A soldering jig for chip processing

Abstract

The application discloses a reflow soldering clamp for chip processing and relates to the technical field of chip processing. The application comprises a supporting assembly. The supporting assembly comprises a base, and a suction assembly is fixedly connected to the top of the base. The suction assembly comprises a mounting plate, a vacuum suction platform is fixedly connected to the bottom of the mounting plate, and a sliding rheostat is fixedly connected to the top of the mounting plate. Two clamping assemblies for clamping and fixing chips are fixedly connected to the bottom of the mounting plate, an adjusting and controlling assembly for adjusting the clamping force of the clamping assemblies is fixedly connected to the top of the mounting plate, and the adjusting and controlling assembly comprises a heat conduction rod which is fixedly inserted through the top of the mounting plate. The heating degree of the chip changes, the clamping force of the two clamping assemblies in the horizontal direction and the suction force of the vacuum suction platform in the vertical direction are changed in real time, the chip is prevented from swelling due to heating, the deformation of the chip in the reflow soldering process is avoided, and the quality of chip production is improved.

Description

Technical Field

[0001] This invention belongs to the field of chip processing technology, and in particular relates to a welding fixture for chip processing. Background Technology

[0002] Chip soldering is crucial and is a key process in the production of products by manufacturers. It fixes the chip in the product through soldering. In the traditional chip soldering process, soldering jigs are generally used to fix the chip and then solder it.

[0003] Existing welding fixtures typically use screws and clamping blocks to hold chips in place. During welding, chips expand due to heat, and the fixtures that maintain the clamping force cannot accommodate this expansion, easily causing chip deformation and affecting the quality of the welding. To address this issue, we provide a welding fixture for chip processing to solve the aforementioned problems. Summary of the Invention

[0004] The purpose of this invention is to provide a welding fixture for chip processing. By changing the degree of chip heating, the clamping force of the two clamping components in the horizontal direction and the adsorption force of the vacuum adsorption platform in the vertical direction are changed in real time. This avoids the chip from expanding due to heat and causing deformation during the welding process, thereby improving the quality of chip production. This invention solves the problem that existing welding fixtures cannot adapt to the chip expansion due to heat during the welding process, which easily causes chip deformation and affects the quality of the chip after welding.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: The present invention is a welding fixture for chip processing, including a support assembly; the support assembly includes a base, and an adsorption assembly is fixedly fitted on the top of the base; the adsorption assembly includes a mounting plate, a vacuum adsorption platform is fixedly connected to the bottom of the mounting plate, and a sliding rheostat is fixedly connected to the top of the mounting plate; two clamping assemblies for clamping and fixing chips are fixedly fitted on the bottom of the mounting plate, and a regulating assembly for adjusting the clamping force of the clamping assemblies is fixedly fitted on the top of the mounting plate; the regulating assembly includes a heat-conducting rod that is fixedly inserted through the top of the mounting plate, and the regulating assembly also includes a fixed connection... A cylindrical tube is attached to the top of the mounting plate and covers the heat-conducting rod. An air bladder is fitted on the outer wall of the heat-conducting rod and located inside the cylindrical tube. A piston plate that slides against the air bladder is slidably fitted on the inner wall of the cylindrical tube. A sliding rod extending through the outside of the cylindrical tube is fixedly connected to the top of the piston plate. A toothed plate is fixedly connected to the top of the sliding rod. The control assembly also includes a fixed plate fixedly connected to the top of the mounting plate. A lead screw is rotatably connected through one side of the fixed plate. A spur gear meshing with the toothed plate is fixedly connected to one end of the lead screw. A moving plate is threadedly connected to the circumferential side of the lead screw. A connecting rod is fixedly connected to one side of the moving plate. The end of the connecting rod is fixedly connected to a slider on a sliding rheostat.

[0006] Furthermore, the support assembly also includes a solder pool fixedly connected to the top of the base, a control box fixedly connected to the top of the base, a support column fixedly connected to the top of the base, a horizontal plate fixedly connected to the top of the support column, and a reinforcing rib fixedly connected between the horizontal plate and the support column; a load-bearing plate is hinged to one side of the horizontal plate, a hydraulic cylinder is fixedly connected to the bottom of the load-bearing plate, the output end of the hydraulic cylinder is fixedly engaged with the mounting plate, and a baffle that abuts against the load-bearing plate is fixedly connected to one side of the horizontal plate.

