Device and method for measuring physical property parameters of material under low-temperature strong magnetic field

Abstract

The invention provides a device for measuring physical property parameters of a material under a low-temperature strong magnetic field, and the device comprises a test thermostat which is used for providing a low-temperature environment; the clamping device is mounted at one end of the test thermostat and used for clamping a to-be-tested sample serving as a superconducting magnet conduction cooling material and transmitting the cooling capacity of the test thermostat to the to-be-tested sample; a superconducting magnet is arranged in the cryostat, the cryostat is used for providing a strong magnetic field environment, and a room temperature through hole is formed in the cryostat; wherein one end of the test thermostat is used for rotatably feeding a to-be-tested sample into the cryostat through the through hole, so that the material physical property parameters of the to-be-tested sample are measured. A low-temperature magnetic field environment and a high-intensity magnetic field environment are provided through the test thermostat and the cryostat respectively, and the low-temperature state can be kept in the whole measurement process. High-precision and high-efficiency measurement of material physical property parameters in a low-temperature high-intensity magnetic field environment is realized. The invention further provides a method for measuring the physical property parameters of the material under the low-temperature strong magnetic field.

Description

Technical Field

[0001] The present disclosure relates to the technical field of measuring material physical property parameters, and particularly to a device and a method for measuring material physical property parameters under low temperature and high magnetic field. Background Art

[0002] The properties of conduction-cooled materials on superconducting magnets will fluctuate greatly in the environment of low temperature and high magnetic field. Therefore, it is necessary to accurately obtain material physical property parameters such as the thermal conductivity of the conduction-cooled materials used for more precise conduction-cooling calculations to ensure the stable operation of superconducting magnets.

[0003] However, there is currently a lack of a measuring device that can efficiently and accurately measure material physical property parameters in a low-temperature and high-magnetic-field environment, which cannot meet the measurement requirements for conduction-cooled materials with high precision and high efficiency. Summary of the Invention

[0004] In view of the above problems, embodiments of the present disclosure provide a device and a method for measuring material physical property parameters under low temperature and high magnetic field.

[0005] One aspect of the present disclosure provides a device for measuring material physical property parameters under low temperature and high magnetic field, including: a test cryostat for providing a low-temperature environment; a clamping device installed at one end of the test cryostat for clamping a sample to be tested used as a conduction-cooled material for a superconducting magnet and transferring the cold of the test cryostat to the sample to be tested; a low-temperature cryostat for providing a high-magnetic-field environment, and a room-temperature through-hole is provided on one side of the low-temperature cryostat; wherein, one end of the test cryostat rotatably sends the sample to be tested into the low-temperature cryostat through the room-temperature through-hole to measure the material physical property parameters of the sample to be tested.

[0006] According to an embodiment of the present disclosure, the device for measuring material physical property parameters further includes a support platform 1 for supporting the test cryostat. The support platform 1 includes: a rotating device connected to the test cryostat for adjusting the angle of the sample to be tested clamped by the clamping device in the low-temperature cryostat; a lifting device provided on one side of the rotating device for adjusting the height of the test cryostat; a pulley block provided on the side of the lifting device away from the rotating device for adjusting the position of the test cryostat so that it can move relative to the direction of the room-temperature through-hole.

[0007] According to an embodiment of the present disclosure, the test cryostat includes: a refrigerator, a first-stage cold head, a second-stage cold head, a first-stage cold shield, a second-stage cold shield, an outer dewar, and a flange; wherein, the second-stage cold shield is provided on the side of the second-stage cold head away from the first-stage cold head and covers at least part of the clamping device, the first-stage cold shield covers the first-stage cold head and at least part of the second-stage cold shield, the outer dewar covers the first-stage cold shield and the second-stage cold shield, and a plurality of flanges are provided on the outer dewar.

[0008] According to an embodiment of the present disclosure, the clamping device includes: a base connected to a side of the secondary cold head away from the primary cold head; a heat conduction rod disposed on a side of the base away from the secondary cold head for clamping a sample to be tested serving as a conduction cooling material of a superconducting magnet and transferring the cold quantity of the test cryostat to the sample to be tested; a plurality of temperature sensors respectively disposed at two ends of the sample to be tested for measuring the temperature of the sample to be tested; a heating sheet disposed on a side of the sample to be tested away from the heat conduction rod; wherein, a side of the base away from the secondary cold head is connected to a secondary cold shield, and the secondary cold shield covers the heat conduction rod, the plurality of temperature sensors and the heating sheet.

