High-performance beryllium copper alloy and preparation method thereof

Abstract

The invention relates to a high-performance beryllium copper alloy and a preparation method thereof, and belongs to the technical field of alloy materials. The beryllium-copper alloy comprises the following chemical components in percentage by weight: 1.7 to 2.0 percent of Be, 0.25 to 0.38 percent of Co, 0.32 to 0.4 percent of Ni, 0.16 to 0.23 percent of Ti, and the following main impurity components in percentage by weight: less than or equal to 0.12 percent of Fe, less than or equal to 0.08 percent of Si, less than or equal to 0.05 percent of Al and the balance of Cu and inevitable impurities. After alloying smelting, a C-coated SiC / Te refining agent is adopted for refining and purifying, the refining agent takes silicon carbide as a carrier, the thermal stability is excellent, slag can be fully discharged to be separated from impurities, and the comprehensive performance of the beryllium-copper alloy is remarkably improved through a triple synergistic mechanism of'carbon layer protection-Te efficient impurity removal-low residue design 'of a surface load layer.

Description

Technical Field

[0001] The invention belongs to the technical field of alloy materials, and in particular, relates to a high-performance beryllium copper alloy and a preparation method thereof. Background Art

[0002] Beryllium copper alloy is widely used in precision molds, aerospace and electronics industries due to its excellent strength, thermal conductivity, wear resistance and fatigue resistance. However, traditional beryllium copper alloy is easily affected by impurity elements (such as oxygen, sulfur, non-metallic inclusions, etc.) during the smelting process, resulting in an increase in internal defects in the material and a significant decrease in mechanical properties and thermal fatigue life.

[0003] In the prior art, various refining agents are used to purify beryllium copper alloys, such as phosphor copper refining agents, fluorine calcium refining agents, and borax refining agents, but the strengthening effect is not obvious and there are obvious technical bottlenecks. Te (tellurium) is a highly surface active element that reacts with impurities such as sulfur and oxygen in beryllium copper alloys and is an excellent refining material for beryllium copper alloys. However, Te is easily oxidized and fails. It is easily oxidized during high-temperature smelting, resulting in the loss of effective components and reducing the refining efficiency. In addition, residual Te is prone to form a brittle phase, which reduces the toughness and fatigue resistance of the material, seriously restricting its application in high-performance beryllium copper alloys. Summary of the invention

[0004] In order to solve the technical problems mentioned in the background technology, the purpose of the present invention is to provide a high-performance beryllium copper alloy and a preparation method thereof.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A high performance beryllium copper alloy, the chemical composition of which is:

[0007] Be: 1.7-2.0wt%, Co: 0.25-0.38wt%, Ni: 0.32-0.4wt%, Ti: 0.16-0.23wt%, Fe≤0.12wt%, Si≤0.08wt%, Al≤0.05wt%, and the balance is Cu and unavoidable impurities.

[0008] The C@SiC / Te refining agent is prepared by the following method:

[0009] Step A1: premix the silane coupling agent KH-560 and methanol aqueous solution, add propylene glycol and mix well, acidify with hydrochloric acid to a pH value of 4, stir and hydrolyze at room temperature for 35-40 hours, then add silicon carbide micropowder, stir and disperse, and then stand for coupling for 24 hours, remove the liquid phase and dry to obtain epoxidized silicon carbide;

[0010] Further, the feeding ratio of silicon carbide micropowder, silane coupling agent KH-560, glycerol and methanol aqueous solution is 50 g: 2 - 2.5 mL: 0.3 - 0.4 g: 120 - 160 mL. The silane coupling agent KH-560 is hydrolyzed and coupled onto the surface of silicon carbide micropowder, introducing organic epoxy groups to the surface.

[0011] Step A2: Premix diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran, introduce dry nitrogen for protection, control the temperature at 0 - 5 °C in an ice-water bath, slowly add diphenyldichlorosilane and stir for reaction for 8 - 10 h. After the reaction is completed, rotary evaporate to remove tetrahydrofuran, wash the substrate with water by mixing, separate the aqueous phase and dry it to obtain the modifier.

