Automatic cutter separating method for laser drilling
The laser drilling data is divided by automatic knife splitting technology, which solves the problem of limited heat accumulation and diffusion in dense holes in laser drilling, and realizes an efficient laser drilling process and avoids bubble problems.
Patent Information
- Application Number
- CN202510153780.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-12
- Publication Date
- 2025-06-10
AI Technical Summary
The existing laser drilling technology can easily lead to limited heat accumulation and diffusion in dense hole areas, causing bubble problems, and manual tool separation is inefficient and prone to errors.
By obtaining laser drilling data in advance, obtaining tool division information, and dividing the corresponding tool sequence in laser drilling data according to the tool division information, laser drilling data is generated to reduce the number of continuous processing holes in the dense holes area and avoiding heat accumulation and diffusion limitation.
During laser drilling, it is possible to reduce the accumulation and diffusion of hole-intensive areas, avoid bubble problems, improve the efficiency of cutting and reduce the possibility of artificial errors.
Smart Images

Figure CN120129153A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board manufacturing, and more specifically, it relates to a method for automatically dividing the drill bits in laser drilling. Background Art
[0002] With the continuous development of electronic products towards miniaturization and high-speed performance, higher requirements are put forward for the manufacturing of PCB circuit boards. Since electronic products are continuously reducing in volume and improving in performance, in order to meet the high density, high precision, micro-holing, small pitch and high reliability of electronic products, more and more manufacturers meet the performance requirements of the above-mentioned electronic products by setting micro-vias on the PCB circuit board (Printed Circuit Board).
[0003] At present, in the PCB circuit board industry, mechanical drilling is usually used to meet the through-hole requirements of products. However, mechanical drilling can only meet the through-hole requirements with a hole diameter greater than 0.15 mm. When making through-holes with a hole diameter less than 0.15 mm, due to the too small diameter of the drill bit during mechanical manufacturing, problems such as serious needle breakage occur during manufacturing.
[0004] Therefore, laser drilling is usually used when drilling micro-holes. For the method of manufacturing laser-conducted micro-holes on the existing PCB board, reference can be made to the invention patent with the Chinese patent application number CN202210673751.4. It locates from the first processing surface to obtain the first positioning hole; drills holes on the first processing surface according to the first positioning hole to a depth of two-thirds of the thickness of the processing board to obtain the first laser hole; locates on the second processing surface according to the first laser hole to determine the second positioning hole, wherein the second positioning hole and the first positioning hole are symmetrically arranged horizontally with the processing board; drills holes on the second processing surface according to the second positioning hole to a depth of two-thirds of the thickness of the processing board to obtain the second laser hole; and processes the target micro-hole according to the first laser hole and the second laser hole.
[0005] During the laser drilling process, the laser generates a high-energy laser beam, which is focused by the optical system and then irradiated onto the material surface. The material surface instantly generates high temperature, melts or vaporizes to form holes; although this process is efficient, it is also easy to cause pressure changes inside the material, especially in the area where holes are dense. Due to the limited heat accumulation and diffusion, it is easy to form bubbles. The usual solution is to divide the drill bit sequence of the drill in the dense area, so that the number of continuous processing holes in the dense area becomes smaller and the positions are staggered to avoid high temperature problems. And the division of the drill bits usually adopts manual division, which has low efficiency, and due to the large number of drillings in the dense area, it is easy to make mistakes during manual division, so there is still room for improvement. Summary of the Invention
[0006] In view of the deficiencies of the prior art, the purpose of the present invention is to provide an automatic tool splitting method for laser drilling to solve the above technical problems.
[0007] The above technical objective of the present invention is achieved through the following technical solutions: An automatic tool splitting method for laser drilling, including:
[0008] Pre-acquire laser drilling data, the laser drilling data includes a number of tool sequences, and the tool sequence includes a tool sequence name and a drilling coordinate;
[0009] Obtain tool splitting information;
[0010] According to the tool splitting information, split the corresponding tool sequences in the laser drilling data in a preset allocation order to obtain split tool sequences;
[0011] Generate laser split drilling data according to the laser drilling data and the split tool sequences.