[0007] Furthermore, a guide groove is provided on one side of the horizontal plate, and a first slider is slidably connected inside the guide groove. A support rod is hinged to one side of the first slider, and the support rod is hinged to the load-bearing plate. An electric push rod is fixedly connected to one side of the horizontal plate, and the output end of the electric push rod is fixedly connected to the first slider.

[0008] Furthermore, the adsorption assembly also includes a power supply fixedly connected to the top of the mounting plate, a vacuum pump fixedly connected to the top of the mounting plate, and L-shaped limiting plates fixedly connected to both opposite sides of the vacuum adsorption platform.

[0009] Furthermore, the clamping assembly also includes two electromagnet plates fixedly connected to the bottom of the mounting plate. A movable rod is slidably connected through one side of each electromagnet plate. A vertical plate is fixedly connected to one end of the movable rod. A return spring sleeved on the movable rod is fixedly connected between the vertical plate and the electromagnet plates.

[0010] Furthermore, a wedge block is fixedly connected to the other end of the moving rod, and a first fixing rod is fixedly connected between two adjacent wedge blocks. The clamping assembly also includes a vertical plate slidably connected to the bottom of the mounting plate. An elastic block that cooperates with the two wedge blocks is symmetrically fixedly connected to one side of the vertical plate near the wedge block. A first slot is symmetrically opened on the side of the vertical plate away from the wedge block. A first sliding groove is opened on both inner sides of the first slot. A second slot located above the first slot is symmetrically opened through one side of the vertical plate.

[0011] Furthermore, a pressure plate is slidably connected inside the first slot, and guide plates that slide and cooperate with the first groove are fixedly connected to the opposite sides of the pressure plate. A top rod that slides through the second slot is fixedly connected to the top of the pressure plate. A rotating shaft is rotatably connected to the opposite inner sides of the second slot, and a rotating plate is fixedly connected between the two rotating shafts. A second groove is opened at the bottom of the rotating plate, and a second slider is slidably connected inside the second groove. The second slider is hinged to the top rod, and a second fixing rod is fixedly connected between two adjacent rotating plates.

[0012] Furthermore, the control box is equipped with a PLC controller, which is electrically connected to the power supply, vacuum pump, and electromagnet plate.

[0013] The present invention has the following beneficial effects: 1. The present invention fixes the chip by adsorption components, then fixes the chip side by two clamping components, and then adjusts the chip height by a support component to enable chip soldering. During the soldering process, the heat-conducting rod on the control component is heated in the solder bath. The heat is transferred to the air bag through the heat-conducting rod. The air bag expands due to heat, which in turn moves the piston plate upward. This causes the piston plate to move the toothed plate upward through the slide rod, which in turn drives the spur gear to rotate. This further drives the lead screw to rotate, which in turn moves the moving plate and connecting rod away from the fixed plate. This in turn moves the slider on the sliding rheostat away from the fixed plate, thereby increasing the resistance of the sliding rheostat and reducing the current in the circuit. This reduces the clamping force of the clamping components on the chip from the side, and also reduces the vertical adsorption capacity of the vacuum adsorption platform on the chip. By changing the degree of chip heating, the clamping force of the two clamping components in the horizontal direction and the adsorption force of the vacuum adsorption platform in the vertical direction are changed in real time, thereby avoiding chip expansion due to heat and deformation during the soldering process, thus improving the quality of chip production.

[0014] 2. This invention controls an electric push rod to move the first slider away from the baffle, causing the first slider to rotate the load-bearing plate towards the first slider via a support rod. This causes the load-bearing plate to rotate the adsorption assembly and clamping assembly away from the solder pool, making it easier for operators to install and remove chips, thereby improving ease of use.

[0015] 3. This invention controls the vacuum pump to start, creating negative pressure on the vacuum adsorption platform, which then adsorbs the chip. Next, the electromagnet plate is energized, generating an adsorption force that moves the vertical plate closer to the electromagnet plate. This, in turn, moves the wedge block closer to the vertical plate via a moving rod, causing the wedge block to contact the vertical plate and move the vertical plate closer to the outer wall of the chip. As the wedge block continues to move closer to the vertical plate, it compresses the elastic block and simultaneously squeezes the rotating plate, causing it to rotate. This rotating plate, via the second slider and top rod, moves the pressure plate upward until it contacts the bottom of the chip, thus securing the chip from the bottom. The use of the clamping assembly initially enables the chip to be secured from the side and bottom, and, combined with the adsorption of the vacuum adsorption platform, further improves the stability of chip clamping. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a welding fixture used in chip processing.

