A fully automatic vacuum and oxygen-free oven

Abstract

The present invention provides a fully automatic vacuum and oxygen-free oven, belonging to the technical field of wafer processing. It solves the technical problems of low loading and unloading efficiency and low heating and baking efficiency of the existing wafer oven, as well as low automation degree. This fully automatic vacuum and oxygen-free oven includes an oven frame assembly, an EFEM frame assembly, two vacuum pump assemblies, and four wafer loaders evenly distributed at equal intervals. Four cavity assemblies and four automatic door assemblies are provided inside the oven frame assembly. A robot transfer assembly and a machine control box are provided inside the EFEM frame assembly. A main control machine is provided on the left side of the EFEM frame assembly. The cavity assemblies are connected to the vacuum pump assemblies on the same side through air extraction pipelines, and the cavity assemblies are connected to an external high-purity nitrogen source. The whole process of the present invention realizes the fully automatic and stable grasping and loading, vacuum pumping, heating, constant temperature process baking, dual-mode cooling, and wafer unloading of wafers in an oxygen-free and high-precision temperature control environment through the cooperation of multiple sensors, mechanical linkage, and a gas-liquid cooling system.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing and relates to a fully automatic vacuum and oxygen-free oven. Background Art

[0002] A wafer is the basic material for manufacturing semiconductor chips. The most important raw material for semiconductor integrated circuits is silicon, so correspondingly it is a silicon wafer. In the prior art, during the process of producing wafers, it is often necessary to place the wafers into a baking device, and through the appropriate temperature of the baking tray, physical or chemical transformations such as the photoresist on the wafers are carried out, such as thermal curing and the like.

[0003] The baking of wafers is one of the processes in semiconductor processing. Currently, the most commonly used oven is a vacuum oven. Most of the existing vacuum ovens are single-chamber ovens with limited production capacity; they do not have an oxygen content detection function and do not meet the requirements of the prior art; they do not have an automatic product transfer function, which will affect the particle size problem in the chamber and lead to product scrapping; there is only external air duct air cooling for temperature reduction, and the cooling rate is relatively low; it requires manual opening and closing of the chamber door, consuming labor; most of the existing ovens are in the hot air circulation mode, occupying a large space, with complex sealing, and unable to achieve a vacuum environment.

[0004] Therefore, we propose a fully automatic vacuum and oxygen-free oven, which realizes the full-automatic and stable grasping and loading, vacuum pumping, heating, constant-temperature process baking, dual-mode cooling and unloading of wafers in an oxygen-free and high-precision temperature control environment through the cooperation of multiple sensors, mechanical linkage and gas-liquid cooling system. Summary of the Invention

[0005] The purpose of the present invention is to address the above problems existing in the prior art and propose a fully automatic vacuum and oxygen-free oven. The technical problem to be solved by this invention is: how to realize the full-automatic and stable grasping and loading, vacuum pumping, heating, constant-temperature process baking, dual-mode cooling and unloading of wafers in an oxygen-free and high-precision temperature control environment through the cooperation of multiple sensors, mechanical linkage and gas-liquid cooling system.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A fully automatic vacuum and oxygen-free oven, comprising an oven frame assembly, an EFEM frame assembly connected to the front side of the oven frame assembly, vacuum pump assemblies symmetrically arranged on the left and right sides of the oven frame assembly, and four equally spaced and evenly distributed wafer loaders located in front of the EFEM frame assembly. Four cavity assemblies and four automatic door assemblies are arranged at the four corners inside the oven frame assembly. Two cavity assemblies at the same height are symmetrically arranged left and right, and two automatic door assemblies at the same height are symmetrically arranged left and right. The positions of the automatic door assemblies correspond to those of the cavity assemblies, and the automatic door assemblies are located in front of the cavity assemblies. A robot transfer assembly and a machine control box are arranged inside the EFEM frame assembly. A main control machine is arranged on the left side of the EFEM frame assembly. The cavity assemblies are connected to the vacuum pump assemblies on the same side through air extraction pipelines, and the cavity assemblies are connected to an external high-purity nitrogen source.

[0008] Working principle of the present invention: An operator or an automated system places a wafer cassette on four equally spaced wafer loaders and prepares to enter the baking process; the EFEM frame assembly maintains a clean positive pressure environment inside to prevent external contamination from entering; the robotic transfer assembly grabs the wafer from the wafer loader; transports the wafer to the front of the automatic door assembly of the target chamber assembly and waits for the chamber to be ready; after receiving a signal, the automatic door assembly of the target chamber assembly opens, and the robotic transfer assembly sends the wafer into the chamber assembly. After the wafer is in place, the automatic door assembly immediately closes to ensure the sealing of the chamber assembly and prepares for vacuum pumping; the symmetrically distributed vacuum pump assemblies are started to quickly pump out the air in the chamber assembly to reach the set vacuum level. The temperature in the chamber assembly rises according to a preset temperature curve, and the main controller adjusts it in real time through the PID algorithm to ensure temperature control accuracy; the wafer completes processes such as baking, annealing, or drying in a constant temperature environment, and the time is set by the program; after the heating is completed, the chamber assembly stops heating and starts to cool down. After the wafer cools down naturally with the chamber assembly for 10 minutes, an external high-purity nitrogen source fills the chamber assembly with nitrogen to accelerate the cooling. After the cooling is completed; after reaching a safe temperature, an external high-purity nitrogen source fills the chamber assembly with nitrogen to restore normal pressure and prepares for wafer extraction; after the pressure in the chamber assembly is balanced, the automatic door assembly opens, and the robotic transfer assembly enters to grab the wafer that has completed the process and sends the wafer back to the designated position of the wafer loader to complete a processing cycle; the automatic door assembly closes, and the vacuum pump assemblies standby, waiting for the next batch of wafers to be sent in. If other chamber assemblies are idle, the robotic transfer assembly can process multiple wafers in parallel to improve efficiency; the nitrogen chamber process flow is optional: if required by the process, high-purity nitrogen can be introduced to replace the residual oxygen to ensure an oxygen-free environment, that is, after the wafer transfer is completed, the automatic door assembly closes, the vacuum pump assembly is started to pump vacuum. After the oxygen content and pressure value reach the standard, the set temperature and flow opening are set, and then the heating starts. After the process is completed, the external air duct air-cooling blower is turned on, the heating tube stops heating, and the cooling starts. After the cooling is completed, the automatic door assembly opens, and the robotic transfer assembly takes out the wafer from the chamber assembly; the whole process runs automatically and is jointly controlled by the main controller and the machine control box to ensure a high-precision, oxygen-free, and pollution-free process environment.

[0009] The oven frame assembly includes an oven frame main body. Inside the oven frame main body, there are four independent cavity placement areas distributed at the four corners. Inside the oven frame main body, there are water-cooling units symmetrically arranged on both sides. Four blowers are fixed inside the oven frame main body. On both the left and right sides of the oven frame main body, there are several through-board connection pipes evenly distributed at equal intervals up and down. A liquid leakage detection component is provided at the bottom side inside the oven frame main body.

[0010] With the above structure, the oven frame body is the supporting core structure, which is internally divided into four independent cavity placement areas, each area accommodating a cavity component to achieve multi-wafer parallel processing; the water cooling unit is used for cooling the cavity component and cooling the evacuated hot gas to ensure the long-term stable operation of the equipment; four blowers respectively correspond to the cavity placement areas, used for cooling the cavity component and accelerating the cooling of the wafer; the external high-purity nitrogen gas source of the through-board connecting pipe is used to connect the vacuum pump component, nitrogen, gas injection system and electrical circuit to ensure the integration and sealing of the functional modules, and the liquid leakage detection component monitors whether the bottom of the oven frame body leaks coolant or chemical liquid to trigger an alarm to protect the safety of the wafer.

[0011] The cavity component includes two cavity support frames, the two cavity support frames are fixed at the lower ends of the cavity placement areas at corresponding positions, mica heat insulation plates are fixed at the upper ends of the two cavity support frames, a hollow furnace cavity is fixed at the upper ends of the two mica heat insulation plates, the hollow furnace cavity is a box body with an opening at the front side, a hollow air duct is formed between the inner cavity wall and the outermost wall of the hollow furnace cavity, heating pipe shields are arranged on the upper, lower, left and right sides inside the hollow furnace cavity, a heating interval is formed between the heating pipe shield and the hollow furnace cavity, heating pipe fittings are arranged inside the heating interval, thermocouple fixing blocks are arranged on the left and right sides inside the hollow furnace cavity, an adjustment substrate is arranged at the upper end of the lower heating pipe shield, a metal boat is detachably arranged at the upper end of the adjustment substrate, air inlet pipes and exhaust pipes are arranged on the outer side parts of the hollow furnace cavity, the air inlet pipes and the exhaust pipes are both communicated with the hollow air duct of the hollow furnace cavity to form a heat dissipation channel, the air inlet pipe is connected to the air outlet end of the blower at the same position, a flow regulating blade is rotatably arranged inside the exhaust pipe, an electric butterfly valve is arranged on the exhaust pipe, and the control shaft of the electric butterfly valve is in transmission connection with the rotating shaft of the flow regulating blade; a sealing ring and a water jacket pipe are arranged at the front side opening of the hollow furnace cavity, the sealing ring abuts against the outer side of the water jacket pipe, and two water guide pipes are connected between the water jacket pipes of the two cavity components and the water cooling unit on the same side.

