Damp-proof anti-oxidation light emitting diode pin connection packaging structure

Abstract

The invention provides a moisture-proof anti-oxidation light emitting diode pin connection packaging structure, which relates to the technical field of packaging structures and comprises a packaging box, a surface-mounted heating resistor, a first trigger switch and a second trigger switch. Full-automatic control over the packaging process is achieved through the synergistic effect of the elastic piece and the trigger switches, when the packaging box is closed, the elastic piece is pressed to deform so that the first trigger switch and the second trigger switch can be switched on, and the patch type heating resistor starts to heat the hot melt adhesive piece; when the hot melt adhesive melts to fill the gap and overflows to the sealing groove, the elastic sheet is reset due to pressure release, the trigger switch is switched off, the heating resistor is automatically powered off, and the LED recovers light, the mechanism does not need external control equipment, and the whole process of heating-sealing-power-off is accurately completed through dynamic feedback of physical deformation and the hot melt adhesive state. And while the compactness of the sealing layer is ensured, the packaging time is shortened to 1 / 3 of that of a traditional process, and the production efficiency and the energy utilization rate are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging structures, and in particular to a moisture-proof and antioxidant light-emitting diode pin connection packaging structure. Background Art

[0002] A light-emitting diode is a semiconductor device that converts electrical energy into light energy through the principle of electroluminescence. Its core structure is a PN junction. When current passes through, electrons and holes recombine to release photons, achieving light emission. The packaging of light-emitting diodes is a key link in determining their performance, lifespan, and application scenarios.

[0003] In traditional LED packaging processes, the connection between pins and power lines usually relies on potting glue or epoxy resin for sealing, which requires curing through an external heating device. The process is cumbersome and time-consuming. Moreover, the gap between the pins and the package body easily causes water vapor to penetrate, accelerating pin oxidation and affecting the lifespan of the LED. In addition, the external heating device needs to continuously work until the glue is cured, resulting in low energy utilization efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide a moisture-proof and antioxidant light-emitting diode pin connection packaging structure to solve the problem of the cumbersome and time-consuming traditional light-emitting diode pin packaging process described in the above background.

[0005] To solve the above technical problems, the technical solution adopted by the present invention is a moisture-proof and antioxidant light-emitting diode pin connection packaging structure, including: a light-emitting diode to be packaged and a packaging box. An anode pin and a cathode pin are provided at the bottom of the light-emitting diode to be packaged, and the anode pin and the cathode pin are connected to a power line through soldering.

[0006] The packaging box wraps around the outside of the connection of the anode pin, cathode pin, and power line of the light-emitting diode to be packaged. A heat-melt film is provided inside the packaging box, and a patch-type heating resistor is also provided inside the packaging box. The patch-type heating resistor is electrically connected to a first trigger switch and a second trigger switch, and the first trigger switch and the second trigger switch are disconnected after the heat-melt film melts.

[0007] Further, the packaging box includes an upper packaging cover and a lower packaging cover. One side of the upper packaging cover and the lower packaging cover is rotatably connected through a hinge, and the other side of the upper packaging cover and the lower packaging cover is snap-fitted. The upper packaging cover and the lower packaging cover form an openable and closable closed cavity through the hinge and the snap, providing physical protection for the pins and the power line. The snap structure ensures tightness when closed, preventing external water vapor from invading.

[0008] Further, elastic sheets are provided on the encapsulation upper cover and the encapsulation lower cover. One side of the elastic sheet is fixedly connected to the encapsulation upper cover and the encapsulation lower cover, and the other three sides of the elastic sheet are separated from the encapsulation upper cover and the encapsulation lower cover. The cross-section of the elastic sheet is trapezoidal. The thickness of the side of the elastic sheet fixedly connected to the encapsulation upper cover and the encapsulation lower cover is less than the thickness of the opposite side. In the unloaded state, the outer surface of the elastic sheet is flush with the outer walls of the encapsulation upper cover and the encapsulation lower cover, and the inner surface of the elastic sheet protrudes from the inner walls of the encapsulation upper cover and the encapsulation lower cover. The elastic sheet is deformed by extrusion when the encapsulation box is closed, triggering the conduction of the heating resistance circuit; the trapezoidal cross-section design generates elastic force during reset, assisting the hot melt adhesive to fill the sealing gap, and at the same time the protruding inner surface ensures reliable contact of the trigger switch.

