A silicon wafer cylinder processing and grinding device for semiconductor production

Abstract

The present invention discloses a silicon wafer cylinder processing and grinding device for semiconductor production, which relates to the field of semiconductor production technology, including a processing plate, a placing plate fixedly installed on the top of the processing plate, a linear drive mechanism fixedly penetrated through the top of the moving end of the linear drive mechanism, a driving motor fixedly installed on the output end of the driving motor, a loading plate fixedly installed on the end of the loading plate away from the driving motor, and a grinding mechanism fixedly penetrated through the end, and also includes a clamping device; wherein the clamping device includes an electric push rod, a carrying plate, a T-shaped rod, a No. 1 spring, a rubber plate, a lifting plate, a No. 1 spring, two connecting rods, an arc bar and a support rod, the support force applied by the processing plate is used to improve the stability of the grinding, and the arc bar is used to apply pressure to the silicon wafer cylinder to ensure that the silicon wafer cylinder will not deflect during the grinding process and affect the grinding effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, in particular to a silicon wafer cylinder processing and grinding device for semiconductor production. Background Art

[0002] A silicon wafer is a circular material made of silicon single crystals. It is the basic material in the manufacture of semiconductor devices. A wafer cylinder is one of the forms of this material. It is a cylindrical silicon single crystal formed during the crystal growth process after silicon is melted. This cylindrical silicon crystal can be cut into thin slices and then used to manufacture various semiconductor devices.

[0003] The patent with patent announcement number CN215510588U relates to a silicon wafer cylinder processing equipment for semiconductor production, including a base, and a transparent cover is fixedly connected to the top of the base. When in use, the patent can effectively isolate the dust generated during the grinding process through the setting of the protective cover, avoiding the harm of the scattered dust to the workers' bodies, and the position of the grinding disc can be adjusted on the outside of the transparent cover through the mutual cooperation between the servo motor, the second threaded rod, the second threaded sleeve, the fixed rod and the T-shaped rod, which also avoids the harm caused by the direct manual operation of the workers. The mutual cooperation between the splint, the pressure plate, the arc groove, the anti-slip pad, the first threaded rod and the hand wheel avoids the shaking of the silicon wafer cylinder during the grinding process, affecting the grinding efficiency, and through the mutual cooperation between the side plate and the hydraulic cylinder, the distance between the two side plates can be adjusted to process silicon wafer cylinders of different lengths, and the use effect is good.

[0004] The above patent has the function of clamping silicon wafer cylinders of different lengths. Through the cooperation between the first threaded rod and the hand wheel, the staff can easily adjust the clamping device to adapt to silicon wafer cylinders of various lengths, which not only simplifies the operation process, but also meets various production needs. However, during the polishing process, the flat clamping plate cannot completely fit the curved surface of the cylindrical silicon wafer cylinder. Due to the limited contact area, the clamping force on the silicon wafer cylinder is unevenly distributed, causing the silicon wafer cylinder to shift or vibrate during the polishing process, thereby affecting the polishing accuracy. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides a silicon wafer cylinder processing and grinding device for semiconductor production, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: A silicon wafer cylinder processing and grinding device for semiconductor production, comprising a processing plate, a placing plate fixedly installed on the top of the processing plate, a linear drive mechanism fixedly penetrated through the top of the moving end of the linear drive mechanism, a driving motor fixedly installed on the output end of the driving motor, a loading plate fixedly installed, an end of the loading plate away from the driving motor fixedly penetrated by a grinding mechanism, a slide groove is provided on the top of the processing plate, and also includes a clamping device; wherein the clamping device includes an electric push rod, a carrying plate, a T-shaped rod, a No. 1 spring, a rubber plate, a lifting plate, a No. 1 spring, two connecting rods, an arc bar and a support rod, when the electric push rod is started, the output end of the electric push rod drives the carrying plate to move toward the placing plate, and the movement of the carrying plate drives the T-shaped rod to move toward the placing plate. The electric push rod is fixedly mounted on the top of the processing plate, the carrying plate is fixedly mounted on the output end of the electric push rod, the T-shaped rod slides through the side of the carrying plate away from the electric push rod, the No. 1 spring is arranged between the T-shaped rod and the carrying plate, the rubber plate is fixedly mounted on the side of the T-shaped rod away from the carrying plate, the lifting plate slides through the top of the carrying plate, the No. 1 spring is arranged between the lifting plate and the carrying plate, the two connecting rods are fixedly mounted on the side of the lifting plate away from the electric push rod, the arc bar is arranged at both ends of the connecting rod away from the lifting plate, the support rod is fixedly mounted on the bottom of the lifting plate, the support rod slides through the bottom of the carrying plate, and the side of the rubber plate away from the carrying plate is provided with corrugation one, and the corrugation one of the rubber plate contacts the silicon wafer cylinder during movement, and the rubber plate stops moving due to the obstruction imposed by the silicon wafer cylinder.

