Dispensing mold and dispensing method of display module and display module

Abstract

The invention relates to a dispensing mold and a dispensing method of a display module and the display module, the dispensing mold of the display module comprises an anti-overflow baffle, the anti-overflow baffle is provided with a first surface and a second surface, the anti-overflow baffle comprises a groove and a blocking wall which are located on the first surface, and the blocking wall is located on one side, in the first direction, of the groove; the bonding layer is located on the first surface and located on the side, close to the groove, of the blocking wall. The protection performance of the bending part can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a dispensing mold for a display module, a dispensing method, and a display module. Background Art

[0002] With the continuous development of display technologies, organic light-emitting diode (OLED) display devices have been widely used in multiple fields such as flat panel displays, flexible displays, in-vehicle displays, and solid-state lighting due to advantages such as a wide color gamut, high contrast ratio, energy conservation, and foldability. An OLED display panel includes a substrate and a plurality of sub-pixels disposed on the substrate, and the plurality of sub-pixels can display images. Compared with LCD technology, the OLED display panel can reduce the width of the lower border of the display by means of pad bending, and has become an effective technical means to achieve a narrow border effect.

[0003] However, in the prior art, there is a serious problem that the protection performance deteriorates significantly after the bending part is bent. Summary of the Invention

[0004] Based on this, it is necessary to provide a dispensing mold for a display module, a dispensing method, and a display module, aiming to solve the problem that the protection performance deteriorates significantly after the bending part is bent in the prior art.

[0005] In a first aspect, an embodiment of the present application provides a dispensing mold for a display module, including:

[0006] An anti-overflow baffle having a first surface and a second surface, the anti-overflow baffle including a groove and a blocking wall on the first surface, the blocking wall being located on one side of the groove along a first direction;

[0007] An adhesive layer located on the first surface and on the side of the blocking wall close to the groove.

[0008] In a second aspect, an embodiment of the present application further provides a dispensing method for a display module, including:

[0009] Providing a dispensing mold for a display module, the dispensing mold including an anti-overflow baffle and an adhesive layer, the anti-overflow baffle having a first surface and a second surface, the anti-overflow baffle including a groove on the first surface and a blocking wall located on one side of the groove along a first direction, the adhesive layer being located on the first surface and on the side of the blocking wall close to the groove;

[0010] Provided is a display module, the display module includes a display panel, the display panel includes a display portion and a bent portion located on one side of the display portion, and a bonding portion located on the side of the bent portion away from the display portion, and the bonding portion is bent toward the side away from the light-emitting surface of the display portion;

[0011] The dispensing mold is detachably and fixedly arranged on the side of the bonding portion away from the display portion, the first surface is arranged opposite to the bonding portion, the orthographic projection of the barrier wall on the display panel is located on the side of the orthographic projection of the groove on the display panel close to the bent portion, and at least the portion of the anti-overflow baffle on the side away from the groove forms a dispensing space with the bonding portion, and the opening of the dispensing space faces the outside of the display panel along the first direction;

[0012] Fill the dispensing space with glue from the opening;

[0013] Cure the glue to form a protective glue layer;

[0014] Remove the dispensing mold.

[0015] In a third aspect, an embodiment of the present application further provides a display module, which is manufactured by using the dispensing method of the display module described in any one of the above.

[0016] In the embodiment of the present application, by applying the dispensing mold of the present application to the glue coating process, the dispensing mold includes an anti-overflow baffle and an adhesive layer, the adhesive layer is used to fixedly arrange the anti-overflow baffle with the display panel or the display module, and the anti-overflow baffle is provided with a barrier wall, so that the anti-overflow baffle can form a dispensing space with the bent portion and / or the protective cover plate, and then filling the dispensing space with glue can form a protective glue layer with high precision, fixed thickness and fixed position, which can greatly reduce the requirements for the precision of the equipment and the process, thereby avoiding or improving the problems of large glue coating fluctuations, glue overflow and glue shortage in glue coating; at the same time, the protective glue layer can well wrap the bent portion, so that the external impact force received by the bent portion can be buffered, thereby avoiding the direct intrusion of external water vapor, dust, etc. into the bent portion, and improving the protection performance of the bent portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1A top view schematic diagram of the first surface of a dispensing mold for a display module provided by some embodiments of the present application.

[0019] Figure 2 A cross-sectional structure schematic diagram of a dispensing mold for a display module provided by some embodiments of the present application.

[0020] Figure 3 A cross-sectional view after bending of a bent portion of a display panel provided by some embodiments of the present application.