[0009] According to an embodiment of the present disclosure, the clamping device further includes: a plurality of Hall sensors disposed on the heat conduction rod for measuring magnetic fields in multiple different directions inside the cryostat; a wire groove opened inside the heat conduction rod for arranging signal lines, and the signal lines are led out from at least one of a plurality of flanges along the wire groove, and the signal lines are used for transmitting signals of at least one of the plurality of temperature sensors, the heating sheet and the plurality of Hall sensors.

[0010] According to an embodiment of the present disclosure, the sample to be tested includes a conduction cooling material inside a dry-cooled superconducting magnet.

[0011] Another aspect of the present disclosure provides a method for measuring material physical property parameters under low temperature and high magnetic field, including: cooling the clamping device by using a test cryostat, the clamping device is disposed at one end of the test cryostat, and a sample to be tested serving as a conduction cooling material of a superconducting magnet is clamped inside the clamping device; transferring the cold quantity of the test cryostat to the sample to be tested by using the clamping device; rotatably feeding the sample to be tested into a cryostat for providing a high magnetic field environment; measuring the material physical property parameters of the sample to be tested to obtain the material physical property parameters of the sample to be tested.

[0012] According to an embodiment of the present disclosure, before cooling the clamping device by using the test cryostat, it further includes: performing a vacuum pumping operation on the test cryostat through a plurality of flanges on the test cryostat.

[0013] According to an embodiment of the present disclosure, transferring the cold quantity of the test cryostat to the sample to be tested by using the clamping device includes: connecting one end of the heat conduction rod of the clamping device to the sample to be tested, and at least one material of indium sheet and thermal grease is disposed on the connection surface between the heat conduction rod and the sample to be tested; transferring the cold quantity of the test cryostat to the sample to be tested by using the heat conduction rod.

[0014] According to an embodiment of the present disclosure, the material physical property parameters of a sample to be measured are measured, and the material physical property parameters of the sample to be measured obtained include: using a plurality of Hall sensors and a plurality of temperature sensors provided in a clamping device to obtain magnetic field information in a cryostat and temperature information in a test thermostat; heating the sample to be measured using a heating sheet provided in the clamping device according to the temperature information to obtain heating information; and determining the material physical property parameters of the sample to be measured according to the magnetic field information, the temperature information, and the heating information.

[0015] The present disclosure provides a low-temperature and strong magnetic field environment through a test thermostat and a cryostat respectively, and uses a clamping device to transfer cold to the sample to be measured, so that it can maintain a low-temperature state throughout the measurement process. High-precision and high-efficiency measurement of material physical property parameters in a low-temperature and strong magnetic field environment is achieved. Brief Description of the Drawings

[0016] Through the following description of the embodiments of the present disclosure with reference to the drawings, the above content and other objects, features, and advantages of the present disclosure will become clearer. In the drawings:

[0017] Figure 1 Schematically shows a structural diagram of a device for measuring material physical property parameters under low-temperature and strong magnetic field according to an embodiment of the present disclosure;

[0018] Figure 2A Schematically shows an external structural diagram of a test thermostat according to an embodiment of the present disclosure;

[0019] Figure 2B Schematically shows a middle structural diagram of a test thermostat according to an embodiment of the present disclosure;

[0020] Figure 2C Schematically shows an internal structural diagram of a test thermostat according to an embodiment of the present disclosure;

[0021] Figure 3 Schematically shows a structural diagram of a clamping device according to an embodiment of the present disclosure;

[0022] Figure 4 Schematically shows a flowchart of a method for measuring material physical property parameters under low-temperature and strong magnetic field according to an embodiment of the present disclosure.

[0023]

Description of the Reference Numerals

[0024] 1 - Support platform; 1.1 - Lifting device; 1.2 - Pulley block; 1.3 - Rotating device; 2 - Test thermostat; 2.1 - Refrigerator; 2.2 - Flange; 2.3 - Outer dewar; 2.4 - First - stage cold shield; 2.5 - First - stage cold head; 2.6 - Second - stage cold shield; 2.7 - Second - stage cold head; 3 - Cryostat; 3.1 - Room - temperature through - hole 3.1; 4 - Clamping device 4; 4.1 - Base; 4.2 - Cold - conducting rod; 4.3 - Wire groove; 4.4 - Multiple Hall sensors 4.4; 4.5 - Multiple temperature sensors; 4.6 - Specimen under test; 4.7 - Heating sheet. Detailed implementation manners

[0025] To make the objectives, technical solutions, and advantages of the present disclosure clearer and more understandable, the following further describes the present disclosure in detail with reference to specific embodiments and the accompanying drawings.

