Cooling equipment and server

Abstract

The invention provides cooling equipment and a server. The liquid cooling equipment comprises a heat dissipation assembly and a soaking assembly, the heat dissipation assembly comprises a substrate with a circulation channel and a penetrating opening, and the penetrating opening penetrates through the substrate in the thickness direction of the substrate and communicates with the circulation channel; the circulation channel is configured to circulate a first cooling medium; the soaking assembly comprises a soaking plate and a cooling piece integrally formed with the soaking plate, the soaking plate is connected with the bottom face of the base plate, and the cooling piece is located in the penetrating opening; the vapor chamber comprises a containing cavity for containing a second cooling medium. The liquid cooling technology and the vacuum cavity vapor chamber heat dissipation technology are organically combined together, the second cooling medium located at the bottom of the containing cavity absorbs the heat of the to-be-cooled component, then evaporates and diffuses into the containing cavity, the heat is transmitted to the cooling piece, the heat exchanges heat with the first cooling medium in the heat dissipation assembly and is condensed into the liquid state, and the heat dissipation efficiency is improved. And therefore, the heat dissipation effect of the cooling equipment can be improved.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a cooling device and a server. Background Art

[0002] With the popularization and application of artificial intelligence technology, the demand for high-computing-power scenarios has been increasing continuously, causing the average power consumption of the chips inside the server to jump from 300W to over 1000W, thus leading to an increase in the server temperature and affecting the normal use of the server.

[0003] In related technologies, an air-cooling device or a liquid-cooling device is usually used to cool the chips inside the server for heat dissipation of the server. However, the air-cooling technology or the liquid-cooling technology can no longer meet the heat dissipation requirements of the chips inside the server. Summary of the Invention

[0004] Embodiments of this application provide a cooling device and a server.

[0005] In a first aspect, embodiments of this application provide a liquid-cooling device, including:

[0006] A heat dissipation component, the heat dissipation component includes a substrate having a flow channel and a through-hole, the through-hole penetrates the substrate along the thickness direction of the substrate and communicates with the flow channel; the flow channel is configured to flow a first cooling medium;

[0007] A heat spreading component, the heat spreading component includes a heat spreader and a cooling member integrally formed with the heat spreader, the heat spreader is connected to the bottom surface of the substrate, and the cooling member is located in the through-hole; the heat spreader includes a receiving cavity for receiving a second cooling medium;

[0008] Wherein, in the receiving cavity, the second cooling medium vaporized by heat moves towards the top of the receiving cavity, exchanges heat with the first cooling medium and condenses into a liquid state, and then flows back to the bottom of the receiving cavity.

[0009] The liquid cooling device provided in the embodiment of the present application includes a heat spreader assembly and a heat dissipation assembly, which organically combines liquid cooling technology and vacuum chamber heat spreader heat dissipation technology. After the second cooling medium located at the bottom of the accommodating cavity absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling element. This heat is exchanged with the first cooling medium in the heat dissipation assembly to condense into a liquid state, and then flows back to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in a three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction solution in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat, so it can take away the heat generated by the component to be cooled more quickly.

[0010] In addition, the heat spreader and the cooling element are integrally formed, that is, the cooling element can be directly processed on the surface of the heat spreader facing the substrate, and the cooling element can be directly located in the through hole of the substrate and directly contact the first cooling medium. Compared with the technical solution in the related art in which the cooling element is arranged on the substrate, the conduction path of the second cooling medium after being heated and vaporized is shortened, so that the second cooling medium after being heated and vaporized can quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device.

[0011] In a possible implementation, the heat spreader partially overlaps with the bottom surface of the substrate; wherein the projection of the through-hole on the heat spreader covers part of the heat spreader and at least covers the projection of the cooling element on the heat spreader; and the flow channel is distributed on opposite sides of the through-hole.

[0012] In a possible implementation, the vapor chamber at least completely overlaps with the bottom surface of the substrate; the cooling element is located in the middle of the vapor chamber;

[0013] The through-opening is located in the middle of the substrate and is arranged opposite to the cooling member; the flow channels are distributed on two opposite sides of the through-opening.

[0014] In a possible implementation, the cooling member includes a plurality of cooling channels, and the plurality of cooling channels are arranged at intervals along a first direction; the opening of each cooling channel faces the circulation channel and is connected to the circulation channel; wherein the first direction is perpendicular to the circulation channel.

[0015] In a possible implementation, the cooling element includes a plurality of fins, and the plurality of fins are arranged at intervals along the first direction; the cooling channel is formed between adjacent fins, and / or the cooling channel is provided in each of the fins.

