High-speed eutectic mounter and its working method

Abstract

The present invention discloses a high-speed eutectic chip mounter and its working method. The eutectic chip mounter includes a machine body, and a feeding module, a loading and unloading module, a eutectic stage module, and a preheating and cooling module are arranged on the machine body; the loading and unloading module includes a loading box and a unloading box; the feeding module is used to convey the substrate in the loading box to the preheating and cooling module; the preheating and cooling module includes a preheating component, a pre-cooling component, and a kicking component. The preheating component is used to preheat the substrate, the kicking component is used to convey the substrate, and the pre-cooling component is used to pre-cool the substrate. This solution preheats the substrate before eutectic chip mounting, so as to improve the working efficiency of the eutectic chip mounter. At the same time, after the eutectic chip mounting is completed, the pre-cooling component is used to pre-cool the substrate with the chip attached, thereby reducing the temperature gradient during the cooling process of the high-temperature substrate, reducing the internal stress between the chip and the substrate after cooling, and improving the reliability of the subsequent use of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing equipment for electrical component assemblies, and particularly relates to a high-speed eutectic mounter and its working method. Background Art

[0002] An eutectic mounter is an automated device that uses the principle of eutectic soldering to weld chips to substrates, and is widely used in the manufacturing of electrical component assemblies.

[0003] When the current eutectic mounter is in use, usually the substrate and the chip are directly heated and then eutectic chip mounting is carried out, and after the chip mounting is completed, the high-temperature substrate with the chip is directly transferred to the discharging box for placement. Therefore, the following problems exist when the existing eutectic mounter is in use: 1. Since it takes a certain amount of time to heat the substrate and the chip, this will reduce the working efficiency of the eutectic mounter. 2. Directly transferring the high-temperature substrate with the chip to the discharging box for placement will result in a very large temperature gradient during the cooling process of the high-temperature substrate, causing a large internal stress between the chip and the substrate after cooling, and reducing the reliability of the subsequent use of the chip. 3. When the existing eutectic mounter heats the substrate and the chip and performs eutectic chip mounting, high temperature easily causes oxidation of the bonding surface. Therefore, nitrogen needs to be introduced to prevent oxidation of the bonding surface. However, the current eutectic mounters on the market often introduce nitrogen into the entire module. This method not only consumes a large amount of nitrogen, but also has a low nitrogen concentration at the bonding surface, and cannot achieve an effective oxidation protection effect. Summary of the Invention

[0004] Aiming at the above deficiencies existing in the prior art, the technical problem to be solved by the present invention is: how to provide a high-speed eutectic mounter that can improve the working efficiency of the eutectic mounter, while reducing the internal stress between the chip and the substrate after cooling and improving the reliability of the subsequent use of the chip.

[0005] In addition, the present invention also provides a working method for the high-speed eutectic mounter.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A high-speed eutectic mounter includes a machine body, and a feeding module, a loading and unloading module, an eutectic table module and a preheating and cooling module are arranged on the machine body;

[0008] The loading and unloading module includes a loading box and a discharging box;

[0009] The feeding module is used to convey the substrate in the loading box to the preheating and cooling module;

[0010] The preheating and cooling module includes a preheating component, a pre-cooling component, and a kicking component. The preheating component is used to preheat the substrate conveyed by the feeding module. The kicking component is used to convey the preheated substrate to the eutectic stage module for eutectic chip bonding processing, and convey the substrate after the eutectic chip bonding processing by the eutectic stage module to the preheating and cooling module for pre-cooling. At the same time, after the pre-cooling of the substrate by the pre-cooling component is completed, the substrate is conveyed into the blanking box.

[0011] The working principle of the present invention is as follows: When the eutectic chip bonder of the present invention is in use, the substrate is placed in the loading box of the loading and unloading module. The feeding module conveys the substrate in the loading box to the preheating component of the preheating and cooling module for preheating. The preheated substrate is conveyed to the eutectic stage module for eutectic chip bonding processing. The substrate after the eutectic chip bonding processing by the eutectic stage module is conveyed to the preheating and cooling module for pre-cooling. After the pre-cooling of the substrate by the pre-cooling component is completed, the substrate is conveyed into the blanking box. Therefore, in this solution, the substrate is preheated before the eutectic chip bonding to improve the working efficiency of the eutectic chip bonder. At the same time, after the eutectic chip bonding is completed, the pre-cooling component is used to pre-cool the substrate with the chip attached, thereby reducing the temperature gradient during the cooling process of the high-temperature substrate, reducing the internal stress between the chip and the substrate after cooling, and improving the reliability of the subsequent use of the chip.

[0012] Preferably, the preheating and cooling module further includes a first axial movement component arranged along the axis. The fixed part of the first axial movement component is installed on the machine body. The moving part of the first axial movement component is connected to both the preheating component and the pre-cooling component at the same time, so that the moving part of the first axial movement component can drive the preheating component and the pre-cooling component to move axially.

[0013] In this way, by setting the first axial movement component, the axial movement of the preheating component and the pre-cooling component is realized by using the first axial movement component. The axial movement of the preheating component can make the position of the preheating component correspond to that of the loading box, so that the substrate in the loading box can be conveyed into the preheating component for preheating. At the same time, it can make the position of the preheating component correspond to that of the kicking component, so as to use the kicking component to convey the preheated substrate to the eutectic stage module for eutectic chip bonding processing. The axial movement of the pre-cooling component can make the position of the pre-cooling component correspond to that of the kicking component, so as to use the kicking component to convey the substrate after the eutectic chip bonding processing at the eutectic stage module to the preheating and cooling module for pre-cooling, and convey the substrate after the pre-cooling is completed into the blanking box.

[0014] Preferably, the kicking component includes a mounting frame, a kicking arm, and a first longitudinal movement component. The mounting frame is connected to the machine body. The fixed part of the first longitudinal movement component is connected to the mounting frame in the longitudinal direction, and the moving part of the first longitudinal movement component is connected to the kicking arm, so that the first longitudinal movement component can drive the kicking arm to move longitudinally.

[0015] In this way, when the kicking component needs to transport the preheated substrate to the eutectic stage module for eutectic chip bonding treatment, first, the first axial movement component drives the preheating component to move to a position corresponding to the kicking arm, and then the first longitudinal movement component drives the kicking arm to move longitudinally, and the kicking arm is used to push the substrate to the eutectic stage module. When the kicking component needs to transport the substrate after the eutectic chip bonding treatment at the eutectic stage module to the pre-cooling module for pre-cooling and transport the substrate after the pre-cooling is completed to the blanking box, first, the first axial movement component drives the pre-cooling component to move to a position corresponding to the kicking arm, and then the first longitudinal movement component drives the kicking arm to move to a position corresponding to the eutectic stage module. The first longitudinal movement component drives the kicking arm to move longitudinally so that the substrate on the eutectic stage module is transported to the pre-cooling module for pre-cooling treatment. After the pre-cooling treatment of the substrate is completed, the first longitudinal movement component further drives the kicking arm to move longitudinally, so that the kicking arm pushes the substrate of the pre-cooling module into the blanking box.

[0016] Preferably, the preheating component includes a preheating mounting base, which is connected to the moving part of the first axial movement component. The preheating mounting base is provided with a preheating rod, a first substrate support plate, a first substrate top air isolation plate, and a first vertical movement component. The first substrate support plate is used to place the substrate, and the preheating rod is used to preheat the substrate on the first substrate support plate. The first vertical movement component includes a first vertical power component, a first substrate pressing piece, and a first substrate side baffle. The power output end of the first vertical power component is respectively connected to the first substrate pressing piece and the first substrate side baffle through a first connecting plate. The first vertical power component is used to drive the first substrate pressing piece and the first substrate side baffle to move in the vertical direction to a first upper set position and a first lower set position. The first upper set position is the position where the first substrate pressing piece is separated from the substrate on the first substrate support plate, and the first lower set position is the position where the first substrate pressing piece presses the substrate on the first substrate support plate. And at the first lower set position, the first substrate support plate, the first substrate side baffle, and the first substrate top air isolation plate form a relatively closed space during the preheating of the substrate.