[0026] It should be noted that in the description of the drawings or the specification, similar or identical parts are all denoted by the same reference numerals. The technical features in the various embodiments exemplified in the specification can be freely combined to form new solutions on the premise of no conflict. In addition, each claim can be regarded as an independent embodiment, or the technical features in each claim can be combined to form a new embodiment. Moreover, in the drawings, the shape or thickness of the embodiments can be enlarged, and can be simplified or conveniently marked. Furthermore, the elements or implementation manners not shown or described in the drawings are in the forms known to those of ordinary skill in the art. Additionally, although this document may provide examples with parameters including specific values, it should be understood that the parameters do not necessarily exactly equal the corresponding values, but may approximate the corresponding values within an acceptable error tolerance or design constraint.

[0027] Unless there are technical obstacles or contradictions, the above - mentioned various embodiments of the present disclosure can be freely combined to form additional embodiments, and these additional embodiments are all within the protection scope of the present disclosure.

[0028] Although the present disclosure is described with reference to the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplarily illustrate the preferred embodiments of the present disclosure, and should not be construed as a limitation to the present disclosure. The dimensional ratios in the drawings are merely schematic and should not be construed as a limitation to the present disclosure.

[0029] Although some embodiments of the general concept of the present disclosure have been shown and described, those of ordinary skill in the art will understand that changes can be made to these embodiments without departing from the principles and spirit of the general concept of the present disclosure. The scope of the present disclosure is defined by the claims and their equivalents.

[0030] Figure 1 The structural diagram of the device for measuring material physical property parameters under low temperature and high magnetic field according to an embodiment of the present disclosure is schematically shown.

[0031] AsFigure 1 As shown in Figure 1 , an embodiment of the present disclosure provides a device for measuring material physical property parameters under low temperature and strong magnetic field, including: a test cryostat 2 for providing a low temperature environment; a clamping device 4 installed at one end of the test cryostat 2 for clamping a sample under test 4.6 used as a conduction cooling material for a superconducting magnet, and transferring the cold quantity of the test cryostat 2 to the sample under test 4.6; and a low temperature cryostat 3 for providing a strong magnetic field environment, with a room temperature through hole 3.1 provided in the low temperature cryostat 3. Wherein, one end of the test cryostat 2 rotatably feeds the sample under test 4.6 into the low temperature cryostat 3 through the through hole 3.1 to measure the material physical property parameters of the sample under test 4.6.

[0032] In some embodiments, the test cryostat 2 can adopt, for example, a liquid helium circulation refrigeration structure and has a vacuum environment inside to provide a low temperature environment below 4.2K for the sample under test 4.6.

[0033] The clamping device 4 is arranged at one end of the test cryostat 2 and can be, for example, a cylindrical rod-shaped device with the sample under test 4.6 clamped inside. When the test cryostat 2 is turned on, the clamping device 4 can transfer the cold quantity of the test cryostat 2 to the sample under test 4.6.

[0034] A superconducting magnet is integrated inside the low temperature cryostat 3, which can be used to generate a magnetic field above 3T, for example. A room temperature through hole 3.1 is provided at the center of the low temperature cryostat 3, and the diameter of the room temperature through hole 3.1 is limited by the size of the superconducting magnet. It should be understood that the size of the above-mentioned clamping device 4 should be opened according to the diameter of the room temperature through hole 3.1 so that the clamping device 4 can be smoothly rotated and fed into the low temperature cryostat 3. Wherein, T represents Tesla, which is a derived unit of the International System of Units for magnetic flux density or magnetic induction intensity.

[0035] During measurement, for example, the test cryostat 2 can be first turned on so that the inside of the test cryostat 2 is in a low temperature environment below 4.2K, and the cold quantity is transferred to the sample under test 4.6 through the clamping device 4. Then, for example, the test cryostat 2 can be operated to translate along the direction of the room temperature through hole 3.1 so that the clamped sample under test 4.6 enters the central magnetic field area of the low temperature cryostat 3 through the room temperature through hole 3.1. Finally, for example, the material physical property parameters of the sample under test 4.6 can be measured through multiple measurement modules in the clamping device 4. Wherein, K represents Kelvin, which is the unit of thermodynamic temperature.

[0036] By testing, the thermostat 2 and the cryostat 3 respectively provide a low-temperature and a strong magnetic field environment, and the clamping device 4 is used to transfer the cold quantity to the sample 4.6 to be measured, enabling it to maintain a low-temperature state throughout the measurement process. High-precision and high-efficiency measurement of the physical property parameters of materials is achieved in a low-temperature and strong magnetic field environment. In addition, the present disclosure can provide a low-temperature and strong magnetic field environment and can also be used for other related tests, such as the calibration of low-temperature temperature chips and the test of the critical current of superconducting wires.