[0018] Figure 2 for Figure 1 A frontal view of the structure.

[0019] Figure 3 This is a schematic diagram of the support component in this invention.

[0020] Figure 4 This is a schematic diagram of the adsorption component in this invention.

[0021] Figure 5 for Figure 4 A frontal view of the structure.

[0022] Figure 6 This is a bottom view of the connection between the vacuum adsorption platform and the L-shaped limiting plate in this invention.

[0023] Figure 7This is a schematic diagram of the clamping component in this invention.

[0024] Figure 8 for Figure 7 A side view structural diagram.

[0025] Figure 9 This is a schematic diagram of the structure at the connection between the vertical plate, the first slot, and the second slot in this invention.

[0026] Figure 10 This is a partial bottom view of the clamping component in this invention.

[0027] Figure 11 This is a schematic diagram of the connection between the adsorption component and the clamping component in this invention.

[0028] Figure 12 This is a schematic diagram of the control component in this invention.

[0029] The attached diagram lists the components represented by each number as follows:

[0030] 1-Support assembly, 101-Base, 102-Solder pool, 103-Control box, 104-Support column, 105-Horizontal plate, 106-Reinforcing rib, 107-Bearing plate, 108-Hydraulic cylinder, 109-Baffle, 110-Guide groove, 111-First slider, 112-Stretch rod, 113-Electric push rod, 2-Adsorption assembly, 201-Mounting plate, 202-Vacuum adsorption platform, 203-Sliding rheostat, 204-Power supply, 205-Vacuum pump, 206-L-shaped limit plate, 3-Clamping assembly, 301-Electromagnetic plate, 302-Moving rod, 303-Upright plate, 304-Reset spring, 3 05-Wedge block, 306-First fixed rod, 307-Vertical plate, 308-Elastic block, 309-First groove, 310-First sliding groove, 311-Second groove, 312-Pressure plate, 313-Guide plate, 314-Top rod, 315-Second fixed rod, 316-Rotating shaft, 317-Rotating plate, 318-Second sliding groove, 319-Second slider, 4-Control component, 401-Heat-conducting rod, 402-Cylindrical tube, 403-Airbag, 404-Piston plate, 405-Sliding rod, 406-Gear plate, 407-Fixed plate, 408-Lead screw, 409-Spur gear, 410-Moving plate, 411-Connecting rod. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example 1, please refer to Figure 1-12 The present invention provides the following technical solution: a welding fixture for chip processing, comprising a support component 1; the support component 1 includes a base 101, and an adsorption component 2 is fixedly fitted on the top of the base 101; the adsorption component 2 includes a mounting plate 201, and a vacuum adsorption platform 202 (the vacuum adsorption platform 202 is composed of an adsorption panel, a vacuum tank, a sealing element, a vacuum source interface, a support frame, a vent layout, an auxiliary system, etc., which is prior art and will not be described in detail here) is fixedly connected to the bottom of the mounting plate 201; two clamping components 3 for clamping and fixing chips are fixedly fitted on the bottom of the mounting plate 201, and a regulating component 4 for adjusting the clamping force of the clamping components 3 is fixedly fitted on the top of the mounting plate 201; the regulating component 4 includes a heat-conducting rod 401 that is fixedly inserted through the top of the mounting plate 201, and the regulating component 4 also includes a heat-conducting rod 401 fixedly fitted to the top of the mounting plate 201. A cylindrical tube 402 is mounted on the heat-conducting rod 401. An air bladder 403 (made of silicone material, with a temperature tolerance range of -60℃ to 300℃) is fitted inside the cylindrical tube 402 on the outer wall of the heat-conducting rod 401. A piston plate 404 is slidably fitted on the inner wall of the cylindrical tube 402, which abuts against the air bladder 403. A slide rod 405 extending through the outer side of the cylindrical tube 402 is fixedly connected to the top of the piston plate 404. The top of the slide rod 405 is fixedly connected to... The control assembly 4 also includes a gear plate 406; a fixed plate 407 is fixedly connected to the top of the mounting plate 201. A lead screw 408 is rotatably connected through one side of the fixed plate 407. A spur gear 409 that meshes with the gear plate 406 is fixedly connected to one end of the lead screw 408. A movable plate 410 is threadedly connected to the circumferential side of the lead screw 408. A connecting rod 411 is fixedly connected to one side of the movable plate 410. The end of the connecting rod 411 is fixedly connected to the upper slide plate of the sliding rheostat 203.