[0016] In a possible implementation, the flow channel includes a first flow channel and a second flow channel. The first flow channel and the second flow channel are respectively located on both sides of the through hole and are symmetrically arranged with respect to the center line of the through hole. Wherein, the center line of the through hole is parallel to the first direction;

[0017] The first flow channel includes a first channel and at least two second channels. The first channel extends along the first direction; at least two of the second channels are arranged on a side of the first channel facing the through hole and communicate with the first channel.

[0018] In a possible implementation, the top surface of the cooling member located in the through hole is lower than the bottom surface of the flow channel.

[0019] In a possible implementation, the accommodation cavity is a vacuum chamber, and the accommodation cavity includes at least two relatively independently arranged sub-cavities. The bottom surfaces of at least two of the sub-cavities are all in contact with the component to be cooled, and the top surfaces of at least two of the sub-cavities are all in contact with the surface of the cooling member facing the substrate.

[0020] In a possible implementation, the heat dissipation assembly further includes a top plate. The top plate is arranged on the substrate to cover the flow channel and the through hole;

[0021] A liquid inlet pipe and a liquid outlet pipe are arranged on the top plate. One ends of the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the flow channel and are located on both sides of the cooling member.

[0022] In a possible implementation, the cooling device further includes an annular mounting plate and a locking member. The mounting plate is provided with a first mounting hole;

[0023] When the heat pipe at least completely coincides with the bottom surface of the substrate, a second mounting hole is provided on the heat pipe. The second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat pipe and sleeved on the outer peripheral surface of the substrate; the locking member passes through the first mounting hole and the second mounting hole in sequence and is fixedly connected to the circuit board;

[0024] Alternatively, when the heat pipe plate partially overlaps with the bottom surface of the substrate, the substrate includes a first substrate and a second substrate disposed on the first substrate, and the area of the second substrate is smaller than that of the first substrate; a third mounting hole is provided on the first substrate, and the third mounting hole is disposed opposite to the first mounting hole; the annular mounting plate is disposed on the first substrate and sleeved on the outer peripheral surface of the second substrate; the locking member is fixedly connected to the circuit board after passing through the first mounting hole and the third mounting hole in sequence.

[0025] In a possible implementation, the locking member includes a locking rod and an adapter sleeved on the locking rod;

[0026] The adapter includes an annular main body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular main body, and the plurality of elastic claws are spaced apart along the circumferential direction of the annular main body.

[0027] In a possible implementation, the locking member further includes an elastic member; the locking rod includes a first boss and a second boss disposed at intervals, and the second boss and the adapter are respectively located on both sides of the annular mounting plate;

[0028] The elastic member is sleeved on the locking rod and located between the first boss and the second boss.

[0029] In a second aspect, an embodiment of the present application provides a server, including a circuit board, a chip, and the cooling device according to any one of the first aspect; the chip is disposed on the circuit board; the cooling device is disposed on the circuit board, and at least the heat pipe plate of the cooling device is attached to the chip.

[0030] Since the server provided by the embodiment of the present application includes the cooling device of the first aspect, the effects of the cooling device of the first aspect are also possessed by the server of the embodiment of the present application, which will not be elaborated herein.

[0031] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought by the technical features of these technical solutions, other technical problems that can be solved by the cooling device and the server provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manners. Description of the Drawings

[0032] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0033] Figure 1 Explosion diagram of the cooling device provided by an embodiment of the present application;

[0034] Figure 2 For Figure 1 front view;

[0035] Figure 3 For Figure 1 top view;

[0036] Figure 4 Schematic diagram of the heat pipe and the substrate provided by an embodiment of the present application;

[0037] Figure 5 Schematic diagram of the heat pipe assembly provided by an embodiment of the present application;

[0038] Figure 6 For Figure 5 enlarged schematic diagram of area A in

[0039] Figure 7 Schematic diagram of the substrate provided by an embodiment of the present application;

[0040] Figure 8 Schematic diagram of the substrate and the cooling member provided by an embodiment of the present application;

[0041] Figure 9 Explosion diagram of the cooling device provided by another embodiment of the present application;

[0042] Figure 10 Schematic diagram of the heat pipe assembly provided by another embodiment of the present application;

[0043] Figure 11 For Figure 10 enlarged schematic diagram of area B in

[0044] Figure 12 Schematic diagram of the substrate provided by another embodiment of the present application;

[0045] Figure 13 Schematic diagram of the substrate and the cooling member provided by another embodiment of the present application;

[0046] Figure 14 Schematic diagram of the locking member provided by an embodiment of the present application;

[0047] Figure 15 Schematic diagram of an adapter provided by an embodiment of the present application;

[0048] Figure 16 Schematic diagram of a receiving cavity provided by an embodiment of the present application;

[0049] Figure 17 Schematic diagram of a server provided by an embodiment of the present application.

