Substrate holder, substrate holding method, and film forming apparatus

Abstract

According to the invention, the substrate is prevented from falling off, and the deformation or damage and the generation of scratches of the substrate are inhibited. The substrate holder according to the present invention is provided with a hole portion in which a disc-shaped substrate is disposed in a vertical direction, and at least four support members mounted so as to be elastically deformable around the hole portion, two of the four support members supporting the disc-shaped substrate at first and second outer peripheral end portions of the disc-shaped substrate positioned on the upper side of the disc-shaped substrate in the vertical direction, the other two of the four support members support the disc-shaped substrate on the third and fourth outer peripheral end portions of the disc-shaped substrate located on the lower side of the disc-shaped substrate in the vertical direction. The center angle of the disc-shaped substrate between each of the first and second outer peripheral end portions and the uppermost end portion of the disc-shaped substrate located on the uppermost side of the disc-shaped substrate in the vertical direction is 30-65 degrees. The center angle between each of the third and fourth outer peripheral end portions and the lowermost end portion of the lowermost disk-shaped substrate of the disk-shaped substrate in the vertical direction is 10-20 degrees.

Description

Technical Field

[0001] The present invention relates to a substrate holder, a substrate holding method, and a film forming apparatus. Background Art

[0002] Conventionally, in a film forming apparatus for a substrate, a substrate holder that holds a substrate by a plurality of support members is used. As a film forming apparatus using such a substrate holder, for example, Patent Document 1 discloses a tandem film forming apparatus in which a carrier holds substrates with the surfaces of two substrates facing the sides in the transport direction, and the carrier is sequentially transported through a plurality of vacuum chambers provided along a polygonal transport path by a transport system, and a continuous film forming process is performed by a processing means provided in the vacuum chambers constituting the film forming processing chamber.

[0003] In addition, Patent Document 2 discloses a film forming apparatus including: a first support member having a clamping member that protrudes from the inner periphery of an opening of a substrate holder body toward the inside of the opening and supports one end of an insulating substrate; and a second support member having a clamping member that supports the other end of the insulating substrate and protrudes into the opening or can move so as to retract from the inside of the opening, and a substrate holder that holds the insulating substrate with a pair of the first support member and the second support member.

[0004] [Prior Art Documents]

[0005] [Patent Documents]

[0006] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 8-274142

[0007] [Patent Document 2] Japanese Unexamined Patent Application Publication No. 2009-277343 Summary of the Invention

[0008] [Problems to be Solved by the Invention]

[0009] However, in the film forming apparatuses such as those in Patent Documents 1 and 2, when the transport speed of the substrate is increased to improve productivity, the substrate may easily fall due to vibration during transport or acceleration applied to the substrate. In addition, as in the carrier of Patent Document 1 and the substrate holder of Patent Document 2, when the support force of the substrate based on the support members is increased to prevent the substrate from falling, deformation or breakage of the substrate may easily occur.

[0010] In addition, when viewed from the surface direction of the substrate, no deformation (dents due to plastic deformation, i.e., indentations) is seen, but sometimes when viewed from the thickness direction, scratches are generated on the substrate. The generation of these scratches causes dust generation in the film forming process for manufacturing a recording medium, and when a bias voltage is applied from the support members of the substrate holder to the substrate, the applied voltage is unstable.

[0011] Therefore, an object of the present invention is to suppress deformation, breakage, and scratches of a substrate while suppressing the dropping of the substrate in view of the above problems.

[0012]

Means for Solving the Problem

[0013] The present invention has the following structure.

[0014] (1) A substrate holder having a hole portion in which a disk-shaped substrate is disposed vertically,

[0015] and at least four support members elastically deformably mounted around the hole portion,

[0016] Two first support members of the four support members support the disk-shaped substrate on a first side outer peripheral end portion and a second side outer peripheral end portion of the disk-shaped substrate on the upper side of the disk-shaped substrate in the vertical direction,

[0017] The other two second support members of the four support members support the disk-shaped substrate on a third side outer peripheral end portion and a fourth side outer peripheral end portion of the disk-shaped substrate on the lower side of the disk-shaped substrate in the vertical direction,

[0018] The central angle of the disk-shaped substrate between the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is 30° to 65°,

[0019] The central angle of the disk-shaped substrate between the third side outer peripheral end portion and the fourth side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate located at the lowermost side of the disk-shaped substrate in the vertical direction is 10° to 20°.

[0020] (2) The substrate holder according to (1), wherein the support member does not support the disk-shaped substrate except at the position of the disk-shaped substrate within the following ranges,

[0021] The range of the central angle of the disk-shaped substrate between the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate, and

[0022] The range of the central angle of the disk-shaped substrate between the third side outer peripheral end portion and the fourth side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate.

[0023] (3) The substrate holder according to (1) or (2), wherein the first support member has,

[0024] a spiral spring disposed in a gap formed around the hole portion,

[0025] and a leaf spring member that is connected to the coil spring in the gap and protrudes from the gap toward the inside of the hole portion.

[0026] (4) The substrate holder according to (3), wherein the spring constant of the coil spring is 0.2 N / mm to 8.0 N / mm.

[0027] (5) The substrate holder according to any one of (1) to (4), wherein the second support member has an L-shaped bent shape,

[0028] and the spring constant of the second support member is 0.2 N / mm to 8.0 N / mm.

