Wafer position adjuster

Abstract

The invention belongs to the field of semiconductors, and particularly relates to a wafer position adjuster which comprises a support, a wafer supporting frame capable of enabling a wafer to be horizontally placed is arranged on the support through a lifting device, a wafer clamping claw is arranged on the support through a rotating mechanism, and the free end of the wafer clamping claw faces upwards. The moving path of each claw toe of the wafer clamping claw is parallel to the upper surface of the support, the vertical central axis of the wafer supporting frame and the vertical central axis of the wafer clamping claw are collinear, clamping seams matched with the claw toes are reserved in the wafer supporting frame, a detection device matched with the wafer clamping claw is arranged on the support, and the wafer clamping claw is arranged on the wafer supporting frame. The detection device is in signal connection with the rotating mechanism and the lifting device; according to the wafer clamping device, the problems that the wafer is not in a horizontal state after being clamped and the clamping force for clamping the wafer is not uniform due to the fact that the wafer is directly clamped by a clamping jaw at present are solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductors, and specifically relates to a wafer position adjuster. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. During the feeding or processing of wafers, their positional relationships have specified standards. Usually, there is a notch on the wafer (as Figure 1 shown). When feeding, it is necessary to ensure that the notch of the wafer aligns with a certain position (such as the front side of the station or the left side of the station, etc.) to ensure that other mechanisms can process the accurate positions on the wafer during processing. Currently, the only device used to fix the wafer is a clamping jaw. By clamping the circumferential surface of the wafer with the clamping jaw, when workers place the wafer, they need to hold it by hand first and then wait until the clamping jaw clamps it before letting go. This method easily causes the wafer not to be in a horizontal state after being clamped, and the clamping force of the wafer clamped by the clamping jaw is uneven. Summary of the Invention

[0003] The main purpose of this application is to address the shortcomings of the existing technology. By adopting the method of setting a wafer support frame on the bracket that cooperates with the wafer clamping jaw, a wafer position adjuster is designed, enabling the wafer to be in a horizontal state before being clamped by the clamping jaw. Then, through the precise detection of the detection device and the precise rotation of the rotation mechanism, the problems that directly using the clamping jaw to clamp the wafer easily leads to the wafer not being in a horizontal state after being clamped and the uneven clamping force of the wafer being clamped are solved.

[0004] To achieve the above purpose, the technical solution adopted in this application is:

[0005] A wafer position adjuster includes a bracket. A wafer support frame capable of horizontally placing a wafer is provided on the bracket through a lifting device. A wafer clamping jaw is provided on the bracket through a rotation mechanism. The free end of the wafer clamping jaw faces upward. The moving path of each claw toe of the wafer clamping jaw is parallel to the upper surface of the bracket. The vertical central axis of the wafer support frame coincides with the vertical central axis of the wafer clamping jaw. A clamping slot for cooperating with the claw toe is reserved on the wafer support frame. A detection device cooperating with the wafer clamping jaw is provided on the bracket. The detection device is signal-connected to the rotation mechanism and the lifting device.

[0006] Preferably, the wafer support frame includes a support disk and support claws. The support disk is provided on the bracket. The support disk is parallel to the upper surface of the bracket. At least three support claws are provided around the central axis of the support disk on the support disk. The tops of all the support claws are at the same height. The lower surface of the support disk is fixedly connected to the execution end of the lifting device.

[0007] Preferably, one end of the support rod A is fixedly connected to the support disc, and the other end of the support rod A is fixedly provided with the support claw, and the support rod A is parallel to the upper surface of the bracket.