[0012] Specifically, first read the laser drilling data that needs to be split. The laser drilling data has drill tool sequences and the corresponding laser drilling coordinates for each drill tool sequence. Then receive the tool splitting information input by the operator, and split the tool sequences that need to be split in the laser drilling data according to the preset order. Taking the tool sequence order as an example, first split the tool sequence with a relatively early tool sequence name, and then split the tool sequence with a relatively late tool sequence name to obtain the corresponding split tool sequences. Then integrate the split tool sequences into the laser drilling data, and adjust the other tool sequences in the laser drilling data in order to generate the laser split drilling data.
[0013] By splitting the tool sequences corresponding to the tool splitting information in the laser drilling data, integrating the split tool sequences into the laser drilling data, and adjusting and integrating the other tool sequences in the laser drilling data to obtain the laser split drilling data. When laser drilling the PCB board, since the selected tool sequences are split, the number of continuous processing holes in the corresponding area becomes smaller, thus avoiding blistering caused by limited heat accumulation and diffusion in the area with dense holes.
[0014] Optionally, the obtaining of the tool splitting information includes:
[0015] Obtain the tool sequences to be split and the corresponding number of splits for the tool sequences to be split;
[0016] Match the corresponding number of splits according to the tool sequence name of the tool sequences to be split to obtain a split list; output the split list as the tool splitting information.
[0017] Specifically, by obtaining the tool order to be split and the corresponding number of split tools set by the operator, sorting all the tool orders to be split in sequence according to the tool order names of the tool orders to be split, and matching the corresponding number of split tools according to the tool order names of the tool orders to be split to obtain a split tool list corresponding to all the tool orders to be split. By obtaining the split tool list, the tool orders to be split can be arranged in the order of the tool order, and the tool orders to be split can be matched with the number of split tools, so as to facilitate splitting the tool orders to be split and ensure that the tool order after splitting conforms to the laser drilling order.
[0018] Optionally, the tool order corresponding in the laser drilling data includes the tool order to be split in the laser drilling data;
[0019] The splitting of the tool order corresponding in the laser drilling data in a preset allocation order according to the splitting information to obtain the split tool order includes:
[0020] Sequentially select the tool orders to be split in the laser drilling data according to the split tool list;
[0021] Split the selected tool order to be split according to the corresponding number of split tools to obtain the increased tool order name corresponding to the tool order to be split;
[0022] Evenly distribute all the drilling coordinates in the tool order to be split to each increased tool order name regularly according to the corresponding number of split tools to obtain the corresponding split tool order.
[0023] Specifically, all the tool orders to be split in the split tool list are processed in sequence according to the order of the split tool list, and the tool orders to be split are split according to the number of split tools. The drilling coordinates corresponding to the tool orders to be split are evenly divided into coordinate sequences with corresponding numbers regularly, and the coordinate sequences are distributed to the corresponding increased tool order names. Since the tool orders to be split are split, there is an interval between adjacent drilling coordinates in each split tool order, thus avoiding heat accumulation and limited heat diffusion.
[0024] Optionally, the splitting of the selected tool order to be split according to the corresponding number of split tools to obtain the increased tool order name corresponding to the tool order to be split includes:
[0025] Obtain the tool order name corresponding to the selected tool order to be split;
[0026] Generate the corresponding increased tool order name according to the tool order name of the tool order to be split and its corresponding number of split tools.
[0027] Specifically, by obtaining the tool sequence name corresponding to the selected tool sequence to be split, and using this tool sequence name as the starting name, sequentially accumulate and generate increased tool sequence names after the starting name according to the number of split tools. Subsequently, adjust the tool sequence names of all tool sequences after the tool sequence to be split to after the increased tool sequence names in turn, and update the tool sequence name of the next tool sequence to be split. Repeat this process until all tool sequences to be split in the split tool list are completed. By adjusting the tool sequence name of the tool sequence to be split to an increased tool sequence name according to the number of split tools, and adjusting the tool sequence names of the tool sequences after the first tool sequence to be split, it is ensured that the tool sequences after splitting conform to the laser drilling order.