[0050] Reference numerals:

[0051] 100: Heat dissipation component;

[0052] 110: Substrate; 111: Flow channel; 1111: First flow channel; 1111a: First channel; 1111b: Second channel; 1112: Second flow channel; 112: Through hole; 113: First substrate; 1131: Third mounting hole; 114: Second substrate;

[0053] 120: Top plate; 121: Notch;

[0054] 130: Liquid inlet pipe; 140: Liquid outlet pipe;

[0055] 200: Heat spreader component; 210: Heat spreader plate; 211: Second mounting hole; 220: Cooling component; 221: Cooling channel; 230: Receiving cavity; 240: Partition;

[0056] 300: Mounting plate;

[0057] 400: Locking component; 410: Locking rod; 411: First boss; 412: Second boss; 420: Adapter; 421: Ring-shaped main body; 422: Elastic claw; 430: Elastic component;

[0058] 500: Circuit board;

[0059] 600: Chip. Detailed implementation manners

[0060] As described in the background art, the cooling effect of the cooling device is poor and cannot meet the heat dissipation requirements of the chips inside the server. After research by the inventor, it is found that the reason for this problem is that: the related art usually adopts a liquid cooling method for heat dissipation, that is, a radiator is arranged directly above the chip to absorb the heat generated by the chip. However, the material of the radiator is usually a metal material, such as copper or aluminum, and the thermal conductivity of copper or aluminum is not good enough to meet the heat dissipation requirements of the chips.

[0061] In view of this, embodiments of the present application provide a cooling device and a server, which organically combine liquid cooling technology and vapor chamber heat dissipation technology. After the second cooling medium located at the bottom of the accommodation chamber absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodation chamber, and transfers the heat to the cooling member. This heat exchanges heat with the first cooling medium in the heat dissipation assembly and condenses into a liquid state, and then flows back to the bottom of the accommodation chamber. On the one hand, the accommodation chamber adopts a vacuum design, and the second cooling medium after being heated and vaporized can conduct in three-dimensional space, simplifying the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the scheme of metal heat conduction in the related art, it has a larger conduction system, greatly improving the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodation chamber absorbs heat, vaporizes and condenses repeatedly, and needs to absorb a large amount of heat. Therefore, it can take away the heat generated by the component to be cooled faster.

[0062] In addition, the vapor chamber and the cooling member are integrally formed, that is, the cooling member can be directly processed on the surface of the vapor chamber facing the substrate, and the cooling member can be directly located in the through hole of the substrate and be in direct contact with the first cooling medium. Compared with the technical solution in the related art where the cooling member is arranged on the substrate, the conduction path of the second cooling medium after being heated and vaporized is shortened, enabling the second cooling medium after being heated and vaporized to quickly exchange heat and condense with the first cooling medium, improving the cooling effect of the cooling device.

[0063] In order to make the above objects, features, and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0064] Please refer to Att Figure 1 to Att Figure 16 , embodiments of the present application provide a cooling device, which is used to dissipate heat from the component to be cooled to ensure the normal operation of the component to be cooled. Exemplarily, the cooling device is used to dissipate heat from the chips of a server. The cooling device has strong heat dissipation performance and can quickly take away the heat generated by the chips of the server, ensuring the normal operation of the chips of the server.

[0065] The cooling device includes a heat dissipation component 100 and a heat spreader component 200, wherein the heat dissipation component 100 includes a substrate 110, the substrate 110 has a circulation channel 111 and a through hole 112, the circulation channel 111 is configured to circulate a first cooling medium, the circulation channel 111 and the through hole 112 are interconnected, so that the first cooling medium flows in the circulation channel 111 and the through hole. The through hole 112 penetrates the substrate 110 along the thickness direction of the substrate 110, so that the through hole 112 is a through hole connected from top to bottom, so as to accommodate the cooling member 220 of the heat spreader component 200.

[0066] The heat spreader assembly 200 includes a heat spreader plate 210 and a cooling member 220. The heat spreader plate 210 is connected to the bottom surface of the substrate 110, and the cooling member 220 is located in the through opening 112. The heat spreader plate 210 includes a receiving cavity 230 for receiving a second cooling medium (see the attached Figure 16 ), wherein the receiving cavity 230 of the heat spreader 210 is a vacuum cavity. It should be noted that, in a specific preparation process, the second cooling medium can be filled into the receiving cavity 230 and the receiving cavity 230 can be evacuated to form a vacuum in the receiving cavity 230.

[0067] In actual use, the cooling device is installed on the part to be cooled so that the heat spreader 210 fits the part to be cooled to dissipate the heat of the part to be cooled. In this embodiment, the liquid cooling technology and the vacuum chamber heat spreader heat dissipation technology are organically combined. After the second cooling medium at the bottom of the accommodating cavity absorbs the heat of the part to be cooled (for example, the chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling member 220. This heat is exchanged with the first cooling medium in the heat dissipation assembly 100 and condensed into liquid cooling, and refluxed to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction scheme in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat, so it can take away the heat generated by the part to be cooled more quickly.