[0007] According to the above technical solution, a spherical surface 1 is provided on one end of the T-shaped rod close to the lifting plate, and an inclined surface 1 is provided on one side of the lifting plate close to the T-shaped rod. The inclined surface 1 of the lifting plate contacts the spherical surface 1 during movement, and the inclined surface 1 continues to move and moves downward due to the resistance exerted by the spherical surface 1.

[0008] According to the above technical solution, the arc strip itself is elastic, the middle position of the arc strip is blocked and stops moving, the connecting rod moves to stretch the two ends of the arc strip, the arc strip is stretched and deformed, and an anti-slip groove is provided on the side of the arc strip close to the rubber plate.

[0009] The cam is fixedly mounted on the top of the sliding plate, and the cam is fixedly mounted on the bottom of the sliding plate, and the limit plate is fixedly mounted on the outer wall of the sliding plate. The cam is fixedly mounted on the outer wall of the sliding plate, and the limit plate is fixedly mounted on the outer wall of the sliding plate. The cam is fixedly mounted on the surface of the rectangular plate, and the elastic plate is fixedly mounted on the inner wall of the sliding plate. When the rectangular plate moves, the cylindrical block is driven to move in the direction of the elastic plate. The cylindrical block contacts the elastic plate during movement, and the round rod is fixedly mounted on the inner wall of the sliding frame.

[0010] According to the above technical solution, the elastic sheets are equidistantly distributed on the inner wall of the movable frame with the rectangular plate as the axis of symmetry. The cylindrical block continues to move to squeeze the elastic sheets, and the elastic sheets are deformed by the squeezing. The deformed elastic sheets are separated from the surface in contact with the round rod. The side of the limit plate close to the placement plate is provided with a second inclined surface, and the side of the limit plate away from the movable frame is provided with a circular hole.

[0011] According to the above technical solution, the elastic sheet is provided with an arc surface one on the side away from the round rod. When the cylindrical block resets and moves, it contacts the arc surface one of the elastic sheet. The cylindrical block continues to move and extrude the arc surface one. The elastic sheet is squeezed and deformed, and the elastic sheet contacts the circumferential surface of the round rod.

[0012] The cam is fixedly mounted on the workbench, and the movable plate is moved along the workbench to move the movable plate toward the workbench. The movable plate is moved along the workbench, and the movable plate is moved along the workbench. The movable plate is fixedly mounted on the workbench, and the movable plate is moved along the workbench. The movable plate is fixedly mounted on the workbench, and the movable plate is moved toward the workbench. The movable plate is fixedly mounted on the workbench, and the movable plate is moved toward the workbench.

[0013] According to the above technical solution, a spiral spring is arranged between the rotating plate and the connecting seat, and a semicircular groove is provided on the side of the rotating plate away from the grip rod. The circumferential surface of the grip rod contacts the semicircular groove during movement, so that the rotating plate limits the movement of the grip rod, and at the same time the docking rod cannot contact the moving limit plate, and the rotating plate contacts the blocking plate.

