Die bonder with double-layer conveying function

Abstract

The invention relates to the field of die bonders, and discloses a die bonder with a double-layer conveying function, which comprises a die bonder main body, a substrate carrying table, a double-layer conveying mechanism, a wafer disc, a fixed arm, a swing arm, a dynamic counteracting mechanism, an auxiliary stabilizing mechanism and a linear motor, the substrate carrying table, the double-layer conveying mechanism and the linear motor are all arranged on the die bonder main body, and the crystal disc is arranged on the double-layer conveying mechanism; the linear motor sliding table is fixedly connected with the fixed arm through the connecting plate, the fixed arm is rotationally connected with the swing arm, and the dynamic counteracting mechanism is arranged on the swing arm. The swing arm is in transmission fit with a driving part, and when the driving part drives the swing arm to rotate, the acting part of the dynamic counteracting mechanism and the swing arm move oppositely in opposite directions. The dynamic counteracting mechanism is arranged to reduce the inertia influence of the swing arm, the auxiliary stabilizing mechanism restrains the position of the swing arm to improve the crystal taking and fixing precision, oil in the semicircular ring is utilized to conduct heat, the part loss is reduced, and the operation reliability is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonders, and more specifically, it relates to a die bonder with a double-layer conveying function. Background Art

[0002] As a core device in the LED packaging production line, the die bonder undertakes the important task of accurately transferring and installing the LED chips on the wafer to the corresponding installation positions on the LED board (such as MiniLED or MicroLED display panels, etc.). The currently common structure of the die bonder mainly consists of a stage, a wafer tray, and a swing arm. The main function of the stage is to carry the substrate, that is, the LED board on which the LED chips need to be installed. The wafer tray is used to place various wafers, such as wafers containing red LED chips, wafers with green LED chips, and wafers equipped with blue LED chips, etc. The swing arm has the ability to move back and forth between the wafer tray and the stage. When the swing arm moves to the position of the wafer tray, it picks up the wafers from the wafer, and these wafers can be red LED chips, green LED chips, or blue LED chips, etc.; when the swing arm moves to the position of the stage, it accurately transfers and installs the picked-up wafers onto the substrate placed on the stage.

[0003] Currently, the driving method of the swing arm of the die bonder mainly adopts the shaft drive form. Specifically, a driving force is applied to the shaft connected to the end of the swing arm to achieve driving. However, this driving method only provides power at a single point. Given the relatively long length of the swing arm itself, and the pick-up mechanism installed at the end of the swing arm has a certain weight. During the high-speed swinging process, the end of the swing arm is easily affected by inertia and gravity. Conventional driving components such as hydraulic cylinders can accurately control and suppress inertia. However, as the usage time of the hydraulic cylinder increases, there is wear inside it, which easily leads to the situation of unstable hydraulic pressure, resulting in the inability to suppress the inertia of the end of the swing arm, and thus the end of the swing arm shows unstable phenomena during the movement process. Specifically, it is manifested as small displacements of the swing arm in the vertical and horizontal directions. This instability makes it difficult for the swing arm to maintain stability during swinging, which has an adverse impact on the accuracy of picking up the wafers. Summary of the Invention

[0004] The present invention provides a die bonder with a double-layer conveying function, which solves the technical problem that in the related art, small displacements occur in the vertical and horizontal directions of the swing arm, resulting in difficulty in maintaining the stability of the swing arm during swinging and having an adverse impact on the accuracy of picking up the wafers.

[0005] The present invention provides a die bonder with a double-layer conveying function, including: a die bonder main body, a substrate stage, a double-layer conveying mechanism, a wafer tray, a fixed arm, a swing arm, a dynamic cancellation mechanism, an auxiliary stabilization mechanism, and a linear motor; The substrate stage, the double-layer conveying mechanism and the linear motor are all arranged on the die bonder main body, and the wafer tray is arranged on the double-layer conveying mechanism; The linear motor slide is fixedly connected to the fixed arm through a connecting plate. The fixed arm is rotatably connected to the swing arm, and the dynamic cancellation mechanism is arranged on the swing arm; The swing arm is drivingly engaged with a driving member. When the driving member drives the swing arm to perform a rotating action, the acting part of the dynamic cancellation mechanism moves relative to the swing arm in the opposite direction to apply a dynamic inertia moment. During this process, the auxiliary stabilizing mechanism restricts the position of the swing arm in the length and vertical directions.