[0068] The cooling member 220 is disposed on the vapor chamber 210 and is integrally formed with the vapor chamber 210. For example, a shovel or other processing tool may be used on the surface of the vapor chamber 210 facing the substrate 110 to form the cooling member 220 on the vapor chamber 210. In this embodiment, the cooling member may be located in the through hole 112 penetrating the substrate 110 and in direct contact with the first cooling medium.

[0069] In the related art, the cooling member is directly disposed on the substrate. Thus, the heat carried by the second cooling medium after being heated and vaporized needs to be first conducted to the lower surface of the substrate 110, and then conducted through the substrate 110 to the upper surface of the substrate 110 before it can exchange heat with the first cooling medium.

[0070] In this embodiment, the heat carried by the second cooling medium after being heated and vaporized is directly conducted to the cooling member 220, and the cooling member 220 is located within the through hole 112 and is in direct contact with the first cooling medium. With such a setting, the conduction path of the second cooling medium after being heated and vaporized is shortened, enabling the second cooling medium after being heated and vaporized to quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device. In addition, the cooling member 220 and the heat spreader 210 are integrally formed, which can simplify the welding process between the cooling member 220 and the heat spreader 210 and simplify the manufacturing process of the heat spreader assembly 200.

[0071] The heat spreader 210 may partially overlap with the bottom surface of the substrate 110, or may at least completely overlap with the bottom surface of the substrate 110. In a possible implementation, please refer to the attached Figures 4 to 8 , the heat spreader 210 partially overlaps with the bottom surface of the substrate 110. In other words, the heat spreader 210 is a small-sized structural member, and the area of the heat spreader 210 is smaller than the area of the substrate 110.

[0072] The cooling member 220 is formed on the surface of the heat spreader 210. Among them, the projection of the through hole 112 on the heat spreader 210 covers a part of the heat spreader 210 and at least covers the projection of the cooling member 220 on the heat spreader 210. That is to say, the area of the through hole 112 is smaller than the area of the heat spreader 210 and larger than the area of the cooling member 220. With such a setting, it is convenient for the heat spreader 210 to both cover the bottom of the through hole 112 and install the cooling member 220 into the through hole 112.

[0073] The flow channels 111 are distributed on opposite sides of the through hole 112. That is to say, the flow channels 111 located on one side of the through hole 112 are used to circulate the relatively low-temperature first cooling medium; the flow channels 111 located on the other side of the through hole 112 are used to circulate the first cooling medium that absorbs heat, so that the first cooling medium forms a circulating flow between the flow channels 111 and the through hole 112.

[0074] In this embodiment, the heat spreader 210 is a small-sized structural member, and the heat spreader 210 can be directly disposed on the surface of the main component to be cooled. For example, the heat spreader 210 can be directly disposed on the chip of the circuit board and adhered to the chip. With such a setting, it is possible to both cool the main component to be cooled in a timely and effective manner and reduce the manufacturing cost of the heat spreader assembly 200, thereby reducing the manufacturing cost of the cooling device.

[0075] In another possible implementation, please refer to the attached Figure 9 to the attached Figure 13 , the vapor chamber 210 at least completely coincides with the bottom surface of the substrate 110. In this way, the vapor chamber 210 can be used to provide support for the substrate 110. In one example, the vapor chamber 210 may only completely coincide with the bottom surface of the substrate 110, that is, the area of the vapor chamber 210 is equal to the area of the substrate 110. In another example, the area of the vapor chamber 210 is larger than the area of the substrate 110.

[0076] The cooling member 220 is located in the middle of the vapor chamber 210, the through hole 112 is located in the middle of the substrate 110, and is disposed opposite to the cooling member 220; the flow channels 111 are distributed on opposite sides of the through hole 112. That is to say, the flow channels 111 on one side of the through hole 112 are used to circulate the first cooling medium at a lower temperature; the flow channels 111 on the other side of the through hole 112 are used to circulate the first cooling medium after absorbing heat, so that the first cooling medium forms a circulating flow between the flow channels 111 and the through hole 112. It should be noted that the middle of the vapor chamber 210 in this embodiment may refer to the central area of the vapor chamber 210, or may refer to the area adjacent to the central area of the vapor chamber 210.

[0077] When the cooling device in this example is used to dissipate heat from the circuit board of the server, the chip is the main component to be cooled, but other components on the circuit board will also generate a certain amount of heat. The area of the vapor chamber 210 in this embodiment is relatively large and can cover most of the circuit board. In this way, it can not only quickly and effectively dissipate heat from the chip, but also help dissipate heat from other components on the circuit board, improving the overall heat dissipation effect of the circuit board of the server.