[0029] (6) A substrate holding method based on a substrate holder, comprising:

[0030] a step of supporting the disk-shaped substrate on a first side outer peripheral end portion and a second side outer peripheral end portion of the disk-shaped substrate located on the upper side of the disk-shaped substrate in the vertical direction by two support members out of at least four support members that are elastically deformably mounted around a hole portion where the disk-shaped substrate is disposed in a vertically placed state, and

[0031] a step of supporting the disk-shaped substrate on a third side outer peripheral end portion and a fourth side outer peripheral end portion of the disk-shaped substrate located on the lower side of the disk-shaped substrate in the vertical direction by another two support members out of the four support members,

[0032] wherein a central angle between each of the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is 30° to 65°,

[0033] and a central angle between each of the third side outer peripheral end portion and the fourth side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate located at the lowermost side of the disk-shaped substrate in the vertical direction is 10° to 20°.

[0034] (7) A film forming apparatus, comprising: a chamber for performing a film forming process on a disk-shaped substrate,

[0035] a carrier provided with the substrate holder according to (1) or (2) that holds the disk-shaped substrate at least in the chamber, and

[0036] a transfer mechanism for transferring the carrier.

[0037] [[Effect of the Invention]]

[0038] According to one aspect of the present invention, while suppressing the dropping of the substrate, deformation, breakage, and scratches of the substrate can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0039]

Figure 1

[0040]

Figure 2

[0041]

Figure 3

[0042]

Figure 4

[0043]

Figure 5

[0044]

Figure 6

[0045]

Description of Reference Numerals

[0046] 1 Series film forming apparatus

[0047] 7 Carrier

[0048] 9 Disc-shaped substrate

[0049] 10 Substrate holder

[0050] 12 Hole portion

[0051] 13 Support member

[0052] 13A First support member

[0053] 13B Second support member

[0054] 14 First side outer peripheral end

[0055] 15 Second side outer peripheral end

[0056] 16 Third side outer peripheral end

[0057] 17 Fourth side outer peripheral end

[0058] 18 Uppermost end

[0059] 19 Lowermost end

[0060] 121, 121A, and 121B clearances

[0061] 131 helical spring

[0062] 132, 132A, and 132B leaf spring components

[0063] 133 fixing part

[0064] 134 connecting part

[0065] α first central angle

[0066] β second central angle

[0067] δ third central angle

[0068] γ fourth central angle

[0069] Z vertical direction Detailed implementation mode

[0070] Hereinafter, with reference to the accompanying drawings, the implementation modes of the present invention will be described in detail. In each drawing, the same reference numerals are given to the same components, and repeated descriptions are appropriately omitted.

[0071] (Magnetic recording medium)

[0072] First, an example of the recording medium manufactured by the film forming apparatus according to the present embodiment will be described. Figure 1 It is a cross-sectional view showing an example of the recording medium manufactured by the film forming apparatus according to the present embodiment. The recording medium is, for example, a magnetic recording medium.

[0073] In recent years, the applicable range of magnetic recording devices has increased significantly, the importance of magnetic recording devices has increased, and at the same time, there has been a growing demand for a significant increase in the recording density of magnetic recording media used in magnetic recording devices.

[0074] The magnetic recording medium needs to achieve a higher recording density in the future. Therefore, it is necessary to achieve a high coercivity, a high signal-to-noise ratio (SNR), and a high resolution for the magnetic layer. In addition, in recent years, the following research has been conducted to increase the areal recording density by increasing the track density while increasing the online recording density.

[0075] As a method for manufacturing a magnetic recording medium, for example, there is a method of forming a soft magnetic layer, an intermediate layer, a recording magnetic layer, etc. on a non-magnetic substrate, and then forming a protective layer on the recording magnetic layer.

[0076] In such a manufacturing method, it is preferably carried out continuously with as few film forming apparatuses as possible. By performing continuous film forming processes, contamination of the substrate can be prevented during operation, and at the same time, the number of operation steps can be reduced, etc., improving the efficiency of the manufacturing process and the product yield, and increasing the productivity of the magnetic recording medium.

[0077] Therefore, when manufacturing such a magnetic recording medium, a tandem film-forming apparatus has been proposed, which sequentially transports a carrier holding a non-magnetic substrate among a plurality of chambers while sequentially forming magnetic layers and the like on both sides of the non-magnetic substrate.

[0078] In order to improve the productivity of the magnetic recording medium in the tandem film-forming apparatus, the transport speed of the carrier is sometimes increased. However, if the transport speed of the carrier is increased, the substrate is likely to fall off the carrier due to vibration during transport or acceleration applied to the substrate.

[0079] To prevent the substrate from falling off, when the supporting force of the supporting member that supports the substrate is excessively increased, the substrate may be deformed or damaged. In particular, in recent years, in order to increase the recording capacity of a hard disk device, the substrate has been thinned, and as a result, the number of magnetic recording media housed in the cartridge has been increased. Due to the thinning of the substrate, the strength of the substrate is reduced, and deformation or damage is likely to occur.