[0006] As a further optimized solution of the present invention, the double-layer conveying mechanism includes an X module, a support plate, a servo motor, a bidirectional threaded rod and a mounting table. The X module is assembled on the die bonder main body. The support plate is installed at the conveying end of the X module. The servo motor is installed on the support plate, and the driving shaft of the servo motor is axially connected to the bidirectional threaded rod. The mounting table is slidably arranged on the support plate and is threadedly sleeved with the bidirectional threaded rod. The wafer tray is placed on the mounting table.

[0007] As a further optimized solution of the present invention, a guide rail is installed on the support plate, and the slide of the guide rail is fixedly connected to the mounting table.

[0008] As a further optimized solution of the present invention, the dynamic cancellation mechanism includes a mounting plate, a driven bevel gear, a ball screw, a counterweight and a guide plate. The mounting plate is installed on the swing arm and is fixedly connected to the guide plate. The ball screw is rotatably arranged on the mounting plate and is axially connected to the driven bevel gear. The counterweight is fixedly sleeved on the moving table of the ball screw and is in rolling connection with the guide plate.

[0009] As a further optimized solution of the present invention, a rolling member is provided at the bottom of the counterweight, and the rolling member is in rolling connection with the top of the guide plate.

[0010] As a further optimized solution of the present invention, the driving member includes a driving motor, a driving gear, a transmission gear, a transmission bevel gear, a rotating rod, a bottom gear and a synchronous gear. The driving motor is fixedly installed on the connecting plate. The driving shaft of the driving motor extends into the interior of the fixed arm and is fixedly sleeved with the driving gear. The transmission gear is rotatably arranged in the interior of the fixed arm and is mutually driven. One of the transmission gears is drivingly engaged with the driving gear and is axially connected to the synchronous gear through a linkage shaft. The other transmission gear is axially connected to the swing arm. The transmission bevel gear and the bottom gear are both fixedly sleeved on the rotating rod. One end of the rotating rod rotatably extends into the swing arm. The bottom gear is drivingly engaged with the synchronous gear, and the transmission bevel gear is drivingly engaged with the driven bevel gear.

[0011] As a further optimization scheme of the present invention, the auxiliary stabilization mechanism includes a limit frame, a rolling ball and a semicircular ring. The semicircular ring is fixedly connected to the linear motor slide. The limit frame forms an opening on one side and is installed on the swing arm. The rolling ball is rotatably sleeved on one side of the limit frame close to the swing arm and is rollingly connected to the inner circumferential wall of the semicircular ring.

[0012] As a further optimization scheme of the present invention, there is a gap between the top wall and the bottom wall of the limit frame and the semicircular ring, the top wall of the limit frame is inlaid with magnetic block one, the bottom of the limit frame is inlaid with magnetic block two, the interior of the semicircular ring is centrally arranged, and a follower magnetic block is slidably arranged, the follower magnetic block has opposite magnetic properties to magnetic block one, and has the same magnetic properties as magnetic block two.

[0013] As a further optimization solution of the present invention, the interior of the semicircular ring is filled with oil, and the oil submerges the follower magnetic block.

[0014] As a further optimization solution of the present invention, the top and bottom of the semicircular ring are both made of non-metallic materials, and the inner circumference of the semicircular ring is made of metal.

[0015] The beneficial effects of the present invention are: 1. The crystal bonding machine with double-layer conveying function described in the present invention reduces the inertial force generated during the rotation of the swing arm by setting a dynamic compensation mechanism, thereby reducing its inertial influence. At the same time, the auxiliary stabilization mechanism constrains the position of the swing arm in the length and vertical directions to suppress the shaking and deviation of the end of the swing arm, making the swing arm more stable when performing crystal retrieval and crystal bonding operations, greatly improving the accuracy of the operation and ensuring the quality stability of the crystal bonding process.

