Electronic device

Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a first shell, a heating element group, a fan and a heat dissipation module, the heating element set and the heat dissipation module are arranged in the first shell. The plurality of heating elements in the heating element group do not comprise a processor. And a fan is arranged on each of the two sides of the heating element group in the first shell. The positions, corresponding to the air inlets of the two fans, of the first shell are each provided with an air inlet area, and the air inlets communicate with the corresponding air inlet areas. A first air outlet of the fan faces the heating element set and is communicated with the first outlet. The heat dissipation module comprises a first heat pipe and a first heat conduction plate connected with the first heat pipe, the first heat pipe and the first heat conduction plate at least cover the heating elements in the middle area in the heating element set, and the two ends of the first heat pipe correspond to the first air outlets of the two fans respectively. According to the electronic equipment, all heating elements of a non-processor can be considered, so that the temperature of the surface of the electronic equipment is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and particularly to an electronic device. Background Art

[0002] To enable an electronic device to have better heat dissipation performance, some electronic devices are provided with an active heat dissipation structure, which can dissipate heat from the heat-generating components inside the electronic device. Electronic devices can include laptops, tablets, etc.

[0003] Taking a laptop as an example, the active heat dissipation structure mainly includes a substrate, heat pipes, a fan, and heat exchange fins. The substrate covers the heat-generating components on the circuit board in the laptop. The heat-generating components include a processor and other heat-generating components. The heat pipes are in contact with the substrate at the position corresponding to the processor, the fan and the heat exchange fins are arranged at the ends of the heat pipes, and the heat exchange fins are connected to the ends of the heat pipes. The heat generated by the heat-generating components can be transferred to the substrate, and then through the substrate to the heat pipes and the heat exchange fins. The heat on the heat exchange fins can be taken away by the airflow generated by the fan, and after the airflow flows to the outside of the first housing, it can dissipate heat from all the heat-generating components on the circuit board.

[0004] However, the heat dissipation efficiency of this active heat dissipation structure of the laptop for the heat-generating components other than the processor is relatively low, and it will still cause the temperature on the surface of the laptop to be too high. Summary of the Invention

[0005] This application provides an electronic device, which can enable the heat-generating components in at least the middle area of the heat-generating component group to exchange heat with the outside in a timely and effective manner, so as to reduce the temperature on the surface of the electronic device.

[0006] An embodiment of this application provides an electronic device, including:

[0007] A first housing, having an air inlet area and a first outlet, and the air inlet area has a ventilation opening;

[0008] A heat-generating component group, arranged inside the first housing; the heat-generating component group includes a plurality of heat-generating components, and the plurality of heat-generating components do not include a processor;

[0009] Fans, along the length direction of the first housing, there is a fan on each side of the heat-generating component group inside the first housing, and the fans are centrifugal fans; each fan has an air inlet and a first air outlet, and the first housing is provided with an air inlet area at the positions corresponding to the two air inlets respectively; the air inlet is communicated with the ventilation opening in the corresponding air inlet area; the first air outlet faces the heat-generating component group and is communicated with the first outlet;

[0010] The heat dissipation module is disposed inside the first housing. The heat dissipation module includes a first heat pipe and a first heat conduction plate. The first heat pipe and the first heat conduction plate at least cover the heat generating components in the middle area of the heat generating component group, and the two end portions of the first heat pipe are respectively arranged corresponding to the first air outlets of two fans; the first heat conduction plate is connected to the first heat pipe.

[0011] Through the arrangement of the first heat pipe and the first heat conduction plate, the heat of at least the heat generating components in the middle area of the heat generating component group is gathered at the two end portions of the first heat pipe. Moreover, through the arrangement that the two end portions of the first heat pipe are respectively arranged corresponding to the first air outlets of the two fans, the air flow flowing out from the first air outlets of the two fans can respectively take away the heat concentrated at the two end portions of the first heat pipe, and can dissipate the heat of at least the heat generating components in the middle area of the heat generating component group, so that the heat generating components in at least the middle area of the heat generating component group can timely and effectively exchange heat with the external air of the electronic device, avoiding the surface temperature of the electronic device, especially the surface temperature of the second housing, from being too high, and can avoid excessive air resistance.

[0012] Moreover, the heat of the heat generating components covered by the first heat pipe in the heat generating component group can be transferred to the first heat pipe along the thickness direction of the first housing, which can reduce the thermal conduction resistance of the heat generating components covered by the first heat pipe in the length direction and the width direction of the first housing, so as to reduce the thermal resistance of the heat generating components covered by the first heat pipe in the heat dissipation path. And the heat transferred to the first heat pipe can be gathered at the two end portions of the first heat pipe along the extending direction of the first heat pipe, and is dissipated through the first air outlets of the two fans, which can improve the heat dissipation effect of the heat generating components in the heat generating component group and reduce the temperature of the first housing and the surface of the electronic device.

[0013] In some embodiments, the first heat pipe can cover some of the heat generating components in the heat generating component group, and the first heat conduction plate can cover the remaining heat generating components in the heat generating component group. In this way, through the arrangement of the first heat pipe and the first heat conduction plate, all the heat generating components in the heat generating component group can be covered, all the heat generating components in the heat generating component group can be taken into account, and the heat of all the heat generating components in the heat generating component group can be dissipated, further improving the heat dissipation effect of the heat generating components in the heat generating component group and further reducing the temperature of the first housing and the surface of the electronic device.

[0014] In some embodiments, the first heat pipe has a connecting portion, the connecting portion covers some of the heat generating components in the heat generating component group, along the width direction of the first housing, the first air outlets of the two fans are both located on one side of the connecting portion, and the two end portions of the first heat pipe are both located on the side of the connecting portion facing the two first air outlets, so that while the first heat pipe covers the connecting portion, the two end portions of the first heat pipe can be respectively arranged at the corresponding first air outlets.

[0015] In some embodiments, the electronic device further includes a circuit board disposed in the first housing. The first housing has a bottom case and a housing body oppositely arranged in the thickness direction. The heating element group is disposed on one side of the circuit board facing the bottom case;

[0016] A first air duct is provided in the first housing at a position opposite to the end of the first heat pipe. At least part of the first air duct is located between the bottom case and the first heat pipe;

[0017] The two fans share a first outlet, and the first air duct communicates the first outlet with the adjacent first air outlet.

[0018] Through the arrangement of the first air duct, the air flow flowing out of the first air outlets of the two fans can flow in their respective corresponding first air ducts and then flow out of the first housing through the same first outlet. While guiding the air flow flowing out of the first air outlets through the first air duct, the setting of the openings on the first housing can be reduced.

[0019] In some embodiments, the heat dissipation module further includes a first heat exchange member. The end of the first heat pipe is provided with a first heat exchange member on the side facing the bottom case;

[0020] The first heat exchange member includes a plurality of heat exchange parts connected to the end of the first heat pipe. The heat exchange parts are oppositely arranged with the first air outlet and are located in the first air duct.

[0021] In this way, the heat in the heating element group can be collected at the end of the first heat pipe and then transferred to the heat exchange parts. Through the arrangement of the plurality of heat exchange parts, the heat exchange area of the first heat exchange member in the first air duct can be increased. When the air flow flowing out of the first air outlet of the fan enters the first air duct, it will exchange heat with the plurality of heat exchange parts, dissipate heat from the heating elements and then be discharged out of the first housing through the first outlet, so that all the heating elements in the heating element group can exchange heat with the external air of the electronic device in a timely and effective manner.

[0022] Moreover, through the arrangement of the first heat exchange member, without affecting the overall air volume of the fan, the heat exchange parts can increase the impedance when the fan discharges air from the first air outlet, can avoid the excessive air volume at the first air outlet from affecting the air volume at the second air outlet of the fan, so as to ensure the heat dissipation efficiency of the air flow flowing out of the second air outlet for the processor, and at the same time ensure the heat dissipation efficiency of the air flow flowing out of the first air outlet for the heating elements in the heating element group.

[0023] In some embodiments, the first heat exchange member further includes a heat exchange main body. The heat exchange main body is connected to the side of the end of the first heat pipe facing the bottom case and is oppositely arranged with the first air outlet;

[0024] The heat exchange parts are located on the side of the heat exchange main body facing the bottom case, and there are gaps between adjacent heat exchange parts.

[0025] Through the setting of the heat exchange main body, the connection between the heat exchange part and the end of the first heat pipe can be realized, so that the heat collected at the end of the first heat pipe can be transferred to the heat exchange part through the heat exchange main body. Through the setting that there is a gap between adjacent heat exchange parts, the air flow in the first air duct can flow between adjacent heat exchange parts, so as to increase the heat exchange area between the heat exchange part and the air flow and improve the heat dissipation efficiency of the heating elements in the heating element group.

[0026] In some embodiments, along the thickness direction of the first housing, the gap between the heat exchange part and the bottom case is greater than 0.2 mm and less than 0.8 mm. In this way, while avoiding the heat exchange part affecting the temperature of the first housing on the bottom case and ensuring the installation of the heat dissipation module in the first housing, it can also enable the heat exchange part to have sufficient heat exchange area to ensure the heat dissipation efficiency of the heating elements in the heating element group.

[0027] In some embodiments, along the length direction of the first housing:

[0028] The fan is located on the side of the heating element group facing the outside of the first housing, and the distance between the first heat exchange part and the fan is less than 0.5 mm;

[0029] Along the width direction of the first housing:

[0030] The size of the first heat exchange part in the width direction of the first housing matches the first air outlet.

[0031] In this way, when the distance between the first heat exchange part and the fan can be less than or equal to 0.5 mm, a smaller distance can be achieved between the first heat exchange part and the fan, so as to ensure that more air flowing out of the first air outlet enters the first air duct to exchange heat with the first heat exchange part, improving the heat dissipation efficiency and heat dissipation effect of the heating elements in the heating element group.

[0032] In some embodiments, multiple heat exchange parts are arranged in an array on the heat exchange main body, so that the arrangement of the heat exchange parts on the heat exchange main body is more uniform. While enhancing the impedance of the heat exchange parts to the air flow from the first air outlet of the fan, it is convenient to distribute the air flow rates of the fan at the first air outlet and the second air outlet.

[0033] In some embodiments, a second air duct is provided at a position in the first housing opposite to the end of the first heat pipe, and the second air duct is located between the first heat pipe and the circuit board;

[0034] One end of the second air duct communicates with the adjacent first air outlet, and the other end of the second air duct communicates with the first outlet and the adjacent first air duct.

[0035] Through the setting of the second air duct, after the air flow flows in the second air duct and converges with the air flow in the first air duct for heat exchange, the temperature of the hot air in the first air duct can be reduced, thereby reducing the temperature of the housing main body or the bottom case of the first housing on the rotating shaft side.

[0036] In some embodiments, a third air duct is provided inside the first housing at a position opposite to the end of the first heat pipe. The third air duct is located between the circuit board and the housing body, and the third air duct communicates the first outlet with the two first air outlets.

[0037] Through the arrangement of the third air duct, the air flow flowing out of the first air outlets of the two fans can also flow along the corresponding third air ducts in the direction of the first outlet to the outside of the first housing, so as to reduce the temperature of the first housing on the keyboard surface of the housing body.

[0038] In some embodiments, the electronic device further includes a wind guiding assembly. The wind guiding assembly includes a first wind guiding member, a second wind guiding member, and a third wind guiding member. The first wind guiding member is disposed between the end of the first heat pipe and the bottom case, and encloses a first air duct with the bottom case;

[0039] The second wind guiding member is disposed between the end of the first heat pipe and the circuit board, and the second wind guiding member and the end of the first heat pipe and the circuit board enclose a second air duct;

[0040] The third wind guiding member is disposed between the circuit board and the housing body, and the third wind guiding member and the circuit board and the housing body enclose a third air duct.

[0041] In some embodiments, the first heat conducting plate is connected to the first heat exchanging member, so that the heat on the first heat conducting plate is also transferred to the first heat exchanging member, enabling the heat dissipation module to have better heat dissipation efficiency and heat dissipation effect on the heat generating elements in the heat generating element group.

[0042] In some embodiments, the air inlet area is located at a position of the bottom case opposite to the air inlet;

[0043] The first housing has a user side and a rotating shaft side in the width direction. The rotating shaft side is used to install the rotating shaft, and at least part of the first opening is located at a position of the first housing on the rotating shaft side opposite to the heat generating element group. In this way, the air flows in the two first air ducts flow in their respective air ducts and exchange heat with the first heat exchanging member, and then can flow out from the first opening, so that all the heat generating elements in the heat generating element group can timely and effectively exchange heat with the external air of the electronic device.

[0044] In some embodiments, the electronic device further includes a circuit board. The circuit board is disposed inside the first housing. The first housing has a bottom case and a housing body oppositely arranged in the thickness direction. The heat generating element group is disposed on one side of the circuit board facing the bottom case;

[0045] A first air duct is provided inside the first housing at a position opposite to the end of the first heat pipe. At least part of the first air duct is located between the bottom case and the first heat pipe;

[0046] The first opening is located at a position on the bottom case adjacent to the first air outlet, and the bottom case is provided with a first opening at the position corresponding to the first air outlets of the two fans. The first air duct connects the adjacent first outlet and the adjacent first air outlet.