[0009] Further, the patch-type heating resistance is pasted on the inner side of the elastic sheet, directly attaching the heating resistance to the hot melt film, shortening the heat transfer path, improving the heating efficiency. At the same time, the deformation of the elastic sheet drives the synchronous displacement of the heating resistance, ensuring the coordination of the circuit trigger and the hot melting process.

[0010] Further, the positive electrode of the patch-type heating resistance is electrically connected to the first trigger switch. One end of the first trigger switch is electrically connected to the anode pin of the light-emitting diode to be encapsulated. The first trigger switch includes a first elastic contact piece and a first fixed contact piece. The first elastic contact piece is pasted at the thicker end of the elastic sheet and is connected to the positive electrode of the patch-type heating resistance. First sealing grooves are provided at one ends of the encapsulation upper cover and the encapsulation lower cover close to the light-emitting diode to be encapsulated. The first fixed contact piece is clamped in the first sealing groove and contacts the anode pin of the light-emitting diode to be encapsulated. The first trigger switch is closed when the elastic sheet is pressed, connecting the heating resistance to the anode pin circuit. The fixed contact piece in the sealing groove ensures stable contact between the pin and the contact piece, and at the same time the sealing groove guides the hot melt adhesive to fill the gap between the pin and the box body.

[0011] Further, the second trigger switch is electrically connected to the negative electrode of the patch-type heating resistance. One end of the second trigger switch is electrically connected to the cathode pin of the light-emitting diode to be encapsulated. The second trigger switch includes a second elastic contact piece and a second fixed contact piece. The second elastic contact piece is pasted at the thicker end of the elastic sheet and is connected to the negative electrode of the patch-type heating resistance. The second fixed contact piece is clamped in the first sealing groove and contacts the cathode pin of the light-emitting diode to be encapsulated. The second trigger switch cooperates with the first trigger switch to form a complete circuit of the heating resistance; the double-trigger structure ensures the reliability of circuit conduction, and at the same time the fixed contact piece in the sealing groove realizes the electrical connection and physical sealing of the cathode pin.

[0012] Furthermore, a hot-melt film is provided inside each of the encapsulation upper cover and the encapsulation lower cover. The hot-melt film is consistent with the internal dimensions of the encapsulation upper cover and the encapsulation lower cover. After the hot-melt film is heated and melted, it fills the pin gaps and the box body gaps to form a continuous sealing layer, isolating water vapor and oxygen. The design consistent with the box body size ensures the sealing integrity.

[0013] Furthermore, two first inner openings are provided inside the first sealing groove, and a first outer opening is provided outside the first sealing groove. The positions of the two groups of first inner openings and the first outer opening respectively correspond to the positions of the anode pins and the cathode pins of the light-emitting diode to be encapsulated. The stepped opening design guides the molten hot-melt adhesive to overflow and fill the sealing groove to form a double seal. The misaligned structure of the inner opening and the outer opening enhances the sealing between the pins and the box body, preventing water vapor from penetrating.

[0014] Furthermore, a second sealing groove is provided at one end of the encapsulation upper cover and the encapsulation lower cover close to the power line. A second inner opening is provided inside the second sealing groove, and a second outer opening is provided outside the second sealing groove. The positions of the second inner opening and the second outer opening correspond to the position of the power line. The second sealing groove and the first sealing groove work together to seal the pins and the power line respectively. The misaligned design of the inner and outer openings ensures the sealing between the power line and the box body, preventing water vapor from invading at the multi-interface.

