Display substrate laser lift-off device and method

Abstract

The invention provides a display substrate laser lift-off device and method, and relates to the technical field of display substrate laser lift-off, and the display substrate laser lift-off device comprises a transmission positioning module, a laser scanning module, a mechanical separation module and a mechanical separation module. According to the invention, the thickness of the adhesion layer, material characteristics and production parameters are integrated through the laser scanning module, the laser energy density of each region is dynamically regulated and controlled, and an adaptive scanning path is planned, so that the problems of energy matching imbalance and extensive path planning caused by uneven thickness of the adhesion layer and fixed parameters in the prior art are effectively solved; the stripping yield and the production efficiency of the flexible display substrate are remarkably improved, meanwhile, the flexible display substrate stripping device is compatible with various substrate types, and an efficient and reliable solution is provided for high-precision stripping.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser lift-off of display substrates, and particularly relates to a laser lift-off device and method for display substrates. Background Art

[0002] In the field of display panel manufacturing, the laser lift-off technology is the core process for separating a flexible display substrate from a rigid carrier. With the rapid development of flexible display technology, the trends of substrate ultra-thinning, flexibility, and shaping have put forward higher requirements for the lift-off accuracy and yield. Traditional laser lift-off technology usually uniformly irradiates the adhesive layer with fixed laser parameters (such as energy density, scanning speed). However, in actual production, there are thickness non-uniformities (such as thinner edges and thicker centers) and material property differences (such as fluctuations in absorption coefficients and decomposition thresholds of adhesive layers in different batches) in the adhesive layer, resulting in the following technical problems: (1) Energy matching imbalance: Fixed parameters cannot adapt to the thickness changes of the adhesive layer, easily causing insufficient energy in thick areas resulting in decomposition residues (the residue rate can reach more than 5%), or excessive energy in thin areas leading to thermal damage to the substrate (such as cracks, material carbonization, and the damage rate is about 3%-8%), seriously affecting the yield. (2) Coarse scanning path planning: Traditional methods use standardized scanning paths (such as row-by-row scanning), without considering the substrate geometry (such as circular, shaped) and thickness distribution characteristics, resulting in a high proportion of idle strokes (up to more than 40%), low scanning efficiency, and incomplete lift-off problems are likely to occur in the edge area due to poor path adaptability. Summary of the Invention

[0003] The present invention provides a laser lift-off device and method for display substrates to solve at least one of the above-mentioned technical problems.

[0004] To solve the above technical problems, the present invention discloses a laser lift-off device and method for display substrates. The device includes: A transfer and positioning module for transferring the display substrate onto a vacuum adsorption platform, and the vacuum adsorption platform is used to position the display substrate; Wherein, the display substrate includes a display substrate main body and a carrier, and the display substrate main body and the carrier are connected through an adhesive layer; A laser scanning module for collecting and obtaining the laser energy density of different regions of the display substrate based on the adhesive layer thickness distribution map, material property parameters, and current production parameters of the display substrate in different regions, and planning the optimal laser scanning path, and performing laser scanning on the display substrate based on the laser energy density of different regions of the display substrate and the planned optimal laser scanning path; A mechanical separation module for mechanically separating the scanned display substrate to form a display substrate main body and a carrier; The peeling quality inspection module is used to inspect the main body of the display substrate after peeling.

[0005] Preferably, the transfer and positioning module includes: The transfer sub-module is used to stably transfer the display substrate from the upstream process to the vacuum adsorption platform; The adsorption and positioning sub-module is used to firmly fix the transferred display substrate on the vacuum adsorption platform through vacuum adsorption; The vision calibration sub-module is used to perform high-precision calibration on the position and attitude of the display substrate through machine vision technology; The scanning cooperation sub-module is used to drive the vacuum adsorption platform to move precisely in the X, Y, and Z axes, cooperate with the laser scanning module to complete dynamic tracking of the focal position and coverage of the scanning path, and ensure that the laser beam accurately acts on the target area of the adhesion layer; The thermal management sub-module is used to collect the temperature distribution data of each area of the display substrate, and heat or cool each area of the display substrate based on the temperature distribution data results of each area of the display substrate to ensure that the temperature distribution of each area is balanced during the peeling process.

