing liquid monitoring method, including the following steps:

[0055] Supply chemical liquid to the wafer 70 that rotates in the accommodation cavity 12 of the protective cover 10;

[0056] Collect the first splashing liquid data of the chemical liquid in the collection area including the opening 11 of the protective cover 10 through the visual acquisition unit 40;

[0057] Detect the second splashing liquid data of the chemical liquid splashed out of the accommodation cavity 12 through the opening 11 by the sensor unit 50;

[0058] Based on the first splashing liquid data and the second splashing liquid data, execute control operations at different levels.

[0059] It should be understood that the specific processes for each module to execute the above corresponding steps have been described in detail in the above system embodiments. For the sake of brevity, they will not be repeated here.

[0060] It should also be understood that the division of modules in the embodiments of the present application is illustrative, merely a logical function division. In actual implementation, there may be other division methods. Additionally, in each embodiment of the present application, the various functional modules may be integrated in a processor, may exist separately physically, or two or more modules may be integrated in one module. The above integrated modules may be implemented in the form of hardware or in the form of software functional modules.

[0061] The present application also proposes a computer-readable medium storing computer program code, and the computer program code, when executed by a processor, implements the foregoing dual-stage splash monitoring method.

[0062] When the dual-stage splash monitoring method is implemented as a computer program, it may also be stored in a computer-readable storage medium as a product. For example, the computer-readable storage medium may include, but is not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic strips), optical disks (e.g., compact discs (CDs), digital versatile discs (DVDs)), smart cards, and flash memory devices (e.g., electrically erasable programmable read-only memories (EPROMs), cards, sticks, key drives). In addition, the various storage media described herein can represent one or more devices and / or other machine-readable media for storing information. The term "machine-readable medium" may include, but is not limited to, wireless channels and various other media (and / or storage media) that can store, contain, and / or carry code and / or instructions and / or data.

[0063] It should be understood that the embodiments described above are merely illustrative. The embodiments described herein can be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For hardware implementation, the processor can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the functions described herein, or in combination therewith.

[0064] Some aspects of the present application can be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above-mentioned hardware or software can all be referred to as "data blocks", "modules", "engines", "units", "components" or "systems". The processor can be one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. In addition, aspects of the present application may be embodied as a computer product located in one or more computer-readable media, which includes computer-readable program code. For example, the computer-readable media may include, but is not limited to, magnetic storage devices (such as hard disks, floppy disks, magnetic tapes...), optical disks (such as compact disks CD, digital versatile disks DVD...), smart cards, and flash memory devices (such as cards, sticks, key drives...).

[0065] The computer-readable media may contain a propagated data signal having computer program code embodied therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take various forms, including electromagnetic forms, optical forms, etc., or suitable combinations thereof. The computer-readable media can be any computer-readable media other than a computer-readable storage media, which can be connected to an instruction execution system, apparatus, or device to effect communication, propagation, or transmission for use of the program. The program code located on the computer-readable media can be propagated through any suitable medium, including radio, cable, fiber optic cable, radio frequency signal, or similar media, or any combination of the above media.

[0066] The above embodiments are only illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present application should still be covered by the claims of the present application.

Claims

1. A dual-stage splash monitoring system, characterized in that: include: A protective cover having an opening and a receiving cavity; A wafer clamp, located in the accommodating cavity, and used to drive the wafer to rotate; A liquid supply unit, used for supplying chemical liquid to the wafer in the accommodating cavity through the opening; A visual collection unit, used for collecting first splashing data of the chemical liquid in a collection area including the opening; The sensor unit includes a first detection module for detecting second splashing data of the chemical liquid splashed outside the containing cavity through the opening; as well as A control unit is communicatively connected to the visual acquisition unit and the sensor unit respectively, and is used to perform different levels of control operations based on the first splashing liquid data and the second splashing liquid data.

2. The dual-stage splash monitoring system according to claim 1, characterized in that: The control unit performs different levels of control operations based on the first splash data and the second splash data, including: When the first splashing liquid data or the second splashing liquid data is greater than or equal to the corresponding splashing liquid preset value, performing a primary control operation; When the first splashing liquid data or the second splashing liquid data is less than the corresponding splashing liquid preset value, performing a secondary control operation; The level of the primary control operation is higher than the level of the secondary control operation.

3. The dual-stage splash monitoring system according to claim 2, characterized in that: The first splashing data and the second splashing data both include splashing duration and splashing times, and the splashing preset value includes a duration preset value and a number preset value.

4. The dual-stage splash monitoring system according to claim 2, characterized in that: The first-level control operation includes: the control unit sends a first-level alarm signal and stops the current process on the wafer; The secondary control operation includes: the control unit sends out a secondary alarm signal, and stops the next process after the current process on the wafer is completed.

5. The dual-stage splash monitoring system according to claim 1, characterized in that: Also includes: The protective cover, the wafer clamp, the liquid supply unit, the visual acquisition unit and the sensor unit are all located in the chamber.

6. The dual-stage splash monitoring system according to claim 5, characterized in that: The collection area also includes a top wall of the chamber located directly above the opening, the visual collection unit is further used to collect first gas condensation data on the top wall, and the control unit is further used to perform corresponding control operations based on the first gas condensation data.

7. The dual-stage splash monitoring system according to claim 6, characterized in that: The control unit performs a corresponding control operation based on the first gas condensation data, including: When the first gas condensation data indicates that the gas has been condensed, a primary control operation is performed.

8. The dual-stage splash monitoring system according to claim 5, characterized in that: The sensor unit further includes at least one second detection module for detecting second gas condensation data and / or gas concentration data in the chamber, and the control unit is further configured to perform corresponding control operations based on the second gas condensation data and / or the gas concentration data.

9. The dual-stage splash monitoring system according to claim 8, characterized in that: The control unit performs corresponding control operations based on the second gas condensation data and / or the gas concentration data, including: When the second gas condensation data is condensed, performing a primary control operation; When the gas concentration data reaches a preset concentration value, a secondary control operation is performed.

10. The dual-stage splash monitoring system according to claim 9, characterized in that: The first-level control operation includes: the control unit sends a first-level alarm signal and stops the current process on the wafer; The secondary control operation includes: the control unit sends out a secondary alarm signal, and stops the next process after the current process on the wafer is completed.

11. A dual-stage splash monitoring method, characterized in that: The following steps are involved: supplying chemical liquid to the wafer rotating in the receiving chamber of the protective cover; Collecting first splashing data of the chemical liquid in a collection area including the opening of the protective cover by a visual collection unit; detecting, by a sensor unit, second liquid splashing data of the chemical liquid splashing out of the containing chamber through the opening; Based on the first splash data and the second splash data, different levels of control operations are performed.

12. A computer readable medium storing computer program code, characterized in that: The computer program code implements the dual-stage splash monitoring method of claim 11 when executed by a processor.

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