A semiconductor wafer grinding and polishing tool

Abstract

The application discloses a kind of semiconductor wafer grinding polishing tools, belong to the field of semiconductor polishing field field.It includes workbench, the upper surface center of the workbench is provided with grinding mechanism;The upper surface front of the workbench is provided with liquid injection mechanism;The upper surface rear of the workbench is provided with rest mechanism;The upper surface right of the workbench is fixedly provided with grinding suction mechanism;The liquid injection mechanism includes support one, the top of the support one is fixedly connected with mounting arm, the outer side wall of the mounting arm is opened with recess, the inside of the mounting arm is opened with hydraulic chamber behind the recess, the inside of the hydraulic chamber is slidably connected with piston block one, the outer side wall of the piston block one is fixedly connected with push rod one in the inside of the hydraulic chamber;When polishing semiconductor wafer, start motor one, drive rotary table to rotate, realize single side polishing of semiconductor wafer by grinding pad rotation, cooperate with grinding fluid sprayed on grinding pad.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor polishing, and in particular to a semiconductor wafer grinding and polishing tool. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. They are widely used in radios, televisions, and temperature measurement. Diodes, for example, are devices made of semiconductors. Semiconductors are materials with controllable electrical conductivity, ranging from insulators to conductors. The core units of most electronic products today, such as computers, mobile phones, and digital recorders, are closely related to semiconductors. In semiconductor manufacturing, the surface of the initially produced semiconductor wafers needs to be ground and polished. During this process, grinding fluid is used to assist in the grinding process.

[0003] Patent: CN217317530U provides a semiconductor surface grinding device, including a grinding device, a water storage box and a liquid collecting tank. The water storage box is fixedly connected to the lower right side of the grinding device, and the liquid collecting tank is fixedly connected to the lower side of the grinding device. The water storage box is composed of a water supply pipe, a water pump, a water extraction pipe, a nozzle and a power controller. When the grinding liquid is used for grinding, the water source is pumped out by the water pump to the water extraction pipe, and the water source is sprayed out through the nozzle to the processing table and the fixed parts, thereby avoiding the grinding liquid from easily forming crystals on the processing table and the fixed parts, avoiding the disadvantage of being difficult to clean, and achieving convenience for subsequent use. It solves the problem that in semiconductor manufacturing, it is necessary to perform surface grinding and polishing on the semiconductor wafers produced initially, and when processing them, grinding liquid is used to assist grinding, but the sprayed grinding liquid will cause crystallization on the processing table and the fixed position during use, which will cause influence in subsequent use.

[0004] When the above technology is used, the grinding liquid and the water used for cleaning cannot be controlled to be evenly sprayed and distributed. The uneven distribution of the grinding liquid can easily lead to uneven grinding and polishing of the semiconductor wafer surface during the grinding and polishing process, which can easily waste working time and working materials, and waste production costs. The water cannot be controlled to be sprayed evenly for cleaning, which can easily lead to unclean rinsing of the grinding pad surface, resulting in residual grinding debris during the next round of semiconductor wafer grinding, thereby scratching the semiconductor wafer. In addition, the spraying of the grinding liquid and the spraying water in the above technology needs to be manually adjusted. When a round of semiconductor grinding is completed and the next grinding material is replaced, the grinding liquid cannot be automatically switched to water for cleaning. The operation is complicated and needs to be improved. For this reason, we have proposed a semiconductor wafer grinding and polishing tool. Summary of the Invention

[0005] Purpose of the invention: The purpose of the present invention is to provide a grinding liquid and water for cleaning that can be controlled to be evenly sprayed and distributed; another purpose of the present invention is to provide automatic switching of spraying water or grinding liquid.