[0033] The operation process of this embodiment is as follows: First, the chip is adsorbed and fixed by the adsorption component 2. Then, the chip is fixed to the side by two clamping components 3. Subsequently, the chip height is adjusted by the support component 1 so that the chip can be soldered. During the soldering process, the heat-conducting rod 401 on the control component 4 is heated in the solder pool 102. The heat is transferred to the air bag 403 through the heat-conducting rod 401. The air bag 403 expands due to heat, thereby driving the piston plate 404 to move upward. This causes the piston plate 404 to drive the toothed plate 406 to move upward through the slide rod 405, thereby driving the spur gear 409 to rotate, which in turn drives the lead screw 408 to rotate, thereby driving the moving plate 410. The connecting rod 411 moves away from the fixed plate 407, which in turn drives the slider on the sliding rheostat 203 to move away from the fixed plate 407, thereby increasing the resistance of the sliding rheostat 203 and reducing the current in the circuit. This reduces the clamping force of the clamping assembly 3 on the chip from the side, and at the same time reduces the adsorption capacity of the vacuum adsorption platform 202 on the chip in the vertical direction. By changing the degree of chip heating, the clamping force of the two clamping assemblies 3 in the horizontal direction and the adsorption force of the vacuum adsorption platform 202 in the vertical direction are changed in real time, thereby avoiding the chip from expanding due to heat and causing deformation of the chip during the welding process, thus improving the quality of chip production.

[0034] Example 2, please refer to Figure 1-12 This second embodiment improves upon the first embodiment as follows: the support assembly 1 further includes a solder pool 102 fixedly connected to the top of the base 101 (the internal temperature of the solder pool 102 is controllable, which is prior art and will not be described further); a control box 103 is fixedly connected to the top of the base 101; a support column 104 is fixedly connected to the top of the base 101; a horizontal plate 105 is fixedly connected to the top of the support column 104; a reinforcing rib 106 is fixedly connected between the horizontal plate 105 and the support column 104 (the reinforcing rib 106 further improves the stability of the horizontal plate 105); a bearing is hinged to one side of the horizontal plate 105. The load-bearing plate 107 has a hydraulic cylinder 108 fixedly connected to its bottom. The output end of the hydraulic cylinder 108 is fixedly engaged with the mounting plate 201. A baffle 109 that abuts against the load-bearing plate 107 is fixedly connected to one side of the horizontal plate 105. A guide groove 110 is provided on one side of the horizontal plate 105. A first slider 111 is slidably connected inside the guide groove 110. A support rod 112 is hingedly connected to one side of the first slider 111. The support rod 112 is hingedly connected to the load-bearing plate 107. An electric push rod 113 is fixedly connected to one side of the horizontal plate 105. The output end of the electric push rod 113 is fixedly connected to the first slider 111.

[0035] The operation process of this embodiment is as follows: By controlling the electric push rod 113, the first slider 111 is moved away from the baffle 109. This causes the first slider 111 to rotate the load-bearing plate 107 towards the first slider 111 via the support rod 112. The load-bearing plate 107 then causes the adsorption assembly 2 and the clamping assembly 3 to rotate away from the solder pool 102, making it easier for operators to install and remove the chip, thus improving usability. After the chip is installed in the adsorption assembly 2 and the clamping assembly 3, the electric push rod 113 is controlled to move the first slider 111 away from the baffle 109. 1. Move towards the baffle 109, so that the first slider 111 drives the load-bearing plate 107 to rotate towards the baffle 109 via the support rod 112. When the load-bearing plate 107 rotates to abut against the baffle 109, the chip is just above the solder pool 102. By moving the clamped chip into the solder pool 102, the inside of the solder pool 102 is filled with molten solder. At this time, the solder on the chip is in contact with the molten solder. By precisely controlling the temperature of the solder pool 102, the solder on the chip is melted again and a reliable solder joint is formed.

