Light-emitting diode (LED) of lamp string side tangent line

Abstract

The invention relates to the technical field of LED lamp string manufacturing, and discloses a lamp string side tangent LED light-emitting diode, which comprises an insulating substrate, the front surface of the insulating substrate is provided with a light-emitting wafer die bonding area, a bonding wire area and a control chip bonding pad, and the back surface of the insulating substrate is provided with a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad; the third bonding pad and the fourth bonding pad are located on the same horizontal line, and isolation regions with the spacing of 0.05 mm-1. 5mm are formed at intervals in the middle through hollow structures; the power supply parallel circuit comprises a power supply positive electrode end and a power supply negative electrode end which are respectively connected to the first bonding pad and the second bonding pad; a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are arranged on the back surface of an insulating substrate, and a plurality of circuit boards are sequentially connected in series and in parallel by adopting a power supply parallel circuit and a signal series circuit; according to the design, the welding steps and the complex wiring process are reduced, the wiring packaging process is effectively simplified, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED light string manufacturing, and specifically to an LED light-emitting diode with a side tangent for the light string. Background Art

[0002] By using encapsulation glue to encapsulate light-emitting diodes (English full name: light-emitting diode, abbreviation: LED) and drive IC chips in the fixed functions of an LED PCB board to form LED lamp beads, and then connecting multiple LED lamp beads in series and parallel through power lines, signal lines, etc. to form an LED light string, it has become the mainstream processing method of LED light strings on the market at present.

[0003] After retrieval, a patent with Chinese patent number CN116885083A discloses an LED light-emitting diode, which includes a housing, a lamp core assembly and two conductive pins, and also includes a mounting seat arranged in the housing. The mounting seat includes an upper seat body and a lower seat body; the upper seat body is fixedly connected to the housing, and a pair of first conductive terminals are arranged at the bottom of the upper seat body. The lamp core assembly is arranged on the top of the upper seat body, and the first conductive terminals are electrically connected to the lamp core assembly through first conductive wires arranged in the upper seat body; the lower seat body is rotatably embedded in the housing and is located below the lower seat body. A pair of second conductive terminals and a pair of third conductive terminals are arranged at intervals along the circumference on the top of the lower seat body; a receiving cavity is arranged inside the lower seat body, and a rectification module is arranged in the receiving cavity. The upper ends of the conductive pins are respectively electrically connected to the second conductive terminals and the input end of the rectification module; the third conductive terminals are electrically connected to the output end of the rectification module.

[0004] In the manufacturing process of the above-mentioned LED light string, limited by the structure of the LED bracket and the pin pitch, the power line and the signal line are directly welded to the pins, and then the part of the signal line located between the two pins is cut off to obtain a signal input line and a signal transmission line. However, the power line and the signal line are prone to soldering defects or insecure soldering during welding. The signal line needs to be cut off in advance, and cutting off in advance is not convenient for welding. At the same time, there will also be problems such as incomplete wire filaments being cut off, resulting in short circuits, and it is also easy to cause pin deformation, resulting in a high defective rate of the light strip and poor reliability, and there is a risk of failure during the service life. Based on this, the present invention designs an LED light-emitting diode with a side tangent for the light string to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide an LED light-emitting diode with a side tangent for the light string, which solves the problems of inconvenient soldering and pin deformation in the background art.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: An LED light-emitting diode with a side tangent for the light string, comprising: An insulating substrate, on the front surface of which there are a light-emitting chip die-bonding area, a wire-bonding area, and a control chip pad, and on the back surface of which there are a first pad, a second pad, a third pad, and a fourth pad; The third pad and the fourth pad are located on the same horizontal line, and an isolation area with a spacing of 0.05 mm - 1.5 mm is formed by being separated by a hollow structure in the middle; A power parallel circuit, including a positive power terminal and a negative power terminal, which are respectively connected to the first pad and the second pad; A signal series circuit, including a signal input terminal and a signal output terminal, which are respectively connected to the third pad and the fourth pad; A circuit board is cascaded through the power parallel circuit and the signal series circuit in sequence, and an RGB three-color light-emitting chip and a control IC are installed on the circuit board; The pin definitions of the control IC are: the first pin is connected to the positive power terminal, the second pin is connected to the negative power terminal, the third pin is connected to the signal input terminal, and the fourth pin is connected to the signal output terminal.