[0047] With such a setting, the first opening can be adjusted from the side of the rotating shaft to the position on the bottom case adjacent to the first air outlet, and the two fans respectively discharge air through a corresponding first opening, shortening the path from the first air outlet to the first outlet, so that the air flow in the first air duct can directly flow out of the first opening to the outside of the first housing after dissipating heat from the heating elements in the heating element group, and can greatly reduce the surface temperature of the first housing at the position where the rotating shaft is located.

[0048] In some embodiments, the air inlet area is located at the edge area of the first housing in the length direction, so that the air inlet area is far away from the first outlet, to prevent the air flow flowing out of the first outlet from directly flowing back into the fan through the air inlet area without exchanging heat with the air outside the first housing, which affects the heat dissipation efficiency and heat dissipation effect of the fan on the heating elements in the heating element group.

[0049] In some embodiments, the heat dissipation module further includes a second heat exchange member, the second heat exchange member is disposed opposite to the first air outlet, and the second heat exchange member is connected to the side of the end of the first heat pipe facing the bottom case;

[0050] The second heat exchange member has a plurality of sub air ducts inside, and the sub air ducts connect the first air duct corresponding to the end of the first heat pipe where they are located and the first air outlet.

[0051] Through the setting of the second heat exchange member, after the heat in the heating element group is concentrated at the end of the first heat pipe, it can be transferred to the second heat exchange member. Through the setting of a plurality of sub air ducts in the second heat exchange member, the heat exchange area of the second heat exchange member can be increased, and the first air duct can be connected to the adjacent first air outlet through the sub air ducts. In this way, when the air flow flowing out of the first air outlet by the fan enters the sub air ducts, it will exchange heat with the plurality of second heat exchange members, dissipate heat from the heating elements and then be discharged out of the first housing through the first air duct and the first outlet.

[0052] In some embodiments, the second heat exchange member includes a heat exchange shell and a plurality of heat dissipation fins. The side of the heat exchange shell facing the first air outlet has an air inlet end;

[0053] A plurality of heat dissipation fins are arranged inside the heat exchange shell and divide the space inside the heat exchange shell into a plurality of sub air ducts. One end of the sub air ducts is connected to the first air outlet; there is a communication port on the side of the heat exchange shell facing the bottom case, and the communication port connects the other end of the sub air ducts and the first air duct.

[0054] Through the provision of heat dissipation fins and a heat exchange housing, while forming a second heat exchange member with multiple sub-air ducts, the second heat exchange member has a larger heat exchange area compared to the first heat exchange member, which can improve the heat dissipation efficiency of the heating elements in the heating element group. Moreover, through the provision of the communication ports, the communication between the sub-air ducts and the first air duct can be achieved, enabling the air flow in the sub-air ducts to enter the first air duct through the communication ports after heat exchange.

[0055] In some embodiments, the heat dissipation fins are inclined in the heat exchange housing so that the direction of the sub-air ducts matches the direction of the air flow flowing out of the first air outlet, which can reduce the air resistance of the air flow flowing out of the first air outlet in the sub-air ducts, enabling the air flow flowing out of the first air outlet to flow in a smoother manner in the sub-air ducts.

[0056] In some embodiments, the first housing has a third outlet, and two fans share one third outlet;

[0057] A second air duct is provided in the first housing at a position opposite to the end of the first heat pipe. The second air duct is located between the first heat pipe and the circuit board, and the second air duct communicates the third outlet with the adjacent first air outlet.

[0058] Through the provision of the second air duct, the air flow flowing out of the first air outlets of the two fans can also flow along the corresponding second air ducts in the direction of the third outlet to the outside of the first housing (i.e., the environment), so that the air flow (cold air) in the second air duct and the air flow (hot air) after heat exchange in the first air duct do not interfere with each other, so as to avoid affecting the heat dissipation efficiency of the heating elements in the heating element group.

[0059] In some embodiments, the first housing has a user side and a rotating shaft side in the width direction. The rotating shaft side is used to install the rotating shaft, and at least part of the third outlet is located at a position of the first housing on the rotating shaft side opposite to the heating elements. In this way, while reducing the temperature of the heating elements in the heating element group, the temperature of the housing body or the bottom shell of the first housing on the rotating shaft side can be reduced.

[0060] In some embodiments, a third air duct is provided in the first housing. The third air duct is located between the circuit board and the housing body, and the third air duct communicates the third outlet with the two first air outlets.

[0061] Through the provision of the third air duct, the air flow flowing out of the first air outlets of the two fans can also flow along the corresponding third air ducts in the direction of the third outlet to the outside of the first housing, so as to reduce the temperature of the first housing on the keyboard surface of the housing body. Moreover, the second active heat dissipation structure also enables the air flow flowing out of the first air outlets of the fans to flow along three different air ducts through the provision of the first air duct, the second air duct, and the third air duct, and the cold and hot air do not interfere with each other, so as to achieve different purposes.

[0062] In some embodiments, the electronic device further includes a wind guiding component, which includes a fourth wind guiding member, a fifth wind guiding member, a sixth wind guiding member, and a seventh wind guiding member;

[0063] Along the length direction of the first housing, the fourth wind guiding member and the fifth wind guiding member are spaced between the end of the first heat pipe and the bottom case, and the fourth wind guiding member and the fifth wind guiding member and the bottom case enclose a first air duct;

[0064] The sixth wind guiding member is disposed between the end of the first heat pipe and the circuit board, and the sixth wind guiding member and the first heat pipe and the circuit board enclose a second air duct;

[0065] The seventh wind guiding member is disposed between the circuit board and the housing body, and encloses a third air duct with the circuit board and the housing body.

[0066] In some embodiments, the first heat conducting plate includes a copper plate or an aluminum plate. When the first heat conducting plate is an aluminum plate, while meeting the heat dissipation requirements of the heating elements in the heating element group of the electronic device, it can reduce the weight of the heat dissipation module, which is helpful for the lightweight design of the electronic device.

[0067] In some embodiments, the heating elements include at least one of the power supply elements of the processor, the power supply elements of the video memory module, the video memory module, and the charging elements. The power supply elements of the processor and the video memory module both include a power supply inductor and a power supply field effect transistor; the charging elements include a charging inductor and a charging field effect transistor;

[0068] At least one of the power supply field effect transistor, the charging field effect transistor, and the video memory module is covered by the first heat pipe. Through the arrangement of the first heat pipe, at least one of the power supply field effect transistor, the charging field effect transistor, and the video memory module can be cooled.

[0069] At least one of the power supply inductor and the charging inductor is covered by the first heat conducting plate. Through the arrangement of the first heat conducting plate, at least one of the power supply inductor and the charging inductor can be cooled.

[0070] In some embodiments, the electronic device further includes a processor, which is disposed in the first housing and located between two fans;

[0071] The fan also has a second air outlet, and the housing is provided with a second outlet opposite to the second air outlet;

[0072] The heat dissipation module further includes a second heat conducting plate, a second heat pipe, and two heat dissipation components. A heat dissipation component is provided between the second air outlets of the two fans and the corresponding second outlets; the second heat conducting plate covers the processor, a part of the second heat pipe covers the second heat conducting plate, and the two ends of the second heat pipe respectively extend to the two second air outlets and are connected to the heat dissipation components disposed at the second air outlets;

[0073] At least one end of the first heat pipe is connected to the second heat pipe.

[0074] Through the settings of the first air outlet and the second air outlet, the air volume characteristics of the single fan can be improved, enabling the air volume characteristics of the single fan to increase by approximately 15% - 30%, thereby enhancing the fan performance. Moreover, through the settings of the first heat pipe and the second heat pipe, when the heating elements in the heating element group dissipate heat, they will not be limited by the heat transfer capacity of the second heat pipe, and the heat dissipation effect on the heating elements in the heating element group can be improved to avoid excessive temperature on the surface of the electronic device, especially the surface temperature of the second housing.

[0075] Since the first air outlet is provided on the side of the fan facing the heating element and towards the inside of the first housing, the first air outlet can be referred to as the inner air outlet of the fan. By setting the first air outlet as the inner air outlet of the fan, it will not affect the thickness of the first housing at the edge.

[0076] The connection of at least one end of the first heat pipe to the second heat pipe also enables the heat on the first heat pipe and the second heat pipe to be conducted to each other to improve the temperature uniformity of the heat dissipation module, so that the temperature on the surface of the second housing will also be more uniform. Description of the Drawings

[0077] Figure 1 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application in a first perspective when in an open state;

[0078] Figure 2 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application in a second perspective when in an open state;

[0079] Figure 3 It is a schematic diagram of an active heat dissipation structure in an electronic device provided in the related art;

[0080] Figure 4 It is a schematic structural diagram of a part of the first housing of an electronic device provided by an embodiment of the present application;

[0081] Figure 5a It is an exploded view of a part of the first housing of an electronic device provided by an embodiment of the present application;

[0082] Figure 5b It is a partial exploded view of a part of the first housing of an electronic device provided by an embodiment of the present application;

[0083] Figure 6 It is a schematic structural diagram of the inside of the first housing of an electronic device provided by an embodiment of the present application Figure 1 ;

[0084] Figure 7Schematic diagram of the structure of an electronic device provided by an embodiment of the present application within a first housing Figure 2 ;

[0085] Figure 8 is Figure 4 a cross-sectional view in the A-A direction;

[0086] Figure 9 Schematic diagram of the structure of an electronic device provided by an embodiment of the present application within a first housing Figure 2 ;

[0087] Figure 10 Schematic diagram of the structure of another electronic device provided by an embodiment of the present application in the part where the first housing is located;

[0088] Figure 11 is Figure 10 an exploded view of the electronic device in the part where the first housing is located in ;

[0089] Figure 12 is Figure 10 a schematic diagram of the structure of the electronic device in the first housing in ;

[0090] Figure 13 is Figure 10 a schematic diagram of the structure of the heating element and the second active heat dissipation structure in ;

[0091] Figure 14 is Figure 10 a cross-sectional view of the electronic device in the B-B direction in ;

[0092] Figure 15 is Figure 12 an enlarged view at C.

[0093] Reference numerals:

[0094] 10 - Electronic device;

[0095] 20 - First housing; 2a - Bottom case; 2b - Housing main body; 2c - User side; 2d - Rotating shaft side; 21 - Air inlet area; 22 - First outlet; 23 - Second outlet; 24 - Third outlet; 25 - First air duct; 26 - Second air duct; 27 - Third air duct;

[0096] 30 - Circuit board assembly; 31 - Circuit board; 32 - Processor; 33 - Heating element group; 331 - Power supply inductor; 332 - Power supply field effect transistor;

[0097] 40 - Second housing;

[0098] 50 - Display screen; 51 - Display surface;

[0099] 60 - Substrate;

[0100] 70 - Fan; 7a - First fan; 7b - Second fan; 71 - Air inlet; 72 - First air outlet; 73 - Second air outlet;

[0101] 80 - Heat exchange fins;

[0102] 90 - Heat pipe; 91 - First heat pipe; 911 - Connection part; 912 - First end; 913 - Second end; 92 - Second heat pipe;

[0103] 100 - First heat conducting plate;

[0104] 200 - Second heat conducting plate;

[0105] 300 - Heat dissipation component;

[0106] 400 - First heat exchange component; 410 - Heat exchange part; 420 - Heat exchange main body;

[0107] 500 - Second heat exchange component; 510 - Heat exchange shell; 511 - Open end; 520 - Heat dissipation fins; 530 - Sub - air duct;

[0108] 600 - Air guiding assembly; 610 - First air guiding part; 620 - Second air guiding part; 630 - Third air guiding part; 640 - Fourth air guiding part; 650 - Fifth air guiding part; 651 - Inclined surface; 660 - Sixth air guiding part; 670 - Seventh air guiding part;

[0109] 700 - Wind blocking part. Detailed implementation manners

[0110] The terms used in the implementation manners part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application.

[0111] The embodiments of this application provide an electronic device. Among them, the electronic device provided by the embodiments of this application can be a portable electronic device. The portable electronic device can include, but is not limited to, electronic devices such as laptop computers, tablet computers (i.e., pads), etc. that are actively cooled by fans inside and are convenient for users to carry.

[0112] Figure 1 and Figure 2 Shows a schematic structural diagram of an electronic device 10 in an open state from different perspectives. Figure 1 and Figure 2 The illustrated electronic device 10 is a laptop computer. The following takes the laptop computer as an example and further elaborates on the structure of the electronic device 10 in combination with Figure 1 and Figure 2 to further elaborate on the structure of the electronic device 10.

[0113] See Figure 1 and Figure 2, the electronic device 10 includes a first housing 20 and a circuit board assembly 30, and the circuit board assembly 30 is disposed within the first housing 20. The circuit board assembly 30 is one of the core components of the electronic device 10 and can implement functions such as data processing and operation, image processing, power management, and storage of the electronic device 10.

[0114] The circuit board assembly 30 includes a circuit board 31 and a plurality of electronic components. The electronic components are disposed on the circuit board 31. Among the plurality of electronic components, there are some heating components and non-heating components. For example, the heating components may include a processor 32, a video RAM (VRAM) module, capacitors, charging components, power supply components for the processor 32, and power supply components for the video RAM module, etc. For example, the non-heating components may include capacitors.