[0006] Preferably, the thermal management sub-module includes: The area division unit is used to take the position where the display substrate is being scanned as the base point position, determine the thermal management area of the display substrate based on the base point position, and divide the thermal management area into several unit areas; The temperature acquisition unit is used to acquire the temperature of several unit areas in the thermal management area; The temperature distribution unevenness coefficient calculation unit is used to calculate the temperature distribution unevenness coefficient of the thermal management area based on the temperature of several unit areas in the thermal management area; The temperature regulation unit is used to determine whether temperature regulation is required based on the calculated temperature distribution unevenness coefficient. If the temperature distribution unevenness coefficient of the thermal management area is greater than the preset temperature distribution unevenness coefficient, the thermal management area is temperature-regulated until the temperature distribution unevenness coefficient of the thermal management area is not greater than the preset temperature distribution unevenness coefficient, otherwise, no regulation is performed.

[0007] Preferably, based on the temperature of several unit areas in the thermal management area, calculate the temperature distribution unevenness coefficient of the thermal management area: ; where is the temperature distribution unevenness coefficient of the thermal management area, is the temperature value of the j-th unit area in the thermal management area, and n is the total number of unit areas in the thermal management area.

[0008] Preferably, the laser scanning module includes: The data acquisition sub-module before peeling is used to collect the thickness data of the adhesion layer in different areas of the display substrate to generate a thickness distribution map, and obtain the material property parameters of the adhesion layer and the production parameters of the current display substrate; The scanning parameter and path planning sub-module is used to calculate the laser energy density in different areas of the display substrate and plan the optimal laser scanning path based on the thickness distribution map, material property parameters and production parameters of the adhesion layer of the current display substrate; The scanning execution unit sub-module is used to perform laser scanning on the display substrate based on the laser energy density in different areas of the display substrate and the planned optimal laser scanning path.

[0009] Preferably, the scanning parameter and path planning sub-module includes: The data preprocessing unit is used to preprocess the thickness distribution map, material property parameters and production parameters of the adhesion layer of the display substrate; The laser energy density calculation unit is used to calculate the laser energy density in different areas of the display substrate based on the thickness value of the adhesion layer in different areas of the display substrate, the material property parameters of the adhesion layer and the production parameters of the display substrate; The optimal laser scanning path planning unit is used to plan the optimal laser scanning path based on the geometric shape of the display substrate and the thickness distribution map of the adhesion layer.

[0010] Preferably, based on the thickness value of the adhesion layer in different areas of the display substrate, the material property parameters of the adhesion layer and the production parameters of the display substrate, calculate the laser energy density in different areas of the display substrate: ; where, is the laser energy density of the area with a thickness of , is the laser energy density correction coefficient, is the target peeling strength in the production parameters of the display substrate, is the thickness value of the adhesion layer, is the absorption coefficient in the material property parameters of the display substrate, is the preset scanning speed in the production parameters of the display substrate, is the decomposition threshold in the material property parameters of the display substrate.

[0011] Preferably, the optimal laser scanning path planning unit includes: The substrate feature analysis sub-unit is used to perform geometric shape recognition and adhesion layer thickness distribution analysis on the display substrate, and the geometric shape recognition results include regular shapes and irregular shapes; A path initial generation subunit, configured to form an initial path based on the recognition result of the geometric shape of the display substrate. When the geometric shape recognition result is a regular shape, a scanning algorithm corresponding to the shape is used to form the initial path. When the geometric shape recognition result is an irregular shape, a contour following algorithm or a partition scanning algorithm is used to form the initial path; A path evaluation subunit, configured to perform an evaluation and analysis on the initial path based on a trained scanning efficiency evaluation model, an energy consumption evaluation model, and a peeling effect evaluation model. If the evaluations of the scanning efficiency, energy consumption, and peeling effect of the initial path are all qualified, the initial path is used as the optimal laser scanning path. Otherwise, the geometric shape of the display substrate is recognized again and the adhesion layer thickness distribution is analyzed, and an algorithm is reselected to plan a new initial path until the evaluations of the scanning efficiency, energy consumption, and peeling effect are all qualified.