[0016] 2. The crystal bonding machine with a double-layer conveying function described in the present invention realizes heat dissipation during reciprocating use by setting an auxiliary stabilizing mechanism. The semicircular ring in the auxiliary stabilizing mechanism is filled with oil, and the oil submerges the follower magnet. When the swing arm moves, the ball rolls on the inner wall of the semicircular ring and the follower magnet slides in the semicircular ring, which will generate heat. At this time, the oil can stably conduct the heat and evenly disperse the heat to avoid local overheating, thereby reducing the performance loss and wear of related components caused by high temperature, effectively increasing the stability of the auxiliary stabilizing mechanism itself, and thus ensuring the reliability of the overall operation of the crystal bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a crystal bonding machine with a double-layer conveying function proposed by the present invention.

[0018] Figure 2 The present invention is a schematic structural diagram of a double-layer conveying mechanism in a crystal bonding machine with a double-layer conveying function.

[0019] Figure 3 Schematic diagram of the internal structure of the fixed arm in a die bonder with a double-layer conveying function proposed by the present invention.

[0020] Figure 4 Schematic diagram of the side sectional structure of the fixed arm in a die bonder with a double-layer conveying function proposed by the present invention.

[0021] Figure 5 Schematic diagram of the sectional structure of the semi-circular ring in a die bonder with a double-layer conveying function proposed by the present invention.

[0022] Figure 6 Schematic diagram of the structure of the limit frame in a die bonder with a double-layer conveying function proposed by the present invention.

[0023] In the figure: 1. Die bonder main body; 2. Substrate carrier; 3. Double-layer conveying mechanism; 31. X module; 32. Support plate; 33. Servo motor; 34. Bidirectional threaded rod; 35. Loading platform; 36. Guide rail; 4. Wafer tray; 5. Fixed arm; 6. Swing arm; 7. Dynamic cancellation mechanism; 71. Mounting plate; 72. Driven bevel gear; 73. Ball screw; 74. Counterweight; 75. Guide plate; 8. Auxiliary stabilization mechanism; 81. Limit frame; 82. Ball; 83. Semi-circular ring; 84. Magnet one; 85. Magnet two; 86. Follow-up magnet; 9. Linear motor; 10. Connecting plate; 11. Driving motor; 12. Driving gear; 13. Transmission gear; 14. Transmission bevel gear; 15. Rotating rod; 16. Bottom gear; 17. Synchronization gear. Detailed implementation manners

[0024] Now, the subject matter described herein will be discussed with reference to example embodiments. It should be understood that discussing these embodiments is only to enable those skilled in the art to better understand and thus implement the subject matter described herein. Without departing from the protection scope of the content of this specification, changes can be made to the functions and arrangements of the elements discussed. Each example can omit, substitute, or add various processes or components as needed. Additionally, the features described in some examples can also be combined in other examples.

[0025] like Figures 1 to 3 As shown, a crystal bonding machine with a double-layer conveying function according to an embodiment of the present invention comprises: a crystal bonding machine body 1, a substrate carrier 2, a double-layer conveying mechanism 3, a crystal plate 4, a fixed arm 5, a swing arm 6, a dynamic compensation mechanism 7, an auxiliary stabilization mechanism 8 and a linear motor 9; The substrate carrier 2, the double-layer conveying mechanism 3 and the linear motor 9 are all arranged on the crystal bonding machine body 1, and the crystal plate 4 is arranged on the double-layer conveying mechanism 3; The linear motor 9 slide is fixedly connected to the fixed arm 5 through the connecting plate 10, the fixed arm 5 is rotatably connected to the swing arm 6, and the dynamic compensation mechanism 7 is arranged on the swing arm 6; The swing arm 6 is equipped with a driving member. When the driving member drives the swing arm 6 to rotate, the active part of the dynamic compensation mechanism 7 moves relative to the swing arm 6 in the opposite direction to apply a dynamic inertia moment. During this process, the auxiliary stabilization mechanism 8 limits the length and vertical position of the swing arm 6.

[0026] Due to the coordinated use of the fixed arm 5 and the swing arm 6, the length of the swing arm 6 is shortened compared with the past, reducing the length of the swing arm to pick up the wafer, reducing the length of the swing arm, and reducing deformation during high-speed swinging.

