Temperature-sensing heat dissipation circuit board and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a temperature-sensing heat-dissipation circuit board, and the method comprises the steps: providing a temperature control assembly which comprises a cold end and a hot end connected with the cold end; the cold end is connected with a to-be-cooled assembly, the to-be-cooled assembly is used for generating heat and conducting the heat to the cold end, and the temperature control assembly is used for transferring the heat of the cold end to the hot end; and the hot end is connected with a temperature sensing assembly, and the temperature sensing assembly is used for visualizing the magnitude of the heat. The temperature-sensing heat dissipation circuit board provided by the invention has the advantages of efficient heat dissipation and visualization. In addition, the invention also provides a temperature-sensing heat dissipation circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board heat dissipation, and particularly to a temperature-sensitive heat dissipation circuit board and a manufacturing method thereof. Background Art

[0002] In the design and manufacturing process of electronic devices, especially in the application of printed circuit boards (PCBs), heat dissipation management is a key issue. For the heat-generating devices on the PCB, traditional heat dissipation solutions include using heat sinks, heat pipes, and heat sinks with fans. For cases with a large number of devices, customized large heat shields or heat plates are used for heat dissipation. In addition, to compensate for the uneven heat dissipation caused by inconsistent soldering heights, thermal silicone pads are usually attached to the surface of the components.

[0003] However, in the case of a large number of heat-generating devices, the above methods are often difficult to meet the requirements of modern electronic products for thinness, lightness, and efficient heat dissipation. In addition, these traditional methods lack real-time temperature monitoring and intuitive feedback mechanisms, which limit the effective control of the internal thermal environment of the circuit board. Summary of the Invention

[0004] In view of this, this application proposes a manufacturing method of a temperature-sensitive heat dissipation circuit board to solve the above problems.

[0005] In addition, this application also provides a temperature-sensitive heat dissipation circuit board.

[0006] A manufacturing method of a temperature-sensitive heat dissipation circuit board includes the steps of:

[0007] Providing a temperature control component, the temperature control component includes a cold end and a hot end connected to the cold end.

[0008] Connecting the component to be cooled to the cold end, the component to be cooled is used to generate heat and conduct the heat to the cold end, and the temperature control component is used to transfer the heat of the cold end to the hot end.

[0009] Connecting a temperature sensing component to the hot end, the temperature sensing component is used to visualize the magnitude of the heat.

[0010] In some possible embodiments, the temperature control component further includes a heat conduction groove provided at the cold end, the component to be cooled includes a plurality of heat generating elements, and the step of "connecting the component to be cooled to the cold end" includes:

[0011] Placing a plurality of the heat generating elements in the heat conduction groove,

[0012] Then, a heat conductor is provided in the gap between the heat generating element and the heat conduction groove.

[0013] In some possible embodiments, the temperature control component is a Peltier cooler, and the manufacturing method of the temperature control component includes the following steps: providing a first circuit substrate, the first circuit substrate including a first insulating layer and a first circuit layer arranged on the first insulating layer, the first circuit layer including a plurality of first connection pads arranged at intervals. Alternatingly arranging a plurality of N-type semiconductors and a plurality of P-type semiconductors on the first circuit layer, wherein one N-type semiconductor and one P-type semiconductor are arranged on each of the first connection pads. Arranging a first heat-insulating layer on the first insulating layer, the first heat-insulating layer covers the first circuit layer and wraps the plurality of N-type semiconductors and the plurality of P-type semiconductors, and the end faces of the plurality of N-type semiconductors and the plurality of P-type semiconductors are exposed on the outer surface of the heat-insulating layer. Arranging a second circuit layer on the first heat-insulating layer, the second circuit layer including a plurality of second connection pads arranged at intervals, each of the second connection pads connecting the N-type semiconductors and the P-type semiconductors arranged at intervals, and the plurality of the first connection pads and the plurality of the second connection pads connect the plurality of the N-type semiconductors and the plurality of the P-type semiconductors in series. Arranging the heat-conducting groove on the second circuit layer, the temperature control component is obtained.