[0078] It should be noted that when the vapor chamber 210 partially coincides with the bottom surface of the substrate 110, or when the vapor chamber 210 at least completely coincides with the bottom surface of the substrate 110, the structures of the corresponding substrate 110 are different.

[0079] In one example, please refer to the attached Figure 7 , when the vapor chamber 210 partially coincides with the bottom surface of the substrate 110, the substrate 110 includes a first substrate 113 and a second substrate 114. The second substrate 114 is disposed on the first substrate 113, and the area of the second substrate 114 is smaller than the area of the first substrate 113, that is, the shape of the substrate 110 is convex.

[0080] The through hole 112 is disposed at the center of the second substrate 114, and the through hole 112 penetrates the first substrate 113 and the second substrate 114 along the thickness direction of the substrate 110; the flow channels 111 are located on opposite sides of the through hole 112 and are formed on the second substrate 114. That is to say, along the attachedFigure 7 In the X direction, the flow passage 111 is located on both sides of the through port 112 in the X direction, that is, a part of the flow passage 111 is located on the left side of the through port 112, and the remaining flow passage 111 is located on the right side of the through port 112.

[0081] In another example, please refer to the attached Figure 12 When the heat sink 210 coincides at least with the entire bottom surface of the substrate 110, the shape of the substrate 110 is the same as the shape of the second substrate 114 in the above example. At this time, the through port 112 and the flow passage 111 are both formed on the substrate 110.

[0082] In this embodiment, the cooling member 220 can be a plate heat exchanger or a microchannel heat exchanger. Exemplarily, please refer to the attached Figure 5 and the attached Figure 6 and the attached Figure 10 and the attached Figure 11 and the attached Figure 5 and the attached Figure 10 In the Y direction in.

[0083] The opening of each cooling channel 221 faces the flow passage 111 and is in communication with the flow passage 111 so that the first cooling medium can flow in the cooling channel 221. It should be noted that when the flow passage 111 includes a first flow passage 1111 and a second flow passage 1112, the first flow passage 1111 and the second flow passage 1112 are respectively located on both sides of the through port 112. At this time, each cooling channel 221 has two openings, one opening faces the first flow passage 1111 and is in communication with the first flow passage 1111, and the other opening faces the second flow passage 1112 and is in communication with the second flow passage 1112. Such a setting can make one opening serve as the inlet of the cooling channel 221 and the other opening serve as the outlet of the cooling channel 221, so as to facilitate the circulation of the first cooling medium in the flow passage and the cooling channel 221.

[0084] In this embodiment, the cooling member 220 includes a plurality of cooling channels 221, and the first cooling medium can flow in each cooling channel 221 and exchange heat with the heat transferred to the cooling member 220, so that the second cooling medium after being heated and vaporized can quickly exchange heat and condense with the first cooling medium, improving the cooling effect of the cooling device.

[0085] Among them, the multiple cooling channels 221 can be formed in the cooling member 220 in various forms. For example, the cooling member 220 can be a plate structure, and the multiple cooling channels 221 can be formed in the cooling member 220 so that multiple micro-channels are formed inside the cooling member 220. Another example is that the cooling member 220 includes multiple fins, the multiple fins are arranged at intervals along the first direction, and each fin extends along the second direction, and the first direction and the second direction intersect. That is to say, the first direction and the second direction are two intersecting directions in the plane where the substrate 110 is located. A cooling channel 221 is formed between adjacent fins, and / or a cooling channel 221 is provided in each fin. In other words, the cooling channel 221 can be simply composed of the area between adjacent fins; or, the cooling channel 221 can be simply formed inside each fin; or, the cooling channel 221 is simultaneously composed of the area between adjacent fins; and the cooling channel 221 is provided inside each fin.

[0086] For the convenience of describing the flow channels 111 on both sides of the through-port 112, the flow channels 111 may be divided so that the flow channels 111 include a first flow channel 1111 and a second flow channel 1112. The first flow channel 1111 and the second flow channel 1112 are respectively located on both sides of the through-port 112, and the first flow channel 1111 and the second flow channel 1112 are symmetrically arranged with respect to the center line of the through-port 112. Among them, the center line of the through-port 112 is parallel to the first direction, and the center line of the through-port 112 can be the Figure 7 S line in the figure. The first flow channel 1111 and the second flow channel 1112 are symmetrically arranged. On the one hand, it is convenient for the preparation of the first flow channel 1111 and the second flow channel 1112, and simplifies the preparation process; on the other hand, it can balance the flow velocity of the first cooling medium in the first flow channel 1111 and the second flow channel 1112, and improve the cooling effect of the cooling device.

