Method for binding target material assembly by adopting tin-zinc alloy solder

Abstract

The invention provides a method for binding a target material assembly by adopting tin-zinc alloy solder, which comprises the following steps: (1) carrying out ultrasonic infiltration treatment on a to-be-welded area of the target material assembly under a heating condition; the target material assembly comprises a target material and a back plate; (2) constructing a welding flux groove on the welding surface of the back plate by adopting a high-temperature-resistant material, uniformly placing metal wires after injecting tin-zinc alloy welding flux, and forming a boss on the back plate; (3) the welding face of the target material is buckled to the boss of the back plate, then a pressing block is placed on the non-welding face of the target material, and a welded whole is formed; and (4) the welded whole is cooled, redundant welding flux is scraped off after the high-temperature-resistant material is removed, and the target material assembly with the flat welding layer is obtained. According to the method provided by the invention, the defects that in the welding process of tin-zinc alloy welding flux, oxide can block the edge of the joint, so that welding defects are caused, or the welding flux is difficult to polish, cut and remove after being cooled are overcome; according to the method, the welding binding force of the target and the back plate is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and relates to a method for bonding a target component, and particularly to a method for bonding a target component using a tin-zinc alloy solder. Background Art

[0002] Sputtering coating technology usually utilizes gas discharge to generate gas ionization. Positive ions are accelerated by an electric field to bombard the cathode target at high speed, knocking out atoms or molecules of the cathode target and flying towards the surface of the substrate to be coated for film deposition. Currently, sputtering technologies include radio frequency sputtering, triode sputtering, and magnetron sputtering. Among them, magnetron sputtering has a relatively high coating rate compared to other sputtering technologies. Magnetron sputtering coating was industrialized in the 1970s. In the 1980s, magnetron sputtering technology in China had great development, and in the 1990s, large-scale magnetron sputtering devices could be provided and coating products could be mass-produced. Nowadays, magnetron sputtering has become one of the mainstream coating technologies. With the rapid development of terminal application markets such as artificial intelligence, 5G technology, and consumer electronics products, the market scale of semiconductor chips is expanding day by day, and the application scope of magnetron sputtering technology is also becoming more and more extensive.

[0003] Tin-zinc alloy solder is a low-temperature welding material used in the production of electronic components, with good fluidity, relatively high mechanical strength of the weld seam, and good corrosion resistance. However, this material is prone to oxidation at welding temperatures. The melting point of tin-zinc alloy is relatively low. For example, the melting point of Sn91Zn9 eutectic solder is 198 °C, which is close to the melting point of Sn-Pb eutectic (183 °C), and it can be used without changing existing welding equipment and processes. Tin-zinc alloy solder also has high tensile strength, high shear strength, high creep resistance, thermal fatigue performance, and good joint strength, with relatively low cost and rich reserves. Although tin-zinc alloy solder has many advantages, there are also some limitations. For example, the activity of zinc is relatively large, resulting in poor wettability and corrosion resistance of this solder, which limits its wide application. In addition, the tin-zinc alloy solder cannot be removed after cooling and solidification, while other solders can be scraped off by a crowbar after cooling and solidification.

[0004] CN 117248203A discloses a method for bonding a graphite target and a backplane, CN 115041767A discloses a method for bonding an ITO target and a Cu backplane, and CN 114951880A discloses a method for welding a three-layer structure ceramic target. The above patents all disclose bonding or welding the target and the backplane through solder, but do not disclose tin-zinc alloy solder, nor a method for removing the excess solder after welding. That is, the methods provided by the above patents cannot solve the problems encountered in the use of tin-zinc alloy solder.

[0005] In summary, it is necessary to provide a method to solve the defects that oxides will block at the edge of the joint during the welding process using a tin-zinc alloy solder, resulting in welding defects, or it is difficult to remove the solder by grinding and cutting after cooling. Summary of the Invention

[0006] The purpose of the present invention is to provide a method for binding a target component using a tin-zinc alloy solder. The method solves the defects that oxides will block at the edge of the joint during the welding process using a tin-zinc alloy solder, resulting in welding defects, or it is difficult to remove the solder by grinding and cutting after cooling; and the method improves the welding bonding force between the target and the backplane.

[0007] To achieve the purpose of this invention, the following technical solutions are adopted:

[0008] The present invention provides a method for binding a target component using a tin-zinc alloy solder, and the method includes the following steps:

[0009] (1) Under heating conditions, perform ultrasonic infiltration treatment on the welding area of the target component; the target component includes a target and a backplane.