[0014] In some possible embodiments, the step of “connecting a temperature sensing component to the hot end” includes: arranging the temperature sensing component on a side of the first insulating layer away from the first thermal insulation layer, the temperature sensing component including a thermochromic material.

[0015] In some possible embodiments, the manufacturing method of the heat dissipation component includes the steps of: providing a second circuit substrate, the second circuit substrate including a second insulating layer and a third circuit layer disposed on the second insulating layer; and disposing a plurality of the heating elements on the third circuit layer to obtain the heat dissipation component.

[0016] In some possible embodiments, the step of "connecting the component to be cooled at the cold end" further includes: setting an adhesive layer between the component to be cooled and the temperature control component, the adhesive layer being provided with an opening, and the heat conductive groove passing through the opening.

[0017] In some possible embodiments, the heat dissipation component includes an outlet pad, and the temperature control component includes an inlet pad, and the manufacturing method further includes the steps of: setting an opening through the heat dissipation component and the adhesive layer, and partially exposing the inlet pad at the bottom of the opening. Setting a conductive body in the opening, and connecting the inlet pad and the outlet pad.

[0018] In some possible embodiments, the steps are further included:

[0019] A protective film is disposed on a side of the front heat dissipation component away from the adhesive layer.

[0020] A temperature-sensitive heat dissipation circuit board includes a temperature control component, a component to be cooled, and a temperature sensing component. The temperature control component includes a cold end and a hot end connected to the cold end. The component to be cooled is connected to the cold end, and the component to be cooled is used to generate heat and conduct it to the cold end. The temperature control component is used to transfer the heat of the cold end to the hot end. The temperature sensing component is connected to the hot end, and the temperature sensing component is used to visualize the magnitude of the heat.

[0021] In some possible embodiments, the temperature control component includes a heat insulation layer, a plurality of cold end connection pads, a plurality of hot end connection pads, a plurality of P-type semiconductors, and a plurality of N-type semiconductors. The plurality of cold end connection pads are arranged at intervals on one side of the heat insulation layer facing the component to be cooled, the plurality of hot end connection pads are arranged on the other side of the heat insulation layer facing away from the heat dissipation component, the plurality of P-type semiconductors and the plurality of N-type semiconductors are alternately arranged on the heat insulation layer, and the plurality of hot end connection pads and the plurality of cold end connection pads sequentially connect in series the plurality of P-type semiconductors and the plurality of N-type semiconductors.

[0022] Compared with the prior art, the manufacturing method of the temperature-sensitive heat dissipation circuit board provided in this application connects the temperature control component to one side of the component to be cooled and arranges the temperature sensing component on one side of the temperature control component. The temperature control component can absorb heat from the component to be cooled, achieve rapid and effective heat transfer to reduce the temperature of the component to be cooled, thereby improving the stability and lifespan of the electronic device. At the same time, the temperature sensing component can intuitively reflect the temperature of the temperature control component through color change, providing real-time temperature monitoring for users. Moreover, compared with traditional large radiators or heat pipes, the integrated design of the temperature control component and the temperature sensing component greatly reduces the space occupation, making the temperature-sensitive heat dissipation circuit board more compact and providing greater flexibility for the design of thin and light electronic products. Description of the Drawings

[0023] Figure 1 It is a cross-sectional schematic diagram of a first substrate provided in an embodiment of this application.

[0024] Figure 2 For etching Figure 1 It is a cross-sectional schematic diagram of a first circuit layer formed after etching the first copper foil layer of the first substrate shown in the figure.

[0025] Figure 3 For Figure 2 It is a cross-sectional schematic diagram of the first circuit layer shown in the figure after setting a thermoelectric body.

[0026] Figure 4 For Figure 3 It is a cross-sectional schematic diagram of the first insulating layer shown in the figure after setting a first heat insulation layer.

[0027] Figure 5 For Figure 4Cross-sectional schematic diagram of the first heat insulation layer after the second circuit layer is provided.

[0028] Figure 6 For Figure 5 Cross-sectional schematic diagram of the temperature control component formed after the heat conduction groove is provided in the second circuit layer shown.