[0080] To solve such problems, the substrate holder and the substrate holding method according to the present embodiment can suppress the substrate from falling off the carrier even when the transport speed of the carrier is increased. In addition, even when the thickness of the substrate is thinned, deformation, damage, and scratches of the substrate on the supporting portion of the substrate caused by the supporting member can be suppressed. Further, the film-forming apparatus according to the present embodiment uses such a substrate holder to improve the productivity of the recording medium.

[0081] In the present embodiment, the following case is exemplified. A tandem film-forming apparatus that sequentially transports a disk-shaped substrate among a plurality of chambers while performing a film-forming process is used to manufacture a magnetic recording medium mounted on a hard disk device.

[0082] As Figure 1 shown, the magnetic recording medium manufactured by the tandem film-forming apparatus according to the present embodiment has the following structure. A soft magnetic layer 81, an intermediate layer 82, a recording magnetic layer 83, and a protective layer 84 are sequentially laminated on both sides of a disk-shaped substrate 9. Further, a lubricating film 85 is formed on the outermost surface.

[0083] If the disk-shaped substrate 9 is a non-magnetic substrate, there is no particular limitation, and any substrate can be used. As the disk-shaped substrate 9, for example, an Al alloy substrate such as an Al-Mg alloy containing Al as a main component, soda glass, aluminosilicate glass or crystallized glass, silicon, titanium, ceramics, and substrates made of various resins are used.

[0084] (Tandem film-forming apparatus)

[0085] Figure 2 is a plan view of the tandem film-forming apparatus 1 according to the present embodiment. When manufacturing a magnetic recording medium, for example, as Figure 2The shown tandem film forming apparatus 1 laminates at least a soft magnetic layer 81, an intermediate layer 82, a recording magnetic layer 83, and a protective layer 84 on both sides of a disk-shaped substrate 9 to be film-formed in sequence. By going through such a process, a magnetic recording medium can be obtained with high productivity.

[0086] Specifically, the tandem film forming apparatus 1 includes a robot platform 8, a substrate cassette transfer robot 3 placed on the robot platform 8, a substrate mounting / dismounting robot 2 adjacent to the robot platform 8, and a plurality of corner chambers 4 that rotate the carrier 7. In addition, the tandem film forming apparatus 1 includes a plurality of chambers 5 provided between the corner chambers 4, a plurality of carriers 7 transported in the plurality of corner chambers 4 and the plurality of chambers 5, and a transport mechanism 11 for transporting the plurality of carriers 7 (refer to Figure 3 ).

[0087] In addition, gate valves 6 are provided at the connection parts of the respective chambers 5. When these gate valves 6 are in a closed state, each chamber 5 is an independent sealed space.

[0088] In addition, in each chamber 5, a vacuum pump (not shown) is connected. In each chamber 5 in a reduced pressure state by the operation of these vacuum pumps, the plurality of carriers 7 are sequentially transported by the transport mechanism 11. While sequentially transporting the plurality of carriers 7, on both sides of the disk-shaped substrate 9 held on the carrier 7 in each chamber 5, as Figure 1 shown, the soft magnetic layer 81, the intermediate layer 82, the recording magnetic layer 83, and the protective layer 84 are sequentially formed. Then, the disk-shaped substrate 9 is taken out from the tandem film forming apparatus 1, and a lubricating film 85 as Figure 1 shown is formed on both sides thereof. Finally, a magnetic recording medium as Figure 1 shown is obtained. In addition, each corner chamber 4 is a chamber that changes the moving direction of the carrier 7, and a mechanism for rotating the carrier 7 and moving it to the next chamber 5 is provided inside the corner chamber 4.

[0089] Figure 3 is a side sectional view of the chamber 5 in the tandem film forming apparatus 1 according to the present embodiment. As the transport mechanism 11 for transporting the carrier 7, the tandem film forming apparatus 1 includes, for example, a linear motor drive mechanism that is driven in a non-contact state. In this linear motor drive mechanism, a plurality of magnets are arranged in an alternating pattern of N poles and S poles below the carrier 7, and below the magnets of the carrier 7, a rotating magnet with an alternating pattern of N poles and S poles in a spiral shape is arranged along the transport path through a partition wall. The linear motor drive mechanism transports the carrier 7 while magnetically coupling the magnets on the carrier 7 side and the rotating magnet in a non-contact manner and rotating the rotating magnet around an axis.

[0090] (Manufacturing method of magnetic recording medium)

[0091] Regarding the manufacturing method of the magnetic recording medium using the tandem film forming apparatus 1 according to the present embodiment, usingFigure 1 will be described. The tandem film forming apparatus 1 sequentially transports the disk-shaped substrate 9 held on the carrier 7 among a plurality of chambers 5, and sequentially stacks a soft magnetic layer 81, an intermediate layer 82, a recording magnetic layer 83, and a protective layer 84 on both sides of the disk-shaped substrate 9, thereby manufacturing a magnetic recording medium.

[0092] In such a method for manufacturing a magnetic recording medium, by using the tandem film forming apparatus 1, the formation of the soft magnetic layer 81 to the protective layer 84 can be continuously performed using one apparatus. When the disk-shaped substrate 9 to be formed into a film is being operated, the contamination of the disk-shaped substrate 9 can be reduced. In addition, in the method for manufacturing a magnetic recording medium by using the tandem film forming apparatus 1, the number of operation steps and the like can be reduced, the manufacturing process can be made highly efficient, the product yield can be increased, and the productivity of the magnetic recording medium can be improved.