[0027] The substrate carrier 2 is used to carry the substrate on which the chip needs to be installed. The double-layer conveying mechanism 3 can realize the precise conveying of the crystal plate 4 at different positions, and two layers of crystal plates 4 are conveyed from both sides at a time, which is convenient for the swing arm 6 to take the crystal in time to realize double-layer conveying. The linear motor 9 drives the fixed arm 5 to move through the connecting plate 10, and the fixed arm 5 is rotatably connected with the swing arm 6. The dynamic compensation mechanism 7 is installed on the swing arm 6. When the swing arm 6 rotates under the action of the driving member, the active part of the dynamic compensation mechanism 7 and the swing arm 6 produce relative and opposite movement in the direction. This is because the inertia force and gravity generated when the swing arm 6 rotates affect its stability. The dynamic compensation mechanism 7 applies a dynamic inertia torque through this relative movement, and uses the torque balance principle to offset part of the inertia force generated when the swing arm 6 rotates, thereby reducing the shaking of the end of the swing arm 6. The auxiliary stabilization mechanism 8 limits the position of the swing arm 6 from the length and vertical direction, further enhancing the stability of the swing arm 6 during movement.

[0028] like Figure 2 As shown, the double-layer conveying mechanism 3 includes an X-module 31, a support plate 32, a servo motor 33, a bidirectional threaded rod 34 and a loading table 35. The X-module 31 is assembled on the crystal bonding machine body 1, the support plate 32 is installed at the conveying end of the X-module 31, the servo motor 33 is installed on the support plate 32, and the drive shaft of the servo motor 33 is axially connected to the bidirectional threaded rod 34. The loading table 35 is slidably set on the support plate 32 and is threadedly sleeved with the bidirectional threaded rod 34. The crystal plate 4 is placed on the loading table 35.

[0029] It should be noted that the X module 31 is assembled on the die bonder main body 1 and can provide linear motion in the horizontal direction. The support plate 32 is installed at the conveying end of the X module 31 and moves along with the movement of the X module 31. The servo motor 33 is installed on the support plate 32, and its drive shaft is axially connected to the bidirectional threaded rod 34. When the servo motor 33 is started, it will drive the bidirectional threaded rod 34 to rotate. The threads on the bidirectional threaded rod 34 are divided into two sections, and the two sections of threads are symmetrically arranged to be threadedly connected to the two loading platforms 35 respectively. Since the loading platform 35 is threadedly sleeved with the bidirectional threaded rod 34 and is slidably arranged on the support plate 32, according to the principle of screw drive, the rotation of the bidirectional threaded rod 34 will be converted into the linear movement of the loading platform 35 on the support plate 32. In this way, by controlling the forward and reverse rotation and the rotation speed of the servo motor 33, the two loading platforms 35 can be made to approach or move away from each other, so as to realize the primary double-layer conveying of the wafers on the wafer tray 4.

[0030] Furthermore, in order to increase the smoothness of the movement of the loading platform 35, a guide rail 36 is installed on the support plate 32, and the sliding table of the guide rail 36 is fixedly connected to the loading platform 35.

[0031] As Figure 3 shown, the dynamic cancellation mechanism 7 includes a mounting plate 71, a driven bevel gear 72, a ball screw 73, a counterweight 74 and a guide plate 75. The mounting plate 71 is installed on the swing arm 6 and is fixedly connected to the guide plate 75. The ball screw 73 is rotatably arranged on the mounting plate 71 and is axially connected to the driven bevel gear 72. The counterweight 74 is fixedly sleeved on the moving table of the ball screw 73 and is in rolling connection with the guide plate 75.

[0032] When the driving part operates to drive the driven bevel gear 72 to rotate, the ball screw 73 rotates accordingly. Since the counterweight 74 is fixedly sleeved on the moving table of the ball screw 73 and is in rolling connection with the guide plate 75, according to the transmission principle of the ball screw 73, the rotation of the ball screw 73 will drive the counterweight 74 to move linearly along the guide plate 75. In this way, when the swing arm 6 rotates, the counterweight 74 will move relative to the swing arm 6 in the opposite direction, thereby generating a dynamic inertia moment to cancel the inertia force when the swing arm 6 rotates. While the driving part drives the swing arm 6 to rotate, the counterweight 74 moves on the guide plate 75. During the entire process of the rotation of the swing arm 6, the counterweight 74 continuously generates a dynamic moment to cancel the inertia force of the swing arm 6 in real time, effectively enhancing the cancellation effect of the dynamic cancellation mechanism 7 on the inertia force of the swing arm 6, significantly improving the stability of the swing arm 6 during high-speed rotation, and greatly reducing the sway at the end of the swing arm 6, thereby improving the accuracy of crystal picking and die bonding of the die bonder.

