Power module, power module group and packaging method thereof

Abstract

The invention discloses a power module. The power module comprises a first insulating substrate; the first wiring layer is positioned on the first insulating substrate; the lower bridge power device group and a plurality of power devices of the lower bridge power device group are arranged on the first wiring layer, and each power device comprises a first end, a second end and a third end; according to the invention, the lower bridge power device group and the plurality of branch confluence parts of the lower bridge power device group are respectively connected with the second ends of the power devices, so that the lengths of conductive paths from the power devices to the respective main confluence parts are similar, and the uniform distribution of current is realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a power module and a packaging method thereof. Background Art

[0002] A power module is a new type of high-power power electronic device, which has advantages such as high current density, low saturation voltage, and high voltage resistance, and is currently widely used in various fields such as production and life.

[0003] As a power semiconductor device that realizes power conversion control in a power electronic system, with the gradual increase of power demand, a power module usually needs to parallel multiple power devices to meet the high-power demand. In the existing power modules with parallel multiple power devices, there is usually a current sharing problem, that is, some power devices will be affected by the current shunting of other power devices, and the currents borne by multiple power devices are uneven, resulting in an excessive current borne by some power devices, and then overheating and failure. Further, there is also a switching oscillation problem in the existing parallel connection of multiple power devices. Since the lengths of the gate and source loop paths of each power device are different, and the power loop with a longer coupling has a larger stray inductance, the switching times of the driving gates of each power device are inconsistent, and there is mutual crosstalk between multiple power devices, resulting in unstable gate voltage, current, and voltage between the source and drain of the parallel power devices, and obvious oscillation. This affects the performance of the entire power module. Summary of the Invention

[0004] In view of the above problems, the purpose of the present invention is to provide a power module to improve the current distribution of each power device in the power module, reduce the problems of uneven current distribution and switching oscillation, and improve the electrical performance of the power module.

[0005] The present invention provides a power module, including:

[0006] A first insulating substrate;

[0007] A first wiring layer, which is located on the first insulating substrate;

[0008] A lower bridge power device group, which includes multiple power devices. The multiple power devices of the lower bridge power device group are located on the corresponding first wiring layer, and each power device of the lower bridge power device group includes a first end, a second end, and a third end;

[0009] An upper bridge power device group, which includes multiple power devices. The multiple power devices of the upper bridge power device group are located on the corresponding first wiring layer, and each power device of the upper bridge power device group includes a first end, a second end, and a third end;

[0010] A current collecting part, which includes a main current collecting part and multiple branch current collecting parts;

[0011] The multiple branch busbar parts are respectively electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group, and / or the multiple branch busbar parts are respectively electrically connected to the second ends of the corresponding power devices of the upper-bridge power device group.

[0012] Further, the second ends of the power devices of the lower-bridge power device group are electrically connected to the second power terminal of the power module, and the third ends of the power devices of the lower-bridge power device group are electrically connected to the first control terminal; the first ends of the power devices of the upper-bridge power device group are electrically connected to the first power terminal of the power module, the second ends of the power devices of the upper-bridge power device group are electrically connected to the third power terminal of the power module, and the third ends of the power devices of the upper-bridge power device group are electrically connected to the second control terminal; the busbar part includes a second busbar part and a third busbar part, the main busbar part includes a first main busbar part and a second main busbar part, the multiple branch busbar parts shown include multiple first branch busbar parts and multiple second branch busbar parts, the second busbar part includes the first main busbar part and multiple first branch busbar parts, and the third busbar part includes the second main busbar part and multiple second branch busbar parts; the multiple first branch busbar parts are respectively electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group, and the first main busbar part is electrically connected to the second power terminal; the multiple second branch busbar parts are respectively electrically connected to the second ends of the corresponding power devices of the upper-bridge power device group, the second main busbar part is electrically connected to the third power terminal, and the first ends of the power devices of the lower-bridge power device group are electrically connected to the second main busbar part.

[0013] Further, the multiple first branch busbar parts are respectively electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group through one of the second metal interconnection layer, bonding wire or bonding tape of the lower-bridge power device group;

[0014] Further, the multiple second branch busbar parts are respectively electrically connected to the second ends of the corresponding power devices of the upper-bridge power device group through one of the second metal interconnection layer, bonding wire or bonding tape of the upper-bridge power device group.