[0008] Preferably, the lifting device includes a first mounting plate, a lifting motor, an eccentric wheel, and a support rod. The first mounting plate and the lifting motor are both fixedly provided in the bracket. A first slide rail perpendicular to the upper surface of the bracket is provided on the first mounting plate. A slider is slidably provided between the two ends of the first slide rail. The lower end of the support rod is fixedly connected to the slider. The support rod is parallel to the first slide rail. The top end of the support rod is fixedly connected to the wafer support frame. One end face of the eccentric wheel is fixedly connected to the output shaft of the lifting motor. The output shaft of the lifting motor is parallel to the upper surface of the bracket and perpendicular to the end face of the eccentric wheel. A notch is provided on the side wall of the slider parallel to the support rod. The upper side wall of the notch is slidably connected to the circumferential surface of the eccentric wheel. The length of the notch is greater than the diameter of the eccentric wheel.

[0009] Preferably, the wafer clamping claw includes a mounting disc, a linear motor, mounting rods, and the claw toes. The mounting disc is rotatably provided on the bracket. At least three second slide rails are provided around the center of the mounting disc on the mounting disc. All the second slide rails are parallel to the upper surface of the bracket. One end of each second slide rail faces the center of the mounting disc, and the other end faces outside the mounting disc. The two ends of each mounting rod are slidably connected to the mounting disc through a corresponding second slide rail. The corresponding mounting rods are parallel to the second slide rails. One claw toe is provided at one end of each mounting rod facing away from the center of the mounting disc. A first pin shaft is provided at one end of each mounting rod facing the center of the mounting disc. All the first pin shafts are perpendicular to the upper surface of the bracket. One end of each connecting rod B is rotatably connected to a corresponding first pin shaft. A rotating disc is coaxially rotatably provided on the mounting disc. Second pin shafts corresponding to each connecting rod B are evenly provided around the center on the upper surface of the rotating disc. All the second pin shafts are parallel to all the first pin shafts. The other end of one connecting rod B is rotatably connected to a corresponding second pin shaft. The linear motor is fixedly provided on the mounting disc. A driving rod is radially fixedly provided on the output shaft of the linear motor. The driving rod is parallel to the upper surface of the bracket. The driving rod is fixedly connected to one side of one mounting rod. The output shaft of the linear motor is parallel to the mounting rod fixedly connected to the driving rod. All the mounting rods are circumferentially and equidistantly arranged on the mounting disc. The mounting disc is coaxially fixedly connected to the output shaft of the rotating mechanism. The distance from the end of the mounting rod facing away from the center of the mounting disc to the center of the mounting disc is greater than the distance from the outer edge of the wafer support frame to the center of the mounting disc.

[0010] Preferably, a U-shaped member is provided on the side wall of the mounting rod connected to the driving rod. The projection of the U-shaped member on the mounting disc is U-shaped. The closed end of the U-shaped member is fixedly connected to the mounting rod connected to the driving rod. One end of the driving rod facing away from the output shaft of the linear motor is located inside the U-shaped of the U-shaped member. A pin is provided on the U-shaped member. The pin is parallel to the mounting rod on which the U-shaped member is provided. A through hole with an axis parallel to the output shaft of the linear motor is provided on the driving rod. The two ends of the pin penetrate through the through hole, and the two ends of the pin are fixed on the U-shaped member. A spring is sleeved between the side of the mounting rod on which the U-shaped member is provided facing the center of the mounting disc and the inner side wall of the U-shaped member on the pin.

[0011] Preferably, a first sensor is provided on the mounting disc. An additional plate is provided on the side wall of a part of the mounting rod. An induction notch cooperating with the first sensor is provided on the additional plate. The additional plate is parallel to the mounting rod on which it is provided. The first sensor is signal-connected to the linear motor.

[0012] Preferably, the rotating mechanism includes a rotating motor, a first pulley, a second pulley, a second mounting plate, and a rotating shaft. The rotating shaft is rotatably provided on the second mounting plate. The second mounting plate is fixedly provided on the bracket. The upper end of the rotating shaft is coaxially and fixedly provided with the mounting disc. The lower end of the rotating shaft is coaxially and fixedly provided with the second pulley. The rotating motor is fixedly provided on the second mounting plate. The output shaft of the rotating motor is fixedly provided with the first pulley. The first pulley and the second pulley are connected by a belt for transmission.