[0015] Furthermore, the diameter of the first outer opening is larger than the diameters of the anode pin and the cathode pin, the diameter of the first inner opening is larger than the diameter of the first outer opening, the diameter of the second outer opening is larger than the diameter of the second outer opening, and the diameter of the second inner opening is larger than the diameter of the second outer opening. The stepped opening forms a "narrow opening - wide opening" structure, allowing the hot-melt adhesive to overflow and solidify into a boss, enhancing the mechanical strength of the sealing layer; the larger inner opening ensures that the hot-melt adhesive is fully filled, and the smaller outer opening restricts the excessive loss of the adhesive liquid, optimizing the sealing effect.

[0016] Compared with the prior art, the beneficial effects of the present invention include:

[0017] A moisture-proof and antioxidant light-emitting diode pin connection encapsulation structure proposed by the present invention realizes the full-automatic control of the encapsulation process through the cooperation of the elastic sheet and the trigger switch: when the encapsulation box is closed, the elastic sheet is deformed under pressure to conduct the first and second trigger switches, and the patch-type heating resistor starts to heat the hot-melt film; when the hot-melt adhesive melts and fills the gap and overflows to the sealing groove, the elastic sheet resets due to the release of pressure, the trigger switch is disconnected, and the heating resistor automatically cuts off the power, and the LED resumes emitting light. This mechanism does not require external control equipment. Through the dynamic feedback of physical deformation and the state of the hot-melt adhesive, it accurately completes the full process of heating - sealing - power-off, ensuring the density of the sealing layer while shortening the encapsulation time to 1 / 3 of the traditional process, significantly improving the production efficiency and energy utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure of the present invention will be described with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the drawings, the same reference numerals are used to refer to the same components. Among them:

[0019] Figure 1 Schematically shows a schematic diagram of the open structure of the packaging box of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention;

[0020] Figure 2 Schematically shows a schematic diagram of a partial structure of the packaging box of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention;

[0021] Figure 3 Schematically shows a schematic diagram of the structure of an elastic sheet of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention in an uncompressed state;

[0022] Figure 4 Schematically shows a schematic diagram of the structure of an elastic sheet of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention in a compressed state;

[0023] Figure 5 Schematically shows a schematic diagram of a cross-sectional structure of an elastic sheet of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention in an uncompressed state;

[0024] Figure 6 Schematically shows a schematic diagram of a cross-sectional structure of an elastic sheet of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention in a compressed state;

[0025] Figure 7 Schematically shows a schematic diagram of a detection circuit of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention;

[0026] Figure 8 Schematically shows a schematic diagram of the structure of a patch-type heating resistor, a first trigger switch and a second trigger switch of a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention;

[0027] Figure 9 Schematically shows a moisture-proof, antioxidant light-emitting diode pin connection packaging structure according to an embodiment of the present invention Figure 2 The enlarged schematic diagram at position A;

[0028] Figure 10Schematically shows a moisture-proof, antioxidant light-emitting diode pin connection and packaging structure according to an embodiment of the present invention Figure 2 The enlarged structural schematic diagram at position B in

[0029] Reference numerals in the figure: 1, light-emitting diode to be packaged; 2, anode pin; 3, cathode pin; 4, power line; 5, packaging box; 501, upper packaging cover; 502, lower packaging cover; 6, buckle; 7, elastic sheet; 8, patch-type heating resistor; 9, first trigger switch; 901, first elastic contact piece; 902, first fixed contact piece; 10, second trigger switch; 1001, second elastic contact piece; 1002, second fixed contact piece; 11, first sealing groove; 1101, first inner opening; 1102, first outer opening; 12, second sealing groove; 1201, second inner opening; 1202, second outer opening; 13, hot melt film. Specific embodiments

[0030] It is easy to understand that according to the technical solution of the present invention, without changing the essence of the present invention, those of ordinary skill in the art can propose various replaceable structural ways and implementation ways. Therefore, the following specific embodiments and the accompanying drawings are only exemplary descriptions of the technical solution of the present invention, and should not be regarded as the whole of the present invention or as a limitation or restriction on the technical solution of the present invention.