[0010] (2) Use a high-temperature resistant material to construct a solder groove on the welding surface of the backplane, inject a tin-zinc alloy solder, and evenly place a metal wire, and form a boss on the backplane.

[0011] (3) Fasten the welding surface of the target to the boss on the backplane, and then place a pressing block on the non-welding surface of the target to form a welded whole.

[0012] (4) Cool down the welded whole obtained in step (3), remove the high-temperature resistant material in step (2), and scrape off the excess solder to obtain a target component with a flat solder layer.

[0013] The present invention further improves the binding rate of the target component by changing the welding structure. That is, when the target and the backplane are welded, a welding grass with a boss structure is constructed on the welding surface of the backplane. The binding rate is higher with a fixed groove structure in a concave shape, which can reduce the number of times the target is unbound, reduce the risk of target blank cracking, and better reduce production costs;

[0014] In addition, the binding method provided by the present invention can effectively scrape off the excess tin-zinc alloy solder during the welding process, and solves the defect that it is difficult to remove the tin-zinc alloy solder by grinding and cutting during use.

[0015] The heating conditions in step (1) of the present invention are: the temperature of the welding platform during the welding process is 300°C.

[0016] Preferably, the target component includes an LCD strip target component.

[0017] Preferably, the model of the target component includes any one of G5.1, G8.5, G8.6, G10.5 or G11.

[0018] Preferably, the backplane includes a copper alloy backplane.

[0019] Preferably, the target includes an aluminum alloy target.

[0020] As a preferred technical solution of the present invention, before the ultrasonic infiltration treatment in step (1), the welding area of the target component is polished.

[0021] Preferably, the ultrasonic infiltration treatment in step (1) includes infiltrating the surface of the welding area of the target component with an ultrasonic brush head.

[0022] Preferably, the time of the ultrasonic infiltration treatment in step (1) is 5 - 10 min, for example, it can be 5 min, 6 min, 7 min, 8 min, 9 min or 10 min, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0023] Preferably, the intensity of the ultrasonic wave in the ultrasonic infiltration treatment in step (1) is ≥300 W, for example, it can be 300 W, 310 W, 320 W, 330 W, 340 W or 350 W, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0024] Preferably, the infiltration liquid used in the ultrasonic infiltration treatment in step (1) includes a molten tin - zinc alloy solder.

[0025] As a preferred technical solution of the present invention, the construction of the solder groove in step (2) includes: winding a heat - resistant material around the periphery of the welding area of the backplane for one circle, and the height of the edge of the heat - resistant material is greater than the horizontal plane of the backplane to form a solder groove;

[0026] Preferably, the heat - resistant material includes a heat - resistant tape.

[0027] Preferably, the height of the solder groove is 3 - 5 mm, for example, it can be 3 mm, 3.4 mm, 3.8 mm, 4.2 mm, 4.6 mm or 5 mm, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0028] As a preferred technical solution of the present invention, the metal wire in step (2) includes an aluminum wire.

[0029] Preferably, the diameter of the aluminum wire is 0.2 to 0.4 mm. For example, it can be 0.2 mm, 0.24 mm, 0.28 mm, 0.32 mm, 0.36 mm or 0.4 mm, but is not limited to the listed values. Other values within the numerical range that are not listed are equally applicable.

[0030] The present invention constructs a solder groove with a boss structure, and there is no need to adjust the centering position of the target on the backplane as required by the fixed groove structure. The welding bonding rate of the fixed groove structure is about 80%. The reason for the low welding bonding rate of the target in the fixed groove structure is that there are a large number of defects in the edge area. When the fixed structure solder groove is buckled, the solder in the edge area cannot be discharged, and it accumulates in the edge, resulting in the generation of edge defects. The present invention constructs a boss structure by placing an aluminum wire. The boss structure leaves a machining allowance for the buckling of the target and the scraping of excess solder. Through multiple welding experiments, it is found that the welding bonding rate of this boss structure is ≥97%. The solder groove of the boss structure is formed by pasting a 3-5 mm high-temperature resistant tape on the outermost surface of the backplane. Since the diameter of the backplane is about 100 mm larger than the diameter of the target during welding, the area of the solder groove is larger than that of the fixed groove. When buckling, the oxidized indium is more likely to be discharged to the outer area where the target and the backplane are in contact, that is, it will not accumulate in the edge defects of the target, improving the welding rate of the target.