[0021] Figure 4 For Figure 3 A top view schematic diagram of the back surface of the display module in

[0022] Figure 5 For the back side top view schematic diagram after the combination of the dispensing mold and the Figure 3 display module in

[0023] Figure 6 For the back side top view schematic diagram of the edge alignment of the dispensing mold and the Figure 5 display module in

[0024] Figure 7 A flow step schematic diagram of a dispensing method for a display module provided by some embodiments of the present application.

[0025] Figure 8 A schematic diagram of the first intermediate process of a dispensing method for a display module provided by some embodiments of the present application.

[0026] Figure 9 A schematic diagram of the second intermediate process of a dispensing method for a display module provided by some embodiments of the present application.

[0027] Figure 10 A schematic diagram of the third intermediate process of a dispensing method for a display module provided by some embodiments of the present application.

[0028] Reference numerals:

[0029] Display module 300; Display panel 200; Dispensing mold 100; Anti-overflow baffle 10; Adhesive layer 13; First surface 10a; Second surface 10b; Groove 11; Barrier wall 12; First barrier wall portion 121; Second barrier wall portion 122; First plate body portion 101; Second plate body portion 102; Center line C3-C3; Second width d2; First width d1; Alignment notch 14; Third width d3; Fourth width d4; Anti-collision claw 15;

[0030] The first direction Y; the second direction X; the display unit 20A; the bending part 20B; the bonding part 20C; the substrate 201; the display functional layer 202; the protection cover plate 17; the optical adhesive layer 16; the circuit board 40; the driving chip 30; the backplane layer 50; the support layer 60; the first backplane 51; the second backplane 52;

[0031] The dispensing space 301; the dispensing device 500; the opening 301K; the protective adhesive layer 400; the first space part 3011; the second space part 3012. Detailed implementation manners

[0032] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure content of the present application more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0034] When describing the positional relationship, unless otherwise specified, when an element such as a layer, a film or a substrate is referred to as being "on" another element, it can be directly on the other element or there can also be intermediate elements. Further, when a layer is referred to as being "under" another layer, it can be directly below or there can be one or more intermediate elements. It can also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there can also be one or more intermediate elements.

[0035] In the case of using "including", "having", and "comprising" described herein, unless a clear limiting term is used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be understood as having a quantity of one.

[0036] It should be understood that although terms such as "first" and "second" can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present application, the first element can be called the second element, and similarly, the second element can be called the first element.

[0037] It should also be understood that when interpreting an element, although not explicitly described, the element is interpreted as including an error range, which should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "about", "approximately" or "substantially" may mean within one or more standard deviations, which is not limited herein.

[0038] In addition, in the specification, the phrase "schematic diagram of planar distribution" refers to the drawing when observing the target part from above, and the phrase "schematic cross-sectional diagram" refers to the drawing when observing the cross-section intercepted by vertically cutting the target part from the side.

[0039] In addition, the drawings are not drawn to a scale of 1:1, and the relative sizes of the components are only drawn by way of example in the drawings and are not necessarily drawn to the actual scale.

[0040] As described in the background art section, there is a serious problem that the protection performance decreases after the bending part is bent in the prior art. The inventors found that the reasons for the above phenomenon are as follows: 1) When no protective glue layer is formed by coating around the bending part, the bending part is very fragile and directly contacts the external environment. For example, the bending part directly bears the external pressure, such as the bending part directly suffers from the intrusion of external water vapor and dust, etc., which makes the protection performance of the bending part decrease seriously and is easily damaged. 2) When a protective glue layer is directly formed by coating on the bending part, generally, the position, thickness, width and other morphologies of the protective glue layer are controlled by controlling the glue output of the coating equipment, the coating path, etc. However, in the existing equipment and processes, the coating accuracy of the glue material is poor, there are large coating fluctuations, and there are often coating problems such as glue overflow and glue shortage.

[0041] Based on the above technical problems, the inventors have studied and found that by applying the dispensing mold of the present application to the coating process, the dispensing mold includes an anti-overflow baffle and an adhesive layer. The adhesive layer is used to fix the anti-overflow baffle to the display panel. The anti-overflow baffle is provided with a blocking wall, so that the anti-overflow baffle can form a dispensing space with the bending part and / or the protective cover plate. Then, by filling the dispensing space with the glue material, a protective glue layer with high precision, fixed thickness and fixed position can be formed, which can greatly reduce the requirements for the precision of the equipment and processes, thereby avoiding or improving coating problems such as large coating fluctuations, glue overflow and glue shortage; at the same time, the protective glue layer can well wrap the bending part, thereby buffering the external impact force received by the bending part, thereby avoiding the direct intrusion of external water vapor and dust, etc. into the bending part, and improving the protection performance of the bending part.