[0017] In this way, when preheating the substrate, first, the first vertical power component drives the first substrate pressing piece and the first substrate side baffle to move upward to the first upper set position. Then, the feeding module conveys the substrate in the loading box to the first substrate support plate. Next, the first vertical power component drives the first substrate pressing piece and the first substrate side baffle to move downward to the first lower set position. At this time, the first substrate pressing piece presses the substrate on the first substrate support plate to ensure the stability during the substrate preheating process. The first substrate side baffle shields the first substrate support plate from both ends, thereby making the first substrate support plate, the first substrate side baffle, and the first substrate top air isolation plate form a relatively enclosed space during substrate preheating. At this time, the preheating rod preheats the substrate. When the preheating process is completed, the first vertical power component drives the first substrate pressing piece and the first substrate side baffle to move upward to the first upper set position again, and then the kicking arm conveys the substrate to the eutectic stage module for eutectic chip bonding processing.

[0018] Preferably, the pre-cooling assembly includes a pre-cooling mounting seat, which is connected to the moving part of the first axial moving assembly. The pre-cooling mounting seat is provided with a pre-cooling rod, a second substrate support plate, a second substrate top air isolation plate, and a second vertical moving assembly. The second substrate support plate is used to place the substrate. The pre-cooling rod is used to pre-cool the substrate on the second substrate support plate. The second vertical moving assembly includes a second vertical power component, a second substrate pressing piece, and a second substrate side baffle. The power output end of the second vertical power component is respectively connected to the second substrate pressing piece and the second substrate side baffle through a second connecting plate. The second vertical power component is used to drive the second substrate pressing piece and the second substrate side baffle to move in the vertical direction to the second upper set position and the second lower set position. The second upper set position is the position where the second substrate pressing piece is separated from the substrate on the second substrate support plate, and the second lower set position is the position where the second substrate pressing piece presses the substrate on the second substrate support plate. And at the second lower set position, the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively enclosed space during substrate pre-cooling.

[0019] In this way, when pre-cooling the substrate, first, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move upward to the second upper set position. Then, the eutectic table module on the kicker arm conveys the substrate to the second substrate support plate. Next, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move downward to the second lower set position. At this time, the second substrate pressing piece presses the substrate on the second substrate support plate to ensure the stability during the substrate pre-cooling process. The second substrate side baffle shields the second substrate support plate from both ends, so that the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively enclosed space during the substrate pre-cooling. At this time, the pre-cooling rod pre-cools the substrate. When the pre-cooling process is completed, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move upward to the second upper set position again, and then the kicker arm is used to convey the substrate into the blanking box.

[0020] Preferably, a plurality of first nitrogen inlet holes are provided on both axial sides of the first substrate support plate, and a plurality of second nitrogen inlet holes are provided on both axial sides of the second substrate support plate. The first nitrogen inlet holes and the second nitrogen inlet holes are both used for inputting nitrogen.

[0021] In this way, by providing a plurality of first nitrogen inlet holes on both axial sides of the first substrate support plate, when pre-heating the substrate, nitrogen is introduced at the first nitrogen inlet holes to prevent oxidation of the bonding surface. Since during the entire pre-heating process, the first substrate support plate, the first substrate side baffle, and the first substrate top air isolation plate form a relatively enclosed space during the substrate pre-heating, the nitrogen introduced through the first nitrogen inlet holes can act better on the bonding surface, not only reducing the nitrogen consumption but also ensuring the effect of preventing oxidation of the bonding surface. Similarly, by providing a plurality of second nitrogen inlet holes on both axial sides of the second substrate support plate, when pre-cooling the substrate, nitrogen is introduced at the second nitrogen inlet holes to prevent oxidation of the bonding surface. Since during the entire pre-cooling process, the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively enclosed space during the substrate pre-cooling, the nitrogen introduced through the second nitrogen inlet holes can act better on the bonding surface, not only reducing the nitrogen consumption but also ensuring the effect of preventing oxidation of the bonding surface.

[0022] Preferably, the eutectic table module includes a eutectic table assembly, a eutectic table axial movement assembly, and a eutectic table longitudinal movement assembly. The eutectic table axial movement assembly is used to drive the eutectic table assembly to move axially, and the eutectic table longitudinal movement assembly is used to drive the eutectic table assembly to move longitudinally.

[0023] The eutectic stage assembly includes an eutectic stage, on which a third substrate support plate and a third vertical movement assembly are provided; the third substrate support plate is used for placing a substrate, and the third vertical movement assembly includes a third vertical power member, a third substrate pressing piece, and a third substrate side baffle. The power output end of the third vertical power member is respectively connected to the third substrate pressing piece and the third substrate side baffle through a third connecting plate. The third vertical power member is used to drive the third substrate pressing piece and the third substrate side baffle to move in the vertical direction to a third upper set position and a third lower set position. The third upper set position is the position where the third substrate pressing piece is separated from the substrate on the third substrate support plate, and the third lower set position is the position where the third substrate pressing piece presses the substrate on the third substrate support plate. Above the third substrate support plate, an eutectic stage top cover is further provided, and an eutectic chip bonding hole is opened on the eutectic stage top cover.

[0024] In this way, when performing eutectic chip bonding on the substrate, first, the eutectic stage axial movement assembly drives the eutectic stage assembly to move axially to a position corresponding to the preheating assembly, and the third vertical power member drives the third substrate pressing piece and the third substrate side baffle to move upward to the third upper set position. Then, the kicker arm conveys the substrate on the preheating assembly to the third substrate support plate, and then the third vertical power member drives the third substrate pressing piece and the third substrate side baffle to move downward to the third lower set position. At this time, the third substrate pressing piece presses the substrate on the third substrate support plate to ensure the stability during the eutectic chip bonding process of the substrate. After the conveyance of the substrate is completed, the eutectic stage axial movement assembly and the eutectic stage longitudinal movement assembly jointly drive the eutectic stage assembly to move, so that the material on the eutectic stage that needs to be bonded with the chip is exposed at the eutectic chip bonding hole to complete the eutectic chip bonding process. After the eutectic chip bonding of one material is completed, the eutectic stage axial movement assembly and the eutectic stage longitudinal movement assembly drive the eutectic stage to move again, so that the next material that needs to be bonded with the chip is exposed at the eutectic chip bonding hole to complete the eutectic chip bonding process, and so on until all the materials on the substrate have completed the eutectic chip bonding process. After all the materials on the substrate have completed the eutectic chip bonding process, the eutectic stage axial movement assembly drives the eutectic stage to move to the position directly behind the pre-cooling assembly, and the third vertical power member drives the third substrate pressing piece and the third substrate side baffle to move upward to the third upper set position, and then the kicker arm is used to convey the substrate after the eutectic chip bonding to the pre-cooling assembly for cooling.

[0025] Preferably, a plurality of third nitrogen inlet holes are provided on both axial sides of the third substrate support plate, and the third nitrogen inlet holes are used for inputting nitrogen.

[0026] In this way, by providing a plurality of third nitrogen inlet holes on both axial sides of the third substrate support plate, when eutectic bonding the substrate, nitrogen is introduced at the third nitrogen inlet holes to prevent oxidation of the bonding surface. Since nitrogen is directly introduced to the bonding surface, the amount of nitrogen used can be reduced, and at the same time, the effect of preventing oxidation can be ensured.

[0027] Preferably, a wafer movement module, a lifting module, and a chip suction module are further provided on the body;

[0028] The wafer movement module includes a wafer stage, a wafer stage axial movement component, and a wafer stage longitudinal movement component. The wafer stage is used for placing chips. The wafer stage axial movement component is used to drive the wafer stage to move axially, and the wafer stage longitudinal movement component is used to drive the wafer stage to move longitudinally;

[0029] The lifting module includes a top needle head and a fourth vertical movement component. The fixed part of the fourth vertical movement component is installed on the body in the vertical direction. The moving part of the fourth vertical movement component is connected to the top needle head to drive the top needle head to move in the vertical direction through the moving part of the fourth vertical movement component;

[0030] The chip suction module includes a chip suction arm and an arm rotation power component. The arm rotation power component is connected to the body through a mounting frame. The power output end of the arm rotation power component is connected to the chip suction arm to drive the chip suction arm to rotate through the arm rotation power component. A chip suction nozzle head is further provided at one end of the chip suction arm away from the arm rotation power component. The chip suction nozzle head is used for sucking chips.