[0033] Furthermore, a rolling member (not shown in the figure, the rolling member is a ball or a roller. When a ball is selected, the ball is rotatably sleeved inside the counterweight block 74) is provided at the bottom of the counterweight block 74, and the rolling member is in rolling connection with the top of the guide plate 75, thereby increasing the smoothness of the movement of the counterweight block 74.

[0034] As Figure 3 and Figure 4 shown, the driving member includes a driving motor 11, a driving gear 12, a transmission gear 13, a transmission bevel gear 14, a rotating rod 15, a bottom gear 16 and a synchronous gear 17. The driving motor 11 is fixedly installed on the connecting plate 10. The driving shaft of the driving motor 11 extends into the inside of the fixed arm 5 and is fixedly sleeved with the driving gear 12. The transmission gear 13 is rotatably arranged inside the fixed arm 5 and transmits power to each other. One transmission gear 13 is in transmission cooperation with the driving gear 12 and is axially connected to the synchronous gear 17 through a linkage shaft. The other transmission gear 13 is axially connected to the swing arm 6. The transmission bevel gear 14 and the bottom gear 16 are both fixedly sleeved on the rotating rod 15. One end of the rotating rod 15 rotatably extends into the swing arm 6. The bottom gear 16 is in transmission cooperation with the synchronous gear 17, and the transmission bevel gear 14 is in transmission cooperation with the driven bevel gear 72.

[0035] The driving motor 11 is fixedly installed on the connecting plate 10. After starting, its driving shaft drives the driving gear 12 to rotate. The driving gear 12 transmits power to the transmission gear 13 inside the fixed arm 5. One of the transmission gears 13 cooperates with the driving gear 12 and is axially connected to the synchronous gear 17 through a linkage shaft to transmit power to the synchronous gear 17. The other transmission gear 13 is axially connected to the swing arm 6 to drive the swing arm 6 to rotate. The transmission bevel gear 14 and the bottom gear 16 are fixedly sleeved on the rotating rod 15. The bottom gear 16 is in transmission cooperation with the synchronous gear 17 to transmit the power of the synchronous gear 17 to the rotating rod 15 to make the rotating rod 15 rotate. When the rotating rod 15 rotates, the transmission bevel gear 14 at its end is in transmission cooperation with the driven bevel gear 72 to drive the driven bevel gear 72 to rotate, thereby driving the dynamic cancellation mechanism 7 to work, realizing the rotation of the swing arm 6 by the driving motor 11 and the work of the dynamic cancellation mechanism 7.

[0036] As Figure 3 and Figure 5 shown, the auxiliary stabilizing mechanism 8 includes a limiting frame 81, a rolling ball 82 and a semi-circular ring 83. The semi-circular ring 83 is fixedly connected to the sliding table of the linear motor 9. The limiting frame 81 forms an opening on one side and is installed on the swing arm 6. The rolling ball 82 is rotatably sleeved inside the limiting frame 81 on the side close to the swing arm 6 and is in rolling connection with the inner peripheral wall of the semi-circular ring 83.

[0037] It should be noted that a suction mechanism (not shown in the figure) is provided at the bottom of the limit frame 81. The semi-circular ring 83 is fixedly connected to the slide of the linear motor 9 so that the suction mechanism can move in the vertical direction to suck the wafer. When the linear motor 9 drives the fixed arm 5 to move, the semi-circular ring 83 moves accordingly. A limit frame 81 installed on the swing arm 6 and opening to one side has a rolling ball 82 rotatably sleeved on the inner side close to the swing arm 6. The rolling ball 82 is in rolling connection with the inner peripheral wall of the semi-circular ring 83. During the operation of the die bonder, when the swing arm 6 rotates and moves with the fixed arm 5, the rolling ball 82 always contacts and rolls with the inner wall of the semi-circular ring 83. Through the cooperation of the rolling ball 82 and the semi-circular ring 83, the position of the swing arm 6 in the length direction is restricted, preventing it from overextending. At the same time, to a certain extent, the displacement of the swing arm 6 in the vertical direction is restricted, providing stable support and limit for the swing arm 6, ensuring that the swing arm 6 moves within the specified range, playing a role in stabilizing the swing arm 6, enhancing the restriction and stability of the position of the swing arm 6, reducing the shaking and deviation of the swing arm 6 during movement, improving the precision of crystal picking and die bonding of the die bonder, and ensuring the stable operation of the equipment.