[0029] Figure 7 Cross-sectional schematic diagram of the second substrate provided in an embodiment of the present application.

[0030] Figure 8 For Figure 7 Cross-sectional schematic diagram of the second substrate shown after multiple slots are provided.

[0031] Figure 9 For Figure 8 Cross-sectional schematic diagram of the second slot shown after the second conductor is provided in it.

[0032] Figure 10 For etching Figure 9 Cross-sectional schematic diagram after the third copper foil layer shown is etched to form the third circuit layer.

[0033] Figure 11 For Figure 10 Cross-sectional schematic diagram of the heat dissipation component to be formed after the heating element is provided in the third circuit layer shown.

[0034] Figure 12 For laminating Figure 11 The heat dissipation component to be shown, Figure 6 Cross-sectional schematic diagram of the first intermediate formed after the temperature control component shown and the adhesive layer are laminated.

[0035] Figure 13 For Figure 12 Cross-sectional schematic diagram of the first intermediate shown after the second opening is provided.

[0036] Figure 14 For Figure 13 Cross-sectional schematic diagram of the second opening shown after the third conductor is provided in it.

[0037] Figure 15 For Figure 14 Cross-sectional schematic diagram of the temperature sensing and heat dissipation circuit board formed after the temperature sensing component is provided in the temperature control component shown.

[0038] Main component symbol description

[0039] Temperature sensing and heat dissipation circuit board 100

[0040] Temperature control component 10

[0041] Cold end 11

[0042] Hot end 12

[0043] The first substrate 20

[0044] The first insulating layer 21

[0045] The first copper foil layer 22

[0046] The first circuit layer 23

[0047] The hot-end connection pad 231

[0048] The N-type semiconductor 24

[0049] The P-type semiconductor 25

[0050] The heat insulation layer 26

[0051] The first circuit board 261

[0052] The second circuit layer 27

[0053] The cold-end connection pad 271

[0054] The first connection pad 272

[0055] The second connection pad 273

[0056] The heat conduction tank 30

[0057] The bottom plate 31

[0058] The side plate 32

[0059] The accommodating space 33

[0060] The component to be heat-dissipated 40

[0061] The second substrate 41

[0062] The second insulating layer 411

[0063] The second copper foil layer 412

[0064] The third copper foil layer 413

[0065] The slot 414

[0066] The electroplated layer 42

[0067] The first conductor 421

[0068] The third circuit layer 43

[0069] The third connection pad 431

[0070] The fourth circuit layer 44

[0071] The fourth connection pad 441

[0072] Fifth connection pad 442

[0073] Sixth connection pad 443

[0074] Second circuit board 445

[0075] Heating element 45

[0076] Adhesive layer 50

[0077] First intermediate 51

[0078] First opening 511

[0079] Heat conductor 52

[0080] Second opening 53

[0081] Third opening 54

[0082] Second conductor 55

[0083] Third conductor 56

[0084] First protective film 60

[0085] Second adhesive layer 61

[0086] Protective layer 62

[0087] Temperature sensing component 70

[0088] Third adhesive layer 71

[0089] Temperature sensing layer 72

[0090] The following specific embodiments will further illustrate the present application in conjunction with the above drawings. Specific embodiments

[0091] To make the above objects, features, and advantages of the present application more apparent and understandable, the following detailed description will be given to the specific embodiments of the present application in conjunction with the drawings.

[0092] In the following description, many specific details are set forth in order to fully understand the present application. However, the present application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar applications without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0093] Secondly, the present application will be described in detail in conjunction with the schematic diagrams. When describing the embodiments of the present application in detail, for the convenience of explanation, the cross-sectional views showing the device structure will be enlarged locally out of the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application herein. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0094] The following will be described in detail by way of embodiments.

[0095] Please refer to Figures 1 to 15 , an embodiment of the present application provides a method for manufacturing a temperature-sensitive heat dissipation circuit board 100, including the steps of:

[0096] S1: Please refer to Figures 1 to 6 , fabricate a temperature control component 10. The temperature control component 10 is a Peltier Cooler, and the temperature control component 10 includes a cold end 11 and a hot end 12 connected to the cold end 11. The temperature control component 10 can transfer the heat of the cold end 11 to the hot end 12. In other embodiments of the present application, the temperature control component 10 may also be a thermoelectric coupler, a solid-state cooler, a heat pipe, etc.