[0013] Compared with the prior art, the present application has the following beneficial effects:

[0014] The present application adopts the method of setting a wafer support frame cooperating with the wafer clamping claws on the bracket, and designs a wafer position adjuster, so that the wafer can be in a horizontal state before being clamped by the clamping claws, and then through the precise detection of the detection device and the precise rotation of the rotating mechanism, the problems that currently directly using the clamping claws to clamp the wafer, which easily leads to the wafer not being in a horizontal state after being clamped and the uneven clamping force of the wafer being clamped are solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a structural schematic diagram of the wafer;

[0016] Figure 2 is a structural schematic diagram of the present application;

[0017] Figure 3 is a structural schematic diagram of the present application after removing the outer housing on the bracket;

[0018] Figure 4 This is a diagram showing the relationship between the lifting device and the bracket in this application;

[0019] Figure 5 is Figure 4 an exploded view of;

[0020] Figure 6 is Figure 5 a schematic diagram of the left side;

[0021] Figure 7 This is a diagram showing the relationship between the wafer clamping jaw and the bracket in this application;

[0022] Figure 8 is Figure 7 an enlarged view of area A in;

[0023] Figure 9 is a part drawing of the linear motor, U-shaped component, spring, and pin;

[0024] Figure 10 is a diagram showing the relationship between the rotating disk and the mounting rod;

[0025] Figure 11 is Figure 10 a schematic diagram of the structure of the back side;

[0026] Figure 12 is a diagram showing the relationship between the rotating mechanism and the bracket;

[0027] Figure 13 This is a schematic diagram showing a wafer placed on the support claw of this application;

[0028] Figure 14 This is a schematic diagram when the wafer clamping jaw of this application grabs the wafer;

[0029] Figure 15 is a schematic diagram of the structure of the support claw.

[0030] Among them, 1. Bracket; 2. Claw toe; 3. Detection device; 4. Support disk; 5. Support claw; 5-1. Blocking protrusion; 6. Connecting rod A; 7. First mounting plate; 8. Lifting motor; 9. Eccentric wheel; 10. Support rod; 11. First slide rail; 12. Slide block; 13. Notch; 14. Mounting disk; 15. Linear motor; 16. Mounting rod; 17. Second slide rail; 18. First pin shaft; 19. Connecting rod B; 20. Second pin shaft; 21. Driving rod; 22. U-shaped component; 23. Pin; 24. Through hole; 25. Spring; 26. First sensor; 27. Induction notch; 28. Additional plate; 29. Rotating motor; 30. Second mounting plate; 31. Rotating shaft; 32. Belt; 33. First pulley; 34. Second pulley; 35. Rotating disk; 36. Wafer; 37. Notch; 38. Second sensor; 40. PCBA circuit board. Detailed implementation mode

[0031] As Figures 1 - 15 shown, a wafer position adjuster includes a bracket 1. A wafer support frame capable of horizontally placing a wafer is provided on the bracket 1 through a lifting device. A wafer clamping claw is provided on the bracket 1 through a rotating mechanism. The free end of the wafer clamping claw faces upward. The moving path of each claw toe 2 of the wafer clamping claw is parallel to the upper surface of the bracket 1. The vertical central axis of the wafer support frame coincides with the vertical central axis of the wafer clamping claw. A clamping slot for cooperating with the claw toe 2 is reserved on the wafer support frame. A detection device 3 cooperating with the wafer clamping claw is provided on the bracket 1. The detection device 3 is signal-connected to the rotating mechanism and the lifting device.