[0042] Please refer to Figures 1 to 8 。 Figure 1 It is a top view schematic diagram of the first surface of a dispensing mold of a display module provided by some embodiments of the present application. Figure 2 It is a schematic cross-sectional structure diagram of a dispensing mold of a display module provided by some embodiments of the present application. Figure 2is Figure 1 A schematic cross-sectional view in the direction of the dashed line C1-C1. Compared with Figure 1 , Figure 2 the cross-sectional structure in

[0043] Figure 3 A schematic cross-sectional view after bending the bent portion of a display panel provided in some embodiments of the present application. Figure 4 is Figure 3 A top view schematic of the back of the display module in Figure 5 is the back top view schematic after the bonding of the dispensing mold and the Figure 3 display module in Figure 5 The structures or components blocked by the dispensing mold are indicated by dashed lines in Figure 6 is the enlarged schematic of the edge alignment of the dispensing mold and the Figure 5 display module in Figure 3 Schematically shows the display panel 200, or Figure 3 schematically shows the state of the display module 300 before dispensing.

[0044] Figure 7 A schematic flow chart of a dispensing method for a display module provided in some embodiments of the present application. Figure 8 A schematic diagram of the first intermediate process of a dispensing method for a display module provided in some embodiments of the present application. Figure 9 A schematic diagram of the second intermediate process of a dispensing method for a display module provided in some embodiments of the present application. Figure 10 A schematic diagram of the third intermediate process of a dispensing method for a display module provided in some embodiments of the present application. Figure 8 and Figure 9 schematically shows the cross-sectional view in the direction of the dashed line C2-C2 in Figure 5 . Compared with Figure 5 , Figures 8 to 10 the cross-sectional structure in Figure 10 is also a schematic cross-sectional view of the dispensed display module 300 provided in the embodiments of the present application.

[0045] It should be noted that Figure 1 the first surface 10a of the anti-overflow baffle 10 is seen in Figure 5 the second surface 10b of the anti-overflow baffle 10 is seen in

[0046] In a first aspect, please refer to Figure 1 and Figure 2 , and at the same time, please combine with Figure 3 , Figures 4 to 6 , and Figures 8 to 10, this application provides a dispensing mold 100 for a display module. The dispensing mold 100 for the display module includes an anti-overflow baffle 10 and an adhesive layer 13. The anti-overflow baffle 10 has a first surface 10a and a second surface 10b. The anti-overflow baffle 10 includes a groove 11 and a blocking wall 12 on the first surface 10a. The blocking wall 12 is located on one side of the groove 11 along the first direction Y; the adhesive layer 13 is located on the first surface 10a and on the side of the blocking wall 12 close to the groove 11.

[0047] Exemplarily, as Figure 3 shown, the display module 300 includes a display panel 200. The display panel 200 includes a display portion 20A, a bending portion 20B located on one side of the display portion 20A, and a bonding portion 20C located on the side of the bending portion 20B away from the display portion 20A. The bonding portion 20C is bent toward the side away from the light-emitting surface of the display portion 20A to achieve a narrow bezel design.

[0048] Exemplarily, as Figure 3 shown, the display panel 200 includes a substrate 201 and a display function layer 202 located on one side of the substrate 201. The display function layer 202 may include a plurality of sub-pixels for displaying images. The display function layer 202 is disposed on the side of the substrate 201 away from the bonding portion 20C in the display portion 20A. The display panel 200 further includes a protection cover plate 17. The protection cover plate 17 is attached to the side of the display function layer 202 away from the substrate 201 through an optical adhesive layer 16. The substrate 201 can be bent at the bending portion 20B. The structure of the display panel 200 is not limited to Figure 3 examples.

[0049] Exemplarily, as Figure 3 shown, the driving chip 30 is electrically connected to the bonding portion 20C on the side of the bonding portion 20C away from the display portion 20A, and the circuit board 40 is electrically connected to the bonding portion 20C on the side of the bonding portion 20C away from the display portion 20A. The driving chip 30 and / or the circuit board 40 are not limited to Figure 3 the exemplary structure.

[0050] Exemplarily, as Figure 3 shown, the display module 300 may further include a backplane layer 50 and a support layer 60. The backplane layer 50 includes a first backplane 51 and a second backplane 52. The first backplane 51 corresponds to the display portion 20A and is disposed on the side of the substrate close to the bonding portion 20C; the second backplane 52 corresponds to the bonding portion 20C and is disposed on the side of the substrate 201 close to the display portion 20A; the support layer 60 is disposed between the first backplane 51 and the second backplane 52. The material of the support layer 60 may include foam, heat dissipation layer, etc. The display module 300 may also be Figure 3 other structures other than the examples, which are not limited herein.

