Coated and stacked graphene cooling fin

Abstract

The invention provides a coated and stacked type graphene cooling fin. The coated and stacked graphene radiating fin comprises a cementing layer, at least one radiating material layer and an insulating layer. The cementing layer is provided with a top surface and a bottom surface which are opposite to each other, wherein the bottom surface is used for being attached to at least one heating element on a circuit board assembly. And the at least one heat dissipation material layer comprises a metal layer and a graphene layer, the metal layer is stacked on the top surface of the cementing layer, and the graphene layer is stacked on the metal layer. The insulating layer is stacked on the top surface of the cementing layer and at least wraps the peripheral side edge of the graphene layer.

Description

Technical Field

[0001] This case relates to a heat sink, especially a coated stacked graphene heat sink, which uses an insulating material to coat and stack heat dissipation material layers, effectively isolating the conductive layer from electronic components and increasing the reliability of the product. Background Art

[0002] At present, graphene copper foils on the market are all cut after being stacked and pressed together with multiple layers of materials, resulting in the exposure of graphene copper foils on the surrounding sides. Due to the conductive property of graphene copper foils, when pressed and covered on electronic components at different heights, because they cannot be flatly attached, the sides of the graphene copper foils may cause single electronic components or multiple electronic components at different positions to conduct, resulting in the inoperability of electronic products or even damage to electronic products.

[0003] In view of this, it is necessary to provide a coated stacked graphene heat sink that uses an insulating material to coat and stack heat dissipation material layers to insulate the heat dissipation material layer or the metal layer therein, so as to improve the conventional simple stacking method, effectively isolate the conductive layer from electronic components, increase the reliability of the product, and solve the deficiencies of the conventional technology. Summary of the Invention

[0004] The purpose of this case is to provide a coated stacked graphene heat sink that uses an insulating material to coat and stack heat dissipation material layers to insulate the heat dissipation material layer or the metal layer therein, so as to ensure that conductive layers such as graphene layers and metal layers in the heat dissipation material layer do not directly contact electronic components during use, which helps prevent possible short circuits and failures. Furthermore, the complete coating of multiple heat dissipation layers is achieved through the adhesive layer and the insulating layer, which helps improve the reliability of the product. When in use, it is avoided that the graphene layer and the metal layer in the heat dissipation layer become conductive layers and directly contact electronic components, reducing the risk of damage and failure, and thus improving the stability of the overall product and the reliability of long-term use.

[0005] Another object of the present invention is to provide a coated stacked graphene heat sink. A heat dissipation material layer composed of a graphene layer and a copper foil metal layer can be stacked on an insulating adhesive layer, and then at least the side edges of the graphene layer and the copper foil metal layer are covered by an insulating layer, an auxiliary adhesive layer or an adhesive layer, so as to achieve the effect of protecting the heat dissipation material layer and ensuring that when the coated stacked graphene heat sink is used, the graphene layer and the copper foil metal layer do not come into contact with other electronic components, thus avoiding the risk of damage and malfunction. In addition, when the insulating layer covers the side edge of the graphene layer, the top surface of the graphene layer is allowed to be exposed to come into large-area contact with air, further improving the heat dissipation efficiency. Moreover, when a plurality of heat dissipation material layers are arranged on the adhesive layer and the side edges of the graphene layer and the copper foil metal layer are covered by an insulating layer of transparent polyester film (mylar), an auxiliary adhesive layer is further provided on the outer peripheral side edge of each heat dissipation material layer to increase the adhesive protection of the insulating layer and the adhesive layer, ensuring the integrity of the coated stacked structure of each heat dissipation material layer, and thus improving the stability of the overall product and the reliability of long-term use.

[0006] To achieve the foregoing object, the present invention provides a coated stacked graphene heat sink. The coated stacked graphene heat sink includes an adhesive layer, at least one heat dissipation material layer and an insulating layer. The adhesive layer has a top surface and a bottom surface opposite to each other, wherein the bottom surface is used for adhering to at least one heating element on a circuit board assembly. At least one heat dissipation material layer includes a metal layer and a graphene layer, wherein the metal layer is stacked on the top surface of the adhesive layer, and the graphene layer is stacked on the metal layer. The insulating layer is stacked on the top surface of the adhesive layer and covers at least the outer peripheral side edge of the graphene layer.