[0032] In this embodiment, the user places the wafer 36 on the wafer support frame, and the wafer support frame supports the wafer 36 so that the wafer 36 is in a horizontal state. After that, the lifting device lifts the wafer support frame, that is, raises the wafer support frame. Then the wafer clamping claws grasp the wafer 36. Since the moving path of each claw toe 2 is parallel to the upper surface of the support 1, when the wafer clamping claws grasp the wafer 36, the claw toe 2 contacts the circumferential surface of the wafer 36, so that the notch 37 on the wafer 36 is not blocked. Then the rotating mechanism drives the wafer clamping claws to rotate, that is, at this time the wafer 36 rotates around its own center as the center point. When the wafer 36 rotates to the position where the notch 37 is located at the detection device 3 under the action of the rotating mechanism, the detection device 3 can detect the notch 37 on the wafer 36, thus realizing automatic adjustment. In practical applications, a PCBA circuit board 40 is set for calculation. The PCBA circuit board 40 is fixed in the support 1, and the rotating mechanism, the lifting device, and the wafer clamping claws are uniformly controlled through the PCBA circuit board 40. Then the rotating mechanism, the lifting device, and the wafer clamping claws are all signal-connected to the PCBA circuit board 40. The detection device is arranged above the wafer clamping claws, and the detection device can detect the edge of the wafer 36 placed on the wafer support frame.

[0033] The wafer support frame includes a support disk 4 and support claws 5. The support disk 4 is arranged on the support 1. The support disk 4 is parallel to the upper surface of the support 1. At least three support claws 5 are arranged around the central axis of the support disk 4 on the support disk 4. The tops of all the support claws 5 are at the same height. The lower surface of the support disk 4 is fixedly connected to the execution end of the lifting device.

[0034] After such a setting, the support disk 4 is used to install the support claws 5. The fact that the tops of all the support claws 5 are at the same height can ensure that after the wafer 36 is placed on the support claws 5, the wafer 36 is in a horizontal state, which is convenient for the next operation. Among them, the gap between two adjacent support claws 5 forms a clamping slot that cooperates with the claw toe 2, so as to facilitate the wafer clamping claws to clamp the wafer 36.

[0035] Preferably, a blocking protrusion 5-1 is arranged on the upper surface of each support claw 5 on the side facing away from the center of the support plate 4. The distance from each blocking protrusion 5-1 to the center of the support plate 4 is equal, and is equal to the radius of the wafer 36. The roots of all the blocking protrusions 5-1 on one side of the central axis of the support plate 4 are located on a virtual circle A, and the diameter of this virtual circle A is equal to the diameter of the wafer. The tops of all the blocking protrusions 5-1 on one side of the central axis of the support plate 4 are located on a virtual circle B, and the diameter of this virtual circle B is larger than the diameter of the wafer. This facilitates the worker to place the wafer 36 on the support claws 5.

[0036] As a preferred embodiment, one end of the connecting rod A6 is fixedly connected to the support disk 4, and the other end of the connecting rod A6 is fixedly provided with the support claw 5. The connecting rod A6 is parallel to the upper surface of the bracket 1. In this way, through the arrangement of the connecting rod A6, the support claw 5 is located outside the support disk 4, which can avoid the situation that the support disk 4 affects the process of the wafer clamping claw clamping the wafer.

[0037] As a preferred embodiment, the lifting device includes a first mounting plate 7, a lifting motor 8, an eccentric wheel 9, and a support rod 10. The first mounting plate 7 and the lifting motor 8 are both fixedly arranged inside the bracket 1. A first slide rail 11 perpendicular to the upper surface of the bracket 1 is provided on the first mounting plate 7. A slider 12 is slidably arranged between the two ends of the first slide rail 11. The lower end of the support rod 10 is fixedly connected to the slider 12. The support rod 10 is parallel to the first slide rail 11. The top end of the support rod 10 is fixedly connected to the wafer support frame. One end face of the eccentric wheel 9 is fixedly connected to the output shaft of the lifting motor 8. The output shaft of the lifting motor 8 is parallel to the upper surface of the bracket 1 and perpendicular to the end face of the eccentric wheel 9. A notch 13 is provided on the side wall of the slider 12 parallel to the support rod 10. The upper side wall of the notch 13 is slidably connected to the circumferential surface of the eccentric wheel 9. The length of the notch 13 is greater than the diameter of the eccentric wheel 9. After such an arrangement, when the wafer 36 is placed on the support claw 5, the lifting motor 8 rotates, thereby driving the eccentric wheel 9 to rotate. The rotation of the eccentric wheel 9 drives the slider 12 to move through the notch 13. Due to the existence of the first slide rail 11, the slider 12 and the support rod 10 can only move up and down under the action of the lifting motor 8. Among them, the length of the notch 13 being greater than the diameter of the eccentric wheel 9 can ensure that the eccentric wheel 9 is not stuck by the notch 13 during the movement. The lifting motor 8 is signal-connected to the detection device 3. If the PCBA circuit board 40 is adopted, the lifting motor 8 is signal-connected to the PCBA circuit board 40.