[0051] It should be noted that the dispensing mold 100 of the display module 300 of the present application can also be used for Figure 3 The protective adhesive layer formed by the adhesive dispensing process for other display panels or display modules other than those in the examples, such as the adhesive dispensing process for a display panel or display module that does not include the bending portion 20B, can also play a role in protecting the display panel or display module.

[0052] For example, please combine Figure 8 During the glue dispensing process, the anti-overflow baffle 10 can be fixed to the display panel 200 or the display module 300, and the anti-overflow baffle 10 can form a glue dispensing space 301 with the bending portion 20B and / or the protective cover 17, and then the glue material is filled into the glue dispensing space 301 to form a protective glue layer 400 with high precision, fixed thickness and fixed position, which can greatly reduce the requirements for accuracy in equipment and processes, thereby avoiding or improving glue dispensing problems such as large glue dispensing fluctuations, glue overflow and glue shortage.

[0053] For example, Figure 8 As shown, the adhesive layer 13 is used to fix the anti-overflow baffle 10 to the display module 300 , for example, the adhesive layer 13 is bonded to the back side of the display module 300 .

[0054] For example, Figure 8 As shown, the bonding layer 13 may include materials or structures having bonding or fixing functions such as foam glue or phenolic resin adhesive.

[0055] For example, Figure 8 As shown, the anti-overflow baffle 10 has a first surface 10a and a second surface 10b. In the glue dispensing process, the first surface 10a is the surface of the partial side wall of the glue dispensing space 301 opposite to the bending portion 20B, and the second surface 10b is a side surface of the anti-overflow baffle 10 that is away from the first surface 10a.

[0056] For example, Figure 8 As shown, in the glue dispensing process, the groove 11 can accommodate components such as the driver chip 30, so that the anti-overflow baffle 10 is more tightly combined with the back of the display module 300, for example, a glue dispensing space 301 with a preset thickness is formed, so that the protective glue layer 400 has a preset thickness.

[0057] For example, the groove 11 may be formed by a hollowed-out portion in the thickness direction of the anti-overflow baffle 10 , or may be formed by a depression and a protrusion of the anti-overflow baffle 10 from the first surface 10a toward the second surface 10b , which is not limited here.

[0058] For example, Figure 5 As shown, in the glue dispensing process, the blocking wall 12 is used to enclose the glue dispensing space 301, so as to limit the location and position of the protective glue layer 400 and prevent glue coating problems such as glue overflow and glue shortage.

[0059] Exemplarily, as Figure 5 and Figure 8 shown, the barrier wall 12 is located on one side of the groove 11 along the first direction Y; the bonding layer 13 is located on the first surface 10a and on the side of the barrier wall 12 close to the groove 11, that is, the bonding layer 13 is located outside the dispensing space 301, avoiding the bonding layer 13 interfering with the formation of the protective glue layer 400.

[0060] Exemplarily, the thickness of the barrier wall 12 can be set so that the dispensing space 301 has a preset thickness, thereby controlling the protective glue layer 400 to have a preset thickness.

[0061] In the embodiments of the present application, by applying the dispensing mold 100 of the present application to the glue coating process, the dispensing mold 100 includes an anti-overflow baffle 10 and a bonding layer 13. The bonding layer 13 is used to fix the anti-overflow baffle 10 to the display panel 200 or the display module 300. The anti-overflow baffle 10 is provided with a barrier wall 12, so that the anti-overflow baffle 10 can form a dispensing space 301 with the bending part and / or the protective cover plate 17. Then, by filling the glue material into the dispensing space 301, a protective glue layer 400 with high precision, fixed thickness and fixed position can be formed, which can greatly reduce the requirements for the precision in the equipment and process, thereby avoiding or improving the problems of large glue coating fluctuations, glue overflow and glue shortage in the glue coating; at the same time, the protective glue layer 400 can well wrap the bending part 20B, thereby buffering the external impact force received by the bending part, and thus avoiding the bending part 20B being directly invaded by external water vapor, dust, etc., improving the protection performance of the bending part 20B.

[0062] In some embodiments, as Figure 5 shown, the barrier wall 12 includes a first barrier wall part 121 extending along the second direction X, and two second barrier wall parts 122 respectively connected to both ends of the first barrier wall part 121. The second barrier wall parts 122 extend along the first direction Y towards the direction away from the groove 11 of the first barrier wall part 121, and the second direction X intersects with the first direction Y.

[0063] Exemplarily, the barrier wall 12 can prevent the glue material of the protective glue layer 400 from flowing to device areas such as the driving chip 30.