[0097] In this embodiment, the manufacturing method of the temperature control component 10 includes the steps of:

[0098] S11: Please refer to Figure 1 , provide a first substrate 20, the first substrate 20 includes a first insulating layer 21 and a first copper foil layer 22 disposed on one side of the first insulating layer 21. Wherein, the first substrate 20 is a ceramic substrate, so that the first substrate 20 has high heat resistance and heat dissipation ability.

[0099] S12: Please refer to Figure 2 , etch the first copper foil layer 22 to form a first circuit layer 23, the first circuit layer 23 includes a plurality of hot end connection pads 231, and the plurality of hot end connection pads 231 are spaced apart on the first insulating layer 21. Specifically, the first circuit layer 23 is formed through steps such as dry film, exposure and development, and etching.

[0100] S13: Please refer to Figure 3 , dispose thermoelectric bodies on the first circuit layer 23, the thermoelectric bodies include a plurality of N-type semiconductors 24 and a plurality of P-type semiconductors 25. The plurality of N-type semiconductors 24 and the plurality of P-type semiconductors 25 are alternately and spaced apart on the first circuit layer 23. Each of the hot end connection pads 231 is spaced apart from one of the N-type semiconductors 24 and one of the P-type semiconductors 25. Specifically, the plurality of N-type semiconductors 24 and the plurality of P-type semiconductors 25 are disposed on the first circuit layer 23 by means of printing and soldering.

[0101] S14: Please refer to Figure 4, a heat insulation layer 26 is provided on the first insulation layer 21. The heat insulation layer 26 covers the first circuit layer 23 to obtain a first circuit substrate 261. Part of the heat insulation layer 26 is filled into the wire grooves of the first circuit layer 23 and connected to the first insulation layer 21. In addition, the heat insulation layer 26 wraps the thermoelectric body. The end faces of the N-type semiconductor 24 and the P-type semiconductor 25 are exposed from the heat insulation layer 26.

[0102] In this embodiment, the material of the heat insulation layer 26 includes one of porous materials or heat-reflective materials. The porous material uses the pores contained in the material itself for heat insulation because the thermal conductivity of the air or inert gas in the pores is very low, such as foam materials, fiber materials, etc. The heat-reflective material has a very high reflection coefficient and can reflect heat, such as gold, silver, nickel, aluminum foil, or polyester or polyimide films plated with metal.

[0103] S15: Please refer to Figure 5 , a second circuit layer 27 is provided on the heat insulation layer 26. The second circuit layer 27 includes a plurality of cold-end connection pads 271. The plurality of cold-end connection pads 271 are spaced apart on the first insulation layer 21. Each cold-end connection pad 271 is disposed approximately between two adjacent hot-end connection pads 231 and connects the adjacent N-type semiconductor 24 and P-type semiconductor 25. In this way, the plurality of cold-end connection pads 271 and the plurality of hot-end connection pads 231 connect the plurality of N-type semiconductors 24 and the plurality of P-type semiconductors 25 in series. Among them, the plurality of cold-end connection pads 271 connecting the N-type semiconductor 24 and the plurality of P-type semiconductors 25 constitute the cold end 11. The plurality of hot-end connection pads 231 connecting the N-type semiconductor 24 and the plurality of P-type semiconductors 25 constitute the hot end 12.

[0104] In this embodiment, the second circuit layer 27 further includes a first connection pad 272 and a second connection pad 273. The first connection pad 272 and the second connection pad 273 are respectively disposed on opposite sides of the plurality of cold-end connection pads 271. The first connection pad 272 connects the leftmost P-type semiconductor. The second connection pad 273 connects the rightmost N-type semiconductor.