[0038] Preferably, a second sensor 38 is provided on the bracket 1, so as to sense whether the wafer 36 is placed on the support claw 5 through the second sensor 38. If the PCBA circuit board 40 is adopted, the second sensor 38 is signal-connected to the PCBA circuit board 40.

[0039] As a preferred embodiment, the wafer gripping claws include a mounting disk 14, a linear motor 15, mounting rods 16, and the claw toes 2. The mounting disk 14 is rotatably disposed on the bracket 1. At least three second slide rails 17 are provided around the center of the mounting disk 14 on the mounting disk 14. All the second slide rails 17 are parallel to the upper surface of the bracket 1. One end of each second slide rail 17 faces the center of the mounting disk 14, and the other end faces outside the mounting disk 14. The two ends of each mounting rod 16 are slidably connected to the mounting disk 14 through a corresponding second slide rail 17. The corresponding mounting rods 16 are parallel to the second slide rails 17. One claw toe 2 is provided at one end of each mounting rod 16 facing away from the center of the mounting disk 14. A first pin shaft 18 is provided at one end of each mounting rod 16 facing the center of the mounting disk 14. All the first pin shafts 18 are perpendicular to the upper surface of the bracket 1. One end of each connecting rod B19 is rotatably connected to a corresponding first pin shaft 18. The rotating disk 35 is coaxially rotatably disposed on the mounting disk 14. Second pin shafts 20 corresponding to each connecting rod B19 are evenly provided around the center on the upper surface of the rotating disk 35. All the second pin shafts 20 are parallel to all the first pin shafts 18. The other end of one connecting rod B19 is rotatably connected to a corresponding second pin shaft 20. The linear motor 15 is fixedly provided on the mounting disk 14. A driving rod 21 is radially fixedly provided on the output shaft of the linear motor 15. The driving rod 21 is parallel to the upper surface of the bracket 1. The driving rod 21 is fixedly connected to one side of one mounting rod 16. The output shaft of the linear motor 15 is parallel to the mounting rod 16 fixedly connected to the driving rod 21. After such a circumferential array, when looking down at the mounting disk 4, all the mounting rods 6 can be seen to be either arranged clockwise or counterclockwise, so as to ensure that all the claw toes 2 are driven simultaneously. All the connecting rods B19 are circumferentially equidistantly arrayed on the mounting disk 4. The mounting disk 14 is coaxially fixedly connected to the output shaft of the rotating mechanism. The distance from the end of the mounting rod 16 facing away from the center of the mounting disk 14 to the center of the mounting disk 14 is greater than the distance from the outer edge of the wafer support frame to the center of the mounting disk 14.

[0040] After such a setting, the purpose of the mounting disk 14 is to install the linear motor 15, the mounting rod 16, the second slide rail 17, the rotating disk 35, and to connect to the output shaft of the rotating mechanism. The settings of the rotating disk 35, the second slide rail 17, and the connecting rod B19 are mainly to ensure that when the linear motor 15 drives an axial movement of a mounting rod 16 to achieve the clamping or releasing action, the three claw toes 2 can move synchronously. The setting that the distance from the end of the mounting rod 16 facing away from the center of the mounting disk 14 to the center of the mounting disk 14 is greater than the distance from the outer edge of the wafer support frame to the center of the mounting disk 14 is to ensure that the movement of the claw toes 2 will not be affected by the wafer support frame, especially not by the support disk 4. If a PCBA circuit board 40 is adopted, the linear motor 15 is signal-connected to the PCBA circuit board 40, and the linear motor 15 is controlled through the PCBA circuit board 40.