[0036] Example 3, please refer to Figure 1-12 This embodiment three is an improvement on the first embodiment as follows: the adsorption component 2 further includes a power supply 204 fixedly connected to the top of the mounting plate 201, a vacuum pump 205 fixedly connected to the top of the mounting plate 201, and L-shaped limiting plates 206 fixedly connected to both sides of the vacuum adsorption platform 202. The clamping component 3 further includes two electromagnet plates 301 fixedly connected to the bottom of the mounting plate 201. A moving rod 302 is slidably connected through one side of the electromagnet plate 301. A vertical plate 303 (made of metal material that can be attracted by the electromagnet plate 301 after being energized) is fixedly connected to one end of the moving rod 302. A reset spring 304 sleeved on the moving rod 302 is fixedly connected between the vertical plate 303 and the electromagnet plate 301. A wedge block 305 is fixedly connected to the other end of the moving rod 302. A first fixing rod 306 is fixedly connected between two adjacent wedge blocks 305.

[0037] The clamping assembly 3 also includes a vertical plate 307 slidably connected to the bottom of the mounting plate 201. On the side of the vertical plate 307 near the wedge blocks 305, elastic blocks 308 that cooperate with the two wedge blocks 305 are symmetrically fixedly connected. On the side of the vertical plate 307 away from the wedge blocks 305, a first slot 309 is symmetrically formed. On both inner sides of the first slot 309, a first sliding groove 310 is formed. On one side of the vertical plate 307, a second slot 311 is symmetrically formed, located above the first slot 309. A pressure plate 312 is slidably connected inside the first slot 309. On both sides of the pressure plate 312, guide plates 3 that slide and cooperate with the first sliding groove 310 are fixedly connected. 13. A top rod 314 is fixedly connected to the top of the pressure plate 312 and slides through into the second slot 311; a rotating shaft 316 is rotatably connected to both inner sides of the second slot 311, and a rotating plate 317 is fixedly connected between the two rotating shafts 316. A second sliding groove 318 is opened at the bottom of the rotating plate 317, and a second slider 319 is slidably connected inside the second sliding groove 318. The second slider 319 is hinged to the top rod 314, and a second fixing rod 315 is fixedly connected between two adjacent rotating plates 317. A PLC controller is installed in the control box 103, and the PLC controller is electrically connected to the power supply 204, the vacuum pump 205, and the electromagnet plate 301.

[0038] The operation process of this embodiment is as follows: By controlling the vacuum pump 205 to start, a negative pressure is generated in the vacuum adsorption platform 202, causing the vacuum adsorption platform 202 to adsorb the chip. Then, the electromagnet plate 301 is energized, causing the electromagnet plate 301 to generate an adsorption force, which drives the vertical plate 303 to move closer to the electromagnet plate 301. Then, the moving rod 302 drives the wedge block 305 to move closer to the vertical plate 307, so that the wedge block 305 abuts against the vertical plate 307, causing the vertical plate 307 to move closer to the outer wall of the chip. The wedge block 305 continues to move closer to the vertical plate 307 (when it is necessary for the vertical plate 307 to release the chip, after the vertical plate 307 is no longer under force, by...). The two vertical plates 307 are controlled to move away from each other, so that the two vertical plates 307 are no longer in contact with the chip. At this time, the wedge block 305 compresses the elastic block 308, and at the same time, the wedge block 305 squeezes the rotating plate 317, causing the rotating plate 317 to rotate. The rotating plate 317 drives the pressure plate 312 to move upward through the second slider 319 and the top rod 314. The pressure plate 312 moves upward until it abuts against the bottom of the chip, thereby completing the fixation of the chip by the pressure plate 312 from the bottom. Through the use of the clamping component 3, the clamping component 3 can initially achieve the fixation of the chip from the side and bottom of the chip, and in conjunction with the adsorption of the vacuum adsorption platform 202, the stability of the chip clamping is further improved.