[0038] As Figure 6 shown, there is a gap between the inner top wall and the bottom wall of the limit frame 81 and the semi-circular ring 83. A first magnetic block 84 is embedded in the inner top wall of the limit frame 81, and a second magnetic block 85 is embedded at the inner bottom of the limit frame 81. The inside of the semi-circular ring 83 is centrally arranged and a follower magnetic block 86 is slidably arranged. The follower magnetic block 86 has the opposite magnetic polarity to the first magnetic block 84 and the same magnetic polarity as the second magnetic block 85.

[0039] It should be noted that a first magnetic block 84 is embedded in the inner top wall of the limit frame 81, and a second magnetic block 85 is embedded at the bottom. A follower magnetic block 86 with the opposite magnetic polarity to the first magnetic block 84 and the same magnetic polarity as the second magnetic block 85 is slidably arranged inside the semi-circular ring 83. During the movement of the swing arm 6, as long as there is a displacement trend in the vertical direction, the follower magnetic block 86 will move accordingly under the action of the magnetic field force. For example, when the swing arm 6 deviates upward, the attraction force of the first magnetic block 84 on the follower magnetic block 86 increases, causing the follower magnetic block 86 to move upward, generating a downward restoring force to pull the swing arm 6 back to its original position. On the contrary, when the swing arm 6 deviates downward, the repulsive force of the second magnetic block 85 on the follower magnetic block 86 will make the follower magnetic block 86 move upward, generating an upward restoring force to correct the displacement of the swing arm 6. Through this magnetic interaction, the auxiliary stabilizing mechanism 8 further enhances the stabilizing effect on the swing arm 6 in the vertical direction, can continuously ensure the stability of the swing arm 6, effectively reduce the vertical displacement of the swing arm 6 during movement, and thus improve the precision of crystal picking and die bonding of the die bonder and enhance the working stability of the equipment.

[0040] Furthermore, the inside of the semi-circular ring 83 is filled with hydraulic oil, and the hydraulic oil submerges the follower magnetic block 86.

[0041] The oil plays a role in cooling the semi-circular ring 83, conducts the heat generated by the rolling parts rolling back and forth at the inner circumference of the semi-circular ring 83, reduces the temperature, and increases the stability of the use of the rolling parts and the semi-circular ring 83. The semi-circular ring 83 is filled with oil inside and submerges the follower magnet 86. When the follower magnet 86 slides in the semi-circular ring 83 under the limitation of the limiting frame 81, due to the magnetic action of the magnet one 84 and the magnet two 85 on the follower magnet 86, the follower magnet 86 moves inside the semi-circular ring 83, which can stir the oil and increase the uniformity of the oil temperature, so as to facilitate the conduction of the temperature.

[0042] Both the top and bottom of the semi-circular ring 83 are made of non-metallic materials, and the inner circumference of the semi-circular ring 83 is made of metal.

[0043] During the operation of the die bonder, different material parts of the semi-circular ring 83 perform their respective functions. The non-metallic top and bottom ensure a stable magnetic field environment, and the metal inner circumference provides a good environment for the rolling ball 82 and the follower magnet 86, jointly ensuring the stable function of the auxiliary stabilizing mechanism 8 on the swing arm 6.

[0044] Working principle: Wafer transfer: The X module 31 on the die bonder main body 1 drives the support plate 32 to move horizontally. The servo motor 33 installed on the support plate 32 drives the bidirectional threaded rod 34 to rotate. Since the two symmetric threads at both ends of the bidirectional threaded rod 34 are respectively threadedly sleeved with two loading platforms 35, the loading platforms 35 move linearly on the support plate 32 with the rotation of the bidirectional threaded rod 34 under the assistance of the guide rail 36, realizing the mutual approach or separation of the two loading platforms 35, and then accurately transferring the wafer 4 placed on the loading platform 35 to the appropriate position, completing a double-layer transfer, which is convenient for the picking mechanism at the swing arm 6 to pick up the wafer.