[0015] Further, the first ends of the power devices of the lower-bridge power device group are electrically connected to the third power terminal of the power module through one of the first brazing layer, first sintering layer, first eutectic soldering or first conductive adhesive;

[0016] Further, the first ends of the power devices of the upper-bridge power device group are electrically connected to the first power terminal of the power module through one of the second brazing layer, second sintering layer, second eutectic soldering layer or second conductive adhesive of the upper-bridge power device group.

[0017] Further, the first wiring layer includes a first part of the first wiring layer, a second part of the first wiring layer, a third part of the first wiring layer, a fourth part of the first wiring layer, a fifth part of the first wiring layer, and a sixth part of the first wiring layer that are isolated from each other.

[0018] Further, multiple power devices of the lower-bridge power device group are located on the corresponding first part of the first wiring layer, and multiple power devices of the lower-bridge power device group are located on the corresponding fourth part of the first wiring layer.

[0019] Further, the second power terminal and the first main busbar are a metal clip of an integral structure.

[0020] Further, the third power terminal and the second main busbar are a metal clip of an integral structure.

[0021] Further, the second power terminal and the first main busbar are a metal clip of a discrete structure.

[0022] Further, the third power terminal and the second main busbar are a metal clip of a discrete structure.

[0023] Further, at least a part of the first main busbar is a bonding wire or a bonding tape;

[0024] Further, at least a part of the second main busbar is a bonding wire or a bonding tape.

[0025] Further, the first main busbar and the first branch busbar are a metal clip of an integral structure;

[0026] Further, the second main busbar and the second branch busbar are a metal clip of an integral structure.

[0027] Further, the first main busbar and the first branch busbar are a metal clip of a discrete structure;

[0028] Further, the second main busbar and the second branch busbar are a metal clip of a discrete structure.

[0029] Further, the first branch busbars corresponding to some adjacent power devices of the lower-bridge power device group are of an integral structure;

[0030] Further, the first branch busbars corresponding to some adjacent power devices of the upper-bridge power device group are of an integral structure.

[0031] Further, the first branch busbars corresponding to some adjacent power devices of the lower-bridge power device group are of a discrete structure, and the second ends of some adjacent power devices of the lower-bridge power device group are connected to each other through one of a bonding wire, a bonding tape, or a discrete metal clip;

[0032] Further, the second branch busbar parts corresponding to some adjacent power devices in the upper bridge power device group are of a discrete structure, and the second ends of some adjacent power devices in the upper bridge power device group are connected to each other by one of bonding wires, bonding tapes or discrete metal clips.

[0033] Further, the currents of the first main busbar and the multiple first branch busbars intersect at a first convergence end. The first main busbar includes a first end and a second end. The first convergence end is located at the first end of the first main busbar, and the distance from the first end of the first main busbar to the second power terminal is greater than the distance from the second end of the first main busbar to the second power terminal.

[0034] Further, the power module further includes a first sampling terminal, and the second end of the first sampling terminal is electrically connected to the first convergence end.

[0035] Further, the second end of the first sampling terminal and the first convergence end are interconnected by a bonding wire or a bonding tape.

[0036] Further, the second end of the first sampling terminal and the first convergence end are interconnected through a third metal interconnection layer and a first wiring layer.

[0037] Further, the second end of the first sampling terminal and the first convergence end are directly interconnected with the second part of the first wiring layer in the lower bridge power device group area.

[0038] Further, the second end of the first sampling terminal and the first convergence end are of an integral structure.

[0039] Further, the power module further includes a first sampling terminal, and the second end of the first sampling terminal is electrically connected to the second end of the power device in the lower bridge power device group by one of a bonding wire, a bonding tape or a metal clip.

[0040] Further, the power module further includes a first sampling terminal, and the second end of the first sampling terminal is electrically connected to the first branch busbar by one of a bonding wire, a bonding tape or a metal clip.

[0041] Further, the currents of the second main busbar and the multiple second branch busbars intersect at a second convergence end. The second main busbar includes a first end and a second end. The second convergence end is located at the first end of the second main busbar, and the distance from the first end of the second main busbar to the third power terminal is greater than the distance from the second end of the second main busbar to the third power terminal.

[0042] Further, the power module further includes a second sampling terminal, and the second end of the second sampling terminal is electrically connected to the second convergence end.

[0043] Further, the second end of the second sampling terminal and the second convergence end are interconnected by a bonding wire or a bonding tape.