[0039] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A welding fixture for chip processing, comprising a support assembly (1); characterized in that: The support assembly (1) includes a base (101) and a solder pool (102) fixedly connected to the top of the base (101); an adsorption assembly (2) is fixedly fitted above the base (101), the adsorption assembly (2) includes a mounting plate (201), a vacuum adsorption platform (202) is fixedly connected to the bottom of the mounting plate (201), and a sliding rheostat (203) is fixedly connected to the top of the mounting plate (201); The bottom of the mounting plate (201) is fixedly fitted with two clamping components (3) for clamping and fixing the chip, and the top of the mounting plate (201) is fixedly fitted with a regulating component (4) for adjusting the clamping force of the clamping components (3). The control component (4) includes a heat-conducting rod (401) that is fixedly inserted through the top of the mounting plate (201). The control component (4) also includes a cylindrical tube (402) that is fixedly connected to the top of the mounting plate (201) and covers the heat-conducting rod (401). An airbag (403) located inside the cylindrical tube (402) is sleeved on the outer wall of the heat-conducting rod (401). The inner wall of the cylindrical tube (402) is slidably fitted with a piston plate (404) that abuts against the airbag (403). The top of the piston plate (404) is fixedly connected to a slide rod (405) that extends through to the outside of the cylindrical tube (402). The top of the slide rod (405) is fixedly connected to a toothed plate (406). The control assembly (4) further includes a fixing plate (407) fixedly connected to the top of the mounting plate (201). A lead screw (408) is rotatably connected through one side of the fixing plate (407). A spur gear (409) meshing with a gear plate (406) is fixedly connected to one end of the lead screw (408). A moving plate (410) is threadedly connected to the circumferential side of the lead screw (408). A connecting rod (411) is fixedly connected to one side of the moving plate (410). The end of the connecting rod (411) is fixedly connected to the slider on the sliding rheostat (203). The clamping assembly (3) also includes two electromagnet plates (301) fixedly connected to the bottom of the mounting plate (201). A moving rod (302) is slidably connected through one side of the electromagnet plate (301). A vertical plate (303) is fixedly connected to one end of the moving rod (302). A return spring (304) sleeved on the moving rod (302) is fixedly connected between the vertical plate (303) and the electromagnet plate (301). The other end of the moving rod (302) is fixedly connected to a wedge block (305), and a first fixing rod (306) is fixedly connected between two adjacent wedge blocks (305). The clamping assembly (3) also includes a vertical plate (307) slidably connected to the bottom of the mounting plate (201). The vertical plate (307) has elastic blocks (308) symmetrically fixedly connected to the side of the wedge block (305) that cooperate with the two wedge blocks (305). The vertical plate (307) has a first slot (309) symmetrically opened on the side away from the wedge block (305). The first slot (309) has a first sliding groove (310) opened on both inner sides. The vertical plate (307) has a second slot (311) symmetrically opened through the side above the first slot (309). A pressure plate (312) is slidably connected inside the first slot (309). The pressure plate (312) is fixedly connected to guide plates (313) that slide with the first slide groove (310) on both sides. A top rod (314) that slides through the second slot (311) is fixedly connected to the top of the pressure plate (312). A rotating shaft (316) is rotatably connected to both sides of the second slot (311). A rotating plate (317) is fixedly connected between the two rotating shafts (316). A second slide groove (318) is opened at the bottom of the rotating plate (317). A second slider (319) is slidably connected inside the second slide groove (318). The second slider (319) is hinged to the top rod (314). A second fixing rod (315) is fixedly connected between two adjacent rotating plates (317).

2. The welding fixture for chip processing according to claim 1, characterized in that, A control box (103) is fixedly connected to the top of the base (101), a support column (104) is fixedly connected to the top of the base (101), a horizontal plate (105) is fixedly connected to the top of the support column (104), and a reinforcing rib (106) is fixedly connected between the horizontal plate (105) and the support column (104). A load-bearing plate (107) is hinged to one side of the horizontal plate (105), and a hydraulic cylinder (108) is fixedly connected to the bottom of the load-bearing plate (107). The output end of the hydraulic cylinder (108) is fixedly engaged with the mounting plate (201), and a baffle (109) that abuts against the load-bearing plate (107) is fixedly connected to one side of the horizontal plate (105).

3. The welding fixture for chip processing according to claim 2, characterized in that, A guide groove (110) is provided on one side of the horizontal plate (105). A first slider (111) is slidably connected inside the guide groove (110). A support rod (112) is hinged to one side of the first slider (111). The support rod (112) is hinged to the load-bearing plate (107). An electric push rod (113) is fixedly connected to one side of the horizontal plate (105). The output end of the electric push rod (113) is fixedly connected to the first slider (111).

4. A welding fixture for chip processing according to claim 3, characterized in that, The adsorption assembly (2) also includes a power supply (204) fixedly connected to the top of the mounting plate (201), a vacuum pump (205) fixedly connected to the top of the mounting plate (201), and L-shaped limiting plates (206) fixedly connected to both sides of the vacuum adsorption platform (202).

5. A welding fixture for chip processing according to claim 4, characterized in that, The control box (103) is equipped with a PLC controller, which is electrically connected to the power supply (204), vacuum pump (205), and electromagnet plate (301).

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