[0031] The implementation object of the present invention is the light-emitting diode 1 to be packaged. The light-emitting diode 1 to be packaged is provided with an anode pin 2 and a cathode pin 3. The anode pin 2 and the cathode pin 3 are key components for connecting the light-emitting diode 1 to be packaged to an external power supply, used for transmitting electric energy to ensure that the light-emitting diode 1 can obtain normal power supply and emit light. The anode pin 2 and the cathode pin 3 are connected with a power line 4 through soldering. The power line 4 provides a stable power input for the light-emitting diode 1 to be packaged, ensuring its continuous and stable light emission, and together with the anode pin 2 and the cathode pin 3, constitutes a channel for electric energy transmission.

[0032] Example 1: According to the embodiment of the present invention in combination with Figures 1-10Shown. A moisture-proof and antioxidant light-emitting diode pin connection packaging structure, including a packaging box 5. The packaging box 5 provides a closed space for the entire packaging structure, which can effectively block external moisture and oxygen, play a role in moisture-proof and antioxidant, and protect internal components such as the light-emitting diode 1 and its pins. The packaging box 5 includes a packaging upper cover 501 and a packaging lower cover 502. The packaging upper cover 501 and the packaging lower cover 502 cooperate with each other to jointly form the complete structure of the packaging box 5. The two wrap the light-emitting diode 1 to be packaged and its pins through a specific connection method to form a relatively independent space. One side of the packaging upper cover 501 and the packaging lower cover 502 is rotatably connected by a hinge. This connection method enables the packaging upper cover 501 and the packaging lower cover 502 to be conveniently opened and closed, facilitating the placement of the light-emitting diode 1 to be packaged into the interior of the packaging box 5 for packaging operations. The other side of the packaging upper cover 501 and the packaging lower cover 502 is snap-fitted and connected by a snap 6. The snap 6 can ensure the tight combination of the packaging upper cover 501 and the packaging lower cover 502, prevent the packaging box 5 from accidentally opening during use, and ensure the stability and sealing of the packaging structure.

[0033] Elastic sheets 7 are provided on the packaging upper cover 501 and the packaging lower cover 502. The elastic sheets 7 play a key role in triggering and assisting in sealing during the packaging process. One side of the elastic sheet 7 is fixedly connected to the packaging upper cover 501 and the packaging lower cover 502, and the other three sides of the elastic sheet 7 are separated from the packaging upper cover 501 and the packaging lower cover 502. The cross-section of the elastic sheet 7 is trapezoidal. The thickness of the side of the elastic sheet 7 fixedly connected to the packaging upper cover 501 and the packaging lower cover 502 is less than the opposite side. The elastic sheet 7 has elasticity. In the unloaded state, the outer surface of the elastic sheet 7 is flush with the outer walls of the packaging upper cover 501 and the packaging lower cover 502, and the inner surface of the elastic sheet 7 protrudes from the inner walls of the packaging upper cover 501 and the packaging lower cover 502. When the packaging upper cover 501 and the packaging lower cover 502 are closed and squeeze the hot melt adhesive film 13, the elastic sheet 7 will be squeezed and deformed. Its deformation can trigger subsequent circuit connections. At the same time, during the melting and curing process of the hot melt adhesive, the elastic force of the elastic sheet 7 helps the hot melt adhesive to better fill the space and achieve sealing.

[0034] A patch-type heating resistor 8 is pasted on the inner side of the elastic sheet 7. The patch-type heating resistor 8 is a key component for realizing hot melt encapsulation and can convert electrical energy into heat energy. The positive pole of the patch-type heating resistor 8 is connected to a first trigger switch 9. One end of the first trigger switch 9 is connected to the anode pin 2 of the light-emitting diode 1 to be encapsulated. The first trigger switch 9 includes a first elastic contact piece 901 and a first fixed contact piece 902. The first elastic contact piece 901 is pasted at the thicker end of the elastic sheet 7. The first elastic contact piece 901 is connected to the positive pole of the patch-type heating resistor 8. At one end of the upper encapsulation cover 501 and the lower encapsulation cover 502 close to the light-emitting diode 1 to be encapsulated, a first sealing groove 11 is provided. The first fixed contact piece 902 is clamped in the first sealing groove 11. The first fixed contact piece 902 contacts the anode pin 2 of the light-emitting diode 1 to be encapsulated. When the elastic sheet 7 is extruded and deformed, the first elastic contact piece 901 contacts the first fixed contact piece 902, so that the patch-type heating resistor 8 is connected to the anode pin 2 of the light-emitting diode 1 to be encapsulated, providing power for the patch-type heating resistor 8 and enabling it to generate heat.