[0064] Exemplarily, as Figure 5 shown, and at the same time, please refer to Figure 8 shown. In the dispensing process, the first barrier wall part 121 and the two second barrier wall parts 122 surround the dispensing space 301, thereby defining the size, shape, position, etc. of the dispensing space 301, preventing problems such as glue overflow and glue shortage in the glue coating.

[0065] Exemplarily, in some embodiments, the first direction Y is perpendicular to the second direction X, but is not limited thereto. For example, the acute angle between the first direction Y and the second direction X is 70 degrees to 90 degrees; for example, the acute angle between the first direction Y and the second direction X is any one of 70 degrees, 75 degrees, 80 degrees, and 85 degrees.

[0066] In some embodiments, as Figure 1 and Figure 5 shown, the anti-overflow baffle 10 includes a first plate body portion 101 and a second plate body portion 102 arranged and connected in the first direction Y; the bonding layer 13 is located on the second plate body portion 102, and the bonding layer 13 is located on the side of the groove 11 away from the blocking wall 12; in the direction perpendicular to the first direction Y, the width of the second plate body portion 102 is smaller than the width of the first plate body portion 101, and the second plate body portion 102 is connected to the first plate body portion 101 on one side of the center line of the first plate body portion 101 along the first direction Y.

[0067] Exemplarily, as Figure 1 shown, the bonding layer 13 is located on the second plate body portion 102 to prevent the bonding layer 13 from interfering with the dispensing space 301.

[0068] Exemplarily, as Figure 1 shown, the bonding layer 13 is located on the second plate body portion 102, and the bonding layer 13 is located on the side of the groove 11 away from the blocking wall 12. In the first direction Y, the bonding layer 13, the groove 11, and the blocking wall 12 are arranged in sequence, so that the structure of the dispensing mold 100 matches the structure of the back surface of the display module 300.

[0069] Exemplarily, as Figure 3 and Figure 4 shown, the display module 300 includes a circuit board 40, and the bonding portion 20C extends along the first direction Y parallel to the center line C3-C3 in the first direction Y; in the direction perpendicular to the first direction Y, the circuit board 40 is electrically connected to the bonding portion 20C on one side of the center line C3-C3 of the bonding portion 20C.

[0070] Exemplarily, as Figure 5 shown, the circuit board 40 is relatively fragile, or the circuit board 40 is prone to move relative to the substrate of the display module 300. Therefore, the bonding layer 13 cannot be bonded to the circuit board 40.

[0071] Exemplarily, as Figure 1 shown, in the direction perpendicular to the first direction Y, the width of the second plate body portion 102 is the second width d2, the width of the first plate body portion 101 is the first width d1, and the second width is smaller than the first width d1.

[0072] Exemplarily, as Figure 4 and Figure 5As shown, in a direction perpendicular to the first direction Y, the width of the second plate portion 102 is smaller than that of the first plate portion 101. The second plate portion 102 is connected to the first plate portion 101 on one side of the center line of the first plate portion 101 along the first direction Y, such that the adhesive layer 13 and the circuit board 40 are respectively located on both sides of the center line C3 - C3, preventing the adhesive layer 13 from adhering to the circuit board 40 and avoiding damage to the circuit board 40.

[0073] In some embodiments, such as Figure 1 and Figure 6 as shown, on the side of the barrier wall 12 away from the groove 11, the edge of the anti - overflow baffle 10 has a registration notch 14.

[0074] Exemplarily, such as Figure 1 and Figure 6 as shown, the registration notch 14 can help the anti - overflow baffle 10 to be aligned with the top - view edge of the bent portion 20B or the edge of the protective cover plate 17.

[0075] Exemplarily, as shown in 6, in the first direction Y, the width of the registration notch 14 is the third width d3. When the dispensing die 100 is fixed to the back of the display module 300, the distance between the top - view edge of the bent portion 20B or the edge of the protective cover plate 17 and the edge of the registration notch 14 is the fourth width d4. By controlling the preset size relationship between the fourth width d4 and the third width d3, the position accuracy of the dispensing die 100 fixed to the back of the display module 300 can be controlled.

[0076] Exemplarily, as shown in 6, in some embodiments, the preset size relationship between the fourth width d4 and the third width d3 is: the fourth width d4 is half of the third width d3, which is more convenient for the human eye or machine to determine whether the position accuracy of the dispensing die 100 relative to the display module 300 is qualified.

[0077] Exemplarily, as shown in 9, in some embodiments, in the dispensing process, the registration notch 14 can also be used to determine the amount of glue in the protective glue layer 400. For example, when the amount of glue in the protective glue layer 400 reaches the edge of the registration notch 14 close to the groove 11, it is determined that the glue reaches the preset amount. For example, when the amount of glue in the protective glue layer 400 reaches half of the third width d3 of the registration notch 14, it is determined that the glue reaches the preset amount.