[0044] Further, the second end of the second sampling terminal is interconnected with the fifth part of the first wiring layer through the fourth metal interconnection layer and the second converging end.

[0045] Further, the second end of the second sampling terminal and the second converging end are directly interconnected with the fifth part of the first wiring layer in the upper bridge power device group area.

[0046] Further, the second end of the second sampling terminal and the second converging end are of an integral structure.

[0047] Further, the power module further includes a second sampling terminal, and the second end of the second sampling terminal is electrically connected to the second end of the power device in the upper bridge power device group through one of a bonding wire, a bonding tape, or a metal clip.

[0048] Further, the power module further includes a second sampling terminal, and the second end of the second sampling terminal is electrically connected to the second branch busbar through one of a bonding wire, a bonding tape, or a metal clip.

[0049] Further, during the turn-on process of each power device in the lower bridge power device group, control the current to flow through the first control terminal, the third end of each power device in the lower bridge power device group, the second end of each power device in the lower bridge power device group, the first branch busbar, the first main busbar, converge to the first converging end, and then flow to the first sampling terminal through one of the second part of the first wiring layer in the lower bridge power device group area, a bonding wire, or a bonding tape.

[0050] Further, during the turn-on process of each power device in the lower bridge power device group, the control current of the lower bridge power device group flows through the first control terminal, the third end of each power device in the lower bridge power device group, the second end of each power device in the lower bridge power device group, the first branch busbar, the first main busbar, converge to the first converging end, and then flow to the first sampling terminal.

[0051] Further, during the turn-on process of each power device in the lower bridge power device group, control the current to flow through the first control terminal, the third end of each power device in the lower bridge power device group, the second end of each power device in the lower bridge power device group, the first branch busbar, and then flow to the first sampling terminal through one of a bonding wire, a bonding tape, or a metal clip.

[0052] Further, during the turn-on process of each power device in the upper bridge power device group, control the current to flow through the first control terminal, the third end of each power device in the upper bridge power device group, the second end of each power device in the upper bridge power device group, the second branch busbar, the second main busbar, converge to the second converging end, and then flow to the second sampling terminal through one of the fifth part of the first wiring layer in the upper bridge power device group area, a bonding wire, or a bonding tape.

[0053] Further, during the turn-on process of each power device in the upper-bridge power device group, control the current to flow through the second control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar section, the second main busbar section, converge to the second convergence terminal, and then flow to the second sampling terminal.

[0054] Further, during the turn-on process of each power device in the upper-bridge power device group, control the current to flow through the second control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar section, and then flow to the second sampling terminal through one of the bonding wires, bonding tapes or metal clips.

[0055] Further, when each power device in the power module is turned on in the forward direction, the current sequentially flows through: the first power terminal, the fourth part of the first wiring layer in the upper-bridge power device group area, the first terminal of the power device in the upper-bridge power device group, the second terminal of the power device in the upper-bridge power device group, the second branch converging section, then converges to the second main busbar section, the second part of the first wiring layer in the lower-bridge power device group area, the first terminal of the power device in the lower-bridge power device group, the second terminal of the power device in the lower-bridge power device group, the first branch converging section, then to the first main busbar section, and finally is output through the second power terminal.

[0056] Further, the first main busbar section is located above the power device in the lower-bridge power device group, and a partial projection of the first main busbar section on the first insulating substrate is located between adjacent power devices in the lower-bridge power device group.

[0057] Further, the second main busbar section is located above the power device in the upper-bridge power device group, and a partial projection of the second main busbar section on the first insulating substrate is located between some adjacent power devices in the upper-bridge power device group.

[0058] Further, the second busbar section further includes a second insulating substrate and a second wiring layer. The second wiring layer is located on the second insulating substrate, the second insulating substrate is located on the first wiring layer, the second insulating substrate and the second wiring layer are located between some adjacent power devices in the lower-bridge power device group, and the second wiring layer is electrically connected to a plurality of first branch busbar sections and the first main busbar section.

[0059] Further, the third busbar section further includes a third insulating substrate and a third wiring layer. The third wiring layer is located on the third insulating substrate, the third insulating substrate is located on the first wiring layer, the third insulating substrate and the third wiring layer are located between some adjacent power devices in the upper-bridge power device group, and the third wiring layer is electrically connected to a plurality of second branch busbar sections and the second main busbar section.