[0031] In this way, before bonding the chip to the substrate, the chip is placed on the wafer stage. Then, the wafer stage axial movement component and the wafer stage longitudinal movement component drive the wafer stage to move, so that the chip to be bonded on the wafer stage moves directly above the top needle head. Then, the fourth vertical movement component drives the top needle head to move upward and lift the chip. At the same time, the arm rotation power component also drives the chip suction arm to move directly above the top needle head. At this time, the top needle head moves upward to lift the chip to the surface of the chip suction nozzle head of the chip suction arm, and then the chip suction nozzle head sucks the chip. After the chip suction nozzle head sucks the chip, the arm rotation power component drives the chip suction arm to rotate to the adjustment module, and the chip suction nozzle head places the chip at the adjustment module.

[0032] Preferably, an adjustment module is further provided on the body. The adjustment module is used to adjust the position of the chip placed by the chip suction nozzle head;

[0033] The adjustment module includes a transfer platform and an adjustment motor. The transfer platform is used to place the chip. The rotating shaft of the adjustment motor is connected to the transfer platform to drive the transfer platform to rotate through the rotation of the adjustment motor, and the rotation of the transfer platform adjusts the position of the chip.

[0034] In this way, before chip bonding, the chip is first placed on the transfer platform. When there is an angular deviation of the chip, the angular deviation of the chip is adjusted by the rotation of the adjustment motor driving the transfer platform to rotate, ensuring the accuracy of the position where the chip is bonded to the substrate.

[0035] Preferably, a chip bonding module is further provided on the machine body. The chip bonding module includes a chip bonding head, a bonding head axial movement component, and a bonding head vertical movement component. The bonding head axial movement component is used to drive the chip bonding head to move axially, and the bonding head vertical movement component is used to drive the chip bonding head to move vertically. The chip bonding head sucks the chip from the transfer platform and bonds it to the substrate of the eutectic stage module. A bonding head heating rod and a temperature sensor are further provided on the chip bonding head. The bonding head heating rod is used to heat the chip bonding head, and the temperature sensor is used to detect the temperature of the chip bonding head.

[0036] In this way, when chip bonding is performed, the bonding head axial movement component and the bonding head vertical movement component drive the chip bonding head to move to the transfer platform. The chip bonding head sucks the chip from the transfer platform. Since a bonding head heating rod and a temperature sensor are provided on the chip bonding head, after the chip bonding head sucks the chip, the bonding head heating rod will heat the chip bonding head, and at the same time, the temperature sensor detects the temperature of the chip bonding head. Thus, the chip bonding head can always maintain the set temperature to heat the chip, and then the bonding head axial movement component and the bonding head vertical movement component drive the chip bonding head to move to the eutectic bonding hole, and the chip bonding head bonds the chip to the material at the eutectic bonding hole. By heating the chip during the chip movement process, the working efficiency of the eutectic mounter is further improved.

[0037] A working method of a high-speed eutectic mounter as described above. The feeding module transports the substrate in the loading box to the preheating component of the preheating and cooling module. The preheating component heats the substrate and then transports it to the eutectic stage module for eutectic bonding processing. The substrate after the eutectic bonding processing by the eutectic stage module is transported to the pre-cooling component of the preheating and cooling module for pre-cooling. After the pre-cooling component completes the pre-cooling of the substrate, the substrate is transported into the unloading box.

[0038] Compared with the prior art, before and after the chip and the substrate are bonded, effective preheating and pre-cooling are carried out in the present invention, which greatly saves the time of eutectic soldering and ensures the effectiveness of eutectic soldering. In addition, protective covers isolated from the outside air are added in the preheating, pre-cooling and eutectic soldering stages, and nitrogen is only introduced to the bonding surface that needs to prevent oxidation, reducing the nitrogen consumption and effectively preventing the bonding surface from oxidation. Therefore, the present invention effectively improves the efficiency and reliability of eutectic soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Attached Figure 1 is a schematic diagram of the overall structure of the high-speed eutectic mounter of the present invention;

[0040] Attached Figure 2 is a top view of the high-speed eutectic mounter of the present invention;

[0041] Attached Figure 3 is a schematic diagram of the structure of the loading and unloading module in the high-speed eutectic mounter of the present invention;

[0042] Attached Figure 4 is a schematic diagram of the structure of the feeding module in the high-speed eutectic mounter of the present invention;

[0043] Attached Figure 5 is a schematic diagram of the structure of the preheating and cooling module in the high-speed eutectic mounter of the present invention;

[0044] Attached Figure 6 is a schematic diagram of the structure of the preheating component in the high-speed eutectic mounter of the present invention (removing the air isolation plate on the top of the first substrate);

[0045] Attached Figure 7 is a schematic diagram of the structure of the preheating component in the high-speed eutectic mounter of the present invention;

[0046] Attached Figure 8 is a schematic diagram of the structure of the eutectic stage module in the high-speed eutectic mounter of the present invention;

[0047] Attached Figure 9 is a schematic diagram of the structure of the eutectic stage component in the high-speed eutectic mounter of the present invention;

[0048] Attached Figure 10 is a schematic diagram of the structure of the wafer movement module in the high-speed eutectic mounter of the present invention;

[0049] Attached Figure 11 is a schematic diagram of the structure of the lifting module in the high-speed eutectic mounter of the present invention;

[0050] Attached Figure 12 is a schematic diagram of the structure of the chip suction module in the high-speed eutectic mounter of the present invention;

[0051] Attached Figure 13Schematic diagram of the structure of the adjustment module in the high-speed eutectic chip mounter of the present invention;

[0052] Appendix Figure 14 Schematic diagram of the structure of the chip bonding module in the high-speed eutectic chip mounter of the present invention.

[0053] Description of reference numerals: machine body 1, loading and unloading module 2, loading and unloading vertical movement component 201, loading box 202, unloading box 203, feeding module 3, push rod 301, second longitudinal movement component 302, preheating and cooling module 4, first axial movement component 401, preheating component 402, first vertical power component 4021, first guide rail 4022, preheating rod 4023, first substrate support plate 4024, first substrate side baffle 4025, first substrate pressing piece 4026, first nitrogen inlet hole 4027, first substrate top air isolation plate 4028, pre-cooling component 403, first longitudinal movement component 404, kicking arm 405, eutectic stage module 5, eutectic stage axial movement component 501, eutectic stage longitudinal movement component 502, eutectic stage component 503, eutectic stage 5031, third substrate side baffle 5032, third substrate pressing piece 5033, third substrate support plate 5034, third nitrogen inlet hole 5035, wafer movement module 6, wafer stage 601, wafer stage axial movement component 602, wafer stage longitudinal movement component 603, lifting module 7, top needle head 701, fourth vertical movement component 702, chip suction module 8, arm rotation power component 801, chip suction arm 802, chip suction nozzle head 803, chip bonding module 9, chip bonding head 901, adjustment module 10, transfer platform 1001, adjustment motor 1002, chip vision component 11, eutectic bonding vision component 12. Detailed implementation manners

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0055] In the high-speed eutectic chip mounter in this specific embodiment, it includes a machine body 1. On the machine body 1, there are a feeding module 3, a loading and unloading module 2, an eutectic stage module 5, a preheating and cooling module 4, a wafer movement module 6, a lifting module 7, a chip suction module 8, an adjustment module 10, and a chip bonding module 9. Above the wafer movement module 6, there is a chip vision component 11, and above the eutectic stage module, there is an eutectic bonding vision component 12. The position of each module on the machine body 1 is as shown in Appendix Figure 1 and Appendix Figure 2 shown.