[0012] Further, the feeding ratio of diphenyldichlorosilane, diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran is 10 mmol: 11 - 13 mmol: 3.5 - 4 mL: 25 - 40 mL. Under low-temperature alkaline conditions, the excessive diethanolamine undergoes a substitution reaction with diphenyldichlorosilane to form a compound with multiple benzene rings.

[0013] Step A3: Mix the modifier, cetyltrimethylammonium bromide and dimethyl sulfoxide, then add the epoxidized silicon carbide and stir for dispersion. Heat up to 85 - 100 °C and stir for reaction for 2.5 - 3 h. After the reaction is completed, centrifuge to collect the precipitate, wash it with ethanol and dry it to obtain the modified matrix.

[0014] Further, the feeding ratio of epoxidized silicon carbide, modifier, cetyltrimethylammonium bromide and dimethyl sulfoxide is 50 g: 7.5 - 9.2 g: 0.5 - 0.7 g: 80 - 100 mL. Cetyltrimethylammonium bromide acts as a phase transfer agent and catalyst, promoting the ring-opening of the epoxy group on the surface of epoxidized silicon carbide with the secondary amine in the modifier molecule, and grafting the modifier onto the surface of epoxidized silicon carbide.

[0015] Step A4: Premix tellurium tetrachloride and anhydrous toluene, introduce dry nitrogen for protection, add the modified matrix and disperse it by ultrasonic wave. Heat up to 70 - 80 °C, slowly add triethylamine and stir for reaction for 3 - 4 h. After the reaction is completed, centrifuge to collect the precipitate, place it in a nitrogen atmosphere furnace, calcine it at 750 - 800 °C for 5 - 5.5 h, and cool it with the furnace to obtain the C@SiC / Te refining agent.

[0016] Further, the feeding ratio of the modified matrix, tellurium tetrachloride, triethylamine and anhydrous toluene is 50 g: 4.8 - 5.6 g: 25 - 40 mL: 150 - 200 mL. The nitrogen-oxygen chain segment in the modifier structure on the surface of the modified matrix forms a chelating effect on tellurium tetrachloride, enriching tellurium tetrachloride on the surface of the modified matrix. Then it reacts with the hydroxyl group of the epoxy ring-opening to form telluride loading. Under anaerobic high-temperature calcination, the grafted layer of the modifier forms a carbide to coat the silicon carbide, and the telluride decomposes and is loaded on the surface of the carbide.

[0017] A preparation method of a high-performance beryllium copper alloy, comprising the following steps:

[0018] Step S1: Melt electrolytic copper and control the temperature at 1300 ± 10 °C, add nickel wire, cobalt wire, titanium wire and beryllium copper master alloy to melt. After the temperature of the alloy liquid rises back to 1450 °C, keep it warm, add C@SiC / Te refining agent in batches for refining treatment for 11 - 14 min, skim the slag and then cast and cool to form, obtaining an alloy casting;

[0019] Step S2: Perform hot forging treatment, solution treatment and aging treatment on the alloy casting in sequence, and then a high-performance beryllium copper alloy is obtained.

[0020] Furthermore, the dosage of the C@SiC / Te refining agent is 0.18 - 0.21 wt% of the alloy liquid.

[0021] Furthermore, the starting forging temperature of the hot forging treatment is 850 °C, the final forging temperature is 750 °C, and the forging ratio is 2.5 - 3.

[0022] Furthermore, the solution treatment temperature is 790 - 820 °C, and the treatment time is 2.8 - 3.5 h.

[0023] Furthermore, the aging treatment temperature is 300 - 350 °C, and the treatment time is 2.5 - 3 h.