[0006] Technical solution: A semiconductor wafer grinding and polishing tool includes a workbench, wherein a grinding mechanism is provided at the center of the upper surface of the workbench;

[0007] A liquid spraying mechanism is provided in front of the upper surface of the workbench;

[0008] A rest mechanism is provided behind the upper surface of the workbench;

[0009] A grinding and suction mechanism is fixedly provided on the right side of the upper surface of the workbench;

[0010] The liquid spraying mechanism includes a pillar 1, the top of the pillar 1 is fixedly connected to a mounting arm, the outer wall of the mounting arm is provided with a notch, the interior of the mounting arm is provided with a hydraulic chamber located behind the notch, the interior of the hydraulic chamber is slidably connected to a piston block 1, the outer wall of the piston block 1 is located inside the hydraulic chamber and is fixedly connected to a push rod 1, the front end of the push rod 1 is fixedly connected to a movable block, the outer wall of the movable block is fixedly connected to an adjusting box, the front of the upper surface of the mounting arm is fixedly connected to an extraction pump, the interior of the adjusting box is slidably connected to a transfer chamber, the outer wall of the transfer chamber is located on the outside of the adjusting box and is fixedly connected to a plurality of pipe heads, a discharge pipe is fixedly connected between the extraction pump and the transfer chamber, and the bottom end of the pillar 1 is fixedly connected to the upper surface of the workbench.

[0011] Furthermore, the grinding mechanism includes a motor 1, a collection plate is provided on the outer wall of the output shaft of the motor 1, a plurality of support columns are fixedly connected between the collection plate and the workbench, the top end of the output shaft of the motor 1 is located on the inner side of the collection plate and is fixedly connected to a turntable, a grinding pad is embedded in the upper surface of the turntable, and the bottom of the motor 1 is fixedly connected to the upper surface of the workbench.

[0012] Furthermore, an external drain port is integrally formed on the left side of the lower surface of the collecting tray, and a scraper plate is fixedly connected to the outer side wall of the turntable.

[0013] Furthermore, a plurality of trapezoidal blocks are fixedly connected to the upper surface of the mounting arm near the adjusting box, a rotating head is fixedly connected to the left side of the transfer chamber, the lower surface of the rotating head is rotatably connected to a traction block via a rotating shaft, the lower surface of the traction block is located on the inner side of the adjusting box and is rotatably connected to a movable plate via a rotating shaft, a plurality of springs are fixedly connected between the movable plate and the adjusting box, and a push block is fixedly connected to the left side of the movable plate between the plurality of trapezoidal blocks.

[0014] The top end of the gear train is fixedly connected to the gear of the said rotary table, and the lower end of the gear train is fixedly connected to the gear of the said rotary table.

[0015] Furthermore, the upper surface of the swing arm is fixedly connected to a hydraulic box between the second motor and the sliding sleeve, the interior of the hydraulic box is slidingly connected to a second piston block, a second push rod is fixedly connected between the second piston block and the sliding sleeve, and a connecting pipe is fixedly connected between the hydraulic box and the hydraulic chamber.

[0016] Furthermore, the grinding suction mechanism includes an L-shaped mounting frame, the upper surface of the L-shaped mounting frame is fixedly connected to motor three, the bottom end of the output shaft of motor three is located on the inner side of the L-shaped mounting frame and is fixedly connected to an electric telescopic rod, the bottom end of the output end of the electric telescopic rod is fixedly connected to a grinding head, and the bottom of the L-shaped mounting frame is fixedly connected to the upper surface of the workbench.

[0017] Furthermore, the upper surface of the workbench is located on the left side of the L-shaped mounting frame and is fixedly connected to a liquid storage tank, and the interior of the liquid storage tank is provided with a grinding liquid chamber and a water storage chamber in sequence from top to bottom, the front surface of the liquid storage tank is fixedly connected to a steering chamber, the inner rear surface of the steering chamber is located inside the water storage chamber and the grinding liquid chamber, and both are fixedly connected to an extraction pipe, the interior of the steering chamber is slidably connected to a sealing baffle, the upper surface of the sealing baffle is fixedly connected to a connecting rod, the end of the connecting rod away from the sealing baffle extends to the top of the liquid storage tank, and is fixedly connected to a circular sleeve on the outer side wall of the output end of the electric telescopic rod, and the inner side wall of the circular sleeve is rotatably connected to the outer side wall of the output end of the electric telescopic rod through a rotating shaft.

