Full-automatic hot-pressing device and hot-pressing method for multilayer printed circuit board

Abstract

The invention relates to the technical field of printed circuit board processing, and discloses a multilayer printed circuit board full-automatic hot pressing device which comprises a processing base and a processing top seat, a hot pressing cavity is arranged between the processing base and the processing top seat, and a hot pressing assembly and a printed circuit board assembly are arranged in the hot pressing cavity. By means of the structures such as the air exhaust channel, the air exhaust fan blades and the purification chamber, harmful gas generated by the printed circuit board assembly in the hot pressing process can be exhausted and purified, leakage of the harmful gas is prevented, and the working environment is protected; a first pushing plate, a second pushing plate and a third pushing plate in the downward pressing assembly are used for controlling gas to enter a second ventilation channel and controlling the opening and closing states of the gas outlet end and the gas inlet end of the second ventilation channel correspondingly, the hot pressing cavity is closed during hot pressing, and compressed gas can push harmful gas to be exhausted after hot pressing is completed; and exhaust fan blades are utilized to accelerate discharge of harmful gas, and dissipation of heat in the hot-pressing cavity can be accelerated.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board processing, and particularly to a fully automatic hot pressing device and a hot pressing method for multi-layer printed circuit boards. Background Art

[0002] A printed circuit board is also called a PCB board. As a key carrier for the electrical connection of electronic components, the manufacturing quality of a multi-layer printed circuit board directly affects the performance and stability of electronic devices. A multi-layer printed circuit board is usually tightly composed of inner core boards, prepregs (PP sheets), etc. Resin or additives are provided between these components, and the hot pressing process is a key link to achieve the tight combination of each layer of the multi-layer printed circuit board.

[0003] During the assembly process of multi-layer printed circuit boards, a hot press is required. The hot press needs to perform hot pressing and bonding on the multi-layer printed circuit board and the panel. During the hot pressing process, since materials such as resin or additives melt at high temperatures and generate harmful gases, in traditional hot pressing devices during hot pressing work, an air suction fan and a purification box are provided at the hot pressing part on the workbench, and the harmful gases generated by hot pressing are extracted by pumping into the purification box for purification. However, this air extraction method cannot completely draw all these harmful gases into the purification box, and there will still be some harmful gases discharged into the working environment, and these discharged harmful gases will be absorbed by the operators, which not only endangers the physical health of the operators but also causes environmental pollution.

[0004] In the above patent, when the circuit board assembly is performing hot pressing work, the circuit board assembly is exposed on the workbench, and no harmful gas collection device is provided on the workbench. Summary of the Invention

[0005] The purpose of the present invention is to provide a fully automatic hot pressing device and a hot pressing method for multi-layer printed circuit boards to solve the problems raised in the above background art.

[0006] Technical Solution

[0007] The present invention provides the following technical solution: A fully automatic hot pressing device for multi-layer printed circuit boards includes a processing base and a processing top seat. A hot pressing chamber is provided between the processing base and the processing top seat. A hot pressing component and a printed circuit board component are arranged in the hot pressing chamber. A downward pressing component is arranged below the processing top seat. A purification chamber, a second ventilation channel, and an air extraction channel are arranged in the processing base. An air extraction fan blade is arranged in the air extraction channel. When the processing top seat moves upward, it will cause the second ventilation channel to open through the downward pressing component and flow air into the hot pressing chamber, accelerating the flow of harmful gases generated by the hot pressing component in the hot pressing chamber heating the printed circuit board component, and driving the harmful gases in the hot pressing chamber to enter the purification chamber through the air extraction channel, and the purification chamber purifies and eliminates the harmful gases from the hot pressing chamber.

[0008] Preferably, the pressing-down assembly includes a first pushing plate, a second pushing plate and a third pushing plate. The first pushing plate pushes air into the second ventilation channel. The second pushing plate controls the opening and closing state of the air outlet end of the second ventilation channel. The third pushing plate controls the opening and closing state of the air inlet end of the second ventilation channel.