[0056] Next, the structures and working principles of each module will be described in detail:

[0057] As shown in Appendix Figure 3 shown, in this specific embodiment, the loading and unloading module 2 includes a loading box 202, an unloading box 203, and a loading and unloading vertical movement component 201. The fixed part of the loading and unloading vertical movement component 201 is installed on the frame. On the moving part of the loading and unloading vertical movement component 201, there is a fixed plate installed. Both the loading box 202 and the unloading box 203 are installed on the fixed plate. In this way, the loading and unloading vertical movement component 201 can be used to drive the loading box 202 and the unloading box 203 to achieve the effect of vertical movement. Each loading box 202 is provided with a plurality of loading slots for placing substrates to be subjected to chip mounting processing. There are a plurality of materials on the substrate. The unloading box 203 is provided with a plurality of unloading slots for placing substrates that have completed chip mounting processing. Among them, the loading and unloading vertical movement component 201 realizes a linear movement in the vertical direction. The implementation method of this linear movement can adopt the structural form of a linear motor plus a linear guide rail, or a cylinder, a slider plus a guide rail, etc. These structural forms for realizing linear movement all belong to the prior art. For those skilled in the art, they can select the specific structure according to the actual design needs, and the implementation form of this linear structure will not have a substantial impact on the solution of the present invention and does not belong to the technical solution to be protected by the present invention. Therefore, it will not be elaborated in detail in the present invention.

[0058] As shown in Appendix Figure 3 to Appendix Figure 5As shown, in this specific embodiment, the feeding module 3 is used to convey the substrate in the loading cassette 202 to the preheating and cooling module 4. Specifically, the feeding module 3 includes a push rod 301 and a second longitudinal movement component 302. The fixed part of the second longitudinal movement component 302 is installed on the machine body 1 along the longitudinal direction. The moving part of the second longitudinal movement component 302 is connected to the push rod 301, so as to drive the push rod 301 to move longitudinally through the second longitudinal movement component 302. And during the longitudinal movement of the push rod 301, it can extend into the loading slot of the loading cassette 202 and abut against the substrate at the corresponding position, and convey the substrate at the corresponding position to the preheating component 402 through the longitudinal movement of the push rod 301. Among them, the second longitudinal movement component 302 realizes a linear movement in the longitudinal direction. The implementation method of this linear movement can adopt the structural form of a linear motor plus a linear guide rail, or the structural form of a slider plus a guide rail, etc. These structural forms for realizing linear movement all belong to the prior art. For those skilled in the art, they can select the specific structure according to the actual design needs, and the implementation form of this linear structure will not have a substantial impact on the solution of the present invention and does not belong to the technical solution to be protected by the present invention. Therefore, it will not be elaborated in detail in the present invention.

[0059] In this way, place the substrate to be processed by chip mounting in the loading slot of the loading cassette 202, drive the loading cassette 202 to move vertically through the vertical movement component 201 for loading and unloading, so that the substrates in the loading slots at different positions in the loading cassette 202 move to the positions corresponding to the push rod 301, and then drive the push rod 301 to move longitudinally through the second longitudinal movement component 302. During the longitudinal movement of the push rod 301, it extends into the loading slot of the loading cassette 202 and abuts against the substrate at the corresponding position, and conveys the substrate at the corresponding position to the preheating component 402 through the continuous longitudinal movement of the push rod 301. In addition, when the substrate completes the pre-cooling treatment on the pre-cooling component 403, the vertical movement component 201 for loading and unloading drives the unloading cassette 203 to move vertically, so that the unloading slots at different positions of the unloading cassette 203 correspond to the pre-cooling component 403, and thus use the kicking arm 405 to convey the substrate that has completed the pre-cooling treatment on the pre-cooling component 403 to the unloading slots at different positions.

[0060] In this specific embodiment, as shown in the appendix Figure 5As shown in the figure, the preheating and cooling module 4 includes a preheating component 402, a pre-cooling component 403, a kicking component, and a first axial movement component 401 arranged axially. The fixed part of the first axial movement component 401 is installed on the machine body 1, and the moving part of the first axial movement component 401 is connected to both the preheating component 402 and the pre-cooling component 403, so that the moving part of the first axial movement component 401 can drive the preheating component 402 and the pre-cooling component 403 to move axially. The preheating component 402 is used to preheat the substrate conveyed by the feeding module 3. The kicking component is used to convey the preheated substrate to the eutectic table module 5 for eutectic chip bonding processing, and convey the substrate after the eutectic chip bonding processing by the eutectic table module 5 to the preheating and cooling module 4 for pre-cooling, and at the same time convey the substrate into the blanking box 203 after the pre-cooling component 403 finishes pre-cooling the substrate. Specifically, the kicking component includes a mounting rack, a kicking arm 405, and a first longitudinal movement component 404. The mounting rack is connected to the machine body 1. The fixed part of the first longitudinal movement component 404 is connected to the mounting rack in the longitudinal direction, and the moving part of the first longitudinal movement component 404 is connected to the kicking arm 405, so that the first longitudinal movement component 404 can drive the kicking arm 405 to move longitudinally. Among them, the first axial movement component 401 and the first longitudinal movement component 404 respectively achieve linear motion in the axial direction and the longitudinal direction. The implementation manner of this linear motion can adopt the structural form of a linear motor plus a linear guide rail, or the structural form of a slider plus a guide rail, etc. These structural forms for realizing linear motion all belong to the prior art. For those skilled in the art, the specific structure can be selected according to actual design needs, and the implementation form of this linear structure will not have a substantial impact on the solution of the present invention and does not belong to the technical solution to be protected by the present invention, so it will not be elaborated in detail in the present invention.

[0061] In this way, by setting the first axial movement component 401, the axial movement of the preheating component 402 and the pre-cooling component 403 is realized by using the first axial movement component 401. The axial movement of the preheating component 402 can make the position of the preheating component 402 correspond to that of the loading box 202, so that the substrate in the loading box 202 can be transported into the preheating component 402 for preheating. At the same time, it can make the position of the preheating component 402 correspond to that of the kicking component, so as to use the kicking component to transport the preheated substrate to the eutectic stage module 5 for eutectic chip bonding processing. When the kicking component needs to transport the preheated substrate to the eutectic stage module 5 for eutectic chip bonding processing, first, the first axial movement component 401 drives the preheating component 402 to move to a position corresponding to the kicking arm 405, and then the first longitudinal movement component 404 drives the kicking arm 405 to move longitudinally, and the kicking arm 405 is used to push the substrate to the eutectic stage module 5. The axial movement of the pre-cooling component 403 can make the position of the pre-cooling component 403 correspond to that of the kicking component, so as to use the kicking component to transport the substrate after the eutectic chip bonding processing at the eutectic stage module 5 to the pre-cooling module for pre-cooling, and transport the substrate after the pre-cooling is completed into the unloading box 203. When the kicking component needs to transport the substrate after the eutectic chip bonding processing at the eutectic stage module 5 to the pre-cooling module for pre-cooling and transport the substrate after the pre-cooling is completed into the unloading box 203, first, the first axial movement component 401 drives the pre-cooling component 403 to move to a position corresponding to the kicking arm 405, and then the first longitudinal movement component 404 drives the kicking arm 405 to move to a position corresponding to the eutectic stage module 5. The first longitudinal movement component 404 drives the kicking arm 405 to move longitudinally to transport the substrate on the eutectic stage module 5 to the pre-cooling module for cooling processing. After the substrate cooling processing is completed, the first longitudinal movement component 404 further drives the kicking arm 405 to move longitudinally, so that the kicking arm 405 pushes the substrate of the pre-cooling module into the unloading box 203.

[0062] In this specific embodiment, as shown in the attached Figure 6 and attached Figure 7As shown, the preheating component 402 includes a preheating mounting base, which is connected to the moving part of the first axial movement component 401. The preheating mounting base is provided with a preheating rod 4023, a first substrate support plate 4024, a first substrate top air isolation plate 4028 and a first vertical movement component; the first substrate support plate 4024 is used to place the substrate, the preheating rod 4023 is used to preheat the substrate on the first substrate support plate 4024. First vertical movement components are provided on both axial sides of the first substrate support plate 4024. A plurality of first nitrogen inlet holes 4027 are also provided on both axial sides of the first substrate support plate 4024. Nitrogen is input at the first nitrogen inlet holes 4027. The first vertical movement component includes a first vertical power member 4021, a first substrate pressing piece 4026 and a first substrate side baffle 4025. A plurality of first substrate pressing pieces 4026 are arranged along the longitudinal direction. Two first substrate side baffles 4025 are provided, and the two first substrate side baffles 4025 are respectively corresponding to the longitudinal two sides of the first substrate support plate 4024. The power output end of the first vertical power member 4021 is connected to the first substrate pressing piece 4026 and the first substrate side baffle 4025 through a first connecting plate. The first vertical power member 4021 is used to drive the first substrate pressing piece 4026 and the first substrate side baffle 4025 to move in the vertical direction to a first upper set position and a first lower set position. Specifically, the first vertical power member 4021 can be a first cylinder. A first guide rail 4022 can also be provided on the preheating mounting base, and a first slider is provided on the first connecting plate. When the power output end of the first cylinder moves in the vertical direction, the first slider slides along the first guide rail to guide the vertical movement of the first substrate pressing piece 4026 and the first substrate side baffle 4025. Of course, the first vertical power member 4021 can be of other structural forms as long as it can achieve the vertical movement of this solution. The first upper set position is the position where the first substrate pressing piece 4026 is separated from the substrate on the first substrate support plate 4024, and the first lower set position is the position where the first substrate pressing piece 4026 is pressed against the substrate on the first substrate support plate 4024. And at the first lower set position, the first substrate support plate 4024, the first substrate side baffle 4025 and the first substrate top air isolation plate 4028 form a relatively closed space during substrate preheating.