[0014] The present invention provides a silicon wafer cylindrical processing and grinding device for semiconductor production. It has the following beneficial effects:

[0015] (1) The semiconductor production silicon wafer cylinder processing and grinding device, the T-shaped rod applies a thrust to the rubber plate under the action of tension, so that the corrugation 1 is in close contact with the silicon wafer cylinder. The tension applied during the deformation of the No. 1 spring ensures that the corrugation 1 is in close contact with the silicon wafer cylinder, which helps to improve the stability of the clamping. The two ends of the arc strip are bent downward, and the anti-slip groove of the arc strip fits closely with the curved surface of the silicon wafer cylinder during the deformation process. The support force applied by the processing plate improves the stability of the grinding, and then the arc strip is used to apply pressure to the silicon wafer cylinder to ensure that the silicon wafer cylinder will not deflect during the grinding process, affecting the grinding effect.

[0016] (2) In the semiconductor production silicon wafer cylinder processing and grinding device, the second spring sheet exerts a reaction force on the moving frame under the action of its own elasticity. The moving frames on both sides are in close contact under the influence of the reaction force. The reaction force exerted by the second spring sheet ensures that the glass cover can effectively prevent the powder generated during the grinding process from flying into the working area. The elastic sheet recovers under the action of its own elasticity. During the recovery process, the elastic sheet collides with the round rod to generate vibration. Multiple vibrations are generated through intermittent collisions between the elastic sheet and the round rod, and then the vibrations are transmitted to the moving frame to prevent the dust accumulated in the slide from affecting the smoothness of the moving frame.

[0017] (3) In the semiconductor production silicon wafer cylinder processing and grinding device, the docking rod passes through the circular hole, so that the docking rod limits the moving frame. By limiting the moving frame through the circular hole, the staff can open the glass cover only after standardized operation, which helps to improve the safety of operation. The rotating plate limits the movement of the grip rod, and at the same time, the docking rod cannot contact the limit plate. The active limit movable plate allows the staff to rotate and use the docking rod according to actual conditions, which helps to improve the practicality of the docking rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the top structure of the processing plate of the present invention;

[0020] Figure 3 For the present invention Figure 2 A in the middle is an enlarged structural diagram;

[0021] Figure 4 This is a schematic diagram of the position structure of the driving motor and the loading plate of the present invention;

[0022] Figure 5 Schematic diagram of the internal structure of the clamping device of the present invention;

[0023] Figure 6 For the present invention Figure 5 The enlarged structural diagram at B in the middle;

[0024] Figure 7 Schematic diagram of the internal structure of the dustproof device of the present invention;

[0025] Figure 8 For the present invention Figure 7 The enlarged structural diagram at C in the middle;

[0026] Figure 9 Schematic diagram of the internal structure of the locking device of the present invention.

[0027] In the figure: 1. processing plate; 2. placing plate; 3. linear drive mechanism; 4. driving motor; 5. loading plate; 6. grinding mechanism; 7. electric push rod; 8. carrying plate; 9. T-shaped rod; 10. No. 1 spring; 11. rubber plate; 12. lifting plate; 13. No. 1 spring; 14. connecting rod; 15. arc bar; 16. supporting rod; 161. moving frame; 162. glass cover; 163. rectangular plate; 164. No. 2 spring; 165. contact plate; 166. limit plate; 167. cylindrical block; 168. elastic sheet; 169. round rod; 171. fixed plate; 172. moving rod; 173. No. 2 spring; 174. movable plate; 175. grip rod; 176. docking rod; 177. connecting seat; 178. rotating plate; 179. blocking plate. DETAILED DESCRIPTION