[0035] The negative pole of the patch-type heating resistor 8 is connected to a second trigger switch 10. One end of the second trigger switch 10 is connected to the cathode pin 3 of the light-emitting diode 1 to be encapsulated. The second trigger switch 10 includes a second elastic contact piece 1001 and a second fixed contact piece 1002. The second elastic contact piece 1001 is pasted at the thicker end of the elastic sheet 7. The second elastic contact piece 1001 is connected to the negative pole of the patch-type heating resistor 8. The second fixed contact piece 1002 is clamped in the first sealing groove 11. The second fixed contact piece 1002 contacts the cathode pin 3 of the light-emitting diode 1 to be encapsulated. Cooperating with the first trigger switch 9, when the elastic sheet 7 deforms, the second elastic contact piece 1001 contacts the second fixed contact piece 1002, connecting the patch-type heating resistor 8 to the cathode pin 3 of the light-emitting diode 1 to be encapsulated, thus forming a complete circuit and enabling the patch-type heating resistor 8 to work normally and generate heat.

[0036] One hot melt film 13 is provided inside each of the upper encapsulation cover 501 and the lower encapsulation cover 502. The hot melt film 13 is the same size as the inner part of the upper encapsulation cover 501 and the lower encapsulation cover 502. The hot melt film 13 will melt under the heat generated by the patch-type heating resistor 8. The melted hot melt glue can fill the space around the anode pin 2 and the cathode pin 3 of the light-emitting diode 1 to be encapsulated, as well as the gap between the upper encapsulation cover 501 and the lower encapsulation cover 502, forming a sealing layer, effectively preventing water vapor and oxygen from entering, and playing a role in moisture-proof and antioxidant.

[0037] Two first inner openings 1101 are provided inside the first sealing groove 11, and a first outer opening 1102 is provided outside the first sealing groove 11. The positions of the two groups of first inner openings 1101 and the first outer opening 1102 respectively correspond to the positions of the anode pin 2 and the cathode pin 3 of the light-emitting diode 1 to be encapsulated. The diameter of the first outer opening 1102 is larger than the diameters of the anode pin 2 and the cathode pin 3, and the diameter of the first inner opening 1101 is larger than the diameter of the first outer opening 1102. The first sealing groove 11 and its corresponding opening structure can guide the excess hot melt adhesive into it after the hot melt adhesive melts, further enhancing the sealing effect between the anode pin 2 and the cathode pin 3 and the encapsulation box 5. At the same time, this stepped opening design helps the hot melt adhesive to better fill and seal, preventing external water vapor and oxygen from entering through the connection between the pins and the encapsulation box 5.

[0038] A second sealing groove 12 is provided at one end of the upper encapsulation cover 501 and the lower encapsulation cover 502 close to the power line 4. A second inner opening 1201 is provided inside the second sealing groove 12, and a second outer opening 1202 is provided outside the second sealing groove 12. The positions of the second inner opening 1201 and the second outer opening 1202 correspond to the position of the power line 4. The diameter of the second outer opening 1202 is larger than the diameter of the second outer opening 1202 (should be a typo, assume it means larger than the diameter of the power line 4), and the diameter of the second inner opening 1201 is larger than the diameter of the second outer opening 1202. The function of the second sealing groove 12 and its opening structure is similar to that of the first sealing groove 11, sealing the connection between the power line 4 and the encapsulation box 5 to prevent water vapor and oxygen from entering the interior of the encapsulation box 5 from the introduction point of the power line 4, and working together with the first sealing groove 11 to comprehensively improve the moisture-proof and antioxidant performance of the encapsulation structure.

