A method for scheduling a die-bonding bracket

Abstract

The present invention discloses a method for scheduling die-bonding supports, which is performed by a conveyor mechanism. The method comprises: a first upper conveyor delivers a support that has not completed RGB die bonding, and / or a first lower conveyor delivers a support that has not undergone any die bonding operation; if the first upper conveyor continues to deliver supports, a rotary linear feed assembly and a rotary lifting drive mechanism cooperate to preferentially schedule the support delivered by the first upper conveyor to the corresponding die-bonding equipment for die bonding; if the first upper conveyor stops delivering supports, a rotary linear feed assembly and a rotary lifting drive mechanism cooperate to schedule the support delivered by the first lower conveyor to the corresponding die-bonding equipment for die bonding. The die-bonding support scheduling method provided by the present invention can effectively solve the problems of poor expansion flexibility and low production efficiency of existing Miniled die-bonding processes.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding equipment, and in particular to a crystal bonding bracket scheduling method. Background Art

[0002] When performing RGB die bonding, you must first bond the R chip, then the G chip, and finally the B chip.

[0003] Existing Miniled die bonding production lines typically include:

[0004] A conveying mechanism, the conveying mechanism being used to convey the stent;

[0005] A plurality of R die-bonding devices, each of which is sequentially arranged along the conveying mechanism, and each of which is used to perform R chip die-bonding operations on part of the die-bonding points of the bracket;

[0006] a plurality of G die-bonding devices, each of the G die-bonding devices being located downstream of all the R die-bonding devices and arranged sequentially along the conveying mechanism, each of the R die-bonding devices being used to perform G chip die-bonding operations on a portion of the R chips on the support;

[0007] A plurality of B die-bonding devices are provided, each of which is located downstream of all the G die-bonding devices and arranged in sequence along the conveying mechanism. Each of the B die-bonding devices is used to perform B chip die-bonding operations on a portion of the G chips on the support.

[0008] See also Figure 1 Taking the example of two R die bonding equipment, two G die bonding equipment, and two B die bonding equipment, the existing Miniled die bonding process is as follows:

[0009] ① The conveying mechanism 1 transports the empty rack without any chip bonding to the first R bonding device 2. After the first R bonding device 2 performs R chip bonding on half of the bonding points of the rack, it returns the rack to the conveying mechanism 1.

[0010] ② The conveying mechanism 1 transports the bracket that has completed the R chip bonding at half of the bonding points to the second R bonding device 3. After the second R bonding device 3 performs the R chip bonding operation at the other half of the bonding points of the bracket, it returns the bracket to the conveying mechanism 1;

[0011] ③ The conveying mechanism 1 transports the rack that has completed R chip bonding to the first G chip bonding device 4. After the first G chip bonding device 4 performs the G chip bonding operation on half of the R chips on the rack, it returns the rack to the conveying mechanism 1.

[0012] ④ The conveying mechanism 1 transports the rack that has completed the G chip bonding operation on half of the R chips to the second G chip bonding device 5. The second G chip bonding device 5 performs the G chip bonding operation on the other half of the R chips on the rack and then returns the rack to the conveying mechanism 1.

[0013] ⑤ The conveying mechanism 1 transports the rack that has completed G chip bonding to the first B die bonding device 6. After the first B die bonding device 6 performs the B chip bonding operation on half of the G chips on the rack, it returns the rack to the conveying mechanism 1.

[0014] ⑥ The conveyor mechanism 1 transports the rack that has completed the B chip bonding operation on half of the G chips to the second B chip bonding device 7. The second B chip bonding device 7 performs the B chip bonding operation on the other half of the G chips on the rack and then returns the rack to the conveyor mechanism 1.

[0015] ⑦ At this point, the RGB die bonding operation of all die bonding points on the bracket has been completed, and the conveying mechanism 1 transports the bracket on which the RGB die bonding operation has been completed to the downstream process.

[0016] The above process has the following problems:

[0017] ① The R-GB die bonding sequence is not adjustable. Therefore, after the B die bonding device, the R die bonding device or the G die bonding device cannot be installed. For example, if the existing Miniled die bonding production line has two R die bonding devices, two G die bonding devices, and two B die bonding devices, the specific die bonding device arrangement is RRGGBB.

[0018] If you want to expand production capacity later and increase the number of R die bond equipment, G die bond equipment, and B die bond equipment to three each, that is, the desired die bond equipment arrangement is RRRGGGBBB, you cannot simply add a set of R die bond equipment, G die bond equipment, and B die bond equipment behind the original RRGGBB die bond production line. Instead, you have to dismantle the entire RRGGBB die bond production line and reinsert a set of R die bond equipment, G die bond equipment, and B die bond equipment.

[0019] This results in poor flexibility of the entire production line and high costs for subsequent upgrades and expansions;

[0020] ② In theory, if the time it takes for all die-bonding devices to remove the brackets from conveyor mechanism 1 and the time it takes to put the brackets back on conveyor mechanism 1 after bonding are the same, then each forward transport operation of conveyor mechanism 1 can simultaneously meet the bracket transportation needs of all die-bonding devices;

[0021] However, in reality, there are deviations in the processing time of different die bonding equipment, which results in some die bonding equipment having a fast die bonding speed and some having a slow die bonding speed.

[0022] The existing conveying mechanism 1 is a single-layer conveyor belt structure, and each bracket can only be transported forward in sequence. Even if some of the crystal bonding equipment has completed the crystal bonding operation of its own workstation, the conveying mechanism 1 must wait until other crystal bonding equipment has completed the crystal bonding work of the corresponding workstation before it can uniformly transport the brackets forward. The waiting time of the crystal bonding equipment will cause production resources to be idle, greatly reducing production efficiency.

[0023] Therefore, it is necessary to improve the existing Miniled die bonding process to solve the problems of poor expansion flexibility and low production efficiency.

[0024] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Summary of the Invention

[0025] One object of the present invention is to provide a die-bonding bracket scheduling method that can effectively solve the problems of poor expansion flexibility and low production efficiency of the existing Miniled die-bonding process.

[0026] To achieve the above objectives, the present invention provides a die-bonding support scheduling method, which is performed by a transmission mechanism.

[0027] The conveying mechanism includes at least two fixed linear feeding assemblies arranged at intervals, a rotary linear feeding assembly located between two adjacent fixed linear feeding assemblies, and a rotary lifting drive mechanism for driving the rotary linear feeding assembly to rotate and lift relative to the fixed linear feeding assembly;

[0028] Wherein, each of the fixed linear feeding assemblies includes a first fixed linear feeding assembly located upstream of the rotary linear feeding assembly, and a second fixed linear feeding assembly located downstream of the rotary linear feeding assembly;

[0029] The first fixed linear feeding assembly includes, from top to bottom, a first upper conveying device, a first middle conveying device, and a first lower conveying device;

[0030] The second fixed linear feeding assembly includes, from top to bottom, a second upper conveying device, a second middle conveying device, and a second lower conveying device;

[0031] The rotary linear feeding assembly includes, from top to bottom, an upper dispatching conveying device and a lower dispatching conveying device;

[0032] The die-bonding bracket scheduling method includes:

[0033] S10: The first upper conveyor delivers a rack on which RGB die bonding has not been completed, and / or the first lower conveyor delivers a rack on which no die bonding has been performed;

[0034] S20: If the first upper conveyor continuously delivers the stents, the rotary linear feeding assembly and the rotary lifting drive mechanism cooperate to preferentially dispatch the stents delivered by the first upper conveyor to the corresponding die bonding equipment for die bonding operation;

[0035] S30: If the first upper conveyor stops delivering the bracket, the rotary linear feeding assembly and the rotary lifting drive mechanism cooperate to dispatch the bracket delivered by the first lower conveyor to the corresponding die bonding equipment for die bonding operation.