[0018] Furthermore, a liquid extraction pipe is fixedly connected between the front surface of the steering cavity and the input end of the extraction pump.

[0019] Beneficial effect: When polishing a semiconductor wafer, the motor 1 is started to drive the turntable to rotate, and the single-side polishing of the semiconductor wafer is achieved by rotating the polishing pad and cooperating with the polishing liquid sprayed onto the polishing pad;

[0020] During the grinding process, the residual grinding liquid and the water used for flushing will enter the collection tray. As the turntable rotates, the scraper plate that rotates together will scrape the grinding debris and residual liquid to the external drain port, making them easy to discharge. This can effectively avoid the continuous use of the device. When grinding, excessive accumulation of residual liquid is difficult to clean up, avoiding the problem of stopping the device for cleaning in the prior art, and effectively improving work efficiency.

[0021] By reciprocatingly filling the hydraulic chamber with liquid for driving, a two-stage movement is achieved, which increases the spraying range of the nozzle head and avoids the cost increase caused by the need for multiple nozzle heads to spray to ensure uniform spraying in the existing technology. At the same time, it avoids the problem of incomplete spraying caused by the distribution interval when a small number of nozzle heads are spraying, which easily leads to the problem of unnecessary loss caused by damage to the grinding crystal due to incomplete spraying;

[0022] The dressing head rotates to dress the surface of the polishing pad, which can remove pollutants, residues and worn areas on the surface of the polishing pad, avoid uneven distribution of polishing pressure due to local depressions or protrusions, thereby reducing scratches on the wafer surface or fluctuations in material removal rate, and at the same time drive the swing arm to swing repeatedly, thereby increasing the dressing range, effectively avoiding the need in the prior art to use two driving devices to respectively drive the dressing head to rotate and dress and drive the swing arm to swing back and forth, reducing the cost increase caused by the driving device, and in the process of repeated forward and backward movement of the sliding sleeve, the liquid inside the hydraulic box will be repeatedly filled in and drawn out from the hydraulic chamber, realizing the driving work of evenly spraying the polishing liquid in the spray mechanism, and achieving the effect of joint linkage and coordination;

[0023] During normal grinding, the semiconductor raw material adheres to the grinding pad. At this time, the extraction pump extracts the grinding fluid to achieve the grinding function. When the electric telescopic rod is controlled to retract and the semiconductor raw material is replaced, the extraction pump will automatically extract clean water to clean the surface of the grinding pad during the replacement interval. This method effectively saves the need to manually adjust the switching between the extraction of grinding fluid and clean water, and can achieve the effect of automatic replacement by replacing the semiconductor raw material interval. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a front view structural schematic diagram of the present invention;

[0025] Figure 2 It is a schematic diagram of the left side structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the internal connection structure of the mounting arm and the adjustment box of the present invention from top view;

[0027] Figure 4 It is a side structural schematic diagram of the rest mechanism of the present invention;

[0028] Figure 5It is a top view schematic diagram of the connection structure of the hydraulic box, sliding sleeve, push rod 2 and piston block 2 of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the left side of the vertical cross section of the liquid storage tank of the present invention;

[0030] Figure 7 It is a schematic diagram of the internal structure of the steering cavity of the present invention.