[0045] Swing arm drive and dynamic cancellation: The drive motor 11 is installed on the connecting plate 10. After starting, the drive shaft drives the drive gear 12 to rotate. The drive gear 12 and the transmission gear 13 in the fixed arm 5 are mutually transmitted. One of the transmission gears 13 drives the synchronous gear 17, and the other transmission gear 13 drives the swing arm 6 to rotate. The synchronous gear 17 makes the rotating rod 15 rotate through the bottom gear 16. The transmission bevel gear 14 on the rotating rod 15 drives the driven bevel gear 72, and then makes the ball screw 73 rotate. The counterweight 74 is fixedly sleeved on the moving table of the ball screw 73 and is in rolling connection with the guide plate 75. The rotation of the ball screw 73 drives the counterweight 74 to move linearly along the guide plate 75, so as to generate a relative movement in the opposite direction to the swing arm 6 when the swing arm 6 rotates, generating a dynamic inertial moment to cancel the inertial force when the swing arm 6 rotates, and ensuring the stability of the swing arm 6 during high-speed rotation.

[0046] Auxiliary stability: The slider of the linear motor 9 drives the fixed arm 5 to move through the connecting plate 10, and the swing arm 6 rotationally connected to the fixed arm 5 moves accordingly. The semi-circular ring 83 is fixedly connected to the slider of the linear motor 9. The limiting frame 81 is installed on the swing arm 6. The rolling ball 82 is in rolling connection with the inner peripheral wall of the semi-circular ring 83 within the limiting frame 81, restricting the position of the swing arm 6 in the length direction and preventing excessive extension. When the swing arm 6 has a displacement tendency in the vertical direction, the first magnet 84 and the second magnet 85 in the limiting frame 81 interact with the follower magnet 86 in the semi-circular ring 83. For example, when the swing arm 6 moves upward, the first magnet 84 attracts the follower magnet 86 to move upward, generating a downward restoring force to pull back the swing arm 6; vice versa. The hydraulic fluid in the semi-circular ring 83 can reduce the heat generated by the rolling parts and the semi-circular ring 83, increasing stability. Moreover, the non-metallic top and bottom ensure the stability of the magnetic field, and the metallic inner circumference provides a good environment for the rolling ball 82 and the follower magnet 86.

[0047] Crystal picking and die bonding: In the above stable motion state, the swing arm 6 first moves to the position of the wafer tray 4, picks up the wafer using the picking mechanism at the bottom of the limiting frame 81, and then moves above the substrate stage 2 to install the wafer on the substrate carried on the substrate stage 2, completing the crystal picking and die bonding operations. The die bonding work is carried out in such a cycle.

[0048] The embodiments of the present invention have been described above, but these embodiments are not limited to the above specific implementation manners. The above specific implementation manners are merely illustrative rather than restrictive. Under the inspiration of this embodiment, those of ordinary skill in the art can also make many forms, all of which fall within the protection scope of this embodiment.

Claims

1. A crystal bonding machine with double-layer conveying function, characterized in that: include: A crystal bonding machine body (1), a substrate carrier (2), a double-layer conveying mechanism (3), a crystal plate (4), a fixed arm (5), a swing arm (6), a dynamic compensation mechanism (7), an auxiliary stabilization mechanism (8), and a linear motor (9); The substrate carrier (2), the double-layer conveying mechanism (3) and the linear motor (9) are all arranged on the crystal bonding machine body (1), and the crystal plate (4) is arranged on the double-layer conveying mechanism (3); The linear motor (9) slide is fixedly connected to the fixed arm (5) via a connecting plate (10); the fixed arm (5) is rotatably connected to the swing arm (6); and the dynamic compensation mechanism (7) is arranged on the swing arm (6); The swing arm (6) is coupled to a driving member. When the driving member drives the swing arm (6) to rotate, the active part of the dynamic compensation mechanism (7) moves relative to the swing arm (6) in the opposite direction to exert a dynamic inertia moment. During this process, the auxiliary stabilization mechanism (8) limits the position of the swing arm (6) in length and vertical direction.