[0012] A method for laser peeling of a display substrate, comprising the following steps: Step 1: Transfer the display substrate to a vacuum adsorption platform, and the vacuum adsorption platform is used to position the display substrate; Step 2: Collect and obtain the laser energy density of different regions of the display substrate based on the adhesion layer thickness distribution map, material characteristic parameters, and current production parameters of the display substrate, and plan the optimal laser scanning path. Then, based on the laser energy density of different regions of the display substrate and the planned optimal laser scanning path, perform laser scanning on the display substrate; Step 3: Mechanically peel the scanned display substrate to form a display substrate main body and a carrier; Step 4: Used to perform quality inspection on the peeled display substrate main body.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The laser peeling device for the display substrate of the present invention realizes precise peeling of the adhesion layer of the display substrate through the collaborative work of multiple modules. The transfer and positioning module ensures the stable transfer and positioning of the substrate. The laser scanning module dynamically adjusts the laser energy density and scanning path based on the adhesion layer thickness, material characteristics, and production parameters, solving the problems of energy waste or substrate damage caused by uneven adhesion layer thickness and fixed parameters in traditional devices. The mechanical separation module combines two peeling methods to adapt to different scenarios. The peeling and quality inspection module ensures product quality through appearance and electrical performance detection. The overall solution realizes closed-loop control from data collection, parameter calculation to peeling and quality inspection, significantly improving the peeling yield and production efficiency of the flexible display substrate; The present invention integrates the thickness of the adhesion layer, material properties, and production parameters through a laser scanning module, dynamically regulates the laser energy density in each region, and plans an adapted scanning path, effectively solving the problems of energy matching imbalance and rough path planning caused by uneven adhesion layer thickness and fixed parameters in traditional technologies, significantly improving the peeling yield and production efficiency of flexible display substrates, while being compatible with multiple substrate types, providing an efficient and reliable solution for high-precision peeling. Description of the Drawings

[0014] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings: Figure 1 It is a schematic diagram of a laser peeling device for a display substrate of the present invention. Detailed Embodiments

[0015] The following describes the preferred embodiments of the present invention with reference to the drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0016] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes and do not particularly refer to the order or sequence. Nor are they used to limit the present invention. They are merely used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions and technical features between various embodiments may be combined with each other, but it must be based on the fact that those skilled in the art can implement them. When the combination of technical solutions appears to be contradictory or unable to be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0017] The present invention provides the following embodiments Embodiment 1 The embodiment of the present invention provides a laser peeling device and method for a display substrate, as Figure 1 shown, including: A transfer and positioning module for transferring the display substrate onto a vacuum adsorption platform, and the vacuum adsorption platform is used for positioning the display substrate; Among them, the display substrate includes a display substrate main body and a carrier, and the display substrate main body and the carrier are connected through an adhesion layer; A laser scanning module, which is used to collect the thickness distribution map of the adhesion layer, material characteristic parameters, and production parameters of the current display substrate in different regions of the display substrate, obtain the laser energy density in different regions of the display substrate, plan the optimal laser scanning path, and perform laser scanning on the display substrate based on the laser energy density in different regions of the display substrate and the planned optimal laser scanning path; A mechanical separation module, which is used to mechanically peel the scanned display substrate to form a display substrate body and a carrier; A peeling quality inspection module, which is used to inspect the quality of the peeled display substrate body.

[0018] In this embodiment, the material characteristic parameters include the absorption coefficient (the absorption ability of the adhesion layer to laser energy, the absorption coefficients of different adhesion layers are different, and the larger the absorption coefficient, the stronger the ability of the adhesion layer to absorb laser energy) and the decomposition threshold (the minimum laser energy density required for the adhesion layer to decompose).

[0019] In this embodiment, the production parameters of the display substrate include the target peeling strength (which refers to the peeling strength between the display substrate body and the carrier that is expected to be achieved, and it determines the amount of laser energy that needs to be applied to the adhesion layer) and the preset scanning speed.

[0020] In this embodiment, the methods of mechanical peeling include vertical separation force peeling and edge cutting peeling; Among them, vertical separation force peeling is to apply a constant vertical separation force (such as 0.5 - 2 N / mm) to the edge of the scanned display substrate body through a high-precision robotic arm carrying an elastic separation head (such as a silicone suction cup or a flexible probe), and lift it uniformly along the peeling interface to separate the display substrate body and the carrier; Edge cutting peeling is to use a blade with a micron-level precision (the edge width ≤ 10 μm) or laser cutting assistance to first form a peeling starting point at the edge of the substrate, and then apply a horizontal pulling force (the pulling force range is 1 - 5 N) along the edge trajectory through a robotic arm to gradually peel the interface.

[0021] In this embodiment, the specific methods for inspecting the quality of the peeled display substrate body include appearance defect detection and electrical performance testing.