[0031] In the figure: 1. workbench; 2. grinding mechanism; 3. liquid spraying mechanism; 4. rest mechanism; 5. grinding suction mechanism; 6. liquid storage tank; 7. grinding liquid chamber; 8. water storage chamber; 9. steering chamber; 10. extraction pipe; 11. sealing baffle; 12. connecting rod; 13. round sleeve; 14. extraction pipe; 201. motor 1; 202. collecting tray; 203. supporting column; 204. turntable; 205. grinding pad; 206. external liquid discharge port; 207. scraper; 301. pillar 1; 302. mounting arm; 303. notch; 304. hydraulic chamber; 305. piston block 1; 306. push rod 1; 307. movable block; 308. regulating box; 309. extraction pump; 31 0. Transfer chamber; 311. Pipe head; 312. Drain pipe; 313. Trapezoidal block; 314. Rotating head; 315. Pulling block; 316. Movable plate; 317. Spring; 318. Push block; 401. Pillar 2; 402. Shaft column; 403. Gear; 404. Swing arm; 405. Motor 2; 406. Disc 1; 407. Cylinder; 408. Disc 2; 409. Swing rod; 410. Sliding sleeve; 411. Rack; 412. Hydraulic box; 413. Piston block 2; 414. Push rod 2; 415. Connecting pipe; 416. Dressing head; 501. L-shaped mounting bracket; 502. Motor 3; 503. Electric telescopic rod; 504. Grinding head. DETAILED DESCRIPTION

[0032] In order to make the technical solution of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] Example

[0034] like Figure 1 and Figure 2 As shown, a semiconductor wafer grinding and polishing tool is provided, comprising a workbench 1, with a grinding mechanism 2 provided at the center of the upper surface of the workbench 1;

[0035] The grinding mechanism 2 comprises a motor 201, the outer wall of the output shaft of the motor 201 is sleeved with a collection disc 202, a plurality of support columns 203 are fixedly connected between the collection disc 202 and the workbench 1, the top end of the output shaft of the motor 201 is fixedly connected with a turntable 204 on the inner side of the collection disc 202, a grinding pad 205 is embedded on the upper surface of the turntable 204, and the bottom of the motor 201 is fixedly connected with the upper surface of the workbench 1;

[0036] An external liquid discharge port 206 is integrally formed on the lower surface of the collection disc 202, and the outer side wall of the turntable 204 is fixedly connected with a scraping plate 207;

[0037] When the semiconductor wafer is polished, the motor 201 is started to drive the turntable 204 to rotate, and the grinding pad 205 is rotated to cooperate with the grinding liquid sprayed on the grinding pad 205 to realize single-sided polishing of the semiconductor wafer. During the polishing process, residual liquid will be thrown into the inside of the collection disc 202 through the rotation of the turntable 204, and the scraping plate 207 rotating together with the turntable 204 will scrape the polishing debris and residual liquid to the external liquid discharge port 206, so as to facilitate discharge, which can effectively avoid the problem that the device needs to be stopped for cleaning in the prior art, and effectively improve the work efficiency;

[0038] As shown in the figure, Figure 3 The upper surface of the workbench 1 is provided with a liquid spraying mechanism 3 in front;

[0039] The liquid spraying mechanism 3 comprises a support column 301, the top end of the support column 301 is fixedly connected with a mounting arm 302, the outer side wall of the mounting arm 302 is provided with a notch 303, the inside of the mounting arm 302 is provided with a hydraulic cavity 304 behind the notch 303, the inside of the hydraulic cavity 304 is slidably connected with a piston block 305, the outer side wall of the piston block 305 is fixedly connected with a push rod 306 in the inside of the hydraulic cavity 304, the front end of the push rod 306 is fixedly connected with a movable block 307, the outer side wall of the movable block 307 is fixedly connected with an adjusting box 308, the upper surface of the mounting arm 302 is fixedly connected with a suction pump 309 in front, the inside of the adjusting box 308 is slidably connected with a transfer cavity 310, the outer side wall of the transfer cavity 310 is fixedly connected with a plurality of pipe heads 311 outside the adjusting box 308, a liquid discharge pipe 312 is fixedly connected between the suction pump 309 and the transfer cavity 310, and the bottom end of the support column 301 is fixedly connected with the upper surface of the workbench 1;