[0009] Preferably, a second connecting air cavity and a second compressed gas cavity are further arranged in the processing base. A spring rod and a clamping member are arranged in the second connecting air cavity. Adjacent two groups of clamping members clamp and fix the printed circuit board assembly. An adjusting plate and an air inlet valve are arranged in the second compressed gas cavity. The adjusting plate is close to the air inlet end of the second ventilation channel.

[0010] Preferably, the first pushing plate is located in the second connecting air cavity and pushes air in the second connecting air cavity into the second compressed gas cavity, and also pushes the clamping member into contact with the printed circuit board assembly.

[0011] Preferably, a rotating shaft is arranged in the air extraction channel. An air extraction fan blade is arranged on the rotating shaft. A clockwork spring and a second rotating gear are also arranged on the rotating shaft. The second pushing plate penetrates through the air extraction channel and is meshed and connected with the second rotating gear.

[0012] Preferably, a first rotating gear is fixedly installed on the outer side of the central axis of the adjusting plate. A tooth column is arranged on the third pushing plate and is meshed and connected with the first rotating gear through the tooth column.

[0013] Preferably, a column is arranged on the outer side of the processing base. A telescopic air cylinder and a first connecting air cavity are arranged on the column. A connecting plate and a connecting column are arranged on the telescopic air cylinder. The telescopic air cylinder is fixedly connected with the processing top seat. A first communication cavity is arranged in the connecting column. A filter screen plate and a second communication cavity are arranged in the purification chamber.

[0014] Preferably, an air blowing pipe is further arranged in the hot pressing cavity. The other end of the air blowing pipe is also provided with a second communication cavity. Adjacent two second communication cavities are communicated through the first communication cavity.

[0015] Preferably, a first ventilation channel and a working cavity are arranged in the processing top seat. An air bag and a return spring are arranged in the working cavity. The hot pressing assembly includes an upper hot pressing plate and a lower hot pressing plate. Both the air bag and the return spring are fixedly connected with the upper hot pressing plate.

[0016] Preferably, the side of the connecting plate extends into the column and a first compressed gas cavity is arranged between the connecting plate and the inner wall of the column. The air in the first compressed gas cavity enters the air bag through the first ventilation channel to promote the downward movement of the upper hot pressing plate to heat the printed circuit board assembly.

[0017] A hot pressing method for a fully automatic hot pressing device for multi-layer printed circuit boards includes the following steps

[0018] Step 1: The processing top seat moves downward, the printed circuit board assembly is clamped, the airbag expands to drive the upper hot pressing plate to move downward, and cooperates with the lower hot pressing plate to perform hot pressing on the printed circuit board assembly;

[0019] Step 2: The processing top seat moves upward, the second push plate moves upward to drive the exhaust fan blades to extract the harmful gases in the hot pressing cavity through the exhaust channel and the filter plate to the purification chamber for purification;

[0020] Step 3: The gas in the second ventilation channel flows into the hot pressing cavity, accelerating the flow of harmful gases in the hot pressing cavity into the purification chamber and accelerating the cooling of the surface of the printed circuit board assembly.

[0021] Beneficial effects

[0022] Compared with the prior art, the present invention provides a fully automatic hot pressing device and a hot pressing method for multi-layer printed circuit boards, having the following beneficial effects:

[0023] 1. In the present invention, through structures such as the exhaust channel, exhaust fan blades, and purification chamber, the harmful gases generated by the printed circuit board assembly during the hot pressing process can be discharged and purified, preventing the leakage of harmful gases and protecting the working environment.

[0024] 2. In the present invention, the opening and closing states of the gas entering the second ventilation channel, the outlet end and the inlet end of the second ventilation channel are respectively controlled by the first push plate, the second push plate and the third push plate in the pressing component. The hot pressing cavity is closed during hot pressing, and after hot pressing, the compressed gas can be used to push the harmful gases out, and the exhaust fan blades are used to accelerate the discharge of harmful gases, and the heat dissipation in the hot pressing cavity can also be accelerated.