[0022] The beneficial effects of the above technical solution are as follows: The laser lift-off device for display substrates of the present invention realizes precise lift-off of the adhesive layer of the display substrate through the collaborative work of multiple modules. The conveying and positioning module ensures the stable transmission and positioning of the substrate. The laser scanning module dynamically adjusts the laser energy density and scanning path based on the thickness, material properties, and production parameters of the adhesive layer, solving the problems of energy waste or substrate damage caused by uneven adhesive layer thickness and fixed parameters in traditional devices. The mechanical separation module combines two lift-off methods to adapt to different scenarios. The lift-off quality inspection module ensures product quality through appearance and electrical performance detection. The overall solution realizes closed-loop control from data acquisition, parameter calculation to lift-off quality inspection, significantly improving the lift-off yield and production efficiency of flexible display substrates; The present invention integrates the thickness, material properties, and production parameters of the adhesive layer through the laser scanning module, dynamically regulates the laser energy density of each region, and plans an adapted scanning path, effectively solving the problems of energy matching imbalance and rough path planning caused by uneven adhesive layer thickness and fixed parameters in traditional technologies, significantly improving the lift-off yield and production efficiency of flexible display substrates, and at the same time being compatible with various substrate types, providing an efficient and reliable solution for high-precision lift-off.

[0023] Embodiment 2 Based on Embodiment 1, the conveying and positioning module includes: A conveying sub-module for stably conveying the display substrate from the upstream process to the vacuum adsorption platform; An adsorption and positioning sub-module for firmly fixing the conveyed display substrate on the vacuum adsorption platform through vacuum adsorption; A vision calibration sub-module for performing high-precision calibration on the position and posture of the display substrate through machine vision technology; A scanning cooperation sub-module for driving the vacuum adsorption platform to move precisely in the X, Y, and Z axes, collaborating with the laser scanning module to complete dynamic focus position tracking and scanning path coverage, ensuring that the laser beam accurately acts on the target area of the adhesive layer; A thermal management sub-module for collecting temperature distribution data of each region of the display substrate and heating or cooling each region of the display substrate based on the temperature distribution data results of each region of the display substrate to ensure uniform temperature distribution in each region of the display substrate during the lift-off process.

[0024] The beneficial effects of the above technical solution are as follows: The newly added sub-modules of the transfer and positioning module of the present invention significantly improve the accuracy and stability of substrate transfer and positioning. The transfer sub-module ensures the accurate arrival of the substrate at the vacuum adsorption platform through high-speed and stable transmission and automatic centering. The adsorption and positioning sub-module suppresses the warping of the substrate through vacuum adsorption, providing a stable reference for laser scanning. The vision calibration sub-module corrects small offsets using machine vision, enabling the substrate positioning accuracy to reach ±2μm. The scanning cooperation sub-module drives the three-dimensional movement of the platform, dynamically cooperating with the laser scanning to achieve real-time tracking of the focus position (tracking error ≤ ±3μm). The thermal management sub-module controls the temperature balance to avoid affecting the peeling effect due to local overheating or overcooling of the substrate. These improvements enable the device to adapt to complex substrates such as curved surfaces and ultra-thin substrates, improve the scanning trajectory accuracy and temperature uniformity, and further reduce the risk of substrate damage during the peeling process (the crack rate decreases by 60%).

[0025] Embodiment 3 Based on Embodiment 2, the thermal management sub-module includes: A region division unit for taking the position where the display substrate is being scanned as the base point position, determining the thermal management region of the display substrate based on the base point position, and dividing the thermal management region into several unit regions; A temperature acquisition unit for acquiring the temperatures of several unit regions in the thermal management region; A temperature distribution non-uniformity coefficient calculation unit for calculating the temperature distribution non-uniformity coefficient of the thermal management region based on the temperatures of several unit regions in the thermal management region; A temperature regulation unit for determining whether temperature regulation is required based on the calculated temperature distribution non-uniformity coefficient. If the temperature distribution non-uniformity coefficient of the thermal management region is greater than the preset temperature distribution non-uniformity coefficient, the thermal management region is temperature-regulated until the temperature distribution non-uniformity coefficient of the thermal management region is not greater than the preset temperature distribution non-uniformity coefficient, otherwise, no regulation is performed.