[0093] (Substrate holder and substrate holding method)

[0094] Figure 4 is a side view of the carrier 7 used in the tandem film forming apparatus 1 according to the present embodiment. Regarding the carrier 7 in the present embodiment, use Figure 4 will be described in more detail. The carrier 7 is provided with one substrate holder 10 for holding the disk-shaped substrate 9 in a vertically placed state. In addition, vertically placing means a state in which the main surface (front surface or back surface) of the disk-shaped substrate 9 is parallel to the direction of gravity. In the carrier 7, one substrate holder 10 is provided in the transport direction.

[0095] The substrate holder 10 has a thickness of about 1 to several times the thickness of the disk-shaped substrate 9. In addition, on the substrate holder 10, a circular hole portion 12 larger in diameter than the disk-shaped substrate 9 is provided such that a gap of about 10 mm is formed in the radial direction from the outer peripheral end portion of the held disk-shaped substrate 9.

[0096] In addition, four support members 13 can be elastically deformed and installed around the hole portion 12 of each substrate holder 10. The four support members 13 are provided around the hole portion 12 of the substrate holder 10 in such a manner as to support the outer peripheral end portion of the disk-shaped substrate 9 provided inside the hole portion 12 at a specific position.

[0097] The substrate holder 10 supports the outer peripheral end portion of the disk-shaped substrate 9 and can detachably hold the disk-shaped substrate 9 inserted inside the support member 13. In addition, the loading and unloading of the disk-shaped substrate 9 with respect to the substrate holder 10 is performed, for example, as follows: The substrate mounting / dismounting robot 2 presses down the two support members 13 on the lower side of the substrate holder 10 in the vertical direction.

[0098] Four support members 13 respectively support the first-side outer peripheral end portion 14, the second-side outer peripheral end portion 15, the third-side outer peripheral end portion 16, and the fourth-side outer peripheral end portion 17 of the disc-shaped substrate 9. Thus, the substrate holder 10 holds the disc-shaped substrate 9 inside the hole portion 12. Among the first-side outer peripheral end portion 14, the second-side outer peripheral end portion 15, the third-side outer peripheral end portion 16, and the fourth-side outer peripheral end portion 17 of the disc-shaped substrate 9, at least one of the outer peripheral surface of the disc-shaped substrate 9 and the outer peripheral edge (edge or corner) of the disc-shaped substrate 9 is included.

[0099] The base end side of the support member 13 is located in the gap 121 formed around the hole portion 12 of the substrate holder 10 and is fixed to the main body of the substrate holder 10 in the gap 121. The front end side of the support member 13 protrudes from the gap 121 of the substrate holder 10 toward the inside of the hole portion 12.

[0100] The four support members 13 include two first support members 13A and two second support members 13B.

[0101] The two first support members 13A support the first-side outer peripheral end portion 14 located on the upper side of the disc-shaped substrate 9 in the vertical direction and the second-side outer peripheral end portion 15 located on the upper side of the disc-shaped substrate 9 in the vertical direction. The first-side outer peripheral end portion 14 is located on the left side of the disc-shaped substrate 9 in the horizontal direction (or on the right side when viewed from the back), and the second-side outer peripheral end portion 15 is located on the right side of the disc-shaped substrate 9 in the horizontal direction (or on the left side when viewed from the back). Figure 4 When viewed from the back), the second-side outer peripheral end portion 15 is located on the right side of the disc-shaped substrate 9 in the horizontal direction (or on the left side when viewed from the back). Figure 4 When viewed from the back).

[0102] The first support member 13A includes a helical spring 131, a leaf spring member 132A, a fixing portion 133 provided in the gap 121A located on the upper side of the disc-shaped substrate 9 in the vertical direction in the gap 121 of the hole portion 12, and a connecting portion 134 that connects the helical spring 131 and the leaf spring member 132A.

[0103] The helical spring 131 is provided on the fixing portion 133 provided in the gap 121A of the hole portion 12, and the main body of the substrate holder 10 is fixed by the fixing portion 133. One end of the helical spring 131 is connected to the connecting portion 134.

[0104] The leaf spring member 132A has the following shape: one end thereof is connected to the connecting portion 134 in the gap 121A of the hole portion 12, protrudes from the gap 121A toward the inside of the hole portion 12, and is formed in a plate shape.

[0105] The fixing portion 133 is provided in the gap 121A of the hole portion 12 and is fixed to the main body of the substrate holder 10.

[0106] The connecting portion 134 is provided on the fixing portion 133 within the gap 121A of the hole portion 12. In the fixing portion 133, the coil spring 131 and the leaf spring member 132A are connected.

[0107] Two second support members 13B support the third side outer peripheral end portion 16 located on the lower side of the disc-shaped substrate 9 in the vertical direction and the fourth side outer peripheral end portion 17 located on the lower side of the disc-shaped substrate 9 in the vertical direction. The third side outer peripheral end portion 16 is located on the left side of the disc-shaped substrate 9 in the horizontal direction (or on the right side when viewed from the Figure 4 back side), and the fourth side outer peripheral end portion 17 is located on the right side of the disc-shaped substrate 9 in the horizontal direction (or on the left side when viewed from the Figure 4 back side).