[0012] With the above structure, the cavity support frame provides mechanical support to ensure the stability of the hollow furnace cavity. The mica heat insulation board isolates the heat conduction downward from the heating area, protecting the main body of the oven frame and the equipment below. The heating pipe fittings are evenly distributed in the heating area formed by the heating pipe shield and the inner wall of the hollow furnace cavity. After being powered on, they radiate heat to form a uniform temperature field. The thermocouple fixing block is used to fix the thermocouple, monitor the temperature of the hollow furnace cavity in real time and feedback it to the main control unit to achieve precise PID temperature control. The metal boat and the adjustment substrate can be quickly replaced to adapt to different process requirements. The metal boat ensures a constant distance between the wafer and the heating pipe fittings to avoid uneven heating. The sealing ring and the automatic door assembly are pressed together to form an airtight seal to prevent air leakage. The water jacket pipe surrounds the opening of the hollow furnace cavity, and the internal circulating cooling water is connected to the water cooling unit through the water guiding pipe to reduce the temperature of the sealing ring, prevent high-temperature aging and ensure long-term sealing reliability. The blower injects cold air into the hollow air duct of the hollow furnace cavity through the air inlet pipe. The air flow takes away the heat through the heating area. The regulating blade of the exhaust pipe adjusts the opening degree through the electric butterfly valve to control the exhaust rate and achieve gradient cooling. The hot air is discharged from the exhaust pipe to ensure efficient heat dissipation. The water cooling unit synchronously cools the outer wall of the furnace cavity to avoid thermal deformation.

[0013] A cavity vacuum pipeline, a nitrogen pipeline, a transmitter pipeline, two symmetrically arranged four-core thermocouple pipelines and eight hollow pipelines are provided at the rear side of the hollow furnace cavity and are connected to it. The cavity vacuum pipeline is sequentially connected with an oxygen analyzer and a baffle valve. The nitrogen pipeline is sequentially connected with a high-vacuum solenoid valve, an MFC, a medium-vacuum solenoid valve and a combination unit and then connected to an external high-purity nitrogen source. A pressure transmitter is connected to the transmitter pipeline. A number of circumferentially distributed bendable thermocouple wires are arranged inside each of the four-core thermocouple pipelines. The bendable thermocouple wires are fixed on the thermocouple fixing blocks on the same side. A welded knife-edge flange is fixed at the end of the hollow pipeline. External threaded tension bolts are arranged inside each of the hollow pipelines. The external threaded tension bolts are sleeved on the heating pipe fittings, and the ends of the external threaded tension bolts extend out of the welded knife-edge flange. An oxygen-free copper gasket sealing ring is sleeved on the external threaded tension bolts. The oxygen-free copper gasket sealing ring is located inside the hollow pipeline and abuts between the external threaded tension bolt and the welded knife-edge flange. A pull plate flange is screwed on the external threaded tension bolt. The pull plate flange abuts on the welded knife-edge flange to externally tension the external threaded tension bolt. Insulating rings are arranged at the ends of the heating pipe fittings. Two self-locking nuts are screwed at the ends of the heating pipe fittings. The inner self-locking nut abuts and locks on the insulating ring.

[0014] With the above structure, the cavity vacuum pipeline is connected to the vacuum pump assembly to create a vacuum environment for the gas in the hollow furnace cavity. The oxygen analyzer monitors the residual oxygen concentration in the cavity in real time to ensure an oxygen-free process condition. The baffle valve regulates the gas flow during vacuum pumping or vacuum breaking. In case of emergency, it can quickly cut off the pipeline to protect the vacuum pump assembly and prevent vacuum backflow. The nitrogen gas pipeline is connected to an external high-purity nitrogen gas source, used to flush the hollow furnace cavity before the process to stably control the replacement of residual oxygen, and stably control the injection of nitrogen during vacuum breaking after the process to avoid the oxidation of the wafer when it comes into contact with air. The pressure transmitter detects the real-time pressure of the furnace cavity through the transmitter pipe and feeds it back to the main control unit to jointly control the vacuum pump assembly and nitrogen injection. The four-core thermocouple pipes arranged symmetrically on the left and right contain multiple bendable thermocouple wires, which extend into the furnace cavity and are fixed to the thermocouple fixing blocks to monitor the temperature distribution of the furnace cavity at multiple points, such as the temperature difference between the center and the edge, to ensure that the temperature field uniformity is within ±1°C and prevent the temperature from changing due to position deviation. The welded knife-edge flange is fixed at the end of the hollow pipe and connected to an external power supply / cooling system. The oxygen-free copper gasket seal is placed inside the hollow pipe and pressed against the welded knife-edge flange by the externally threaded tightening bolts to achieve vacuum sealing with high temperature resistance and anti-creep properties. The pull plate flange is screwed onto the tightening bolts to apply tension from the outside to enhance the sealing pressure. The insulating ring isolates the heating pipe fittings from the metal structure of the furnace cavity to prevent short circuits. The self-locking nut: a double-nut design, with the inner nut locking the insulating ring and the outer nut preventing loosening, ensuring that the heating pipe does not displace under vibration and thermal expansion and contraction. During the vacuum pumping stage, the baffle valve opens, and the vacuum pump assembly pumps air through the cavity vacuum pipeline. The oxygen analyzer monitors the oxygen concentration, and the pressure transmitter feeds back the vacuum degree. During the nitrogen replacement stage, if the oxygen analyzer detects residual oxygen, the main control unit opens the nitrogen gas pipeline valve to inject nitrogen to flush the furnace cavity. During the heating stage, the heating pipe fittings are energized to generate heat, and the bendable thermocouple wires monitor the temperature in real time. The main control unit dynamically adjusts the power. At the end of the process stage, nitrogen is injected through the nitrogen gas pipeline to break the vacuum. After the pressure transmitter confirms normal pressure, the automatic door assembly opens. The combination of the welded knife-edge flange and the oxygen-free copper gasket adapts to extreme high-temperature vacuum working conditions. Precise temperature control: multiple thermocouple monitoring + zoned heating pipe adjustment to meet the stringent requirements of semiconductor processes for temperature uniformity. Dual monitoring by the oxygen analyzer and the pressure transmitter to avoid process abnormalities.

[0015] The automatic door assembly includes a bottom plate, which is fixed at the corresponding position on the front side of the oven frame body. A door opening is provided on the bottom plate, and the door opening is directly opposite to the hollow furnace cavity at the corresponding position. The sealing ring extends out of the door opening at the corresponding position. A drag chain groove plate, an adjustment cylinder, two slide rails, and two limit sensors are fixed on the front side of the bottom plate. The adjustment cylinder is located above the door opening, the two slide rails are located on the upper and lower sides of the door opening, and the two limit sensors are located on the left and right sides of the upper slide rail. A moving frame is slidably arranged on the two slide rails, and a number of push cylinders are fixed on the moving frame. The telescopic ends of the number of push cylinders are all fixed with heat-insulating outer door panels, and a sealed inner door panel is fixed on the rear side of the heat-insulating outer door panel. The drag chain groove plate is located below the lower slide rail.

[0016] With the above structure, during the door opening preparation stage, the pushing cylinder retracts and extends, pulling the heat-insulating outer door panel and the sealed inner door panel away from the sealing ring; during the horizontal sliding door stage, the position adjusting cylinder operates to slide the moving frame horizontally along the slide rail, driving the heat-insulating outer door panel and the sealed inner door panel to horizontally move away from the door opening. When the limit sensor triggers a stop signal, the door panel is fully opened, and the robot transfer component can access the wafers; during the door closing and sealing stage, the moving frame slides in the reverse direction, causing the door panel to cover the door opening; the pushing cylinder extends to push the sealed inner door panel against the sealing ring to form a vacuum seal; when opening the door after the process is completed, after breaking the vacuum, the pushing cylinder retracts to relieve the sealing pressure and prepare for the next cycle; the sealing ring extends out of the door opening and forms an airtight seal when pressed against the sealed inner door panel to ensure a vacuum environment; the limit sensors are installed on the left and right sides of the upper slide rail to detect the extreme positions of the moving frame and prevent over-travel collision; the heat-insulating outer door panel is made of high-temperature resistant materials such as ceramic fiber to isolate the heat in the furnace cavity from being transferred to the outside and protect external components; the drag chain trough plate is located at the lower part of the lower slide rail to accommodate the cylinder air pipes and sensor cables to avoid entanglement and wear.

[0017] The EFEM frame assembly includes an EFEM frame main body and an FFU filter chassis. The EFEM frame main body is connected to the front side of the oven frame main body. There is a four-color light on the front side of the EFEM frame main body. The machine control box is arranged at the bottom inside the EFEM frame main body. There are side doors on both the left and right sides of the EFEM frame main body. There is a transfer door on the front side of the EFEM frame main body. There is an outer cover on the front side of the EFEM frame main body. Four wafer loaders are located inside the outer cover. There is a touch control screen on the left side of the EFEM frame main body. There are several lighting lamps and ion pumps above the inside of the EFEM frame main body. The FFU filter chassis is arranged above the EFEM frame main body.

[0018] With the above structure, the EFEM frame body is connected to the front side of the oven frame body to form an integral module, providing a clean environment for wafer transmission; the FFU filter box is located on the top of the EFEM, with a built-in high-efficiency filter, which continuously transports clean air downward to form a vertical laminar flow to remove particulate pollutants; the four-color light displays the equipment operation status, such as green normal, red fault, yellow standby, and blue maintenance, which is convenient for operators to monitor; the machine control box integrates the controllers of subsystems such as the robot transplanting component and the wafer loader to coordinate the internal automation process of the EFEM; the left and right sides of the side door can be opened to facilitate equipment maintenance or emergency intervention The transfer door is used for the robot to transfer the components to remove the wafers from the wafer loader, so as to realize the automatic transfer of the wafer cassette; the outer cover surrounds the protective cover of the wafer loader to prevent accidental human touch or particle contamination; the touch control screen human-machine interaction interface is used for parameter setting, status monitoring and manual operation; the lighting provides internal lighting of the EFEM to ensure operational visibility; the ion pump releases ion wind to neutralize static electricity to prevent the wafer from adsorbing particles or being damaged by discharge; if leakage or abnormal FFU wind pressure is detected, the four-color light switches to red, triggering an audible and visual alarm, and maintenance personnel can enter the EFEM through the side door for inspection.