[0105] S16: Please refer to Figure 6 , a heat conduction groove body 30 is provided on the second circuit layer 27 to obtain the temperature control component 10. The heat conduction groove body 30 includes a bottom plate 31 and a plurality of side plates 32. The plurality of side plates 32 surround the periphery of the bottom plate 31 to form an accommodation space 33. The bottom plate 31 is disposed corresponding to the plurality of cold-end connection pads 271. That is, the bottom plate 31 connects the cold end 11. Among them, the heat conduction groove body 30 is made of ceramic material.

[0106] During specific use, the temperature control component 10 is connected to an external power supply to form a current loop. When current passes through different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release phenomena will occur at the joints of different conductors respectively with the change of the current direction.

[0107] Among them, the N-type semiconductor 24 has surplus electrons and a negative thermoelectric potential. The P-type semiconductor 25 lacks electrons and has a positive thermoelectric potential. When electrons pass from the P-type semiconductor 25 through the cold-end connection pad 271 to the N-type semiconductor 24, the temperature of the cold-end connection pad 271 drops. On the contrary, when electrons pass from the N-type semiconductor 24 to the P-type semiconductor 25, the temperature of the hot-end connection pad 231 will rise. At the same time, the value of the temperature rise of the hot-end connection pad 231 is approximately the same as the value of the temperature drop of the cold-end connection pad 271.

[0108] S2: Please refer to Figures 7 to 11 , fabricate a component to be cooled 40, and the component to be cooled 40 includes a plurality of heating elements 45. The plurality of heating elements 45 are used to implement specific functions and generate heat. The accumulated heat causes the temperature to rise, resulting in the heating elements 45 being unable to implement specific functions. Specifically, the heating elements 45 include passive components, such as resistors, capacitors, inductors, or passive components, such as chips, etc. The heating elements 45 can be used to implement functions such as switching, display, and operation.

[0109] In this embodiment, the manufacturing method of the component to be cooled 40 includes the steps of:

[0110] S21: Please refer to Figure 7, a second substrate 41 is provided, and the second substrate 41 is a double-sided copper-clad substrate. The second substrate 41 includes a second insulating layer 411, a second copper foil layer 412, and a third copper foil layer 413. The second copper foil layer 412 and the third copper foil layer 413 are respectively disposed on opposite side surfaces of the second insulating layer 411. Among them, the second substrate 41 is made of polyimide. In other embodiments of the present application, the material of the second insulating layer 411 includes, but is not limited to, at least one of liquid crystal polymer (LCP), phenolic epoxy resin (EP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

[0111] S22: Please refer to Figure 8 , a plurality of slots 414 are provided on one side of the second substrate 41. The plurality of slots 414 are spaced apart. The slots 414 penetrate through the third copper foil layer 413 and the second insulating layer 411. Part of the second copper foil layer 412 is exposed at the bottom of the slots 414. Among them, the plurality of slots 414 are formed by laser drilling. In other embodiments of the present application, the plurality of slots 414 can be formed by machine drilling, chemical etching, etc.

[0112] S23: Please refer to Figure 9 , an electroplated layer 42 is provided on the third copper foil layer 413, and part of the electroplated layer 42 fills the plurality of slots 414, thereby forming a plurality of first conductors 421. The first conductors 421 connect the second copper foil layer 412 and the third copper foil layer 413.

[0113] S24: Please refer to Figure 10, etch the second copper foil layer 412 to form a third circuit layer 43, and etch the third copper foil layer 413 and the electroplated layer 42 to form a fourth circuit layer 44, obtaining a second circuit substrate 445. The first conductor 421 connects the third circuit layer 43 and the fourth circuit layer 44. Specifically, the third circuit layer 43 includes a plurality of third connection pads 431, and the plurality of third connection pads 431 are spaced apart on one side of the second insulating layer 411. The fourth circuit layer 44 includes a plurality of fourth connection pads 441, a fifth connection pad 442, and a sixth connection pad 443. The plurality of fourth connection pads 441 are spaced apart on the other side of the second insulating layer 411. The third connection pads 431 are arranged corresponding to the fourth connection pads 441. The first conductor 421 is disposed between the oppositely arranged third connection pads 431 and fourth connection pads 441. The fifth connection pad 442 is disposed on one side of the plurality of fourth connection pads 441, and the sixth connection pad 443 is disposed on the other side of the plurality of fourth connection pads 441.