[0007] In one embodiment, the insulating layer further covers a top surface of the graphene layer.

[0008] In one embodiment, the insulating layer covers the outer peripheral side edge of the metal layer.

[0009] In one embodiment, the coated stacked graphene heat sink further includes an auxiliary adhesive layer disposed between the adhesive layer and the insulating layer and covering the outer peripheral side edge of the metal layer.

[0010] In one embodiment, the adhesive layer and the auxiliary adhesive layer are composed of a double-sided adhesive.

[0011] In one embodiment, a top surface of the graphene layer is exposed through the insulating layer.

[0012] In one embodiment, the metal layer is composed of a copper foil.

[0013] In one embodiment, the insulating layer is composed of a transparent polyester film.

[0014] In one embodiment, the adhesive layer and at least one heat dissipation material layer are stacked in sequence along a vertical direction, and the vertical projections of at least one heat dissipation material layer are all within the vertical projection range of the adhesive layer.

[0015] In one embodiment, at least one heat dissipation material layer includes a plurality of heat dissipation material layers. The plurality of heat dissipation material layers are arranged on the top surface of the adhesive layer, and each of the plurality of heat dissipation material layers is respectively coated between the adhesive layer and the insulating layer.

[0016] To achieve the foregoing objectives, the present case further provides a coated stacked graphene heat sink. The coated stacked graphene heat sink includes an adhesive layer, at least one heat dissipation material layer, and an insulating layer. The adhesive layer has opposite top and bottom surfaces, wherein the bottom surface is used to adhere to at least one heat generating component on a circuit board assembly. At least one heat dissipation material layer, composed of a graphene material, is stacked on the top surface of the adhesive layer. The insulating layer is stacked on the top surface of the adhesive layer, and the outer peripheral edge of at least one heat dissipation material layer is coated by the adhesive layer and / or the insulating layer. Description of the Drawings

[0017] The following detailed description of the present case and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above content and are not intended to limit the present case.

[0018] Figure 1 It is a disassembled structural diagram showing the application of the coated stacked graphene heat sink of the first embodiment of the present case to a circuit board assembly.

[0019] Figure 2 It is a three-dimensional structural diagram showing the application of the coated stacked graphene heat sink of the first embodiment of the present case to a circuit board assembly.

[0020] Figure 3 It is a cross-sectional view of the coated stacked graphene heat sink of the first embodiment of the present case.

[0021] Figure 4 It is a cross-sectional view of the coated stacked graphene heat sink of the second embodiment of the present case.

[0022] Figure 5 It is a cross-sectional view of the coated stacked graphene heat sink of the third embodiment of the present case. Detailed Description of the Embodiments

[0023] Some exemplary embodiments embodying the features and advantages of the present case will be described in detail in the following description. It should be understood that the present case can have various variations in different aspects, all of which do not depart from the scope of the present case, and the descriptions and drawings therein are essentially for illustrative purposes and not for limiting the present case. For example, if the following content of the present disclosure describes a first feature being disposed on or above a second feature, it means that it includes embodiments in which the above-mentioned first feature and the above-mentioned second feature are in direct contact, and also includes embodiments in which additional features can be disposed between the above-mentioned first feature and the above-mentioned second feature, such that the above-mentioned first feature and the above-mentioned second feature may not be in direct contact. Additionally, repeated reference symbols and / or markings may be used in different embodiments of the present disclosure. These repetitions are for the purpose of simplification and clarity and are not used to limit the relationship between each embodiment and / or the described external structure. Furthermore, for the convenience of describing the relationship between a component or feature part in a drawing and another (plural) component or (plural) feature part, spatial relative terms such as "upper", "lower", "bottom", "top" and similar terms may be used. Except for the orientations shown in the drawings, the spatial relative terms are used to cover different orientations of the device during use or operation.