[0078] It should be noted that, in some embodiments, such as Figure 1 and Figure 6As shown, the anti-overflow baffle 10 further includes anti-collision claws 15. The anti-collision claws 15 are located on the side of the alignment notch 14 away from the groove 11, and the anti-collision claws 15 are connected to the side edge of the alignment notch 14. Before the dispensing process, the anti-collision claws 15 can prevent the dispensing mold 100 from damaging the alignment notch 14 after being impacted by an external force, avoiding affecting the alignment accuracy in the dispensing process. During the dispensing process, the anti-collision claws 15 can protrude beyond the top-down edge of the bent portion 20B or the edge of the protective cover plate 17. When impacted by an external force, the anti-collision claws 15 can prevent the edge of the bent portion 20B or the edge of the protective cover plate 17 from being impacted.

[0079] It should be noted that, in some embodiments, as Figure 1 and Figure 6 shown, the alignment notch 14 can be two or more. Exemplarily, the anti-collision claws 15 can also be two or more.

[0080] It should be noted that the anti-overflow baffle 10 can be an integrally formed structure. For example, the groove 11, the blocking wall 12, the first plate body portion 101, the second plate body portion 102, etc. in the anti-overflow baffle 10 are integrally injection-molded structures, making the thickness and other topographies of the protective glue layer 400 more stable.

[0081] It should be noted that, in the embodiments of the present application, as Figure 8 shown, the anti-overflow baffle 10 can have a certain curved surface. For example, at least some parts of the first plate body portion 101 have the shape of a curved surface, so as to form a protective glue layer 400 with a curved surface shape, making the shape of the protective glue layer 400 more matched with the shape of the bent portion 20B, which can better protect the bent portion 20B and can reduce the thickness of the display module 300 after dispensing.

[0082] It should be noted that, in the embodiments of the present application, as Figure 8 shown, according to the shape of the display module 300 required by the terminal product (such as electronic products like mobile phones), a dispensing mold 100 with corresponding shapes and sizes can be designed, for example, to form a protective glue layer 400 with a curved surface shape.

[0083] In some embodiments, the dispensing mold 100 further includes an anti-sticking layer, and the anti-sticking layer is at least provided on the first surface 10a of the blocking wall 12 on the side away from the groove 11.

[0084] Exemplarily, the anti-sticking layer is at least provided on the first surface 10a of the blocking wall 12 on the side away from the groove 11, that is, the anti-sticking layer is at least provided on the surface forming the dispensing space 301.

[0085] Exemplarily, the material of the anti-sticking layer can be nano-silver, or fluoride coating, etc. After the dispensing process is completed and the dispensing mold 100 is removed, it can prevent glue residue from remaining on the dispensing mold 100.

[0086] In a second aspect, the present application also provides a dispensing method for a display module, and the dispensing mold 100 of any of the above can be applied to the dispensing method of this display module 300. The dispensing method of the display module 300 includes: step S100, step S200, step S300, step S400, step S500, and step S600.

[0087] Step S100: Provide a dispensing mold for a display module. The dispensing mold includes an anti-overflow baffle and an adhesive layer. The anti-overflow baffle has a first surface and a second surface. The anti-overflow baffle includes a groove on the first surface and a blocking wall located on one side of the groove along a first direction. The adhesive layer is located on the first surface and on the side of the blocking wall close to the groove.

[0088] Exemplarily, provide a dispensing mold 100 for a display module of any of the above.

[0089] Exemplarily, provide a dispensing mold 100 for a display module. The dispensing mold 100 includes an anti-overflow baffle 10 and an adhesive layer 13. The anti-overflow baffle 10 has a first surface 10a and a second surface 10b. The anti-overflow baffle 10 includes a groove 11 on the first surface 10a and a blocking wall 12 located on one side of the groove 11 along the first direction Y. The adhesive layer 13 is located on the first surface 10a and on the side of the blocking wall 12 close to the groove 11.

[0090] Step S200: Provide a display module. The display module includes a display panel. The display panel includes a display portion, a bending portion located on one side of the display portion, and a bonding portion located on the side of the bending portion away from the display portion. The bonding portion is bent toward the side away from the light-emitting surface of the display portion.

[0091] Exemplarily, provide a display module 300. The display module 300 includes a display panel 200. The display panel 200 includes a display portion 20A, a bending portion 20B located on one side of the display portion 20A, and a bonding portion 20C located on the side of the bending portion 20B away from the display portion 20A. The bonding portion 20C is bent toward the side away from the light-emitting surface of the display portion 20A.