[0031] As a preferred technical solution of the present invention, the temperature of the tin-zinc alloy solder in step (2) is 210 to 280 °C. For example, it can be 210 °C, 220 °C, 230 °C, 240 °C, 250 °C, 260 °C, 270 °C or 280 °C, but is not limited to the listed values. Other values within the numerical range that are not listed are equally applicable.

[0032] As a preferred technical solution of the present invention, after placing the metal wire in step (2), it further includes performing ultrasonic defibrillation on the tin-zinc alloy solder in the solder groove.

[0033] Preferably, the time for ultrasonic defibrillation is 5 to 10 min. For example, it can be 5 min, 6 min, 7 min, 8 min, 9 min or 10 min, but is not limited to the listed values. Other values within the numerical range that are not listed are equally applicable.

[0034] Preferably, the intensity of the ultrasonic wave in the ultrasonic defibrillation is ≥300 W. For example, it can be 300 W, 310 W, 320 W, 330 W, 340 W or 350 W, but is not limited to the listed values. Other values within the numerical range that are not listed are equally applicable.

[0035] As a preferred technical solution of the present invention, the mass of the pressing block in step (3) is 90 to 100 kg, for example, it can be 90 kg, 92 kg, 94 kg, 96 kg, 98 kg or 100 kg, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0036] As a preferred technical solution of the present invention, the end temperature of the temperature reduction in step (4) is 200 to 220 °C, for example, it can be 200 °C, 204 °C, 208 °C, 212 °C, 216 °C or 220 °C, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0037] Preferably, the tool used for scraping in step (4) includes a silicone scraper.

[0038] Preferably, the thickness of the silicone scraper is 8 to 12 mm, for example, it can be 8 mm, 9 mm, 10 mm, 11 mm or 12 mm, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0039] It should be noted that the scraping in step (4) of the present invention is: continuously scraping the excess solder on the surface of the solder layer, target or backplane before cooling to the end temperature until the temperature drops below the end temperature.

[0040] As a preferred technical solution of the present invention, the end point of the buckling in step (3) is: ensuring that the space between the target and the backplane is filled with the tin-zinc alloy solder;

[0041] Preferably, the scraping of the excess solder in step (4) includes: scraping the excess solder in the solder groove and at the edge of the solder layer, ensuring that there is no residue of solder particles on the edge of the solder layer, the surface of the backplane and the surface of the target.

[0042] As a preferred technical solution of the present invention, the method for binding a target component using a tin-zinc alloy solder provided by the present invention includes the following steps:

[0043] (1) Under heating conditions, ultrasonic infiltration treatment is performed on the welding area to be welded of the target component that has been ultrasonically treated using a molten tin-zinc alloy solder; the target component includes a target and a backplane;

[0044] The time of the ultrasonic infiltration treatment is 5 to 10 min, and the intensity of the ultrasonic wave ≥ 300 W;

[0045] (2) A high-temperature resistant tape is wound around the periphery of the welding area to be welded of the backplane, and the height of the edge of the high-temperature resistant material is greater than the horizontal plane of the backplane, forming a solder groove with a height of 3 to 5 mm. After injecting a tin-zinc alloy solder at a temperature of 210 to 280 °C, aluminum wires with a diameter of 0.2 to 0.4 mm are evenly placed to form a boss on the backplane;

[0046] (3) Fasten the welding surface of the target to the boss of the backplane, ensure that the space between the target and the backplane is filled with the tin-zinc alloy solder, and then place a pressing block with a mass of 90 - 100 kg on the non-welding surface of the target to form a welded whole;

[0047] (4) Cool down the welded whole obtained in step (3) to 200 - 220 °C, remove the high-temperature resistant material described in step (2), and then scrape off the excess solder in the solder groove and at the edge of the solder layer, ensuring that there is no residual solder particle on the edge of the solder layer, the surface of the backplane, and the surface of the target, so as to obtain a target assembly with a flat solder layer.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] (1) The method provided by the present invention forms a tight whole between the backplane and the target by constructing a solder groove, and the binding combination rate is as high as over 98%, with relatively high bonding strength;

[0050] (2) The method provided by the present invention solves the defects that oxides will block at the edge of the joint during the welding process using tin-zinc alloy solder, resulting in welding defects, or it is difficult to grind, cut, and remove the solder after it cools. Specific Embodiments

[0051] The technical solution of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations on the present invention.