[0028] The following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0029] See also Figures 1-9, one embodiment of the present invention is: a silicon wafer cylinder processing and grinding device for semiconductor production, comprising a processing plate 1, a placing plate 2 is fixedly installed on the top of the processing plate 1, a linear drive mechanism 3 is fixedly passed through the top of the processing plate 1, a driving motor 4 is fixedly installed on the top of the moving end of the linear drive mechanism 3, a loading plate 5 is fixedly installed on the output end of the driving motor 4, a grinding mechanism 6 is fixedly passed through the end of the loading plate 5 away from the driving motor 4, a slide groove is provided on the top of the processing plate 1, and also includes a clamping device; wherein the clamping device includes an electric push rod 7, a carrying plate 8, a T-shaped rod 9, a No. 1 spring 10, a rubber plate 11, a lifting plate 12, a No. 1 spring 13, two connecting rods 14, an arc bar 15 and a support rod 16, the electric push rod 7 is fixedly mounted on the top of the processing plate 1, and the carrying plate 8 is fixedly mounted on the At the output end, the T-shaped rod 9 slides through the side of the carrying plate 8 away from the electric push rod 7, the No. 1 spring 10 is arranged between the T-shaped rod 9 and the carrying plate 8, the rubber plate 11 is fixedly installed on the side of the T-shaped rod 9 away from the carrying plate 8, the lifting plate 12 slides through the top of the carrying plate 8, the No. 1 spring 13 is arranged between the lifting plate 12 and the carrying plate 8, the two connecting rods 14 are fixedly installed on the side of the lifting plate 12 away from the electric push rod 7, the arc bar 15 is arranged at both ends of the connecting rod 14 away from the lifting plate 12, the support rod 16 is fixedly installed at the bottom of the lifting plate 12, the support rod 16 slides through the bottom of the carrying plate 8, and the rubber plate 11 is provided with a corrugation 1 on the side away from the carrying plate 8. The tension applied during the deformation of the No. 1 spring 10 ensures that the corrugation 1 is in close contact with the silicon wafer cylinder, which helps to improve the stability of the clamping.

[0030] A spherical surface 1 is provided on one end of the T-shaped rod 9 close to the lifting plate 12, and an inclined surface 1 is provided on one side of the lifting plate 12 close to the T-shaped rod 9. By providing the spherical surface 1 and the inclined surface 1, it is ensured that when the inclined surface 1 contacts the spherical surface 1, the T-shaped rod 9 can move downward smoothly.

[0031] The arc strip 15 itself is elastic, and an anti-slip groove is provided on the side of the arc strip 15 close to the rubber plate 11. The supporting force applied by the processing plate 1 improves the stability of the mounting plate 8 during grinding, and then the arc strip 15 is used to apply pressure to the silicon wafer column to ensure that the silicon wafer column will not deflect during the grinding process and affect the grinding effect.