[0028] Optionally, the generating the corresponding increased tool sequence name according to the tool sequence name of the tool sequence to be split and its corresponding number of split tools includes:
[0029] Using the tool sequence name of the tool sequence to be split as the starting name, sequentially accumulate after the starting name according to the corresponding number of split tools to generate increased tool sequence names corresponding to the number of split tools.
[0030] Specifically, by using the tool sequence name of the tool sequence to be split as the starting name and sequentially accumulating in order after the starting name according to the corresponding number of split tools to generate the corresponding increased tool sequence name, it is convenient to maintain the laser drilling order of the tool sequence to be split and the tool sequences after it.
[0031] Optionally, the evenly distributing all drilling coordinates in the tool sequence to be split to each increased tool sequence name regularly according to the corresponding number of split tools to obtain the corresponding split tool sequence includes:
[0032] Pre-obtain the drilling coordinates corresponding to all tool sequences to be split;
[0033] Sort the drilling coordinates corresponding to each tool sequence to be split in the order of reading the coordinates to obtain the corresponding drilling sorted list;
[0034] According to the number of split tools corresponding to the tool sequence to be split and the corresponding drilling sorted list, staggeredly distribute all drilling coordinates to each increased tool sequence name regularly to obtain the corresponding split tool sequence.
[0035] Specifically, the tool sequence to be split has multiple drilling coordinates. By sorting the multiple drilling coordinates in the order of reading the coordinates and sequentially distributing the drilling coordinates in the drilling sorted list to each increased tool sequence name according to the number of split tools, the adjacent drilling coordinates in each split tool sequence are at least separated by the corresponding number of split tools, so that the drilling coordinates in each split tool sequence are sequentially spaced apart and dispersed, thus avoiding heat accumulation and limited heat diffusion due to overly dense drilling coordinates during laser drilling.
[0036] Optionally, after dividing the to-be-divided tool sequence into corresponding increased tool sequence names according to the number of divisions, the following steps are further included:
[0037] Replace the tool sequence name of the corresponding to-be-divided tool sequence in the laser drilling data according to the increased tool sequence name, and accumulate the tool sequence names after the to-be-divided tool sequence in sequence to generate a modified tool sequence.
[0038] Specifically, adjust the tool sequence names of the tool sequences after the to-be-divided tool sequence to ensure that the tool sequences after division conform to the laser drilling order. After dividing a to-be-divided tool sequence, adjust the tool sequence names of all the tool sequences after this to-be-divided tool sequence, and at the same time adjust the tool sequence name of the next to-be-divided tool sequence in the division list to ensure that the tool sequence name conforms to the laser drilling order when dividing the next to-be-divided tool sequence.
[0039] Optionally, the generation of the laser divided drilling data according to the laser drilling data and the division tool sequence includes:
[0040] Integrate the division tool sequence and the modified tool sequence to obtain the laser divided drilling data.
[0041] Specifically, by integrating the division tool sequence and the modified tool sequence and arranging them in sequence according to the tool sequence name, the laser divided drilling data is obtained, which can ensure that when performing laser drilling, the moving path of the laser is the same as the moving path before division.
[0042] In summary, the present invention has the following beneficial effects: By dividing the tool sequence of the corresponding division information in the laser drilling data, integrating the division tool sequence into the laser drilling data, and adjusting and integrating the other tool sequences in the laser drilling data in sequence to obtain the laser divided drilling data. When performing laser drilling on the PCB board, due to the division of the selected tool sequence, the number of consecutive processed holes in the corresponding area becomes smaller, thus avoiding blistering caused by limited heat accumulation and diffusion in the area with dense holes. Brief Description of the Drawings
[0043] Figure 1 is the flowchart of the method of the present invention. Detailed Embodiments
[0044] To make the objectives, features, and advantages of the present invention more obvious and understandable, the detailed embodiments of the present invention will be described below with reference to the accompanying drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.
[0045] In the present invention, unless otherwise clearly specified or limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.