[0019] The liquid leakage detection component includes a liquid leakage tray, which is detachably arranged on the bottom side of the oven frame body. A plurality of nut columns are arranged on the liquid leakage tray, and a liquid leakage sensor is fixed by the plurality of nut columns. When a liquid leakage is detected, the liquid leakage sensor reports to the main control machine, triggering a buzzer alarm of the four-color light and turning it red.

[0020] With the above structure, when liquid leakage occurs, coolant such as deionized water or process liquid leaks into the leakage tray due to pipeline rupture, seal failure, etc.; the leakage sensor detects the signal and transmits the signal to the main control machine through the cable; after the main control machine receives the signal, it immediately triggers the four-color light to switch to red and starts the buzzer, and the sound and light alarm prompts the operator; all moving parts in the oven frame body are stopped to prevent liquid splashing and contaminating the wafer; fault information is recorded for subsequent maintenance analysis; maintenance personnel enter between the oven frame assembly and the EFEM frame assembly through the side door, check the leakage source and deal with it; the leakage tray can be disassembled and cleaned to prevent residual liquid from corroding the equipment.

[0021] The robot transplanting assembly includes a base frame, which is fixed at the middle position of the inner bottom side of the EFEM frame body, a reinforcement frame is fixed to the rear side of the base frame, and the reinforcement frame is fixedly connected to the middle position of the front side of the oven frame body, a vertically arranged electric lifting wire rod and two vertically arranged lifting guide rails are provided on the front side of the base frame, the two lifting guide rails are located on the left and right sides of the electric lifting wire rod, a lifting seat is slidably provided on the two lifting guide rails, the lifting seat is fixedly connected to the slider of the electric lifting wire rod, a synchronization frame is fixed to the rear side of the lifting seat, a mechanical arm chassis is provided on the lifting seat, and a transplanting mechanical arm component is provided above the mechanical arm chassis.

[0022] With the above structure, initial positioning and height adjustment are performed, and the electric lifting wire rod is started to drive the lifting seat to move vertically along the lifting guide rail, so that the transfer robot arm is aligned with the height of the wafer loader or the chamber assembly. The position feedback is transmitted to the machine control box in real time by the encoder or grating ruler to ensure the positioning accuracy; wafer grabbing, the transfer robot arm extends into the wafer box of the wafer loader to adsorb the edge of the wafer, and the transfer robot arm moves the wafer out of the wafer loader and transfers it to the front of the automatic door assembly through the clean area inside the EFEM; wafer placement, lifting and lowering fine-tuning, the electric lifting wire rod fine-tunes the height to compensate for the height difference between the chamber assembly and the wafer loader, and after the automatic door assembly is opened, the wafer is sent into the chamber assembly; reset standby, return to the safe position, the transfer robot arm is reset, and the lifting seat is lowered to the standby height to avoid interfering with other components; the reinforcement frame connects the base frame and the oven frame body to enhance the structural rigidity and prevent vibration and deviation when the robot arm moves.

[0023] The transplanting mechanical arm component includes a mechanical arm chassis, which is fixed above the lifting seat. The upper end of the mechanical arm chassis is rotatably provided with a first mechanical arm, a first motor is fixed inside the mechanical arm chassis, and the output shaft of the first motor is fixedly connected to the rotating shaft of the first mechanical arm. The upper end of the first mechanical arm is rotatably provided with a second mechanical arm, a second motor is fixed inside the first mechanical arm, and the output shaft of the second motor is fixedly connected to the rotating shaft of the second mechanical arm. A third motor and a fourth motor are fixed inside the second mechanical arm, and two mechanical arm plates are rotatably provided with the upper end of the second mechanical arm. The axes of the rotating shafts of the two mechanical arm plates are collinear, and the output shafts of the third motor and the fourth motor are respectively connected to the rotating shafts of the two mechanical arm plates in a transmission manner. Tooth forks are detachably provided at the ends of the mechanical arm plates, a suction cup air pipe is provided at the lower part of the tooth fork, a plurality of suction cups are provided at the upper part of the tooth fork, the suction cups are connected to the suction cup air pipe, and a mapping sensor is provided on the tooth fork.

[0024] With the above structure, for wafer grasping, positioning and alignment, the first motor drives the first robotic arm to rotate, and the second motor drives the second robotic arm to rotate to align the tooth fork with the wafer cassette of the wafer loader; the third motor and the fourth motor respectively drive the rotation of two robotic arm plates to make the tooth fork parallel to the wafer plane; for vacuum adsorption, the suction cup trachea is connected to the vacuum, and the suction cup adsorbs the non-functional area at the edge of the back of the wafer; for wafer transfer, the joints move in coordination, and the first robotic arm and the second robotic arm move in combination to move the wafer out of the wafer loader and transfer it to the cavity component through the EFEM clean area; the motion trajectory is planned by the machine control box to avoid collision with other components within the EFEM; the electric lifting screw adjusts the height of the lifting seat to compensate for the height difference between the cavity component and the wafer loader; for wafer placement, for precise alignment, the robotic arm plate rotates to adjust the wafer angle, and the mapping sensor calibrates the coincidence of the wafer center and the cavity component center; for wafer release, the suction cup trachea closes the vacuum, and the suction cup releases the wafer onto the metal boat, the transplanting robotic arm returns to the initial posture, and the lifting seat descends to the standby height to prepare for the next transplant; the suction cup trachea is connected to an external vacuum generator to control the adsorption / release of the suction cup, and the pipeline is internally provided with a filter to prevent contamination.

[0025] The vacuum pump assembly includes a vacuum pump box. Inside the vacuum pump box, there are two vacuum pumps and two filters. The vacuum pumps are connected to the filters at the corresponding positions. There is an air extraction pipeline between the filters and the baffle valves of one cavity component at the corresponding positions. The air extraction pipelines respectively pass through the water-cooling units on the same side. The upper end of the vacuum pump box is provided with a heat dissipation hole plate.

[0026] With the above structure, when the baffle valve is opened and the cavity component needs to be evacuated, the main control machine sends a signal, the baffle valve opens, the dry pump starts, and the vacuum pump works to quickly reduce the internal pressure of the cavity component from atmospheric pressure to the low vacuum range. The hot gas in the air extraction pipeline is cooled by the water-cooling unit to avoid overheating and affecting the pump performance. The filter intercepts the reflux oil vapor or particles at this stage to ensure the cleanliness of the cavity component. The heat dissipation hole plate is used for heat dissipation.

[0027] Compared with the prior art, the full-automatic vacuum and oxygen-free oven has the following advantages:

[0028] The robot transplanting component is used to stably grasp and release wafers, enabling rapid and damage-free transfer of wafers between the wafer loader and the cavity component, providing an efficient automation foundation for the vacuum and oxygen-free process, and being the core execution mechanism to ensure the throughput and process yield of the equipment; through the cooperation of the oven frame component, the automatic door component and the cavity component, a stable vacuum and oxygen-free environment is maintained; the cavity component uses multi-zone heating to ensure the uniformity of the temperature field, avoid stress deformation of the wafers, adopts a dual-mode of air cooling and water cooling to improve the throughput of the equipment, and the automatic door component and the cavity component cooperate with good sealing performance and are convenient for wafer loading and unloading; the cavity component is linked with the vacuum pump component to perform vacuum pumping after sealing, and the cavity component is connected to an external high-purity nitrogen source to accelerate cooling or restore normal pressure; the automatic door component is synchronized with the robot transplanting component, and the fully open signal of the door panel is used as the permission condition for the robot transplanting component to transplant wafers; the cavity component cooperates with the oxygen analyzer, and if the oxygen content increases due to seal failure, an alarm is immediately given and the process is terminated; through the cooperation of the EFEM frame body and the FFU filter chassis, clean air is continuously delivered downward to provide a clean environment for wafer transfer; the liquid leakage detection component ensures that expensive wafers and precision equipment in semiconductor manufacturing are protected from liquid leakage damage through real-time monitoring and rapid response; throughout the process, through the cooperation of multiple sensors, mechanical linkage and the gas-liquid cooling system, full-automatic wafer loading, vacuum pumping, heating, constant temperature process treatment, cooling and wafer unloading processes are realized in an oxygen-free and high-precision temperature-controlled environment. Brief Description of the Drawings

[0029] Figure 1 It is a schematic three-dimensional overall assembly structure diagram of the present invention.

[0030] Figure 2 It is a schematic structure diagram of the oven frame component, the cavity component, the automatic door component and the vacuum pump component in the present invention.

[0031] Figure 3 It is a schematic structure diagram of the EFEM frame component, the wafer loader and the robot transplanting component in the present invention.

[0032] Figure 4 It is a schematic structure diagram of the oven frame component in the present invention.

[0033] Figure 5 It is a schematic structure diagram of the automatic door component in the present invention.

[0034] Figure 6 It is a schematic three-dimensional front structure diagram of the cavity component in the present invention.

[0035] Figure 7 It is a schematic three-dimensional rear structure diagram of the cavity component in the present invention.

[0036] Figure 8 is the present invention Figure 7Schematic diagram of the enlarged structure at A in the [Chinese context].

[0037] Figure 9 It is a schematic diagram of the upper-side three-dimensional structure of the EFEM frame component in the present invention.

[0038] Figure 10 It is a schematic diagram of the lower-side three-dimensional structure of the EFEM frame component in the present invention.