[0092] Exemplarily, the dispensing method of the display module of the present application can also be used for Figure 3 The dispensing process of other display modules other than the examples, for example, the dispensing process for a display module / display panel that does not include the bending portion 20B. The formed protective glue layer can also play a role in protecting the display module / display panel.

[0093] Step S300: detachably and fixedly arrange the dispensing mold on the side of the bonding part facing away from the display part, with the first surface arranged opposite to the bonding part. The orthographic projection of the barrier wall on the display panel is located on the side of the orthographic projection of the groove on the display panel closer to the bending part. At least the part of the anti-overflow baffle on the side away from the groove forms a dispensing space with the bonding part, and the opening of the dispensing space faces the outside of the display panel along the first direction.

[0094] Exemplarily, as Figure 8 shown, detachably and fixedly arrange the dispensing mold 100 on the side of the bonding part 20C facing away from the display part 20A, with the first surface 10a arranged opposite to the bonding part 20C. The orthographic projection of the barrier wall 12 on the display panel is located on the side of the orthographic projection of the groove 11 on the display panel closer to the bending part 20B. At least the part of the anti-overflow baffle 10 on the side away from the groove 11 forms a dispensing space 301 with the bonding part 20C, and the opening 301K of the dispensing space 301 faces the outside of the display panel along the first direction Y.

[0095] Step S400: fill the dispensing space with glue material from the opening.

[0096] Exemplarily, as Figure 9 shown, fill the dispensing space 301 with glue material from the opening 301K.

[0097] Exemplarily, as Figure 9 shown, the glue material can be filled into the dispensing space 301 from the opening 301K through a dispensing device 500, which can be a dispensing process or a spraying process, and is not limited herein.

[0098] Step S500: cure the glue material to form a protective glue layer.

[0099] Exemplarily, cure the glue material to form a protective glue layer 400.

[0100] Step S600: remove the dispensing mold.

[0101] Exemplarily, as Figure 10 shown, remove the dispensing mold 100, and the protective glue layer 400 remains on the display panel, and the protective glue layer 400 can play a role in protecting the bending part 20B.

[0102] In some embodiments, as Figure 8 shown, and please also refer to Figure 1 and Figure 5, in the step of detachably and fixedly arranging the dispensing mold 100 on the side of the bonding part 20C facing away from the display part 20A (step S300), the barrier wall 12 is in matching contact with the surface of the bonding part 20C in the display module 300 on the side facing away from the display part 20A. The barrier wall 12 includes a first barrier wall part 121 extending along the second direction X, and two second barrier wall parts 122 respectively connected to both ends of the first barrier wall part 121. The second barrier wall parts 122 extend along the first direction Y towards the direction away from the groove 11 of the first barrier wall part 121. The second direction X intersects with the first direction Y, and the barrier wall 12 surrounds the dispensing space 301.

[0103] In some embodiments, as Figure 3 shown, the display module 300 further includes a driving chip 30. The driving chip 30 is electrically connected to the bonding part 20C on the side of the bonding part 20C facing away from the display part 20A; as Figure 8 shown, in the step of detachably and fixedly arranging the dispensing mold 100 on the side of the bonding part 20C facing away from the display part 20A (step S300), the driving chip 30 is received in the groove 11.

[0104] In some embodiments, as Figure 3 shown, the display module 300 further includes a protective cover plate 17. The protective cover plate 17 is attached to the side of the display part 20A facing away from the bonding part 20C.

[0105] In the step of detachably and fixedly arranging the dispensing mold 100 on the side of the bonding part 20C facing away from the display part 20A (step S300), as Figure 8 shown, the dispensing space 301 includes a first space part 3011 located between the anti-overflow baffle 10 and the bonding part 20C, and a second space part 3012 between the anti-overflow baffle 10 and the protective cover plate 17. The second space part 3012 is located on the side of the first space part 3011 away from the groove 11, and the first space part 3011 communicates with the second space part 3012.

[0106] In the step of curing the glue material to form the protective glue layer 400 (step S500), the protective glue layer 400 covers the bent part 20B.

[0107] Exemplarily, as Figure 8 shown, the second space part 3012 is located on the side of the first space part 3011 away from the groove 11, and the first space part 3011 communicates with the second space part 3012, so that the formed protective glue layer 400 covers the bent part 20B, and the protective glue layer 400 can better protect the bent part 20B.

[0108] In a third aspect, as Figure 10 shown, Figure 10It is also a schematic diagram of a display module provided by an embodiment of the present application. The present application also provides a display module 300, and the display module 300 is manufactured by using the dispensing method of the display module 300 in any one of the above.