[0024] The beneficial effects of the present invention:

[0025] The present invention uses a C@SiC / Te refining agent to refine and purify beryllium copper alloy. Taking silicon carbide as the carrier, it has excellent thermal stability and can fully remove slag and separate impurities. After being treated with silane coupling agent KH-560, organic epoxy groups are grafted on the surface. Through the substitution reaction of diethanolamine and diphenyldichlorosilane, a modifier with a chain-like polybenzene ring structure is prepared. The epoxy groups on the surface of silicon carbide particles are ring-opened with the modifier, and the modifier is coated on the surface of silicon carbide. The nitrogen-oxygen chain segments in the modifier structure form a chelating effect on tellurium tetrachloride, enriching tellurium tetrachloride on the surface of the modified matrix. Then, it reacts with the hydroxyl groups of the ring-opened epoxy to form telluride loading. Under anaerobic high-temperature roasting, the polybenzene rings of the modifier are carbonized to form a carbon layer, and the telluride decomposes and is loaded on the carbon layer. Compared with the existing refining agents, the carbon layer formed by the carbonization of the polybenzene ring structure has a porous structure, providing a structural basis for the loading of tellurium. At the same time, as a protective layer, the carbon layer reacts with oxygen preferentially to prevent the oxidation of tellurium, ensuring that tellurium maintains high activity during the refining process, fully reacting with sulfur, oxygen and their inclusions, playing an efficient role in removing impurities and refining. The refined telluride is discharged with the refining slag, reducing the tellurium residue in the alloy liquid, avoiding the formation of brittle phases due to the long-term high-temperature reaction of tellurium with copper, and reducing the influence of tellurium on the mechanical properties of the alloy material. The C@SiC / Te refining agent significantly improves the comprehensive performance of beryllium copper alloy through the triple synergistic mechanism of "carbon layer protection - efficient tellurium impurity removal - low residue design". Detailed implementation manners

[0026] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] Example 1, preparing high-performance beryllium copper alloy, the specific implementation process is as follows:

[0028] I. Preparation of C@SiC / Te refining agent

[0029] Step A1: Prepare a methanol aqueous solution with a volume fraction of 15%. Premix the silane coupling agent KH-560 and the methanol aqueous solution, add glycerol and mix well, acidify to pH value of 4 with hydrochloric acid, stir and hydrolyze at room temperature for 40h, then add silicon carbide micropowder, stir and disperse, and stand for coupling for 24h. Among them, the feeding ratio of silicon carbide micropowder, silane coupling agent KH-560, glycerol and methanol aqueous solution is 50g: 2mL: 0.3g: 120mL. Finally, remove the liquid phase and dry to make epoxy-modified silicon carbide.

[0030] Step A2: Premix diethanolamine, N,N - diisopropylethylamine and anhydrous tetrahydrofuran, introduce dry nitrogen for protection, control the temperature at 0 °C in an ice - water bath, slowly add diphenyldichlorosilane and stir for reaction for 10 h. Among them, the feeding ratio of diphenyldichlorosilane, diethanolamine, N,N - diisopropylethylamine and anhydrous tetrahydrofuran is 10 mmol: 11 mmol: 3.5 mL: 25 mL. After the reaction, rotary evaporate to remove tetrahydrofuran, wash the substrate with water and mix, separate the aqueous phase and dry it to prepare a modifier.

[0031] Step A3: Mix the modifier, cetyltrimethylammonium bromide and dimethyl sulfoxide, then add epoxy - modified silicon carbide and stir to disperse, heat up to 85 °C and stir for reaction for 3 h. Among them, the feeding ratio of epoxy - modified silicon carbide, modifier, cetyltrimethylammonium bromide and dimethyl sulfoxide is 50 g: 7.5 g: 0.5 g: 80 mL. After the reaction, centrifuge to obtain the precipitate, wash it with ethanol and dry it to prepare a modified matrix.

[0032] Step A4: Premix tellurium tetrachloride and anhydrous toluene, introduce dry nitrogen for protection, add the modified matrix and disperse it by ultrasonic wave, heat up to 70 °C, slowly add triethylamine and stir for reaction for 4 h. Among them, the feeding ratio of the modified matrix, tellurium tetrachloride, triethylamine and anhydrous toluene is 50 g: 4.8 g: 25 mL: 150 mL. After the reaction, centrifuge to obtain the precipitate, place it in a nitrogen - atmosphere furnace, calcine at 750 °C for 5.5 h, and cool with the furnace to obtain the C@SiC / Te refining agent.