[0039] Figure 11 It is a schematic diagram of the structure of the robot transplanting component in the present invention.

[0040] Figure 12 It is a schematic diagram of the structure of some components of the robot transplanting component in the present invention.

[0041] Figure 13 It is a schematic diagram of the structure of the vacuum pump component in the present invention.

[0042] In the figure, 1. Oven frame component; 2. EFEM frame component; 3. Wafer loader; 4. Main control machine; 5. Vacuum pump component; 6. Automatic door component; 7. Cavity component; 8. Robot transplanting component; 9. Oven frame main body; 10. Cavity placement area; 11. Blower; 12. Through-board connection pipe; 13. Bottom plate; 14. Position-adjusting cylinder; 15. Slide rail; 16. Moving frame; 17. Pushing cylinder; 18. Heat-insulating outer door panel; 19. Drag chain groove plate; 20. Sealed inner door panel; 21. Door opening; 22. Limit sensor; 23. Cavity support frame; 24. Mica heat-insulating plate; 25. Hollow furnace cavity; 26. Air inlet pipe; 27. Electric butterfly valve; 28. Exhaust pipe; 29. Heating pipe fittings; 30. Heating pipe shield; 31. Adjustment substrate; 32. Sealing ring; 33. Water jacket pipe; 34. Hollow pipe; 35. Four-core thermocouple pipe; 36. Damper valve; 37. Pressure transmitter; 38. Oxygen analyzer; 39. Nitrogen pipeline; 40. Welding knife-edge flange; 41. Pulling plate flange; 42. Oxygen-free copper gasket sealing ring; 43. EFEM frame main body; 44. Side door; 45. FFU filter chassis; 46. Transfer door; 47. Touch control screen; 48. Machine control box; 49. Lighting lamp; 50. Ion pump; 51. Peripheral cover; 52. Synchronization frame; 53. Base frame; 54. Reinforcing frame; 55. Lifting guide rail; 56. Electric lifting screw rod part; 57. Transplanting robotic arm part; 58. Wafer; 59. Robotic arm chassis; 60. Lifting seat; 61. First motor; 62. First robotic arm; 63. Second robotic arm; 64. Robotic arm plate; 65. Tooth fork; 66. Suction cup; 67. Suction cup air pipe; 68. Vacuum pump box; 69. Heat dissipation hole plate; 70. Filter; 71. Vacuum pump; 72. Flexible thermocouple wire; 73. Thermocouple fixing block. Detailed implementation manners

[0043] The following are specific embodiments of the present invention. In combination with the accompanying drawings, the technical solutions of the present invention will be further described, but the present invention is not limited to these embodiments.

[0044] As Figures 1-13 shown, this fully automatic vacuum and oxygen-free oven includes an oven frame assembly 1, an EFEM frame assembly 2 connected to the front side of the oven frame assembly 1, vacuum pump assemblies 5 symmetrically arranged on the left and right sides of the oven frame assembly 1, and four wafer loaders 3 evenly distributed at equal intervals in the front of the EFEM frame assembly 2. Four cavity assemblies 7 are arranged at the four corners inside the oven frame assembly 1, and four automatic door assemblies 6 are arranged at the four corners. Two cavity assemblies 7 with the same height are symmetrically arranged left and right, and two automatic door assemblies 6 with the same height are symmetrically arranged left and right. The positions of the automatic door assemblies 6 correspond to those of the cavity assemblies 7, and the automatic door assemblies 6 are located in the front of the cavity assemblies 7. A robot transfer assembly 8 and a machine control box 48 are arranged inside the EFEM frame assembly 2. A main control machine 4 is arranged on the left side of the EFEM frame assembly 2. The cavity assemblies 7 are respectively connected to the vacuum pump assemblies 5 on the same side through air extraction pipelines, and the cavity assemblies 7 are connected to an external high-purity nitrogen source.

[0045] An operator or an automated system places the wafer cassette on four equally spaced wafer loaders 3, preparing to enter the baking process; the EFEM frame assembly 2 maintains a clean positive pressure environment inside to prevent external contamination from entering; the robotic transfer assembly 8 grabs the wafer from the wafer loader 3; transports the wafer to the front of the automatic door assembly 6 of the target chamber assembly 7 and waits for the chamber to be ready; after receiving a signal, the automatic door assembly 6 of the target chamber assembly 7 opens, and the robotic transfer assembly 8 sends the wafer into the chamber assembly 7. After the wafer is in place, the automatic door assembly 6 immediately closes to ensure the sealing of the chamber assembly 7 and prepares for vacuum pumping. Four can operate simultaneously and separately to handle different situations and increase production value; the symmetrically distributed vacuum pump assemblies 5 are started to quickly extract the air inside the chamber assembly 7 to reach the set vacuum level, and the temperature inside the chamber assembly 7 rises according to the preset temperature curve, which is adjusted in real time by the main controller 4 using the PID algorithm to ensure temperature control accuracy; the wafer completes processes such as baking, annealing, or drying in a constant temperature environment, and the time is set by the program; after the heating ends, the chamber assembly 7 stops heating and starts to cool down. After the wafer cools down naturally with the chamber assembly 7 for 10 minutes, the external high-purity nitrogen source flushes nitrogen into the chamber assembly 7 to accelerate the cooling. After the cooling ends; after reaching a safe temperature, the external high-purity nitrogen source flushes nitrogen into the chamber assembly 7 to restore normal pressure and prepares for wafer extraction; after the pressure inside the chamber assembly 7 is balanced, the automatic door assembly 6 opens, and the robotic transfer assembly 8 enters to grab the wafer that has completed the process and sends the wafer back to the designated position on the wafer loader 3, completing one processing cycle; the automatic door assembly 6 closes, and the vacuum pump assemblies 5 standby, waiting for the next batch of wafers to be sent in. If other chamber assemblies 7 are idle, the robotic transfer assembly 8 can process multiple wafers in parallel to improve efficiency; the nitrogen chamber process flow is optional: if required by the process, high-purity nitrogen can be introduced to replace the residual oxygen to ensure an oxygen-free environment, that is, after the wafer transfer ends, the automatic door assembly 6 closes, the vacuum pump assemblies 5 are started to pump vacuum. After the oxygen content and pressure value reach the standard, the set temperature and flow opening are set, and the heating starts. After the process is completed, the external air duct air-cooling blower is turned on, the heating tube stops heating, and the cooling starts. After the cooling ends, the automatic door assembly 6 opens, and the robotic transfer assembly 8 takes out the wafer from the chamber assembly 7; the entire process runs automatically and is jointly controlled by the main controller 4 and the machine control box 48 to ensure a high-precision, oxygen-free, and pollution-free process environment.

[0046] The oven frame assembly 1 includes an oven frame main body 9. Inside the oven frame main body 9, there are four independently distributed cavity placement areas 10 at the four corners. Inside the oven frame main body 9, there are water-cooling units symmetrically distributed on both sides. Four blowers 11 are fixed inside the oven frame main body 9. On both the left and right sides of the oven frame main body 9, there are several equally spaced through-board connection pipes 12 arranged vertically. At the bottom side inside the oven frame main body 9, there is a liquid leakage detection component.

[0047] The oven frame body 9 is the supporting core structure, which is internally divided into four independent cavity placement areas 10, and each area accommodates a cavity component 7 to achieve multi-wafer parallel processing; the water cooling unit is used to cool the cavity component 7 and cool the evacuated hot gas to ensure the long-term stable operation of the equipment; four blowers 11 respectively correspond to the cavity placement areas 10 to cool the cavity component 7 and accelerate the cooling of the wafers; the through-board connecting pipes 12 are used to connect the vacuum pump assembly 5, nitrogen, gas injection system and electrical circuits to ensure the integration and sealing of functional modules, and the liquid leakage detection component monitors whether the bottom of the oven frame body 9 leaks coolant or chemical liquid to trigger an alarm to protect the safety of the wafers.

[0048] The cavity component 7 includes two cavity support frames 23, and the two cavity support frames 23 are fixed at the lower ends of the cavity placement areas 10 at corresponding positions. Mica heat insulation plates 24 are fixed at the upper ends of the two cavity support frames 23, and a hollow furnace cavity 25 is fixed at the upper ends of the two mica heat insulation plates 24. The hollow furnace cavity 25 is a box body with an opening at the front side. A hollow air duct is formed between the inner cavity wall and the outermost wall of the hollow furnace cavity 25. Heating tube shields 30 are provided on the upper, lower, left and right sides inside the hollow furnace cavity 25, and a heating interval is formed between the heating tube shields 30 and the hollow furnace cavity 25. Heating pipe fittings 29 are provided inside the heating intervals. Thermocouple fixing blocks 73 are provided on the left and right sides inside the hollow furnace cavity 25. An adjustment substrate 31 is provided at the upper end of the lower heating tube shield 30, and a metal boat is detachably provided at the upper end of the adjustment substrate 31. Air inlet pipes 26 and exhaust pipes 28 are provided on the outer side parts of the hollow furnace cavity 25. The air inlet pipes 26 and the exhaust pipes 28 are both communicated with the hollow air duct of the hollow furnace cavity 25 to form a heat dissipation channel. The air inlet pipes 26 are connected to the air outlet ends of the blowers 11 at the same positions. A flow regulating blade is rotatably provided inside the exhaust pipe 28, and an electric butterfly valve 27 is provided on the exhaust pipe 28. The control shaft of the electric butterfly valve 27 is in transmission connection with the rotating shaft of the flow regulating blade. A sealing ring 32 and a water jacket pipe 33 are provided at the front side opening of the hollow furnace cavity 25. The sealing ring 32 abuts against the outer side of the water jacket pipe 33. Two water guide pipes are connected between the water jacket pipes 33 of the two cavity components 7 and the water cooling unit on the same side.