[0036] Optionally, the S20 includes:

[0037] S201: The rotary lifting drive mechanism drives the rotary linear feeding assembly to move until the scheduling upper conveyor is aligned with and flush with the first upper conveyor, and the scheduling lower conveyor is aligned with and flush with the first lower conveyor;

[0038] S202: The first upper conveyor transfers the racks that have not completed RGB die bonding to the scheduling upper conveyor, and the scheduling lower conveyor transfers the racks that have not completed the die bonding operation to the second lower conveyor;

[0039] S203: The rotary lifting drive mechanism drives the scheduling upper conveyor to rotate until it is aligned with and flush with the corresponding crystal bonding equipment; the corresponding crystal bonding equipment takes out the bracket from the first upper conveyor for crystal bonding, and transfers the bracket that has completed the crystal bonding operation of the crystal bonding equipment to the scheduling upper conveyor.

[0040] Optionally, the S203 includes:

[0041] If the bracket sent by the die bonding equipment has not completed RGB die bonding:

[0042] Then the rotary lifting drive mechanism drives the dispatching upper conveying device to rotate until it is directly opposite and flush with the second upper conveying device;

[0043] Then, the scheduling upper conveying device transports the bracket on which the RGB die bonding is not completed to the second upper conveying device.

[0044] Optionally, the S203 further includes:

[0045] If the bracket sent by the die bonding equipment has completed RGB die bonding:

[0046] The rotary lifting drive mechanism drives the upper dispatching conveyor to rotate and descend until it is aligned with and flush with the second middle conveyor;

[0047] Then, the upper conveying device is dispatched to transport the bracket on which the RGB die bonding has been completed to the second middle conveying device.

[0048] Optionally, the S30 includes:

[0049] S301: The rotary lifting drive mechanism drives the rotary linear feeding assembly to move until the scheduling upper conveyor is aligned with and flush with the first lower conveyor; the first lower conveyor conveys the stents that have not been die-bonded to the scheduling upper conveyor;

[0050] S302: The rotary lift drive mechanism drives the dispatching upper conveyor to rotate and rise until it is aligned with and flush with the corresponding die bonding equipment; the corresponding die bonding equipment removes the racks that have not been bonded from the first lower conveyor and performs the first R chip bonding, and returns the racks that have completed the bonding process of the die bonding equipment to the dispatching upper conveyor;

[0051] S303: The rotary lifting drive mechanism drives the scheduling upper conveyor to rotate until it is aligned with and flush with the second upper conveyor, and transfers the rack with R-chip die-bonding completed to the second upper conveyor;

[0052] S304: The other subsequent fixed linear feeding components, rotary linear feeding components, and rotary lifting drive mechanisms cooperate with each other to complete the remaining G chip and B chip bonding operations in sequence according to step S20.

[0053] Optionally, also include:

[0054] S40: If the first conveying device delivers a bracket with RGB die bonded, the rotary linear feeding assembly cooperates with the rotary lifting drive mechanism to transfer the bracket delivered by the first conveying device to the second conveying device.

[0055] Optionally, each of the die bonding devices includes an R die bonding device for performing R chip die bonding, a G die bonding device for performing G chip die bonding, and a B die bonding device for performing B chip die bonding;

[0056] Wherein, each of the G die-bonding devices is provided with an R die-bonding device upstream and a B die-bonding device downstream, so as to form a continuous RGB arrangement structure.

[0057] Optionally, also include:

[0058] S50: Adding a plurality of RGB die bonding modules behind the downstream B die bonding device and extending the conveying mechanism accordingly to expand the die bonding capacity; wherein the RGB die bonding modules sequentially include the R die bonding device, the G die bonding device, and the B die bonding device.

[0059] Optionally, both the fixed linear feeding assembly and the rotary linear feeding assembly include a conveyor fixing frame for mounting and fixing each conveyor, and a fixing frame transverse direct drive mechanism located at the bottom of the conveyor fixing frame;

[0060] Wherein, the driving direction of the fixed frame transverse direct drive mechanism is perpendicular to the feeding direction of the fixed linear feeding assembly.

[0061] Optional,

[0062] The rotary lifting drive mechanism comprises:

[0063] A rotary drive mechanism, wherein a driving end of the rotary drive mechanism is connected to the rotary linear feeding assembly and is used to drive the rotary linear feeding assembly to rotate around a vertical axis;

[0064] A lifting direct drive mechanism, wherein the driving end of the lifting direct drive mechanism is connected to the rotary drive mechanism, and is used to drive the rotary drive mechanism to drive the rotary linear feeding assembly to move up and down in the vertical direction.

[0065] The beneficial effect of the present invention is to provide a method for scheduling a die-bonding bracket, which has the following advantages:

[0066] 1. Modular and scalable architecture

[0067] Through the serial design of modular equipment groups and the connection with independent transmission units, seamless expansion of the end of the production line can be achieved, solving the problem of disassembly and reorganization of traditional production lines and reducing the difficulty of production line expansion.

[0068] 2. Three-dimensional transmission system

[0069] By adopting the coordinated scheduling of multi-layer fixed conveyor belts and rotating lifting mechanisms, a three-dimensional material channel is established to achieve parallel transmission and spatial reuse of brackets in different processes.

[0070] 3. Dynamic priority scheduling mechanism

[0071] Intelligently allocate transmission paths based on process status, prioritize the flow of semi-finished brackets, and simultaneously schedule raw material replenishment to eliminate equipment waiting windows and improve production efficiency.

[0072] 4. Multi-channel redundant transmission design

[0073] Construct upper / middle / lower layered transmission channels to achieve physical isolation of finished product output, semi-finished product processing and raw material input, ensuring system degradation operation in the event of a single channel failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0075] Figure 1 A schematic top view of an existing Miniled die bonding production line provided as background technology;

[0076] Figure 2 A side view of a transmission mechanism provided in an embodiment;

[0077] Figure 3 A schematic diagram of the inner side of a transmission mechanism provided in an embodiment;

[0078] Figure 4 A schematic top view of a Miniled die bonding production line with a four-module structure provided in an embodiment;

[0079] Figure 5 A flowchart of a die-bonding bracket scheduling method provided in an embodiment.