[0037] Please continue to refer to Figure 1 As shown, the device for measuring the physical property parameters of materials further includes a support platform 1 for supporting the test thermostat 2. The support platform 1 includes: a rotating device 1.3 connected to the test thermostat 2 for adjusting the angle of the sample 4.6 to be measured clamped by the clamping device 4 in the cryostat 3. A lifting device 1.1 is arranged on one side of the rotating device 1.3 for adjusting the height of the test thermostat 2. A pulley block 1.2 is arranged on the side of the lifting device 1.1 away from the rotating device 1.3 for adjusting the position of the test thermostat 2 so that it can move relative to the direction of the room-temperature through-hole 3.1.

[0038] In some embodiments, the support platform 1 may be composed of, for example, a lifting device 1.1, a pulley block 1.2, and a rotating device 1.3.

[0039] The lifting device 1.1 is used to adjust the angle of the sample 4.6 to be measured in the cryostat 3. Due to the different angles of the sample 4.6 to be measured in the cryostat 3, the scheme of replacing the background magnet in the cryostat 3 can be changed, enabling the device to be adapted to magnets of different sizes and different magnetic field strengths.

[0040] The pulley block 1.2 is used to adjust the position of the test thermostat 2 so that it can move relative to the direction of the room-temperature through-hole 3.1. The pulley block 1.2 provides the flexibility for the whole device to move and ensures that the front end of the test thermostat 2 can be inserted into the room-temperature through-hole 3.1 of the cryostat 3 that provides a strong magnetic field.

[0041] The rotating device 1.3 can manually control the rotation of the test thermostat 2. The magnetic field direction at different angles of the front end (i.e., the clamping device 4) of the test thermostat 2 in the room-temperature through-hole 3.1 is different. Therefore, the measurement of the physical properties of materials in different magnetic field directions can be achieved without changing the cryostat 3.

[0042] For the measurement requirements of the physical properties of materials under different magnetic field strengths, the present disclosure is equipped with a support platform 1 with adjustable position and angle for the test thermostat 2, enabling it to be adapted to superconducting magnets of different sizes.

[0043] Figure 2A Schematically shows the external structure diagram of the test thermostat according to an embodiment of the present disclosure. Figure 2BSchematically shows a middle structure diagram of the test thermostat 2 according to an embodiment of the present disclosure. Figure 2C Schematically shows an internal structure diagram of the test thermostat according to an embodiment of the present disclosure.

[0044] Figure 2A 、 Figure 2B 、 Figure 2C Are respectively an external structure diagram, a middle structure diagram, and an internal structure diagram of the test thermostat according to an embodiment of the present disclosure.

[0045] According to an embodiment of the present disclosure, as shown in FIG. 2, Figure 3 and Figure 4 shown, the test thermostat 2 includes: a refrigerator 2.1, a first-stage cold head 2.5, a second-stage cold head 2.7, a first-stage cold shield 2.4, a second-stage cold shield 2.6, an outer dewar 2.3, and a flange 2.2. Among them, the second-stage cold shield is disposed on a side of the second-stage cold head away from the first-stage cold head and covers at least part of the clamping device, the first-stage cold shield covers the first-stage cold head and at least part of the second-stage cold shield, the outer dewar covers the first-stage cold shield and the second-stage cold shield, and the outer dewar is provided with a plurality of flanges.

[0046] In some embodiments, the test thermostat 2 can be provided with a low-temperature environment by, for example, 1 GM refrigerator (Gifford Mcmahon refrigerator). The outer dewar 2.3 on the GM refrigerator 2.1 is used to maintain a high-vacuum environment and reduce heat leakage caused by convective heat transfer. The first-stage cold head 2.5 in the GM refrigerator 2.1 can be connected to the first-stage cold shield 2.4 by bolts, for example, to cool the first-stage cold shield 2.4 to below 50K. The second-stage cold head 2.7 in the GM refrigerator 2.1 can also be connected to the second-stage cold shield 2.6 by bolts, for example, to cool the second-stage cold shield 2.6 to below 4.2K. Among them, K represents Kelvin, which is a unit of thermodynamic temperature.

[0047] Four KF25 flanges 2.2 can be provided on the outer dewar 2.3, for example. The above flanges 2.2 can be used for vacuum pumping, installing a vacuum gauge, and leading out signal wires. Among them, the KF25 flange represents a quick-disconnect vacuum flange with a nominal diameter of 25 mm.