[0114] S25: Please refer to Figure 11 , dispose a plurality of the heating elements 45 on the third connection pads 431, obtaining the component to be heat-dissipated 40. Specifically, each of the heating elements 45 is connected to two adjacent third connection pads 431, and the heating element 45 is connected to the third connection pad 431 by means of reflow soldering.

[0115] S3: Please refer to Figure 12 , bond the temperature control component 10, the component to be heat-dissipated 40, and a first adhesive layer 50, obtaining a first intermediate 51. Wherein, the temperature control component 10 and the component to be heat-dissipated 40 are respectively disposed on opposite sides of the first adhesive layer 50. The first adhesive layer 50 is provided with a first opening 511 therethrough. The plurality of heating elements 45 are located in the accommodating space 33 of the heat conducting groove body 30, and a plurality of side plates 32 of the heat conducting groove body 30 pass through the first opening 511 and are connected to the second insulating layer 411 of the component to be heat-dissipated 40, thereby enclosing the accommodating space 33.

[0116] In this embodiment, in step S3, before enclosing the accommodating space 33, it further includes: injecting a heat conducting body 52 into the accommodating space 33. After enclosing the accommodating space 33, the heat conducting body 52 fills the entire accommodating space 33, so that the heat generated by the heating element 45 is conducted to the bottom plate 31 of the heat conducting groove body 30 more efficiently. Wherein, the heat conducting body 52 is heat conducting silica gel.

[0117] In this embodiment, the bottom plate 31 is provided corresponding to a plurality of the cold-end connection pads 271. The first connection pad 272 is provided corresponding to the fifth connection pad 442, and the second connection pad 273 is provided corresponding to the sixth connection pad 443.

[0118] S4: Please refer to Figure 13 , a second opening 53 and a third opening 54 are provided in the first intermediate body 51. The second opening 53 penetrates through the fifth connection pad 442, the second insulating layer 411, and the first adhesive layer 50, such that a part of the first connection pad 272 is exposed at the bottom of the second opening 53. The third opening 54 penetrates through the sixth connection pad 443, the second insulating layer 411, and the first adhesive layer 50, such that a part of the second connection pad 273 is exposed at the bottom of the third opening 54. Specifically, both the second opening 53 and the third opening 54 are formed by laser drilling. In other embodiments of the present application, the second opening 53 and the third opening 54 may be formed by machine drilling, etching drilling, etc.

[0119] S5: Please refer to Figure 14 , a second conductor 55 is provided in the second opening 53, and a third conductor 56 is provided in the third opening 54. The second conductor 55 connects the first connection pad 272 and the fifth connection pad 442, and the third conductor 56 connects the second connection pad 273 and the sixth connection pad 443. In this way, a plurality of the series-connected cold-end connection pads 271, a plurality of hot-end connection pads 231, and the thermoelectric body can be led out by the fifth connection pad 442 and the sixth connection pad 443. Among them, the fifth connection pad 442 is used to connect the positive pole of the power supply, and the sixth connection pad 443 is used to connect the negative pole of the power supply.

[0120] S6: Please refer to Figure 15 , a first protective film 60 is provided on the fourth circuit layer 44, and a temperature control component 10 is provided on the side of the first insulating layer 21 away from the hot-end connection pad 231, to obtain the temperature-sensing and heat-dissipating circuit board 100. The temperature control component 10 is used to visualize the magnitude of the heat of the hot end 12.

[0121] Among them, the first protective film 60 includes a second adhesive layer 61 and a protective layer 62. The second adhesive layer 61 is provided between the protective layer 62 and the fourth circuit layer 44. The protective layer 62 includes a polyimide material with high heat resistance and high insulation performance. This material can not only effectively protect the circuit board from physical damage, but also prevent electromagnetic interference, ensuring the stability and long-term reliability of the circuit board.