[0046] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
[0047] Embodiment 1
[0048] This embodiment provides a method for automatically dividing tools in laser drilling, as Figure 1 shown, including:
[0049] Pre-acquire laser drilling data, where the laser drilling data includes a number of tool sequences, and the tool sequence includes a tool sequence name and a drilling coordinate;
[0050] Obtain tool division information;
[0051] According to the tool division information, divide the corresponding tool sequences in the laser drilling data in a preset allocation order to obtain divided tool sequences;
[0052] Generate laser divided drilling data according to the laser drilling data and the divided tool sequences.
[0053] Specifically, first read the laser drilling data that needs to be divided. The laser drilling data has drill tool sequences and the corresponding laser drilling coordinates for each drill tool sequence. Then receive the tool division information input by the operator, and divide the tool sequences that need to be divided in the laser drilling data in a preset order. Taking the tool sequence order as an example, first divide the tool sequence with a relatively early tool sequence name, and then divide the tool sequence with a relatively late tool sequence name to obtain the corresponding divided tool sequences. Then integrate the divided tool sequences into the laser drilling data, and adjust the other tool sequences in the laser drilling data in order, and then the laser divided drilling data can be generated.
[0054] By splitting the tool sequence corresponding to the tool splitting information in the laser drilling data, integrating the split tool sequence into the laser drilling data, and adjusting and integrating the other tool sequences in the laser drilling data in order to obtain the laser split drilling data. When laser drilling the PCB board, since the selected tool sequence is split, the number of consecutive processed holes in the corresponding area becomes smaller, thus avoiding blistering in the area with dense holes due to limited heat accumulation and diffusion.
[0055] Optionally, the obtaining of the tool splitting information includes:
[0056] Obtaining the tool sequence to be split and the number of splits corresponding to the tool sequence to be split;
[0057] Matching the corresponding number of splits according to the tool sequence name of the tool sequence to be split to obtain a split list; outputting the split list as the tool splitting information.
[0058] Specifically, by obtaining the tool sequence to be split set by the operator and the corresponding number of splits, sorting all the tool sequences to be split in sequence according to the tool sequence name of the tool sequence to be split, and matching the corresponding number of splits according to the tool sequence name of the tool sequence to be split to obtain a split list corresponding to all the tool sequences to be split. By obtaining the split list, the tool sequences to be split can be arranged in the order of the tool sequence, and the tool sequences to be split can be matched with the number of splits, so as to facilitate splitting the tool sequences to be split and ensure that the tool sequence after splitting conforms to the laser drilling sequence.
[0059] Optionally, the corresponding tool sequence in the laser drilling data includes the tool sequence to be split in the laser drilling data;
[0060] The splitting of the corresponding tool sequence in the laser drilling data according to the tool splitting information in a preset allocation order to obtain the split tool sequence includes:
[0061] Sequentially selecting the tool sequences to be split in the laser drilling data according to the split list;
[0062] Splitting the selected tool sequence to be split according to the corresponding number of splits to obtain the increased tool sequence name corresponding to the tool sequence to be split;
[0063] Evenly distributing all the drilling coordinates in the tool sequence to be split to each increased tool sequence name regularly according to the corresponding number of splits to obtain the corresponding split tool sequence.
[0064] Specifically, all the tool sequences to be split in the tool splitting list are processed in sequence according to the order of the tool splitting list, and the tool sequences to be split are split according to the number of tool splits. All the drilling coordinates corresponding to the tool sequences to be split are regularly divided into coordinate sequences of corresponding numbers of copies, and the coordinate sequences are assigned to the corresponding added tool sequence names. Since the tool sequences to be split are split, there is a gap between adjacent drilling coordinates in each split tool sequence, thus avoiding heat accumulation and limited heat diffusion.
[0065] In this embodiment, taking the total number of tools in the laser drilling data as four tools, namely T01, T02, T03, and T04, as an example, the selected tool sequences to be split are T02 and T04. Among them, the number of tool splits for T02 is 3, and the number of tool splits for T04 is 4. Then, first split T02, and its added tool sequence names are T02, T03, and T04. The total tool sequence is T01, T02, T03, T04, T05 (original T03), T06 (original T04); then split the original T04, now T06, and its added tool sequence names are T06, T07, T08, and T09; the total tool sequence is T01, T02, T03, T04, T05, T06, T07, T08, and T09.