[0115] The processor 32 includes a central processing unit (CPU) and a graphics processing unit 32 (GPU). The central processing unit, as the operation core and control core of the electronic device 10, is mainly used for data processing and operation in the electronic device 10. The graphics processing unit 32, as the core of image processing of the electronic device 10, is mainly used for data processing, etc. in the electronic device 10. Some graphics processing units 32 are configured with a video RAM module to store graphic data, etc.

[0116] The power supply components for the processor 32 include a power supply inductor 331 and a power supply field-effect transistor 332. The power supply field-effect transistor 332 for the processor 32 refers to a metal-oxide-semiconductor field-effect transistor (abbreviated as power supply MOS) for power supply to the processor 32. For example, the power supply inductor 331 includes a power supply inductor 331 for the central processing unit and a power supply inductor 331 for the graphics processing unit 32, etc. For example, the power supply field-effect transistor 332 includes a power supply field-effect transistor 332 for the central processing unit and a power supply field-effect transistor 332 for the graphics processing unit 32, etc.

[0117] The power supply components for the video RAM module also include a power supply inductor 331 and a power supply field-effect transistor 332.

[0118] The charging components are mainly used in the battery charging circuit of the electronic device 10 and are part of the power management system of the electronic device 10. For example, the charging components include a charging inductor, a metal-oxide-semiconductor field-effect transistor for charging (abbreviated as charging MOS), etc.

[0119] See Figure 1, the first housing 20 has a bottom case 2a and a housing main body 2b that are oppositely arranged in the thickness direction. The electronic device 10 may further include a keyboard and a touchpad. The keyboard and the touchpad, as two different input modules in the electronic device 10 such as a laptop, can both be embedded in the housing main body 2b of the first housing 20 and electrically connected to the circuit board 31. When the user operates the keyboard and the touchpad, commands or data can be sent to the electronic device 10 through the keyboard and the touchpad.

[0120] See Figure 1 and Figure 2 , the first housing 20 has a user side 2c and a rotation axis side 2d in the width direction. The electronic device 10 further includes a rotation axis, which is installed on the rotation axis side 2d of the first housing 20 and connected to the screen member, so that the screen member is rotatably connected to the first housing 20. When the screen member rotates relative to the first housing 20 around the rotation axis, the configuration of the electronic device 10 can be changed. For example, when the screen member rotates relative to the first housing 20 around the rotation axis to a certain angle, the electronic device 10 can be in an open state (as Figure 1 and Figure 2 shown). Or, when the screen member rotates relative to the first housing 20 around the rotation axis and is stacked on the first housing 20, the electronic device 10 can be in a closed state.

[0121] See Figure 1 , the screen member includes a second housing 40 and a display screen 50. The display screen 50 includes a display surface 51 and a non-display surface 51 that are oppositely arranged. The display screen 50 is installed in the second housing 40, and the display surface 51 is exposed on the side of the second housing 40 facing the first housing 20.

[0122] It should be noted that when the electronic device 10 is a tablet computer, the electronic device 10 does not include the second housing 40, the keyboard, the touchpad, and the rotation axis, and the display screen 50 replaces the keyboard and the touchpad and is installed on the housing main body 2b of the first housing 20. At this time, the display screen 50 can be a touch display screen 50, so that when the user operates on the display screen 50, commands or data can be sent to the electronic device 10 through the touch display screen 50.

[0123] Continuing with the laptop as an example below, the structure of the electronic device 10 will be further elaborated.

[0124] See Figure 1 and Figure 2 , the side of the screen member facing away from the display screen 50 forms the A surface of the electronic device 10. The side of the screen member provided with the display screen 50 forms the B surface of the electronic device 10. Among them, the side of the housing main body 2b provided with the keyboard and the touchpad constitutes the C surface of the electronic device 10, and the side of the bottom case 2a facing away from the housing main body 2b constitutes the D surface of the electronic device 10.

[0125] The processor 32, the power supply component of the processor 32, and the video memory module are the main heat sources in the circuit board assembly 30. When these heat-generating components generate heat, a large amount of heat will be dissipated. If the heat is not dissipated in time, the surface of the first housing 20 will have a relatively high temperature, affecting the normal use of the electronic device 10.

[0126] Therefore, some existing electronic devices 10 are provided with an active heat dissipation structure, and the heat-generating components in the first housing 20 can be dissipated by the active heat dissipation structure.

[0127] Figure 3 The schematic diagram of an active heat dissipation structure in an electronic device 10 provided in the prior art is shown.

[0128] See Figure 3 , the active heat dissipation structure mainly includes a substrate 60, a heat pipe 90, a fan 70, and a heat exchange fin 80. The fan 70 is a centrifugal fan. The substrate 60 covers the heat-generating components, the heat pipe 90 is in contact with the position of the substrate 60 corresponding to the processor 32, the fan 70 and the heat exchange fin 80 are arranged at the end of the heat pipe 90, and the heat exchange fin 80 is connected to the end of the heat pipe 90. The heat generated by the heat-generating components can be transferred to the substrate 60 and then to the heat pipe 90 through the substrate 60. After the heat of the heat-generating components is transferred to the heat pipe 90, it will be sequentially transferred to the end of the heat pipe 90 and the heat exchange fin 80 along the extension direction of the heat pipe 90. The airflow generated by the fan 70 can take away the heat on the heat exchange fin 80, and after the airflow flows to the outside of the first housing 20, it dissipates heat from the heat-generating components and reduces the temperature of the surface of the electronic device 10.

[0129] It should be noted that the unit composed of the heat-generating components on the circuit board 31 except the processor 32 is called the heat-generating component group 33, that is, the heat-generating component group 33 does not include the processor 32. For example, the heat-generating components in the heat-generating component group 33 can include the power supply component of the processor 32, the power supply component of the video memory module, the video memory module, and the charging component, etc.

[0130] Figure 3The heat dissipation efficiency of the active heat dissipation structure shown in the figure for the heat-generating components on the circuit board 31 other than the processor 32 is relatively low, which still causes the temperature on the surface of the laptop computer to be too high. The reason is that the active heat dissipation structure is affected by multiple factors such as contact thermal resistance, heat pipe 90 thermal resistance, fin heat dissipation area, and fan 70 performance. The heat-generating components in the heat-generating component group 33 have a relatively long thermal resistance in the heat dissipation path, including from the heat-generating component to the substrate 60, from the substrate 60 to the heat pipe 90, and from the heat pipe 90 to the heat exchange fin 80. This will not only generate more contact thermal resistance but also generate heat pipe 90 thermal resistance, etc. Moreover, during the process from the heat-generating component to the heat pipe 90, the heat of the heat-generating component needs to be first conducted along the thickness direction of the first housing 20 to the substrate 60, and then transferred along the surface of the substrate 60 to the heat pipe 90. This will result in a relatively large thermal resistance for the heat-generating components in the heat-generating component group 33 to transfer to the heat pipe 90. And, limited by the heat conduction ability of the heat pipe 90, etc., the heat pipe 90 will preferentially conduct the heat of the processor 32, that is, preferentially dissipate heat from the processor 32, making the heat of the heat-generating components in the heat-generating component group 33 unable to be effectively exchanged with the external air of the electronic device 10 in a timely manner, causing the temperature on the surface of the electronic device 10 to be too high, especially the temperature on the surface of the second housing 40 to be too high.

[0131] Therefore, in the related art, Figure 3 On the basis of the active heat dissipation structure, the fan 70 is changed to a fan 70 with a double air outlet. The double air outlets of the fan 70 include a second air outlet 73 and a first air outlet 72. The second air outlet 73 faces the rotating shaft side 2d, and the first air outlet 72 faces the inside of the first housing 20 and is disposed opposite to the heat-generating component group 33, that is, the inner air outlet.

[0132] Compared with the original active heat dissipation structure in the related art ( Figure 3 in), through the setting of the first air outlet 72, the air flow flowing out from the first air outlet 72 directly passes through the heat-generating components in the heat-generating component group 33. In this way, the thermal resistance of the heat-generating components in the heat-generating component group 33 in the heat dissipation path can be greatly reduced, and the heat dissipation efficiency of the heat-generating components can be improved. Although the thermal resistance of the heat dissipation path is the smallest, however, due to the very small gap between the heat-generating components in the heat-generating component group 33, the air resistance will be relatively large, making the air flow flowing out from the first air outlet 72 only able to pass through the heat-generating components in the edge area of the heat-generating component group 33, and it is difficult to take into account the heat-generating components in the middle area of the heat-generating component group 33, which still causes the temperature on the surface of the electronic device 10 to be too high, especially the temperature on the surface of the second housing 40 to be too high.

[0133] In view of this, in the embodiment of the present application, another new active heat dissipation structure is provided inside the electronic device 10. This new active heat dissipation structure includes a heat dissipation module and two fans. The two fans are arranged on both sides of the heat generating element group, and the first air outlets of the fans all face the heat generating element group. The first air outlets of the fans can be regarded as the inner air outlets. The heat dissipation module includes a first heat pipe and a first heat conducting plate. At least some of the heat generating elements in the heat generating element group can be covered by the first heat pipe and the first heat conducting plate. The heat of the heat generating elements covered by the first heat pipe and the heat generating elements covered by the first heat conducting plate will be concentrated at the two ends of the first heat pipe along different directions. Moreover, the first air outlets of the two fans can respectively correspond to the two ends of the first heat pipe, so that the air flow flowing out from the first air outlets of the fans can take away the heat concentrated at the corresponding ends of the first heat pipe. In this way, while dissipating heat from all the heat generating elements in the heat generating element group, it is also possible to reduce the thermal resistance of the heat generating elements in the heat generating element group on the heat dissipation path, improve the heat dissipation effect of the heat generating elements in the heat generating element group, and further effectively reduce the temperature of the first housing and the surface of the electronic device, and improve the service life and user experience of the electronic device.

[0134] The following further elaborates on a new active heat dissipation structure provided by the embodiment of the present application with reference to the accompanying drawings and embodiments.

[0135] Figure 4 FIG. shows a partial structural schematic diagram of an electronic device 10. Figure 5a FIG. shows an exploded view of a part of the first housing 20 in the electronic device 10.

[0136] See Figure 4 and Figure 5a In FIGS. and, the electronic device 10 includes a first housing 20. The first housing 20 has an air inlet area 21 and a first outlet 22. The air inlet area 21 has a ventilation opening for air intake. For example, the air inlet area 21 may have at least one ventilation opening. The ventilation opening can be a rectangular opening, a circular opening, etc. The first outlet 22 is for air outlet.

[0137] Figure 5b FIG. shows a partial exploded view of a part of the first housing 20 in the electronic device 10.

[0138] See Figure 5a and Figure 5a In FIGS. and, the electronic device 10 further includes a heat generating element group 33, and the heat generating element group 33 is arranged inside the first housing 20. The heat generating element group 33 includes a plurality of heat generating elements, and the plurality of heat generating elements do not include the processor 32.

[0139] See Figure 5a and Figure 5a, the electronic device 10 further includes a fan 70. Along the length direction of the first housing 20, a fan 70 is respectively provided on both sides of the heating element group 33 inside the first housing 20. The length direction of the first housing 20 can refer to the X direction. The fan 70 is a centrifugal fan, and the fan 70 has an air inlet 71 and a first air outlet 72. The first housing 20 is respectively provided with an air inlet area 21 at positions corresponding to the two air inlets 71. The air inlet 71 is communicated with the ventilation openings in the corresponding air inlet area 21, so that the air flow outside the electronic device 10 enters the corresponding fan 70 through the ventilation openings and the air inlets 71, and flows out from the first air outlet 72. The first air outlet 72 faces the heating element group 33 and is communicated with the first outlet 22, so that the air flow flowing out from the first air outlet 72 can blow towards the heating element group 33 and flow out of the first housing 20 from the first outlet 22 to dissipate heat from the heating elements in the heating element group 33.

[0140] The electronic device 10 further includes a heat dissipation module, and the heat dissipation module is provided inside the first housing 20. The heat dissipation module includes a first heat pipe 91 and a first heat conduction plate 100. Among them, the first heat pipe 91 and the first heat conduction plate 100 at least cover the heating elements in the middle area of the heating element group 33. That is to say, the heating elements covering at least the middle area of the heating element group 33 are covered by the first heat pipe 91 and the first heat conduction plate 100. For example, the first heat pipe 91 can cover at least a part of the heating elements in the middle area of the heating element group 33, and the first heat conduction plate 100 can cover at least another part of the heating elements in the middle area of the heating element group 33. The middle area refers to the area located at the center of the heating element group 33 and having a distance from the edge of the heating element group 33 when all the heating elements other than the processor 32 form a unit.

[0141] The two end parts of the first heat pipe 91 are respectively arranged corresponding to the first air outlets 72 of the two fans 70. And, the first heat conduction plate 100 is connected to the first heat pipe 91.