[0122] The temperature control component 10 includes a third adhesive layer 71 and a temperature sensing layer 72. The third adhesive layer 71 is disposed between the temperature sensing layer 72 and the first insulating layer 21. Specifically, the third adhesive layer 71 is made of a transparent adhesive material, such as epoxy resin. The temperature sensing layer 72 includes one of liquid crystal thermochromic materials, organic thermochromic pigments, thermosensitive inks, thermosensitive microcapsule pigments, and thermosensitive polymers. Preferably, the temperature sensing layer 72 includes an organic thermochromic pigment, such as thermochromic polypropylene. The organic thermochromic pigment is colored at a low temperature, and when the temperature rises to a specific threshold, the material changes from colored to colorless.

[0123] Compared with the prior art, the manufacturing method of the temperature sensing and heat dissipation circuit board 100 provided by this application has the following advantages:

[0124] 1. By connecting the temperature control component 10 to one side of the component to be cooled 40 and arranging a temperature sensing component 70 on one side of the temperature control component 10. The temperature control component 10 can absorb heat from the component to be cooled 40, achieve rapid and effective heat transfer to reduce the temperature of the component to be cooled 40, thereby improving the stability and lifespan of the electronic device. At the same time, the temperature sensing component 70 can visually reflect the temperature of the temperature control component 10 through color change, providing real-time temperature monitoring for users. In addition, the integrated design of the temperature control component 10 and the temperature sensing component 70 greatly reduces space occupancy, making the temperature sensing and heat dissipation circuit board 100 more compact and providing greater flexibility for the design of thin and light electronic products.

[0125] 2. Relying on the Peltier effect, the temperatures of the cold end 11 and the hot end 12 are in a linear proportional relationship, enabling the temperature conditions of the multiple heating elements 45 thermally connected to the cold end 11 to be visually judged by observing the color change of the temperature sensing component 70, thereby achieving accurate temperature monitoring.

[0126] 3. By accommodating the multiple heating elements 45 in the heat conduction groove body 30, it is not only beneficial to improve the relative centralization of component packaging and space utilization rate, but also beneficial to centralized heat management and improve the heat dissipation efficiency of the heat conduction groove body 30 at the cold end 11.

[0127] In addition, the present application also provides a temperature-sensing heat dissipation circuit board 100, which includes a temperature control component 10, a component to be dissipated 40, and a temperature sensing component 70. The temperature control component 10 includes a cold end 11 and a hot end 12 connected to the cold end 11. The component to be dissipated 40 is connected to the cold end 11, and the component to be dissipated 40 is used to generate heat and conduct it to the cold end 11. The temperature control component 10 is used to transfer the heat of the cold end 11 to the hot end 12. The temperature sensing component 70 is connected to the hot end 12, and the temperature sensing component 70 is used to visualize the size of the heat.

[0128] In this embodiment, the temperature control component 10 includes a heat insulation layer 26, a plurality of cold end connection pads 271, a plurality of hot end connection pads 231, a plurality of P-type semiconductors 25, and a plurality of N-type semiconductors 24. The plurality of cold end connection pads 271 are arranged at intervals on one side of the heat insulation layer 26 facing the component to be cooled 40, and the plurality of hot end connection pads 231 are arranged on the other side of the heat insulation layer 26 away from the component to be cooled 40. The plurality of P-type semiconductors 25 and the plurality of N-type semiconductors 24 are alternately arranged in the heat insulation layer 26. The plurality of hot end connection pads 231 and the plurality of cold end connection pads 271 are connected in series with the plurality of P-type semiconductors 25 and the plurality of N-type semiconductors 24 in sequence.

[0129] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a temperature-sensing and heat-dissipating circuit board, It is characterized in that Includes steps: Providing a temperature control component, the temperature control component comprising a cold end and a hot end connected to the cold end; The cold end is connected with a heat dissipation component, the heat dissipation component is used to generate heat and conduct it to the cold end, and the temperature control component is used to transfer the heat of the cold end to the hot end; A temperature sensing component is connected to the hot end, and the temperature sensing component is used to visualize the size of the heat.

2. The manufacturing method according to claim 1, It is characterized in that The temperature control component also includes a heat conduction groove arranged at the cold end, the heat dissipation component includes a plurality of heating elements, and the step of "connecting the heat dissipation component to the cold end" includes: Placing a plurality of the heating elements in the heat conducting groove, Therefore, a heat conductor is arranged in the gap between the heating element and the heat conducting groove.