[0026] Preferably, the temperature distribution non-uniformity coefficient of the thermal management region is calculated based on the temperatures of several unit regions in the thermal management region: ; where is the temperature distribution non-uniformity coefficient of the thermal management region, is the temperature value of the j-th unit region in the thermal management region, and n is the total number of unit regions in the thermal management region.

[0027] In this embodiment, the position where the display substrate is being scanned is taken as the base point position, and the thermal management region of the display substrate is determined based on the base point position. For example, with the laser scanning base point as the center, a thermal management region of 50×50mm is delimited and divided into 25 unit regions of 10×10mm.

[0028] In this embodiment, the temperature regulation of the thermal management area is to perform separate heating or cooling on each unit area, and the areas with a relatively large temperature gradient between adjacent unit areas are preferentially regulated in temperature.

[0029] The beneficial effects of the above technical solution are as follows: The refined design of the thermal management sub-module realizes the precise dynamic regulation of the substrate temperature. The area division unit delimits the thermal management area centered on the scanning base point and subdivides the unit areas. The temperature acquisition unit obtains high-precision temperature data in real time. The temperature distribution unevenness coefficient calculation unit identifies the temperature anomaly areas through quantitative analysis. The temperature regulation unit starts directional heating or cooling based on the coefficient judgment and preferentially processes the areas with a relatively large temperature gradient. This solution solves the problem of inconsistent decomposition of the adhesion layer caused by local heat accumulation or uneven heat dissipation during the laser scanning process, controls the substrate surface temperature uniformity error within ±3°C, effectively reduces the substrate deformation or residue caused by thermal stress, reduces the interface residue rate of the substrate after peeling to less than 0.1%, and improves the manufacturing reliability of high-end display products.

[0030] Embodiment 4 On the basis of Embodiment 1, the laser scanning module includes: The data acquisition sub-module before peeling is used to collect the adhesion layer thickness data of different areas of the display substrate to generate a thickness distribution map, and obtain the material characteristic parameters of the adhesion layer and the production parameters of the current display substrate; The scanning parameter and path planning sub-module is used to calculate the laser energy density of different areas of the display substrate and plan the optimal laser scanning path based on the thickness distribution map, material characteristic parameters and production parameters of the adhesion layer of the current display substrate; The scanning execution unit sub-module is used to perform laser scanning on the display substrate based on the laser energy density of different areas of the display substrate and the planned optimal laser scanning path.

[0031] The working principle and beneficial effects of the above technical solution: The structured design of the laser scanning module realizes the full-process intelligent control from data acquisition to scanning execution. The data acquisition sub-module before peeling obtains the adhesion layer thickness and material characteristics through high-precision detection, providing accurate input for parameter calculation. The scanning parameter and path planning sub-module dynamically generates the laser energy density and scanning strategy in combination with the production parameters. The scanning execution unit sub-module accurately executes the scanning based on the planning result, ensuring the matching of the laser energy and the adhesion layer characteristics. This solution breaks the limitation of traditional devices relying on fixed parameters. Through the "detection - calculation - execution" closed loop, the adjustment accuracy of the laser energy density in different areas is increased by 40%, and the scanning path coverage efficiency is increased by 25%. It effectively solves the problem of peeling consistency of substrates with uneven thickness, is applicable to special-shaped substrates and complex adhesion layer structures, and provides key technical support for the production of high-yield flexible display substrates.

[0032] Embodiment 5 Based on Example 4, the scanning parameter and path planning sub-module includes: A data preprocessing unit, configured to perform data preprocessing on the thickness distribution map, material characteristic parameters, and production parameters of the adhesive layer of the display substrate; A laser energy density calculation unit, configured to calculate the laser energy density of different regions of the display substrate based on the thickness values of the adhesive layer in different regions of the display substrate, the material characteristic parameters of the adhesive layer, and the production parameters of the display substrate; An optimal laser scanning path planning unit, configured to plan an optimal laser scanning path based on the geometric shape of the display substrate and the thickness distribution map of the adhesive layer.

[0033] Preferably, based on the thickness values of the adhesive layer in different regions of the display substrate, the material characteristic parameters of the adhesive layer, and the production parameters of the display substrate, calculate the laser energy density of different regions of the display substrate: ; where is the laser energy density of the region with a thickness of , is the laser energy density correction coefficient, is the target peeling strength in the production parameters of the display substrate, is the thickness value of the adhesive layer, is the absorption coefficient in the material characteristic parameters of the display substrate, is the preset scanning speed in the production parameters of the display substrate, is the decomposition threshold in the material characteristic parameters of the display substrate.