[0007] Preferably, the wire diameters of the first pad, the second pad, the third pad, and the fourth pad range from 0.4 mm to 1.5 mm, and the spacing between adjacent pads satisfies: the spacing between the first pad and the second pad is 0.5 mm - 1 mm, the spacing between the second pad and the third pad is 0.05 mm - 0.9 mm, and the third pad and the fourth pad are separated by the hollow structure with a spacing of 0.05 mm - 1.5 mm.

[0008] Preferably, the area ratio range of the light-emitting chip die-bonding area to the wire-bonding area is (1:0.5) - (1:2), which is used to ensure the stable die-bonding of the light-emitting chip, the reliability of wire-bonding, and meet the electrical connection requirements inside the device.

[0009] Preferably, the connection line between the control IC10 and the RGB three-color light-emitting chip adopts an impedance matching design, and its characteristic impedance Z satisfies the formula: , where L is the line inductance and C is the line capacitance. In the case of a signal transmission frequency of f, the integrity of signal transmission is ensured, where the range of f is 1 MHz - 100 MHz, which is used to ensure the signal control accuracy and stability of the lamp string.

[0010] Preferably, the thickness range of the insulating substrate is 0.2 mm - 0.8 mm, its material is ceramic or composite insulating material, and the thermal conductivity λ of the insulating substrate ≥ 1.0 W / (m K), which is used to meet the heat dissipation requirements during the operation of the device and ensure the performance of the LED light-emitting diode. The top of the insulating substrate is also provided with a light-emitting chip die-bonding area and a control chip pad.

[0011] Preferably, the wiring width range of the power supply parallel circuit and the signal series circuit is 0.3 mm - 1.2 mm. At the connection between adjacent circuit boards, the line spacing of the wiring gradually expands, and the expansion angle α is 30° - 60°, which is used to improve the anti-interference ability and connection reliability of the circuit; the signal transmission rate of the power supply parallel circuit satisfies: Tprop≤(1 / 10) Tclock, where Tprop is the signal transmission delay time and Tclock is the clock period of the control IC.

[0012] Preferably, the signal series circuit includes a control signal line, a power supply positive line, and a power supply negative line. The control signal line is connected to the signal input end of the corresponding circuit board, the power supply positive line is connected to the positive power supply terminal of the corresponding circuit board, and the power supply negative line is connected to the negative power supply terminal of the corresponding circuit board.

[0013] Preferably, the luminous efficiency η of the RGB three-color light-emitting chip is η≥80 lm / W, and the wavelength ranges of each color light-emitting chip are: the wavelength of the red chip is 620 nm - 630 nm, the wavelength of the green chip is 520 nm - 530 nm, and the wavelength of the blue chip is 460 nm - 470 nm, which is used to achieve good color performance and brightness output.

[0014] The cascading of multiple circuit boards is realized through the power supply parallel circuit and the signal series circuit. The positive power supply terminal is connected to the first pad, and the negative power supply terminal is connected to the second pad to provide a stable 12V or 5V power supply for the circuit; the signal input end and the signal output end are respectively connected to the third pad and the fourth pad to ensure that the signal is sequentially transmitted between each circuit board. The die bonding area and the wire bonding area of the light-emitting die on the front side of the insulating substrate provide a stable die bonding foundation for the light-emitting die, and the internal electrical connection is realized through wire bonding to ensure that the RGB three-color light-emitting chip can work normally and achieve different color light-emitting effects.