[0048] Through the setting of the two cold shields in the test thermostat 2, the radiation heat leakage from the outside to the sample is reduced, and the accuracy of material property measurement is improved. And the system has a simple structure, a small specific heat capacity of the internal materials, can achieve rapid cooling within 2 hours, has a short measurement time for a single sample, and can effectively save time costs.

[0049] Figure 3 Schematically shows a structure diagram of the clamping device according to an embodiment of the present disclosure.

[0050] According to an embodiment of the present disclosure, as Figure 3 shown, the clamping device 4 includes: a base 4.1, connected to the side of the secondary cold head 2.7 away from the primary cold head 2.5. A heat conducting rod 4.2, disposed on the side of the base 4.1 away from the secondary cold head 2.7, for clamping a sample under test 4.6 used as a conduction cooling material for a superconducting magnet, and transferring the cooling capacity of the test cryostat 2 to the sample under test 4.6. A plurality of temperature sensors 4.5, respectively disposed at both ends of the sample under test 4.6, for measuring the temperature of the sample under test 4.6. A heating sheet 4.7, disposed on the side of the sample under test 4.6 away from the heat conducting rod 4.2. Wherein, the side of the base 4.1 away from the secondary cold head 2.7 is connected to the secondary cold shield 2.6, and the secondary cold shield 2.6 covers the heat conducting rod 4.2, the plurality of temperature sensors 4.5, and the heating sheet 4.7.

[0051] In some embodiments, one side of the base 4.1 can be connected to the secondary cold head 2.7 in the GM refrigerator 2.1, and the other side can be connected to the secondary cold shield 2.6. The heat conducting rod 4.2 can be, for example, a relatively long cylindrical heat conducting copper rod made of copper material, for feeding the sample under test 4.6 into the room temperature through hole 3.1 of the low temperature cryostat 3.

[0052] One end of the heat conducting copper rod is connected to the base 4.1, and the other end can be connected to a sample under test 4.6, for example. A temperature sensor is provided at each end of the sample under test 4.6. The above temperature sensor can be fixed to the sample under test 4.6 through a temperature sensor fixture, for example, to ensure the accuracy of temperature measurement on the sample under test 4.6. The side of the sample under test 4.6 away from the heat conducting copper rod can be connected to the heating sheet 4.7, for example, and the heating sheet 4.7 is used to heat the sample under test 4.6 to form a stable temperature difference on the sample under test 4.6.

[0053] The method of conducting cooling using the heat conducting rod 4.2 to cool the sample saves the usage amount of liquid helium, reduces the test cost, and improves the stability of the system at the same time.

[0054] According to an embodiment of the present disclosure, the clamping device 4 further includes: a plurality of Hall sensors 4.4, disposed on the heat conducting rod 4.2, for measuring magnetic fields in various different directions in the low temperature cryostat 3. A wire groove 4.3, opened inside the heat conducting rod 4.2, for arranging signal lines, and the signal lines are led out from at least one of the plurality of flanges 2.2 along the wire groove 4.3, and the signal lines are used to transmit the signals of at least one of the plurality of sensors, the heating sheet 4.7, and the plurality of Hall sensors 4.4.

[0055] In some embodiments, a wire outlet groove 4.3 is provided on the heat conduction rod 4.2 for the signal wire to run, preventing the signal wire from contacting the secondary cold shield 2.6. One end of the signal wire can be connected to, for example, multiple sensors, a heating sheet 4.7, and multiple Hall sensors 4.4 respectively, and the other end extends out from a flange 2.2 port along the groove 4.3 to transmit the signals of the above-mentioned devices.

[0056] For example, the signal wire can also be used to connect an external temperature controller, and through the temperature controller, the physical property parameters of the material can also be tested within different temperature ranges to obtain complete data.

[0057] Two Hall sensors can be provided on the heat conduction rod 4.2, for example, so as to measure magnetic fields in two different directions in the cryostat 3.

[0058] The measurement accuracy of the device can be further improved by setting the wire groove 4.3 and the Hall sensors.

[0059] According to an embodiment of the present disclosure, the sample to be measured 4.6 includes a conduction cooling material inside a dry-cooled superconducting magnet.

[0060] The dry-cooled superconducting magnet is a core component of the rotating gantry of a medical heavy ion therapy device, which can significantly reduce the size and weight of the rotating gantry. The dry-cooled superconducting magnet on the rotating gantry of the medical heavy ion therapy device operates in a fast pulse mode and generates a large amount of AC loss during normal operation, thereby causing the temperature rise of the superconducting magnet and then leading to quenching. Therefore, it is necessary to accurately obtain parameters such as the thermal conductivity of the conduction cooling material used and perform more precise conduction cooling calculations to ensure the stable operation of the superconducting magnet.