[0039] Working principle: First, in the standby state, the elastic piece 7 is not under pressure. The outer surface of the elastic piece 7 is flush with the outer walls of the upper encapsulation cover 501 and the lower encapsulation cover 502, and the inner surface of the elastic piece 7 protrudes from the inner walls of the upper encapsulation cover 501 and the lower encapsulation cover 502. At this time, both the first trigger switch 9 and the second trigger switch 10 are off. Specifically, the side of the elastic piece 7 protruding from the inner walls of the upper encapsulation cover 501 and the lower encapsulation cover 502 lifts the first elastic contact piece 901 and the second elastic contact piece 1001, so that the first elastic contact piece 901 does not contact the first fixed contact piece 902, and the second elastic contact piece 1001 does not contact the second fixed contact piece 1002.

[0040] When performing encapsulation, first, the anode pin 2 and the cathode pin 3 of the light-emitting diode 1 to be encapsulated are clamped between the upper encapsulation cover 501 and the lower encapsulation cover 502. Two hot-melt films 13 inside the upper encapsulation cover 501 and the lower encapsulation cover 502 clamp the anode pin 2 and the cathode pin 3 of the light-emitting diode 1 to be encapsulated in the middle. When the upper encapsulation cover 501 and the lower encapsulation cover 502 are fastened by the buckle 6, the hot-melt film 13 will be squeezed, and thus the hot-melt film 13 will also squeeze the elastic sheet 7, squeezing the elastic sheet 7 outwards, so that the inner side of the elastic sheet 7 is flush with the inner walls of the upper encapsulation cover 501 and the lower encapsulation cover 502. At this time, the first elastic contact piece 901 will contact the first fixed contact piece 902, and the second elastic contact piece 1001 will contact the second fixed contact piece 1002. At the same time, the first fixed contact piece 902 and the second fixed contact piece 1002 will respectively contact the anode pin 2 and the cathode pin 3 of the light-emitting diode 1 to be encapsulated, and further make the patch-type heating resistor 8 form a parallel connection with the light-emitting diode 1 to be encapsulated.

[0041] After the encapsulation box 5 is installed, it is necessary to perform power-on detection on the light-emitting diode 1 to be encapsulated according to the traditional process. Since the patch-type heating resistor 8 and the light-emitting diode 1 to be encapsulated are in a parallel state, and the resistance value of the patch-type heating resistor 8 is small, the light-emitting diode 1 to be encapsulated is regarded as short-circuited and cannot emit light until the patch-type heating resistor 8 heats and melts the hot-melt film 13. Under the elastic extrusion of the elastic sheet 7, the melted hot-melt film 13 will fill the space between the two hot-melt films 13, completely sealing the anode pin 2 and the cathode pin 3 of the light-emitting diode 1 to be encapsulated. At the same time, the melted hot-melt glue will fill the gap between the upper encapsulation cover 501 and the lower encapsulation cover 502. In addition, the excess melted hot-melt glue will also enter the first sealing groove 11 and the second sealing groove 12 through the first inner opening 1101 and the second inner opening 1201, so that the pressure inside the encapsulation box 5 decreases, and the elastic sheet 7 will return to its original position without pressure, so that the first elastic contact piece 901 is separated from the first fixed contact piece 902, and the second elastic contact piece 1001 is separated from the second fixed contact piece 1002, so that the patch-type heating resistor 8 is powered off, and the light-emitting diode 1 to be encapsulated will be connected and emit light, which marks the completion of the encapsulation. This encapsulation scheme has high tightness, can effectively prevent moisture and oxidation, and at the same time integrates the hot-melt encapsulation process into the power-on detection process, saving the encapsulation time and improving the efficiency.