[0052] Example 1

[0053] This example provides a method for binding a target assembly using a tin-zinc alloy solder, and the method includes the following steps:

[0054] (1) Under the condition that the welding platform is set at 300 °C, perform ultrasonic infiltration treatment on the area to be welded of the target assembly that has been ultrasonically treated using molten tin-zinc alloy solder; the target assembly includes a target and a backplane;

[0055] The time of the ultrasonic infiltration treatment is 8 min, and the intensity of the ultrasonic wave is 350 W;

[0056] (2) Wind a high-temperature resistant tape around the periphery of the area to be welded of the backplane for one circle, and the height of the edge of the high-temperature resistant material is greater than the horizontal plane of the backplane to form a solder groove with a height of 4 mm. After injecting the tin-zinc alloy solder at a temperature of 280 °C, evenly place aluminum wires with a diameter of 0.3 mm to form a boss on the backplane;

[0057] (3) Fasten the welding surface of the target to the convex platform of the backplane, ensure that the space between the target and the backplane is filled with the tin-zinc alloy solder, and then place a pressing block with a mass of 95 kg on the non-welding surface of the target to form a welded unit;

[0058] (4) Cool down the welded unit obtained in step (3) to 210 °C, remove the high-temperature resistant material described in step (2), and then scrape off the excess solder in the solder groove and at the edge of the solder layer to ensure that there are no solder particles remaining on the edge of the solder layer, the surface of the backplane, and the surface of the target, thus obtaining a target assembly with a flat solder layer.

[0059] Example 2

[0060] This example provides a method for binding a target assembly using a tin-zinc alloy solder. The method includes the following steps:

[0061] (1) Under the condition that the welding platform is set at 300 °C, use the molten tin-zinc alloy solder to perform ultrasonic infiltration treatment on the area to be welded of the target assembly that has been ultrasonically treated; the target assembly includes a target and a backplane;

[0062] The time for the ultrasonic infiltration treatment is 5 minutes, and the intensity of the ultrasonic wave is 400 W;

[0063] (2) Use a high-temperature resistant tape to wind around the periphery of the area to be welded of the backplane in a circle, and ensure that the height of the edge of the high-temperature resistant material is greater than the horizontal plane of the backplane to form a solder groove with a height of 3 mm. Inject the tin-zinc alloy solder at a temperature of 210 °C, and then evenly place aluminum wires with a diameter of 0.2 mm to form a convex platform on the backplane;

[0064] (3) Fasten the welding surface of the target to the convex platform of the backplane, ensure that the space between the target and the backplane is filled with the tin-zinc alloy solder, and then place a pressing block with a mass of 100 kg on the non-welding surface of the target to form a welded unit;

[0065] (4) Cool down the welded unit obtained in step (3) to 200 °C, remove the high-temperature resistant material described in step (2), and then scrape off the excess solder in the solder groove and at the edge of the solder layer to ensure that there are no solder particles remaining on the edge of the solder layer, the surface of the backplane, and the surface of the target, thus obtaining a target assembly with a flat solder layer.

[0066] Example 3

[0067] This example provides a method for binding a target assembly using a tin-zinc alloy solder. The method includes the following steps:

[0068] (1) Under the condition that the welding platform is set at 300 °C, use the molten tin-zinc alloy solder to perform ultrasonic infiltration treatment on the area to be welded of the target assembly that has been ultrasonically treated; the target assembly includes a target and a backplane;

[0069] The time of the ultrasonic infiltration treatment is 10 min, and the intensity of the ultrasonic wave is 300 W;

[0070] (2) Wind a high-temperature resistant tape around the periphery of the area to be welded on the backplane for one circle, and the height of the edge of the high-temperature resistant material is greater than the horizontal plane of the backplane to form a solder groove with a height of 5 mm. After injecting the tin-zinc alloy solder at a temperature of 260 °C, evenly place aluminum wires with a diameter of 0.4 mm to form a boss on the backplane;

[0071] (3) Fasten the welding surface of the target to the boss on the backplane to ensure that the space between the target and the backplane is filled with the tin-zinc alloy solder. Then, place a pressing block with a mass of 90 kg on the non-welding surface of the target to form a welded whole;

[0072] (4) Cool down the welded whole obtained in step (3) to 220 °C. After removing the high-temperature resistant material described in step (2), scrape off the redundant solder in the solder groove and at the edge of the solder layer to ensure that there is no residual solder particle on the edge of the solder layer, the surface of the backplane, and the surface of the target, and obtain a target component with a flat solder layer.

[0073] Example 4

[0074] This example provides a method for binding a target component using a tin-zinc alloy solder. The difference between this method and that of Example 1 is only that:

[0075] In this example, the height of the solder groove described in step (2) is adjusted to 2 mm.