[0041] As a preferred method, a U-shaped component 22 is provided on the side wall of the mounting rod 16 connected to the driving rod 21. The projection of the U-shaped component 22 on the mounting disk 14 is U-shaped. The closed end of the U-shaped component 22 is fixedly connected to the mounting rod 16 connected to the driving rod 21. One end of the driving rod 21 facing away from the output shaft of the linear motor 15 is located inside the U-shape of the U-shaped component 22. A pin 23 is provided on the U-shaped component 22. The pin 23 is parallel to the mounting rod 16 on which the U-shaped component 22 is provided. A through hole 24 with an axis parallel to the output shaft of the linear motor 15 is provided on the driving rod 21. The two ends of the pin 23 penetrate through the through hole 24, and the two ends of the pin 23 are fixed on the U-shaped component 22. A spring 25 is sleeved between the side of the mounting rod 16 on which the U-shaped component 22 is provided facing the center of the mounting disk 14 and the inner side wall of the U-shaped component 22 on the pin 23. After such a setting, due to the setting of the spring 25, when the three claw toes 2 all move towards the center of the mounting disk 14, that is, when clamping the wafer 36, the setting of the spring 25 can play a buffering role to prevent the wafer 36 from being damaged. The settings of the pin 23 and the U-shaped component 22 are to facilitate the installation of the spring 25. The setting of the driving rod 21 is equivalent to an extension of the mounting rod 16. Through the setting of the driving rod 21, the spring 25 can prevent the mounting rod 16 from moving beyond the limit.

[0042] As a preferred method, a first sensor 26 is provided on the mounting disc 14, an additional plate 28 is provided on the side wall of a part of the mounting rod 16, an induction notch 27 that cooperates with the first sensor 26 is provided on the additional plate 28, the additional plate 28 is parallel to the mounting rod 16 on which it is provided, and the first sensor 26 is signal-connected to the linear motor 15. By providing the first sensor 26, the mounting rod 16 is prevented from exceeding the necessary movement limit. For example, when the first sensor 26 does not sense any object, it is a normal situation. However, when the mounting rod 16 moves out of the mounting disc 14 beyond a certain limit, the first sensor 26 senses one side wall of the induction notch 27. At this time, the first sensor 26 transmits a signal to the linear motor 15, and the linear motor 15 stops working. Similarly, when the mounting rod 16 moves into the mounting disc 14 beyond a certain limit, the first sensor 26 senses the other side wall of the induction notch 27. At this time, the first sensor 26 transmits a signal to the linear motor 15, and the linear motor 15 stops working.

[0043] As a preferred method, the rotating mechanism includes a rotating motor 29, a first pulley 33, a second pulley 34, a second mounting plate 30, and a rotating shaft 31. The rotating shaft 31 is rotatably arranged on the second mounting plate 30. The second mounting plate 30 is fixedly arranged on the bracket 1. The upper end of the rotating shaft 31 is coaxially and fixedly provided with the mounting disc 14. The lower end of the rotating shaft 31 is coaxially and fixedly provided with the second pulley 34. The rotating motor 29 is fixedly arranged on the second mounting plate 30. The output shaft of the rotating motor 29 is fixedly provided with the first pulley 33. The first pulley 33 and the second pulley 34 are drivingly connected by a belt 32. After such an arrangement, when the rotating motor 29 rotates, it drives the first pulley 33 to rotate. The first pulley 33 drives the second pulley 33 to rotate through the belt 32. Since the second pulley 33 is coaxially and fixedly connected to the rotating shaft 31, the mounting disc 14 is driven to rotate, and then the entire wafer clamping claw is driven to rotate. Among them, the rotating disc 35, the mounting disc 14, the rotating shaft 31, and the second pulley 14 are all provided with through holes for the support rod 10 to pass through, so that when the rotating disc 35, the mounting disc 14, the rotating shaft 31, and the second pulley 14 rotate, it does not affect the support rod 10. At the same time, when the lifting motor 8 drives the support rod 10 to move up and down, it does not affect the rotation of the entire wafer clamping claw.