[0108] The second support member 13B has a leaf spring member 132B that is bent in a substantially L-shape.

[0109] The leaf spring member 132B has the following shape: it protrudes from the gap 121B located on the lower side of the disc-shaped substrate 9 in the vertical direction toward the inside of the hole portion 12 within the gap 121 of the hole portion 12.

[0110] In addition, on the front end portions of the support member 13 (the front end portions of the leaf spring members 132A and 132B), there are provided groove portions, such as V-shaped or U-shaped groove portions, that engage with the outer peripheral end portion of the disc-shaped substrate 9 to prevent the disc-shaped substrate 9 from falling.

[0111] The spring constant of the coil spring 131 is preferably 0.2 N / mm to 8.0 N / mm. The lower limit value of the spring constant of the coil spring 131 is more preferably 1.0 N / mm or more, and further preferably 3.0 N / mm or more. The upper limit value of the spring constant of the coil spring 131 is more preferably 7.0 N / mm or less, and further preferably 6.0 N / mm or less. By setting the spring constant of the coil spring 131 within the above-mentioned preferred range, while further improving the effect of preventing the disc-shaped substrate 9 from falling, the effects of suppressing deformation or breakage of the disc-shaped substrate 9 and preventing scratches from occurring on the disc-shaped substrate 9 can be further improved.

[0112] The spring constant of the leaf spring member 132A is not particularly limited and can be designed to have an appropriate arbitrary value. Since the leaf spring member 132A is mounted on the coil spring 131, the leaf spring member 132A preferably has high rigidity. For example, the rigidity of the leaf spring member 132A is preferably higher than that of the coil spring 131 or the leaf spring member 132B. When the rigidity of the leaf spring member 132A is relatively high, sliding during handling of the disc-shaped substrate 9 is suppressed, and scratches on the disc-shaped substrate 9 can be prevented.

[0113] The spring constant of the leaf spring member 132B is the same as that of the coil spring 131, preferably 0.2 N / mm to 8.0 N / mm. The lower limit value of the spring constant of the leaf spring member 132B is the same as that of the coil spring 131, more preferably 1.0 N / mm or more, and still more preferably 3.0 N / mm or more. The upper limit value of the spring constant of the leaf spring member 132B is the same as that of the coil spring 131, more preferably 7.0 N / mm or less, and still more preferably 6.0 N / mm or less. By setting the spring constant of the leaf spring member 132B within the above-mentioned preferred range, while further improving the effect of suppressing the dropping of the disk-shaped substrate 9, the effects of suppressing the deformation or breakage of the disk-shaped substrate 9 and the generation of scratches on the disk-shaped substrate 9 can be further improved.

[0114] The support member 13 can be made of a heat-resistant alloy mainly composed of any one of iron, nickel, cobalt, molybdenum, tungsten, etc. In addition, based on the supporting force of the disk-shaped substrate 9 by the support member 13, it is appropriately selected according to the material and thickness of the disk-shaped substrate 9, for example, 2 N to 6 N.

[0115] The first central angle α of the disk-shaped substrate 9 between the first side outer peripheral end portion 14 located on the upper side of the disk-shaped substrate 9 in the vertical direction and the uppermost end portion 18 located on the uppermost side of the disk-shaped substrate 9 in the vertical direction is 30° to 65°. The lower limit value of the first central angle α is preferably 35° or more, more preferably 40° or more, and still more preferably 45° or more. The upper limit value of the first central angle α is preferably 60° or less, more preferably 55° or less, and still more preferably 50° or less.

[0116] In addition, the second central angle β of the disk-shaped substrate 9 between the second side outer peripheral end portion 15 located on the upper side of the disk-shaped substrate 9 in the vertical direction and the uppermost end portion 18 located on the uppermost side of the disk-shaped substrate 9 in the vertical direction is the same as the first central angle α, that is, 30° to 65°, and preferably the same angle as the first central angle α. The lower limit value of the second central angle β is the same as that of the first central angle α, preferably 35° or more, more preferably 40° or more, and still more preferably 45° or more. The upper limit value of the second central angle β is the same as that of the first central angle α, preferably 60° or less, more preferably 55° or less, and still more preferably 50° or less.

[0117] The third central angle γ of the disk-shaped substrate 9 between the third side outer peripheral end portion 16 located on the lower side of the disk-shaped substrate 9 in the vertical direction and the lowermost end portion 19 located on the lowermost side of the disk-shaped substrate 9 in the vertical direction is 10° to 20°. The lower limit value of the third central angle γ is preferably 12° or more, and more preferably 13° or more. The upper limit value of the third central angle γ is preferably 18° or less, and more preferably 15° or less.

[0118] In addition, the fourth central angle δ of the disk-shaped substrate 9 between the fourth side outer peripheral end portion 17 located on the lower side of the disk-shaped substrate 9 in the vertical direction and the lowermost end portion 19 located on the lowermost side of the disk-shaped substrate 9 in the vertical direction is 10° to 20°, the same as the first central angle α, and preferably the same angle as the third central angle γ. The lower limit value of the fourth central angle δ is the same as the third central angle γ, preferably 12° or more, more preferably 13° or more. The upper limit value of the fourth central angle δ is preferably 18° or less, more preferably 15° or less.