[0060] Further, during the turn-on process of each power device in the lower-bridge power device group, after controlling the current to flow through the first branch busbar section, it also flows through the second wiring layer and then to the first main busbar section; and / or

[0061] Further, during the turn-on process of each power device in the upper-bridge power device group, after controlling the current to flow through the second branch busbar section, it also flows through the third wiring layer and then to the second main busbar section.

[0062] Further, the second busbar section further includes a fourth wiring layer independent of the first wiring layer. The fourth wiring layer is located between some adjacent power devices. The first surface of the fourth wiring layer is electrically connected to a plurality of first branch busbar sections and the first main busbar section, and the second surface of the fourth wiring layer is located on the first insulating substrate.

[0063] Further, the third busbar section further includes a fifth wiring layer independent of the first wiring layer. The fifth wiring layer is located between some adjacent power devices. The first surface of the fifth wiring layer is electrically connected to a plurality of second branch busbar sections and the second main busbar section, and the second surface of the fifth wiring layer is located on the first insulating substrate.

[0064] Further, during the turn-on process of each power device in the lower-bridge power device group, after controlling the current to flow through the first branch busbar section, it also flows through the fourth wiring layer and then to the first main busbar section; and / or

[0065] Further, during the turn-on process of each power device in the upper-bridge power device group, after controlling the current to flow through the second branch busbar section, it also flows through the fifth wiring layer and then to the second main busbar section.

[0066] Further, the first branch busbar section is one of a bonding wire, a bonding tape, or a metal clip.

[0067] Further, the second branch busbar section is one of a bonding wire, a bonding tape, or a metal clip.

[0068] Further, the power devices in the lower-bridge power device group are arranged in two columns; the power devices in the upper-bridge power device group are arranged in two columns.

[0069] Further, there are four power devices in the lower-bridge power device group. The first branch busbar section includes four first connection ends, and each first connection end of the first branch busbar section is respectively connected to the second ends of the four power devices in the lower-bridge power device group; there are four power devices in the upper-bridge power device group. The second branch busbar section includes four second connection ends, and each second connection end of the second branch busbar section is respectively connected to the second ends of the four power devices in the upper-bridge power device group.

[0070] Further, the first insulating substrate further includes a first heat dissipation bottom plate, and the first heat dissipation bottom plate is exposed on the lower surface of the plastic package.

[0071] Further, the power devices in the lower-bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors; the power devices in the upper-bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors.

[0072] Further, the first power terminal is a DC+ power terminal, the second power terminal is a DC− power terminal, and the third power terminal is an AC power terminal.

[0073] Further, the first end of the power device in the lower-bridge power device group is the drain, the second end of the power device in the lower-bridge power device group is the source, and the third end of the power device in the lower-bridge power device group is the gate; the first end of the power device in the upper-bridge power device group is the drain, the second end of the power device in the upper-bridge power device group is the source, and the third end of the power device in the upper-bridge power device group is the gate.

[0074] Further, the power module further includes a plastic package body that at least covers the first insulating substrate, the first wiring layer, the power devices in the lower-bridge power device group, and the power devices in the upper-bridge power device group. The plastic package body includes opposite first and second sides and opposite third and fourth sides, and the first side and the third side of the plastic package body are perpendicular; the first power terminal extends from the first surface of the plastic package body, the first surface of the plastic package body is parallel to the first insulating substrate, the second power terminal and the first control terminal of the lower-bridge power device group and the first sampling terminal of the lower-bridge power device group extend from the first side of the plastic package body, and the third power terminal and the second control terminal of the upper-bridge power device group and the second sampling terminal of the upper-bridge power device group extend from the second side of the plastic package body.

[0075] Further, the first power terminal is led out from the first surface of the plastic package body, and the first surface of the plastic package body is parallel to the first insulating substrate. The power module adopts the above power module.

[0076] Further, some adjacent power devices are power devices in the same row.

[0077] A power module adopts the above power module.

[0078] A packaging method for a power module adopts the above power module.