[0080] In the picture:

[0081] 100, first RGB module; 200, second RGB module; 300, third RGB module; 400, fourth RGB module;

[0082] 1. Conveying mechanism; 101. First fixed linear feeder assembly; 1011. First upper conveyor; 1012. First middle conveyor; 1013. First lower conveyor; 102. Second fixed linear feeder assembly; 1021. Second upper conveyor; 1022. Second middle conveyor; 1023. Second lower conveyor; 103. Rotary linear feeder assembly; 1031. Dispatching upper conveyor; 1032. Dispatching lower conveyor; 104. Rotary lifting drive mechanism; 1041. Rotary drive mechanism; 1042. Lifting direct drive mechanism; 105. Conveying mechanism fixed frame; 106. Fixed frame transverse direct drive mechanism;

[0083] 2. The first R die bonding equipment;

[0084] 3. Second R die bonding equipment;

[0085] 4. First G die bonding equipment;

[0086] 5. Second G die bonding equipment;

[0087] 6. First B die bonding equipment;

[0088] 7. Second B die bonding equipment;

[0089] 801, module 1 first R fixed feeding assembly; 802, module 1 R rotating feeding assembly; 803, module 1 second R fixed feeding assembly;

[0090] 901, module 1 first G fixed feeding assembly; 902, module 1 G rotating feeding assembly; 903, module 1 second G fixed feeding assembly;

[0091] 1001, module 1, first B fixed feeding assembly; 1002, module 1, B rotating feeding assembly; 1003, module 1, second B fixed feeding assembly;

[0092] 1101, first R fixed feeding assembly of module 2; 1102, R rotating feeding assembly of module 2; 1103, second R fixed feeding assembly of module 2;

[0093] 1201, module 2 first G fixed feeding assembly; 1202, module 2 G rotating feeding assembly; 1203, module 2 second G fixed feeding assembly;

[0094] 1301, the first B fixed feeding component of module 2; 1302, the B rotating feeding component of module 2; 1303, the second B fixed feeding component of module 2. DETAILED DESCRIPTION

[0095] Reference to "embodiments" in the present invention means that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the word "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in the present invention, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the embodiments can be combined in any manner to form a corresponding implementable technical solution.

[0096] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which the present invention belongs. The use of relevant terms herein is only for describing specific embodiments and is not intended to limit the present invention.

[0097] In the description of the present invention, the term "and / or" is used to describe a logical relationship between objects, indicating that three possible relationships exist. For example, A and / or B means: A exists, B exists, and both A and B exist. Furthermore, the character " / " generally indicates that the objects are in a logical "or" relationship.

[0098] In the present invention, terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0099] Without further restrictions, in the present invention, the words "include", "comprise", "have" or other similar expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0100] Consistent with the understanding in the Examination Guidelines, in the present invention, expressions such as "greater than," "less than," and "exceed" are understood to exclude the number itself; expressions such as "above," "below," and "within" are understood to include the number itself. Furthermore, in the description of the embodiments of the present invention, "multiple" means two or more (including two), and similar expressions related to "multiple," such as "multiple groups" and "multiple times," are also understood in this manner, unless otherwise specifically defined.

[0101] In the description of the embodiments of the present invention, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present invention or facilitating the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present invention.

[0102] Unless otherwise expressly specified or limited, in the description of the embodiments of the present invention, the terms "installed", "connected", "connected", "fixed", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection between two elements or the interaction relationship between two elements. For those skilled in the art of the technology to which the present invention belongs, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0103] The present invention provides a conveying mechanism, a Miniled die bonding production line and a die bonding bracket scheduling method, which are suitable for application scenarios in which each bracket is continuously transported to different die bonding equipment for die bonding. It can effectively solve the problems of poor expansion flexibility and low production efficiency of existing Miniled die bonding production lines.

[0104] As in Examples 1 and 2, various implementations of the conveying mechanism, Miniled die bonding production line, and die bonding support scheduling method of the present invention will be introduced below with reference to the accompanying drawings.

[0105] Example 1

[0106] This embodiment provides a conveying mechanism and a Miniled die-bonding production line. By coordinating the multi-layer fixed linear feeding assembly and the rotary linear feeding assembly, and by utilizing a modular die-bonding equipment layout, a rotating and lifting multi-directional transmission mechanism is utilized to achieve flexible expansion of the Miniled production line and efficient parallel production, thereby solving the problems of poor scalability and low production efficiency of the production line in the prior art.

[0107] The Miniled die bonding production line provided in this embodiment includes a conveying mechanism, a plurality of R die bonding devices, a plurality of G die bonding devices, and a plurality of B die bonding devices.

[0108] See also Figure 2 and Figure 3 The conveying mechanism 1 is used to convey stents. Specifically, the conveying mechanism 1 includes at least two fixed linear feeder assemblies spaced apart from each other, a rotary linear feeder assembly 103 located between two adjacent fixed linear feeder assemblies, and a rotary lift drive mechanism 104 for driving the rotary linear feeder assembly 103 to rotate and lift relative to the fixed linear feeder assemblies.

[0109] in,

[0110] The fixed linear feeding assembly includes at least three layers of fixed conveying devices arranged from top to bottom, and the rotary linear feeding assembly 103 includes at least two layers of scheduling conveying devices arranged from top to bottom;

[0111] The rotary lifting drive mechanism 104 is used to:

[0112] ① Driving the rotary linear feeding assembly 103 to rotate parallel to the feeding direction of each of the fixed linear feeding assemblies to perform material transfer operations between the fixed linear feeding assemblies and the rotary linear feeding assembly 103;

[0113] ② Drive the rotary linear feeding assembly 103 to rotate perpendicular to the feeding direction of each of the fixed linear feeding assemblies to perform material transfer operations between the rotary linear feeding assembly 103 and the die bonding platform.

[0114] In this embodiment:

[0115] Each of the R die-bonding devices is provided with a corresponding rotary linear feeding assembly 103, and each of the R die-bonding devices is used to perform R chip die-bonding operations on some die-bonding points of the bracket;

[0116] Each of the G die-bonding devices is correspondingly provided with one of the rotary linear feeding components 103 , and each of the R die-bonding devices is used to perform the G chip die-bonding operation on the R chip portion of the bracket;

[0117] Each B die-bonding device is correspondingly provided with one of the rotary linear feeding components 103 , and each B die-bonding device is used to perform a B chip die-bonding operation on a portion of the G chips on the support.

[0118] Generally, during the die bonding process, the chips are provided by the die bonding equipment, and the conveying mechanism 1 is mainly used to transfer the support. Therefore, in this embodiment, the conveying mechanism 1 is mainly used to transfer the support.

[0119] Of course, in some other embodiments, according to actual production needs, the conveying mechanism 1 can also be used for the transmission operation of the wafer ring, and the present invention is not limited to this.

[0120] The following mainly takes the conveying mechanism 1 used for conveying the stent as an example to illustrate the working principles of the conveying mechanism 1 and the Miniled die bonding production line.