[0066] Optionally, splitting the selected tool sequence to be split according to the corresponding number of tool splits to obtain the added tool sequence names corresponding to the tool sequence to be split includes:
[0067] Obtain the tool sequence name corresponding to the selected tool sequence to be split;
[0068] Generate the corresponding added tool sequence names according to the tool sequence name of the tool sequence to be split and its corresponding number of tool splits.
[0069] Specifically, by obtaining the tool sequence name corresponding to the selected tool sequence to be split and using this tool sequence name as the starting name, the added tool sequence names are successively accumulated after the starting name according to the number of tool splits. Subsequently, the tool sequence names of all the tool sequences after this tool sequence to be split are successively adjusted after the added tool sequence names, and the tool sequence name of the next tool sequence to be split is updated. This is repeated until all the tool sequences to be split in the tool splitting list are split. By adjusting the tool sequence name of the tool sequence to be split to the added tool sequence name according to the number of tool splits and adjusting the tool sequence names of the tool sequences after the first tool sequence to be split, it is ensured that the tool sequence after splitting conforms to the laser drilling order.
[0070] Optionally, generating the corresponding added tool sequence names according to the tool sequence name of the tool sequence to be split and its corresponding number of tool splits includes:
[0071] Taking the tool sequence name of the tool sequence to be split as the starting name, successively accumulate after the starting name according to the corresponding number of tool splits to generate the added tool sequence names corresponding to the number of tool splits.
[0072] Specifically, by using the tool sequence name of the tool sequence to be split as the starting name, and sequentially adding the corresponding number of split tools after the starting name in order to generate the corresponding increased tool sequence names, it is convenient to maintain the laser drilling order of the tool sequence to be split and the subsequent tool sequences.
[0073] Optionally, the step of evenly distributing all the drilling coordinates in the tool sequence to be split to each increased tool sequence name according to the corresponding number of split tools to obtain the corresponding split tool sequence includes:
[0074] Pre-obtain the drilling coordinates corresponding to all the tool sequences to be split;
[0075] Sort the drilling coordinates corresponding to each tool sequence to be split in the order of reading the coordinates to obtain the corresponding drilling coordinate list;
[0076] Regularly and alternately distribute all the drilling coordinates to each increased tool sequence name according to the number of split tools corresponding to the tool sequence to be split and the corresponding drilling coordinate list to obtain the corresponding split tool sequence.
[0077] Specifically, the tool sequence to be split has multiple drilling coordinates. By sorting the multiple drilling coordinates in the order of reading the coordinates and sequentially distributing the drilling coordinates in the drilling coordinate list to each increased tool sequence name according to the number of split tools, the adjacent drilling coordinates in each split tool sequence are at least separated by the corresponding number of split tools, so that the drilling coordinates in each split tool sequence are sequentially spaced apart, thereby avoiding heat accumulation and limited heat diffusion due to overly dense drilling coordinates during laser drilling.
[0078] For example, according to the order of reading the coordinates, distribute the 1st, 4th, 7th... coordinates to T02, the 2nd, 5th, 8th... coordinates to T03, and the 3rd, 6th, 9th... coordinates to T04 for the drilling coordinates in the original T02, so as to complete the distribution of the drilling coordinates to the increased tool sequence names. Since the adjacent drilling coordinates are in different tool sequences, the drilling coordinates in each split tool sequence are sequentially spaced apart, thereby avoiding heat accumulation and limited heat diffusion due to overly dense drilling coordinates during laser drilling.
[0079] Embodiment 2
[0080] This embodiment provides a method for automatically splitting a laser drill, as Figure 1 shown, including:
[0081] Pre-obtain laser drilling data, where the laser drilling data includes several tool sequences, and the tool sequence includes a tool sequence name and drilling coordinates;
[0082] Obtain splitting information;
[0083] Split the corresponding tool sequence in the laser drilling data according to the tool splitting information in a preset allocation order to obtain the split tool sequence;
[0084] Generate laser split drilling data based on the laser drilling data and the split tool sequence.