[0061] The embodiments of the present disclosure are directed to a conduction cooling material inside a dry-cooled superconducting magnet, and a set of measurement devices and usage methods for material physical property parameters under low temperature and strong magnetic field are developed, which can meet the measurement requirements of material performance with high precision and high efficiency.

[0062] Figure 4 The flowchart of the method for measuring material physical property parameters under low temperature and strong magnetic field according to an embodiment of the present disclosure is schematically shown.

[0063] The embodiments of the present disclosure also provide a method for measuring material physical property parameters under low temperature and strong magnetic field, as Figure 4 shown, including operations S410 to S440.

[0064] In operation S410, the clamping device is cooled by using a test cryostat. The clamping device is arranged at one end of the test cryostat, and a sample to be measured used as a superconducting magnet is clamped inside the clamping device.

[0065] In operation S420, the cold quantity of the test cryostat is transferred to the sample to be tested by using the clamping device.

[0066] In operation S430, the sample to be tested is rotatably fed into the cryostat, and the cryostat is used to provide a low-temperature and high-magnetic-field environment.

[0067] In operation S440, the material physical property parameters of the sample to be tested are measured to obtain the material physical property parameters of the sample to be tested.

[0068] In some embodiments, before measurement, for example, the sample 4.6 to be tested can be first installed on the clamping device 4.

[0069] After that, the clamping device 4 can be installed on the secondary cold head 2.7 of the test cryostat 2, and then the secondary cold shield 2.6 and the primary cold shield 2.4 are respectively connected to the base 4.1 of the clamping device 4 and the primary cold head 2.5 of the test cryostat 2. When installing, for example, indium sheets and thermal grease can be used to assist in the connection to ensure good thermal contact.

[0070] Finally, the outer dewar 2.3 is connected to the refrigerator 2.1, and thus the layout operation before measurement is completed.

[0071] After the installation is completed, the refrigerator 2.1 in the test cryostat 2 can be turned on for cooling, and the cold quantity is transferred to the sample 4.6 to be tested by the clamping device 4. Each time when cooling, for example, the temperature on the sample 4.6 to be tested can reach 3K or below.

[0072] After the temperature is stabilized, power is supplied to the cryostat 3, and the required magnetic field value is obtained by adjusting the current and the position of the support platform 1. The sample 4.6 to be tested is analyzed to obtain the physical properties of the sample.

[0073] According to the embodiments of the present disclosure, before cooling the clamping device 4 by using the test cryostat 2, it further includes: performing a vacuum pumping operation on the test cryostat 2 along a plurality of flanges 2.2 on the test cryostat 2.

[0074] In some embodiments, before cooling the clamping device 4 by using the test cryostat 2, for example, a mechanical pump and a molecular pump can be used to perform a vacuum pumping operation on the test cryostat 2 along a plurality of flanges 2.2 on the test cryostat 2 until the vacuum degree inside the test cryostat 2 reaches 10 -5 Pa.

[0075] The vacuum pumping operation improves the cooling speed of the refrigerator 2.1 and the temperature stability inside the test cryostat 2.

[0076] According to an embodiment of the present disclosure, transferring the cooling capacity of the test thermostat 2 to the sample under test 4.6 by using the clamping device 4 includes: connecting one end of the heat conduction rod 4.2 of the clamping device 4 to the sample under test 4.6, and at least one material of indium sheet and thermal grease is provided on the connection surface between the heat conduction rod 4.2 and the sample under test 4.6. The cooling capacity of the test thermostat 2 is transferred to the sample under test 4.6 by using the heat conduction rod 4.2.

[0077] In some embodiments, before measurement, for example, the sample under test 4.6 can be installed on the heat conduction copper rod, and indium sheets can be arranged or thermal grease can be applied on the contact surface to ensure good thermal contact between the sample under test 4.6 and the heat conduction copper rod.

[0078] The heat conduction copper rod can achieve efficient heat conduction. Arranging indium sheets or applying thermal grease between the sample under test 4.6 and the heat conduction copper rod can fill the microscopic voids and reduce the contact thermal resistance, thereby improving the conduction efficiency.

[0079] According to an embodiment of the present disclosure, measuring the material physical property parameters of the sample under test 4.6 and obtaining the material physical property parameters of the sample under test 4.6 include: using a plurality of Hall sensors 4.4 and a plurality of temperature sensors 4.5 arranged in the clamping device 4 to obtain the magnetic field information and temperature information in the low-temperature thermostat 3; heating the sample under test 4.6 by using the heating sheet 4.7 arranged in the clamping device 4 according to the temperature information to obtain heating information; determining the material physical property parameters of the sample under test 4.6 according to the magnetic field information, temperature information and heating information.