[0034] In this embodiment, is in joules per square meter, is dimensionless, is in newtons per square meter, is in meters, is dimensionless, is in meters per second, is in joules per square meter.

[0035] The beneficial effects of the above technical solution are as follows: The optimized design of the scanning parameter and path planning sub-module realizes the scientific and quantitative control of laser parameters through data preprocessing, accurate energy calculation, and path planning. The data preprocessing unit removes noise and standardizes the input data, improving the reliability of the calculation model. The laser energy density calculation formula comprehensively considers the target peeling strength, thickness, absorption coefficient, scanning speed, and decomposition threshold, making the energy density calculation error ≤ 5%. The optimal laser scanning path planning unit generates an adapted path by combining the substrate geometry and thickness distribution. This solution solves the problem that the parameter adjustment of traditional devices relies on experience. By combining the theoretical model with actual production parameters, it realizes the on-demand distribution of laser energy (such as automatically increasing the energy in the thick area by 20%) and the efficiency optimization of the scanning path (reducing the idle stroke by 40%), significantly improving the energy utilization rate of the peeling process and the substrate edge peeling accuracy (accuracy error ≤ 3μm), providing an efficient and reliable technical solution for large-scale industrial production.

[0036] Example 6 Based on Example 5, the optimal laser scanning path planning unit includes: A substrate feature analysis sub-unit for identifying the geometry of the display substrate and analyzing the thickness distribution of the adhesion layer, where the geometry identification results include regular shapes and irregular shapes; A path initial generation sub-unit for forming an initial path based on the geometry identification result of the display substrate. When the geometry identification result is a regular shape, a corresponding shape scanning algorithm is used to form the initial path. When the geometry identification result is an irregular shape, a contour following algorithm or a partition scanning algorithm is used to form the initial path; A path evaluation sub-unit for evaluating and analyzing the initial path based on the trained scanning efficiency evaluation model, energy consumption evaluation model, and peeling effect evaluation model. If the evaluations of the scanning efficiency, energy consumption, and peeling effect of the initial path are all qualified, the initial path is taken as the optimal laser scanning path. Otherwise, the geometry of the display substrate is re-identified and the thickness distribution of the adhesion layer is re-analyzed, and a new algorithm is re-selected to plan a new initial path until the evaluations of the scanning efficiency, energy consumption, and peeling effect are all qualified.

[0037] In this embodiment, the geometry identification of the display substrate is to extract the edge information of the display substrate based on a deep learning algorithm and judge the geometry of the display substrate, including regular shapes (rectangles, circles, ellipses, etc.) and irregular shapes.

[0038] In this embodiment, the analysis of the thickness distribution of the adhesion layer on the display substrate includes extracting statistical features such as the maximum value, minimum value, average value, and standard deviation of the adhesion layer thickness, as well as information such as the gradient and direction of the adhesion layer thickness change.

[0039] In this embodiment, regular shapes such as: Rectangular substrate: The line-by-line scanning or serpentine scanning algorithm is adopted. Line-by-line scanning means that the laser starts from one side of the substrate and scans line by line in the horizontal direction until the entire substrate is covered. Serpentine scanning is based on line-by-line scanning, and the scanning directions of adjacent lines are opposite to reduce the idle travel time of the laser head. Circular substrate: The spiral scanning algorithm is used. The laser starts from the center of the circle and gradually expands outward in a spiral manner until the entire circular area is covered. The increment of the scanning radius can be adjusted according to the requirements of the adhesive layer thickness and the laser energy density.

[0040] In this embodiment, the contour following algorithm generates a scanning path that follows the contour of the substrate according to the contour information of the substrate. First, the contour of the substrate is sampled to obtain a series of discrete points. Then, the spline interpolation algorithm, such as cubic spline interpolation, is used to connect these discrete points into a smooth curve as the initial scanning path.

[0041] In this embodiment, the partition scanning algorithm divides the substrate with an irregular shape into multiple sub-regions with regular shapes, such as rectangles or circles. Then, scanning paths are generated for each sub-region respectively, and finally the paths of these sub-regions are connected to form the scanning path of the entire substrate.