[0033] II. Preparation of Beryllium - Copper Alloy

[0034] In this example, the alloy components are: Be: 1.7 wt%, Co: 0.25 wt%, Ni: 0.4 wt%, Ti: 0.16 wt%. The main impurity components are controlled as: Fe ≤ 0.12 wt%, Si ≤ 0.08 wt%, Al ≤ 0.05 wt%, and the balance is Cu and unavoidable impurities;

[0035] Step S1. Alloy melting: Using electrolytic copper as the copper raw material, beryllium - copper master alloy as the beryllium raw material, high - purity nickel wire, cobalt wire and titanium wire as alloy raw materials. First, melt the electrolytic copper and control the temperature at 1300 ± 10 °C, add nickel wire, cobalt wire, titanium wire and beryllium - copper master alloy for alloying melting. When the temperature of the alloy liquid rises back to 1450 °C, keep it warm, take 0.21 wt% of the C@SiC / Te refining agent of the alloy liquid and add it in 2 batches for refining treatment for 11 min, skim the slag and then cast and cool to form an alloy casting.

[0036] Step S2, alloy heat treatment: The alloy casting is subjected to hot forging treatment. The initial forging temperature of the hot forging treatment is 850 °C, the final forging temperature is 750 °C, and the forging ratio is 3; then it is sent into a heat treatment furnace for solution treatment. The solution treatment temperature is 790 °C, and the treatment time is 3.5 h; finally, it is sent into the heat treatment furnace again for aging treatment. The aging treatment temperature is 300 °C, and the treatment time is 3 h; after taking out of the furnace, a high-performance beryllium copper alloy is obtained.

[0037] Example 2, preparation of a high-performance beryllium copper alloy, the specific implementation process is as follows:

[0038] I. Preparation of C@SiC / Te refining agent

[0039] Step A1: Prepare an aqueous methanol solution with a volume fraction of 15%. Premix the silane coupling agent KH-560 and the aqueous methanol solution, add glycerol and mix well, acidify with hydrochloric acid to a pH value of 4, stir and hydrolyze at room temperature for 35 h, then add silicon carbide micropowder, stir and disperse, and let stand for coupling for 24 h. Among them, the feeding ratio of silicon carbide micropowder, silane coupling agent KH-560, glycerol and aqueous methanol solution is 50 g: 2.5 mL: 0.4 g: 160 mL. Finally, remove the liquid phase and dry to make epoxy silicon carbide.

[0040] Step A2: Premix diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran, introduce dry nitrogen for protection, control the temperature in an ice-water bath at 5 °C, slowly add diphenyldichlorosilane and stir for reaction for 8 h. Among them, the feeding ratio of diphenyldichlorosilane, diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran is 10 mmol: 13 mmol: 4 mL: 40 mL. After the reaction is completed, rotary evaporate to remove tetrahydrofuran, wash the substrate with water, separate the aqueous phase and dry to make a modifier.

[0041] Step A3: Mix the modifier, cetyltrimethylammonium bromide and dimethyl sulfoxide, then add epoxy silicon carbide and stir and disperse. Heat up to 100 °C and stir for reaction for 2.5 h. Among them, the feeding ratio of epoxy silicon carbide, modifier, cetyltrimethylammonium bromide and dimethyl sulfoxide is 50 g: 9.2 g: 0.7 g: 100 mL. After the reaction is completed, centrifuge to collect the precipitate, wash with ethanol and dry to make a modified matrix.

[0042] Step A4: Premix tellurium tetrachloride and anhydrous toluene, introduce dry nitrogen for protection, add the modified matrix and ultrasonically disperse, heat up to 80 °C, slowly add triethylamine and stir for reaction for 3 h. Among them, the feeding ratio of the modified matrix, tellurium tetrachloride, triethylamine and anhydrous toluene is 50 g: 5.6 g: 40 mL: 200 mL. After the reaction is completed, centrifuge to collect the precipitate, place it in a nitrogen atmosphere furnace, calcine at 800 °C for 5 h, and cool with the furnace to discharge to obtain the C@SiC / Te refining agent.