[0087] In this example, the first flow channel 1111 includes a first channel 1111a and at least two second channels 1111b. The first channel 1111a extends along the first direction; at least two second channels 1111b are arranged on the side of the first channel 1111a facing the through-port 112 and communicate with the first channel 1111a. Among them, at least two second channels 1111b can be arranged at intervals along the first direction, and at least two second channels 1111b can be parallel to each other or relatively inclined. Exemplarily, each second channel 1111b extends along the second direction so that at least two second channels 1111b are parallel to each other.

[0088] At least two second channels 1111b divide the first cooling medium flowing through the first channel 1111a into at least two flow directions, which can reduce the impact force of the first cooling medium on the fins of the cooling member 220. This can not only reasonably adjust the flow rate and velocity of the first cooling medium in the cooling channel 221, but also reduce the damage to the fins of the cooling member 220, thereby increasing the service life of the fins of the cooling member 220.

[0089] In a possible implementation, the top surface of the cooling member 220 located within the through port 112 is lower than the bottom surface of the flow-through channel 111. That is to say, there is a height difference between the top surface of the cooling member 220 and the bottom surface of the flow-through channel 111.

[0090] In this embodiment, the second flow-through channel may be regarded as the liquid inlet end of the first cooling medium, and the first flow-through channel may be regarded as the liquid outlet end of the first cooling medium; when the first cooling medium flows through the second flow-through channel to the through port 112, in view of the fact that the top surface of the cooling member 220 within the through port 112 is lower than the bottom surface of the flow-through channel 111, the flow rate of the first cooling medium in the through port 112 can be slowed down, increasing the flow time of the first cooling medium at the through port 112, providing more sufficient heat exchange time for the first cooling medium and the vaporized second cooling medium, and improving the heat exchange effect of the cooling device.

[0091] In a possible implementation, please refer to the attached Figure 15 , the accommodation cavity 230 is a vacuum chamber, and the accommodation cavity 230 includes at least two relatively independent sub-chambers. For example, a partition 240 is provided within the accommodation cavity 230, and the partition 240 divides the accommodation cavity 230 into at least two relatively independent sub-chambers.

[0092] Among them, in the direction perpendicular to the bottom surface of the heat sink 210, one end of the partition 240 is connected to the bottom surface of the heat sink 210, and the other end of the partition is connected to the top surface of the heat sink 210, so that the bottom surface of each formed sub-chamber is in contact with the component to be cooled, and the top surface is in contact with the surface of the cooling member 220 facing the substrate 110. With such a setting, the second cooling medium in each sub-chamber can absorb the heat of the component to be cooled and vaporize, and the vaporized second cooling medium can move towards the top of the sub-chamber, exchange heat with the first cooling medium and condense into a liquid state, and the liquid second cooling medium returns to the bottom of the sub-chamber under the action of its own gravity. When one of the sub-chambers fails, the other sub-chamber can still maintain operation and complete the cooling function of the heat sink, enabling the cooling device to normally perform the cooling function.

[0093] It should be noted that the partition 240 can be a flat plate. The partition 240 can be perpendicular to the bottom surface of the heat pipe 210, or can be inclined with respect to the direction perpendicular to the bottom surface of the heat pipe 210, so that at least two sub-chambers are regular in shape. The partition 240 can also be an irregular shape, so that at least two sub-chambers are irregular in shape.

[0094] In a possible implementation, the heat dissipation component 100 further includes a top plate 120. The top plate 120 is disposed on the substrate 110 to cover the flow channel 111 and the through hole 112. Such an arrangement can prevent the first cooling medium from overflowing from the flow channel 111 and ensure the normal use of the heat dissipation component 100.

[0095] Wherein, a liquid inlet pipe 130 and a liquid outlet pipe 140 are provided on the top plate 120. One ends of the liquid inlet pipe 130 and the liquid outlet pipe 140 are respectively communicated with the flow channel 111 and are located on both sides of the cooling member 220. In other words, one end of the liquid inlet pipe 130 is communicated with the second flow channel 1112, and one end of the liquid outlet pipe 140 is communicated with the first flow channel 1111. In order to increase the flow path of the first cooling medium in the flow channel 111, the liquid inlet pipe 130 and the liquid outlet pipe 140 are located on a diagonal line of the top plate 120. It should be noted that the other ends of the liquid outlet pipe 140 and the liquid inlet pipe 130 can also be respectively connected to a storage tank for storing the first cooling medium to ensure the normal use of the cooling device.

[0096] At least two notches 121 are spaced apart on the top plate 120. The at least two notches 121 penetrate the top plate 120 along the thickness direction of the top plate 120 and are not communicated with the flow channel 111 and the through hole 112. That is, the projection area of the notch 121 on the substrate 110 is misaligned with the flow channel 111 and the through hole 112, preventing the first cooling medium in the flow channel 111 and the through hole 112 from overflowing and improving the safety of the cooling device.