[0025] It should be understood that the foregoing general description and the following detailed description are merely exemplary and explanatory and are not intended to limit the present disclosure.

[0026] This application document provides an overview of various implementations or examples of the technology described in the present disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings.

[0028] Figure 1 It is the front view of the overall structure of the present invention;

[0029] Figure 2 It is the front sectional view of the processing base and the processing top seat of the present invention;

[0030] Figure 3 Connection diagram of the first compressed gas chamber, the first ventilation passage and the airbag of the present invention;

[0031] Figure 4 Connection diagram of the second connecting air chamber, the second compressed gas chamber and the second ventilation passage of the present invention;

[0032] Figure 5 Connection diagram of the hot pressing plate and the printed circuit board assembly of the present invention;

[0033] Figure 6 Internal sectional view of the third push plate located inside the processing base of the present invention;

[0034] Figure 7 Partial schematic diagram of the bottom of the processing top seat of the present invention;

[0035] Figure 8 Connection diagram of the hot pressing chamber and the purification chamber through the air extraction channel of the present invention;

[0036] Figure 9 Working diagram of the air extraction fan blade of the present invention;

[0037] Figure 10 Working diagram of the air blowing and heat dissipation of the air blowing pipe of the present invention.

[0038] Explanation of reference numerals:

[0039] In the figure: 1. Processing base; 2. Processing top seat; 3. Column; 4. Telescopic cylinder; 5. Connecting plate; 6. Purification chamber; 7. Hot pressing chamber; 8. Printed circuit board assembly; 9. Airbag; 10. Upper hot pressing plate; 11. Filter mesh plate; 12. Return spring; 13. First ventilation passage; 14. First compressed gas chamber; 15. First connecting air chamber; 16. Lower hot pressing plate; 17. First push plate; 18. Second connecting air chamber; 19. Second compressed gas chamber; 20. Second ventilation passage; 21. Adjusting plate; 22. Intake valve; 23. Second push plate; 24. Air extraction fan blade; 25. Third push plate; 26. First rotating gear; 27. Air extraction channel; 28. Spring winding; 29. Second rotating gear; 30. Connecting column; 31. Air blowing pipe; 32. First communication chamber; 33. Second communication chamber; 34. Spring rod; 35. Clamping member. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0041] Embodiment:

[0042] Please refer to Figures 1-9 , the present invention provides a technical solution: a fully automatic hot pressing device for multi-layer printed circuit boards, including a processing base 1 and a processing top seat 2. A hot pressing chamber 7 is provided between the processing base 1 and the processing top seat 2. A hot pressing component and a printed circuit board component 8 are arranged in the hot pressing chamber 7. A downward pressing component is arranged below the processing top seat 2. A purification chamber 6, a second ventilation channel 20 and an air extraction channel 27 are opened in the processing base 1. An air extraction fan blade 24 is arranged in the air extraction channel 27. When the processing top seat 2 moves upward, it will cause the second ventilation channel 20 to open through the downward pressing component and discharge air into the hot pressing chamber 7, accelerating the flow of harmful gases generated by the heating of the printed circuit board component 8 by the hot pressing component in the hot pressing chamber 7, and driving the harmful gases in the hot pressing chamber 7 to enter the purification chamber 6 through the air extraction channel 27, and purifying and eliminating the harmful gases from the hot pressing chamber 7 through the purification chamber 6.

[0043] The hot pressing component includes an upper hot pressing plate 10 and a lower hot pressing plate 16. The printed circuit board component 8 is located between the upper hot pressing plate 10 and the lower hot pressing plate 16. The lower hot pressing plate 16 is fixedly installed in the hot pressing chamber 7 and is located above the purification chamber 6. The upper hot pressing plate 10 is fixedly installed below the airbag 9.