[0063] In this way, when preheating the substrate, first, the first vertical power component 4021 drives the first substrate pressing piece 4026 and the first substrate side baffle 4025 to move upward to the first upper set position. Then, the feeding module 3 conveys the substrate in the loading box 202 onto the first substrate support plate 4024. Next, the first vertical power component 4021 drives the first substrate pressing piece 4026 and the first substrate side baffle 4025 to move downward to the first lower set position. At this time, the first substrate pressing piece 4026 presses the substrate on the first substrate support plate 4024 to ensure the stability during the substrate preheating process. The first substrate side baffle 4025 shields the first substrate support plate 4024 from both ends, so that the first substrate support plate 4024, the first substrate side baffle 4025, and the first substrate top air isolation plate 4028 form a relatively enclosed space during the substrate preheating. The preheating rod 4023 preheats the substrate, and at the same time, nitrogen is introduced into the first nitrogen inlet hole 4027. By introducing nitrogen, oxidation of the bonding surface is prevented. Since nitrogen is directly introduced into the bonding surface here, the nitrogen consumption is small and the anti-oxidation effect is good. After the preheating treatment is completed, the first vertical power component 4021 drives the first substrate pressing piece 4026 and the first substrate side baffle 4025 to move upward to the first upper set position again, and then the kicking arm 405 conveys the substrate to the eutectic stage module 5 for eutectic chip bonding treatment.

[0064] In this specific embodiment, the pre-cooling component 403 and the pre-heating component 402 are exactly the same in structure, except that the heating powers of the pre-heating rods 4023 and the pre-cooling rods of the two are different. Therefore, in this specific embodiment, no structural drawing description is provided for the pre-cooling component 403, and the structure of the pre-cooling component 403 can refer to the structural drawing of the pre-heating component 402. The pre-cooling component 403 includes a pre-cooling mounting base, and the pre-cooling mounting base is connected to the moving member of the first axial moving component 401. The pre-cooling mounting base is provided with a pre-cooling rod, a second substrate support plate, a second substrate top air isolation plate, and a second vertical moving component; the second substrate support plate is used to place the substrate, the pre-cooling rod is used to pre-cool the substrate on the second substrate support plate, and second vertical moving components are provided on both axial sides of the second substrate support plate. A plurality of second nitrogen inlet holes are also provided on both axial sides of the second substrate support plate, and nitrogen is input at the second nitrogen inlet holes. The second vertical moving component includes a second vertical power member, a second substrate pressing piece, and a second substrate side baffle. A plurality of second substrate pressing pieces are arranged in the longitudinal direction, and two second substrate side baffles are provided. The two second substrate side baffles are respectively corresponding to the two longitudinal sides of the second substrate support plate. The power output end of the second vertical power member is respectively connected to the second substrate pressing piece and the second substrate side baffle through a second connecting plate. The second vertical power member is used to drive the second substrate pressing piece and the second substrate side baffle to move in the vertical direction to a second upper set position and a second lower set position. Specifically, the second vertical power member can be a second cylinder. A second guide rail can also be provided on the pre-cooling mounting base, and a second slider can be provided on the second connecting plate. When the power output end of the second cylinder moves vertically, the second slider slides along the second guide rail to guide the vertical movement of the second substrate pressing piece and the second substrate side baffle. Of course, the second vertical power member can be of other structural forms as long as the vertical movement of this solution can be achieved. The second upper set position is the position where the second substrate pressing piece is separated from the substrate on the second substrate support plate, and the second lower set position is the position where the second substrate pressing piece is pressed against the substrate on the second substrate support plate. And at the second lower set position, the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively closed space during substrate pre-cooling.

[0065] In this way, when pre-cooling the substrate, first, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move upward to the second upper set position. Then, the eutectic table module 5 on the kicker arm 405 transports the substrate to the second substrate support plate. Then, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move downward to the second lower set position. At this time, the second substrate pressing piece presses the substrate on the second substrate support plate to ensure the stability during the substrate pre-cooling process. The second substrate side baffle shields the second substrate support plate from both ends, so that the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively enclosed space during the substrate pre-cooling. At this time, the pre-cooling rod pre-cools the substrate, and nitrogen is also introduced into the second nitrogen inlet hole. By introducing nitrogen, oxidation of the bonding surface is prevented. Since nitrogen is directly introduced into the bonding surface here, the nitrogen consumption is small and the anti-oxidation effect is good. When the pre-cooling treatment is completed, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move upward to the second upper set position again, and then the substrate is transported into the blanking box 203 by using the kicker arm 405.

[0066] In this specific embodiment, as shown in the attached Figure 8 and the attached Figure 9 figures, the eutectic table module 5 includes a eutectic table assembly 503, a eutectic table axial movement assembly 501, and a eutectic table longitudinal movement assembly 502. The eutectic table axial movement assembly 501 is used to drive the eutectic table assembly 503 to move axially, and the eutectic table longitudinal movement assembly 502 is used to drive the eutectic table assembly 503 to move longitudinally.

[0067] The eutectic stage assembly 503 includes an eutectic stage 5031, on which a third substrate support plate 5034 and a third vertical movement assembly are provided; the third substrate support plate 5034 is for placing a substrate, and a plurality of third nitrogen inlet holes 5035 are provided on both axial sides of the third substrate support plate 5034, and the third nitrogen inlet holes 5035 are used for inputting nitrogen, and third vertical movement assemblies are provided on both axial sides of the third substrate support plate 5034. The third vertical movement assembly includes a third vertical power member, a third substrate pressing piece 5033 and a third substrate side baffle 5032. A plurality of third substrate pressing pieces 5033 are arranged in the longitudinal direction, and two third substrate side baffles 5032 are provided, and the two third substrate side baffles 5032 are respectively corresponding to the longitudinal two sides of the third substrate support plate 5034. The power output end of the third vertical power member is respectively connected to the third substrate pressing piece 5033 and the third substrate side baffle 5032 through a third connecting plate. The third vertical power member is used to drive the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move in the vertical direction between a third upper set position and a third lower set position. Specifically, the third vertical power member can be a third cylinder, and a third guide rail can also be provided on the eutectic stage 5031, and a third slider is provided on the third connecting plate. When the power output end of the third cylinder moves vertically, the third slider slides along the third guide rail to guide the vertical movement of the third substrate pressing piece 5033 and the third substrate side baffle 5032. Of course, the third vertical power member can be of other structural forms as long as it can achieve the vertical movement of this solution. The third upper set position is the position where the third substrate pressing piece 5033 is separated from the substrate on the third substrate support plate 5034, and the third lower set position is the position where the third substrate pressing piece 5033 presses the substrate on the third substrate support plate 5034. An eutectic stage top cover is further provided above the third substrate support plate 5034. The eutectic stage top cover is installed on the machine body 1, and an eutectic chip mounting hole is provided on the eutectic stage top cover. This eutectic chip mounting hole is the eutectic chip mounting position.