[0121] In this embodiment, the number of the fixed conveying device is three (in some other embodiments, a four-layer, five-layer or even more-layer structure may be provided to increase the bracket transmission speed of the fixed conveying device); further:

[0122] Each of the fixed linear feeding components includes a first fixed linear feeding component 101 located upstream of the rotary linear feeding component 103, and a second fixed linear feeding component 102 located downstream of the rotary linear feeding component 103;

[0123] The fixed conveying devices of the first fixed linear feeding assembly 101 include, from top to bottom, a first upper conveying device 1011, a first middle conveying device 1012, and a first lower conveying device 1013;

[0124] The fixed conveying devices of the second fixed linear feeding assembly 102 include, from top to bottom, a second upper conveying device 1021 , a second middle conveying device 1022 , and a second lower conveying device 1023 .

[0125] In this embodiment, the dispatching conveyor device has two layers (in some other embodiments, a three-layer, four-layer or even more-layer structure can also be provided to increase the dispatching speed of the rotary linear feeding assembly 103); further:

[0126] Each of the scheduling and conveying devices includes, from top to bottom, a scheduling upper conveying device 1031 and a scheduling lower conveying device 1032.

[0127] Optionally, the intervals between two adjacent fixed conveying devices are equal, and when the uppermost fixed conveying device is flush with the uppermost scheduling conveying device, the lowermost fixed conveying device is flush with the lowermost scheduling conveying device.

[0128] Furthermore, the conveying device is a conveyor belt or a conveyor roller group.

[0129] The conveying mechanism 1 and the Miniled die bonding production line provided in this embodiment can implement the following die bonding support scheduling method to complete continuous die bonding operations:

[0130] S10: The first upper conveying device 1011 delivers a rack on which RGB die bonding has not been completed, and / or the first lower conveying device 1013 delivers a rack on which no die bonding has been performed at all;

[0131] In this embodiment, the unfinished RGB die-bonding brackets delivered by the first upper conveyor 1011 may fall into two situations:

[0132] The first type is a bracket that has already undergone die bonding of some chips, for example, R chip die bonding, or R chip and G chip die bonding. This type of bracket with partially bonded chips is generally delivered by the second upper conveyor device 1021 of the previous second fixed linear feed assembly 102 via a scheduling conveyor device. The remaining chip die bonding needs to be completed based on the previously bonded chips to obtain a bracket with completed RGB die bonding.

[0133] The second type is a rack that has never been subjected to a die bonding operation, that is, all the die bonding holes on the entire die bonding rack are empty; this type of rack that has never been subjected to a die bonding operation is generally sent by the second lower conveyor device 1023 of the previous second fixed linear feeding assembly 102 through the scheduling conveyor device, and the first die bonding operation (that is, the most basic R chip die bonding operation) needs to be performed on this rack, so that the rack that has completed the R chip die bonding operation is transported to the downstream first upper conveyor device 1011 through the downstream scheduling conveyor device, so that the remaining G chip and B chip die bonding operations are completed in sequence in the downstream die bonding equipment, and the rack that has completed the RGB die bonding operation is obtained;

[0134] The first lower conveying device 1013 sends the brackets that have not undergone any bonding operation, mainly for conveying the brackets to the idle R bonding equipment downstream. Therefore, if there is no idle R bonding equipment, the brackets that have not undergone any bonding operation will continue to be conveyed forward at the bottom layer until an idle R bonding equipment appears. Only then will they be transported upward to the corresponding R bonding equipment through the corresponding scheduling conveying device to perform the most basic R chip bonding operation.

[0135] S20: If the first upper conveyor 1011 continuously delivers the stents, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to preferentially dispatch the stents delivered by the first upper conveyor 1011 to the corresponding die bonding equipment for die bonding operation;

[0136] It should be noted that if the first upper conveyor 1011 continuously delivers racks, it means that the upstream second lower conveyor 1023 is continuously delivering racks that have already undergone R chip bonding or RG chip bonding. At this time, the racks delivered by the first upper conveyor 1011 should be prioritized for the bonding of the remaining chips.

[0137] Specifically, the S20 includes:

[0138] S201: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move until the scheduling upper conveying device 1031 is aligned with and flush with the first upper conveying device 1011, and the scheduling lower conveying device 1032 is aligned with and flush with the first lower conveying device 1013;

[0139] S202: The first upper conveyor 1011 transfers the racks that have not completed RGB die bonding to the scheduling upper conveyor 1031, and the scheduling lower conveyor 1032 transfers the racks that have not completed the die bonding operation to the second lower conveyor 1023;

[0140] S203: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate until it is aligned with and aligned with the corresponding die bonding equipment; the corresponding die bonding equipment takes out the rack from the first upper conveyor 1011 for die bonding, and transfers the rack that has completed the die bonding operation of the die bonding equipment to the scheduling upper conveyor 1031:

[0141] If the bracket sent by the die bonding equipment has not yet completed RGB die bonding, the rotary lift drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate until it is aligned with and aligned with the second upper conveyor 1021; then, the scheduling upper conveyor 1031 transports the bracket that has not completed RGB die bonding to the second upper conveyor 1021;

[0142] If the bracket sent out by the bonding equipment has completed RGB bonding, the rotating and lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate and descend until it is opposite and flush with the second middle conveyor 1022; then, the scheduling upper conveyor 1031 transports the bracket that has completed RGB bonding to the second middle conveyor 1022.

[0143] S30: If the first upper conveying device 1011 stops delivering the stent, the rotary linear feeding assembly 103 dispatches the corresponding die bonding equipment to perform die bonding on the stent delivered by the first lower conveying device 1013 .

[0144] If the first upper conveyor 1011 stops delivering the stents, it means that the stents on the upstream first upper conveyor 1011 have completed the RGB die bonding process, and all the stents delivered by the upstream first upper conveyor 1011 have been transferred to the first middle conveyor 1012 and the second middle conveyor 1022 by the upstream scheduling upper conveyor 1031;

[0145] At this time, it is necessary to obtain a new bracket from the second lower conveying device 1023 at the bottom layer to perform the first round of R chip bonding operation.

[0146] Specifically, the S30 includes:

[0147] S301: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move until the upper scheduling conveyor 1031 is aligned with and flush with the first lower conveyor 1013; the first lower conveyor 1013 conveys the stents that have not been die-bonded to the upper scheduling conveyor 1031;

[0148] S302: The rotary lift drive mechanism 104 drives the dispatching upper conveyor 1031 to rotate and rise until it is aligned with and flush with the corresponding die bonding equipment; the corresponding die bonding equipment removes the unbonded racks from the first lower conveyor 1013 and performs the first R-chip bonding, and returns the racks that have completed the bonding process to the dispatching upper conveyor 1031;

[0149] S303: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate until it is aligned with and aligned with the second upper conveyor 1021, and transfers the rack with R-chip die-bonding completed to the second upper conveyor 1021;

[0150] S304: The other subsequent fixed linear feeding components, the rotary linear feeding component 103, and the rotary lifting drive mechanism 104 cooperate with each other to complete the remaining G chip and B chip bonding operations in sequence according to step S20.

[0151] S40: If the first conveying device 1012 delivers a bracket with RGB die bonded, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to transfer the bracket delivered by the first conveying device 1012 to the second conveying device 1022.