[0044] Preferably, the detection device 3 includes at least a pair of detection sensors. All the detection sensors are signal-connected to the PCBA circuit board 40. A preset gap is provided between two detection sensors in the same pair of detection sensors. One detection sensor in the same pair of detection sensors is located below the support claw 5, and the other detection sensor is located above the support claw 5. In this way, the detection sensors can detect the edge of the wafer 36 placed on the support claw 5, can detect whether there is a wafer on the support claw 5, and can be used to detect the notch 37 on the wafer.

Claims

1. A wafer position adjuster, characterized in that: The invention comprises a support (1), wherein a wafer support frame capable of placing a wafer horizontally is provided on the support (1) via a lifting device, and a wafer clamping claw is provided on the support (1) via a rotating mechanism, wherein the free end of the wafer clamping claw is upward, and the moving path of each claw (2) of the wafer clamping claw is parallel to the upper surface of the support (1), and the vertical center axis of the wafer support frame is colinear with the vertical center axis of the wafer clamping claw, and a clamping gap cooperating with the claw (2) is reserved on the wafer support frame, and a detection device (3) cooperating with the wafer clamping claw is provided on the support (1), and the detection device (3) is connected to the rotating mechanism and the lifting device by signal.

2. A wafer position adjuster according to claim 1, characterized in that: The wafer support frame comprises a support plate (4) and a support claw (5), wherein the support plate (4) is arranged on the support (1), the support plate (4) is parallel to the upper surface of the support (1), at least three support claws (5) are arranged on the support plate (4) around the central axis of the support plate (4), the top ends of all the support claws (5) are located at the same height, and the lower surface of the support plate (4) is fixedly connected to the execution end of the lifting device.

3. A wafer position adjuster according to claim 2, characterized in that: The support plate (4) is fixedly connected to one end of a connecting rod A (6), and the other end of the connecting rod A (6) is fixedly provided with the supporting claw (5), and the connecting rod A (6) is parallel to the upper surface of the bracket (1).

4. The wafer position adjuster according to claim 1, characterized in that: The lifting device comprises a first mounting plate (7), a lifting motor (8), an eccentric wheel (9), and a support rod (10); the first mounting plate (7) and the lifting motor (8) are both fixedly arranged in the bracket (1); a first slide rail (11) perpendicular to the upper surface of the bracket (1) is arranged on the first mounting plate (7); a slider (12) is slidably arranged between the two ends of the first slide rail (11); the slider (12) is fixedly connected to the lower end of the support rod (10); the support rod (10) is parallel to the first slide rail (11); The top end of the support rod (10) is fixedly connected to the wafer support frame, the output shaft of the lifting motor (8) is fixedly connected to one end face of the eccentric wheel (9), the output shaft of the lifting motor (8) is parallel to the upper surface of the bracket (1) and perpendicular to the end face of the eccentric wheel (9), and a slot (13) is provided on the side wall of the slider (12) parallel to the support rod (10), the upper side wall of the slot (13) is slidably connected to the circumferential surface of the eccentric wheel (9), and the length of the slot (13) is greater than the diameter of the eccentric wheel (9).