[0044] The downward pressing component includes a first pushing plate 17, a second pushing plate 23 and a third pushing plate 25. The first pushing plate 17, the second pushing plate 23 and the third pushing plate 25 are all distributed at the bottom end of the processing top seat 2 and are not located in the hot pressing chamber 7. The first pushing plate 17 pushes air into the second ventilation channel 20. The second pushing plate 23 controls the opening and closing state of the air outlet end of the second ventilation channel 20. The third pushing plate 25 controls the opening and closing state of the air inlet end of the second ventilation channel 20.

[0045] In this embodiment, a second connecting air chamber 18 and a second compressed gas chamber 19 are further arranged in the processing base 1. A gas channel is arranged between the second connecting air chamber 18 and the second compressed gas chamber 19. A spring rod 34 and a clamping member 35 are arranged in the second connecting air chamber 18. The spring rod 34 and the clamping member 35 are fixedly connected. The spring rod 34 passes through the inner wall between the second connecting air chamber 18 and the hot pressing chamber 7 and extends into the hot pressing chamber 7. At the same time, the clamping member 35 is always located in the hot pressing chamber 7. Adjacent two groups of clamping members 35 clamp and fix the printed circuit board component 8. An adjusting plate 21 and an air inlet valve 22 are arranged in the second compressed gas chamber 19. The adjusting plate 21 is close to the air inlet end of the second ventilation channel 20.

[0046] In this embodiment, when the processing top seat 2 moves downward, the first push plate 17 will enter the second connecting air cavity 18. And during the continuous downward movement of the processing top seat 2, the first push plate 17 will continue to push the air that has entered the second connecting air cavity 18 into the second connecting air cavity 18, thereby pushing a part of the air in the second connecting air cavity 18 through the gas passage into the second compressed gas cavity 19. Another part of the air will push the spring rod 34 and the clamping member 35 to move in the hot pressing cavity 7, and make the clamping member 35 contact the printed circuit board assembly 8.

[0047] A sealing ring is arranged outside the first push plate 17 to prevent gas from leaking from around the first push plate 17 when the first push plate 17 moves in the second connecting air cavity 18.

[0048] A ventilation hole is penetrated in the clamping member 35, and the height of the ventilation hole is higher than the height of the printed circuit board assembly 8, so as to prevent the periphery of the printed circuit board assembly 8 from entering the ventilation hole during hot pressing. The bottom end surface of the clamping member 35 is parallel to the lower hot pressing plate 16. At the same time, the harmful gas generated when the upper and lower hot pressing plates hot press the printed circuit board assembly 8 can flow through the ventilation hole into the hot pressing cavity 7, that is, the space between the clamping member 35 and the inner wall of the hot pressing cavity 7.

[0049] When the adjusting plate 21 is in the vertical state, it will completely block the air inlet end of the second ventilation passage 20. When the adjusting plate 21 is inclined, the gas in the second compressed gas cavity 19 can enter the second ventilation passage 20.

[0050] The intake valve 22 adopts a one-way intake valve. The gas from the second connecting air cavity 18 can enter the second compressed gas cavity 19, but the gas in the second compressed gas cavity 19 cannot enter the second connecting air cavity 18.

[0051] When the processing top seat 2 presses downward, it drives the first push plate 17 to enter the second connecting air cavity 18. A part of the gas in the second connecting air cavity 18 will push the spring rod 34 and the clamping member 35 to move back, and make the clamping member 35 clamp the printed circuit board assembly 8. At the same time, in cooperation with the spring rod 34, the printed circuit board assembly 8 with different widths can be clamped, and the adaptation range is large. Another part of the gas will enter the second compressed gas cavity 19 through the gas passage, and pass through the intake valve 22 and be stored between the intake valve 22 and the adjusting plate 21. As the first push plate 17 continues to move downward, more and more gas will be between the intake valve 22 and the adjusting plate 21.