[0097] It should be noted that the cooling device disclosed in the embodiments of the present application needs to be installed on a component to be cooled. For example, it needs to be installed on a circuit board. Therefore, the cooling device disclosed in the embodiments of the present application further includes a mounting plate 300 and a locking member 400.

[0098] Exemplarily, please refer to the attached Figure 1 and the attached Figure 9 , the mounting plate 300 is an annular member, and a first mounting hole (not shown in the figure) is provided on the mounting plate 300. One end of the locking member 400 sequentially passes through the first mounting hole and other mounting holes provided on the cooling device and is fixedly connected to the component to be cooled.

[0099] It should be understood that when the structure of the heat sink 210 is different from that of the substrate 110, the positions of other mounting holes are also different. In one example, please continue to refer to the attached Figure 1 and the attached Figure 2 , when the bottom surface of the heat sink 210 partially coincides with the bottom surface of the substrate 110, at this time, the substrate 110 includes a first substrate 113 and a second substrate 114 disposed on the first substrate 113, and the area of the second substrate 114 is smaller than the area of the first substrate 113.

[0100] At this time, a third mounting hole 1131 is provided on the first substrate 113, and the third mounting hole 1131 is disposed opposite to the first mounting hole.

[0101] The annular mounting plate 300 is disposed on the first substrate 113 and sleeved on the outer peripheral surface of the second substrate 114; the locking member 400 is fixedly connected to the circuit board after passing through the first mounting hole and the third mounting hole 1131 in sequence.

[0102] In another example, please refer to the attached Figure 9 , when the heat sink 210 at least completely coincides with the bottom surface of the substrate 110, at this time, a second mounting hole 211 is provided on the heat sink 210, and the second mounting hole 211 is disposed opposite to the first mounting hole; the annular mounting plate 300 is disposed on the heat sink 210 and sleeved on the outer peripheral surface of the substrate 110; the locking member 400 is fixedly connected to the circuit board after passing through the first mounting hole and the second mounting hole 211 in sequence.

[0103] Please refer to the attached Figure 14 , wherein, the locking member 400 includes a locking rod 410 and an adapter 420, the adapter 420 is sleeved on the locking rod 410, wherein, the adapter 420 is located below the mounting plate 300 and within the second mounting hole 211 or the third mounting hole 1131, and is used to be adapted to the second mounting hole 211 or the third mounting hole 1131.

[0104] Please refer to the attached Figure 15 , the adapter 420 includes an annular main body 421 and a plurality of elastic claws 422; the plurality of elastic claws 422 are connected to the inner surface of the annular main body 421, and the plurality of elastic claws 422 are arranged at intervals along the circumferential direction of the annular main body 421. Wherein, the end of each elastic claw 422 facing away from the annular main body 421 extends towards the center of the annular main body 421, so that the diameter of the area surrounded by the plurality of elastic claws 422 gradually decreases in the direction away from the annular main body 421. With such a setting, the adapter 420 can be adapted to locking rods 410 of different sizes, and the connection strength between the heat sink 210 or the substrate 110 and the locking member 400 can be improved.

[0105] The locking member 400 further includes an elastic member 430; the elastic member 430 may include a spring. Among them, the locking rod 410 includes a first boss 411 and a second boss 412 arranged at intervals, and the second boss 412 and the adapter 420 are respectively located on both sides of the annular mounting plate 300. Taking the attached Figure 1 orientation as an example, the second boss 412 is located above the mounting plate 300, and the adapter 420 is located below the annular mounting plate 300.

[0106] The elastic member 430 is sleeved on the locking rod 410 and is located between the first boss 411 and the second boss 412, which can buffer the installation force, reduce the damage to the circuit board, and improve the service life of the circuit board.

[0107] The embodiment of the present application also provides a server. Please refer to the attached Figure 16 , this server includes a circuit board 500, a chip 600, and the cooling device described in any of the above embodiments.

[0108] Among them, the chip 600 is arranged on the circuit board 500; the cooling device is arranged on the circuit board 500, and the heat dissipation plate 210 of the cooling device at least adheres to the chip.

[0109] Since the server provided by the embodiment of the present application includes the cooling device described in any of the above embodiments, the server of the embodiment of the present application also has the effects of the cooling device described in any of the above embodiments, which will not be elaborated here.

[0110] It should be noted that other components on the circuit board 500 can also be dissipated heat through the cooling device. For example, other components can be in contact with the bottom surface of the heat dissipation plate 210 through a heat-conducting material to conduct the heat generated by other components to the heat dissipation plate 210.

[0111] In the description of the embodiment of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiment of the present application can be understood according to specific situations.

[0112] In the embodiment of the present application or the device or element implied must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the embodiment of the present application. In the description of the embodiment of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically specified.