[0079] According to the power module, power module group and power module packaging method provided by the present invention, the power module includes a lower-bridge power device group and an upper-bridge power device group. The second bus component of the lower-bridge power device group includes a first main bus portion and a plurality of first branch bus portions. The plurality of first branch bus portions are respectively electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group (such as the source electrodes of metal-oxide semiconductor field effect transistors or silicon carbide metal-oxide semiconductor field effect transistors). The third bus component of the upper-bridge power device group includes a second main bus portion and a plurality of second branch bus portions. The plurality of second branch bus portions are respectively electrically connected to the second ends of the corresponding power devices of the upper-bridge power device group (such as the source electrodes of metal-oxide semiconductor field effect transistors or silicon carbide metal-oxide semiconductor field effect transistors). When each power device is turned on in the forward direction, the current flows in sequence through: the first power terminal, the fourth portion of the first wiring layer in the upper-bridge power device group area, the first end of the power device in the upper-bridge power device group, the second end of the power device in the upper-bridge power device group, the second branch bus portion, and then converges to the second main bus portion, the second portion of the first wiring layer in the lower-bridge power device group area, the first end of the power device in the lower-bridge power device group, the second end of the power device in the lower-bridge power device group, the first branch bus portion, and then to the first main bus portion, and finally is output through the second power terminal. Thus, the conduction path lengths from each power device in the upper-bridge power device group to the second main bus portion are similar, and the conduction path lengths from each power device in the lower-bridge power device group to the first main bus portion are similar, realizing uniform current distribution.

[0080] According to the power module, power module group and power module packaging method provided by the present invention, during the turn-on process of each power device in the lower-bridge power device group, the current is controlled to flow through the first control terminal, the third end of each power device in the lower-bridge power device group, the second end of each power device in the lower-bridge power device group, the first branch bus portion, the first main bus portion, converges to the first convergence terminal, and then flows to the first sampling terminal through one of the second portion of the first wiring layer in the lower-bridge power device group area, the bonding wire or the bonding tape.

[0081] The present invention also provides multiple paths for controlling the current during the turn-on process of the power device, reducing switching oscillation:

[0082] During the turn-on process of each power device in the lower-bridge power device group, the current is controlled to flow through the first control terminal, the third end of each power device in the lower-bridge power device group, the second end of each power device in the lower-bridge power device group, the first branch bus portion, the first main bus portion, converges to the first convergence terminal, and then flows to the first sampling terminal.

[0083] During the turn-on process of each power device in the lower-bridge power device group, control the current to flow through the first control terminal, the third terminal of each power device in the lower-bridge power device group, the second terminal of each power device in the lower-bridge power device group, the first branch busbar, and then flow to the first sampling terminal through one of the bonding wires, bonding tapes or metal clips.

[0084] During the turn-on process of each power device in the upper-bridge power device group, control the current to flow through the first control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar, the second main busbar, converge to the second convergence terminal, and then flow to the second sampling terminal through one of the fifth part of the first wiring layer in the upper-bridge power device group area, the bonding wire or the bonding tape.

[0085] During the turn-on process of each power device in the upper-bridge power device group, control the current to flow through the second control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar, the second main busbar, converge to the second convergence terminal, and then flow to the second sampling terminal.

[0086] During the turn-on process of each power device in the upper-bridge power device group, control the current to flow through the second control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar, and then flow to the second sampling terminal through one of the bonding wires, bonding tapes or metal clips.

[0087] The power module provided by the present invention simultaneously packages the lower-bridge power device group and the upper-bridge power device group. Compared with the traditional separate packaging of the upper-bridge power device group and the lower-bridge power device group, it greatly saves area and cost, and is more convenient for users to use.

[0088] The power module provided by the present invention can also adopt a second insulating substrate and a second wiring layer, thereby further reducing the size of the power module, and can flexibly select second insulating substrates of different sizes according to requirements to meet different application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] Through the following description of the embodiments of the present invention with reference to the drawings, the above and other objects, features and advantages of the present invention will become clearer. In the drawings:

[0090] Figure 1 is a three-dimensional schematic diagram of the power module according to the first embodiment of the present invention;

[0091] Figure 2 is a schematic diagram of the first embodiment of the power module according to the first embodiment of the present invention;

[0092] Figure 3Schematic diagram of the current path when the power module of the first embodiment of the present invention is turned on in the forward direction;

[0093] Figure 4 Schematic diagram of the control current path of the power module of the first embodiment of the present invention;

[0094] Figure 5 Schematic diagram of the power module of the second embodiment of the present invention;

[0095] Figure 6 Explosion schematic diagram of the power module of the second embodiment of the present invention;

[0096] Figure 7 Schematic diagram of the power module of the third embodiment of the present invention;

[0097] Figure 8 Schematic diagram of the power module of the fourth embodiment of the present invention;

[0098] Figure 9 Schematic diagram of the power module of the fifth embodiment of the present invention;

[0099] Figure 10 Schematic diagram of the power module of the sixth embodiment of the present invention;

[0100] Figure 11 Schematic diagram of the power module of the seventh embodiment of the present invention;

[0101] Figure 12 Stereoscopic schematic diagram of the power module of the seventh embodiment of the present invention.