[0085] Specifically, first read the laser drilling data that needs to be split. The laser drilling data has drill tool sequences and the corresponding laser drilling coordinates for each drill tool sequence. Then receive the tool splitting information input by the operator, and split the tool sequences that need to be split in the laser drilling data according to the preset order. Taking the tool sequence order as an example, first split the tool sequence with a relatively early tool sequence name, and then split the tool sequence with a relatively late tool sequence name to obtain the corresponding split tool sequence. Then integrate the split tool sequence into the laser drilling data, and adjust the other tool sequences in the laser drilling data in order to generate the laser split drilling data.
[0086] By splitting the tool sequences corresponding to the tool splitting information in the laser drilling data, integrating the split tool sequence into the laser drilling data, and adjusting and integrating the other tool sequences in the laser drilling data to obtain the laser split drilling data. When performing laser drilling on the PCB board, since the selected tool sequences are split, the number of continuous processing holes in the corresponding area becomes smaller, thus avoiding blistering caused by limited heat accumulation and diffusion in the area where the holes are dense.
[0087] Optionally, the obtaining of the tool splitting information includes:
[0088] Obtain the tool sequence to be split and the number of splits corresponding to the tool sequence to be split;
[0089] Match the corresponding number of splits according to the tool sequence name of the tool sequence to be split to obtain a split list; output the split list as the tool splitting information.
[0090] Specifically, obtain the tool sequence to be split and the corresponding number of splits set by the operator, sort all the tool sequences to be split in sequence according to the tool sequence name of the tool sequence to be split, and match the corresponding number of splits according to the tool sequence name of the tool sequence to be split to obtain a split list corresponding to all the tool sequences to be split. By obtaining the split list, the tool sequences to be split can be arranged in the tool sequence order and the tool sequences to be split can be matched with the number of splits, so as to facilitate splitting the tool sequences to be split and ensure that the tool sequences after splitting conform to the laser drilling order.
[0091] Optionally, the corresponding tool sequences in the laser drilling data include the tool sequences to be split in the laser drilling data;
[0092] The splitting the corresponding tool sequences in the laser drilling data according to the tool splitting information in a preset allocation order to obtain the split tool sequence includes:
[0093] Select the tool order to be split in the laser drilling data in sequence according to the split tool list;
[0094] Split the selected tool order to be split according to the corresponding split tool quantity to obtain the increased tool order name corresponding to the tool order to be split;
[0095] Evenly distribute all the drilling coordinates in the tool order to be split regularly according to the corresponding split tool quantity to each increased tool order name to obtain the corresponding split tool order.
[0096] Specifically, process all the tool orders to be split in the split tool list in sequence according to the order of the split tool list, split the tool order to be split according to the split tool quantity, evenly divide all the drilling coordinates corresponding to the tool order to be split into coordinate sequences with corresponding numbers of copies, and distribute the coordinate sequences to the corresponding increased tool order names. Since the tool order to be split is split, there is an interval between adjacent drilling coordinates in each split tool order, thus avoiding heat accumulation and limited heat diffusion.
[0097] Optionally, the splitting the selected tool order to be split according to the corresponding split tool quantity to obtain the increased tool order name corresponding to the tool order to be split includes:
[0098] Obtain the tool order name corresponding to the selected tool order to be split;
[0099] Generate the corresponding increased tool order name according to the tool order name of the tool order to be split and its corresponding split tool quantity.
[0100] Specifically, by obtaining the tool order name corresponding to the selected tool order to be split and using this tool order name as the starting name, sequentially accumulate after the starting name according to the split tool quantity to generate increased tool order names, then sequentially adjust the tool order names of all the tool orders after the tool order to be split to after the increased tool order names, and update the tool order name of the next tool order to be split, and repeat in sequence until all the tool orders to be split in the split tool list are split. By adjusting the tool order name of the tool order to be split to an increased tool order name according to the split tool quantity and adjusting the tool order names of the tool orders after the first tool order to be split, it is ensured that the tool order after splitting conforms to the laser drilling order.