[0015] Preferably, the data shaping and processing circuit built in the control IC adopts an adaptive equalization technology, and its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal, satisfying the formula: , where A_in and A_out are the amplitudes of the input and output signals respectively, and f_in and f_out are the frequencies of the input and output signals respectively, which is used to ensure the stability of the signal during transmission and achieve an accurate flashing control effect of the lamp string.

[0016] The control IC is installed on the control chip pads on the front side of the insulating substrate, and its pins are connected to the positive power terminal, the negative power terminal, the signal input terminal, and the signal output terminal, thereby controlling the transmission and processing of signals. When the control IC works, it receives the signal from the signal input terminal, and after processing, it is transmitted from the signal output terminal to the next circuit board to achieve the sequential control and flashing effect of the lamp string. The distance formed by the isolation of the hollow structure between the third pad and the fourth pad is 0.05 mm - 1.5 mm, which helps to avoid signal interference and ensure the stability of signal transmission.

[0017] Preferably, the shape of the circuit board is rectangular, circular or polygonal, and the adjustable range of the connection angle between adjacent circuit boards is 0° - 180°, which is used to adapt to the lamp string designs with different shapes and layout requirements.

[0018] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: 1. In the present invention, by providing the first pad, the second pad, the third pad and the fourth pad on the back side of the insulating substrate, and adopting a power parallel circuit and a signal series circuit, multiple circuit boards are connected in series and in parallel in sequence. This design reduces the welding steps and the complex wiring process, effectively simplifies the wiring and packaging process, and improves the production efficiency.

[0019] 2. In the present invention, the traditional welding method is prone to problems such as false soldering or insecure welding. By optimizing the pad layout and spacing, and adopting an appropriate wire diameter, the present invention significantly improves the firmness and reliability of welding, and reduces the problems of false soldering and insecure welding; by using a hollow structure to isolate between the third pad and the fourth pad, and performing wire cutting after the circuit board is manufactured, the short - circuit risk and pin deformation problems caused by premature wire cutting are avoided.

[0020] 3. In the present invention, by optimizing the circuit design and wiring method, unnecessary material usage is reduced, and at the same time, the production efficiency is improved, thereby effectively reducing the production cost and maintenance cost; through impedance matching design and adaptive equalization technology, the integrity and stability of the signal during transmission are ensured. The data shaping and processing circuit built in the control IC can repair the signal to ensure that the signal can be accurately transmitted to each LED lamp bead, thereby achieving an accurate flashing control effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a three - dimensional structure schematic diagram of the present invention; Figure 2 is of the present invention Figure 1 is a cross - sectional view at A of the present invention; Figure 3 is a structure schematic diagram of the working process of the present invention; Figure 4 is a working circuit connection diagram of the present invention.

[0022] Wherein: 1. Positive power terminal; 2. Negative power terminal; 3. Signal input terminal; 4. Signal output terminal; 5. RGB three-color light-emitting chip; 6. Insulating substrate; 7. Die bonding area for light-emitting chips; 8. Pad for control chip; 9. Circuit board; 10. Control IC; 13. Positive power line; 14. Negative power line; 15. Control signal line. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment 1; please refer to Figures 1-4 , in the embodiment of the present invention, an LED light-emitting diode with a side-cut line for a string of lights includes: An insulating substrate 6, on the front surface of which there are a die bonding area for light-emitting chips, a wire bonding area, and a pad for a control chip, and on the back surface there are a first pad, a second pad, a third pad, and a fourth pad; The third pad and the fourth pad are on the same horizontal line, and an isolation area with a spacing of 0.05 mm - 1.5 mm is formed by being separated by a hollow structure in the middle; A power parallel circuit, including a positive power terminal 1 and a negative power terminal 2, which are respectively connected to the first pad and the second pad; A signal series circuit, including a signal input terminal 3 and a signal output terminal 4, which are respectively connected to the third pad and the fourth pad; A circuit board 9, which is cascaded in sequence through the power parallel circuit and the signal series circuit, and an RGB three-color light-emitting chip 5 and a control IC 10 are installed on the circuit board 9; The pin definitions of the control IC 10 are: the first pin is connected to the positive power terminal 1, the second pin is connected to the negative power terminal 2, the third pin is connected to the signal input terminal 3, and the fourth pin is connected to the signal output terminal 4.