[0040] The upper surface of the mounting arm 302 is fixedly connected with a plurality of trapezoidal blocks 313 near the adjusting box 308, the left side of the transfer cavity 310 is fixedly connected with a rotating head 314, the lower surface of the rotating head 314 is rotatably connected with a traction block 315 through a rotating shaft, the lower surface of the traction block 315 is rotatably connected with a movable plate 316 through a rotating shaft on the inner side of the adjusting box 308, a plurality of springs 317 are fixedly connected between the movable plate 316 and the adjusting box 308, and a push block 318 is fixedly connected to the left side of the movable plate 316 between the plurality of trapezoidal blocks 313.

[0041] When this part is used, the extraction pump 309 is started to extract the grinding liquid, which is then discharged to the surface of the grinding pad 205 through the transfer cavity 310 and the plurality of pipe heads 311, and the grinding pad 205 is rotated and the grinding suction mechanism 5 is used to realize the grinding of the semiconductor crystal. At the same time, by repeatedly injecting and extracting liquid into the hydraulic cavity 304, the piston block 305 drives the movable block 307 to move back and forth in the notch 303, thereby driving the adjusting box 308 to move back and forth along the outer side of the mounting arm 302, increasing the spraying range of the pipe head 311.

[0042] At the same time, with the repeated movement of the adjusting box 308, the push block 318 will be in constant contact and separation with the plurality of trapezoidal blocks 313, and the push block 318 will push the movable plate 316 to move back and forth in the adjusting box 308, thereby driving the transfer cavity 310 and the pipe head 311 to move back and forth under the linkage of the traction block 315, further increasing the spraying range of the pipe head 311. By repeatedly filling liquid into the hydraulic cavity 304, two-stage movement is realized, the spraying range of the pipe head 311 is increased, the problem of cost increase caused by the need for multiple pipe heads 311 to ensure uniform spraying in the prior art is avoided, and the problem of incomplete spraying caused by the distribution interval of a small number of pipe heads 311 is avoided, thereby avoiding the problem of unnecessary loss caused by damage to the ground crystal due to incomplete spraying.

[0043] As shown in Figure 4 and Figure 5 , the upper surface of the workbench 1 is provided with a rest mechanism 4 at the rear;

[0044] The rest mechanism 4 includes a second pillar 401, the top of the second pillar 401 is fixedly connected to a shaft column 402, the top of the shaft column 402 is fixedly connected to a gear 403, the outer wall of the shaft column 402 is rotatably connected to a swing arm 404 through a rotating shaft, the front of the upper surface of the swing arm 404 is fixedly connected to a second motor 405, the bottom end of the output shaft of the second motor 405 is located below the swing arm 404 and is fixedly connected to a first disk 406, and the rear of the lower surface of the first disk 406 is fixedly connected to a cylinder 407. The bottom end of the cylinder 407 is fixedly connected to the second disk 408, and the outer wall of the cylinder 407 is fixedly connected to the swing rod 409. The rear end of the swing rod 409 is located on the outer wall of the swing arm 404 and is rotatably connected to the sliding sleeve 410 via a rotating shaft. The rear surface of the sliding sleeve 410 is fixedly connected to the rack 411, which is meshed with the gear 403. The lower surface of the second disk 408 is fixedly connected to the dressing head 416. The bottom end of the second pillar 401 is fixedly connected to the upper surface of the workbench 1;

[0045] A hydraulic box 412 is fixedly connected to the upper surface of the swing arm 404 between the second motor 405 and the sliding sleeve 410. A second piston block 413 is slidably connected to the interior of the hydraulic box 412. A second push rod 414 is fixedly connected between the second piston block 413 and the sliding sleeve 410. A connecting pipe 415 is fixedly connected between the hydraulic box 412 and the hydraulic chamber 304.