[0101] Optionally, the generating the corresponding increased tool order name according to the tool order name of the tool order to be split and its corresponding split tool quantity includes:
[0102] Use the tool order name of the tool order to be split as the starting name, and sequentially accumulate after the starting name according to the corresponding split tool quantity to generate increased tool order names corresponding to the split tool quantity.
[0103] Specifically, by using the tool sequence name of the tool sequence to be split as the starting name, and sequentially accumulating according to the corresponding number of split tools after the starting name in order to generate the corresponding increased tool sequence names, it is convenient to maintain the laser drilling order of the tool sequence to be split and the subsequent tool sequences.
[0104] Optionally, the step of regularly and evenly distributing all the drilling coordinates in the tool sequence to be split to each increased tool sequence name according to the corresponding number of split tools to obtain the corresponding split tool sequences includes:
[0105] Pre-obtain the drilling coordinates corresponding to all the tool sequences to be split;
[0106] Sort the drilling coordinates corresponding to each tool sequence to be split in the order of reading the coordinates to obtain the corresponding drilling coordinate list;
[0107] Regularly and alternately distribute all the drilling coordinates to each increased tool sequence name according to the number of split tools corresponding to the tool sequence to be split and the corresponding drilling coordinate list to obtain the corresponding split tool sequences.
[0108] Specifically, the tool sequence to be split has multiple drilling coordinates. By sorting the multiple drilling coordinates in the order of reading the coordinates and sequentially distributing the drilling coordinates in the drilling coordinate list to each increased tool sequence name according to the number of split tools, the adjacent drilling coordinates in each split tool sequence are at least separated by the corresponding number of split tools, so that the drilling coordinates in each split tool sequence are sequentially spaced apart, thereby avoiding heat accumulation and limited heat diffusion due to overly dense drilling coordinates during laser drilling.
[0109] Optionally, after splitting the tool sequence to be split into the corresponding increased tool sequence names, it further includes:
[0110] Replace the tool sequence name of the corresponding tool sequence to be split in the laser drilling data according to the increased tool sequence name, and sequentially accumulate the tool sequence names after the tool sequence to be split to generate the modified tool sequence.
[0111] Specifically, adjust the tool sequence names of the tool sequences after the tool sequence to be split to ensure that the tool sequences after splitting conform to the laser drilling order. After splitting a tool sequence to be split, adjust all the tool sequence names after the tool sequence to be split, and at the same time adjust the tool sequence name of the next tool sequence to be split in the split list to ensure that the tool sequence name conforms to the laser drilling order when splitting the next tool sequence to be split.
[0112] Optionally, the step of generating the laser split drilling data according to the laser drilling data and the split tool sequences includes:
[0113] Integrate the split tool sequences and the modified tool sequences to obtain the laser split drilling data.
[0114] In this embodiment, taking the total number of tools in the laser drilling data as four tools, namely T01, T02, T03, and T04, as an example, the tool sequences to be split are T02 and T04. Among them, the number of split tools for T02 is 3, and the number of split tools for T04 is 4. At this time, first split T02, and its added tool sequence names are T02, T03, T04, and the total tool sequence is T01, T02, T03, T04, T05 (original T03), T06 (original T04); then split the original T04, now T06, and its added tool sequence names are T06, T07, T08, T09; the total tool sequence is T01, T02, T03, T04, T05, T06, T07, T08, T09.
[0115] According to the order of reading the coordinates, allocate the 1st, 4th, 7th... coordinates to T02, the 2nd, 5th, 8th... coordinates to T03, and the 3rd, 6th, 9th... coordinates to T04 for the drilling coordinates in the original T02, so as to complete the allocation of the drilling coordinates to the added tool sequence names. Since adjacent drilling coordinates are in different tool sequences, the drilling coordinates in each split tool sequence are sequentially spaced apart, thus avoiding heat accumulation and limited heat diffusion due to overly dense drilling coordinates during laser drilling. By integrating the split tool sequence and the modified tool sequence and arranging them in the order of the tool sequence names, the laser split drilling data is obtained, which can ensure that the moving path of the laser during laser drilling is the same as the moving path before splitting.