[0119] That is, both the first central angle α and the second central angle β of the disk-shaped substrate 9 are greater than or equal to the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9.

[0120] Moreover, preferably, the support member 13 does not support the disk-shaped substrate 9 at the position of the disk-shaped substrate 9 except for the ranges of the first central angle α and the second central angle β of the disk-shaped substrate 9 and the ranges of the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9.

[0121] By using the substrate holder 10 having such a support member 13, the transfer speed of the carrier 7 is increased, the dropping of the disk-shaped substrate 9 from the carrier 7 is suppressed, and at the same time, the deformation, breakage, and scratches on the support portion of the disk-shaped substrate 9 caused by the support member 13 are suppressed. Therefore, the serial film forming apparatus 1 can improve the productivity of the magnetic recording medium. In addition, since the deformation, breakage, and scratches of the disk-shaped substrate 9 are suppressed, the serial film forming apparatus 1 capable of coping with the thinning of the disk-shaped substrate 9 can be provided.

[0122] The reasons for the above-described effects brought about by using the substrate holder 10 are as follows. When the transfer speed of the carrier 7 is increased, strong vibrations and accelerations are applied to the disk-shaped substrate 9. The vibrations and accelerations applied to the disk-shaped substrate 9, particularly the components in the direction parallel to the traveling direction of the carrier 7, are strong, and such components are the causes of substrate dropping or deformation. The substrate holder 10 supports the disk-shaped substrate 9 at specific positions near the uppermost end portion 18 and the lowermost end portion 19 of the disk-shaped substrate 9, thereby alleviating the force applied in the traveling direction of the carrier 7 and suppressing the dropping of the disk-shaped substrate 9. In addition, the support member 13 does not support the disk-shaped substrate 9 at positions other than the specific positions near the uppermost end portion 18 and the lowermost end portion 19 of the disk-shaped substrate 9, thereby suppressing the deformation of the disk-shaped substrate 9.

[0123] On the other hand, when the first central angle α and the second central angle β of the disk-shaped substrate 9 are within a range less than 30° and the two support members 13 support the first side outer peripheral end portion 14 and the second side outer peripheral end portion 15 of the disk-shaped substrate 9, the holding force of the disk-shaped substrate 9 by the substrate holder 10 is reduced. Then, the disk-shaped substrate 9 is likely to drop from the substrate holder 10.

[0124] In addition, when the first central angle α and the second central angle β of the disk-shaped substrate 9 are within a range greater than 65°, and the two support members 13 support the first side outer peripheral end portion 14 and the second side outer peripheral end portion 15 of the disk-shaped substrate 9, the two support members 13 are likely to cause deformation on the support portion of the disk-shaped substrate 9.

[0125] Furthermore, when the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9 are within a range less than 10°, and the other two support members 13 support the third side outer peripheral end portion 16 and the fourth side outer peripheral end portion 17 of the disk-shaped substrate 9, the holding force of the disk-shaped substrate 9 by the substrate holder 10 is reduced. Then, it is easy for the disk-shaped substrate 9 to drop from the substrate holder 10.

[0126] In addition, when the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9 are within a range greater than 20°, and the other two support members 13 support the third side outer peripheral end portion 16 and the fourth side outer peripheral end portion 17 of the disk-shaped substrate 9, the support members 13 are likely to cause deformation on the support portion of the disk-shaped substrate 9.

[0127] In addition, the deformation of the disk-shaped substrate 9 includes cases where it is difficult to distinguish with the naked eye. A microscope image showing an example of the deformation generated on the disk-shaped substrate 9 by the prior art is as Figure 5 shown. As Figure 5 shown, a deformation that is difficult to distinguish with the naked eye is generated on the disk-shaped substrate 9. The deformation of the disk-shaped substrate 9 is a depression (i.e., a dent) that is plastically deformed due to the supporting force of the support member provided on the conventional substrate holder. The height of this dent is about 1.26 μm, and the width is about 180.15 μm starting from the outermost outer peripheral end of the disk-shaped substrate 9. In recent years, in response to the requirement of increasing the recording capacity of the hard disk device, the recording area of the magnetic recording medium has been extended to the side outer peripheral end portion. Therefore, a minute dent that cannot be distinguished with the naked eye as shown in Figure 5 is also judged as a defective part. If the substrate holder 10 according to the present embodiment is used, the deformation generated on the support portion of the disk-shaped substrate 9 can be suppressed by the support members 13.

[0128] According to the substrate holder 10 and the substrate holding method according to the present embodiment, by increasing the transfer speed of the carrier 7, it is also possible to suppress the dropping of the disk-shaped substrate 9 from the substrate holder 10. In addition, even when the thickness of the disk-shaped substrate 9 is thinned, it is possible to suppress the deformation of the disk-shaped substrate 9 on the support portion of the disk-shaped substrate 9 caused by the support members 13. Furthermore, a serial film-forming apparatus 1 with high productivity can be provided. In addition, since the deformation of the disk-shaped substrate 9 is suppressed, a serial film-forming apparatus 1 that can cope with the thinning of the disk-shaped substrate 9 can be provided.