[0113] In the description and claims of the embodiments of the present application and the above-mentioned drawings, the terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "may include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or devices.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application and are not intended to limit them. Although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling device, characterized in that, comprising: a heat dissipation component, the heat dissipation component includes a substrate having a circulation channel and a through hole, the through hole penetrates the substrate along the thickness direction of the substrate, and is communicated with the circulation channel; the circulation channel is configured to circulate a first cooling medium; a heat spreading component, the heat spreading component includes a heat spreader and a cooling member integrally formed with the heat spreader, the heat spreader is connected to the bottom surface of the substrate, and the cooling member is located in the through hole; the heat spreader includes a receiving cavity for receiving a second cooling medium; wherein, in the receiving cavity, the second cooling medium vaporized by heat moves towards the top of the receiving cavity, exchanges heat with the first cooling medium and condenses into a liquid state, and then flows back to the bottom of the receiving cavity.

2. The cooling device according to claim 1, characterized in that, the heat spreader partially coincides with the bottom surface of the substrate; wherein, the projection of the through hole on the heat spreader covers a part of the heat spreader, and at least covers the projection of the cooling member on the heat spreader; the circulation channels are distributed on opposite sides of the through hole.

3. The cooling device according to claim 1, characterized in that, the heat spreader at least completely coincides with the bottom surface of the substrate, and the cooling member is located in the middle of the heat spreader; the through hole is located in the middle of the substrate and is disposed opposite to the cooling member; the circulation channels are distributed on opposite sides of the through hole.

4. The cooling device according to any one of claims 1-3, characterized in that, the cooling member includes a plurality of cooling channels, and the plurality of cooling channels are arranged at intervals in a first direction; the opening of each cooling channel faces the circulation channel and is communicated with the circulation channel; wherein, the first direction is perpendicular to the circulation channel.

5. The cooling device according to claim 4, characterized in that, the cooling member includes a plurality of fins, and the plurality of fins are arranged at intervals in the first direction; the cooling channels are formed between adjacent fins, and / or, each fin is provided with a cooling channel therein.

6. The cooling device according to claim 5, characterized in that, the circulation channel includes a first circulation channel and a second circulation channel, the first circulation channel and the second circulation channel are respectively located on both sides of the through hole and are symmetrically arranged with respect to the center line of the through hole, wherein, the center line of the through hole is parallel to the first direction; the first circulation channel includes a first channel and at least two second channels, the first channel extends along the first direction; at least two second channels are arranged on the side of the first channel facing the through hole and are communicated with the first channel.

7. The cooling device according to any one of claims 1-3, characterized in that, the top surface of the cooling member located in the through hole is lower than the bottom surface of the circulation channel.

8. The cooling device according to any one of claims 1-3, characterized in that, The accommodating cavity is a vacuum chamber, and the accommodating cavity includes at least two relatively independently arranged sub-chambers. The bottom surfaces of at least two of the sub-chambers are all in contact with the component to be cooled, and the top surfaces of at least two of the sub-chambers are all in contact with the surface of the cooling member facing the substrate.

9. The cooling device according to any one of claims 1-3, characterized in that the heat dissipation assembly further includes a top plate, and the top plate is arranged on the substrate to cover the flow channel and the through port; a liquid inlet pipe and a liquid outlet pipe are arranged on the top plate, and one ends of the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the flow channel and are located on both sides of the cooling member.

10. The cooling device according to claim 2 or 3, characterized in that the cooling device further includes an annular mounting plate and a locking member, and the mounting plate is provided with a first mounting hole; when the heat sink plate completely coincides with at least the bottom surface of the substrate, the heat sink plate is provided with a second mounting hole, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat sink plate and sleeved on the outer peripheral surface of the substrate; the locking member passes through the first mounting hole and the second mounting hole in sequence and is fixedly connected to the circuit board; alternatively, when the heat sink plate partially coincides with the bottom surface of the substrate, the substrate includes a first substrate and a second substrate arranged on the first substrate, and the area of the second substrate is smaller than the area of the first substrate; the first substrate is provided with a third mounting hole, and the third mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the first substrate and sleeved on the outer peripheral surface of the second substrate; the locking member passes through the first mounting hole and the third mounting hole in sequence and is fixedly connected to the circuit board.

11. The cooling device according to claim 10, characterized in that the locking member includes a locking rod and an adapter sleeved on the locking rod; the adapter includes an annular main body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular main body, and the plurality of elastic claws are arranged at intervals along the circumferential direction of the annular main body.

12. The cooling device according to claim 11, characterized in that the locking member further includes an elastic member; the locking rod includes a first boss and a second boss arranged at intervals, and the second boss and the adapter are respectively located on both sides of the annular mounting plate; the elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

13. A server, characterized in that it includes a circuit board, a chip, and the cooling device according to any one of claims 1-12; the chip is arranged on the circuit board; the cooling device is arranged on the circuit board, and the heat sink plate of the cooling device at least adheres to the chip.

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