[0043] II. Preparation of Beryllium Copper Alloy

[0044] In this embodiment, the alloy components are as follows: Be: 2.0 wt%, Co: 0.38 wt%, Ni: 0.32 wt%, Ti: 0.23 wt%. The main impurity components are controlled as: Fe ≤ 0.12 wt%, Si ≤ 0.08 wt%, Al ≤ 0.05 wt%, and the balance is Cu and unavoidable impurities;

[0045] Step S1, alloy melting: Using electrolytic copper as the copper raw material, beryllium copper master alloy as the beryllium raw material, and high-purity nickel wire, cobalt wire and titanium wire as the alloy raw materials. First, melt the electrolytic copper and control the temperature at 1300 ± 10 °C, add nickel wire, cobalt wire, titanium wire and beryllium copper master alloy for alloying melting. After the alloy liquid temperature rises back to 1450 °C, keep it warm. Take 0.18 wt% of C@SiC / Te refining agent of the alloy liquid and add it in 3 batches for 14 minutes of refining treatment. Skim the slag and then cast and cool to form an alloy casting.

[0046] Step S2, alloy heat treatment: Perform hot forging treatment on the alloy casting. The starting forging temperature of the hot forging treatment is 850 °C, the final forging temperature is 750 °C, and the forging ratio is 2.5; then send it into a heat treatment furnace for solution treatment. The solution treatment temperature is 820 °C and the treatment time is 2.8 h; finally, send it into the heat treatment furnace again for aging treatment. The aging treatment temperature is 350 °C and the treatment time is 2.5 h; take it out of the furnace to obtain a high-performance beryllium copper alloy.

[0047] Example 3, preparing a high-performance beryllium copper alloy, the specific implementation process is as follows:

[0048] I. Preparation of C@SiC / Te Refining Agent

[0049] Step A1: Prepare a methanol aqueous solution with a volume fraction of 15%. Premix the silane coupling agent KH-560 and the methanol aqueous solution, add glycerol and mix well, acidify it with hydrochloric acid to a pH value of 4, stir and hydrolyze at room temperature for 37 h, then add silicon carbide micropowder, stir and disperse, and let it stand for coupling for 24 h. Among them, the feeding ratio of silicon carbide micropowder, silane coupling agent KH-560, glycerol and methanol aqueous solution is 50 g: 2.2 mL: 0.35 g: 140 mL. Finally, remove the liquid phase and dry to make epoxy silicon carbide.

[0050] Step A2: Premix diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran, introduce dry nitrogen for protection, control the temperature at 5 °C in an ice-water bath, slowly add diphenyldichlorosilane and stir for reaction for 8.5 h. Among them, the feeding ratio of diphenyldichlorosilane, diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran is 10 mmol: 12 mmol: 3.7 mL: 30 mL. After the reaction is completed, rotary evaporate to remove tetrahydrofuran, wash the substrate with water, separate the aqueous phase and dry to make a modifier.

[0051] Step A3: Mix the modifier, cetyltrimethylammonium bromide, and dimethyl sulfoxide, then add epoxy silicon carbide and stir to disperse. Heat up to 90 °C and stir for reaction for 3 h. Among them, the feeding ratio of epoxy silicon carbide, modifier, cetyltrimethylammonium bromide, and dimethyl sulfoxide is 50 g: 8 g: 0.6 g: 90 mL. After the reaction, centrifuge to obtain the precipitate, wash it with ethanol and dry it to make the modified matrix.

[0052] Step A4: Premix tellurium tetrachloride and anhydrous toluene, introduce dry nitrogen for protection, add the modified matrix and disperse it by ultrasonic wave. Heat up to 75 °C, slowly add triethylamine and stir for reaction for 3.4 h. Among them, the feeding ratio of the modified matrix, tellurium tetrachloride, triethylamine, and anhydrous toluene is 50 g: 5.3 g: 35 mL: 170 mL. After the reaction, centrifuge to obtain the precipitate, place it in a nitrogen atmosphere furnace, calcine it at 770 °C for 5.5 h, and cool it with the furnace to discharge the material to obtain the C@SiC / Te refining agent.