[0129] As described above, the preferred embodiments have been described in detail. However, the present invention is not limited to the above embodiments, and various modifications and substitutions can be made without departing from the scope of the patent claims. For example, the film-forming apparatus including the substrate holder 10 according to the present embodiment is not limited to the serial film-forming apparatus 1, and a batch film-forming apparatus or the like can also be used. In addition, if the number of the support members 13 is four or more, there is no limitation.

[0130] In addition, the ordinal numbers, numbers, etc. used in the description of the above embodiments are all examples for specifically explaining the technology of the present invention, and the present invention is not limited to the exemplified numbers. In addition, the connection relationship between the components is an example for specifically explaining the technology of the present invention, and the connection relationship for realizing the functions of the present invention is not limited thereto.

[0131]

Example

[0132] Hereinafter, the effects of the substrate holder 10 and the serial film-forming apparatus 1 according to the present embodiment will be made more clear by examples. In addition, the substrate holder 10 and the serial film-forming apparatus 1 according to the present embodiment are not limited to the following examples, and can be appropriately changed within the scope not changing the gist.

[0133] <Example 1>

[0134] [Transportation of the disk-shaped substrate 9]

[0135] In Example 1, the serial film-forming apparatus 1 shown in Figure 2 and the carrier 7 shown in Figure 4 were used to manufacture a magnetic recording medium having a layer structure shown in Figure 1 from an aluminum alloy disk-shaped substrate 9 (outer diameter: 96 mm, inner diameter: 25 mm, thickness: 0.7 mm). Specifically, by using the DC sputtering method on both sides of the disk-shaped substrate 9, an FeCoB alloy was used as the soft magnetic layer 81, Ru as the intermediate layer 82, and a 70Co-5Cr-15Pt-10SiO 2 alloy was used as the recording magnetic layer 83 for lamination. In addition, by using the ion beam method, a hard carbon film was laminated as the protective layer 84 on the recording magnetic layer 83.

[0136] The two first support members 13A on the upper side of the substrate holder 10 support the first side outer peripheral end portion 14 and the second side outer peripheral end portion 15 of the disk-shaped substrate 9 at positions where the first central angle α and the second central angle β of the disk-shaped substrate 9 are each 50°. In addition, the two second support members 13B on the lower side of the substrate holder 10 support the third side outer peripheral end portion 16 and the fourth side outer peripheral end portion 17 of the disk-shaped substrate 9 at positions where the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9 are each 13°.

[0137] In the coil spring 131 of the first support member 13A, the spring constant is 5.0 N / mm, the free length is 15 mm, the length of the coil spring 131 within the substrate holder 10 is 11 mm, and the amount of compression of the coil spring 131 when holding the disc-shaped substrate 9 is 1 mm.

[0138] The spring constant of the leaf spring member 132B of the second support member 13B is 5.0 N / mm.

[0139] The transfer speed of the carrier 7 between the chambers 5 is 1.2 m / second, and the acceleration during acceleration and deceleration is 6 m / second 2 。

[0140] Shown in Table 1 are the magnitudes of the central angles (first central angle α, second central angle β, third central angle γ, fourth central angle δ) of the disc-shaped substrate 9 with respect to each support member 13 (first support member 13A and second support member 13B) based on the support position of the disc-shaped substrate 9 by the support member 13, the spring constants of the coil spring 131 and the leaf spring member 132B, the thickness of the disc-shaped substrate 9, the transfer speed of the carrier 7, and the acceleration during acceleration and deceleration.

[0141] [Evaluation]

[0142] (Whether the disc-shaped substrate drops)

[0143] Under the above conditions, 1000 magnetic recording media were manufactured without the disc-shaped substrate 9 dropping.

[0144] (Indentation generation rate)

[0145] Whether there is deformation (indentation) in the outer peripheral end of the magnetic recording medium manufactured under the above conditions is determined by a differential interference microscope image. When observing the magnetic recording medium from the surface side (data side), a deformation with a width of 100 μm or more and a height of 0.5 μm or more starting from the outer peripheral end is found, it is determined that an indentation has occurred.

[0146] (Scratch generation rate)

[0147] Whether there are scratches on the outer peripheral end of the magnetic recording medium manufactured under the above conditions is determined by a differential interference microscope image. When observing the magnetic recording medium in the thickness direction, a scratch with a width of 60 μm or more is found, it is determined that a scratch has occurred. The microscope image of observing the disc-shaped substrate 9 in the thickness direction is as Figure 6 shown. In addition, Figure 6 the black longitudinal linear part in is the end face of the disc-shaped substrate 9, and the two sides thereof are out-of-focus end faces. Figure 6 In , within the black longitudinal linear part, the white visible part is the scratch generated at the end. As in Figure 6 ​As shown, almost no scratches are generated on the disk-shaped substrate 9 held and transported by the substrate holder 10 (refer to Figure 6 (a)).

[0148] The results of whether the disk-shaped substrate 9 drops, the dent generation rate, and the scratch generation rate are shown in Table 1. In addition, in Table 1, regarding whether the disk-shaped substrate 9 drops, when the disk-shaped substrate 9 does not drop, it is indicated as "A", and when the disk-shaped substrate 9 drops, it is indicated as "B".