[0152] In this embodiment, each G die-bonding device is upstream of an R die-bonding device and downstream of a B die-bonding device, forming a continuous RGB arrangement (RGB-RGB-...). Three adjacent R, G, and B die-bonding devices form an RGB die-bonding module.

[0153] Next, see Figure 4 , an explanation is given by taking the case where there are four RGB die-bonding modules (respectively denoted as “first RGB module 100 ”, “second RGB module 200 ”, “third RGB module 300 ”, and “fourth RGB module 400 ”).

[0154] Accordingly,

[0155] The die-bonding equipment of the first RGB module 100 is sequentially denoted as the first R die-bonding equipment 2 , the first G die-bonding equipment 4 , and the first B die-bonding equipment 6 ;

[0156] The die-bonding equipment of the second RGB module 200 is sequentially denoted as the second R die-bonding equipment 3 , the second G die-bonding equipment 5 , and the second B die-bonding equipment 7 ;

[0157] Each of the fixed linear feed assembly and the rotary linear feed assembly 103 is denoted as:

[0158] Module 1 first R fixed feeding component 801, module 1 R rotating feeding component 802, module 1 second R fixed feeding component 803,

[0159] Module 1 first G fixed feeding component 901, module 1 G rotating feeding component 902, module 1 second G fixed feeding component 903,

[0160] Module 1 first B fixed feeding component 1001, module 1 B rotating feeding component 1002, module 1 second B fixed feeding component 1003,

[0161] Module 2 first R fixed feeding component 1101, module 2 R rotating feeding component 1102, module 2 second R fixed feeding component 1103,

[0162] Module 2 first G fixed feeding component 1201, module 2 G rotating feeding component 1202, module 2 second G fixed feeding component 1203,

[0163] Module 2 first B fixed feeding component 1301, module 2 B rotating feeding component 1302, module 2 second B fixed feeding component 1303.

[0164] Assume that the bracket needs to go through the complete processing of two RGB die-bonding modules (R→G→B→R→G→B), and each module only completes 50% of the die-bonding work of the corresponding chip. The specific die-bonding bracket scheduling method is as follows:

[0165] Step 1: Initial bracket into the first RGB module 100

[0166] (1) Bracket input:

[0167] ① The first lower conveyor 1013 of the first R fixed feeding assembly 801 of module 1 continuously delivers the brackets that have not been bonded.

[0168] ② The first middle conveyor 1012 of the first R fixed feeding assembly 801 of module 1 continuously delivers the brackets with completed RGB die bonding;

[0169] First, the first lower conveyor 1013 of the first R fixed feeding assembly 801 of the module 1 transfers the bracket to the dispatching upper conveyor 1031 of the R rotating feeding assembly 802 of the module 1, and the dispatching upper conveyor 1031 of the R rotating feeding assembly 802 of the module 1 transports the bracket upward to the first R die-bonding device 2;

[0170] Then, the first lower conveying device 1013 of the first R fixed feeding component 801 of module 1 will transfer the remaining brackets to the dispatching lower conveying device 1032 of the R rotating feeding component 802 of module 1, which will pass through the second R fixed feeding component 803 of module 1, the first G fixed feeding component 901 of module 1, the G rotating feeding component 902 of module 1, the second G fixed feeding component 903 of module 1, the first B fixed feeding component 1001 of module 1, the B rotating feeding component 1002 of module 1, the second B fixed feeding component 1003 of module 1, the first R fixed feeding component 1101 of module 2, the R rotating feeding component 803 of module 1 and the second R fixed feeding component 803 of module 1. The lower layers of the plurality of linear feeding assemblies, including the material assembly 1102, the second R fixed feeding assembly 1103 of module 2, the first G fixed feeding assembly 1201 of module 2, the G rotary feeding assembly 1202 of module 2, the second G fixed feeding assembly 1203 of module 2, the first B fixed feeding assembly 1301 of module 2, the B rotary feeding assembly 1302 of module 2, and the second B fixed feeding assembly 1303 of module 2, are directly transported to the third RGB module 300; so that while the first RGB module 100 and the second RGB module 200 are performing the die bonding operation, the third RGB module 300 and the fourth RGB module 400 can also perform the die bonding operation simultaneously without waiting, thereby improving production efficiency;

[0171] Furthermore, if more RGB bonding modules need to be added later, it is only necessary to directly add RGB bonding modules and corresponding extended conveying mechanism 1 behind the fourth RGB module 400 without disassembling the entire production line, which greatly improves the flexibility of expanding the bonding production line.

[0172] (2) R die bonding equipment processing:

[0173] Rotational docking: The module 1 R rotary feeding assembly 802 is rotated 90° and lifted so that the upper conveying device 1031 is aligned with the first R die-bonding device 2 .

[0174] Plate removal processing: The first R die bonding device 2 takes away the bracket that has not been bonded at all, and puts another bracket with 50% of the R chip bonded into the scheduling conveyor 1031 of the module 1 R rotary feeding component 802.

[0175] Return transport: The racks with 50% of the R chip die-bonding area completed are transported downwards by the dispatching upper transport device 1031 of the module-1 R rotary feed assembly 802 to the second upper transport device 1021 of the module-1 second R fixed assembly and are marked as "R partially completed";

[0176] The RGB solid crystal operation bracket transportation has been completed: the module-R rotating feeding component 802 cooperates with the corresponding rotating lifting drive mechanism 104, and the bracket sent by the first middle conveying device 1012 of the module-first R fixed feeding component 801 is transferred to the second middle conveying device 1022 of the module-second R fixed feeding component 803 through the scheduling of the upper conveying device 1031 and / or the scheduling of the lower conveying device 1032 of the module-R rotating feeding component 802.

[0177] Step 2: The bracket enters the G die bonding device of the first RGB module 100

[0178] (1) Transmit to G device:

[0179] The second upper conveying device 1021 of the second R fixed assembly of module 1 delivers the completed bracket of the R part to the first upper conveying device 1011 of the first G fixed assembly of module 1;

[0180] The second middle conveying device 1022 of the second R fixed assembly of module 1 delivers the bracket on which the RGB die bonding operation has been completed to the first middle conveying device 1012 of the first G fixed assembly of module 1.

[0181] (2) G die bonding equipment processing:

[0182] Rotational docking: The dispatching upper conveyor 1031 of the module 1 G rotary feeding component 902 first receives the bracket sent by the second upper conveyor 1021 of the module 1 second R fixed component, and then rotates 90° and lifts it so that the dispatching upper conveyor 1031 is aligned with the first G crystal bonding equipment 4 platform.

[0183] Board removal processing: The first G die-bonding device 4 takes away the bracket and sends the bracket with 50% of the G chip die-bonding area completed (covering the completed R area) back to the scheduling upper conveyor 1031.