[0142] Through the coverage of the heating elements in at least the middle area of the heating element group 33 by the first heat pipe 91 and the first heat conduction plate 100, the heat of the heating elements covered by the first heat pipe 91 will be transferred to the first heat pipe 91 and transferred along the extension direction of the first heat pipe 91 to the two end parts of the first heat pipe 91, and the heat of the heating elements covered by the first heat conduction plate 100 will be transferred to the first heat conduction plate 100. And, since the first heat conduction plate 100 is connected to the first heat pipe 91, the heat of the heating elements covered by the first heat conduction plate 100 can be transferred to the first heat pipe 91 through the first heat conduction plate 100 and then also transferred to the two end parts of the first heat pipe 91 along the extension direction of the first heat pipe 91, so that the heat of the heating elements in at least the middle area of the heating element group 33 is concentrated at the two end parts of the first heat pipe 91.

[0143] On this basis, the two end portions of the first heat pipe 91 are respectively arranged corresponding to the first air outlets 72 of the two fans 70, so that the air flows out from the first air outlets 72 of the two fans 70 can respectively take away the heat concentrated at the two end portions of the first heat pipe 91, and can dissipate the heat of the heating elements in the heating element group 33 at least in the middle region, so that the heating elements in the heating element group 33 at least in the middle region can timely and effectively exchange heat with the external air of the electronic device 10, avoiding the temperature on the surface of the electronic device 10 being too high, especially the temperature on the surface of the second housing 40 being too high, and can avoid excessive wind resistance.

[0144] Compared with the active heat dissipation structure of the prior art mentioned above ( Figure 3 as shown), in the embodiment of the present application, the heat of the heating elements covered by the first heat pipe 91 in the heating element group 33 can be transferred to the first heat pipe 91 along the thickness direction of the first housing 20, which can reduce the thermal conduction resistance of the heating elements covered by the first heat pipe 91 in the length direction and width direction of the first housing 20, so as to reduce the thermal resistance of the heating elements covered by the first heat pipe 91 in the heat dissipation path. Moreover, the heat transferred to the first heat pipe 91 can be concentrated at the two end portions of the first heat pipe 91 along the extension direction of the first heat pipe 91, and dissipated through the first air outlets 72 of the two fans 70, which can improve the heat dissipation effect of the heating elements in the heating element group 33 and further reduce the temperature on the surface of the first housing 20 and the electronic device 10.

[0145] In some embodiments, the first heat pipe 91 can cover some of the heating elements in the heating element group 33. At this time, some of the heating elements in the heating element group 33 can be arranged along the extension direction of the first heat pipe 91 so as to be covered by the first heat pipe 91.

[0146] The first heat conducting plate 100 can cover the remaining heating elements in the heating element group 33. At this time, the remaining heating elements in the heating element group 33 can be arranged within the projection area of the first heat conducting plate 100 so as to be covered by the first heat conducting plate 100.

[0147] In this way, through the arrangement of the first heat pipe 91 and the first heat conducting plate 100, all the heating elements in the heating element group 33 can be covered, taking into account all the heating elements in the heating element group 33, dissipating the heat of all the heating elements in the heating element group 33, further improving the heat dissipation effect of the heating elements in the heating element group 33, and further reducing the temperature on the surface of the first housing 20 and the electronic device 10.

[0148] Taking the first heat pipe 91 and the first heat conducting plate 100 covering all the heating elements in the heating element group 33 as an example, the structure of the electronic device will be further described below.

[0149] Figure 6The structural schematic of an electronic device 10 within a first housing 20 is shown Figure 1 , Figure 7 The structural schematic of an electronic device 10 within a first housing 20 is shown Figure 2 .

[0150] Refer to Figure 6 and Figure 7 , in some embodiments, the first heat pipe 91 has a connecting portion 911, the connecting portion 911 covers some of the heat generating elements in the heat generating element group 33, and the first heat conducting plate 100 is connected to the connecting portion 911. Along the width direction of the first housing 20, the first air outlets 72 of the two fans 70 are both located on one side of the connecting portion 911. Moreover, both ends of the first heat pipe 91 are located on the side of the connecting portion 911 facing the two first air outlets 72, so that while the first heat pipe 91 covers the connecting portion 911, both ends of the first heat pipe 91 can be respectively disposed at the corresponding first air outlets 72. At this time, the first heat pipe 91 can be in a "U" shape. The width direction of the first housing 20 refers to the Y direction

[0151] In some embodiments, the height of the heat generating elements covered by the first heat pipe 91 is less than the height of the heat generating elements covered by the first heat conducting plate 100. Thus, through the arrangement of the first heat pipe 91 and the first heat conducting plate 100, the heat generating elements in the heat generating element group 33 can be better covered, so as to dissipate heat from all the heat generating elements in the heat generating element group 33

[0152] In some embodiments, the heat generating elements in the heat generating element group 33 may include at least one of the power supply elements of the processor 32, the power supply elements of the video memory module, the video memory module, and the charging elements. The power supply elements of the processor 32 and the power supply elements of the video memory module both include a power supply inductor 331 and a power supply field effect transistor 332. The charging elements are as described above, including a charging inductor and a charging field effect transistor

[0153] At least one of the power supply field effect transistor 332, the charging field effect transistor, and the video memory module is covered by the first heat pipe 91. For example, the power supply field effect transistor 332 and the charging field effect transistor can be covered by the first heat pipe 91. When the heat generating elements in the heat generating element group 33 include a video memory module, the power supply field effect transistor 332, the charging field effect transistor, and the video memory module can all be covered by the first heat pipe 91

[0154] Through the arrangement of the first heat pipe 91, heat dissipation can be performed on at least one of the power supply field effect transistor 332, the charging field effect transistor, and the video memory module

[0155] At least one of the power supply inductor 331 and the charging inductor is covered by the first heat conducting plate 100. For example, both the power supply inductor 331 and the charging inductor can be covered by the first heat conducting plate 100

[0156] Through the provision of the first heat conducting plate 100, heat dissipation can be achieved for at least one of the power supply inductor 331 and the charging inductor.

[0157] It should be noted that in some embodiments, in addition to the power supply inductor 331 and the power supply field effect transistor 332 of the processor 32, the heating elements in the heating element group 33 may further include a video memory module, a charging inductor, etc. For example, the heating elements covered by the first heat pipe 91 may further include a charging inductor.

[0158] A heat conducting member is further interposed between the first heat pipe 91 and the heating element, and the heat conducting member includes a heat conducting pad or a heat conducting gel, etc. Compared with when the first heat pipe 91 contacts the heating element through the substrate 60, a heat conducting member will still be provided between two adjacent structural members (between the substrate 60 and the heating element). Therefore, in the embodiment of the present application, through the provision of the heat conducting member between the first heat pipe 91 and the heating element, while enabling the heat conducting member to transfer the heat of the heating element to the first heat pipe 91 faster, and compared with the way that the first heat pipe 91 contacts the heating element through the substrate 60, the thermal resistance of the heating elements in the heating element group 33 on the heat dissipation path can still be reduced.

[0159] In some embodiments, the first heat conducting plate 100 has a bent portion, and the bent portion is interposed between the first heat pipe 91 and the heating element covered by the first heat pipe 91 to achieve the connection between the first heat conducting plate 100 and the first heat pipe 91. For example, the bent portion can be interposed between the connecting portion 911 and the heat conducting member and connected to the connecting portion 911.

[0160] There are also some capacitors on the circuit board 31, and there is an overlapping area between the capacitors and the first heat pipe 91 in the thickness direction of the first housing 20. Since when designing the electronic device 10, a safety gap needs to be reserved between the capacitors and the first heat pipe 91 in the thickness direction of the first housing 20 to prevent the capacitors from hitting the first heat pipe 91. And the flatness of the surface of the first heat pipe 91 is relatively poor compared with the first heat conducting plate 100. Therefore, compared with the first heat conducting plate 100, a larger safety gap needs to be reserved between the first heat pipe 91 and the capacitors in the thickness direction of the first housing 20. If the first heat conducting plate 100 can also be located on the side of the connecting portion 911 away from the heat conducting member and connected to the connecting portion 911, the thickness of the electronic device 10 in the part of the first housing 20 will be increased.

[0161] Therefore, the present application, through the setting of the above-mentioned bending portion, can utilize the safety gap reserved between the capacitor and the first heat pipe 91 to realize the connection between the first heat conductive plate 100 and the connecting portion 911 while ensuring that the safety gap reserved between the capacitor and the first heat pipe 91 remains unchanged. At the same time, the gap between the capacitor and the bending portion in the thickness direction of the first shell 20 can also meet the safety gap requirements of the two, and will not affect the thickness of the electronic device in the first shell 20 part.

[0162] Compared with the above-mentioned prior art ( Figure 3 In the active heat dissipation structure shown in the figure, when the bending portion is sandwiched between the first heat pipe 91 and the heating element covered by the first heat pipe 91, most of the heat of the heating element covered by the first heat pipe 91 can be transferred to the first heat pipe 91 along the thickness direction of the first shell 20. Although the heating element covered by the first heat pipe 91 still has a small amount of heat conducted along the plane where the bending portion is located, the thermal resistance of the heating element covered by the first heat pipe 91 on the heat dissipation path can still be reduced, the heat dissipation effect of the heating element in the heating element group 33 can be improved, and the temperature of the surface of the first shell 20 and the electronic device 10 can be reduced.

[0163] It should be noted that, in some embodiments, when there is no overlapping area between the capacitor and the first heat pipe 91 in the thickness direction of the first housing 20, the first heat conducting plate 100 may also be located on the side of the connecting portion 911 away from the heat conducting member, and connected to the connecting portion 911. In this case, the first heat pipe 91 may directly contact the heating element through the heat conducting member, without contacting the heating element through the first heat conducting plate 100, so that the thermal resistance of the heating element covered by the first heat pipe 91 on the heat dissipation path can be reduced as much as possible.

[0164] See also Figure 6 and Figure 7, in some embodiments, the electronic device 10 further includes a processor 32 disposed within the first housing 20 and located between two fans 70. The fan 70 further has a second air outlet 73, and the first housing 20 is provided with a second outlet 23 opposite to the second air outlet 73. The heat dissipation module further includes a second heat conducting plate 200, a second heat pipe 92, and two heat dissipating components 300. For example, the heat dissipating component 300 can be a radiator including heat dissipating fins, etc. A heat dissipating component 300 is provided between the second air outlets 73 of the two fans 70 and the corresponding second outlets 23. The second heat conducting plate 200 covers the processor 32, a part of the second heat pipe 92 covers the second heat conducting plate 200, and two end portions of the second heat pipe 92 respectively extend to the second air outlets 73 of the two fans 70 and are connected to the heat dissipating components 300 provided at the second air outlets 73. That is to say, one end portion of the second heat pipe 92 extends to the second air outlet 73 of one fan 70 and is connected to the heat dissipating component 300 provided at this fan 70, while the other end portion of the second heat pipe 92 extends to the second air outlet 73 of the other fan 70 and is also connected to the heat dissipating component 300 provided at this fan 70. In this way, the heat generated by the processor 32 will be transferred to the second heat pipe 92 through the second heat conducting plate 200, and transferred along the extending direction of the second heat pipe 92 to the two end portions of the second heat pipe 92, and finally transferred to the two heat dissipating components 300 through the two end portions of the second heat pipe 92.

[0165] Compared with the prior art (as Figure 3 shown), through the settings of the first air outlet 72 and the second air outlet 73, the air volume characteristics of a single fan 70 can be improved, and the air volume characteristics of a single fan 70 can be increased by about 15% - 30%, thereby improving the performance of the fan 70. When the air flows out from the second air outlets 73 of the two fans 70 and blows towards their respective corresponding heat dissipating components 300, it can drive the heat transferred to the heat dissipating components 300 and be discharged to the outside of the first housing 20 through the second outlet 23, so that the processor 32 can timely and effectively exchange heat with the outside air of the electronic device 10.

[0166] Therefore, through the settings of the first heat pipe 91 and the second heat pipe 92, the second heat pipe 92 can be used for dissipating heat of the processor 32, and the first heat pipe 91 can be used for dissipating heat of the heating elements in the heating element group 33. In this way, when the heating elements in the heating element group 33 dissipate heat, they will not be limited by the heat transfer capacity of the second heat pipe 92, and the heat dissipation effect of the heating elements in the heating element group 33 can be improved to avoid the surface temperature of the electronic device 10, especially the surface temperature of the second housing 40, from being too high.

[0167] It should be noted that when the end portion of the second heat pipe 92 is connected to the heat dissipating component 300, the second heat pipe 92 can be located on the side of the heat dissipating component 300 away from the keyboard (as Figure 6As shown, or the second heat pipe 92 may also be located on the side of the heat dissipation member 300 facing the keyboard.

[0168] Relative to the second air outlet 73, the first air outlet 72 is provided on the side of the fan 70 facing the heat generating element and faces the inside of the first housing 20. Therefore, the first air outlet 72 can be referred to as the inner air outlet of the fan 70.

[0169] Since the two fans 70 are arranged close to the edge of the first housing 20 in the length direction of the first housing 20, if the first air outlet 72 is provided on the side of the fan 70 facing away from the heat generating element and faces the outside of the first housing 20, that is, the first air outlet 72 is the outer air outlet of the fan 70, then the first air outlet 72 is close to the edge of the first housing 20. Due to the existence of the arc chamfer at the edge of the first housing 20, the first housing 20 will thicken at the edge.