5. The wafer position adjuster according to claim 1, characterized in that: The wafer clamping claw comprises a mounting plate (14), a linear motor (15), a mounting rod (16), and the claw toe (2); the mounting plate (14) is rotatably mounted on the bracket (1); at least three second slide rails (17) are arranged on the mounting plate (14) around the center of the mounting plate (14); all the second slide rails (17) are parallel to the upper surface of the bracket (1); one end of each of the second slide rails (17) faces the center of the mounting plate (14) and the other end faces the outside of the mounting plate (14); and a corresponding one of the two ends of each of the mounting rods (16) is connected by a The second slide rails (17) are slidably connected to the mounting plate (14), and the corresponding mounting rods (16) are parallel to the second slide rails (17). One end of each mounting rod (16) facing away from the center of the mounting plate (14) is provided with a claw (2). One end of each mounting rod (16) facing the center of the mounting plate (14) is provided with a first pin shaft (18). All the first pin shafts (18) are perpendicular to the upper surface of the bracket (1). One end of each connecting rod B (19) is correspondingly connected to one of the first pin shafts (18) for rotation. The rotating plate ( The linear motor (15) is coaxially rotatable on the mounting plate (14), and second pins (20) corresponding to each connecting rod B (19) are evenly arranged around the center of the circle on the upper surface of the rotating plate (35), and all the second pins (20) are parallel to all the first pins (18). The other end of one connecting rod B (19) is rotatably connected to a corresponding second pin (20). The linear motor (15) is fixedly arranged on the mounting plate (14), and a driving rod (21) is radially fixedly arranged on the output shaft of the linear motor (15), and the driving rod (21) is parallel to the bracket ( 1), the driving rod (21) is fixedly connected to one side of one of the mounting rods (16), the output shaft of the linear motor (15) is parallel to the mounting rod (16) fixedly connected to the driving rod (21), all the mounting rods (6) are equidistantly arranged in a circular array on the mounting plate (4), the mounting plate (14) is coaxially fixedly connected to the output shaft of the rotating mechanism, and the distance from one end of the mounting rod (16) facing away from the center of the mounting plate (14) to the center of the mounting plate (14) is greater than the distance from the outer edge of the wafer support frame to the center of the mounting plate (14).

6. The wafer position adjuster according to claim 5, characterized in that: A U-shaped component (22) is provided on the side wall of the mounting rod (16) connected to the driving rod (21); the projection of the U-shaped component (22) on the mounting plate (14) is U-shaped; the sealed end of the U-shaped component (22) is fixedly connected to the mounting rod (16) connected to the driving rod (21); one end of the driving rod (21) facing away from the output shaft of the linear motor (15) is located in the U-shape of the U-shaped component (22); a pin (23) is provided on the U-shaped component (22); the pin (23) is parallel to the mounting plate (14); The U-shaped component (22) is arranged on a mounting rod (16), the driving rod (21) is provided with a through hole (24) whose axis is parallel to the output shaft of the linear motor (15), the through hole (24) is passed through between the two ends of the pin (23), the two ends of the pin (23) are fixed on the U-shaped component (22), and a spring (25) is sleeved on the pin (23) between the side of the mounting rod (16) on which the U-shaped component (22) is arranged, which faces the center of the mounting plate (14) and the inner side wall of the U-shaped component (22).

7. The wafer position adjuster according to claim 5, characterized in that: A first sensor (26) is provided on the mounting plate (14), an additional plate (28) is provided on the side wall of part of the mounting rod (16), the additional plate (28) is provided with a sensing notch (27) matching with the first sensor (26), the additional plate (28) is parallel to the mounting rod (16) on which it is provided, and the signal of the first sensor (26) is connected to the linear motor (15).

8. The wafer position adjuster according to claim 5, characterized in that: The rotating mechanism comprises a rotating motor (29), a first pulley (33), a second pulley (34), a second mounting plate (30), and a rotating shaft (31); the rotating shaft (31) is rotatably mounted on the second mounting plate (30); the second mounting plate (30) is fixedly mounted on the bracket (1); the mounting plate (14) is coaxially fixedly mounted on the upper end of the rotating shaft (31); the second pulley (34) is coaxially fixedly mounted on the lower end of the rotating shaft (31); the rotating motor (29) is fixedly mounted on the second mounting plate (30); the first pulley (33) is fixedly mounted on the output shaft of the rotating motor (29); the first pulley (33) and the second pulley (34) are connected to each other by a belt (32).

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