[0032] When this embodiment is working, the silicon wafer column is placed on the top of the placement plate 2, and the electric push rod 7 is started. The output end of the electric push rod 7 drives the carrying plate 8 to move toward the placement plate 2. The movement of the carrying plate 8 drives the T-shaped rod 9 to move toward the placement plate 2. The movement of the T-shaped rod 9 drives the rubber plate 11 to move toward the placement plate 2. The corrugation of the rubber plate 11 contacts the silicon wafer column during the movement. The rubber plate 11 is blocked by the silicon wafer column and stops moving. The carrying plate 8 continues to move to stretch the No. 1 spring 10. The No. 1 spring 10 is stretched and deformed. The No. 1 spring 10 exerts pressure on the T-shaped rod 9 under the action of its own elasticity. Adding tension, the T-shaped rod 9 applies a thrust to the rubber plate 11 under the action of the tension, so that the corrugation 1 is in close contact with the silicon wafer cylinder. The tension applied by the No. 1 spring 10 during deformation ensures that the corrugation 1 is in close contact with the silicon wafer cylinder, which helps to improve the stability of the clamping. The carrying plate 8 continues to move and drives the lifting plate 12 to move. The inclined surface 1 of the lifting plate 12 contacts the spherical surface 1 during movement. The inclined surface 1 continues to move and moves downward under the resistance applied by the spherical surface 1. The lifting plate 12 moves downward to squeeze the No. 1 spring 13. The No. 1 spring 13 is squeezed and deformed. The movement of the lifting plate 12 drives the support rod 16 to move downward. The support rod 16 contacts the top of the processing plate 1 during movement, and the processing plate 1 applies an upward supporting force to the support rod 16, and the support rod 16 transmits the supporting force to the carrying plate 8. At the same time, the movement of the lifting plate 12 drives the connecting rod 14 to move downward, and the movement of the connecting rod 14 drives the arc-shaped bar 15 to move downward. The middle position of the arc-shaped bar 15 contacts the curved surface of the silicon wafer cylinder during movement, and the middle position of the arc-shaped bar 15 is blocked and stops moving. The connecting rod 14 moves to stretch the two ends of the arc-shaped bar 15, and the arc-shaped bar 15 is stretched and deformed, so that the two ends of the arc-shaped bar 15 are bent downward, and the anti-slip groove of the arc-shaped bar 15 is formed. During the transformation process, it fits tightly with the curved surface of the silicon wafer cylinder. After the silicon wafer cylinder is clamped, the staff starts the linear drive mechanism 3. The moving end of the linear drive mechanism 3 drives the drive motor 4 to move back and forth, and starts the drive motor 4. The output end of the drive motor 4 drives the loading plate 5 to move toward the placement plate 2. The movement of the loading plate 5 drives the grinding mechanism 6 to move toward the placement plate 2, and starts the grinding mechanism 6 to grind the silicon wafer cylinder. The support force applied by the processing plate 1 is used to improve the stability of the grinding, and then the arc bar 15 is used to apply pressure to the silicon wafer cylinder to ensure that the silicon wafer cylinder will not deflect during the grinding process and affect the grinding effect.

[0033] See also Figures 1-9On the basis of the above embodiment, another embodiment of the present invention further includes a dustproof device and a locking device; the dustproof device includes a moving frame 161, a glass cover 162, a rectangular plate 163, a second spring piece 164, a contact plate 165, a limit plate 166, a cylindrical block 167, an elastic piece 168 and a round rod 169, the moving frame 161 is slidably mounted on the top of the slide groove, the glass cover 162 is fixedly mounted inside the moving frame 161, the rectangular plate 163 is slidably mounted on the inner wall of the moving frame 161, and the second spring piece 164 is arranged on the rectangular plate 16 3 and the moving frame 161, the contact plate 165 is fixedly mounted on the bottom of the rectangular plate 163, the limit plate 166 is fixedly mounted on the outer wall of the moving frame 161, the cylindrical block 167 is fixedly mounted on the surface of the rectangular plate 163, the elastic sheet 168 is fixedly mounted on the inner wall of the moving frame 161, and the round rod 169 is fixedly mounted on the inner wall of the moving frame 161. The reaction force exerted by the second spring piece 164 ensures that the glass cover 162 can effectively prevent the powder generated during the grinding process from flying into the working area, thereby reducing the cleaning burden of the staff.

[0034] The elastic sheets 168 are equidistantly distributed on the inner wall of the moving frame 161 with the rectangular plate 163 as the axis of symmetry. The limiting plate 166 is provided with a second inclined surface on the side close to the placement plate 2, and a circular hole is provided on the side of the limiting plate 166 away from the moving frame 161. The elastic sheets 168 and the round rods 169 intermittently collide to generate multiple vibrations, which are then transmitted to the moving frame 161 to prevent dust accumulated in the chute from affecting the smoothness of the movement of the moving frame 161.

[0035] The elastic piece 168 is provided with an arc surface 1 on a side away from the round rod 169. The elastic piece 168 contacts the circumferential surface of the round rod 169. By providing the arc surface 1, it is ensured that the elastic piece 168 will not hinder the staff from resetting the cylindrical block 167 to the initial position.