[0046] When the device is in use, the second motor 405 is started to drive the dressing head 416 to rotate, thereby dressing the surface of the polishing pad 205, removing contaminants, residues and worn areas on the surface of the polishing pad 205, avoiding uneven polishing pressure distribution due to local depressions or protrusions, thereby reducing scratches on the wafer surface or fluctuations in material removal rate;

[0047] At the same time, after the second motor 405 is started, the sliding sleeve 410 and the swing rod 409 cooperate to drive the rack 411 to move repeatedly along the upper side of the swing arm 404, thereby repeatedly engaging with the gear 403 and driving the swing arm 404 to swing repeatedly, thereby increasing the trimming range and effectively avoiding the need in the prior art to use two driving devices to drive the trimming head 416 to rotate and trim and drive the swing arm 404 to swing back and forth, thereby reducing the cost increase caused by the driving device.

[0048] Hydraulic liquid is provided between the hydraulic box 412, the connecting pipe 415 and the hydraulic chamber 304. Thus, during the repeated movement of the sliding sleeve 410 back and forth, the liquid inside the hydraulic box 412 will be repeatedly filled in and drawn out from the hydraulic chamber 304, thereby realizing the driving work of evenly spraying the grinding liquid in the spray mechanism 3 and achieving the effect of joint linkage and coordination.

[0049] like Figure 1 and Figure 2 As shown, a grinding and suction mechanism 5 is fixedly provided on the right side of the upper surface of the workbench 1;

[0050] The grinding suction mechanism 5 comprises an L-shaped mounting frame 501, the upper surface of the L-shaped mounting frame 501 is fixedly connected with a motor three 502, the bottom end of the output shaft of the motor three 502 is fixedly connected with an electric telescopic rod 503 on the inner side of the L-shaped mounting frame 501, the output end of the electric telescopic rod 503 is fixedly connected with a grinding head 504, and the bottom of the L-shaped mounting frame 501 is fixedly connected with the upper surface of the workbench 1.

[0051] The grinding head 504 is used for mounting a semiconductor grinding raw material, the motor three 502 is started to drive the grinding head 504 to rotate, the raw material can be controlled to rotate together with the grinding pad 205, the grinding of the semiconductor raw material is realized, when the device is used, the electric telescopic rod 503 is controlled to extend, so that the raw material contacts the grinding pad 205 for grinding, the electric telescopic rod 503 is controlled to retract, the grinding head 504 is convenient to move away from the grinding pad 205, and the semiconductor to be ground can be replaced at this time.

[0052] As shown in Figure 6 and Figure 7 The upper surface of the workbench 1 is fixedly connected with a liquid storage tank 6 on the left side of the L-shaped mounting frame 501, the inside of the liquid storage tank 6 is sequentially provided with a grinding liquid cavity 7 and a water storage cavity 8 from top to bottom, the front surface of the liquid storage tank 6 is fixedly connected with a steering cavity 9, the inside rear surface of the steering cavity 9 is fixedly connected with a suction pipe 10 in the inside of the water storage cavity 7 and the grinding liquid cavity 8, the inside of the steering cavity 9 is slidingly connected with a sealing baffle 11, the upper surface of the sealing baffle 11 is fixedly connected with a connecting rod 12, one end of the connecting rod 12 away from the sealing baffle 11 penetrates to the upper side of the liquid storage tank 6, and a round sleeve 13 is fixedly connected to the outer side wall of the output end of the electric telescopic rod 503, and the inner side wall of the round sleeve 13 is rotatably connected with the outer side wall of the output end of the electric telescopic rod 503 through a rotating shaft;

[0053] The front surface of the steering cavity 9 is fixedly connected with a liquid suction pipe 14 and the input end of the suction pump 309;