[0149] <Examples 2 to 15, Comparative Examples 1 to 6>

[0150] The conditions are changed to those shown in Table 1, and except for this, the same operations as in Example 1 are performed. Various handling conditions of the disk-shaped substrate 9 in the substrate holder 10 of each example and comparative example (the magnitudes of the central angles of the disk-shaped substrate 9 with respect to the respective support members 13 (first central angle α, second central angle β, third central angle γ, fourth central angle δ), the spring constants of the coil spring 131 and the leaf spring member 132A, the thickness of the disk-shaped substrate 9, the handling speed of the carrier 7, and the acceleration during acceleration and deceleration) are shown in Table 1. In addition, the evaluation results (whether the disk-shaped substrate 9 drops, the dent generation rate, the scratch generation rate) of each example and comparative example are shown in Table 1. In addition, the values in the positions with lighter shading in Table 1 represent the values within the scope of the present embodiment, and the values in the positions with darker shading represent the values outside the scope of the present embodiment.

[0151] In addition, the microscope image of the disk-shaped substrate 9 held and transported by the substrate holder of Comparative Example 1 when observed from the thickness direction is as Figure 6 shown. As Figure 6 shown, in the disk-shaped substrate 9 held and transported by the substrate holder of Comparative Example 1, it is confirmed that scratches are generated at the ends (refer to Figure 6 (b)).

[0152]

Table 1

[0153]

[0154] Based on Table 1, in each example, the disk-shaped substrate 9 does not drop, the dent generation rate is suppressed to 1.0% or less, and the scratch generation rate is suppressed to 4% or less. On the other hand, in each comparative example, at least one of the following occurs: the disk-shaped substrate 9 drops, or the dent generation rate is 2.0% or more, or the scratch generation rate is 5% or more.

[0155] Therefore, it can be confirmed that the first central angle α and the second central angle β of the disk-shaped substrate 9, which are the support positions of the two first support members 13A on the upper side of the substrate holder 10, are respectively 30° to 65°, and the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9, which are the support positions of the two second support members 13B on the lower side of the substrate holder 10, are respectively 10° to 20°. Thus, while preventing the disk-shaped substrate 9 from falling, it is possible to suppress the deformation, breakage, and scratches of the disk-shaped substrate 9.

[0156] Therefore, it can be said that the substrate holder 10 according to the present embodiment can be suitably used for a film-forming apparatus for manufacturing a magnetic recording medium from the disk-shaped substrate 9. In particular, as a substrate holder for a tandem film-forming apparatus, the magnetic recording medium can be effectively manufactured with an excellent yield.

Claims

1. A substrate holder, comprising: The disc-shaped substrate is provided with a hole portion disposed longitudinally, and at least four supporting members elastically deformably mounted around the hole, Two first supporting members among the four supporting members support the disk-shaped substrate at a first outer peripheral end portion and a second outer peripheral end portion of the disk-shaped substrate located on an upper side of the disk-shaped substrate in a vertical direction. The other two second supporting members of the four supporting members support the disk-shaped substrate at the third and fourth outer peripheral ends of the disk-shaped substrate located below the disk-shaped substrate in the vertical direction. The center angle of the disk-shaped substrate between the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is 30° to 65°, A central angle of the disk-shaped substrate between each of the third side outer peripheral end portion and the fourth side outer peripheral end portion and the lowest end portion of the disk-shaped substrate located at the lowest side of the disk-shaped substrate in the vertical direction is 10° to 20°.

2. The substrate holder according to claim 1, wherein the support member does not support the disk-shaped substrate at a position of the disk-shaped substrate excluding the following ranges: a range of a central angle of the disk-shaped substrate between each of the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate, and A range of a central angle of the disk-shaped substrate between each of the third side outer peripheral end portion and the fourth side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate.

3. The substrate holder according to claim 1, wherein the first supporting member comprises: a coil spring disposed in a gap formed around the hole, and A leaf spring member is connected to the coil spring in the gap and protrudes from the gap toward the inside of the hole. 4 . The substrate holder according to claim 3 , wherein a spring constant of the coil spring is 0.2 N / mm to 8.0 N / mm.

5. The substrate holder according to claim 1, wherein the second supporting member has an L-shaped curved shape. The spring constant of the second supporting member is 0.2 N / mm to 8.0 N / mm.

6. A substrate holding method, which is a substrate holding method performed by a substrate holder, comprising: The step of supporting the disk-shaped substrate at a first side outer peripheral end portion and a second side outer peripheral end portion of the disk-shaped substrate located on the upper side of the disk-shaped substrate in the vertical direction by two of at least four supporting members elastically deformably mounted around a hole portion in which the disk-shaped substrate is disposed to be placed longitudinally, and The step of supporting the disk-shaped substrate at the third and fourth outer peripheral ends of the disk-shaped substrate located on the lower side of the disk-shaped substrate in the vertical direction by using the other two of the four supporting members, The center angle of the disk-shaped substrate between the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is 30° to 65°, A central angle of the disk-shaped substrate between each of the third and fourth outer peripheral ends and the lowest end of the disk-shaped substrate located at the lowest side of the disk-shaped substrate in the vertical direction is 10° to 20°.

7. A film forming device comprising: A chamber for film formation on a disc-shaped substrate. A carrier provided with the substrate holder according to claim 1 or 2 for holding the disk-shaped substrate at least in the chamber, and A transport mechanism for transporting the carrier.

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