[0052] In this embodiment, a rotating shaft is provided in the air extraction channel 27. The air extraction fan blade 24 is fixedly installed on the rotating shaft. A clockwork spring 28 and a second rotating gear 29 are also fixedly installed on the rotating shaft. The second push plate 23 passes through the air extraction channel 27 and is meshed with the second rotating gear 29. When the second push plate 23 moves downward, it will drive the second rotating gear 29 to rotate. When the second rotating gear 29 rotates, it drives the clockwork spring 28 to be compressed. At the same time, when the second push plate 23 contacts the second rotating gear 29, the second push plate 23 will also block the air outlet end of the second ventilation channel 20. When the second push plate 23 starts to move upward, the air outlet end of the second ventilation channel 20 will be unsealed.

[0053] In this embodiment, a first rotating gear 26 is fixedly installed outside the central axis of the adjusting plate 21. The third push plate 25 is provided with a tooth column and is meshed with the first rotating gear 26 through the tooth column. After the third push plate 25 moves downward and when the processing base 1 and the processing top seat 2 are about to fit together, the third push plate 25 will drive the first rotating gear 26 to rotate and drive the adjusting plate 21 to rotate. The inclination angle of the adjusting plate 21 is greater than 0° and less than 90°, and the inclination angle of about 45° is the best and is in a vertical state, so that the second compressed gas chamber 19 and the second ventilation channel 20 cannot communicate with each other.

[0054] After the third push plate 25 moves downward with the processing top seat 2, it will be meshed with the first rotating gear 26 and drive the adjusting plate 21 to rotate, so that the adjusting plate 21 can block the communication between the second compressed gas chamber 19 and the second ventilation channel 20. When the third push plate 25 moves upward, it will drive the adjusting plate 21 to rotate. After the adjusting plate 21 rotates, the second compressed gas chamber 19 and the second ventilation channel 20 can be reconnected, so that the compressed gas in the second compressed gas chamber 19 can be discharged through the second ventilation channel 20 and flow into the hot pressing chamber 7.

[0055] A one-way intake valve 22 is also provided at the end of the air extraction channel 27 to prevent the gas entering the purification chamber 6 from flowing back into the hot pressing chamber 7. This intake valve 22 is provided between the air extraction fan blade 24 and the filter screen plate 11.

[0056] In this embodiment, a column 3 is fixedly installed on the outside of the processing base 1. The column 3 is not fixedly connected to the processing top seat 2. A telescopic cylinder 4 is fixedly installed on the column 3. Moreover, a first connecting air cavity 15 is formed on the outer wall of the column 3 on the side close to the processing top seat 2. A connecting plate 5 and a connecting column 30 are respectively fixedly installed on the output shaft of the telescopic cylinder 4. Moreover, the output shaft of the telescopic cylinder 4 is fixedly connected to the top of the processing top seat 2. A first communication cavity 32 is arranged in the connecting column 30. The shape of the first communication cavity 32 is U-shaped. A filter screen plate 11 and a second communication cavity 33 are arranged in the purification chamber 6. The second communication cavity 33 in the purification chamber 6 is located between two adjacent filter screen plates 11. The filter screen plate 11 can absorb and purify the harmful gases from the hot pressing cavity 7.

[0057] In this embodiment, an air blowing pipe 31 is further arranged in the hot pressing cavity 7. The air blowing pipe 31 is located on the side of the hot pressing cavity 7 and is not on the same side as the clamping member 35. And the air blowing pipe 31 does not contact the printed circuit board assembly 8 in the hot pressing cavity 7. The other end of the air blowing pipe 31 is also provided with a second communication cavity 33. Two adjacent second communication cavities 33 are communicated through the first communication cavity 32. When the two ends of the first communication cavity 32 are respectively communicated with the two second communication cavities 33, the purified gas in the purification chamber 6 will be blown to the hot pressing plate and the printed circuit board assembly 8 through the first communication cavity 32, the second communication cavity 33 and the air blowing pipe 31, so as to cool the hot pressing plate and the printed circuit board assembly 8, and blow away the dust on the surfaces of the hot pressing plate and the printed circuit board assembly 8.

[0058] When the processing top seat 2 moves upward, the first ventilation channel 13 can be communicated with the outside air through the first connecting air cavity 15.