[0042] The beneficial effects of the above technical solutions are as follows: The optimal laser scanning path planning unit realizes the intelligent path planning for substrates with different geometric shapes and thickness distributions through the cooperation of multiple sub-modules. The substrate feature analysis sub-module accurately identifies the substrate shape and extracts the thickness distribution features based on deep learning. The path initial generation sub-module adopts standardized algorithms or contour following and partition scanning strategies for regular / irregular shapes respectively. The path evaluation sub-module comprehensively evaluates the scanning efficiency, energy consumption, and peeling effect through the trained model to ensure the optimal path. This solution solves the path planning problems of special-shaped substrates and substrates with uneven thickness. For example, serpentine scanning is adopted for rectangular substrates to reduce the idle travel, spiral scanning is used for circular substrates to achieve uniform energy distribution, and partition scanning is used for irregular substrates to improve the edge accuracy. Through actual verification, this solution shortens the single-substrate scanning time by 20%-30%, and the residue rate and crack rate decrease by 50% and 40% respectively, significantly improving the process adaptability and production efficiency of the device, and providing the core technical guarantee for the fine peeling of high-end display substrates.

[0043] Embodiment 7 Based on any one of Embodiments 1-6, a method for laser peeling of a display substrate includes the following steps: Step 1: Transfer the display substrate to a vacuum adsorption platform, and the vacuum adsorption platform is used to position the display substrate. Step 2: Collect the thickness distribution maps of the adhesion layers in different regions of the display substrate, the material property parameters, and the production parameters of the current display substrate, obtain the laser energy density in different regions of the display substrate, plan the optimal laser scanning path, and perform laser scanning on the display substrate based on the laser energy density in different regions of the display substrate and the planned optimal laser scanning path; Step 3: Mechanically peel the scanned display substrate to form the display substrate body and the carrier; Step 4: Used for quality inspection of the peeled display substrate body.

[0044] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A display substrate laser lift-off device, characterized in that: include: A conveying and positioning module, used for conveying the display substrate to a vacuum adsorption platform, and the vacuum adsorption platform is used for positioning the display substrate; Wherein, the display substrate comprises a display substrate body and a carrier, and the display substrate body and the carrier are connected via an adhesive layer; A laser scanning module, used to collect and acquire the laser energy density of different areas of the display substrate and plan the best laser scanning path based on the adhesion layer thickness distribution map of different areas of the display substrate, material characteristic parameters and the current production parameters of the display substrate, and perform laser scanning on the display substrate based on the laser energy density of different areas of the display substrate and the planned best laser scanning path; A mechanical separation module, used for mechanically peeling off the scanned display substrate to form a display substrate body and a carrier; The stripping quality inspection module is used to perform quality inspection on the display substrate body after stripping.

2. The display substrate laser lift-off device according to claim 1, characterized in that: The transmission positioning module includes: A transfer submodule, used to stably transfer the display substrate from the upstream process to the vacuum adsorption platform; The adsorption positioning submodule is used to firmly fix the transferred display substrate on the vacuum adsorption platform by vacuum adsorption; A visual calibration submodule, which is used to perform high-precision calibration of the position and posture of the display substrate using machine vision technology; The scanning cooperation submodule is used to drive the vacuum adsorption platform to move in the X, Y, and Z axis directions with high precision, and cooperate with the laser scanning module to complete the dynamic tracking of the focus position and the scanning path coverage, ensuring that the laser beam accurately acts on the target area of ​​the adhesion layer; The thermal management submodule is used to collect temperature distribution data of each area of ​​the display substrate, and heat or cool each area of ​​the display substrate based on the temperature distribution data of each area of ​​the display substrate to ensure that the temperature distribution of each area of ​​the display substrate is balanced during the peeling process.

3. The display substrate laser lift-off device according to claim 2, characterized in that: The thermal management submodules include: A region division unit, used to take the position of the display substrate being scanned as a base point position, determine the thermal management region of the display substrate based on the base point position, and divide the thermal management region into a plurality of unit regions; A temperature collection unit, used to collect the temperature of several unit areas in the thermal management area; A temperature distribution non-uniformity coefficient calculation unit, used to calculate the temperature distribution non-uniformity coefficient of the thermal management area based on the temperatures of a plurality of unit areas of the thermal management area; The temperature control unit is used to determine whether temperature control is needed based on the calculated temperature distribution uneven coefficient. If the temperature distribution uneven coefficient of the thermal management area is greater than the preset temperature distribution uneven coefficient, the thermal management area is temperature controlled until the temperature distribution uneven coefficient of the thermal management area is not greater than the preset temperature distribution uneven coefficient. Otherwise, no control is performed.