[0036] The locking device includes a fixed plate 171, a moving rod 172, a second spring 173, a movable plate 174, a gripping rod 175, a docking rod 176, a connecting seat 177, a rotating plate 178 and a blocking plate 179. The fixed plate 171 is fixedly mounted on the surface of the processing plate 1, the moving rod 172 slides through the interior of the fixed plate 171, the second spring 173 is arranged between the moving rod 172 and the fixed plate 171, the movable plate 174 is fixedly mounted on the side of the moving rod 172 close to the fixed plate 171, and the gripping rod 175 is fixedly mounted on the far side of the movable plate 174. On the side away from the processing plate 1, the docking rod 176 is fixedly installed on the side of the movable plate 174 away from the grip rod 175, the connecting seat 177 is fixedly installed on the top of the fixed plate 171, the rotating plate 178 is rotatably installed inside the connecting seat 177, and the blocking plate 179 is fixedly installed on the top of the fixed plate 171. The end of the docking rod 176 away from the movable plate 174 is provided with a spherical surface 2, and the movable frame 161 is limited by passing the docking rod 176 through the circular hole, so that the staff can open the glass cover 162 only after standardized operation, which helps to improve the safety of operation.

[0037] A spiral spring is arranged between the rotating plate 178 and the connecting seat 177. A semicircular groove is provided on the side of the rotating plate 178 away from the grip rod 175. The rotating plate 178 is in contact with the blocking plate 179. Through the active limiting movable plate 174, it is convenient for the staff to rotate and use the docking rod 176 according to actual conditions, which helps to improve the practicality of the docking rod 176.

[0038] When the present embodiment is working, the lifting plate 12 contacts the contact plate 165 during movement, and the lifting plate 12 moves to apply a thrust to the contact plate 165. The contact plate 165 is affected by the thrust and moves toward the placement plate 2. The movement of the contact plate 165 drives the rectangular plate 163 to move toward the placement plate 2. The movement of the rectangular plate 163 drives the moving frame 161 to move toward the placement plate 2. The movement of the moving frame 161 drives the limiting plate 166 to move toward the placement plate 2. At the same time, the movement of the moving frame 161 drives the glass cover 162 to move toward the placement plate 2. The moving frame 161 comes into contact during the movement, and the moving frame 161 is blocked and stops moving. The lifting plate 12 continues to apply a thrust to the contact plate 165. The contact plate 165 moves under the influence of the thrust, so that the rectangular plate 163 continues to move and squeeze the second spring piece 164. The second spring piece 164 is squeezed and deformed. The deformed second spring piece 164 applies a reaction force to the moving frame 161 under the action of its own elasticity. The moving frames 161 on both sides are in close contact under the influence of the reaction force, and the reaction force applied by the second spring piece 164 , ensuring that the glass cover 162 can effectively prevent the powder generated during the grinding process from flying into the working area, the rectangular plate 163 moves while driving the cylindrical block 167 to move towards the elastic sheet 168. The cylindrical block 167 contacts the elastic sheet 168 during the movement, so that the cylindrical block 167 continues to move and squeeze the elastic sheet 168. The elastic sheet 168 is squeezed and deformed. The deformed elastic sheet 168 is separated from the contact surface of the round rod 169. When the contact surface of the cylindrical block 167 and the elastic sheet 168 is separated, the elastic sheet 168 is elastic under its own elastic action. When the cylindrical block 167 is reset, it contacts the arc surface 1 of the elastic piece 168. The cylindrical block 167 continues to move and squeeze the arc surface 1. The elastic piece 168 is squeezed and deformed. When the cylindrical block 167 separates from the arc surface 1, the elastic piece 168 automatically recovers. The intermittent collision between the elastic piece 168 and the circular rod 169 generates multiple vibrations, which are then transmitted to the moving frame 161 to prevent the dust accumulated in the chute from affecting the smooth movement of the moving frame 161.