[0025] The wire diameters of the first pad, the second pad, the third pad, and the fourth pad range from 0.4 mm to 1.5 mm, and the spacing between adjacent pads satisfies: the spacing between the first pad and the second pad is 0.5 mm - 1 mm, the spacing between the second pad and the third pad is 0.05 mm - 0.9 mm, and the third pad and the fourth pad are separated by a hollow structure with a spacing of 0.05 mm - 1.5 mm.

[0026] The area ratio range of the die bonding area of the light-emitting chip to the wire bonding area is 1:0.5 - 1:2, which is used to ensure the stable die bonding of the light-emitting chip, the reliability of wire bonding, and meet the electrical connection requirements inside the device.

[0027] The connection line between the control IC10 and the RGB three-color light-emitting chip 5 adopts an impedance matching design, and its characteristic impedance Z satisfies the formula: , where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f, the integrity of signal transmission is ensured. The range of f is 1MHz - 100MHz, which is used to ensure the signal control accuracy and stability of the lamp string.

[0028] The working principle of the embodiment of the present invention is as follows: An LED light-emitting diode with a side-cut lamp string realizes the cascading of multiple circuit boards 9 through a power parallel circuit and a signal series circuit. The positive power terminal 1 is connected to the first pad, and the negative power terminal 2 is connected to the second pad, providing a stable 12V or 5V power supply for the entire circuit. The signal input terminal 3 and the signal output terminal 4 are respectively connected to the third pad and the fourth pad to ensure the sequential transmission of signals between each circuit board 9. The die bonding area and the wire bonding area on the front side of the insulating substrate 6 provide a stable die bonding foundation for the light-emitting chip and realize internal electrical connection through wire bonding, ensuring that the RGB three-color light-emitting chip 5 can work normally and realizing different color light-emitting effects.

[0029] The control IC10 is installed on the control chip pad on the front side of the insulating substrate 6. Its first pin is connected to the positive power terminal 1, the second pin is connected to the negative power terminal 2, the third pin is connected to the signal input terminal 3, and the fourth pin is connected to the signal output terminal 4, thereby controlling the transmission and processing of signals. When the control IC10 works, it receives the signal from the signal input terminal 3, and after processing, it transmits it from the signal output terminal 4 to the next circuit board 9, realizing the sequential control and flashing effect of the lamp string.

[0030] The spacing formed by the isolation of the hollow structure between the third pad and the fourth pad is 0.05mm - 1.5mm, which helps to avoid signal interference and ensure the stability of signal transmission; at the same time, the wire diameters of the first pad, the second pad, the third pad, and the fourth pad range from 0.4mm to 1.5mm, and the spacing between adjacent pads satisfies: the spacing between the first pad and the second pad is 0.5mm - 1mm, and the spacing between the second pad and the third pad is 0.05mm - 0.9mm. These designs ensure the stable die bonding of the light-emitting chip and the reliability of wire bonding, and meet the electrical connection requirements inside the device.

[0031] The connection line between the control IC 10 and the RGB three-color light-emitting chip 5 adopts an impedance matching design, and its characteristic impedance Z satisfies the formula Z = \sqrt{\frac{L}{C}}, where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f (in the range of 1 MHz - 100 MHz), the integrity of signal transmission is ensured, thereby guaranteeing the signal control accuracy and stability of the lamp string.