[0184] Return transport: After processing, the bracket is sent back to the second upper transport device 1021 of the second G fixed assembly of module 1 through the scheduling upper transport device 1031 of module 1 G rotary feeding assembly 902, and marked as "G part completed";

[0185] The RGB die bonding operation has been completed. The G rotary feeder assembly 902 of the module 1 cooperates with the corresponding rotary lift drive mechanism 104 to transfer the brackets delivered by the first middle conveyor 1012 of the first G fixed feeder assembly 901 of the module 1 to the second middle conveyor 1022 of the second G fixed feeder assembly 903 of the module 1 through the upper conveyor 1031 and / or the lower conveyor 1032 of the G rotary feeder assembly 902.

[0186] Step 3: The bracket enters the B die-bonding device of the first RGB module 100

[0187] (1) Transmit to device B:

[0188] The second upper conveying device 1021 of the second G fixed assembly of module 1 delivers the bracket to the first upper conveying device 1011 of the first B fixed assembly of module 1, and then transfers it to the rotating feeding assembly 1002 of module 1;

[0189] The second middle conveying device 1022 of the second G fixed assembly of module 1 delivers the bracket on which the RGB die bonding operation has been completed to the first middle conveying device 1012 of the first B fixed assembly of module 1.

[0190] (2) B die bonding equipment processing:

[0191] Rotational docking: The upper conveying device 1031 of the module 1 B rotary feeding component 1002 first receives the bracket sent by the second upper conveying device 1021 of the module 1 second G fixed component, and then rotates 90° to align the upper conveying device 1031 with the first B bonding device 6 platform.

[0192] Board removal processing: The first B die-bonding device 6 takes away the bracket and puts the bracket with 50% of the B chip die-bonding area completed (covering the completed G area) back to the scheduling upper conveyor 1031 of the module 1 B rotary feeding component 1002.

[0193] Return transport: The processed stent is sent back to the second upper transport device 1021 of the second B fixed assembly of module 1 through the dispatching upper transport device 1031 of module 1 B rotary feeding assembly 1002 and marked as "Part B completed";

[0194] The RGB solid crystal operation bracket transportation has been completed: the module-B rotating feeding component 1002 cooperates with the corresponding rotating lifting drive mechanism 104, and the bracket sent by the first middle conveying device 1012 of the module-first B fixed feeding component 1001 is transferred to the second middle conveying device 1022 of the module-second B fixed feeding component 1003 through the scheduling upper conveying device 1031 and / or scheduling lower conveying device 1032 of the module-B rotating feeding component 1002.

[0195] Step 4: Transmit the bracket across the module to the second RGB module 200

[0196] (1) Inter-module connection:

[0197] The second upper conveying device 1021 of the second B fixed assembly of module 1 transfers the bracket to the first upper conveying device 1011 of the first R fixed assembly of module 2;

[0198] The second middle conveying device 1022 of the second B fixed assembly of module 1 transfers the bracket to the first middle conveying device 1012 of the first R fixed assembly of module 2;

[0199] The second lower conveying device 1023 of the second B fixed assembly of module 1 transfers the bracket to the first lower conveying device 1013 of the first R fixed assembly of module 2.

[0200] (2) Entering the second R die-bonding device 3 of the second RGB module 200:

[0201] The subsequent process is exactly the same as steps 1-3, but the second R die-bonding device 3, the second G die-bonding device 5, and the second B die-bonding device 7 complete the R→G→B chip die-bonding of the remaining 50% area.

[0202] (3) Final state: After the bracket is completed in the second B bonding device 7 of the second RGB module 200, the bracket is marked as "completely bonded" and is transported by the scheduling upper conveyor 1031 of the module 2 B rotating feed assembly 1302 to the second middle conveyor 1022 of the module 2 second B fixed feed assembly 1303, and is sent downstream through the second middle conveyor 1022.

[0203] In the above process, while the first RGB module 100 and the second RGB module 200 are performing the die bonding operation, the third RGB module 300 can also perform the die bonding operation synchronously without waiting, thereby improving production efficiency;

[0204] Furthermore, if more RGB bonding modules need to be added later, it is only necessary to directly add a new RGB bonding module and a corresponding extended conveying mechanism 1 behind the last RGB bonding module (the fourth RGB module 400), without the need to disassemble the entire production line, which greatly improves the flexibility of expanding the bonding production line.

[0205] Therefore, the conveying mechanism 1 and the Miniled die bonding production line provided in this embodiment can effectively solve the problems of poor expansion flexibility and low production efficiency of the existing Miniled die bonding production line.

[0206] In this embodiment, both the fixed linear feeding assembly and the rotary linear feeding assembly 103 include a conveyor fixing frame 105 for mounting and fixing each conveyor, and a fixing frame transverse direct drive mechanism 106 located at the bottom of the conveyor fixing frame 105;

[0207] Wherein, the driving direction of the fixed frame transverse direct drive mechanism 106 is perpendicular to the feeding direction of the fixed linear feeding assembly.

[0208] The fixed frame transverse direct drive mechanism 106 of the fixed linear feeding assembly is used to adjust the lateral position of the fixed linear feeding assembly so that the fixed linear feeding assembly is aligned with the upstream equipment and thus smoothly receives materials from the upstream equipment.

[0209] The fixed frame transverse direct drive mechanism 106 of the rotary linear feeding assembly 103 is used to adjust the lateral position of the rotary linear feeding assembly 103 so that the rotary linear feeding assembly 103 is aligned with the fixed linear feeding assembly, and then after delivering the material to the downstream equipment, it can smoothly receive the material from the upstream fixed linear feeding assembly.

[0210] Optionally, the rotary and lifting drive mechanism 104 includes a rotary drive mechanism 1041 and a lifting direct drive mechanism 1042 .

[0211] The driving end of the rotary drive mechanism 1041 is connected to the rotary linear feeding assembly 103 and is used to drive the rotary linear feeding assembly 103 to rotate around the vertical axis;

[0212] The driving end of the lifting direct drive mechanism 1042 is connected to the rotating drive mechanism 1041, which is used to drive the rotating drive mechanism 1041 to drive the rotary linear feeding assembly 103 to move up and down in the vertical direction, so that each scheduling conveying device moves to be flush with the corresponding fixed conveying device under different working conditions.

[0213] It should be pointed out that, each of the G die-bonding devices is provided with an R die-bonding device upstream and a B die-bonding device downstream to form an RGB-RGB-... arrangement structure. With such an arrangement of die-bonding devices, when more RGB die-bonding modules need to be added in the future, it is only necessary to directly add an RGB die-bonding module and a corresponding extended conveying mechanism 1 behind the last RGB module, without the need to disassemble the entire production line, which greatly improves the flexibility of the expansion of the die-bonding production line. Therefore, such an arrangement of die-bonding devices is preferred.

[0214] Of course, in some other embodiments, limited by process requirements or design factors, each of the G bonding devices can be located downstream of all the R bonding devices, and each of the B bonding devices can be located downstream of all the G bonding devices to form an arrangement structure of RR...-GG...-BB... The conveying structure provided in this embodiment can also meet the bracket conveying requirements of the arrangement structure of the bonding device, and the present invention is not limited to this.