[0109] The display module provided by the embodiment of the present application can be applied to mobile phones, and can also be applied to any electronic product with a display function, including but not limited to the following categories: televisions, laptop computers, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, in-vehicle displays, industrial control devices, medical display screens, touch interaction terminals, etc. The embodiments of the present application do not make special limitations on this.

[0110] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0111] The above-described embodiments only express several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A dispensing mold for a display module, characterized in that: include: An anti-overflow baffle having a first surface and a second surface, the anti-overflow baffle comprising a groove and a blocking wall located on the first surface, the blocking wall being located on one side of the groove along a first direction; The bonding layer is located on the first surface and on a side of the blocking wall close to the groove.

2. The dispensing mold for the display module according to claim 1, characterized in that: The blocking wall includes a first blocking wall portion extending along a second direction, and two second blocking wall portions respectively connected to both ends of the first blocking wall portion, the second blocking wall portions extending along the first direction toward the first blocking wall portion away from the groove, and the second direction intersects with the first direction.

3. The dispensing mold for the display module according to claim 1, characterized in that: The anti-overflow baffle includes a first plate body portion and a second plate body portion arranged and connected in the first direction; The bonding layer is located on the second plate body, and the bonding layer is located on a side of the groove away from the blocking wall; In a direction perpendicular to the first direction, the width of the second plate portion is smaller than that of the first plate portion, and the second plate portion is connected to the first plate portion at one side of a center line of the first plate portion along the first direction.

4. The dispensing mold for the display module according to claim 1, characterized in that: On a side of the blocking wall away from the groove, an edge of the anti-overflow baffle has an alignment notch.

5. The dispensing mold for the display module according to claim 1, characterized in that: Also includes: The anti-sticking layer is at least arranged on the first surface of the barrier wall at a side away from the groove.

6. A method for dispensing glue for a display module, characterized in that: include: A dispensing mold for a display module is provided, the dispensing mold comprising an anti-overflow baffle and an adhesive layer, the anti-overflow baffle having a first surface and a second surface, the anti-overflow baffle comprising a groove on the first surface, and a blocking wall located at one side of the groove along a first direction, the adhesive layer being located on the first surface and at a side of the blocking wall close to the groove; A display module is provided, the display module comprising a display panel, the display panel comprising a display portion and a bent portion located at one side of the display portion, and a binding portion located at a side of the bent portion away from the display portion, the binding portion being bent toward a side away from a light emitting surface of the display portion; The dispensing mold is detachably fixedly arranged on a side of the binding portion away from the display portion, the first surface is arranged opposite to the binding portion, the orthographic projection of the blocking wall on the display panel is located on a side of the orthographic projection of the groove on the display panel close to the bending portion, and a portion of the anti-overflow baffle located on a side of the blocking wall away from the groove forms a dispensing space with at least the binding portion, and the opening of the dispensing space faces the outside of the display panel along the first direction; Filling glue material into the glue dispensing space through the opening; Curing the adhesive material to form a protective adhesive layer; The dispensing mold is removed.

7. The method for dispensing a display module according to claim 6, characterized in that: In the step of detachably fixing the dispensing mold on the side of the binding part away from the display part, the blocking wall is in matching contact with the surface of the binding part in the display module away from the display part, and the blocking wall includes a first blocking wall portion extending along the second direction, and two second blocking wall portions respectively connected to the two ends of the first blocking wall portion, the second blocking wall portion extends along the first direction toward the direction of the first blocking wall portion away from the groove, the second direction intersects with the first direction, and the blocking wall surrounds the dispensing space.

8. The method for dispensing a display module according to claim 6, characterized in that: The display module further includes a driving chip, wherein the driving chip is electrically connected to the binding portion at a side of the binding portion away from the display portion; In the step of detachably fixing the glue dispensing mold on a side of the binding portion away from the display portion, the driving chip is accommodated in the groove.

9. The method for dispensing a display module according to claim 6, characterized in that: The display module further includes a protective cover plate, which is attached to a side of the display portion away from the binding portion; In the step of detachably fixing the glue dispensing mold on a side of the binding portion away from the display portion, the glue dispensing space includes a first space portion located between the anti-overflow baffle and the binding portion, and a second space portion between the anti-overflow baffle and the protective cover plate, the second space portion is located on a side of the first space portion away from the groove, and the first space portion is connected to the second space portion; In the step of curing the adhesive material to form a protective adhesive layer, the protective adhesive layer covers the bending portion.

10. A display module, characterized in that: The display module is manufactured by the dispensing method of any one of claims 6 to 9.

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