[0024] Figure 1 It is a disassembled structure diagram showing the application of the coated stacked graphene heat sink according to the first embodiment of the present case to a circuit board assembly. Figure 2 It is a three-dimensional structure diagram showing the application of the coated stacked graphene heat sink according to the first embodiment of the present case to a circuit board assembly. Figure 3 It is a cross-sectional view of the coated stacked graphene heat sink according to the first embodiment of the present case. In this embodiment, the present case provides a coated stacked graphene heat sink 1 including an adhesive layer 10, at least one heat dissipation material layer 20, and an insulating layer 30. The adhesive layer 10 has a top surface 12 and a bottom surface 11 opposite to each other. The bottom surface 11 of the adhesive layer 10 is used to be attached to at least one heat generating element 90 on a circuit board assembly 9. At least one heat dissipation material layer 20 includes a metal layer 21 and a graphene layer 22, where the metal layer 21 is stacked on the top surface 12 of the adhesive layer 10, and the graphene layer 22 is stacked on the metal layer 21. In this embodiment, the insulating layer 30 is stacked on the top surface 12 of the adhesive layer 10 and the top surface (i.e., the top surface 222 of the graphene layer 22) of at least one heat dissipation material layer 20, and at least covers the outer peripheral edge 221 of the graphene layer 22.

[0025] In this embodiment, the adhesive layer 10 is composed of a double-sided tape. The metal layer 21 is composed of a copper foil. Additionally, the insulating layer 30 can be composed of, for example, a transparent polyester film (Mylar). The polyester film is a transparent and bright film that can be closely attached to the top surface 222 and the outer peripheral edge 221 of the graphene layer 22, and can also be attached to the outer peripheral edge 211 of the metal layer 21, completely covering the top surface and the outer peripheral edge 201 of at least one heat dissipation material layer 20 (including the outer peripheral edge 211 of the metal layer 21 and the outer peripheral edge 221 of the graphene layer 22), and has excellent operating performance. In other embodiments, the insulating layer 30 can also be composed of polyethylene terephthalate (PET) or other polyester films, and the present case is not limited thereto.

[0026] In this embodiment, the adhesive layer 10, at least one heat dissipation material layer 20, and the insulating layer 30 are stacked in sequence along a vertical direction, and the areas of the insulating layer 30 and the adhesive layer 10 are both larger than the total area of at least one heat dissipation material layer 20. In one embodiment, at least one heat dissipation material layer 20, for example, includes a plurality of heat dissipation material layers 20 arranged on the top surface 12 of the adhesive layer 10, and the vertical projections of the plurality of heat dissipation material layers 20 are all within the vertical projection range of the adhesive layer 10. By increasing the areas of the upper insulating layer 30 and the lower adhesive layer 10, the heat dissipation material layer 20 in the middle sandwich can be completely covered in a way of upper and lower sandwich stacking. As Figure 3 shown, the outer peripheral edge 211 of the metal layer 21 and the outer peripheral edge 221 of the graphene layer 22 can be covered and protected by the insulating layer 30 and / or the adhesive layer 10. Thereby, when the stacked graphene heat sink 1 with covering is attached to the heating element 90 on the circuit board assembly 9 through the bottom surface 11 of the adhesive layer 10, the metal layer 21 or the graphene layer 22 in the heat dissipation material layer 20 will not contact the electronic components, reducing the risk of damage and failure, and thus improving the overall stability and reliability of the product during long-term use.

[0027] It should be noted that the stacked graphene heat sink 1 with covering does not affect the heat dissipation efficiency. Table 1 compares the heat dissipation efficiency of the stacked graphene heat sink 1 with covering in this case and the traditional exposed graphene heat sink. The stacked graphene heat sink 1 with covering in this case and the traditional exposed graphene heat sink are respectively attached to the heating element CTL and the heating element NAND on, for example, a solid-state drive, and their idle maximum temperature, full-speed operation maximum temperature, and full-speed operation + air-cooling maximum temperature are measured. From the comparison of the experimental results, it can be seen that the stacked graphene heat sink 1 with covering in this case can further provide a protection function without affecting the heat dissipation efficiency, increasing the reliability of the product. Of course, the present case is not limited thereto.

[0028] Table 1

[0029]

[0030] In addition, it should be noted that the stacking order of the adhesive layer 10, at least one heat dissipation material layer 20, and the insulating layer 30 can be adjusted according to actual application requirements, and the present case is not limited thereto. In this embodiment, the heat dissipation material layer 20 is stacked, for example but not limited to, the graphene layer 22 and the copper foil metal layer 21, and can be stacked on the top surface 12 of the adhesive layer 10 first and then covered with the insulating layer 30. In other embodiments, the heat dissipation material layer 20 can be, for example, a layered structure composed of graphene material and stacked on the top surface 12 of the adhesive layer 10 first. When the insulating layer 30 is further stacked on the top surface 12 of the adhesive layer 10, the outer peripheral edge 201 of the heat dissipation material layer 20 can be covered by the adhesive layer 10 and / or the insulating layer 30, so as to ensure that the possible conductive layer in the heat dissipation material layer 20 does not directly contact the electronic components when the stacked graphene heat sink 1 is used, which helps to prevent possible short circuits and failures.