[0215] It should be noted that the direct drive mechanism mentioned in the present invention can be a cylinder, a hydraulic cylinder, an electric cylinder, or a motor-screw linear module, and the rotary drive mechanism 1041 mentioned can be a brushed motor, a brushless motor, or a rotary cylinder. The present invention does not limit the specific structural forms of the direct drive mechanism and the rotary drive mechanism 1041.

[0216] In summary, the conveying mechanism 1 and the Miniled die bonding production line provided in this embodiment have the following advantages:

[0217] 1. Modular and scalable architecture

[0218] Through the serial design of modular equipment groups and the connection with independent transmission units, seamless expansion of the end of the production line can be achieved, solving the problem of disassembly and reorganization of traditional production lines and reducing the difficulty of production line expansion.

[0219] 2. Three-dimensional transmission system

[0220] By adopting the coordinated scheduling of multi-layer fixed conveyor belts and rotating lifting mechanisms, a three-dimensional material channel is established to achieve parallel transmission and spatial reuse of brackets in different processes.

[0221] 3. Dynamic priority scheduling mechanism

[0222] Intelligently allocate transmission paths based on process status, prioritize the flow of semi-finished brackets, and simultaneously schedule raw material replenishment to eliminate equipment waiting windows and improve production efficiency.

[0223] 4. Multi-channel redundant transmission design

[0224] Construct upper / middle / lower layered transmission channels to achieve physical isolation of finished product output, semi-finished product processing and raw material input, ensuring system degradation operation in the event of a single channel failure.

[0225] Example 2

[0226] See also Figure 5 This embodiment provides a die-bonding bracket scheduling method, which is executed by the conveying mechanism 1 and / or the Miniled die-bonding production line provided in Example 1 and has the same functions and beneficial effects.

[0227] The die bonding bracket scheduling method provided in this embodiment includes:

[0228] S10: The first upper conveying device 1011 delivers a rack on which RGB die bonding has not been completed, and / or the first lower conveying device 1013 delivers a rack on which no die bonding has been performed at all;

[0229] S20: If the first upper conveyor 1011 continuously delivers the stents, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to preferentially dispatch the stents delivered by the first upper conveyor 1011 to the corresponding die bonding equipment for die bonding operation;

[0230] S30: If the first upper conveying device 1011 stops delivering the stent, the rotary linear feeding assembly 103 dispatches the corresponding die bonding equipment to perform die bonding on the stent delivered by the first lower conveying device 1013 .

[0231] Optionally, the S20 includes:

[0232] S201: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move until the scheduling upper conveying device 1031 is aligned with and flush with the first upper conveying device 1011, and the scheduling lower conveying device 1032 is aligned with and flush with the first lower conveying device 1013;

[0233] S202: The first upper conveyor 1011 transfers the racks that have not completed RGB die bonding to the scheduling upper conveyor 1031, and the scheduling lower conveyor 1032 transfers the racks that have not completed the die bonding operation to the second lower conveyor 1023;

[0234] S203: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate until it is aligned with and aligned with the corresponding die bonding equipment; the corresponding die bonding equipment takes out the rack from the first upper conveyor 1011 for die bonding, and transfers the rack that has completed the die bonding operation of the die bonding equipment to the scheduling upper conveyor 1031:

[0235] If the bracket sent by the die bonding equipment has not yet completed RGB die bonding, the rotary lift drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate until it is aligned with and aligned with the second upper conveyor 1021; then, the scheduling upper conveyor 1031 transports the bracket that has not completed RGB die bonding to the second upper conveyor 1021;

[0236] If the bracket sent out by the bonding equipment has completed RGB bonding, the rotating and lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate and descend until it is opposite and flush with the second middle conveyor 1022; then, the scheduling upper conveyor 1031 transports the bracket that has completed RGB bonding to the second middle conveyor 1022.

[0237] Furthermore, the S30 includes:

[0238] S301: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move until the upper scheduling conveyor 1031 is aligned with and flush with the first lower conveyor 1013; the first lower conveyor 1013 conveys the stents that have not been die-bonded to the upper scheduling conveyor 1031;

[0239] S302: The rotary lift drive mechanism 104 drives the dispatching upper conveyor 1031 to rotate and rise until it is aligned with and flush with the corresponding die bonding equipment; the corresponding die bonding equipment removes the unbonded racks from the first lower conveyor 1013 and performs the first R-chip bonding, and returns the racks that have completed the bonding process to the dispatching upper conveyor 1031;

[0240] S303: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate until it is aligned with and aligned with the second upper conveyor 1021, and transfers the rack with R-chip die-bonding completed to the second upper conveyor 1021;

[0241] S304: The other subsequent fixed linear feeding components, the rotary linear feeding component 103, and the rotary lifting drive mechanism 104 cooperate with each other to complete the remaining G chip and B chip bonding operations in sequence according to step S20.

[0242] S40: If the first conveying device 1012 delivers a bracket with RGB die bonded, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to transfer the bracket delivered by the first conveying device 1012 to the second conveying device 1022.

[0243] In this embodiment, each of the die bonding devices includes an R die bonding device for performing R chip die bonding, a G die bonding device for performing G chip die bonding, and a B die bonding device for performing B chip die bonding;

[0244] Wherein, each of the G die-bonding devices is provided with an R die-bonding device upstream and a B die-bonding device downstream, so as to form a continuous RGB arrangement structure; at this time, the die-bonding support scheduling method may further include:

[0245] S50: Add several RGB die bonding modules behind the downstream B die bonding equipment and extend the conveying mechanism 1 accordingly to expand the production capacity of the Miniled die bonding production line; wherein the RGB die bonding modules include R die bonding equipment, G die bonding equipment, and B die bonding equipment in sequence.

[0246] In summary, the die bonding bracket scheduling method provided in this embodiment also has the following advantages:

[0247] 1. Modular and scalable architecture

[0248] Through the serial design of modular equipment groups and the connection with independent transmission units, seamless expansion of the end of the production line can be achieved, solving the problem of disassembly and reorganization of traditional production lines and reducing the difficulty of production line expansion.

[0249] 2. Three-dimensional transmission system

[0250] By adopting the coordinated scheduling of multi-layer fixed conveyor belts and rotating lifting mechanisms, a three-dimensional material channel is established to achieve parallel transmission and spatial reuse of brackets in different processes.

[0251] 3. Dynamic priority scheduling mechanism

[0252] Intelligently allocate transmission paths based on process status, prioritize the flow of semi-finished brackets, and simultaneously schedule raw material replenishment to eliminate equipment waiting windows and improve production efficiency.

[0253] 4. Multi-channel redundant transmission design

[0254] Construct upper / middle / lower layered transmission channels to achieve physical isolation of finished product output, semi-finished product processing and raw material input, ensuring system degradation operation in the event of a single channel failure.

[0255] On the basis of Example 1, the features not explained in this embodiment adopt the explanation in Example 1 and have the same functions and beneficial effects, and will not be described in detail here.