[0116] The above is only the preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the idea of the present invention belong to the protection scope of the present invention. It should be noted that for those of ordinary skill in the art, several improvements and refinements made without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.
Claims
1. A laser drilling automatic knife division method, characterized in that: include: Pre-acquire laser drilling data, wherein the laser drilling data includes a plurality of tool sequences, and the tool sequence includes a tool sequence name and drilling coordinates; Get the knife information; According to the knife division information, the knife sequence corresponding to the laser drilling data is divided in a preset distribution order to obtain a knife division sequence; Generate laser knife drilling data according to laser drilling data and knife sequence.
2. The method for automatic laser drilling according to claim 1, characterized in that: The obtaining of the knife division information includes: Get the knife sequence to be divided and the number of divided knives corresponding to the knife sequence to be divided; A knife division list is obtained by matching the knife sequence names of the knife sequences to be divided with the corresponding knife division quantities; and the knife division list is output as knife division information.
3. The method for automatic laser drilling according to claim 2, characterized in that: The corresponding tool sequence in the laser drilling data includes the tool sequence to be divided in the laser drilling data; The step of dividing the corresponding tool sequence in the laser drilling data in a preset distribution order according to the tool division information to obtain the tool division tool sequence includes: Selecting the knife sequence to be divided in the laser drilling data in sequence according to the knife division list; The selected knife sequence to be divided is divided according to the corresponding number of divided knives, and the name of the added knife sequence corresponding to the knife sequence to be divided is obtained; All drilling coordinates in the tool sequence to be divided are evenly and regularly distributed to each added tool sequence name according to the corresponding tool number, so as to obtain the corresponding tool sequence.
4. The method for automatic laser drilling according to claim 3, characterized in that: The step of dividing the selected knife sequence to be divided according to the corresponding number of divided knives to obtain the name of the added knife sequence corresponding to the knife sequence to be divided includes: Get the name of the selected knife sequence corresponding to the knife sequence to be divided; Generate a corresponding added knife sequence name according to the knife sequence name of the knife sequence to be divided and its corresponding number of divided knives.
5. The method for automatic laser drilling according to claim 4, characterized in that: The step of generating a corresponding additional knife sequence name according to the knife sequence name of the knife sequence to be divided and the corresponding number of divided knives includes: The knife sequence name of the knife sequence to be divided is used as the starting name, and the corresponding number of divided knives is sequentially accumulated after the starting name to generate an increased knife sequence name corresponding to the number of divided knives.
6. The method for automatic laser drilling according to claim 3, characterized in that: The method of evenly distributing all the drilling coordinates in the tool sequence to be divided into different tools to each added tool sequence name according to the corresponding number of divided tools, to obtain the corresponding tool sequence, comprises: Obtain in advance the drilling coordinates corresponding to all the tool sequences to be divided; Sort the drilling coordinates corresponding to each tool sequence to be divided according to the order of the read coordinates to obtain the corresponding drilling sort list; According to the number of divided knives corresponding to the knife sequence to be divided and the corresponding drilling sort list, all drilling coordinates are regularly and alternately assigned to each added knife sequence name to obtain the corresponding divided knife sequence.
7. The method for automatic laser drilling according to claim 3, characterized in that: After dividing the knife sequence to be divided into corresponding names of the added knife sequence according to the number of divided knives, the method further includes: According to the added tool sequence name, the tool sequence name of the corresponding tool sequence to be divided in the laser drilling data is replaced, and the tool sequence names after the tool sequence to be divided are accumulated in sequence to generate a modified tool sequence.
8. The method for automatic laser drilling according to claim 7, characterized in that: The step of generating laser drilling data according to the laser drilling data and the knife division sequence includes: The knife division sequence and the modified knife sequence are integrated to obtain laser knife division drilling data.
Citation Information
Patent Citations
Manufacturing method of laser conduction micropore of PCB (Printed Circuit Board) and PCB
CN115103512A