[0031] Figure 4 It is a cross-sectional view of the stacked graphene heat sink with coating according to the second embodiment of the present case. In this embodiment, the stacked graphene heat sink with coating 1a is Figures 1 to 3 similar to the stacked graphene heat sink with coating 1 shown, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the top surface of the heat dissipation material layer 20 of the stacked graphene heat sink with coating 1a is not completely covered by the insulating layer 30a. That is, the insulating layer 30a only covers the outer peripheral edge 201 of the heat dissipation material layer 20 (including the outer peripheral edge 211 of the metal layer 21 and the outer peripheral edge 221 of the graphene layer 22), and the top surface 222 of the graphene layer 22 is further exposed through the insulating layer 30a. Since the upper graphene layer 22 of the heat dissipation material layer 20 is not attached with an insulating material and only the outer peripheral edge 221 of the graphene layer 22 is covered, the top surface 222 of the graphene layer 22 is allowed to be exposed to contact with air in a large area, which helps to further improve the heat dissipation efficiency. In one embodiment, the top surface 222 of the graphene layer 22 can be partially exposed. In other embodiments, the exposed ratio of the top surface 222 of the graphene layer 22 can also be adjusted according to actual application requirements, and the present case is not limited thereto and will not be repeated.

[0032] Figure 5 It is a cross-sectional view of the stacked graphene heat sink with coating according to the third embodiment of the present case. In this embodiment, the stacked graphene heat sink with coating 1b is Figures 1 to 3Similar to the encapsulated stacked graphene heat sink 1 shown, and the same component numbers represent the same components, structures, and functions, which will not be elaborated here. In this embodiment, the encapsulated stacked graphene heat sink 1b further includes an auxiliary adhesive layer 40 disposed between the adhesive layer 10 and the insulating layer 30b. Both the adhesive layer 10 and the auxiliary adhesive layer 40 can be constituted by, for example, a double-sided adhesive. When the insulating layer 30b made of a transparent polyester film (Mylar) is used for encapsulation, due to its poor ductility, when a plurality of heat dissipation material layers 20 are arranged on the top surface 12 of the adhesive layer 10, it is not easy to make the insulating layer 30b fit to the top surface 12 of the adhesive layer 10 on the narrow intervals between each other or the narrow edges on the periphery, so that the outer peripheral side edges 201 of each heat dissipation material layer 20 are completely encapsulated. In this embodiment, by disposing the auxiliary adhesive layer 40 on the outer peripheral side edge of each heat dissipation material layer 20, the insulating layer 30b encapsulates the outer peripheral side edge 221 of the graphene layer 22, and the auxiliary adhesive layer 40 encapsulates the outer peripheral side edge 211 of the metal layer 21, increasing the adhesive protection between the insulating layer 30b and the adhesive layer, ensuring the integrity of the structure of each heat dissipation material layer 20 formed into an encapsulated stacked structure, and thus improving the stability of the overall product and the reliability of long-term use. Of course, the present case is not limited thereto, and will not be elaborated further.