[0068] In this way, when performing eutectic chip bonding on the substrate, first, the eutectic stage axial movement component 501 drives the eutectic stage component 503 to move axially to a position corresponding to the preheating component 402, and the third vertical power component drives the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move upward to the third upper set position. Then, the kicking arm 405 conveys the substrate on the preheating component 402 to the third substrate support plate 5034. Next, the third vertical power component drives the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move downward to the third lower set position. At this time, the third substrate pressing piece 5033 presses the substrate on the third substrate support plate 5034 to ensure the stability during the eutectic chip bonding process of the substrate. After the conveyance of the substrate is completed, the eutectic stage axial movement component 501 and the eutectic stage longitudinal movement component 502 jointly drive the eutectic stage component 503 to move, so that the material on the eutectic stage 5031 that needs to be bonded with the chip is exposed at the eutectic chip bonding hole to complete the eutectic chip bonding process. When performing eutectic bonding on the substrate, nitrogen is introduced through the third nitrogen inlet hole 5035 to prevent oxidation of the bonding surface. Since the nitrogen is directly introduced to the bonding surface, the nitrogen consumption can be reduced, and at the same time, the effect of preventing oxidation can be ensured. After the eutectic chip bonding of one material is completed, the eutectic stage axial movement component 501 and the eutectic stage longitudinal movement component 502 drive the eutectic stage 5031 to move again, so that the next material that needs to be bonded with the chip is exposed at the eutectic chip bonding hole to complete the eutectic chip bonding process. In this way, until all the materials on the substrate have completed the eutectic chip bonding process. After all the materials on the substrate have completed the eutectic chip bonding process, the eutectic stage axial movement component 501 drives the eutectic stage 5031 to move to the position directly behind the pre-cooling component 403. The third vertical power component drives the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move upward to the third upper set position. Then, the kicking arm 405 conveys the substrate after eutectic chip bonding to the pre-cooling component 403 for cooling.

[0069] In this specific embodiment, as shown in the attached Figure 10 figure, the wafer movement module 6 includes a wafer stage 601, a wafer stage axial movement component 602, and a wafer stage longitudinal movement component 603. The wafer stage 601 is used to place chips. The wafer stage axial movement component 602 is used to drive the wafer stage 601 to move axially. The wafer stage longitudinal movement component 603 is used to drive the wafer stage 601 to move longitudinally; as shown in the attached Figure 11 figure, the lifting module 7 includes a lifting pin head 701 and a fourth vertical movement component 702. The fixed part of the fourth vertical movement component 702 is installed on the machine body 1 in the vertical direction. The moving part of the fourth vertical movement component 702 is connected to the lifting pin head 701 to drive the lifting pin head 701 to move in the vertical direction through the moving part of the fourth vertical movement component 702; as shown in the attached Figure 12As shown, the chip suction module 8 includes a chip suction arm 802 and an arm rotation power member 801. The arm rotation power member 801 is connected to the machine body 1 through a mounting bracket. The power output end of the arm rotation power member 801 is connected to the chip suction arm 802 to drive the chip suction arm 802 to rotate through the arm rotation power member 801. In this specific embodiment, the arm rotation power member 801 is a rotary motor. A chip suction nozzle head 803 is further provided at one end of the chip suction arm 802 away from the arm rotation power member 801, and the chip suction nozzle head 803 is used to suck the chip. Among them, the wafer stage axial movement component 602, the wafer stage longitudinal movement component 603, and the fourth vertical movement component 702 respectively realize linear movements in the axial direction, the longitudinal direction, and the vertical direction. The implementation manner of this linear movement can adopt a structure form of a linear motor plus a linear guide rail, or a structure form such as a slider plus a guide rail. These structure forms for realizing linear movement all belong to the prior art. For those skilled in the art, the specific structure can be selected according to actual design needs, and the implementation form of this linear structure will not have a substantial impact on the solution of the present invention and does not belong to the technical solution to be protected by the present invention. Therefore, it will not be elaborated in detail in the present invention.

[0070] In this way, a chip vision component 11 is further provided on the machine body 1. Before attaching the chip to the substrate, the chip is placed on the wafer stage 601, and the chip vision component 11 obtains the position information of the chip and sends it to the controller. The controller controls the wafer stage axial movement component 602 and the wafer stage longitudinal movement component 603 to drive the wafer stage 601 to move according to the chip position, so that the chip to be attached on the wafer stage 601 moves directly above the top pin 701. This method of using the vision component to collect position information and send it to the controller for image processing to obtain the chip position information also belongs to the prior art. Then, the fourth vertical movement component 702 drives the top pin 701 to move upward and jack up the chip. At the same time, the arm rotation power member 801 also drives the chip suction arm 802 to move directly above the top pin 701. At this time, the top pin 701 moves upward to jack up the chip to the surface of the chip suction nozzle head 803 of the chip suction arm 802, and then the chip is sucked by the chip suction nozzle head 803. In this specific embodiment, the chip is sucked by introducing vacuum into the chip suction nozzle head 803. After the chip suction nozzle head 803 sucks the chip, the arm rotation power member 801 drives the chip suction arm 802 to rotate to the adjustment module 10, and the chip suction nozzle head 803 places the chip at the adjustment module 10.

[0071] In this specific embodiment, as shown in Figure 13 and Figure 14 shown, the adjustment module 10 is used to adjust the position of the chip placed by the chip suction nozzle head 803;

[0072] The adjustment module 10 includes a transfer platform 1001 and an adjustment motor 1002. The transfer platform 1001 is used to place the chip. The rotating shaft of the adjustment motor 1002 is connected to the transfer platform 1001, so as to drive the transfer platform 1001 to rotate by the rotation of the adjustment motor 1002, and the rotation of the transfer platform 1001 adjusts the position of the chip. Above the transfer platform 1001, there is also a vision component above the transfer platform, which is used to collect visual images of the chip on the transfer platform 1001 from directly above. Below the transfer platform 1001, there is also a vision component below the transfer platform, which is used to collect visual images of the chip on the transfer platform 1001 from directly below.

[0073] In this way, by setting the vision component above the transfer platform and the vision component below the transfer platform, the vision component above the transfer platform and the vision component below the transfer platform are respectively used to collect visual images of the chip on the transfer platform 1001. The image collected by the vision component below the transfer platform can be further sent to the controller at the back end. By comparing the collected image with the standard image, the position of the chip can be judged. When there is a deviation between the collected image and the standard image, the rotation of the adjustment motor 1002 is controlled to drive the rotation of the transfer platform 1001, and then the position of the chip is adjusted by the rotation of the transfer platform 1001. The image collected by the vision component above the transfer platform can be further sent to the controller at the back end to be used for positioning the position information of the chip suction head 901 to suck the chip. Before the chip is bonded, the chip is first placed on the transfer platform 1001. When the chip has an angular deviation, the angular deviation of the chip is adjusted by the way that the adjustment motor 1002 rotates to drive the transfer platform 1001 to rotate, ensuring the accuracy of the position where the chip is bonded to the substrate.

[0074] In this specific embodiment, as shown in the attached Figure 14As shown in the figure, a chip bonding module 9 is further provided on the machine body 1. The chip bonding module 9 includes a chip bonding head 901, a bonding head axial movement component, and a bonding head vertical movement component. The bonding head axial movement component is used to drive the chip bonding head 901 to move axially, and the bonding head vertical movement component is used to drive the chip bonding head 901 to move vertically. The chip bonding head 901 sucks the chip from the transfer platform 1001 and bonds it to the substrate of the eutectic stage module 5. A bonding head heating rod and a temperature sensor are further provided on the chip bonding head 901. The bonding head heating rod is used to heat the chip bonding head 901, and the temperature sensor is used to detect the temperature of the chip bonding head 901. Among them, the bonding head axial movement component and the bonding head vertical movement component respectively realize the linear movement of the bonding head in the axial direction and the vertical direction. The implementation method of this linear movement can adopt the structural form of a linear motor plus a linear guide rail, or the structural form of a slider plus a guide rail, etc. These structural forms for realizing linear movement all belong to the prior art. For those skilled in the art, they can select the specific structure according to the actual design needs, and the implementation form of this linear structure will not have a substantial impact on the solution of the present invention and does not belong to the technical solution to be protected by the present invention, so it will not be elaborated in detail in the present invention.