[0059] In this embodiment, a first ventilation channel 13 and a working cavity are formed in the processing top seat 2. An airbag 9 and a return spring 12 are arranged in the working cavity. Both the airbag 9 and the return spring 12 are fixedly connected to the upper hot pressing plate 10. The first ventilation channel 13 is communicated with the airbag 9. The air from the first ventilation channel 13 can cause the airbag 9 to expand. In this way, when the airbag 9 expands, it will drive the upper hot pressing plate 10 to move downward in the working cavity, and make the upper hot pressing plate 10 contact the printed circuit board assembly 8, and cooperate with the lower hot pressing plate 16 to perform hot pressing treatment on the printed circuit board assembly 8.

[0060] The return spring 12 can be stretched when the airbag 9 is inflated. When the airbag 9 deflates, the return spring 12 will pull the upper hot pressing plate 10 back to its original position by its elastic force.

[0061] Please refer to Figure 10, the present invention provides a technical solution: In this embodiment, the side of the connecting plate 5 extends into the column 3, and a first compressed gas chamber 14 is provided on the inner wall of the column 3. When the processing top seat 2 moves downward, it will drive the connecting plate 5 to move downward together. The lowest end of the processing top seat 2 will block the outlet of the first compressed gas chamber 14. As the connecting plate 5 continues to move downward, the air in the first compressed gas chamber 14 is compressed. When the first ventilation channel 13 in the processing top seat 2 communicates with the outlet of the first compressed gas chamber 14, the air in the first compressed gas chamber 14 will flow into the airbag 9 through the first ventilation channel 13, prompting the upper hot pressing plate 10 to move downward to heat the printed circuit board assembly 8.

[0062] A hot pressing method for a fully automatic hot pressing device of a multi-layer printed circuit board includes the following steps

[0063] Step 1: The processing top seat 2 moves downward, the clamping member 35 clamps the printed circuit board assembly 8, and the air in the first compressed gas chamber 14 enters the airbag 9 through the first ventilation channel 13, driving the upper hot pressing plate 10 to move downward to cooperate with the lower hot pressing plate 16 to perform hot pressing on the printed circuit board assembly 8;

[0064] Step 2: The processing top seat 2 moves upward, the downward pressing assembly moves upward to separate the clamping member 35 from the printed circuit board assembly 8, the adjusting plate 21 rotates, the second pushing plate 23 moves upward, and the exhaust fan blade 24 rotates. The exhaust fan blade 24 sucks the harmful gas in the hot pressing chamber 7 through the exhaust channel 27 and the filter plate 11 to the purification chamber 6 for purification;

[0065] Step 3: The compressed gas in the second compressed gas chamber 19 will flow to the hot pressing chamber 7 through the second ventilation channel 20, accelerating the flow of harmful gas in the hot pressing chamber 7 into the purification chamber 6 and accelerating the cooling of the surface of the printed circuit board assembly 8.

[0066] The working principle of this embodiment: When hot pressing the printed circuit board assembly 8, it is located on the lower hot pressing plate 16 of the processing base 1. The telescopic cylinder 4 drives the processing top seat 2, the downward pressing assembly, the connecting plate 5 and the connecting column 30 to move downward together. The downward movement of the connecting column 30 will separate the first communication chamber 32 and the second communication chamber 33. When the processing top seat 2 starts to move downward, it will block the air outlet end of the first compressed gas chamber 14. When the connecting plate 5 moves downward, the gas in the first compressed gas chamber 14 will be compressed. When the processing top seat 2 moves downward, the first ventilation channel 13 will move downward, and will drive the first pushing plate 17, the second pushing plate 23 and the third pushing plate 25 to move downward together. When the first ventilation channel 13 communicates with the first compressed gas chamber 14, the air in the first compressed gas chamber 14 will enter the airbag 9 through the first ventilation channel 13, and the airbag 9 will move downward, stretching the return spring 12, and at the same time driving the upper hot pressing plate 10 to move downward to contact the printed circuit board assembly 8;