[0033] In summary, the present case provides an encapsulated stacked graphene heat sink, which uses an insulating material to encapsulate and stack heat dissipation material layers, encapsulating and insulating the heat dissipation material layer or the metal layer therein, so as to ensure that the graphene layer and the metal layer and other conductive layers in the heat dissipation material layer do not directly contact the electronic components during use, which helps to prevent possible short circuits and failures. Furthermore, the complete encapsulation of a plurality of heat dissipation layers is achieved through the adhesive layer and the insulating layer, which helps to improve the reliability of the product. When in use, it is avoided that the graphene layer and the metal layer in the heat dissipation layer become conductive layers and directly contact the electronic components, reducing the risk of damage and failure, and thus improving the stability of the overall product and the reliability of long-term use. The encapsulated stacked graphene heat sink in the present case is formed by stacking heat dissipation material layers composed of a graphene layer and a copper foil metal layer on an insulating adhesive layer, and then at least encapsulating the side edges of the graphene layer and the copper foil metal layer through an insulating layer, an auxiliary adhesive layer or an adhesive layer, which can achieve the effect of protecting the heat dissipation material layer, ensuring that the graphene layer and the copper foil metal layer do not contact other electronic components and cause the risk of damage and failure when the encapsulated stacked graphene heat sink is in use. In addition, when the insulating layer encapsulates the side edge of the graphene layer, the top surface of the graphene layer is allowed to be exposed to contact with the air in a large area, further improving the heat dissipation efficiency. Furthermore, when a plurality of heat dissipation material layers are arranged on the adhesive layer and the side edges of the graphene layer and the copper foil metal layer are encapsulated by an insulating layer made of a transparent polyester film (mylar), an auxiliary adhesive layer is further disposed on the outer peripheral side edge of each heat dissipation material layer to increase the adhesive protection between the insulating layer and the adhesive layer, ensuring the integrity of the structure of each heat dissipation material layer formed into an encapsulated stacked structure, and thus improving the stability of the overall product and the reliability of long-term use.

[0034] This case can be modified by those skilled in the art, but all modifications shall fall within the scope of protection as claimed in the appended claims.

[0035] Symbolic Explanation:

[0036] 1, 1a, 1b: Coated stacked graphene heat sinks

[0037] 10: Gluing layer

[0038] 11: Bottom surface

[0039] 12: Top surface

[0040] 20: Heat dissipation material layer

[0041] 201: Outer peripheral edge

[0042] 21: Metal layer

[0043] 211: Outer peripheral edge

[0044] 22: Graphene layer

[0045] 221: Outer peripheral edge

[0046] 222: Top surface

[0047] 30, 30a, 30b: Insulating layer

[0048] 40: Auxiliary gluing layer

[0049] 9: Circuit board assembly

[0050] 90: Heating element

Claims

1. A coated stacked graphene heat sink, comprising: An adhesive layer having a top surface and a bottom surface opposite to each other, wherein the bottom surface is used to adhere to at least one heat generating element on a circuit board assembly; At least one heat dissipation material layer including a metal layer and a graphene layer, wherein the metal layer is stacked on the top surface of the adhesive layer, and the graphene layer is stacked on the metal layer; and An insulating layer stacked on the top surface of the adhesive layer and covering at least the outer peripheral edge of the graphene layer.

2. The coated stacked graphene heat sink according to claim 1, wherein the insulating layer further covers a top surface of the graphene layer.

3. The coated stacked graphene heat sink according to claim 1, wherein the insulating layer covers the outer peripheral edge of the metal layer.

4. The coated stacked graphene heat sink according to claim 1, wherein a top surface of the graphene layer is exposed through the insulating layer.

5. The coated stacked graphene heat sink according to claim 1, further comprising an auxiliary adhesive layer disposed between the adhesive layer and the insulating layer and covering the outer peripheral edge of the metal layer.

6. The coated stacked graphene heat sink according to claim 5, wherein the adhesive layer and the auxiliary adhesive layer are formed by a double-sided tape.

7. The coated stacked graphene heat sink according to claim 1, wherein the metal layer is formed by a copper foil, and the insulating layer is formed by a transparent polyester film.

8. The coated stacked graphene heat sink according to claim 1, wherein the adhesive layer and the at least one heat dissipation material layer are stacked in sequence along a vertical direction, and the vertical projection of the at least one heat dissipation material layer is within the vertical projection range of the adhesive layer.

9. The coated stacked graphene heat sink according to claim 1, wherein the at least one heat dissipation material layer includes a plurality of heat dissipation material layers, the plurality of heat dissipation material layers are arranged on the top surface of the adhesive layer, and each of the plurality of heat dissipation material layers is respectively covered between the adhesive layer and the insulating layer.

10. A coated stacked graphene heat sink, comprising: An adhesive layer having a top surface and a bottom surface opposite to each other, wherein the bottom surface is used to adhere to at least one heat generating element on a circuit board assembly; At least one heat dissipation material layer formed of a graphene material, stacked on the top surface of the adhesive layer; and An insulating layer stacked on the top surface of the adhesive layer, and covering the outer peripheral edge of the at least one heat dissipation material layer by the adhesive layer and / or the insulating layer.

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