[0049] The cavity support frame 23 provides mechanical support to ensure the stability of the hollow furnace cavity 25. The mica heat insulation plate 24 isolates the heat conduction downward from the heating area to protect the oven frame body 9 and the equipment below. The heating pipe fittings 29 are evenly distributed in the heating area formed by the heating pipe shield 30 and the inner wall of the hollow furnace cavity 25. After being powered on, they radiate heat to form a uniform temperature field. The thermocouple fixing block is used to fix the thermocouple, monitor the temperature of the hollow furnace cavity 25 in real time and feedback it to the main control machine 4 to achieve precise PID temperature control. The metal boat and the adjustment substrate 31 can be quickly replaced to adapt to different process requirements. The metal boat ensures a constant distance between the wafer and the heating pipe fittings 29 to avoid uneven heating. The sealing ring 32 forms an airtight seal after being pressed with the automatic door assembly 6 to prevent air leakage. The water jacket pipe 33 surrounds the opening of the hollow furnace cavity 25, and the cooling water circulates inside. It is connected to the water cooling unit through the water guiding pipe to reduce the temperature of the sealing ring 32, prevent high-temperature aging, and ensure long-term sealing reliability. The blower 11 injects cold air into the hollow air duct of the hollow furnace cavity 25 through the air inlet pipe 26. The air flow takes away heat through the heating area. The adjustment blades of the exhaust pipe 28 adjust the opening degree through the electric butterfly valve 27 to control the exhaust rate and achieve gradient cooling. The hot air is discharged from the exhaust pipe 28 to ensure efficient heat dissipation. The water cooling unit cools the outer wall of the furnace cavity synchronously to avoid thermal deformation.

[0050] At the rear side of the hollow furnace cavity 25, there are a cavity vacuum pipe, a nitrogen gas pipeline 39, a transmitter pipe, two symmetrically arranged four-core thermocouple pipes 35 and eight hollow pipes 34 connected thereto. The cavity vacuum pipe is sequentially connected with an oxygen analyzer 38 and a baffle valve 36. The nitrogen gas pipeline 39 is sequentially connected with a high-vacuum solenoid valve, an MFC, a medium-vacuum solenoid valve and a duplex unit and then connected to an external high-purity nitrogen gas source. A pressure transmitter 37 is connected to the transmitter pipe. Inside each of the four-core thermocouple pipes 35, there are several circumferentially evenly distributed bendable thermocouple wires 72. The bendable thermocouple wires 72 are fixed on the thermocouple fixing blocks 73 on the same side. At the end of each hollow pipe 34, there is a welded knife-edge flange 40. Inside each hollow pipe 34, there is an externally threaded tension bolt. The externally threaded tension bolt is sleeved on the heating pipe fitting 29, and the end of the externally threaded tension bolt extends out of the welded knife-edge flange 40. An oxygen-free copper gasket sealing ring 42 is sleeved on the externally threaded tension bolt. The oxygen-free copper gasket sealing ring 42 is located inside the hollow pipe 34, and the oxygen-free copper gasket sealing ring 42 abuts between the externally threaded tension bolt and the welded knife-edge flange 40. A pull plate flange 41 is screwed on the externally threaded tension bolt. The pull plate flange 41 abuts on the welded knife-edge flange 40 to tension the externally threaded tension bolt from the outside. At the end of each heating pipe fitting 29, there is an insulating ring. Two self-locking nuts are screwed on the end of each heating pipe fitting 29. The inner self-locking nut abuts and locks on the insulating ring.

[0051] The cavity vacuum pipeline is connected to the vacuum pump assembly 5 to create a vacuum environment for the gas in the hollow furnace cavity 25. The oxygen analyzer 38 monitors the residual oxygen concentration in the cavity in real time to ensure an oxygen-free process condition. The baffle valve 36 adjusts the air flow during vacuum pumping or vacuum breaking. In case of emergency, it can quickly cut off the pipeline to protect the vacuum pump assembly 5 and prevent vacuum backflow. The nitrogen pipeline 39 is connected to an external high-purity nitrogen source, used for flushing the hollow furnace cavity 25 before the process to stably control the replacement of residual oxygen, and stably control the injection of nitrogen when breaking the vacuum after the process to avoid oxidation of the wafer when it contacts the air. The pressure transmitter 37 detects the real-time pressure in the furnace cavity through the transmitter pipe and feeds it back to the main control unit 4 to jointly control the vacuum pump assembly 5 and nitrogen injection. The four-core thermocouple tubes 35 arranged symmetrically on the left and right contain multiple bendable thermocouple wires 72, which extend into the furnace cavity and are fixed to the thermocouple fixing block 73 to monitor the temperature distribution in the furnace cavity at multiple points, such as the temperature difference between the center and the edge, to ensure that the temperature field uniformity is within ±1°C and prevent the temperature from changing due to position deviation. The welded knife-edge flange 40 is fixed at the end of the hollow pipe 34 and is connected to an external power supply / cooling system. The oxygen-free copper gasket seal 42 is placed inside the hollow pipe 34 and is pressed against the welded knife-edge flange 40 by the externally threaded tightening bolt to achieve high-temperature vacuum sealing, high temperature resistance, and anti-creep. The pull plate flange 41 is screwed onto the tightening bolt to apply tension from the outside to enhance the sealing pressure. The insulating ring isolates the heating pipe fitting 29 from the metal structure of the furnace cavity to prevent short circuits. Self-locking nut: double nut design, the inner nut locks the insulating ring, and the outer nut prevents loosening to ensure that the heating pipe does not displace under vibration and thermal expansion and contraction. During the vacuum pumping stage, the baffle valve 36 is opened, and the vacuum pump assembly 5 pumps air through the cavity vacuum pipeline. The oxygen analyzer 38 monitors the oxygen concentration, and the pressure transmitter 37 feeds back the vacuum degree. During the nitrogen replacement stage, if the oxygen analyzer detects residual oxygen, the main control unit 4 opens the valve of the nitrogen pipeline 39 to inject nitrogen to flush the furnace cavity. During the heating stage, the heating pipe fitting 29 is energized to generate heat, and the bendable thermocouple wire 72 monitors the temperature in real time, and the main control unit dynamically adjusts the power. At the end of the process, nitrogen is injected through the nitrogen pipeline 39 to break the vacuum. After the pressure transmitter 37 confirms normal pressure, the automatic door assembly 6 is opened. The combination of the welded knife-edge flange and the oxygen-free copper gasket is suitable for extreme high-temperature vacuum working conditions. Precise temperature control: multi-thermocouple monitoring + zone heating pipe adjustment to meet the demanding requirements of semiconductor processes for temperature uniformity. Dual monitoring by the oxygen analyzer and the pressure transmitter to avoid process abnormalities.

[0052] The automatic door assembly 6 includes a bottom plate 13, which is fixed at the corresponding position on the front side of the oven frame body 9. A door opening 21 is provided on the bottom plate 13, and the door opening 21 is directly opposite to the hollow furnace cavity 25 at the corresponding position. The sealing ring 32 extends out of the door opening 21 at the corresponding position. A drag chain groove plate 19, an adjustment cylinder 14, two slide rails 15 and two limit sensors 22 are fixed on the front side of the bottom plate 13. The adjustment cylinder 14 is located above the door opening 21, the two slide rails 15 are located on the upper and lower sides of the door opening 21, and the two limit sensors 22 are located on the left and right sides of the upper slide rail 15. A moving frame 16 is slidably arranged on the two slide rails 15, and a number of push cylinders 17 are fixed on the moving frame 16. The telescopic ends of the number of push cylinders 17 are all fixed with heat-insulating outer door panels 18, and a sealing inner door panel 20 is fixed on the rear side of the heat-insulating outer door panel 18. The drag chain groove plate 19 is located below the lower slide rail 15.

[0053] During the door opening preparation stage, the push cylinders 17 retract and extend, pulling the heat-insulating outer door panel 18 and the sealing inner door panel 20 away from the sealing ring 32; during the horizontal door moving stage, the adjustment cylinder 14 acts to slide the moving frame 16 horizontally along the slide rail 15, driving the heat-insulating outer door panel 18 and the sealing inner door panel 20 to move horizontally away from the door opening 21. When the limit sensor 22 triggers a stop signal, the door panel is fully opened, and the robot transfer assembly 8 can access the wafers; during the door closing and sealing stage, the moving frame 16 slides in the reverse direction to make the door panel cover the door opening 21; the push cylinders 17 extend to push the sealing inner door panel 20 to press against the sealing ring 32 to form a vacuum seal; after the process is completed and the door is opened, after breaking the vacuum, the push cylinders 17 retract to release the sealing pressure and prepare for the next cycle; the sealing ring 32 extends out of the door opening 21 and forms an airtight seal when pressed against the sealing inner door panel 20 to ensure a vacuum environment; the limit sensors 22 are installed on the left and right sides of the upper slide rail to detect the limit position of the moving frame 16 and prevent overtravel and collision; the heat-insulating outer door panel 18 is made of high-temperature resistant materials such as ceramic fiber to isolate the heat of the furnace cavity from being transmitted to the outside and protect external components; the drag chain groove plate 19 is located below the lower slide rail 15 to accommodate the cylinder air pipes and sensor cables and avoid entanglement and wear.