[0032] Embodiment 2; Please refer to Figures 1-4 , in the embodiment of the present invention, the thickness range of the insulating substrate 6 is 0.2 mm - 0.8 mm, and its material is ceramic or composite insulating material, and the thermal conductivity λ of the insulating substrate 6 ≥ 1.0 W / (m K) is used to meet the heat dissipation requirements during the operation of the device and ensure the performance of the LED light-emitting diode. A light-emitting chip die-bonding area 7 and a control chip pad 8 are also installed on the top of the insulating substrate 6.

[0033] The wiring width range of the power parallel circuit and the signal series circuit is 0.3 mm - 1.2 mm. At the connection between adjacent circuit boards 9, the line spacing of the wiring gradually expands, and its expansion angle α is 30° - 60°, which is used to improve the anti-interference ability and connection reliability of the circuit; the signal transmission rate of the power parallel circuit satisfies: Tprop ≤ (1 / 10) Tclock, where Tprop is the signal transmission delay time and Tclock is the clock cycle of the control IC 10.

[0034] The signal series circuit includes a control signal line 15, a power positive line 13, and a power negative line 14. The control signal line 15 is connected to the signal input terminal 3 of the corresponding circuit board 9, the power positive line 13 is connected to the power positive terminal 1 of the corresponding circuit board 9, and the power negative line 14 is connected to the power negative terminal 2 of the corresponding circuit board 9.

[0035] The working principle of the embodiment of the present invention is as follows: The thickness range of the insulating substrate 6 is 0.2 mm - 0.8 mm, and its material is ceramic or composite insulating material, and the thermal conductivity λ ≥ 1.0 W / (m K), which can meet the heat dissipation requirements during the operation of the device and ensure the stable performance of the LED light-emitting diode; a light-emitting chip die-bonding area 7 and a control chip pad 8 are installed on the top of the insulating substrate 6, providing a basis for installing and fixing the light-emitting chip and the control IC.

[0036] The wiring width range of the power parallel circuit and the signal series circuit is 0.3 mm - 1.2 mm. At the connection between adjacent circuit boards 9, the line spacing of the wiring gradually expands, and the expansion angle α is 30° - 60°. This design helps to improve the anti-interference ability and connection reliability of the circuit, ensuring the stability and accuracy of signals and power during transmission.

[0037] The signal transmission rate of the power parallel circuit satisfies Tprop ≤ (1 / 10) Tclock, where Tprop is the signal transmission delay time and Tclock is the clock cycle of the control IC10, thereby ensuring that signals can be transmitted to each circuit board 9 in a timely and accurate manner, avoiding abnormal control of the lamp string caused by signal delay. The signal series circuit includes a control signal line 15, a power positive line 13, and a power negative line 14. The control signal line 15 is connected to the signal input terminal 3 of the corresponding circuit board 9, the power positive line 13 is connected to the power positive terminal 1 of the corresponding circuit board 9, and the power negative line 14 is connected to the power negative terminal 2 of the corresponding circuit board 9. Through such a connection method, the orderly transmission and distribution of signals and power in the entire lamp string are realized.

[0038] When the control IC10 works, it receives and processes signals through the control signal line 15, and controls the power positive line 13 and the power negative line 14 to supply power to the RGB three-color light-emitting chips 5, realizing the flashing and lighting control of the lamp string.

[0039] Example 3; Please refer to Figures 1-4 In the embodiment of the present invention, the luminous efficiency η of the RGB three-color light-emitting chip 5 is η ≥ 80 lm / W, and the wavelength ranges of the respective color light-emitting chips are: the wavelength of the red chip is 620 nm - 630 nm, the wavelength of the green chip is 520 nm - 530 nm, and the wavelength of the blue chip is 460 nm - 470 nm, for achieving good color performance and brightness output.

[0040] The data shaping and processing circuit built in the control IC10 adopts an adaptive equalization technique, and its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal, satisfying the formula: where A_in and A_out are the amplitudes of the input and output signals respectively, and f_in and f_out are the frequencies of the input and output signals respectively, for ensuring the stability of the signal during transmission and achieving an accurate flashing control effect of the lamp string.