[0039] The inclined surface 2 of the limit plate 166 contacts the spherical surface 2 during movement, and the inclined surface 2 continues to move to apply a thrust to the spherical surface 2. The docking rod 176 is affected by the thrust and moves toward the movable plate 174. The movement of the docking rod 176 drives the movable plate 174 to move toward the blocking plate 179. The movement of the movable plate 174 drives the moving rod 172 to move toward the blocking plate 179. The moving rod 172 moves to squeeze the No. 2 spring 173. The No. 2 spring 173 is squeezed and deformed. The deformed No. 2 spring 173 stores energy under the action of its own elasticity. When the limit plate 166 moves to the specified position, the surface in contact with the spherical surface 2 is separated, so that the No. 2 spring 173 is restored and drives the moving rod 172 to move away from the blocking plate 179. The movement of the moving rod 172 drives the movable plate 174 to move away from the blocking plate 179. The movement of the movable plate 174 drives the docking rod 176 to move away from the blocking plate 179. The docking rod 176 passes through the round hole during the movement, so that the docking rod 176 limits the moving frame 161. By limiting the moving frame 161 through the round hole, the staff can open the glass cover 162 only after the standard operation, which helps to improve the safety of the operation. When the staff does not need the docking rod 176 to limit the moving frame 161, The rotating plate 178 is manually pressed to rotate in the direction away from the blocking plate 179. When the rotating plate 178 rotates, the scroll spring is stretched, and the scroll spring is deformed by the stretching. At the same time, the rotating plate 178 is separated from the blocking plate 179, and the grip 175 is pulled toward the blocking plate 179. The movement of the grip 175 drives the movable plate 174 to move toward the blocking plate 179. The movement of the movable plate 174 drives the docking rod 176 to move toward the blocking plate 179. After the grip 175 moves to the specified position, the rotating plate 178 is released, and the scroll spring restores and drives the rotating plate 178 to return to its initial position. The rotating plate 178 contacts and stops with the blocking plate 179. Stop rotation, release the grip 175, the No. 2 spring 173 restores and drives the moving rod 172 to move toward the processing plate 1, the movement of the moving rod 172 drives the movable plate 174 to move toward the processing plate 1, the movement of the movable plate 174 drives the grip 175 to move toward the processing plate 1, and the circumferential surface of the grip 175 contacts the semicircular groove during movement, so that the rotating plate 178 limits the movement of the grip 175, and the docking rod 176 cannot contact the moving limit plate 166. By actively limiting the movable plate 174, it is convenient for the staff to rotate and use the docking rod 176 according to actual conditions, which helps to improve the practicality of the docking rod 176.