[0053] II. Preparation of Beryllium Copper Alloy

[0054] In this example, the alloy components are: Be: 1.8 wt%, Co: 0.32 wt%, Ni: 0.35 wt%, Ti: 0.18 wt%. The main impurity components are controlled as: Fe ≤ 0.12 wt%, Si ≤ 0.08 wt%, Al ≤ 0.05 wt%, and the balance is Cu and unavoidable impurities;

[0055] Step S1, alloy melting: Using electrolytic copper as the copper raw material, beryllium copper master alloy as the beryllium raw material, high-purity nickel wire, cobalt wire, and titanium wire as the alloy raw materials. First, melt the electrolytic copper and control the temperature at 1300 ± 10 °C, add nickel wire, cobalt wire, titanium wire, and beryllium copper master alloy for alloying melting. When the temperature of the alloy liquid rises back to 1450 °C, hold it for heat preservation. Take 0.2 wt% of the C@SiC / Te refining agent of the alloy liquid and add it in 2 batches for refining treatment for 12 min. Skim the slag and then cast and cool to form an alloy casting.

[0056] Step S2, alloy heat treatment: Conduct hot forging treatment on the alloy casting. The starting forging temperature of the hot forging treatment is 850 °C, the final forging temperature is 750 °C, and the forging ratio is 3; then send it into the heat treatment furnace for solution treatment. The solution treatment temperature is 800 °C, and the treatment time is 3.1 h; finally, send it into the heat treatment furnace again for aging treatment. The aging treatment temperature is 320 °C, and the treatment time is 3 h; take it out of the furnace to obtain a high-performance beryllium copper alloy.

[0057] Comparative Example 1. This comparative example refers to Example 3, replacing the C@SiC / Te refining agent with a commercially available DCQT-1 type copper alloy refining agent, and the rest of the implementation process is exactly the same.

[0058] Comparative Example 2. This comparative example refers to Comparative Example 1, and 0.005 wt% of Te powder was added during the refining process, and the rest of the implementation process was exactly the same.

[0059] Samples were taken from the beryllium copper alloy materials prepared as above for the following tests:

[0060] Mechanical property test: Tensile test was carried out with reference to the standard of GB / T 228.1-2021;

[0061] Thermal fatigue test: The temperature of the specimen was raised by induction heating and cooled by spray cooling. The cyclic temperature was 100 - 500 °C, and the number of cycles when cracks appeared on the surface of the specimen (crack length ≥ 20 μm) was detected by ultrasonic testing;

[0062] Thermal strain test: The specimen was treated at 600 °C and 80 MPa for 100 h, and the dimensional change rate was detected after cooling;

[0063] Wear test: With reference to the standard of ASTM G133-22, the load was 50 N, the frequency was 5 Hz, the wear cycle was 120 min, and the wear amount was detected.

[0064] The specific test results are shown in Table 1:

[0065] Table 1

[0066] It can be seen from the test results in Table 1 that the beryllium copper alloy prepared in the examples has excellent tensile strength, high thermal cycle stability, stable dimensions under high temperature and high pressure, and excellent wear resistance, and has excellent comprehensive properties.

[0067] In the description of the specification, the description referring to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0068] The above content is only an example and illustration of the present invention. Those skilled in the art of the present technology can make various modifications or supplements to the described specific embodiments or use similar methods for substitution, as long as they do not deviate from the invention or exceed the scope defined by the claims of the present invention, they should all belong to the protection scope of the present invention.