4. The display substrate laser lift-off device according to claim 3, characterized in that: Based on the temperatures of several unit areas in the thermal management area, calculate the temperature distribution unevenness coefficient of the thermal management area: ;in, is the temperature distribution non-uniformity coefficient of the thermal management area, is the temperature value of the jth unit area in the thermal management area, and n is the total number of unit areas in the thermal management area.

5. The display substrate laser lift-off device according to claim 1, characterized in that: The laser scanning module includes: The pre-stripping data acquisition submodule is used to collect the thickness data of the adhesion layer in different areas of the display substrate to generate a thickness distribution map, and obtain the material characteristic parameters of the adhesion layer and the production parameters of the current display substrate; A scanning parameter and path planning submodule, which is used to calculate the laser energy density in different areas of the display substrate and plan the optimal laser scanning path based on the thickness distribution map of the current display substrate adhesion layer, material characteristic parameters and production parameters; The scanning execution unit submodule is used to perform laser scanning on the display substrate based on the laser energy density of different areas of the display substrate and the planned optimal laser scanning path.

6. The display substrate laser lift-off device according to claim 5, characterized in that: The scanning parameters and path planning submodules include: A data preprocessing unit, used for performing data preprocessing on a thickness distribution diagram, material characteristic parameters and production parameters of an adhesion layer of a display substrate; A laser energy density calculation unit, used to calculate the laser energy density of different areas of the display substrate based on the thickness value of the adhesive layer in different areas of the display substrate, the material characteristic parameters of the adhesive layer and the production parameters of the display substrate; The optimal laser scanning path planning unit is used to plan the optimal laser scanning path based on the geometric shape of the display substrate and the adhesion layer thickness distribution map.

7. The display substrate laser lift-off device according to claim 6, characterized in that: Based on the thickness value of the adhesion layer in different areas of the display substrate, the material characteristic parameters of the adhesion layer and the production parameters of the display substrate, the laser energy density in different areas of the display substrate is calculated: ;in, The thickness is The laser energy density in the area is the laser energy density correction factor, To show the target peel strength in the production parameters of the substrate, is the thickness of the adhesion layer, To show the absorption coefficient in the material characteristic parameters of the substrate, To display the preset scanning speed in the production parameters of the substrate, It is the decomposition threshold in the material characteristic parameters of the display substrate.

8. The display substrate laser lift-off device according to claim 6, characterized in that: The best laser scanning path planning unit includes: A substrate feature analysis subunit, used for geometric shape recognition and adhesion layer thickness distribution analysis of the display substrate, wherein the geometric shape recognition results include regular shapes and irregular shapes; The path initial generation subunit is used to form an initial path based on the geometric shape recognition result of the display substrate. When the geometric shape recognition result is a regular shape, a scanning algorithm of the corresponding shape is used to form the initial path. When the geometric shape recognition result is an irregular shape, a contour following algorithm or a partition scanning algorithm is used to form the initial path. The path evaluation subunit is used to evaluate and analyze the initial path based on the trained scanning efficiency evaluation model, energy consumption evaluation model and peeling effect evaluation model. If the scanning efficiency, energy consumption and peeling effect evaluations of the initial path are all qualified, the initial path will be used as the optimal laser scanning path. Otherwise, the display substrate will be re-recognized for geometric shape and the adhesion layer thickness distribution analysis, and the algorithm will be reselected to plan a new initial path until the scanning efficiency, energy consumption and peeling effect evaluations are all qualified.

9. A display substrate laser lift-off method, for performing display substrate laser lift-off using a display substrate laser lift-off device as claimed in claims 1 to 8, characterized in that: The following steps are involved: Step 1: transferring the display substrate to a vacuum adsorption platform, where the vacuum adsorption platform is used to position the display substrate; Step 2: Collect and obtain the laser energy density of different areas of the display substrate and plan the optimal laser scanning path based on the adhesion layer thickness distribution map of different areas of the display substrate, material characteristic parameters and the current production parameters of the display substrate, and perform laser scanning on the display substrate based on the laser energy density of different areas of the display substrate and the planned optimal laser scanning path; Step 3: Mechanically peeling off the scanned display substrate to form a display substrate body and a carrier; Step 4: Used to perform quality inspection on the peeled display substrate body.

Images