[0067] When the first push plate 17 in the downward pressing assembly moves downward, it will cause a part of the gas in the second connecting air chamber 18 to push the spring rod 34 and the clamping member 35 to clamp the printed circuit board assembly 8 in the hot pressing chamber 7. Moreover, the spring rod 34 and the clamping member 35 are elastic and can clamp printed circuit board assemblies 8 with different widths. At the same time, another part of the gas will enter the second compressed gas chamber 19 through the gas passage. When the third push plate 25 moves downward, it will drive the adjusting plate 21 to rotate through the first rotating gear 26, so that the adjusting plate 21 can be vertically located in the second compressed gas chamber 19 and cooperate with the one-way intake valve 22 to compress and store the gas located in the second compressed gas chamber 19. At the same time, the second push plate 23 will also close the outlet end of the second ventilation passage 20 and compress the clockwork spring 28 through the second rotating gear 29, thereby closing the entire hot pressing chamber 7. The harmful gases generated when the upper hot pressing plate 10 and the lower hot pressing plate 16 work on the printed circuit board assembly 8 will be stored in the hot pressing chamber 7;

[0068] When the hot pressing work is completed, the processing top seat 2 moves upward and drives the downward pressing assembly to move upward. When the downward pressing assembly moves upward a certain distance, the upward movement of the first push plate 17 will cause the spring rod 34 and the clamping member 35 in the second connecting air chamber 18 to separate from the printed circuit board assembly 8. The upward movement of the third push plate 25 will drive the adjusting plate 21 to rotate through the first rotating gear 26. At the same time, when the second push plate 23 moves upward, the outlet end of the second ventilation passage 20 will be exposed, and the clockwork spring 28 will be released. After the adjusting plate 21 rotates, the compressed gas in the second compressed gas chamber 19 will flow through the second ventilation passage 20 into the hot pressing chamber 7, so that the harmful gases in the hot pressing chamber 7 will flow through the air extraction passage 27 into the purification chamber 6 along with the released gas. Moreover, when the gas in the hot pressing chamber 7 flows rapidly, it will drive the heat on the surface of the printed circuit board assembly 8 to flow, accelerating the cooling of the printed circuit board assembly 8 and facilitating the unloading of the printed circuit board assembly 8. At the same time, when the clockwork spring 28 is released, it will drive the air extraction fan blade 24 to rotate rapidly. When the air extraction fan blade 24 rotates, it will further accelerate the entry of the harmful gases in the hot pressing chamber 7 into the purification chamber 6 through the filter screen plate 11, completing the absorption and purification of the harmful gases in the hot pressing chamber 7 and preventing the leakage of harmful gases. At the same time, the rotation of the air extraction fan blade 24 will also accelerate the dissipation of heat in the hot pressing chamber 7. When the upward movement of the processing top seat 2 is completed, the first communication chamber 32 and the second communication chamber 33 are communicated, and the gas in the purification chamber 6 will pass through the first communication chamber 32, the second communication chamber 33 and the blow pipe 31 to quickly dissipate heat and cool the hot pressing chamber 7 again. At the same time, the dust and impurities on the surface of the printed circuit board assembly 8 can also be removed.

[0069] Only certain exemplary embodiments of the present invention have been described by way of illustration. Without doubt, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A fully automatic hot pressing device for multi-layer printed circuit boards, comprising a processing base and a processing top base, characterized in that: A hot pressing chamber is arranged between the processing base and the processing top seat, a hot pressing assembly and a printed circuit board assembly are arranged in the hot pressing chamber, a down-pressing assembly is arranged below the processing top seat, a purification chamber, a second ventilation channel and an exhaust channel are arranged in the processing base, an exhaust fan blade is arranged in the exhaust channel, and when the processing top seat moves upward, the down-pressing assembly will cause the second ventilation channel to open and allow air to flow into the hot pressing chamber, thereby accelerating the flow of harmful gases generated by the hot pressing assembly heating the printed circuit board assembly in the hot pressing chamber, and driving the harmful gases in the hot pressing chamber to enter the purification chamber through the exhaust channel, and purifying and eliminating the harmful gases from the hot pressing chamber through the purification chamber.