[0054] The water storage cavity 8 stores water for cleaning, the abrasive liquid cavity 7 stores abrasive liquid, in the abrasive state, the electric telescopic rod 503 is in the elongated state, at this time, the sealing baffle 11 blocks the communication between the water storage cavity 8 and the steering cavity 9, at this time, the extraction pump 309 is started to extract the abrasive liquid, which is convenient for grinding, after grinding, the electric telescopic rod 503 is controlled to contract, at this time, under the pulling of the connecting rod 12, the sealing baffle 11 rises to block the communication between the abrasive liquid cavity 7 and the steering cavity 9, at this time, the extraction pump 309 extracts the water in the water storage cavity 8 for cleaning, which is convenient for washing the surface of the abrasive pad 205, this way makes the semiconductor raw material adhere to the abrasive pad 205 during normal grinding, at this time, the extraction pump 309 extracts the abrasive liquid to realize the grinding function, when the electric telescopic rod 503 is controlled to contract, the semiconductor raw material is replaced, the extraction pump 309 automatically extracts water to clean the surface of the abrasive pad 205 during the replacement interval, this way effectively saves the need for manual adjustment of the switching between the extracted abrasive liquid and the water, and the automatic replacement effect can be realized through the replacement interval.

[0055] The above-described embodiments only express several embodiments of the present application, the description is more specific and detailed, but it cannot be understood as the limitation of the patent scope of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A semiconductor wafer grinding and polishing tool, comprising a workbench (1), characterized in that: A grinding mechanism (2) is provided at the center of the upper surface of the workbench (1); A liquid spraying mechanism (3) is provided in front of the upper surface of the workbench (1); A rest mechanism (4) is provided behind the upper surface of the workbench (1); A grinding and suction mechanism (5) is fixedly provided on the right side of the upper surface of the workbench (1); The liquid spraying mechanism (3) includes a support (301), the top end of the support (301) is fixedly connected to a mounting arm (302), the outer wall of the mounting arm (302) is provided with a notch (303), the interior of the mounting arm (302) is provided with a hydraulic chamber (304) located behind the notch (303), the interior of the hydraulic chamber (304) is slidably connected to a piston block (305), the outer wall of the piston block (305) is located inside the hydraulic chamber (304) and is fixedly connected to a push rod (306), the front end of the push rod (306) is fixedly connected to a movable Block (307), the outer wall of the movable block (307) is fixedly connected to an adjustment box (308), the front of the upper surface of the mounting arm (302) is fixedly connected to an extraction pump (309), the interior of the adjustment box (308) is slidably connected to a transfer chamber (310), the outer wall of the transfer chamber (310) is located outside the adjustment box (308) and is fixedly connected to a plurality of pipe heads (311), a drainage pipe (312) is fixedly connected between the extraction pump (309) and the transfer chamber (310), and the bottom end of the support (301) is fixedly connected to the upper surface of the workbench (1); The grinding mechanism (2) includes a motor (201), a collecting plate (202) is sleeved on the outer wall of the output shaft of the motor (201), a plurality of supporting columns (203) are fixedly connected between the collecting plate (202) and the workbench (1), the top end of the output shaft of the motor (201) is located on the inner side of the collecting plate (202) and is fixedly connected to a turntable (204), a grinding pad (205) is embedded on the upper surface of the turntable (204), and the bottom of the motor (201) is fixedly connected to the upper surface of the workbench (1); The rest mechanism (4) includes a second pillar (401), the top of the second pillar (401) is fixedly connected to a shaft column (402), the top of the shaft column (402) is fixedly connected to a gear (403), the outer wall of the shaft column (402) is rotatably connected to a swing arm (404) via a rotating shaft, the front of the upper surface of the swing arm (404) is fixedly connected to a second motor (405), the bottom end of the output shaft of the second motor (405) is located below the swing arm (404) and is fixedly connected to a first disk (406), the rear of the lower surface of the first disk (406) is fixedly connected to a cylinder (407), the The bottom end of the cylinder (407) is fixedly connected to the second disk (408), the outer wall of the cylinder (407) is fixedly connected to the swing rod (409), the rear end of the swing rod (409) is located on the outer wall of the swing arm (404) and is rotatably connected to the sliding sleeve (410) via a rotating shaft, the rear surface of the sliding sleeve (410) is fixedly connected to the rack (411), the rack (411) is meshed with the gear (403), the lower surface of the second disk (408) is fixedly connected to the trimming head (416), and the bottom end of the second pillar (401) is fixedly connected to the upper surface of the workbench (1); The grinding and suction mechanism (5) includes an L-shaped mounting frame (501), the upper surface of the L-shaped mounting frame (501) is fixedly connected to a motor three (502), the bottom end of the output shaft of the motor three (502) is located on the inner side of the L-shaped mounting frame (501) and is fixedly connected to an electric telescopic rod (503), the bottom end of the output end of the electric telescopic rod (503) is fixedly connected to a grinding head (504), and the bottom of the L-shaped mounting frame (501) is fixedly connected to the upper surface of the workbench (1).