[0080] In some embodiments, before measurement, for example, 1 low-temperature heating sheet 4.7 and 2 low-temperature temperature sensors can be respectively arranged on the sample under test 4.6, and two Hall sensors can be arranged on the heat conduction rod 4.2. Among them, it is necessary to ensure good thermal contact between the low-temperature heating sheet 4.7 and the low-temperature temperature sensors and the sample under test 4.6, and a torque wrench is used to fix the temperature sensors.

[0081] After the temperature is stable, the low-temperature thermostat 3 can be powered on, and the required magnetic field value can be obtained by adjusting the current and the position of the support platform 1. Adjust to the required measurement temperature value. After reaching the target value, the heating sheet 4.7 can be used to heat the sample to form a temperature difference on the sample. Finally, the data of the magnetic field, temperature sensor, heating sheet 4.7, etc. are collected, processed and analyzed to calculate the physical properties of the sample.

[0082] Through the multi-dimensional data provided by the Hall sensor, temperature sensor and heating sheet 4.7, the material physical property parameters such as the thermal conductivity and electrical conductivity of the sample under test 4.6 at low temperature and high magnetic field can be accurately measured.

[0083] For the details not described in the method embodiment part, they are similar to those in the device embodiment part. Please refer to the device embodiment part and will not be elaborated here.

[0084] It should be understood that the specific order or hierarchy of steps in the disclosed process is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process can be rearranged without departing from the scope of the present disclosure. The appended method claims present the elements of the various steps in an exemplary order and are not intended to be limited to the specific order or hierarchy.

[0085] It should also be noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only references to the directions in the accompanying drawings and are not used to limit the scope of the present disclosure. Throughout the drawings, the same elements are denoted by the same or similar reference numerals. When it may cause confusion in the understanding of the present disclosure, conventional structures or configurations will be omitted. And the shapes, sizes, and positional relationships of the components in the drawings do not reflect the actual sizes, proportions, and actual positional relationships.

[0086] In the above detailed description, various features are combined in a single embodiment to simplify the present disclosure. This method of disclosure should not be construed as reflecting an intention that the embodiments of the claimed subject matter require more features than are clearly recited in each claim. On the contrary, as reflected in the appended claims, the present disclosure is in a state less than the full features of the disclosed single embodiment. Therefore, the appended claims are hereby expressly incorporated into the detailed description, where each claim stands alone as a separate preferred embodiment of the present disclosure.

[0087] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. Regarding the term "comprising" used in the specification or claims, the coverage of this word is similar to the term "including", as explained when "including" is used as a transitional word in the claims. Any use of the term "or" in the specification or claims of the claims is intended to mean "non-exclusive or".

[0088] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present disclosure. It should be understood that the above are only specific embodiments of the present disclosure and are not used to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure should be included within the scope of the present disclosure.

Claims

1. A device for measuring material properties under low temperature and strong magnetic field, characterized in that: include: A test thermostat (2) for providing a low temperature environment; A clamping device (4) is installed at one end of the test thermostat (2) and is used to clamp the sample to be tested (4.6) used as a conduction cooling material for the superconducting magnet, and to transfer the cooling energy of the test thermostat (2) to the sample to be tested (4.6); A low temperature thermostat (3) for providing a strong magnetic field environment, wherein a room temperature through hole (3.1) is provided on one side of the low temperature thermostat (3); One end of the test thermostat (2) rotatably delivers the sample to be tested (4.6) into the low-temperature thermostat (3) through the room temperature through hole (3.1) to measure the material property parameters of the sample to be tested (4.6).

2. The device for measuring material properties under low temperature and strong magnetic field according to claim 1, characterized in that The material property parameter measuring device further comprises a supporting platform (1) for supporting the test thermostat (2), wherein the supporting platform (1) comprises: A rotating device (1.3), connected to the test thermostat (2), used to adjust the angle of the sample to be tested (4.6) clamped by the clamping device (4) in the low-temperature thermostat (3); A lifting device (1.1), arranged on one side of the rotating device (1.3), and used for adjusting the height of the test thermostat (2); The pulley block (1.2) is arranged on a side of the lifting device (1.1) away from the rotating device (1.3) and is used to adjust the position of the test thermostat (2) so that it can move in a direction relative to the greenhouse through hole (3.1).