[0054] The EFEM frame assembly 2 includes an EFEM frame body 43 and an FFU filter chassis 45. The EFEM frame body 43 is connected to the front side of the oven frame body 9. Four-color lights are provided on the front side of the EFEM frame body 43. The machine control box 48 is arranged at the bottom side inside the EFEM frame body 43. Side doors 44 are provided on both the left and right sides of the EFEM frame body 43. A transfer door 46 is provided on the front side of the EFEM frame body 43. An outer cover 51 is provided on the front side of the EFEM frame body 43. Four wafer loaders 3 are located inside the outer cover 51. A touch control screen 47 is provided on the left side of the EFEM frame body 43. A number of lighting lamps 49 and ion pumps 50 are provided above the inside of the EFEM frame body 43. The FFU filter chassis 45 is arranged above the EFEM frame body 43.

[0055] The EFEM frame body 43 is connected to the front side of the oven frame body 9 to form an integrated module, providing a clean environment for wafer transfer; the FFU filter chassis 45 is located on the top of the EFEM, with high-efficiency filters built-in, continuously delivering clean air downward to form a vertical laminar flow to remove particulate contaminants; the four-color light displays the operating status of the equipment, such as green for normal, red for fault, yellow for standby, and blue for maintenance, facilitating operators' monitoring; the machine control box 48 integrates the controllers of subsystems such as the robot transfer module 8 and the wafer loader 3 to coordinate the internal automation process of the EFEM; the side doors 44 can be opened on both the left and right sides to facilitate equipment maintenance or emergency intervention; the transfer door 46 is used for the robot transfer module 8 to pick up the wafer from the wafer loader 3 to achieve automatic handover of the wafer cassette; the outer enclosure 51 surrounds the wafer loader 3 to prevent human accidental touch or particulate contamination; the touch control screen 47 is a human-machine interaction interface for parameter setting, status monitoring, and manual operation; the lighting lamp 49 provides internal lighting for the EFEM to ensure visibility of operations; the ion pump 50 releases ion wind to neutralize static electricity to avoid wafer adsorption of particles or discharge damage; if liquid leakage or abnormal FFU air pressure is detected, the four-color light switches to red, triggering an audible and visual alarm, and maintenance personnel can enter the interior of the EFEM through the side door 44 for repair.

[0056] The liquid leakage detection component includes a liquid leakage tray, which is detachably arranged on the inner bottom side of the oven frame body 9. A number of nut posts are provided on the liquid leakage tray, and a liquid leakage sensor is fixed through the number of nut posts. When liquid leakage is detected, the liquid leakage sensor reports to the main control unit 4, triggering a four-color light buzzer alarm and turning red.

[0057] When liquid leakage occurs, the coolant such as deionized water or process liquid leaks into the liquid leakage tray due to pipeline rupture, seal failure, etc.; the liquid leakage sensor detects the signal and transmits the signal to the main control unit 4 through a cable; after receiving the signal, the main control unit 4 immediately triggers the four-color light to switch to red and starts the buzzer, with an audible and visual alarm to prompt the operator; stops all moving parts in the oven frame body 9 to prevent liquid splashing from contaminating the wafer; records the fault information for subsequent maintenance analysis; maintenance personnel enter between the oven frame assembly 1 and the EFEM frame assembly 2 through the side door to check the leakage source and handle it; the liquid leakage tray can be detachably cleaned to avoid residual liquid from corroding the equipment.

[0058] The robot transplanting assembly 8 includes a base frame 53, which is fixed at the middle position of the inner bottom side of the EFEM frame body 43. A reinforcing frame 54 is fixed to the rear side of the base frame 53, and the reinforcing frame 54 is fixedly connected to the middle position of the front side of the oven frame body 9. A vertically arranged electric lifting wire rod 56 and two vertically arranged lifting guide rails 55 are provided on the front side of the base frame 53. The two lifting guide rails 55 are located on the left and right sides of the electric lifting wire rod 56. A lifting seat 60 is slidably provided on the two lifting guide rails 55. The lifting seat 60 is fixedly connected to the slider of the electric lifting wire rod 56. A synchronous frame 52 is fixed to the rear side of the lifting seat 60. A robotic arm chassis 59 is provided on the lifting seat 60, and a transplanting robotic arm 57 is provided above the robotic arm chassis 59.

[0059] Initial positioning, height adjustment, the electric lifting wire rod 56 is started, driving the lifting seat 60 to move vertically along the lifting guide rail 55, so that the transfer robot arm 57 is aligned with the height of the wafer loader 3 or the cavity assembly 7, and the position feedback is transmitted to the machine control box 48 in real time by the encoder or grating ruler to ensure the positioning accuracy; wafer grabbing, the transfer robot arm 57 extends into the wafer box of the wafer loader 3 to adsorb the edge of the wafer, and the transfer robot arm 57 moves the wafer out of the wafer loader 3 and transfers it to the front of the automatic door assembly 6 through the clean area inside the EFEM; wafer placement, lifting fine-tuning, the electric lifting wire rod 56 fine-tunes the height to compensate for the height difference between the cavity assembly 7 and the wafer loader 3, and after the automatic door assembly 6 is opened, the wafer is sent into the cavity assembly 7; reset standby, return to the safe position, the transfer robot arm 57 is reset, and the lifting seat 60 is lowered to the standby height to avoid interfering with other components; the reinforcing frame 54 connects the base frame 53 and the oven frame body 9 to enhance the structural rigidity and prevent vibration and deviation when the robot arm moves.

[0060] The transplanting mechanical arm member 57 includes a mechanical arm chassis 59, which is fixed above the lifting seat 60. The upper end of the mechanical arm chassis 59 is rotatably provided with a first mechanical arm 62. A first motor 61 is fixed inside the mechanical arm chassis 59. The output shaft of the first motor 61 is fixedly connected to the rotating shaft of the first mechanical arm 62. A second mechanical arm 63 is rotatably provided on the upper end of the first mechanical arm 62. A second motor is fixed inside the first mechanical arm 62. The output shaft of the second motor is fixedly connected to the rotating shaft of the second mechanical arm 63. A third motor and a fourth motor are fixed inside, and two robot arm plates 64 are rotatably provided at the upper end of the second robot arm 63. The axes of the rotating shafts of the two robot arm plates 64 are colinear, and the output shafts of the third motor and the output shafts of the fourth motor are respectively connected to the rotating shafts of the two robot arm plates 64 by transmission, and the ends of the robot arm plates 64 are detachably provided with tooth forks 65, and a suction cup air pipe 67 is provided at the lower part of the tooth fork 65, and a plurality of suction cups 66 are provided at the upper part of the tooth fork 65, and the suction cups 66 are connected to the suction cup air pipe 67, and a mapping sensor is provided on the tooth fork 65.

[0061] Wafer grasping, positioning and alignment. The first motor 61 drives the first robotic arm 62 to rotate, and the second motor drives the second robotic arm 63 to rotate, so that the tooth fork 65 aligns with the wafer cassette of the wafer loader 3. The third motor and the fourth motor respectively drive the rotation of the two robotic arm plates 64, so that the tooth fork 65 is parallel to the wafer plane. Vacuum adsorption: The suction cup air pipe 67 is connected to the vacuum, and the suction cup 66 adsorbs the non-functional area at the back edge of the wafer. Wafer transfer: The joints move in coordination, and the first robotic arm 62 and the second robotic arm 63 perform a combined movement to remove the wafer from the wafer loader 3 and transfer it to the cavity assembly 7 through the EFEM clean area. The motion trajectory is planned by the machine control box 48 to avoid collision with other components inside the EFEM. The electric lifting screw member 56 finely adjusts the height of the lifting seat 60 to compensate for the height difference between the cavity assembly 7 and the wafer loader 3. Wafer placement: Precise alignment. The robotic arm plate 64 rotates to adjust the wafer angle, and the mapping sensor calibrates the coincidence of the wafer center and the cavity assembly 7 center. Release the wafer: The suction cup air pipe 67 closes the vacuum, and the suction cup 66 releases the wafer onto the metal boat. The transplanting robotic arm member 57 returns to the initial posture, and the lifting seat 60 descends to the standby height to prepare for the next transplant. The suction cup air pipe 67 is connected to an external vacuum generator to control the adsorption / release of the suction cup 66, and the pipeline is internally provided with a filter to prevent contamination.

[0062] The vacuum pump assembly 5 includes a vacuum pump box 68. Inside the vacuum pump box 68, there are two vacuum pumps 71 and two filters 70. The vacuum pumps 71 are connected to the filters 70 at the corresponding positions. There is an air extraction pipeline between the filters 70 and the baffle valve 36 of a cavity assembly 7 at the corresponding position. The air extraction pipelines respectively pass through the water cooling units on the same side. The upper end of the vacuum pump box 68 is provided with a heat dissipation hole plate 69.

[0063] When the baffle valve 36 is opened and the cavity assembly 7 needs to be evacuated, the main control machine 4 sends a signal, the baffle valve 36 opens, the dry pump starts, the vacuum pump 71 works, and the internal pressure of the cavity assembly 7 is quickly reduced from atmospheric pressure to the low vacuum range. The hot gas in the air extraction pipeline is cooled by the water cooling unit to avoid overheating affecting the pump performance. The filter 70 intercepts the reflux oil vapor or particles to ensure the cleanliness of the cavity assembly 7. The heat dissipation hole plate 69 is used for heat dissipation.

[0064] The working principle of the present invention:

[0065] Wafer loading and preparation: The operator or the automated system places the wafer cassette on the four equally spaced wafer loaders 3 and prepares to enter the baking process. The FFU filter chassis 45 continuously conveys clean air downward to form a vertical laminar flow to remove particulate contaminants. The ion pump 50 releases ion wind to neutralize static electricity to avoid the wafer being adsorbed by particles or damaged by discharge.