2. A fully automatic hot pressing device for a multi-layer printed circuit board according to claim 1, characterized in that: The downward pressure assembly includes a first push plate, a second push plate and a third push plate. The first push plate pushes air into the second ventilation channel. The second push plate controls the opening and closing state of the air outlet end of the second ventilation channel. The third push plate controls the opening and closing state of the air inlet end of the second ventilation channel.

3. A fully automatic hot pressing device for a multi-layer printed circuit board according to claim 2, characterized in that: The processing base is also provided with a second connecting air cavity and a second compressed gas cavity. The second connecting air cavity is provided with a spring rod and a clamping member. Two adjacent groups of clamping members clamp and fix the printed circuit board assembly. The second compressed gas cavity is provided with an adjusting plate and an air inlet valve. The adjusting plate is close to the air inlet end of the second ventilation channel.

4. A fully automatic hot pressing device for a multi-layer printed circuit board according to claim 3, characterized in that: The first push plate is located in the second connecting air cavity, and pushes air in the second connecting air cavity into the second compressed air cavity, and pushes the clamping member to contact the printed circuit board assembly; A rotating shaft is arranged in the air extraction channel, the air extraction fan blades are arranged on the rotating shaft, a spring and a second rotating gear are also arranged on the rotating shaft, and the second push plate passes through the air extraction channel and is meshed and connected with the second rotating gear; A first rotating gear is fixedly installed on the outer side of the central axis of the adjustment plate, and a gear column is arranged on the third push plate, and is meshed and connected with the first rotating gear through the gear column.

5. The fully automatic hot pressing device for multi-layer printed circuit boards according to claim 1, characterized in that: A column is arranged on the outside of the processing base, a telescopic cylinder and a first connecting air cavity are arranged on the column, a connecting plate and a connecting column are arranged on the telescopic cylinder, and the telescopic cylinder is fixedly connected to the processing top seat, a first connecting cavity is arranged in the connecting column, and a filter screen plate and a second connecting cavity are arranged in the purification chamber.

6. A fully automatic hot pressing device for a multi-layer printed circuit board according to claim 5, characterized in that: An air blowing pipe is also provided in the hot pressing chamber, and a second connecting chamber is also provided at the other end of the air blowing pipe. Two adjacent second connecting chambers are connected through the first connecting chamber.

7. The fully automatic hot pressing device for multi-layer printed circuit boards according to claim 5, characterized in that: The processing top seat is provided with a first ventilation channel and a working chamber, the working chamber is provided with an air bag and a return spring, the hot pressing assembly includes an upper hot pressing plate and a lower hot pressing plate, and the air bag and the return spring are fixedly connected to the upper hot pressing plate.

8. The fully automatic hot pressing device for multi-layer printed circuit boards according to claim 7, characterized in that: The side edge of the connecting plate extends into the column and is provided with a first compressed gas cavity on the inner wall of the column. The air in the first compressed gas cavity enters the airbag through the first ventilation channel to prompt the upper hot pressing plate to move downward to heat the printed circuit board assembly.

9. A hot pressing method of a fully automatic hot pressing device for multi-layer printed circuit boards, which is based on the fully automatic hot pressing device for multi-layer printed circuit boards according to claims 1 to 8, characterized in that: The following steps are included: Step 1: The processing top seat moves down, the printed circuit board assembly is clamped, the airbag expands and drives the upper hot pressing plate to move down, and cooperates with the lower hot pressing plate to perform hot pressing on the printed circuit board assembly; Step 2: The processing top seat moves upward, and the second push plate moves upward to drive the exhaust fan blades to extract the harmful gas in the hot pressing chamber through the exhaust channel and the filter screen plate to the purification room for purification; Step 3: The gas in the second ventilation channel flows to the hot pressing chamber, accelerating the flow of harmful gases in the hot pressing chamber into the clean room and accelerating the cooling of the surface of the printed circuit board assembly.

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