3. The device for measuring material properties under low temperature and strong magnetic field according to claim 1, characterized in that: The test thermostat (2) comprises: Refrigerator (2.1), first-stage cold head (2.5), second-stage cold head (2.7), first-stage cold shield (2.4), second-stage cold shield (2.6), external dewar (2.3) and flange (2.2); The secondary cold shield (2.6) is arranged on a side of the secondary cold head (2.7) away from the primary cold head (2.5), and is covered on at least part of the clamping device (4); the primary cold shield (2.4) is covered on the primary cold head (2.5) and at least part of the secondary cold shield (2.6); the outer dewar (2.3) is covered on the primary cold shield (2.4) and the secondary cold shield (2.6); and the outer dewar (2.3) is provided with a plurality of flanges (2.2).

4. The device for measuring material properties under low temperature and strong magnetic field according to claim 3, characterized in that: The clamping device (4) comprises: A base (4.1) connected to a side of the secondary cold head (2.7) away from the primary cold head (2.5); A cooling rod (4.2) is arranged on a side of the base (4.1) away from the secondary cold head (2.7), and is used to clamp the sample to be tested (4.6) used as a conduction cooling material for the superconducting magnet, and to transfer the cooling energy of the test thermostat (2) to the sample to be tested (4.6); A plurality of temperature sensors (4.5) are respectively arranged at two ends of the sample to be tested (4.6) and are used to measure the temperature of the sample to be tested (4.6); A heating plate (4.7) is arranged on a side of the sample to be tested (4.6) away from the cooling rod (4.2); Wherein, a side of the base (4.1) away from the secondary cold head (2.7) is connected to the secondary cold shield (2.6), and the secondary cold shield (2.6) is covered on the cooling rod (4.2), the plurality of temperature sensors (4.5) and the heating plate (4.7).

5. The device for measuring material properties under low temperature and strong magnetic field according to claim 4, characterized in that: The clamping device (4) further comprises: A plurality of Hall sensors (4.4) are arranged on the cooling rod (4.2) and are used to measure magnetic fields in a plurality of different directions in the cryostat (3); A wire groove (4.3) is provided inside the cooling rod (4.2) and is used for arranging a signal line. The signal line is led out from at least one of the multiple flanges (2.2) along the wire groove (4.3). The signal line is used to transmit a signal from at least one of the multiple temperature sensors (4.5), the heating plate (4.7) and the multiple Hall sensors (4.4).

6. The device for measuring material properties under low temperature and strong magnetic field according to claim 1, characterized in that: The sample to be tested (4.6) includes a conductive cooling material in a dry-cooled superconducting magnet.

7. A method for measuring material properties under low temperature and strong magnetic field, characterized in that: include: The clamping device (4) is cooled using a test thermostat (2), wherein the clamping device (4) is arranged at one end of the test thermostat (2), and a sample (4.6) to be tested, which is used as a conduction cooling material for a superconducting magnet, is clamped in the clamping device (4); Utilizing the clamping device (4) to transfer the cooling energy of the test thermostat (2) to the sample to be tested (4.6); The sample to be tested (4.6) is rotatably fed into the cryostat (3), wherein the cryostat (3) is used to provide a strong magnetic field environment; The material property parameters of the sample to be tested (4.6) are measured to obtain the material property parameters of the sample to be tested (4.6).

8. The method for measuring material properties under low temperature and strong magnetic field according to claim 7, characterized in that: Before using the test thermostat (2) to cool the clamping device (4), the method further comprises: The test thermostat (2) is evacuated via a plurality of flanges (2.2) on the test thermostat (2).

9. The method for measuring material properties under low temperature and strong magnetic field according to claim 7, characterized in that: The method of transferring the cold energy of the test thermostat (2) to the sample to be tested (4.6) by using the clamping device (4) comprises: One end of the cooling rod (4.2) of the clamping device (4) is connected to the sample to be tested (4.6), and at least one of an indium sheet and thermal grease is provided on the connection surface between the cooling rod (4.2) and the sample to be tested (4.6); The cooling rod (4.2) is used to transfer the cooling energy of the test thermostat (2) to the sample to be tested (4.6).

10. The method for measuring material properties under low temperature and strong magnetic field according to claim 7, characterized in that: The material property parameters of the sample to be tested (4.6) are measured to obtain the material property parameters of the sample to be tested, including: Utilizing the plurality of Hall sensors (4.4) and the plurality of temperature sensors (4.5) provided in the clamping device (4) to obtain magnetic field information in the low-temperature thermostat (3) and temperature information in the test thermostat; According to the temperature information, the sample to be tested (4.6) is heated using a heating plate (4.7) provided in the clamping device (4) to obtain heating information; The material property parameters of the sample to be tested (4.6) are determined according to the magnetic field information, the temperature information and the heating information.

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