[0040] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A device for processing and grinding silicon wafer cylinders for semiconductor production, comprising a processing plate (1), characterized in that: It also includes a clamping device, a dustproof device and a locking device, a placing plate (2) is fixedly installed on the top of the processing plate (1), a linear drive mechanism (3) is fixedly passed through the top of the processing plate (1), a driving motor (4) is fixedly installed on the top of the moving end of the linear drive mechanism (3), a loading plate (5) is fixedly installed on the output end of the driving motor (4), a grinding mechanism (6) is fixedly passed through the end of the loading plate (5) away from the driving motor (4), and a sliding groove is provided on the top of the processing plate (1); The clamping device comprises an electric push rod (7), a carrying plate (8), a T-shaped rod (9), a No. 1 spring (10), a rubber plate (11), a lifting plate (12), a No. 1 spring (13), two connecting rods (14), an arc strip (15) and a support rod (16), wherein the electric push rod (7) is fixedly mounted on the top of the processing plate (1), the carrying plate (8) is fixedly mounted on the output end of the electric push rod (7), the T-shaped rod (9) slides through the side of the carrying plate (8) away from the electric push rod (7), the No. 1 spring (10) is arranged between the T-shaped rod (9) and the carrying plate (8), and the rubber plate (11) is fixedly mounted on the The T-shaped rod (9) is located on a side away from the carrying plate (8), the lifting plate (12) slides through the top of the carrying plate (8), the first spring piece (13) is arranged between the lifting plate (12) and the carrying plate (8), the two connecting rods (14) are fixedly mounted on a side of the lifting plate (12) away from the electric push rod (7), the arc strip (15) is arranged at both ends of the connecting rod (14) away from the lifting plate (12), the support rod (16) is fixedly mounted on the bottom of the lifting plate (12), the support rod (16) slides through the bottom of the carrying plate (8), and the rubber plate (11) is provided with a corrugated surface on a side away from the carrying plate (8); The dustproof device comprises a movable frame (161), a glass cover (162), a rectangular plate (163), a second spring piece (164), a contact plate (165), a limit plate (166), a cylindrical block (167), an elastic piece (168) and a round rod (169), wherein the movable frame (161) is slidably mounted on the top of the slide groove, the glass cover (162) is fixedly mounted inside the movable frame (161), the rectangular plate (163) is slidably mounted on the inner wall of the movable frame (161), and the The second spring piece (164) is arranged between the rectangular plate (163) and the movable frame (161), the contact plate (165) is fixedly mounted on the bottom of the rectangular plate (163), the limit plate (166) is fixedly mounted on the outer wall of the movable frame (161), the cylindrical block (167) is fixedly mounted on the surface of the rectangular plate (163), the elastic piece (168) is fixedly mounted on the inner wall of the movable frame (161), and the round rod (169) is fixedly mounted on the inner wall of the movable frame (161).

2. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 1, characterized in that: A spherical surface is provided on one end of the T-shaped rod (9) close to the lifting plate (12), and an inclined surface is provided on one side of the lifting plate (12) close to the T-shaped rod (9).

3. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 2, characterized in that: The arc strip (15) itself is elastic, and a non-slip groove is provided on a side of the arc strip (15) close to the rubber plate (11).

4. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 3, wherein: The elastic pieces (168) are equidistantly distributed on the inner wall of the movable frame (161) with the rectangular plate (163) as the axis of symmetry. The limiting plate (166) has a second inclined surface on a side close to the placement plate (2), and has a circular hole on a side away from the movable frame (161).

5. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 4, characterized in that: A curved surface 1 is provided on a side of the elastic sheet (168) away from the round rod (169), and the elastic sheet (168) is in contact with the circumferential surface of the round rod (169).

6. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 5, characterized in that: The locking device comprises a fixed plate (171), a moving rod (172), a second spring (173), a movable plate (174), a gripping rod (175), a docking rod (176), a connecting seat (177), a rotating plate (178) and a blocking plate (179), wherein the fixed plate (171) is fixedly mounted on the surface of the processing plate (1), the moving rod (172) slides through the interior of the fixed plate (171), the second spring (173) is arranged between the moving rod (172) and the fixed plate (171), and the movable plate (174) is fixedly mounted on the moving rod (17 2) a side close to the fixed plate (171), the gripping rod (175) is fixedly mounted on a side of the movable plate (174) away from the processing plate (1), the docking rod (176) is fixedly mounted on a side of the movable plate (174) away from the gripping rod (175), the connecting seat (177) is fixedly mounted on the top of the fixed plate (171), the rotating plate (178) is rotatably mounted inside the connecting seat (177), the blocking plate (179) is fixedly mounted on the top of the fixed plate (171), and a spherical surface 2 is provided on one end of the docking rod (176) away from the movable plate (174).

7. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 6, characterized in that: A volute spring is provided between the rotating plate (178) and the connecting seat (177); a semicircular groove is provided on a side of the rotating plate (178) away from the gripping rod (175); and the rotating plate (178) is in contact with the blocking plate (179).

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