[0042] The technical scope of the present invention is not limited to the content described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical idea of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure, characterized in that: include: A light-emitting diode to be packaged and a packaging box, wherein an anode pin and a cathode pin are arranged at the bottom of the light-emitting diode to be packaged, and the anode pin and the cathode pin are connected to a power line through solder; The packaging box is wrapped around the outside of the anode pin, cathode pin and power line connection of the light-emitting diode to be packaged, and a hot-melt adhesive sheet is arranged in the packaging box. A surface-mount heating resistor is also arranged in the packaging box. The surface-mount heating resistor is electrically connected to a first trigger switch and a second trigger switch. The first trigger switch and the second trigger switch are electrically connected to the anode pin and the cathode pin respectively, and the first trigger switch and the second trigger switch are disconnected after the hot-melt adhesive sheet is heated and melted.

2. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 1, characterized in that: The packaging box comprises a packaging upper cover and a packaging lower cover, one side of the packaging upper cover and the packaging lower cover are rotatably connected by a hinge, and the other side of the packaging upper cover and the packaging lower cover are connected by a buckle.

3. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 2, characterized in that: An elastic sheet is provided on the package upper cover and the package lower cover, one side of the elastic sheet is fixedly connected to the package upper cover and the package lower cover, and the other three sides of the elastic sheet are separated from the package upper cover and the package lower cover. The cross-section of the elastic sheet is a trapezoid, and the thickness of the side of the elastic sheet fixedly connected to the package upper cover and the package lower cover is less than the thickness of the other side opposite thereto. In an unstressed state, the outer surface of the elastic sheet is flush with the outer wall of the package upper cover and the package lower cover, and the inner surface of the elastic sheet protrudes from the inner wall of the package upper cover and the package lower cover.

4. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 3, characterized in that: The patch type heating resistor is pasted on the inner side of the elastic sheet.

5. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 2, characterized in that: One end of the first trigger switch is electrically connected to the anode pin of the light-emitting diode to be packaged. The first trigger switch includes a first elastic contact and a first fixed contact. The first elastic contact is pasted on the thicker end of the elastic sheet. The first elastic contact is connected to the positive electrode of the chip heating resistor. The packaging upper cover and the packaging lower cover are provided with a first sealing groove at one end close to the light-emitting diode to be packaged. The first fixed contact is clamped in the first sealing groove. The first fixed contact is in contact with the anode pin of the light-emitting diode to be packaged.

6. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 2, characterized in that: One end of the second trigger switch is electrically connected to the negative electrode of the SMD heating resistor, and one end of the second trigger switch is electrically connected to the cathode pin of the light-emitting diode to be packaged. The second trigger switch includes a second elastic contact and a second fixed contact. The second elastic contact is pasted on the thicker end of the elastic sheet, the second elastic contact is connected to the negative electrode of the SMD heating resistor, the second fixed contact is clamped in the first sealing groove, and the second fixed contact is in contact with the cathode pin of the light-emitting diode to be packaged.

7. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 2, characterized in that: A hot melt adhesive sheet is respectively arranged inside the packaging upper cover and the packaging lower cover, and the hot melt adhesive sheet has the same internal size as the packaging upper cover and the packaging lower cover.

8. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 5, characterized in that: The first sealing groove has two first inner openings on its inner side and a first outer opening on its outer side. Positions of the two groups of the first inner openings and the first outer openings correspond to the positions of the anode pin and cathode pin of the light emitting diode to be packaged.

9. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 8, characterized in that: A second sealing groove is formed at one end of the upper and lower packaging covers close to the power cord, a second inner opening is formed inside the second sealing groove, and a second outer opening is formed outside the second sealing groove. The positions of the second inner opening and the second outer opening correspond to the positions of the power cord.

10. The moisture-proof and oxidation-resistant light-emitting diode pin connection packaging structure according to claim 9, characterized in that: The diameter of the first outer opening is larger than the diameters of the anode pin and the cathode pin, the diameter of the first inner opening is larger than the diameter of the first outer opening, the diameter of the second outer opening is larger than the diameter of the second outer opening, and the diameter of the second inner opening is larger than the diameter of the second outer opening.

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