[0076] Example 5

[0077] This example provides a method for binding a target component using a tin-zinc alloy solder. The difference between this method and that of Example 1 is only that:

[0078] In this example, the end temperature of the cooling in step (4) is adjusted to 180 °C.

[0079] Example 6

[0080] This example provides a method for binding a target component using a tin-zinc alloy solder. The difference between this method and that of Example 1 is only that:

[0081] In this example, the end temperature of the cooling in step (4) is adjusted to 230 °C.

[0082] Comparative Example 1

[0083] This comparative example provides a method for binding a target component using a tin-zinc alloy solder. The difference between this method and that of Example 1 is only that:

[0084] In this comparative example, the tin-zinc alloy solder is adjusted to indium solder.

[0085] Comparative Example 2

[0086] This comparative example provides a method for bonding a target assembly using a tin-zinc alloy solder. The difference between this method and that of Example 1 is only that:

[0087] This comparative example omits the process of step (2) of constructing a solder groove, that is, directly sets the tin-zinc alloy solder in the area to be welded on the backplane.

[0088] Comparative Example 3

[0089] This comparative example provides a method for bonding a target assembly using a tin-zinc alloy solder. The difference between this method and that of Example 1 is only that:

[0090] This comparative example adjusts step (4) to: cooling the welded whole obtained in step (3) to room temperature, and using a crowbar to clean the excess solder.

[0091] Performance detection is carried out on the target assemblies obtained by using the bonding methods provided in the above examples and comparative examples, and the results are shown in Table 1;

[0092] Among them, the performance detection includes: welding bonding rate detection, single maximum defect area and surface defect detection; the surface defect detection includes: whether there is excess solder on the surfaces of the target, the backplane and the solder layer.

[0093] Table 1

[0094]

[0095] It can be seen from Table 1 that:

[0096] (1) Through comprehensive analysis of Examples 1-3, it can be known that the method provided by the present invention can achieve close bonding of the target and the backplane when using a tin-zinc alloy as the solder, obtaining a welding bonding rate of the target assembly ≥ 97%, and there are no defects on the surface of the target assembly, meeting the usage requirements of sputtering products;

[0097] (2) Through comprehensive analysis of Example 1 and Example 4, it can be known that if the height of the solder groove is reduced, the solder will flow to the side of the target during the welding process and cannot be removed, resulting in a reduction in the qualification rate of the target assembly;

[0098] (3) Through comprehensive analysis of Example 1 and Examples 5-6, it can be known that the end temperature of cooling will affect the solidification of the solder; if the end temperature is too low, the solder will solidify and cannot be scraped off by tools, resulting in target defects and not meeting the usage requirements of sputtering products;

[0099] (4) Through comprehensive analysis of Example 1 and Comparative Example 1, it can be known that if the zinc alloy solder is adjusted to indium solder, using the method provided by the present invention will cause de-soldering during the client's use process;

[0100] (5) By comprehensively analyzing Example 1 and Comparative Example 2, it can be seen that if the solder groove is omitted, the single maximum defect area of the target assembly obtained by welding will be too high, resulting in target defects and failing to meet the usage requirements of sputtering products.

[0101] (6) By comprehensively analyzing Example 1 and Comparative Example 3, it can be seen that if the excess solder is cleaned after the whole welding is cooled to room temperature, it will be impossible to clean the excess solder by tools or any means, resulting in the inability to further process the target assembly.

[0102] In summary, the method provided by the present invention solves the defects that oxides will block at the edge of the joint during the welding process using a tin-zinc alloy solder, resulting in welding defects, or it is difficult to grind, cut and remove after the solder cools; and the method improves the welding bonding force between the target and the backplane.

[0103] The applicant declares that the present invention uses the above embodiments to illustrate the detailed structural features of the present invention, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must rely on the above detailed structural features to be implemented. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of the components selected by the present invention, the addition of auxiliary components, and the selection of specific methods, etc., all fall within the protection scope and the disclosure scope of the present invention.

[0104] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept scope of the present invention, various simple modifications can be made to the technical solutions of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0105] In addition, it should be noted that, in the case of no contradiction, the various specific technical features described in the above specific embodiments can be combined in any appropriate way. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.

[0106] In addition, any combination can be made between various different embodiments of the present invention, as long as it does not violate the idea of the present invention, it should also be regarded as the content disclosed by the present invention.