2. The die bonding machine with double-layer conveying function according to claim 1, characterized in that: The double-layer conveying mechanism (3) comprises an X-module (31), a support plate (32), a servo motor (33), a bidirectional threaded rod (34) and a loading platform (35); the X-module (31) is mounted on a crystal bonding machine body (1); the support plate (32) is mounted at a conveying end of the X-module (31); the servo motor (33) is mounted on the support plate (32); a drive shaft of the servo motor (33) is axially connected to the bidirectional threaded rod (34); the loading platform (35) is slidably arranged on the support plate (32) and is threadably sleeved with the bidirectional threaded rod (34); and the crystal plate (4) is placed on the loading platform (35).

3. The die bonding machine with double-layer conveying function according to claim 2, characterized in that: A guide rail (36) is mounted on the support plate (32), and a slide table of the guide rail (36) is fixedly connected to the loading platform (35).

4. The die bonding machine with double-layer conveying function according to claim 1, characterized in that: The dynamic compensation mechanism (7) comprises a mounting plate (71), a driven bevel gear (72), a ball screw (73), a counterweight (74) and a guide plate (75); the mounting plate (71) is mounted on the swing arm (6) and fixedly connected to the guide plate (75); the ball screw (73) is rotatably mounted on the mounting plate (71) and axially connected to the driven bevel gear (72); the counterweight (74) is fixedly sleeved on the moving platform of the ball screw (73) and rollingly connected to the guide plate (75).

5. The die bonding machine with double-layer conveying function according to claim 4, characterized in that: A rolling element is provided at the bottom of the counterweight block (74), and the rolling element is rollingly connected to the top of the guide plate (75).

6. The die bonding machine with double-layer conveying function according to claim 1, characterized in that: The driving member comprises a driving motor (11), a driving gear (12), a transmission gear (13), a transmission bevel gear (14), a rotating rod (15), a bottom gear (16) and a synchronous gear (17); the driving motor (11) is fixedly mounted on the connecting plate (10); a driving shaft of the driving motor (11) extends into the interior of the fixed arm (5) and is fixedly sleeved with the driving gear (12); the transmission gear (13) is rotatably arranged inside the fixed arm (5) and transmits power to each other; a transmission gear (13) is provided in a rotating manner inside the fixed arm (5) and transmits power to each other; The movable gear (13) is in transmission cooperation with the driving gear (12) and is axially connected to the synchronous gear (17) through a linkage shaft. Another of the transmission gears (13) is axially connected to the swing arm (6). The transmission bevel gear (14) and the bottom gear (16) are both fixedly mounted on the rotating rod (15). One end of the rotating rod (15) is rotated to extend into the swing arm (6). The bottom gear (16) is in transmission cooperation with the synchronous gear (17). The transmission bevel gear (14) is in transmission cooperation with the driven bevel gear (72).

7. The die bonding machine with double-layer conveying function according to claim 6, characterized in that: The auxiliary stabilizing mechanism (8) comprises a limit frame (81), a rolling ball (82) and a semicircular ring (83); the semicircular ring (83) is fixedly connected to a slide table of a linear motor (9); the limit frame (81) is opened on one side and is mounted on a swing arm (6); the rolling ball (82) is rotatably sleeved on a side of the limit frame (81) close to the swing arm (6) and is rollingly connected to an inner peripheral wall of the semicircular ring (83).

8. The die bonding machine with double-layer conveying function according to claim 7, characterized in that: There is a gap between the top wall and the bottom wall of the limit frame (81) and the semicircular ring (83); a first magnetic block (84) is embedded in the top wall of the limit frame (81); a second magnetic block (85) is embedded in the bottom of the limit frame (81); a follower magnetic block (86) is slidably arranged in the middle of the semicircular ring (83); the follower magnetic block (86) has opposite magnetic properties to the first magnetic block (84) and the same magnetic properties as the second magnetic block (85).

9. The die bonding machine with double-layer conveying function according to claim 8, characterized in that: The interior of the semicircular ring (83) is filled with oil, and the oil submerges the follower magnetic block (86).

10. The die bonding machine with double-layer conveying function according to claim 9, characterized in that: The top and bottom of the semicircular ring (83) are both made of non-metallic materials, and the inner circumference of the semicircular ring (83) is made of metal.

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