3. The manufacturing method according to claim 2, It is characterized in that The temperature control component is a Peltier cooler, and the manufacturing method of the temperature control component comprises the steps of: Provide a first circuit substrate, the first circuit substrate comprising a first insulating layer and a first circuit layer arranged on the first insulating layer, the first circuit layer comprising a plurality of first connection pads arranged at intervals; A plurality of N-type semiconductors and a plurality of P-type semiconductors are alternately disposed on the first circuit layer, wherein each of the first connection pads is disposed with one of the N-type semiconductors and one of the P-type semiconductors; A first heat-insulating layer is provided on the first insulating layer, the first heat-insulating layer covers the first circuit layer and wraps the plurality of N-type semiconductors and the plurality of P-type semiconductors, and the end surfaces of the plurality of N-type semiconductors and the plurality of P-type semiconductors are exposed on the outer surface of the heat-insulating layer; A second circuit layer is provided on the first heat insulation layer, the second circuit layer includes a plurality of second connection pads arranged at intervals, each of the second connection pads connects the N-type semiconductor and the P-type semiconductor arranged at intervals, and the plurality of the first connection pads and the plurality of the second connection pads connect the plurality of the N-type semiconductors and the plurality of the P-type semiconductors in series; The heat conduction groove is arranged on the second circuit layer to obtain the temperature control component.

4. The manufacturing method according to claim 3, It is characterized in that The step of "connecting a temperature sensing component to the hot end" includes: The temperature sensing component is arranged on a side of the first insulating layer away from the first heat-insulating layer, and the temperature sensing component includes a thermochromic material.

5. The manufacturing method according to claim 2, It is characterized in that The manufacturing method of the heat dissipation component comprises the steps of: Providing a second circuit substrate, wherein the second circuit substrate comprises a second insulating layer and a third circuit layer disposed on the second insulating layer; A plurality of the heating elements are arranged on the third circuit layer to obtain the heat dissipation component.

6. The manufacturing method according to claim 5, It is characterized in that The step of "connecting the component to be cooled at the cold end" also includes: An adhesive layer is provided between the heat dissipation component and the temperature control component, the adhesive layer is provided with an opening, and the heat conduction groove passes through the opening.

7. The manufacturing method according to claim 6, It is characterized in that The heat dissipation component includes an outlet pad, the temperature control component includes an inlet pad, and the manufacturing method further includes the steps of: An opening is provided through the heat dissipation component and the adhesive layer, and a portion of the introduction pad is exposed at the bottom of the opening; A conductive body is disposed in the opening, and the conductive body connects the lead-in pad and the lead-out pad.

8. The manufacturing method according to claim 7, It is characterized in that Also includes the steps: A protective film is disposed on a side of the heat dissipation component away from the adhesive layer.

9. A temperature-sensing and heat-dissipating circuit board, It is characterized in that include: A temperature control component, the temperature control component comprising a cold end and a hot end connected to the cold end; A heat dissipation component, the heat dissipation component is connected to the cold end, the heat dissipation component is used to generate heat and conduct it to the cold end, and the temperature control component is used to transfer the heat of the cold end to the hot end; A temperature sensing component is connected to the hot end and is used to visualize the size of the heat.

10. The temperature-sensing and heat-dissipating circuit board according to claim 9, It is characterized in that The temperature control component includes a thermal insulation layer, a plurality of cold end connection pads, a plurality of hot end connection pads, a plurality of P-type semiconductors and a plurality of N-type semiconductors, wherein the plurality of cold end connection pads are arranged at intervals on a side of the thermal insulation layer facing the component to be cooled, and the plurality of hot end connection pads are arranged on the other side of the thermal insulation layer away from the component to be cooled, the plurality of P-type semiconductors and the plurality of N-type semiconductors are alternately arranged on the thermal insulation layer, and the plurality of hot end connection pads and the plurality of cold end connection pads are connected in series with the plurality of P-type semiconductors and the plurality of N-type semiconductors in sequence.

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