[0170] On the contrary, in the embodiment of the present application, by setting the first air outlet 72 as the inner air outlet of the fan 70, it will not affect the thickness of the first housing 20 at the edge.

[0171] See Figure 6 , in some embodiments, at least one end of the first heat pipe 91 is connected to the second heat pipe 92, and it also enables the heat on the first heat pipe 91 and the second heat pipe 92 to be conducted to each other to improve the temperature uniformity of the heat dissipation module, so that the temperature on the surface of the second housing 40 will also be more uniform. For example, when the end of the first heat pipe 91 can be connected to the second heat pipe 92 by a heat-conducting method such as welding.

[0172] The following mainly further elaborates on the heat dissipation of the heat generating elements in the heat generating element group 33 by the fan 70 and the heat dissipation module.

[0173] Figure 8 For Figure 4 the cross-sectional view in the A-A direction.

[0174] See Figure 7 and Figure 8 , in some embodiments, the electronic device 10 may further include a circuit board 31, and the circuit board 31 is arranged in the first housing 20. The first housing 20 has a bottom case 2a and a housing main body 2b arranged oppositely in the thickness direction. The heat generating element group 33 is arranged on the side of the circuit board 31 facing the bottom case 2a. In addition, the processor 32 is also arranged on the side of the circuit board 31 facing the bottom case 2a. At this time, since a fan 70 is provided on each side of the heat generating element group 33, and the heat generating element group 33 is arranged on the side of the circuit board 31 facing the bottom case 2a, therefore, the circuit board 31 is arranged between the two fans 70.

[0175] A first air duct 25 is provided inside the first housing 20 at a position opposite to the end of the first heat pipe 91. At least part of the first air duct 25 is located between the bottom case 2a and the first heat pipe 91.

[0176] See Figure 7 , in some embodiments, two fans 70 share a first outlet 22, and the first air duct 25 communicates the first outlet 22 with an adjacent first air outlet 72. For example, for ease of description, the two ends of the first heat pipe 91 are referred to as a first end 912 and a second end 913, the fan 70 opposite to the first end 912 is referred to as a first fan 7a, and the fan 70 opposite to the second end 913 is referred to as a first fan 7a. Since the first heat pipe 91 has two ends, a first air duct 25 is respectively provided inside the first housing 20 at positions opposite to the first end 912 and the second end 913 of the first heat pipe 91. Among them, the first air duct 25 at the first end 912 can communicate the first outlet 22 with the first air outlet 72 of the first fan 7a, and the first air duct 25 at the second end 913 can communicate the first outlet 22 with the first air outlet 72 of the second fan 7b.

[0177] Through the arrangement of the first air duct 25, the air flowing out from the first air outlets 72 of the two fans 70 can flow in their respective corresponding first air ducts 25 and then flow out of the first housing 20 through the same first outlet 22. While guiding the air flowing out from the first air outlets 72 through the first air duct 25, the setting of openings on the first housing 20 can be reduced.

[0178] See Figure 7 and Figure 8 , in some embodiments, the heat dissipation module may further include a first heat exchange member 400, and a first heat exchange member 400 is provided on the side of the end of the first heat pipe 91 facing the bottom case 2a. That is to say, the heat dissipation module includes two first heat exchange members 400, one first heat exchange member 400 is provided on the side of the first end 912 of the first heat pipe 91 facing the bottom case 2a, and another first heat exchange member 400 is provided on the side of the second end 913 of the first heat pipe 91 facing the bottom case 2a.

[0179] The first heat exchange member 400 includes a plurality of heat exchange parts 410 connected to the end of the first heat pipe 91. The heat exchange parts 410 are disposed opposite to the first air outlets 72 and are located inside the first air duct 25.

[0180] Since the heat exchange part 410 is connected to the end of the first heat pipe 91, the heat in the heating element group 33 can be transferred to the heat exchange part 410 after converging at the end of the first heat pipe 91. By arranging a plurality of heat exchange parts 410, the heat exchange area of the first heat exchange member 400 in the first air duct 25 can be increased. In this way, when the air flow flowing out of the first air outlet 72 by the fan 70 enters the first air duct 25, it will exchange heat with a plurality of heat exchange parts 410, dissipate heat from the heating elements, and then be discharged out of the first housing 20 through the first outlet 22, so that all the heating elements in the heating element group 33 can exchange heat with the external air of the electronic device 10 in a timely and effective manner.

[0181] Since the processor 32 generates a large amount of heat, it is necessary that the air volume of the air flow out of the second air outlet 73 by the fan 70 is greater than the air volume of the air flow out of the first air outlet 72.

[0182] If there is no first heat exchange member 400 in the first air duct 25, assuming that it is necessary to distribute the air volumes of the air flow out of the second air outlet 73 and the first air outlet 72 of the fan 70 so that the air volume of the air flow out of the first air outlet 72 is less than the air volume of the air flow out of the second air outlet 73, it can only be achieved by adjusting the size of the fan 70 at the first air outlet 72. However, this implementation method will affect the overall air volume of the fan 70 and the heat dissipation efficiency of the processor 32 and the heating elements in the heating element group 33.

[0183] On the contrary, in the embodiment of the present application, through the arrangement of the first heat exchange member 400, without affecting the overall air volume of the fan 70, when the air flow of the fan 70 at the first air outlet 72 enters the first air duct 25, the heat exchange part 410 blocks the flow of part of the air flow in the first air duct 25, increasing the impedance when the fan 70 discharges air from the first air outlet 72, which can prevent the excessive air volume at the first air outlet 72 from affecting the air volume of the fan 70 at the second air outlet 73, ensuring the heat dissipation efficiency of the air flow flowing out of the second air outlet 73 for the processor 32, and at the same time ensuring the heat dissipation efficiency of the air flow flowing out of the first air outlet 72 for the heating elements in the heating element group 33.

[0184] It should be noted that Figure 8 Only the relevant structure of the first housing 20 at the position of the first end 912 of the first heat pipe 91 is shown. Below, mainly in combination with the scenario of the first end 912 of the first heat pipe 91, the design of the heat dissipation module and the air duct, and the heat dissipation of the heat dissipation module and the fan 70 for the heating elements in the heating element group 33 will be further elaborated. For the scenario of the second end 913 of the first heat pipe 91, the design of the heat dissipation module and the air duct can refer to the relevant description of the first end 912 and will not be repeated.

[0185] See Figure 7 and Figure 8, in some embodiments, the first heat exchanger 400 further includes a heat exchange body 420. The heat exchange body 420 is connected to the side of the end of the first heat pipe 91 facing the bottom case 2a and is disposed opposite to the first air outlet 72. The heat exchange part 410 is located on the side of the heat exchange body 420 facing the bottom case 2a, and there is a gap between adjacent heat exchange parts 410. Through the arrangement of the heat exchange body 420, the connection between the heat exchange part 410 and the end of the first heat pipe 91 can be realized, so that the heat collected at the end of the first heat pipe 91 can be transferred to the heat exchange part 410 through the heat exchange body 420. Through the arrangement that there is a gap between adjacent heat exchange parts 410, the air flow in the first air duct 25 can flow between adjacent heat exchange parts 410, so as to increase the heat exchange area between the heat exchange part 410 and the air flow and improve the heat dissipation efficiency of the heating elements in the heating element group 33.

[0186] In some embodiments, when the heat exchange body 420 is connected to the end of the first heat pipe 91, the heat exchange body 420 can cover at least part of the end of the first heat pipe 91, so that the heat collected at the end of the first heat pipe 91 can be quickly transferred to the heat exchange body 420 and then transferred to the heat exchange part 410 through the heat exchange body 420.

[0187] Exemplarily, the heat exchange part 410 can include a cylindrical structure, a frustum structure, or a convex structure shape such as a steamed bun shape with a relatively smooth side. Compared with the heat exchange part 410 being a prism structure, when the heat exchange part 410 is a cylindrical structure, a frustum structure, or a convex structure shape such as a steamed bun shape with a relatively smooth side, it can avoid the large flow resistance generated by the existence of the heat exchange part 410 to the air flow in the first air duct 25, so that the air flow can flow smoothly along the first air duct 25 to the first outlet 22 and discharge from the first housing 20.

[0188] It should be noted that when the heat exchange part 410 is a cylindrical structure, as an example, the diameter of the heat exchange part 410 can be 1.55 mm, and the gap between adjacent heat exchange parts 410 can be 2.6 mm. However, this does not constitute a limitation on the diameter of the heat exchange part 410 and the gap between adjacent heat exchange parts 410. For example, with the change of the external environment (such as the size of the first housing 20, etc.), the diameter of the heat exchange part 410 and the gap between adjacent heat exchange parts 410 will also change accordingly. In this application, no limitation is made in this regard.

[0189] In some embodiments, along the thickness direction of the first housing 20, the gap between the heat exchange part 410 and the bottom case 2a is greater than 0.2 mm and less than 0.8 mm. For example, the gap between the heat exchange part 410 and the bottom case 2a can be 0.3 mm, 0.4 mm, 0.5 mm, or 0.6 mm, etc. The gap between the heat exchange part 410 and the bottom case 2a in the thickness direction of the first housing 20 can refer to the Z direction.

[0190] If the gap between the heat exchange part 410 and the bottom case 2a is less than 0.2 mm in the thickness direction of the first housing 20, the gap between the heat exchange part 410 and the bottom case 2a is too small, which may affect the temperature of the first housing 20 on the bottom case 2a. Moreover, due to the existence of tolerances, it may also affect the installation of the heat dissipation module in the first housing 20.

[0191] Figure 8 A schematic structure of an electronic device 10 inside the first housing 20 is shown Figure 2 , compared with Figure 7 , Figure 8 Part of the air guiding members surrounding the first air duct 25 are hidden. The formation of the first air duct 25 will be further elaborated below in combination with specific structures.

[0192] Refer to Figure 8 , if the gap between the heat exchange part 410 and the bottom case 2a is greater than 0.8 mm in the thickness direction of the first housing 20, the gap between the heat exchange part 410 and the bottom case 2a is too large, and the heat exchange area of the heat exchange part 410 is limited, which affects the heat dissipation efficiency of the heating elements in the heating element group 33.

[0193] On the contrary, in the embodiment of the present application, when the gap between the heat exchange part 410 and the bottom case 2a is limited to be greater than 0.2 mm and less than 0.8 mm, while avoiding the heat exchange part 410 from affecting the temperature of the first housing 20 on the bottom case 2a and ensuring the installation of the heat dissipation module in the first housing 20, it can also enable the heat exchange part 410 to have sufficient heat exchange area to ensure the heat dissipation efficiency of the heating elements in the heating element group 33.

[0194] In some embodiments, along the width direction of the first housing 20:

[0195] The size of the first heat exchange member 400 in the width direction of the first housing 20 matches the first air outlet 72, that is, the size of the first heat exchange member 400 in the width direction of the first housing 20 is the same as or close to the first air outlet 72.

[0196] And, refer to Figure 8 , along the length direction of the first housing 20:

[0197] The fan 70 is located on the side of the heating element group 33 facing the outside of the first housing 20, and the distance between the first heat exchange member 400 and the fan 70 can be less than or equal to 0.5 mm. For example, the distance between the first heat exchange member 400 and the fan 70 can be 0.5 mm, 0.4 mm, etc. For example, the distance between the first heat exchange member 400 and the fan 70 can also approach zero infinitely.

[0198] In this way, when the distance between the first heat exchange element 400 and the fan 70 is less than or equal to 0.5 mm, a relatively small distance can be achieved between the first heat exchange element 400 and the fan 70, ensuring that more of the air flow out of the first air outlet 72 can enter the first air duct 25 to exchange heat with the first heat exchange element 400, thereby improving the heat dissipation efficiency and effect of the heating elements in the heating element group 33.

[0199] See Figure 8 , a plurality of heat exchange portions 410 can be arranged on the heat exchange main body 420 in an array or other ways, making the arrangement of the heat exchange portions 410 on the heat exchange main body 420 more uniform. While enhancing the impedance of the heat exchange portions 410 to the air flow from the first air outlet 72 of the fan 70, it is convenient to distribute the air flow rates of the fan 70 at the first air outlet 72 and the second air outlet 73.

[0200] For example, the array can include a rectangular array or the like. When a plurality of heat exchange portions 410 are arranged on the heat exchange main body 420 in a rectangular array or other ways, some of the plurality of heat exchange portions 410 can be arranged at intervals along the length direction of the first housing 20 to form a row of heat exchange groups. Some of the plurality of heat exchange portions 410 can also be arranged at intervals along the width direction of the first housing 20 to form a column of heat exchange groups. At least three columns of heat exchange groups can be provided on the heat exchange main body 420.

[0201] It should be noted that if there is no first heat exchange element 400 in the first air duct 25, assuming that the air flow rates of the fan 70 at the second air outlet 73 and the first air outlet 72 are to be distributed at 7:3, it can only be achieved by adjusting the size of the fan 70 at the first air outlet 72. However, this implementation method will affect the overall air flow rate of the fan 70 and the heat dissipation efficiency of the processor 32 and the heating elements in the heating element group 33.