[0256] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concepts of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A method for scheduling a die-bonding support, performed by a transmission mechanism (1), characterized in that: The conveying mechanism (1) comprises at least two fixed linear feeding assemblies arranged at intervals, a rotary linear feeding assembly (103) located between two adjacent fixed linear feeding assemblies, and a rotary lifting drive mechanism (104) for driving the rotary linear feeding assembly (103) to rotate and lift relative to the fixed linear feeding assembly; Each of the fixed linear feeding assemblies comprises a first fixed linear feeding assembly (101) located upstream of the rotary linear feeding assembly (103), and a second fixed linear feeding assembly (102) located downstream of the rotary linear feeding assembly (103); The first fixed linear feeding assembly (101) comprises, from top to bottom, a first upper conveying device (1011), a first middle conveying device (1012), and a first lower conveying device (1013); The second fixed linear feeding assembly (102) comprises, from top to bottom, a second upper conveying device (1021), a second middle conveying device (1022), and a second lower conveying device (1023); The rotary linear feeding assembly (103) comprises, from top to bottom, an upper dispatching conveying device (1031) and a lower dispatching conveying device (1032); The die-bonding bracket scheduling method includes: S10: the first upper conveying device (1011) delivers a bracket on which RGB die bonding has not been completed, and / or the first lower conveying device (1013) delivers a bracket on which no die bonding operation has been performed; S20: If the first upper conveying device (1011) continuously delivers brackets, the rotary linear feeding assembly (103) and the rotary lifting drive mechanism (104) cooperate to preferentially dispatch the brackets delivered by the first upper conveying device (1011) to the corresponding crystal bonding equipment for crystal bonding operations; S30: If the first upper conveying device (1011) stops delivering the bracket, the rotary linear feeding assembly (103) and the rotary lifting drive mechanism (104) cooperate to dispatch the bracket delivered by the first lower conveying device (1013) to the corresponding crystal bonding equipment for crystal bonding operation.

2. The die-bonding bracket scheduling method according to claim 1, characterized in that: The S20 includes: S201: the rotary lifting drive mechanism (104) drives the rotary linear feeding assembly (103) to move until the scheduling upper conveying device (1031) is aligned with and flush with the first upper conveying device (1011), and the scheduling lower conveying device (1032) is aligned with and flush with the first lower conveying device (1013); S202: the first upper conveying device (1011) transfers the bracket on which the RGB die bonding has not been completed to the scheduling upper conveying device (1031), and the scheduling lower conveying device (1032) transfers the bracket on which the die bonding operation has not been completed to the second lower conveying device (1023); S203: The rotating and lifting driving mechanism (104) drives the scheduling upper conveyor (1031) to rotate until it is aligned with and aligned with the corresponding crystal bonding equipment; the corresponding crystal bonding equipment takes out the bracket from the first upper conveyor (1011) for crystal bonding, and transfers the bracket that has completed the crystal bonding operation of the crystal bonding equipment to the scheduling upper conveyor (1031).

3. The die-bonding bracket scheduling method according to claim 2, characterized in that: The S203 includes: If the bracket sent by the die bonding equipment has not completed RGB die bonding: The rotary lifting drive mechanism (104) drives the dispatching upper conveying device (1031) to rotate until it is aligned with and flush with the second upper conveying device (1021); Then, the scheduling upper conveying device (1031) conveys the bracket on which the RGB crystal bonding is not completed to the second upper conveying device (1021).

4. The die-bonding support scheduling method according to claim 2, wherein: The S203 further includes: If the bracket sent by the die bonding equipment has completed RGB die bonding: The rotating and lifting driving mechanism (104) drives the dispatching upper conveying device (1031) to rotate and descend until it is aligned with and flush with the second middle conveying device (1022); Then, the upper conveying device (1031) transports the bracket on which the RGB crystal bonding has been completed to the second middle conveying device (1022).

5. The die-bonding bracket scheduling method according to claim 1, characterized in that: The S30 includes: S301: the rotary lifting drive mechanism (104) drives the rotary linear feeding assembly (103) to move until the scheduling upper conveyor (1031) is aligned with and flush with the first lower conveyor (1013); the first lower conveyor (1013) conveys the bracket that has not been crystal-bonded to the scheduling upper conveyor (1031); S302: the rotating and lifting driving mechanism (104) drives the scheduling upper conveyor (1031) to rotate and rise until it is aligned with and flush with the corresponding die bonding equipment; the corresponding die bonding equipment takes out the brackets that have not been subjected to the die bonding operation from the first lower conveyor (1013), performs the first R chip die bonding, and returns the brackets that have completed the die bonding operation of the die bonding equipment to the scheduling upper conveyor (1031); S303: the rotary lifting drive mechanism (104) drives the scheduling upper conveyor (1031) to rotate until it is aligned with and flush with the second upper conveyor (1021), and transfers the bracket on which the R chip bonding has been completed to the second upper conveyor (1021); S304: The subsequent other fixed linear feeding components, the rotary linear feeding components (103), and the rotary lifting drive mechanism (104) cooperate with each other to complete the remaining G chip and B chip bonding operations in sequence according to step S20.

6. The die-bonding bracket scheduling method according to claim 1, characterized in that: Also includes: S40: If the first conveying device (1012) delivers a bracket on which RGB crystal bonding has been completed, the rotary linear feeding assembly (103) and the rotary lifting drive mechanism (104) cooperate to transfer the bracket delivered by the first conveying device (1012) to the second conveying device (1022).

7. The die-bonding bracket scheduling method according to claim 1, characterized in that: Each of the die bonding devices includes an R die bonding device for performing R chip die bonding, a G die bonding device for performing G chip die bonding, and a B die bonding device for performing B chip die bonding; Wherein, each of the G die-bonding devices is provided with an R die-bonding device upstream and a B die-bonding device downstream, so as to form a continuous RGB arrangement structure.

8. The die-bonding support scheduling method according to claim 7, characterized in that: Also includes: S50: After the most downstream B die bonding equipment, a plurality of RGB die bonding modules are added and the conveying mechanism (1) is correspondingly extended to expand the die bonding production capacity; wherein the RGB die bonding modules include R die bonding equipment, G die bonding equipment, and B die bonding equipment in sequence.

9. The die-bonding bracket scheduling method according to claim 1, characterized in that: Both the fixed linear feeding assembly and the rotary linear feeding assembly (103) include a conveyor fixing frame (105) for mounting and fixing each conveyor, and a fixing frame transverse direct drive mechanism (106) located at the bottom of the conveyor fixing frame (105); Wherein, the driving direction of the fixed frame transverse direct drive mechanism (106) is perpendicular to the feeding direction of the fixed linear feeding assembly.

10. The die-bonding bracket scheduling method according to claim 1, characterized in that: The rotary lifting drive mechanism (104) comprises: A rotary drive mechanism (1041), wherein a driving end of the rotary drive mechanism (1041) is connected to the rotary linear feeding assembly (103) and is used to drive the rotary linear feeding assembly (103) to rotate around a vertical axis; A lifting direct drive mechanism (1042), wherein the driving end of the lifting direct drive mechanism (1042) is connected to the rotary drive mechanism (1041), and is used to drive the rotary drive mechanism (1041) to drive the rotary linear feeding assembly (103) to move up and down in the vertical direction.

Images