[0041] The shape of the circuit board 9 is rectangular, circular, or polygonal, and the adjustable range of the connection angle between adjacent circuit boards 9 is 0° - 180°, for adapting to lamp string designs with different shapes and layout requirements.

[0042] The working principle of the embodiments of the present invention is as follows: The luminous efficiency η of the RGB three-color light-emitting chips 5 is η≥80 lm / W, and the wavelength ranges of the light-emitting chips of each color are respectively: the wavelength of the red chip is 620 nm - 630 nm, the wavelength of the green chip is 520 nm - 530 nm, and the wavelength of the blue chip is 460 nm - 470 nm. This parameter setting ensures that the light-emitting chips can achieve good color performance and brightness output, meeting the color and brightness requirements of the lamp string in different application scenarios.

[0043] The data shaping and processing circuit built in the control IC 10 adopts an adaptive equalization technique, and its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal, satisfying the formula , where A_in and A_out are the amplitudes of the input and output signals respectively, and f_in and f_out are the frequencies of the input and output signals respectively. In this way, the stability and integrity of the signal during transmission are ensured, thereby achieving an accurate flashing control effect of the lamp string.

[0044] The shape of the circuit board 9 is rectangular, circular or polygonal, and the adjustable range of the connection angle between adjacent circuit boards 9 is 0° - 180°. This flexible design enables the lamp string to adapt to the design requirements of different shapes and layout needs, and can be adjusted and laid out according to the specific lamp string shape and installation space in practical applications.

[0045] When the control IC 10 receives a signal from the signal input terminal, after being processed and equalization-adjusted by the data shaping and processing circuit, a stable signal is output to the next circuit board 9, and at the same time, the corresponding RGB three-color light-emitting chips 5 are controlled to emit light. Through the combination and flashing control of light-emitting chips of different colors, a rich and colorful light-emitting effect of the lamp string is achieved. The adjustability of the shape and connection angle of the circuit board 9 makes the entire lamp string more flexible during installation and use, capable of meeting various complex shape and layout requirements, and also facilitating assembly and debugging during the production process.

[0046] Working principle: This patent relates to an LED light-emitting diode with a side tangent for a string of lights, and realizes the cascading of multiple circuit boards through a power parallel circuit and a signal series circuit. The positive terminal 1 of the power supply is connected to the first pad, and the negative terminal 2 of the power supply is connected to the second pad, providing a stable 12V or 5V power supply for the circuit; the signal input terminal 3 and the signal output terminal 4 are respectively connected to the third pad and the fourth pad to ensure the sequential transmission of signals between each circuit board. The die bonding area 7 and the wire bonding area on the front side of the insulating substrate 6 provide a stable die bonding foundation for the light-emitting chips, and achieve internal electrical connection through wire bonding to ensure that the RGB three-color light-emitting chips 5 can work properly; the control IC 10 is installed on the control chip pad 8 on the front side of the insulating substrate 6, and its pins are connected to the positive terminal 1 of the power supply, the negative terminal 2 of the power supply, the signal input terminal 3 and the signal output terminal 4, thereby controlling the transmission and processing of signals. When the control IC 10 works, it receives the signal from the signal input terminal, and after processing, it is transmitted from the signal output terminal 4 to the next circuit board 9 to achieve the sequential control and flashing effect of the string of lights. The spacing formed by the isolation of the hollow structure between the third pad and the fourth pad is 0.05mm - 1.5mm, which helps to avoid signal interference.