[0202] When the size of the first heat exchange element 400 in the width direction of the first housing 20 matches the first air outlet 72, and the distance between the first heat exchange element 400 and the fan 70 is less than or equal to 0.5 mm, at least three columns of heat exchange groups are provided on the heat exchange main body 420. Through thermal simulation, by setting the first heat exchange element 400, the system impedance of the fan 70 at the first air outlet 72 can be increased, and the air flow rates of the fan 70 at the second air outlet 73 and the first air outlet 72 can be distributed at 7:3 to avoid excessive air flow rate at the first air outlet 72, which may affect the air flow rate at the second air outlet 73.

[0203] See Figure 8, in some embodiments, the first heat conducting plate 100 and the first heat exchanging member 400 may be an integral structural member, that is, the first heat conducting plate 100 and the first heat exchanging member 400 are integrally formed. At this time, during the formation of the heat exchanging portion 410, a part of the heat exchanging main body 420 may be recessed toward one side by stamping or the like to form the heat exchanging portion 410.

[0204] Alternatively, in some other embodiments, the first heat conducting plate 100 may be connected to the first heat exchanging member 400. For example, the first heat conducting plate 100 may be connected to the first heat exchanging member 400 by a heat-conducting means such as welding. When the first heat conducting plate 100 and the first heat exchanging member 400 are an integral structural member, or when the first heat conducting plate 100 is connected to the first heat exchanging member 400, the heat on the first heat conducting plate 100 will also be transferred to the first heat exchanging member 400, so that the heat of the heating element covered by the first heat conducting plate 100 can also be directly transferred to the heat exchanging portion 410 of the first heat exchanging member 400. This enables the heat dissipation module to have better heat dissipation efficiency and heat dissipation effect on the heating elements in the heating element group 33.

[0205] The first heat conducting plate 100 may include a copper plate or an aluminum plate, so that the first heat conducting plate 100 has good heat conducting performance, so that the heat of the heating element covered by the first heat conducting plate 100 can be directly transferred to the heat exchanging portion 410 of the first heat exchanging member 400.

[0206] It should be noted that when the first heat conducting plate 100 and the first heat exchanging member 400 are an integral structural member, or when the first heat conducting plate 100 is connected to the first heat exchanging member 400, since the heat dissipation module has better heat dissipation efficiency for the heating elements in the heating element group 33, at this time, the first heat conducting plate 100 may be an aluminum plate. In this way, while meeting the heat dissipation requirements of the heating elements in the heating element group 33 and reducing the temperature on the surface of the first housing 20, since aluminum has a smaller density than copper, therefore, it can also reduce the weight of the heat dissipation module, which helps to reduce the weight of the electronic device 10.

[0207] See Figure 5a , Figure 5b and Figure 6 , in some embodiments, the air inlet area 21 is located at a position of the bottom case 2a opposite to the air inlet 71. The first housing 20 has opposite user side 2c and rotating shaft side 2d in the width direction. The rotating shaft side 2d is used for installing the rotating shaft, and at least part of the first opening is located at a position of the first housing 20 opposite to the heating element group 33 on the rotating shaft side 2d.

[0208] In this way, the air flow outside the first housing 20 can enter the air inlet 71 of the fan 70 through the air inlet area 21 and flow out from the first air outlet 72 into the first air duct 25. Moreover, the air flows in the two first air ducts 25 can flow in their respective air ducts and exchange heat with the first heat exchange member 400, and then flow out from the first opening, so that all the heating elements in the heating element group 33 can exchange heat with the external air of the electronic device 10 in a timely and effective manner.

[0209] It should be noted that when there are also a plurality of ventilation openings in the area between the two fans 70 on the bottom case 2a, a wind blocking member 700 needs to be provided on the inner side of the first housing 20 on the bottom case 2a. The wind blocking member 700 is arranged between the two fans 70, and the wind blocking member 700 covers the ventilation openings on the bottom case 2a between the two fans 70 to prevent the air flow flowing out from the first air outlet 72 from directly flowing back to the air inlet 71 of the fan 70 through the ventilation openings on the bottom case 2a between the two fans 70 without exchanging heat with the air outside the first housing 20, which affects the heat dissipation efficiency and heat dissipation effect of the heating elements in the heating element group 33 by the fan 70. At this time, the gap between the heat exchange part 410 and the bottom case 2a mentioned above can be understood as the gap between the heat exchange part 410 and the wind blocking member 700.

[0210] See Figure 8 , in some embodiments, a second air duct 26 can also be provided at a position in the first housing 20 opposite to the end of the first heat pipe 91. The second air duct 26 is located between the first heat pipe 91 and the circuit board 31, and one end of the second air duct 26 communicates with the adjacent first air outlet 72, and the other end of the second air duct 26 communicates with the first outlet 22 and the adjacent first air duct 25. Taking the first end 912 as an example, that is to say, one end of the second air duct 26 at the first end 912 can communicate with the first air outlet 72 of the first fan 7a, and the other end of the second air duct 26 at the first end 912 can communicate with the first outlet 22 and the first air duct 25 adjacent to the first fan 7a.

[0211] With the provision of the second air duct 26, the air flow flowing out from the first air outlets 72 of the two fans 70 can also flow along the corresponding second air ducts 26 towards the first outlet 22 and then flow to the outside of the first housing 20 (i.e., the environment). Moreover, since the other end of the second air duct 26 is connected to the adjacent first air duct 25, the air flow in the second air duct 26 will converge with the air flow in the first air duct 25 and exchange heat during the flow. The heat of the heating element mainly accumulates on the first heat exchanger 400 in the first air duct 25. When the air flow in the first air duct 25 exchanges heat with the first heat exchanger 400 and becomes hot air, the air flow in the second air duct 26 has a lower temperature and is close to the ambient temperature, which can be regarded as cold air. Therefore, when the air flow flows in the second air duct 26 and converges with the air flow in the first air duct 25 to exchange heat, it can reduce the temperature of the hot air in the first air duct 25, thereby reducing the temperature of the housing body 2b or the bottom case 2a of the first housing 20 on the rotating shaft side 2d.

[0212] See Figure 8 , in some embodiments, a third air duct 27 is provided inside the first housing 20. The third air duct 27 is located between the circuit board 31 and the housing body 2b, and the third air duct 27 communicates the first outlet 22 with the first air outlets 72 of the two fans 70.

[0213] With the provision of the third air duct 27, the air flow flowing out from the first air outlets 72 of the two fans 70 can also flow along the corresponding third air ducts 27 towards the first outlet 22 and then flow to the outside of the first housing 20 to reduce the temperature of the keyboard surface on the housing body 2b of the first housing 20. Moreover, through the provisions of the first air duct 25, the second air duct 26 and the third air duct 27, the air flow flowing out from the first air outlets 72 of the fans 70 can flow along three different air ducts without interfering with each other to achieve different purposes.

[0214] In some embodiments, the electronic device 10 further includes a wind guiding assembly 600. The wind guiding assembly 600 includes a plurality of wind guiding members. For example, the wind guiding member can be a foam, a wind guiding rib, etc. The plurality of wind guiding members include a first wind guiding member 610, a second wind guiding member 620 and a third wind guiding member 630.

[0215] See Figure 6 , the first wind guiding member 610 is provided between the end of the first heat pipe 91 and the bottom case 2a and encloses the first air duct 25 with the bottom case 2a, so that the air flow flowing out from the first air outlet 72 can flow in the first air duct 25 to the first outlet 22.

[0216] It should be noted that Figure 6Six first air guides 610 are shown, of which three first air guides 610 can be arranged at the first air outlet 72 of the first fan 7a, and these three first air guides 610 can be arranged between the first heat pipe 91 and the bottom shell 2a, and the first air guides 610, the bottom shell 2a, the first fan 7a and the first heat pipe 91 together form a first air duct 25. The remaining three first air guides 610 can be arranged at the first air outlet 72 of the second fan 7b, and in the same way, the first air guides 610, the bottom shell 2a, the second fan 7b and the first heat pipe 91 together form another first air duct 25.

[0217] Among them, the end of part of the first air guide member 610 can also be arranged on the side of the second heat pipe 92 facing the bottom shell 2a, and extend in the direction of the first outlet 22 to guide the airflow in the first air duct 25 to the first outlet 22, and make the formed first air duct 25 connected with the first outlet 22, ensuring that the airflow in the first air duct 25 can flow to the outside of the first shell 20 through the first outlet 22.

[0218] See also Figure 9 The second air guide 620 is disposed between the end of the first heat pipe 91 and the circuit board 31, and the second air guide 620, the end of the first heat pipe 91 and the circuit board 31 form a second air duct 26, so that the airflow from the first air outlet 72 can flow to the first outlet 22 in the second air duct 26. The second air guide 620 is disposed between the two ends of the first heat pipe 91 and the circuit board 31, so that a second air duct 26 is formed at the two ends of the first heat pipe 91.

[0219] The formation of the second air duct 26 is further described below by taking the first end 912 of the first heat pipe 91 as an example. The formation of the second air duct 26 at the second end 913 can refer to the relevant description of the first end 912 .

[0220] The second air guide member 620 can be arranged between the end of the first heat pipe 91 and the circuit board 31, and the end of the second air guide member 620 can also be arranged on the side of the end of the second heat pipe 92 away from the bottom shell 2a, and extend toward the first outlet 22 to guide the airflow in the second air duct 26 to the first outlet 22, and make the formed second air duct 26 connected with the first outlet 22, ensuring that the airflow in the second air duct 26 can flow to the outside of the first shell 20 through the first outlet 22.

[0221] It should be noted that some of the multiple first air guides 610 can be connected to the second air guides 620 opposite to the first housing 20 in the thickness direction and separated by the first heat pipe 91. Alternatively, when some of the multiple first air guides 610 are arranged on one side of the first heat pipe 91, they can also simultaneously serve as the second air guides 620 to participate in the formation of the second air duct 26, so as to reduce the number of air guides.

[0222] Figure 10 Shows a partial explosion of an electronic device 10 Figure 3 .

[0223] See Figure 10 , the third air guide member 630 is disposed between the circuit board 31 and the housing main body 2b, and encloses a third air duct 27 with the circuit board 31 and the housing main body 2b, so that the air flow flowing out from the first air outlet 72 can flow in the third air duct 27 to the first outlet 22. Among them, the third air guide member 630 can be clamped between the circuit board 31 and the housing main body 2b, and the end portions of a part of the third air guide member 630 can also extend toward the direction of the first outlet 22 to guide the air flow in the third air duct 27 to the first outlet 22, and make the formed third air duct 27 communicate with the first outlet 22, ensuring that the air flow in the third air duct 27 can flow to the outside of the first housing 20 through the first outlet 22.

[0224] In some embodiments, as Figure 10 shown, the first air outlets 72 of the two fans 70 can share a third air duct 27. Figure 10 Three third air guide members 630 are shown in

[0225] , and these three third air guide members 630 can enclose a semi-surrounding structure, so that the notch of the semi-surrounding structure faces the first outlet 22 to form the air outlet end of the third air duct 27, realizing the communication between the third air duct 27 and the first outlet 22.

[0226] It should be noted that the heat dissipation module and the fan 70 mentioned above are the first type of active heat dissipation structure. Although the first heat dissipation module can reduce the temperature of the first housing 20 on the rotating shaft side 2d through the setting of the second air duct 26, however, since the path from the first air outlet 72 to the first outlet 22 is relatively long, and the air flow at the first air outlet 72 exchanges heat with the heat exchange part 410 of the first heat exchange member 400 in the first air duct 25, and then flows out of the first housing 20 through the rotating shaft provided on the rotating shaft side 2d from the first outlet 22, it may still cause a relatively low surface temperature gain at the position of the rotating shaft of the first housing 20.

[0227] The second active heat dissipation structure also includes two fans 70, a first heat pipe 91, a second heat pipe 92, a first heat conducting plate 100, a second heat conducting plate 200, etc. The settings of the fans 70 relative to the heat generating element group 33 and the processor 32, as well as the settings and connection manners of the first heat pipe 91, the second heat pipe 92, the first heat conducting plate 100, and the second heat conducting plate 200 are the same as those of the first active heat dissipation structure, and will not be elaborated here. The difference from the first active heat dissipation structure lies in the air duct design of the second active heat dissipation structure and the setting positions of the air inlet area 21 and the first outlet 22.

[0228] Figure 10 Fig. shows a schematic structural diagram of another part of the electronic device 10 where the first housing 20 is located. Figure 11 An exploded view of the part where the first housing 20 is located. Figure 11 A second active heat dissipation structure is provided in the first housing 20.

[0229] The following combines Figure 10 and Figure 11 to further elaborate on the differences between the second active heat dissipation structure and the first active heat dissipation structure.

[0230] Refer to Figure 10 and combine with Figure 11 For the second active heat dissipation structure, in some embodiments, the first opening is located at a position of the bottom case 2a adjacent to the first air outlet 72, and the bottom case 2a is provided with a first opening at the position corresponding to the first air outlets 72 of the two fans 70. The first air duct 25 communicates the adjacent first outlet 22 with the adjacent first air outlet 72. With such a setting, the first opening can be adjusted from the rotating shaft side 2d to the position of the bottom case 2a adjacent to the first air outlet 72, and the two fans 70 respectively discharge air through a corresponding first opening, shortening the path of the first air outlet 72 from the first outlet 22, so that the air flow in the first air duct 25 can directly flow out of the first opening to the outside of the first housing 20 after dissipating heat from the heat generating elements in the heat generating element group 33 without passing through the rotating shaft, which can greatly reduce the surface temperature of the first housing 20 at the position of the rotating shaft and improve the benefit of the surface temperature of the first housing 20 at the position of the rotating shaft.