Claims

1. A method for binding a target material assembly using a tin-zinc alloy solder, characterized in that: The method comprises the following steps: (1) Under heating conditions, an ultrasonic infiltration treatment is performed on a target assembly to be welded; the target assembly comprises a target and a back plate; (2) Using high temperature resistant materials to construct a solder groove on the welding surface of the back plate, injecting tin-zinc alloy solder and evenly placing metal wires to form a boss on the back plate; (3) snapping the welding surface of the target material onto the boss of the back plate, and then placing a pressing block on the non-welding surface of the target material to form a welded whole; (4) Cooling the entire weld obtained in step (3), removing the high temperature resistant material in step (2) and scraping off excess solder to obtain a target assembly with a smooth weld layer.

2. The method according to claim 1, characterized in that The step (1) includes polishing the target assembly area to be welded before the ultrasonic infiltration treatment; Preferably, the ultrasonic infiltration treatment in step (1) comprises using an ultrasonic brush head to infiltrate the surface of the target assembly in the area to be welded; Preferably, the ultrasonic immersion treatment in step (1) lasts for 5 to 10 minutes; Preferably, the intensity of the ultrasonic wave in the ultrasonic immersion treatment in step (1) is ≥ 300W; Preferably, the infiltration liquid used in the ultrasonic infiltration treatment in step (1) comprises molten tin-zinc alloy solder.

3. The method according to claim 1 or 2, characterized in that: The step (2) of constructing the solder groove comprises: using a high temperature resistant material to wrap around the area to be soldered of the back plate, and the edge height of the high temperature resistant material is greater than the horizontal plane of the back plate, so as to form a solder groove; Preferably, the high temperature resistant material comprises a high temperature resistant tape; Preferably, the height of the solder groove is 3-5 mm.

4. The method according to any one of claims 1 to 3, characterized in that: The metal wire in step (2) comprises aluminum wire; Preferably, the diameter of the aluminum wire is 0.2-0.4 mm.

5. The method according to any one of claims 1 to 4, characterized in that: The temperature of the tin-zinc alloy solder in step (2) is 210-280°C.

6. The method according to any one of claims 1 to 5, characterized in that: After placing the metal wire in step (2), the method further includes performing ultrasonic defibrillation on the tin-zinc alloy solder in the solder tank; Preferably, the ultrasonic defibrillation time is 5 to 10 minutes; Preferably, the intensity of the ultrasound waves in the ultrasonic defibrillation is ≥ 300W.

7. The method according to any one of claims 1 to 6, characterized in that: The mass of the briquette in step (3) is 90-100 kg.

8. The method according to any one of claims 1 to 7, characterized in that: The terminal temperature of the cooling in step (4) is 200-220° C. Preferably, the scraping tool used in step (4) comprises a silicone scraper; Preferably, the thickness of the silicone scraper is 8 to 12 mm.

9. The method according to any one of claims 1 to 8, characterized in that: The end point of the fastening in step (3) is: ensuring that the space between the target material and the back plate is filled with tin-zinc alloy solder; Preferably, the scraping off of excess solder in step (4) includes: scraping off excess solder in the solder groove and at the edge of the solder layer to ensure that no solder particles remain at the edge of the solder layer, the back plate surface and the target material surface.

10. The method according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: (1) Under heating conditions, using molten tin-zinc alloy solder to perform ultrasonic infiltration treatment on the area to be welded of the ultrasonically treated target assembly; the target assembly includes a target material and a back plate; The ultrasonic immersion treatment time is 5 to 10 minutes, and the intensity of the ultrasonic wave is ≥ 300W; (2) Use a high temperature resistant tape to wrap around the area to be welded on the back plate, and the edge height of the high temperature resistant material is greater than the horizontal plane of the back plate to form a solder groove with a height of 3 to 5 mm. After injecting tin-zinc alloy solder with a temperature of 210 to 280°C, evenly place aluminum wires with a diameter of 0.2 to 0.4 mm to form a boss on the back plate; (3) The welding surface of the target is buckled onto the boss of the back plate to ensure that the space between the target and the back plate is filled with tin-zinc alloy solder, and then a pressing block with a mass of 90 to 100 kg is placed on the non-welding surface of the target to form a welded whole; (4) The overall temperature of the weld obtained in step (3) is reduced to 200-220° C. After removing the high temperature resistant material in step (2), the excess solder in the solder groove and at the edge of the solder layer is scraped off to ensure that there are no solder particles remaining at the edge of the solder layer, the back plate surface and the target surface, so as to obtain a target assembly with a smooth solder layer.

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