Claims

1. A high performance beryllium copper alloy, characterized in that: Its chemical composition is: Be: 1.7-2.0wt%, Co: 0.25-0.38wt%, Ni: 0.32-0.4wt%, Ti: 0.16-0.23wt%, and the main impurity components are controlled as follows: Fe≤0.12wt%, Si≤0.08wt%, Al≤0.05wt%, wherein the beryllium copper master alloy is the beryllium raw material, and the balance is Cu and inevitable impurities, and after alloying and smelting, it is refined by using C@SiC / Te refining agent; The preparation method of the C@SiC / Te refining agent is: Step A1: premix the silane coupling agent KH-560 and methanol aqueous solution, add propylene glycol and mix well, acidify with hydrochloric acid to a pH value of 4, stir and hydrolyze at room temperature for 35-40 hours, then add silicon carbide powder, stir and disperse, and then stand for coupling to obtain epoxidized silicon carbide; Step A2: premix diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran, introduce dry nitrogen for protection, control the temperature at 0-5°C in an ice-water bath, slowly add diphenyldichlorosilane and stir to react for 8-10 hours to obtain a modifier; Step A3: dissolving the modifier, hexadecyltrimethylammonium bromide and dimethyl sulfoxide, adding epoxidized silicon carbide, stirring and dispersing, heating to 85-100° C., stirring and reacting for 2.5-3 hours, to obtain a modified matrix; Step A4: premix tellurium tetrachloride and anhydrous toluene, pass dry nitrogen for protection, add the modified matrix for ultrasonic dispersion, heat to 70-80°C, slowly add triethylamine and stir to react for 3-4h, centrifuge to obtain the precipitate after the reaction is completed, place it in a nitrogen atmosphere furnace, and roast it at 750-800°C for 5-5.5h, cool and discharge the material to obtain a C@SiC / Te refining agent.

2. A high performance beryllium copper alloy according to claim 1, characterized in that: The feed ratio of silicon carbide micropowder, silane coupling agent KH-560, propylene glycol and methanol aqueous solution is 50g:2-2.5mL:0.3-0.4g:120-160mL.

3. A high performance beryllium copper alloy according to claim 1, characterized in that: The feed ratio of diphenyldichlorosilane, diethanolamine, N,N-diisopropylethylamine and anhydrous tetrahydrofuran is 10 mmol: 11-13 mmol: 3.5-4 mL: 25-40 mL.

4. A high performance beryllium copper alloy according to claim 1, characterized in that: The feed ratio of epoxidized silicon carbide, modifier, hexadecyltrimethylammonium bromide and dimethyl sulfoxide is 50g:7.5-9.2g:0.5-0.7g:80-100mL.

5. A high performance beryllium copper alloy according to claim 1, characterized in that: The feed ratio of the modified substrate, tellurium tetrachloride, triethylamine and anhydrous toluene is 50g:4.8-5.6g:25-40mL:150-200mL.

6. A method for preparing a high performance beryllium copper alloy according to any one of claims 1 to 5, characterized in that: The steps include: Step S1: melting the electrolytic copper and controlling the temperature to 1300±10°C, adding nickel wire, cobalt wire, titanium wire and beryllium copper master alloy to melt, and keeping the alloy liquid temperature at 1450°C, adding C@SiC / Te refining agent in batches for refining treatment for 11-14 minutes, and casting and cooling after slagging to obtain alloy castings; Step S2: subjecting the alloy casting to hot forging treatment, solution treatment and aging treatment in sequence to obtain a high-performance beryllium copper alloy.

7. The method for preparing a high performance beryllium copper alloy according to claim 6, characterized in that: The dosage of C@SiC / Te refining agent is 0.18-0.21wt% of the alloy liquid.

8. The method for preparing a high performance beryllium copper alloy according to claim 6, characterized in that: The initial forging temperature of the hot forging treatment is 850°C, the final forging temperature is 750°C, and the forging ratio is 2.5-3.

9. The method for preparing a high performance beryllium copper alloy according to claim 6, characterized in that: The solution treatment temperature is 790-820°C and the treatment time is 2.8-3.5h.

10. The method for preparing a high performance beryllium copper alloy according to claim 6, characterized in that: The aging treatment temperature is 300-350℃ and the treatment time is 2.5-3h.

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