[0231] Refer to Figure 10 and combine with Figure 11 On this basis, for the second active heat dissipation structure, the air inlet area 21 is located at the edge area of the first housing 20 in the length direction. Among them, the first housing 20 is provided with two air inlet areas 21 so that the two air inlet areas 21 can respectively supply air to the adjacent fans 70. For example, the two air inlet areas 21 can be located on the left and right sides of the first housing 20 in the length direction.

[0232] When the air inlet area 21 is located at the edge area of the first housing 20 in the length direction, it can keep the air inlet area 21 away from the first outlet 22, so as to prevent the air flow flowing out of the first outlet 22 from directly flowing back into the fan 70 through the air inlet area 21 without exchanging heat with the air outside the first housing 20, which affects the heat dissipation efficiency and effect of the heating elements in the heating element group 33 by the fan 70.

[0233] Figure 12 shows Figure 10 the schematic structural diagram of the electronic device 10 in the first housing 20.

[0234] See Figure 12 For the second active heat dissipation structure, in some embodiments, the heat dissipation module further includes a second heat exchanger 500, and the second heat exchanger 500 is disposed opposite to the first air outlet 72. And, the second heat exchanger 500 is connected to one side of the end of the first heat pipe 91 facing the bottom case 2a. For example, the second heat exchanger 500 can be connected to the first heat pipe 91 by welding or other heat-conductive means.

[0235] Since the first heat pipe 91 has two ends, the heat dissipation module includes two second heat exchangers 500, and one second heat exchanger 500 is provided at each of the two ends of the first heat pipe 91. The second heat exchanger 500 has a plurality of sub-air ducts 530 therein, and the sub-air ducts 530 communicate with the first air duct 25 corresponding to the end of the first heat pipe 91 where the second heat exchanger 500 is located and the first air outlet 72. For example, the second heat exchanger 500 at the first end 912 can communicate with the first air duct 25 corresponding to the first end 912 and the first air outlet 72 of the first fan 7a, and the second heat exchanger 500 at the second end 913 can communicate with the first air duct 25 corresponding to the second end 913 and the first air outlet 72 of the second fan 7b.

[0236] Through the arrangement of the second heat exchanger 500, after the heat in the heating element group 33 is concentrated at the end of the first heat pipe 91, it can be transferred to the second heat exchanger 500. Through the arrangement of the plurality of sub-air ducts 530 in the second heat exchanger 500, the heat exchange area of the second heat exchanger 500 can be increased, and the first air duct 25 can communicate with the adjacent first air outlet 72 through the sub-air ducts 530. In this way, when the air flow flowing out of the first air outlet 72 of the fan 70 enters the sub-air ducts 530, it will exchange heat with the plurality of second heat exchangers 500, and after dissipating heat from the heating elements, it is discharged to the outside of the first housing 20 through the first air duct 25 and the first outlet 22, without passing through the rotating shaft side 2d, so that all the heating elements in the heating element group 33 can exchange heat with the outside air of the electronic device 10 in a timely and effective manner.

[0237] See Figure 12, in some embodiments, the second heat exchanger 500 includes a heat exchange housing 510 and a plurality of heat dissipation fins 520. The side of the heat exchange housing 510 facing the first air outlet 72 has an air inlet end. The plurality of heat dissipation fins 520 are disposed in the heat exchange housing 510 and divide the space in the heat exchange housing 510 into a plurality of sub-air ducts 530. One end of the sub-air duct 530 communicates with the first air outlet 72; there is a communication port on the side of the heat exchange housing 510 facing the bottom case 2a, and the communication port communicates the other end of the sub-air duct 530 with the first air duct 25. Through the arrangement of the heat dissipation fins 520 and the heat exchange housing 510, while forming the second heat exchanger 500 with a plurality of sub-air ducts 530, the second heat exchanger has a larger heat exchange area compared with the first heat exchanger, which can improve the heat dissipation efficiency of the heating elements in the heating element group 33. Moreover, through the arrangement of the communication port, the communication between the sub-air duct 530 and the first air duct 25 can be realized, so that the air flow in the sub-air duct 530 can enter the first air duct 25 through the communication port after heat exchange.

[0238] In some embodiments, the heat dissipation fins 520 can be inclined and disposed in the heat exchange housing 510 so that the flow guiding direction of the sub-air duct 530 matches (is the same or similar) the air flow direction flowing out of the first air outlet 72. The air flow direction flowing out of the centrifugal fan at the air outlet has a certain directionality. By adjusting the inclination angle of the heat dissipation fins in the heat exchange housing 510, the flow guiding direction of the sub-air duct 530 can be made to match the air flow direction flowing out of the first air outlet 72. For example, the heat dissipation fins 520 can be inclined in the heat exchange housing 510 at an angle of 35° with the horizontal direction. The horizontal direction is parallel to the length direction of the first housing 20.

[0239] Through the setting that the flow guiding direction of the sub-air duct 530 matches the air flow direction flowing out of the first air outlet 72, the air resistance of the air flow flowing out of the first air outlet 72 in the sub-air duct 530 can be reduced, so that the air flow flowing out of the first air outlet 72 can flow in the sub-air duct 530 in a relatively smooth manner.

[0240] The first outlet 22 can be formed by a plurality of holes. For example, the holes forming the first outlet 22 can be strip-shaped holes, circular holes, etc. Taking the strip-shaped hole as an example, the width of the sub-air duct 530 can be the same or similar to the width of the notch. For example, the width of the sub-air duct 530 can be 4.25 mm, but this does not limit the width of the sub-air duct 530. It should be noted that after the size of the electronic device 10 is adjusted, the width of the sub-air duct 530 and the width of the holes can also be adjusted accordingly.

[0241] Similar to the first active heat dissipation structure, for the second active heat dissipation structure, the first heat conduction plate 100 can be a copper plate, an aluminum plate, or the like. Since the second active heat dissipation structure has a high heat dissipation efficiency for the heat generating elements in the heat generating element group 33, when the first heat conduction plate 100 is an aluminum plate, it can still meet the heat dissipation requirements of the heat generating elements in the heat generating element group 33 for the electronic device 10. At the same time, it can reduce the weight of the heat dissipation module, which is helpful for the lightweight design of the electronic device 10.

[0242] In some embodiments, there may be a gap between the first heat conduction plate 100 and the second heat exchange member 500. Since the second active heat dissipation structure has a high heat dissipation efficiency for the heat generating elements in the heat generating element group 33, when there is a gap between the first heat conduction plate 100 and the second heat exchange member 500, it can still meet the heat dissipation requirements of the heat generating elements in the heat generating element group 33 for the electronic device 10.

[0243] It should be understood that, alternatively, the first heat conduction plate 100 and the second heat exchange member 500 are connected to each other. When the first heat conduction plate 100 and the second heat exchange member 500 are connected to each other, the heat of the heat generating elements covered by the first heat conduction plate 100 can also be directly transferred to the second heat exchange member 500, which can further improve the heat dissipation efficiency of the heat generating elements in the heat generating element group 33.

[0244] Figure 13 Shows Figure 10 The structural schematic diagram of the heat generating elements in

[0245] See Figure 13 For the second active heat dissipation structure, the first heat conduction plate 100 can cover the heat generating elements with a relatively large height, the first heat pipe 91 can cover the heat generating elements with a relatively small height, and heat conduction members can be provided between the first heat conduction plate 100 and the heat generating elements, as well as between the first heat pipe 91 and the heat generating elements. For specific details, reference can be made to the relevant description in the first active heat dissipation structure, which will not be elaborated here.

[0246] Figure 14 Shows Figure 10 The cross-sectional view of the electronic device 10 in the B-B direction in

[0247] See Figure 14, for the second active heat dissipation structure, in some embodiments, the first housing 20 further has a third outlet 24, and two fans 70 share the third outlet 24. Inside the first housing 20, a second air duct 26 is provided at a position opposite to the end of the first heat pipe 91. The second air duct 26 is located between the first heat pipe 91 and the circuit board 31. And, the second air duct 26 communicates the third outlet 24 with the adjacent first air outlet 72. Taking the first end 912 as an example, that is to say, the second air duct 26 at the first end 912 communicates the third outlet 24 and the first air outlet 72 of the first fan 7a.

[0248] Through the arrangement of the second air duct 26, the air flow flowing out from the first air outlets 72 of the two fans 70 can also flow along the corresponding second air duct 26 towards the third outlet 24 and then to the outside of the first housing 20 (i.e., the environment), so that the air flow (cold air) in the second air duct 26 and the air flow (hot air) after heat exchange in the first air duct 25 do not interfere with each other, so as to avoid affecting the heat dissipation efficiency of the heating elements in the heating element group 33.

[0249] The first housing 20 has a user side 2c and a rotating shaft side 2d in the width direction. The rotating shaft side 2d is used for installing the rotating shaft, and at least part of the third outlet 24 is located at the position of the first housing 20 on the rotating shaft side 2d opposite to the heating element. In this way, while reducing the temperature of the heating elements in the heating element group 33, the temperature of the housing body 2b or the bottom case 2a of the first housing 20 on the rotating shaft side 2d can be reduced.

[0250] See Figure 14 , for the second active heat dissipation structure, in some embodiments, a third air duct 27 is provided inside the first housing 20. The third air duct 27 is located between the circuit board 31 and the housing body 2b, and the third air duct 27 communicates the third outlet 24 with the first air outlets 72 of the two fans 70.

[0251] Through the arrangement of the third air duct 27, the air flow flowing out from the first air outlets 72 of the two fans 70 can also flow along the corresponding third air duct 27 towards the third outlet 24 and then to the outside of the first housing 20, so as to reduce the temperature of the first housing 20 on the keyboard surface of the housing body 2b. And, the second active heat dissipation structure also makes the air flow flowing out from the first air outlets 72 of the fans 70 flow along three different air ducts through the arrangements of the first air duct 25, the second air duct 26 and the third air duct 27, and the cold and hot air do not interfere with each other, so as to achieve different purposes.

[0252] In some embodiments, the electronic device 10 further includes a wind guiding assembly 600. The wind guiding assembly 600 includes a plurality of wind guiding members. The plurality of wind guiding members include a fourth wind guiding member 640, a fifth wind guiding member 650, a sixth wind guiding member 660 and a seventh wind guiding member 670.

[0253] SeeFigure 12 and Figure 14 Along the length direction of the first housing 20, the fourth air guiding member 640 and the fifth air guiding member 650 are spaced between the end of the first heat pipe 91 and the bottom case 2a, and the fourth air guiding member 640, the fifth air guiding member 650 and the bottom case 2a enclose a first air duct 25, so that the air flow flowing out of the first air outlet 72 can exchange heat with the second heat exchange member 500 in the sub-air duct 530 and then flow to the first outlet 22 through the first air duct 25.

[0254] It should be noted that Figure 12 shows two fourth air guiding members 640 and two fifth air guiding members 650, and one fourth air guiding member 640 and one fifth air guiding member 650 are respectively provided at two ends of the first heat pipe 91, so as to respectively form a first air duct 25 at two ends of the first heat pipe 91. Taking the first end 912 of the first heat pipe 91 as an example, the formation of the first air duct 25 will be further described below. For the formation of the first air duct 25 at the second end 913, reference can be made to the relevant description of the first end 912.

[0255] Figure 15 is Figure 12 an enlarged view at C.

[0256] Refer to Figure 15 Along the length direction of the first housing 20, the fourth air guiding member 640 and the fifth air guiding member 650 can be spaced on both sides of the notch of the heat exchange housing 510, and both the fourth air guiding member 640 and the fifth air guiding member 650 are connected to the inner side of the bottom case 2a, so that the fourth air guiding member 640, the fifth air guiding member 650 and the bottom case 2a can jointly enclose a first air duct 25 at the position of the first end 912, and the first air duct 25 is communicated with the sub-air duct 530.

[0257] In some embodiments, both the fourth air guiding member 640 and the fifth air guiding member 650 can be connected between the heat exchange housing 510 and the bottom case 2a.

[0258] It should be noted that, refer to Figure 15 When the side of the heat exchange housing 510 facing away from the air inlet side is an opening 511, the fifth air guiding member 650 can extend toward the side of the circuit board 31 to block the opening 511 of the heat exchange housing 510, so as to ensure that as much air flow in the sub-air duct 530 as possible flows to the outside of the first housing 20 through the first air duct 25 and the first outlet 22, and to avoid the air flow in the sub-air duct 530 flowing toward the third outlet 24 and affecting the temperature of the first housing 20 at the rotating shaft side 2d.

[0259] At this time, one side of the fifth air guiding member 650 that seals the opening 511 of the heat exchange housing 510 can be an inclined surface 651, so that by adjusting the inclination angle of the inclined surface 651, the air flow in the sub-air duct 530 can be better guided into the first air duct 25 while reducing the air resistance when the air flow in the sub-air duct 530 flows towards the fifth air guiding member 650.