[0075] In this way, when performing chip bonding, the bonding head axial movement component and the bonding head vertical movement component drive the chip bonding head 901 to move to the transfer platform 1001. The chip bonding head 901 sucks the chip from the transfer platform 1001. Since the bonding head heating rod and the temperature sensor are provided on the chip bonding head 901, after the chip bonding head 901 sucks the chip, the bonding head heating rod will heat the chip bonding head 901, and at the same time the temperature sensor detects the temperature of the chip bonding head 901, so that the chip bonding head 901 can always maintain the set temperature to heat the chip. Then, the bonding head axial movement component and the bonding head vertical movement component drive the chip bonding head 901 to move to the eutectic bonding hole, and the chip bonding head 901 bonds the chip to the material at the eutectic bonding hole. By heating the chip during the chip movement process, the working efficiency of the eutectic mounter is further improved.

[0076] In addition, in this specific embodiment, a working method of the above-mentioned high-speed eutectic mounter is also provided. The feeding module 3 transports the substrate in the loading cassette 202 to the preheating component 402 of the preheating and cooling module 4. After the preheating component 402 heats the substrate, it transports the substrate to the eutectic stage module 5 for eutectic bonding processing. The substrate after the eutectic bonding processing by the eutectic stage module 5 is transported to the preheating and cooling module 4 for pre-cooling. After the pre-cooling component 403 pre-cools the substrate, the substrate is transported into the unloading cassette 203.

[0077] Next, a further detailed description of the complete working process of the eutectic mounter of the present invention will be given: When the eutectic mounter of the present invention is in use, first, a substrate is placed in the loading box 202 of the loading and unloading module 2. The loading and unloading vertical movement component 201 drives the loading box 202 to move vertically, so that the substrates in the loading slots at different positions in the loading box 202 move to the positions corresponding to the push rod 301. Then, the second longitudinal movement component 302 drives the push rod 301 to move longitudinally. During the longitudinal movement of the push rod 301, it extends into the loading slot of the loading box 202 and abuts against the substrate at the corresponding position, and the substrate at the corresponding position is conveyed to the preheating component 402 through the continuous longitudinal movement of the push rod 301. The substrate is preheated in the preheating component 402 through the installed preheating rod 4023 and under nitrogen protection. The specific preheating process is as follows: First, the first vertical power component 4021 drives the first substrate pressing piece 4026 and the first substrate side baffle 4025 to move upward to the first set position. Then, the substrate in the loading box 202 is conveyed to the first substrate support plate 4024 through the feeding module 3. Then, the first vertical power component 4021 drives the first substrate pressing piece 4026 and the first substrate side baffle 4025 to move downward to the first lower set position. At this time, the first substrate pressing piece 4026 presses the substrate on the first substrate support plate 4024 to ensure the stability of the substrate during the preheating process. The first substrate side baffle 4025 shields the first substrate support plate 4024 from both ends, so that the first substrate support plate 4024, the first substrate side baffle 4025, and the first substrate top air isolation plate 4028 form a relatively closed space during the substrate preheating. The preheating rod 4023 performs preheating treatment on the substrate. At the same time, the chip vision component 11 obtains the position information of the chip on the wafer stage 601 and sends it to the controller. The controller controls the movement of the wafer stage 601 by driving the wafer stage axial movement component 602 and the wafer stage longitudinal movement component 603 according to the chip position, so that the chip to be bonded on the wafer stage 601 moves to directly above the top needle 701. At the same time, the arm rotation power component 801 also drives the chip suction arm 802 to move to directly above the top needle 701. At this time, the top needle 701 moves upward to lift the chip to the surface of the chip suction nozzle head 803 of the chip suction arm 802, and the chip is sucked by introducing vacuum into the chip suction nozzle head 803. After the chip suction nozzle head 803 sucks the chip, the arm rotation power component 801 drives the chip suction arm 802 to rotate to the adjustment module 10, and the chip suction nozzle head 803 places the chip on the transfer platform 1001.The vision component under the transfer platform collects visual images of the chips on the transfer platform 1001. The collected images can be further sent to the controller at the back end. By comparing the collected images with the standard images, the position of the chips can be judged. When there is a deviation between the collected images and the standard images, the rotation of the adjustment motor 1002 is controlled to drive the rotation of the transfer platform 1001, and then the rotation of the transfer platform 1001 is used to adjust the position of the chips to correct the angular deviation of the chips. After the angular deviation of the chips is adjusted, the chip bonding head 901 is driven by the bonding head axial movement component and the bonding head vertical movement component to move to the transfer platform 1001. The vision component on the transfer platform collects the images of the chips on the transfer platform 1001 and further sends them to the controller at the back end for positioning the position information of the chip bonding head 901 to pick up the chips. The chip bonding head 901 picks up the chips from the transfer platform 1001 according to this position information. Since the bonding head heating rod and the temperature sensor are provided on the chip bonding head 901, when the chip bonding head 901 picks up the chips, the bonding head heating rod will heat the chip bonding head 901, and at the same time the temperature sensor detects the temperature of the chip bonding head 901, so that the chip bonding head 901 can always maintain the set temperature to heat the chips. After the preheating component 402 preheats the substrate, the eutectic stage axial movement component 501 drives the eutectic stage component 503 to move axially to the position corresponding to the preheating component 402, and the third vertical power component drives the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move upward to the third set position. Then the kicker arm 405 transports the substrate on the preheating component 402 to the third substrate support plate 5034, and then the third vertical power component drives the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move downward to the third lower set position. At this time, the third substrate pressing piece 5033 presses the substrate on the third substrate support plate 5034 to ensure the stability during the eutectic chip bonding process. At the same time, nitrogen is introduced through the third nitrogen inlet hole at the bonding surface position of the substrate during the eutectic chip bonding process to prevent oxidation. After the substrate is transported, the eutectic stage axial movement component 501 and the eutectic stage longitudinal movement component 502 jointly drive the eutectic stage component 503 to move, so that the materials on the eutectic stage 5031 that need to bond the chips are exposed in the eutectic chip bonding hole. At the same time, the eutectic bonding vision component 12 above the eutectic bonding position determines and records the precise position of the materials in the area where the chips need to be bonded on the substrate. According to the recorded chip position and the position data of the chip bonding area, the chip bonding head 901 accurately bonds the chips to the specific area of the substrate.After the eutectic chip bonding of a material is completed, the eutectic stage axial movement assembly 501 and the eutectic stage longitudinal movement assembly 502 drive the eutectic stage 5031 to move again, so that the next material that needs to bond the chip is exposed at the eutectic chip bonding hole. The chip suction nozzle head 803 continuously sucks the chips from the wafer stage 601 and places them on the transfer platform 1001. The chip bonding head 901 continuously sucks the chips from the transfer platform 1001, thereby completing the eutectic bonding of the chip and the substrate. After the eutectic chip bonding process of all materials on the substrate is completed, the eutectic stage axial movement assembly 501 drives the eutectic stage 5031 to move to the exact rear of the pre-cooling assembly 403. The third vertical power component drives the third substrate pressing piece 5033 and the third substrate side baffle 5032 to move upward to the third upper set position, and then the kicking arm 405 is used to convey the substrate after the eutectic chip bonding to the pre-cooling assembly 403. Here, the pre-cooling assembly 403 is essentially also a heating assembly, but the heating power of the pre-cooling rod here is much smaller than the heating power of the pre-heating rod 4023. This makes the temperature inside the pre-cooling assembly 403 higher than the ambient temperature but lower than the temperature of the substrate after heating, so that the temperature of the substrate can gradually decrease when it enters the pre-cooling assembly 403. When pre-cooling the substrate, first, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move upward to the second upper set position, then the kicking arm 405 conveys the substrate on the eutectic stage module 5 to the second substrate support plate. Then, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move downward to the second lower set position. At this time, the second substrate pressing piece presses the substrate on the second substrate support plate to ensure the stability during the substrate pre-cooling process. The second substrate side baffle shields the second substrate support plate from both ends, so that the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively closed space during the substrate pre-cooling. At this time, the pre-cooling rod pre-cools the substrate, and nitrogen is introduced through the second nitrogen inlet hole to achieve oxidation protection. When the pre-cooling process is completed, the second vertical power component drives the second substrate pressing piece and the second substrate side baffle to move upward to the second upper set position again, and then the kicking arm 405 conveys the substrate into the blanking box 203. Subsequently, the vertical movement assembly 201 in the loading and unloading module 2 adjusts the height of the next substrate, so that the push rod 301 in the feeding module 3 can push the substrate into the pre-heating and cooling module 4. In this way, the eutectic chip bonding of all substrates in the loading box 202 is completed in a cycle.