[0066] Wafer grasping and positioning: Initial positioning, height adjustment. The electric lifting screw rod part 56 is activated to drive the lifting seat 60 to move vertically along the lifting guide rail 55, aligning the transfer robotic arm part 57 with the height of the wafer loader 3 or the cavity component 7. The position feedback is transmitted to the machine control box 48 in real time by the encoder or grating scale to ensure the positioning accuracy. The transfer robotic arm part 57 extends into the wafer cassette of the wafer loader 3 for wafer grasping and positioning alignment. The first motor 61 drives the first robotic arm 62 to rotate, and the second motor drives the second robotic arm 63 to rotate to align the fork 65 with the wafer cassette of the wafer loader 3. The third motor and the fourth motor respectively drive the rotation of the two robotic arm plates 64 to make the fork 65 parallel to the wafer plane. Vacuum adsorption: The suction cup air pipe 67 is connected to the vacuum, and the suction cup 66 adsorbs the non-functional area at the back edge of the wafer. Wafer transfer: Joint coordinated movement, the composite movement of the first robotic arm 62 and the second robotic arm 63 transfers the wafer from the wafer loader 3, through the EFEM clean area, to the cavity component 7. The motion trajectory is planned by the machine control box 48 to avoid collision with other components inside the EFEM.

[0067] Automatic door assembly 6 opens: During the door opening preparation stage, the push cylinder 17 retracts and extends, pulling the heat-insulating outer door panel 18 and the sealed inner door panel 20 away from the sealing ring 32. During the horizontal door movement stage, the position adjustment cylinder 14 acts to slide the moving frame 16 horizontally along the slide rail 15, driving the heat-insulating outer door panel 18 and the sealed inner door panel 20 to move horizontally away from the door opening 21. The limit sensor 22 triggers a stop signal when the door panel is fully opened.

[0068] Wafer placement: The metal boat and the adjustment substrate 31 can be quickly replaced to adapt to different process requirements. For wafer placement, fine height adjustment is performed by the electric lifting screw rod part 56 to compensate for the height difference between the cavity component 7 and the wafer loader 3. After the automatic door assembly 6 is opened, the wafer is sent into the cavity component 7. To release the wafer, the suction cup air pipe 67 closes the vacuum, and the suction cup 66 releases the wafer onto the metal boat. The transfer robotic arm part 57 returns to the initial posture, and the lifting seat 60 descends to the standby height to prepare for the next transfer.

[0069] Automatic door assembly 6 closes: The moving frame 16 slides in the reverse direction to cover the door opening 21 with the door panel. The push cylinder 17 extends to push the sealed inner door panel 20 to press against the sealing ring 32 to form a vacuum seal.

[0070] Vacuum environment establishment: The baffle valve 36 is opened, and the vacuum pump 71 operates. The vacuum pump 71 evacuates the air through the cavity vacuum pipeline. The oxygen analyzer 38 monitors the oxygen concentration, and the pressure transmitter 37 feeds back the vacuum degree, quickly reducing the internal pressure of the cavity component 7 from atmospheric pressure to the low vacuum range. The hot gas in the evacuation pipeline is cooled by the water cooling unit. If an oxygen-free environment is required, the nitrogen gas pipeline 39 is connected to an external high-purity nitrogen gas source to flush the hollow furnace cavity 25 before the process and stably control the replacement of the residual oxygen.

[0071] Heating and process execution: The heating tube 29 is heated according to a preset curve. The heating tube 29 is evenly distributed in the heating zone formed by the heating tube shield 30 and the inner wall of the hollow furnace chamber 25. After power is turned on, it radiates heat to form a uniform temperature field. The four-core thermocouple tube 35 arranged symmetrically on the left and right has multiple bendable thermocouple wires 72 built in, extending to the inside of the furnace chamber and fixed to the thermocouple fixing block 73. The temperature distribution of the furnace chamber, such as the center / edge temperature difference, is monitored at multiple points to ensure that the temperature field uniformity is within ±1°C and prevent the temperature from changing due to position deviation. The wafer completes the baking, annealing or drying processes in a constant temperature environment on the metal boat, and the time is set by the program;

[0072] Cooling and breaking vacuum: After heating stops, the blower 11 injects cold air into the hollow air duct of the hollow furnace cavity 25 through the air inlet pipe 26. The airflow takes away the heat through the heating interval. The regulating blade of the exhaust pipe 28 is adjusted through the electric butterfly valve 27 to control the exhaust rate and achieve gradient cooling. The hot air is discharged from the exhaust pipe 28 to ensure efficient heat dissipation. The water cooling unit cools the outer wall of the furnace cavity synchronously to avoid thermal deformation. After the temperature drops to a safe value, the nitrogen pipeline 39 is connected to an external high-purity nitrogen source to flush the hollow furnace cavity 25. The nitrogen injection restores the normal pressure, stably controls the replacement of residual oxygen, avoids the wafer from contacting the air for oxidation, and accelerates the cooling at the same time.

[0073] Wafer removal and resetting: After the pressure in the chamber assembly 7 is balanced, the vacuum pump 71 is closed and put on standby, the automatic door assembly 6 is opened, the robot transfer assembly 8 enters to grab the wafers that have completed the process, and sends the wafers back to the designated position of the wafer loader 3 to complete a processing cycle. The automatic door assembly 6 is closed, and the vacuum pump assembly 5 is on standby, waiting for the next batch of wafers to be delivered. If other chamber assemblies 7 are idle, the robot transfer assembly 8 can process multiple wafers in parallel to improve efficiency.

[0074] The nitrogen chamber process flow is optional: if the process requires, the nitrogen pipeline 39 is connected to an external high-purity nitrogen source, and the high-purity nitrogen can be stably controlled to replace the residual oxygen to ensure an oxygen-free environment. After the wafer transfer is completed, the automatic door component 6 is closed, and the vacuum pump component 5 is turned on to evacuate. After the oxygen content and pressure values ​​meet the standards, the temperature and flow opening are set, and the temperature is started to rise. After the process flow is completed, the external air duct air-cooling blower is turned on, the heating tube stops heating, and the temperature is lowered. After the temperature is lowered, the automatic door component 6 is opened, and the robot transfer component 8 takes out the wafer from the chamber component 7;

[0075] The whole process is fully automatic and is controlled by the main control machine 4 and the machine control box 48 to ensure a high-precision, oxygen-free and pollution-free process environment.

[0076] Safety and Monitoring: The bottom liquid leakage tray detects liquid leakage, triggers audible and visual alarms and stops operation. All process data is recorded by the main control system, and the process is automatically terminated in case of anomalies. Throughout the process, through the cooperation of multiple sensors, mechanical linkage and gas-liquid cooling system, the full-automatic processing of wafers in an oxygen-free and high-precision temperature-controlled environment is realized.

[0077] In summary, the robot transfer component 8 is used to stably grasp and release wafers, realizing fast and lossless transfer of wafers between the wafer loader 3 and the chamber component 7, providing an efficient automation foundation for the vacuum oxygen-free process, and being the core execution mechanism to ensure the equipment throughput and process yield; through the cooperation of the oven frame component 1, the automatic door component 6 and the chamber component 7, a stable vacuum and oxygen-free environment is maintained; the chamber component 7 adopts multi-zone heating to ensure the uniformity of the temperature field, avoid stress deformation of the wafers, adopts a dual-mode of air cooling and water cooling to improve the equipment throughput, and the automatic door component 6 and the chamber component 7 cooperate with good sealing performance and are convenient for wafer loading and unloading; the chamber component 7 is linked with the vacuum pump component 5 to perform vacuum pumping after sealing is completed, and the chamber component 7 is connected to an external high-purity nitrogen source to perform accelerated cooling or return to normal pressure; the automatic door component 6 is synchronized with the robot transfer component 8, and the fully open signal of the door panel is used as the permission condition for the robot transfer component 8 to transfer wafers; the chamber component 7 cooperates with the oxygen analyzer 38, and if the sealing fails and the oxygen content increases, an alarm is immediately triggered and the process is terminated; through the cooperation of the EFEM frame body 43 and the FFU filter chassis 45, continuous downward delivery of clean air is realized to provide a clean environment for wafer transfer; the liquid leakage detection component ensures that expensive wafers and precision equipment in semiconductor manufacturing are protected from liquid leakage damage through real-time monitoring and rapid response; throughout the process, through the cooperation of multiple sensors, mechanical linkage and gas-liquid cooling system, the full-automatic processes of wafer loading, vacuum pumping, heating, constant-temperature process treatment, cooling, and wafer unloading are realized in an oxygen-free and high-precision temperature-controlled environment.

[0078] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Those skilled in the art of the present invention can make various modifications or supplements to the described specific embodiments or use similar methods for substitution, but will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A fully automatic vacuum and oxygen-free oven, comprising an oven frame assembly (1), an EFEM frame assembly (2) connected to the front side of the oven frame assembly (1), vacuum pump assemblies (5) symmetrically arranged on the left and right sides of the oven frame assembly (1), and four equally spaced and evenly distributed wafer loaders (3) located in front of the EFEM frame assembly (2), characterized in that, Inside the oven frame assembly (1), there are four cavity assemblies (7) distributed at the four corners and four automatic door assemblies (6) distributed at the four corners. Two cavity assemblies (7) at the same height are symmetrically arranged left and right, and two automatic door assemblies (6) at the same height are symmetrically arranged left and right. The positions of the automatic door assemblies (6) correspond to those of the cavity assemblies (7), and the automatic door assemblies (6) are located on the front side of the cavity assemblies (7). Inside the EFEM frame assembly (2), there are a robot transfer assembly (8) and a machine control box (48). On the left side of the EFEM frame assembly (2), there is a main control machine (4). The cavity assemblies (7) are respectively connected to the vacuum pump assemblies (5) on the same side through air extraction pipelines, and the cavity assemblies (7) are connected to an external high-purity nitrogen source; the oven frame assembly (1) includes an oven frame main body (9). Inside the oven frame main body (9), there are four independent cavity placement areas (10) distributed at the four corners. Inside the oven frame main body (9), there is a water cooling unit symmetrically arranged on both sides left and right. Four blowers (11) are fixed inside the oven frame main body (9). On both the left and right sides of the oven frame main body (9), there are several through-board connection pipelines (12) evenly distributed at equal intervals up and down. At the bottom side inside the oven frame main body (9), there is a liquid leakage detection component.