2. A semiconductor wafer grinding and polishing tool according to claim 1, characterized in that: An external liquid discharge port (206) is integrally formed on the left side of the lower surface of the collecting tray (202), and a scraper plate (207) is fixedly connected to the outer side wall of the turntable (204).

3. The semiconductor wafer grinding and polishing tool according to claim 1, wherein: A plurality of trapezoidal blocks (313) are fixedly connected to the upper surface of the mounting arm (302) near the regulating box (308); a rotating head (314) is fixedly connected to the left side of the transfer chamber (310); a traction block (315) is rotatably connected to the lower surface of the rotating head (314) via a rotating shaft; a lower surface of the traction block (315) is located inside the regulating box (308) and is rotatably connected to a movable plate (316) via a rotating shaft; a plurality of springs (317) are fixedly connected between the movable plate (316) and the regulating box (308); and a push block (318) is fixedly connected to the left side of the movable plate (316) between the plurality of trapezoidal blocks (313).

4. The semiconductor wafer grinding and polishing tool according to claim 1, wherein: The upper surface of the swing arm (404) is fixedly connected to a hydraulic box (412) between the second motor (405) and the sliding sleeve (410), the interior of the hydraulic box (412) is slidably connected to a second piston block (413), a second push rod (414) is fixedly connected between the second piston block (413) and the sliding sleeve (410), and a connecting pipe (415) is fixedly connected between the hydraulic box (412) and the hydraulic chamber (304).

5. The semiconductor wafer grinding and polishing tool according to claim 1, wherein: The upper surface of the workbench (1) is located on the left side of the L-shaped mounting frame (501) and is fixedly connected to a liquid storage tank (6). The interior of the liquid storage tank (6) is provided with a grinding liquid chamber (7) and a water storage chamber (8) in sequence from top to bottom. The front surface of the liquid storage tank (6) is fixedly connected to a steering chamber (9). The rear surface of the interior of the steering chamber (9) is located inside the water storage chamber (8) and the interior of the grinding liquid chamber (7). Both are fixedly connected with an extraction pipe (10). The interior of the steering chamber (9) is slidably connected to a sealing baffle (11). The upper surface of the sealing baffle (11) is fixedly connected to a connecting rod (12). The end of the connecting rod (12) away from the sealing baffle (11) passes through the top of the liquid storage tank (6) and is fixedly connected to a circular sleeve (13) on the outer side wall of the output end of the electric telescopic rod (503). The inner side wall of the circular sleeve (13) is rotatably connected to the outer side wall of the output end of the electric telescopic rod (503) through a rotating shaft.

6. The semiconductor wafer grinding and polishing tool according to claim 5, characterized in that: A liquid extraction pipe (14) is fixedly connected between the front surface of the steering cavity (9) and the input end of the extraction pump (309).

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