[0078] Compared with the prior art, in this solution, the substrate is preheated before eutectic soldering to improve the working efficiency of the eutectic soldering machine. At the same time, after the eutectic soldering is completed, the pre-cooling component is used to pre-cool the substrate with the chips attached, thereby reducing the temperature gradient during the cooling process of the high-temperature substrate, reducing the internal stress between the chips and the substrate after cooling, and improving the reliability of the subsequent use of the chips. In addition, protective covers isolated from the outside air are added in the preheating, pre-cooling, and eutectic soldering stages, and nitrogen is only introduced into the bonding surfaces that need to prevent oxidation, reducing the nitrogen consumption and effectively preventing the oxidation of the bonding surfaces. Therefore, the present invention effectively improves the efficiency and reliability of eutectic soldering.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the technical solutions. Those of ordinary skill in the art should understand that any modifications or equivalent replacements made to the technical solutions of the present invention without departing from the purpose and scope of the present technical solution should be covered within the scope of the claims of the present invention.

Claims

1. A high-speed eutectic chip mounter, comprising a machine body, characterized in that, A feeding module, a loading and unloading module, a eutectic stage module and a preheating and cooling module are provided on the machine body; The loading and unloading module includes a loading box and an unloading box; The feeding module is used to convey the substrate in the loading box to the preheating and cooling module; The preheating and cooling module includes a preheating component, a pre-cooling component and a kicking component. The preheating component is used to preheat the substrate conveyed by the feeding module. The kicking component is used to convey the preheated substrate to the eutectic stage module for eutectic chip bonding processing, and convey the substrate after the eutectic chip bonding processing by the eutectic stage module to the preheating and cooling module for pre-cooling. At the same time, after the pre-cooling of the substrate by the pre-cooling component is completed, the substrate is conveyed into the unloading box; The kicking component includes a mounting frame, a kicking arm and a first longitudinal movement component. The mounting frame is connected to the machine body. The fixed part of the first longitudinal movement component is connected to the mounting frame in the longitudinal direction. The moving part of the first longitudinal movement component is connected to the kicking arm, so that the first longitudinal movement component can drive the kicking arm to move longitudinally.

2. The high-speed eutectic die bonder according to claim 1, wherein The preheating and cooling module further includes a first axial movement component arranged along the axis. The fixed part of the first axial movement component is installed on the machine body. The moving part of the first axial movement component is connected to both the preheating component and the pre-cooling component at the same time, so that the moving part of the first axial movement component can drive the preheating component and the pre-cooling component to move axially.

3. The high-speed eutectic chip mounter according to claim 2, wherein, The preheating component includes a preheating mounting seat. The preheating mounting seat is connected to the moving part of the first axial movement component. A preheating rod, a first substrate support plate, a first substrate top air isolation plate and a first vertical movement component are provided on the preheating mounting seat. The first substrate support plate is used to place the substrate. The preheating rod is used to preheat the substrate on the first substrate support plate. The first vertical movement component includes a first vertical power component, a first substrate pressing piece and a first substrate side baffle. The power output end of the first vertical power component is respectively connected to the first substrate pressing piece and the first substrate side baffle through a first connecting plate. The first vertical power component is used to drive the first substrate pressing piece and the first substrate side baffle to move in the vertical direction to a first upper set position and a first lower set position. The first upper set position is the position where the first substrate pressing piece is separated from the substrate on the first substrate support plate. The first lower set position is the position where the first substrate pressing piece is pressed against the substrate on the first substrate support plate. And at the first lower set position, the first substrate support plate, the first substrate side baffle and the first substrate top air isolation plate form a relatively closed space during the preheating of the substrate.

4. The high-speed eutectic chip mounter according to claim 3, characterized in that, The pre-cooling component includes a pre-cooling mounting base, which is connected to the moving part of the first axial movement component. A pre-cooling rod, a second substrate support plate, a second substrate top air isolation plate, and a second vertical movement component are provided on the pre-cooling mounting base. The second substrate support plate is used to place the substrate. The pre-cooling rod is used to pre-cool the substrate on the second substrate support plate. The second vertical movement component includes a second vertical power component, a second substrate pressing piece, and a second substrate side baffle. The power output end of the second vertical power component is respectively connected to the second substrate pressing piece and the second substrate side baffle through a second connecting plate. The second vertical power component is used to drive the second substrate pressing piece and the second substrate side baffle to move in the vertical direction to a second upper set position and a second lower set position. The second upper set position is the position where the second substrate pressing piece is separated from the substrate on the second substrate support plate, and the second lower set position is the position where the second substrate pressing piece presses against the substrate on the second substrate support plate. And when in the second lower set position, the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively enclosed space during the pre-cooling of the substrate.

5. The high-speed eutectic chip mounter according to claim 4, wherein A plurality of first nitrogen inlet holes are provided on both axial sides of the first substrate support plate, and a plurality of second nitrogen inlet holes are provided on both axial sides of the second substrate support plate. The first nitrogen inlet holes and the second nitrogen inlet holes are both used for inputting nitrogen.

6. The high-speed eutectic die bonder according to claim 5, wherein The eutectic stage module includes an eutectic stage component, an eutectic stage axial movement component, and an eutectic stage longitudinal movement component. The eutectic stage axial movement component is used to drive the eutectic stage component to move axially, and the eutectic stage longitudinal movement component is used to drive the eutectic stage component to move longitudinally. The eutectic stage component includes an eutectic stage. A third substrate support plate and a third vertical movement component are provided on the eutectic stage. The third substrate support plate is used to place the substrate. The third vertical movement component includes a third vertical power component, a third substrate pressing piece, and a third substrate side baffle. The power output end of the third vertical power component is respectively connected to the third substrate pressing piece and the third substrate side baffle through a third connecting plate. The third vertical power component is used to drive the third substrate pressing piece and the third substrate side baffle to move in the vertical direction to a third upper set position and a third lower set position. The third upper set position is the position where the third substrate pressing piece is separated from the substrate on the third substrate support plate, and the third lower set position is the position where the third substrate pressing piece presses against the substrate on the third substrate support plate. A eutectic stage top cover is further provided above the third substrate support plate, and an eutectic chip bonding hole is provided on the eutectic stage top cover.

7. The high-speed eutectic chip mounter according to claim 6, characterized in that, A plurality of third nitrogen inlet holes are provided on both axial sides of the third substrate support plate. The third nitrogen inlet holes are used for inputting nitrogen.

8. The high-speed eutectic die bonder according to claim 7, wherein A wafer movement module, a lifting module, and a chip suction module are further provided on the machine body. The wafer motion module includes a wafer stage, a wafer stage axial movement component, and a wafer stage longitudinal movement component. The wafer stage is used to place chips. The wafer stage axial movement component is used to drive the wafer stage to move axially, and the wafer stage longitudinal movement component is used to drive the wafer stage to move longitudinally; The lifting module includes a top needle head and a fourth vertical movement component. The fixed part of the fourth vertical movement component is installed on the machine body in the vertical direction. The moving part of the fourth vertical movement component is connected to the top needle head to drive the top needle head to move in the vertical direction through the moving part of the fourth vertical movement component; The chip suction module includes a chip suction arm and an arm rotation power component. The arm rotation power component is connected to the machine body through a mounting bracket. The power output end of the arm rotation power component is connected to the chip suction arm to drive the chip suction arm to rotate through the arm rotation power component. A chip suction nozzle head is further provided at one end of the chip suction arm away from the arm rotation power component, and the chip suction nozzle head is used to suck chips.

9. The working method of the high-speed eutectic mounter according to claim 1, characterized in that, The feeding module transports the substrate in the loading cassette to the preheating component of the preheating and cooling module. After the preheating component heats the substrate, the substrate is transported to the eutectic stage module for eutectic chip bonding processing. The substrate after the eutectic chip bonding processing by the eutectic stage module is transported to the pre-cooling component of the preheating and cooling module for pre-cooling. After the pre-cooling component completes the pre-cooling of the substrate, the substrate is transported into the unloading cassette.

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