[0047] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An LED light emitting diode with a side tangent of a light string, characterized in that: include: An insulating substrate (6), wherein a light-emitting die bonding region, a bonding wire region and a control chip bonding pad are arranged on the front side thereof, and a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are arranged on the back side thereof; The third pad and the fourth pad are located on the same horizontal line, and are separated by a hollow structure to form an isolation zone with a spacing of 0.05 mm to 1.5 mm; A power parallel circuit, comprising a power positive terminal (1) and a power negative terminal (2), connected to the first welding pad and the second welding pad respectively; A signal series circuit, comprising a signal input terminal (3) and a signal output terminal (4), which are respectively connected to the third pad and the fourth pad; A circuit board (9) is cascaded in sequence through the power parallel circuit and the signal series circuit, and an RGB three-color light-emitting chip (5) and a control IC (10) are mounted on the circuit board (9); The pins of the control IC (10) are defined as follows: a first pin is connected to the positive terminal (1) of a power supply, a second pin is connected to the negative terminal (2) of a power supply, a third pin is connected to the signal input terminal (3), and a fourth pin is connected to the signal output terminal (4).

2. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The wire diameter range of the first pad, the second pad, the third pad and the fourth pad is 0.4mm-1.5mm, and the distance between adjacent pads satisfies: the distance between the first pad and the second pad is 0.5mm-1mm, the distance between the second pad and the third pad is 0.05mm-0.9mm, and the third pad and the fourth pad are isolated by the hollow structure, with a distance of 0.05mm-1.5mm.

3. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The ratio of the area of ​​the light-emitting wafer solidification region to the area of ​​the wire bonding region is in the range of (1:0.5)-(1:2), which is used to ensure stable solidification of the light-emitting wafer and reliability of the wire bonding and meet the electrical connection requirements inside the device.

4. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The connection line between the control IC (10) and the RGB three-color light-emitting chip (5) adopts an impedance matching design, and its characteristic impedance Z satisfies the formula: , where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f, the integrity of the signal transmission is ensured. The range of f is 1MHz-100MHz, which is used to ensure the signal control accuracy and stability of the light string.

5. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The insulating substrate (6) has a thickness ranging from 0.2 mm to 0.8 mm, is made of ceramic or composite insulating material, and has a thermal conductivity λ ≥ 1.0 W / (m K), used to meet the heat dissipation requirements of the device during operation and to ensure the performance of the LED light-emitting diode, and the top of the insulating substrate (6) is also equipped with a light-emitting crystal element bonding area (7) and a control chip pad (8).

6. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The wiring width of the power parallel circuit and the signal series circuit is in the range of 0.3 mm to 1.2 mm. At the connection between adjacent circuit boards (9), the wiring line spacing is gradually expanded, and the expansion angle α is 30° to 60°, which is used to improve the anti-interference ability and connection reliability of the circuit; the signal transmission rate of the power parallel circuit meets: Tprop≤(1 / 10) Tclock, where Tprop is the signal transmission delay time, and Tclock is the clock period of the control IC (10).

7. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The signal series circuit comprises a control signal line (15), a positive power line (13) and a negative power line (14), wherein the control signal line (15) is connected to a signal input terminal (3) of a corresponding circuit board (9), the positive power line (13) is connected to a positive power terminal (1) of a corresponding circuit board (9), and the negative power line (14) is connected to a negative power terminal (2) of a corresponding circuit board (9).

8. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The luminous efficiency η of the RGB three-color light-emitting chip (5) is ≥80 lm / W, and the wavelength ranges of the light-emitting chips of each color are: the wavelength of the red chip is 620nm-630nm, the wavelength of the green chip is 520nm-530nm, and the wavelength of the blue chip is 460nm-470nm, so as to achieve good color performance and brightness output.

9. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The data shaping processing circuit built into the control IC (10) adopts adaptive equalization technology, and its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal to satisfy the formula: , where A_in and A_out are the amplitudes of the input and output signals, respectively, and f_in and f_out are the frequencies of the input and output signals, respectively, which are used to ensure the stability of the signal during transmission and achieve precise flickering control of the light string.

10. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The shape of the circuit board (9) is rectangular, circular or polygonal, and the connection angle between adjacent circuit boards (9) can be adjusted in the range of 0°-180°, so as to adapt to the design of light strings with different shapes and layout requirements.

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