[0260] See Figure 13 , the sixth air guiding member 660 is arranged between the end of the first heat pipe 91 and the circuit board 31, and the sixth air guiding member 660 and the end of the first heat pipe 91 and the circuit board 31 enclose a second air duct 26, so that the air flow flowing out from the first air outlet 72 can flow in the second air duct 26 to the third outlet 24. Second air guiding members 620 are arranged between the two ends of the first heat pipe 91 and the circuit board 31, so as to respectively form a second air duct 26 at the two ends of the first heat pipe 91. It should be noted that Figure 13 only shows the sixth air guiding member 660 at one end of the first heat pipe 91 in

[0261] Still taking one end of the first heat pipe 91 as an example below, the formation of the second air duct 26 will be further elaborated. The formation of the second air duct 26 at the other end of the first heat pipe 91 can refer to the relevant description of the first end 912.

[0262] The sixth air guiding member 660 can be clamped between the end of the first heat pipe 91 and the circuit board 31, and the end of the sixth air guiding member 660 can also be arranged on the side of the end of the second heat pipe 92 away from the bottom case 2a and extend towards the third outlet 24, so as to guide the air flow in the second air duct 26 to the third outlet 24 and make the formed second air duct 26 communicate with the third outlet 24, ensuring that the air flow in the second air duct 26 can flow to the outside of the first housing 20 through the third outlet 24.

[0263] See Figure 14 , the seventh air guiding member 670 is arranged between the circuit board 31 and the housing main body 2b and encloses a third air duct 27 with the circuit board 31 and the housing main body 2b, so that the air flow flowing out from the first air outlet 72 can flow in the third air duct 27 to the third outlet 24. Among them, the third air guiding member 630 can be clamped between the circuit board 31 and the housing main body 2b, and the end of part of the third air guiding member 630 can also extend towards the third outlet 24, so as to guide the air flow in the third air duct 27 to the third outlet 24 and make the formed third air duct 27 communicate with the third outlet 24, ensuring that the air flow in the third air duct 27 can flow to the outside of the first housing 20 through the third outlet 24.

[0264] In the second active heat dissipation structure, the first air outlets 72 of the two fans 70 can also share a third air duct 27. For the number and the enclosed shape of the seventh air guiding member 670, and the relationship between the enclosed shape and the third air duct 27, etc., reference can be made to the relevant description of the first active heat dissipation structure, which will not be elaborated here.

[0265] Refer to Figure 15 , in the second active heat dissipation structure, there is also a wind shield 700. The wind shield 700 is arranged between the fan 70 and the bottom case 2a, and the wind shield 700 is arranged on the side of the first air outlet 72 facing the bottom case 2a to block the airflow flowing out of the first air outlet 72 from flowing towards the side of the bottom case 2a, ensuring that as much as possible of the airflow flowing out of the first air outlet 72 passes through the sub-air duct 530 and flows into the first air duct 25 to exchange heat with the second heat exchange member 500, which can further improve the heat dissipation efficiency of the heating elements in the heating element group 33.

[0266] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0267] In the description of the present application, it should be understood that the terms "including" and "having" used herein and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, display structure, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0268] The term "and / or" used in the present application is only a description of the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0269] Unless otherwise clearly defined or limited, the terms "installation", "connection", and "linkage" shall be understood in a broad sense. For example, it may be a fixed connection, or an indirect connection through an intermediate medium, or the internal communication between two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0270] In the description and claims of the embodiments of the present application and the above-mentioned drawings, the terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

Claims

1. An electronic device, characterized in that: include: A first shell having an air inlet area and a first outlet, wherein the air inlet area has a vent; A heating element group is disposed in the first housing; the heating element group includes a plurality of heating elements, and the plurality of heating elements does not include a processor; A fan, along the length direction of the first shell, a fan is respectively arranged on both sides of the heating element group in the first shell, and the fan is a centrifugal fan; the fan has an air inlet and a first air outlet, and the first shell is respectively provided with an air inlet area at the position corresponding to the two air inlets; the air inlet is communicated with the vent in the corresponding air inlet area; the first air outlet faces the heating element group and is communicated with the first outlet; A heat dissipation module is arranged in the first shell, and the heat dissipation module includes a first heat pipe and a first heat conductive plate. The first heat pipe and the first heat conductive plate at least cover the heating elements in the middle area of ​​the heating element group, and the two ends of the first heat pipe are respectively arranged corresponding to the first air outlets of the two fans; the first heat conductive plate is connected to the first heat pipe.

2. The electronic device according to claim 1, characterized in that: The first heat pipe covers part of the heating elements of the heating element group, and the first heat conducting plate covers the remaining heating elements of the heating element group.

3. The electronic device according to claim 1 or 2, characterized in that: The first heat pipe has a connecting portion, and the connecting portion covers a portion of the heating elements in the heating element group; Along the width direction of the first shell, the first air outlets of the two fans are both located on one side of the connecting portion, and both ends of the first heat pipe are both located on a side of the connecting portion facing the two first air outlets.

4. The electronic device according to any one of claims 1 to 3, characterized in that: It also includes a circuit board, the circuit board is arranged in the first shell, the first shell has a bottom shell and a shell body arranged opposite to each other in the thickness direction, and the heating element is arranged on a side of the circuit board facing the bottom shell; A first air duct is provided in the first housing at a position opposite to the end of the first heat pipe, and at least a portion of the first air duct is located between the bottom housing and the first heat pipe; The two fans share one first outlet, and the first air duct connects the first outlet with the adjacent first air outlet.

5. The electronic device according to claim 4, characterized in that: The heat dissipation module further includes a first heat exchange member, and the end of the first heat pipe is provided with the first heat exchange member on a side facing the bottom shell; The first heat exchange element includes a plurality of heat exchange parts connected to the ends of the first heat pipes. The heat exchange parts are arranged opposite to the first air outlet and are located in the first air duct.

6. The electronic device according to claim 5, characterized in that: The first heat exchange element further includes a heat exchange body, which is connected to a side of the end of the first heat pipe facing the bottom shell and is arranged opposite to the first air outlet; The heat exchange part is located on a side of the heat exchange body facing the bottom shell, and there is a gap between adjacent heat exchange parts.

7. The electronic device according to claim 6, characterized in that: The plurality of heat exchange parts are arranged in an array on the heat exchange body.

8. The electronic device according to claims 5-7, characterized in that: Along the thickness direction of the first shell, a gap between the heat exchange portion and the bottom shell is greater than 0.2 mm and less than 0.8 mm.

9. The electronic device according to any one of claims 5 to 8, characterized in that: Along the length direction of the first shell: The fan is located on a side of the heating element group facing the outside of the first shell, and the distance between the first heat exchange element and the fan is less than 0.5 mm; Along the width direction of the first housing: The dimension of the first heat exchange element in the width direction of the first shell matches the first air outlet.

10. The electronic device according to any one of claims 5 to 9, characterized in that: A second air duct is provided in the first housing at a position opposite to the end of the first heat pipe, and the second air duct is located between the first heat pipe and the circuit board; One end of the second air duct is connected to the adjacent first air outlet, and the other end of the second air duct is connected to the first outlet and the adjacent first air duct.

11. The electronic device according to claim 10, characterized in that: A third air duct is provided in the first shell at a position opposite to the end of the first heat pipe. The third air duct is located between the circuit board and the shell body, and the third air duct is connected to the first outlet and the two first air outlets.

12. The electronic device according to claim 11, characterized in that: It also includes an air guide assembly, the air guide assembly includes a first air guide member, a second air guide member and a third air guide member, the first air guide member is arranged between the end of the first heat pipe and the bottom shell, and forms the first air duct with the bottom shell; The second air guide is disposed between the end of the first heat pipe and the circuit board, and the second air guide, the end of the first heat pipe and the circuit board form the second air duct; The third air guide is disposed between the circuit board and the shell body, and the third air guide, the circuit board and the shell body form the third air duct.

13. The electronic device according to any one of claims 5 to 12, characterized in that: The first heat conducting plate is connected to the first heat exchanging element.

14. The electronic device according to any one of claims 4 to 13, characterized in that: The air inlet area is located at a position where the bottom shell is opposite to the air inlet; The first shell has a user side and a shaft side in the width direction, the shaft side is used to install the shaft, and at least part of the first opening is located at a position of the first shell on the shaft side opposite to the heating element group.

15. The electronic device according to any one of claims 1 to 3, characterized in that: It also includes a circuit board, the circuit board is arranged in the first shell, the first shell has a bottom shell and a shell body arranged opposite to each other in the thickness direction, and the heating element is arranged on a side of the circuit board facing the bottom shell; A first air duct is provided in the first housing at a position opposite to the end of the first heat pipe, and at least a portion of the first air duct is located between the bottom housing and the first heat pipe; The first opening is located at a position of the bottom shell adjacent to the first air outlet, and the bottom shell is provided with a first opening at a position corresponding to the first air outlets of two fans, and the first air duct connects the adjacent first outlet with the adjacent first air outlet.

16. The electronic device according to claim 15, characterized in that: The air inlet area is located at an edge area of ​​the first shell in the length direction.

17. The electronic device according to claim 15 or 16, characterized in that: The heat dissipation module further includes a second heat exchange member, which is arranged opposite to the first air outlet and connected to a side of the end of the first heat pipe facing the bottom shell; The second heat exchange component has a plurality of sub-air ducts therein, and the sub-air ducts are connected to the first air duct corresponding to the end of the first heat pipe and the first air outlet.

18. The electronic device according to claim 17, characterized in that: The second heat exchange element comprises a heat exchange shell and a plurality of heat dissipation fins, and the heat exchange shell has an air inlet end on a side facing the first air outlet; The multiple heat dissipation fins are arranged in the heat exchange shell, and divide the space in the heat exchange shell into multiple sub-air ducts, one end of each sub-air duct is connected to the first air outlet; a connecting port is provided on the side of the heat exchange shell facing the bottom shell, and the connecting port connects the other end of the sub-air duct and the first air duct.

19. The electronic device according to claim 18, characterized in that: The heat dissipation fins are arranged obliquely in the heat exchange shell so that the sub-air duct matches the air flow direction flowing out of the first air outlet.

20. The electronic device according to any one of claims 15 to 19, characterized in that: The first housing has a third outlet, and the two fans share one third outlet; A second air duct is provided in the first housing at a position opposite to the end of the first heat pipe. The second air duct is located between the first heat pipe and the circuit board, and the second air duct communicates with the third outlet and the adjacent first outlet.

21. The electronic device according to claim 20, characterized in that: The first shell has a user side and a shaft side in the width direction, the shaft side is used to install the shaft, and at least part of the third outlet is located at a position of the first shell on the shaft side opposite to the heating element.

22. The electronic device according to claim 20 or 21, characterized in that: A third air duct is disposed in the first shell, the third air duct is located between the circuit board and the shell body, and the third air duct is connected with the third outlet and the two first air outlets.

23. The electronic device according to claim 22, characterized in that: Also included is an air guide assembly, the air guide assembly including a fourth air guide member, a fifth air guide member, a sixth air guide member and a seventh air guide member; Along the length direction of the first housing, the fourth air guide member and the fifth air guide member are arranged between the end of the first heat pipe and the bottom housing at intervals, and the fourth air guide member and the fifth air guide member and the bottom housing form the first air duct; The sixth air guide is disposed between the end of the first heat pipe and the circuit board, and the sixth air guide, the first heat pipe and the circuit board form the second air duct; The seventh air guide member is disposed between the circuit board and the shell body, and forms the third air duct together with the circuit board and the shell body.

24. The electronic device according to any one of claims 15 to 23, characterized in that: There is a gap between the first heat conducting plate and the first heat exchanging element.

25. The electronic device according to any one of claims 1 to 24, characterized in that: The first heat conducting plate comprises a copper plate or an aluminum plate.

26. The electronic device according to any one of claims 1 to 25, characterized in that: The heating element comprises at least one of a power supply element, a power supply element of a video memory module, a video memory module and a charging element, the power supply element of the processor and the power supply element of the video memory module both comprise a power supply inductor and a power supply field effect transistor; the charging element comprises a charging inductor and a charging field effect transistor; At least one of the power supply field effect transistor, the charging field effect transistor and the video memory module is covered by the first heat pipe; At least one of the power supply inductor and the charging inductor is covered by the first heat conducting plate.

27. The electronic device according to any one of claims 1 to 26, characterized in that: Also includes a processor, the processor is disposed in the first housing and located between the two fans; The fan also has a second air outlet, and the housing is provided with a second outlet at a position opposite to the second air outlet; The heat dissipation module further includes a second heat conducting plate, a second heat pipe and two heat dissipating elements, wherein a heat dissipating element is disposed between the second air outlets of the two fans and the corresponding second outlets; the second heat conducting plate covers the processor, a portion of the second heat pipe covers the second heat conducting plate, and two ends of the second heat pipe extend to the two second air outlets respectively and are connected to the heat dissipating elements disposed at the second air outlets; At least one end of the first heat pipe is connected to the second heat pipe.

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