2. The fully automatic vacuum and oxygen-free oven according to claim 1, wherein The cavity assembly (7) includes two cavity support frames (23). The two cavity support frames (23) are fixed at the lower ends of the cavity placement areas (10) in corresponding positions. At the upper ends of the two cavity support frames (23), mica heat insulation plates (24) are fixed. At the upper ends of the two mica heat insulation plates (24), a hollow furnace cavity (25) is fixed. The hollow furnace cavity (25) is a box body with an opening at the front side. A hollow air duct is formed between the inner cavity wall of the hollow furnace cavity (25) and the outermost wall of the hollow furnace cavity (25). Heating tube shields (30) are arranged on the upper, lower, left, and right four sides inside the hollow furnace cavity (25). A heating interval is formed between the heating tube shields (30) and the hollow furnace cavity (25). Heating pipe fittings (29) are arranged inside the heating intervals. Thermocouple fixing blocks (73) are arranged on the left and right sides inside the hollow furnace cavity (25). At the upper end of the lower heating tube shield (30), an adjustment substrate (31) is provided. A metal boat is detachably arranged at the upper end of the adjustment substrate (31). Air inlet pipes (26) and exhaust pipes (28) are arranged on the outer side parts of the hollow furnace cavity (25). The air inlet pipes (26) and the exhaust pipes (28) are both connected to the hollow air duct of the hollow furnace cavity (25) to form a heat dissipation channel. The air inlet pipes (26) are connected to the air outlet ends of the blowers (11) in the same position. A flow regulating blade is rotatably arranged inside the exhaust pipe (28). An electric butterfly valve (27) is arranged on the exhaust pipe (28). The control shaft of the electric butterfly valve (27) is in transmission connection with the rotating shaft of the flow regulating blade. A sealing ring (32) and a water jacket pipe (33) are arranged at the front side opening of the hollow furnace cavity (25). The sealing ring (32) abuts against the outer side of the water jacket pipe (33). Two water guide pipes are connected between the water jacket pipes (33) of the two cavity assemblies (7) and the water cooling unit on the same side.

3. The fully automatic vacuum and oxygen-free oven according to claim 2, wherein, At the rear side of the hollow furnace cavity (25), there are a cavity vacuum pipeline, a nitrogen gas pipeline (39), a transmitter pipe, two symmetrically arranged four-core thermocouple pipes (35) and eight hollow pipes (34) connected thereto. The cavity vacuum pipeline is sequentially connected with an oxygen analyzer (38) and a baffle valve (36). The nitrogen gas pipeline (39) is sequentially connected with a high-vacuum solenoid valve, an MFC, a medium-vacuum solenoid valve and a combination unit and then connected to an external high-purity nitrogen gas source. A pressure transmitter (37) is connected to the transmitter pipe. Inside each of the four-core thermocouple pipes (35), there are a number of bendable thermocouple wires (72) evenly distributed in a circumferential direction. The bendable thermocouple wires (72) are fixed on the thermocouple fixing blocks (73) on the same side. At the end of each hollow pipe (34), a welded knife-edge flange (40) is fixed. Inside each hollow pipe (34), there is an externally threaded tension bolt. The externally threaded tension bolt is sleeved on a heating pipe fitting (29), and the end of the externally threaded tension bolt extends out of the welded knife-edge flange (40). An oxygen-free copper gasket seal ring (42) is sleeved on the externally threaded tension bolt. The oxygen-free copper gasket seal ring (42) is located inside the hollow pipe (34), and the oxygen-free copper gasket seal ring (42) abuts between the externally threaded tension bolt and the welded knife-edge flange (40). A pull plate flange (41) is screwed on the externally threaded tension bolt. The pull plate flange (41) abuts on the welded knife-edge flange (40) to tension the externally threaded tension bolt from the outside. At the end of each heating pipe fitting (29), there is an insulating ring. Two self-locking nuts are screwed on the end of each heating pipe fitting (29), and the inner self-locking nut abuts and locks on the insulating ring.

4. The fully automatic vacuum anaerobic oven according to claim 3, wherein The automatic door assembly (6) includes a bottom plate (13). The bottom plate (13) is fixed at the corresponding position on the front side of the oven frame body (9). A door opening (21) is formed on the bottom plate (13). The door opening (21) is directly opposite to the corresponding hollow furnace cavity (25). A sealing ring (32) extends out of the corresponding door opening (21). On the front side of the bottom plate (13), a drag chain groove plate (19), an adjusting cylinder (14), two slide rails (15) and two limit sensors (22) are fixed. The adjusting cylinder (14) is located above the door opening (21). The two slide rails (15) are located on the upper and lower sides of the door opening (21). The two limit sensors (22) are located on the left and right sides of the upper slide rail (15). A moving frame (16) is slidably arranged on the two slide rails (15). A number of pushing cylinders (17) are fixed on the moving frame (16). The telescopic ends of the number of pushing cylinders (17) are all fixed with heat-insulating outer door panels (18). A sealed inner door panel (20) is fixed on the rear side of the heat-insulating outer door panel (18). The drag chain groove plate (19) is located below the lower slide rail (15).

5. The fully automatic vacuum and oxygen-free oven according to claim 4, wherein The EFEM frame component (2) includes an EFEM frame body (43) and an FFU filter chassis (45). The EFEM frame body (43) is connected to the front side of the oven frame body (9). A four-color light is provided on the front side of the EFEM frame body (43). The machine control box (48) is arranged on the inner bottom side of the EFEM frame body (43). Side doors (44) are provided on both the left and right sides of the EFEM frame body (43). A transfer door (46) is provided on the front side of the EFEM frame body (43). An outer cover (51) is provided on the front side of the EFEM frame body (43). Four wafer loaders (3) are located inside the outer cover (51). A touch control screen (47) is provided on the left side of the EFEM frame body (43). A number of lighting lamps (49) and ion pumps (50) are provided above the interior of the EFEM frame body (43). The FFU filter chassis (45) is arranged above the EFEM frame body (43).

6. The fully automatic vacuum and oxygen-free oven according to claim 5, characterized in that, The liquid leakage detection component includes a liquid leakage tray. The liquid leakage tray is detachably arranged on the inner bottom side of the oven frame body (9). A number of nut columns are provided on the liquid leakage tray, and a liquid leakage sensor is fixed through the number of nut columns. When it is detected that liquid leakage occurs, the liquid leakage sensor reports to the main control machine (4), triggering the buzzer alarm of the four-color light and turning it red.

7. A fully automatic vacuum and oxygen-free oven according to claim 6, characterized in that, The robot transfer component (8) includes a base frame (53). The base frame (53) is fixed at the middle position of the inner bottom side of the EFEM frame body (43). A reinforcing frame (54) is fixed to the rear side of the base frame (53). The reinforcing frame (54) is fixedly connected to the middle position of the front side of the oven frame body (9). A vertically arranged electric lifting screw rod member (56) and two vertically arranged lifting guide rails (55) are provided on the front side of the base frame (53). The two lifting guide rails (55) are located on the left and right sides of the electric lifting screw rod member (56). A lifting seat (60) is slidably arranged on the two lifting guide rails (55). The lifting seat (60) is fixedly connected to the slider of the electric lifting screw rod member (56). A synchronous frame (52) is fixed to the rear side of the lifting seat (60). A robotic arm chassis (59) is provided on the lifting seat (60). A transfer robotic arm member (57) is provided above the robotic arm chassis (59).

8. A fully automatic vacuum anaerobic oven according to claim 7, characterized in that, The transplanting robotic arm member (57) includes a robotic arm chassis (59), the robotic arm chassis (59) is fixed above the lifting seat (60), a first robotic arm (62) is rotatably provided at the upper end of the robotic arm chassis (59), a first motor (61) is fixed inside the robotic arm chassis (59), the output shaft of the first motor (61) is fixedly connected to the rotating shaft of the first robotic arm (62), a second robotic arm (63) is rotatably provided at the upper end of the first robotic arm (62), a second motor is fixed inside the first robotic arm (62), the output shaft of the second motor is fixedly connected to the rotating shaft of the second robotic arm (63), a third motor and a fourth motor are fixed inside the second robotic arm (63), two robotic arm plates (64) are rotatably provided at the upper end of the second robotic arm (63), the axes of the rotating shafts of the two robotic arm plates (64) are collinear, the output shafts of the third motor and the fourth motor are respectively in transmission connection with the rotating shafts of the two robotic arm plates (64), a fork (65) is detachably provided at the end of the robotic arm plate (64), a suction cup air pipe (67) is provided at the lower part of the fork (65), a plurality of suction cups (66) are provided at the upper part of the fork (65), the suction cups (66) are connected to the suction cup air pipe (67), and a mapping sensor is provided on the fork (65).

9. The fully automatic vacuum anaerobic oven according to claim 8, wherein, The vacuum pump assembly (5) includes a vacuum pump box (68), two vacuum pumps (71) and two filters (70) are provided inside the vacuum pump box (68), the vacuum pumps (71) are connected to the filters (70) at corresponding positions, an air extraction pipeline is provided between the filter (70) and the baffle valve (36) of a cavity assembly (7) at the corresponding position, the air extraction pipeline passes through the water cooling unit on the same side respectively, and a heat dissipation hole plate (69) is provided at the upper end of the vacuum pump box (68).

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