[0102] Figure 13 Schematic diagram of the power module of the eighth embodiment of the present invention;

[0103] Figure 14 Stereoscopic schematic diagram of the power module of the eighth embodiment of the present invention

[0104] Figure 15 Schematic diagram of the power module of the ninth embodiment of the present invention;

[0105] Figure 16 Stereoscopic schematic diagram of the power module of the ninth embodiment of the present invention;

[0106] Figure 17 Schematic diagram of the control current path of the power module of the ninth embodiment of the present invention.

[0107] Figure 18 Schematic diagram of the power module of the ninth embodiment of the present invention;

[0108] Figure 19 Stereoscopic schematic diagram of the power module of the ninth embodiment of the present invention. Detailed implementation manners

[0109] The present application will be described based on embodiments, but the present application is not limited to these embodiments. In the following detailed description of the present application, some specific details are described in detail. Those skilled in the art can fully understand the present application without the description of these details. In order to avoid obscuring the essence of the present application, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0110] In addition, those of ordinary skill in the art should understand that the accompanying drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0111] Unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0112] For ease of explanation, spatially relative terms such as "inner", "outer", "below", "beneath", "lower", "above", "upper", etc. are used herein to describe the relationship of one element or feature illustrated in the drawings to another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is flipped, the element described as "below" or "beneath" another element or feature will then be positioned "above" that other element or feature. Thus, the exemplary term "below" can encompass both the orientation of above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptive words used herein should be interpreted accordingly.

[0113] Unless the context clearly requires otherwise, words such as "including" and "comprising" throughout the application should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".

[0114] In the description of the present application, it should be understood that terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0115] As Figures 1 to 17 shown, a power module includes:

[0116] The first insulating substrate 101;

[0117] The first wiring layer 102, and the first wiring layer 102 is located on the first insulating substrate 101;

[0118] The lower-bridge power device group, the lower-bridge power device group includes a plurality of power devices 103-1, the plurality of power devices 103-1 of the lower-bridge power device group are located on the corresponding first wiring layer 102, and each power device 103-1 of the lower-bridge power device group includes a first end, a second end, and a third end; the upper-bridge power device group, the upper-bridge power device group includes a plurality of power devices 103-2, the plurality of power devices 103-2 of the upper-bridge power device group are located on the corresponding first wiring layer 102, and each power device 103-2 of the upper-bridge power device group includes a first end, a second end, and a third end;

[0119] The busbar portion, the busbar portion includes a main busbar portion and a plurality of branch busbar portions;

[0120] The plurality of branch busbar portions are respectively electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group, and / or the plurality of branch busbar portions are respectively electrically connected to the second ends of the corresponding power devices of the upper-bridge power device group,

[0121] The embodiments of the present invention are described by taking Figures 1 to 17 as an example. As Figures 1 to 17 shown, the plurality of branch busbar portions are respectively electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group. However, the present invention is not limited by the foregoing embodiments. Except for Figures 1 to 17 the power module shown, the plurality of branch busbar portions are respectively only electrically connected to the second ends of the corresponding power devices of the lower-bridge power device group, or the plurality of branch busbar portions may be respectively only electrically connected to the second ends of the corresponding power devices of the upper-bridge power device group.

[0122] Figures 1 to 17 The power module shown in:

[0123] The second end of the power device 103-1 of the lower-bridge power device group is electrically connected to the second power terminal of the power module, and the third end of the power device 103-1 of the lower-bridge power device group is electrically connected to the first control terminal 136-1;

[0124] The first end of the power device 103-2 of the upper-bridge power device group is electrically connected to the first power terminal 120 (i.e., the DC+ power terminal) of the power module, the second end of the power device 103-2 of the upper-bridge power device group is electrically connected to the third power terminal 122 (i.e., the AC power terminal) of the power module, and the third end of the power device 103-2 of the upper-bridge power device group is electrically connected to the second control terminal 136-2;

[0125] The busbar section includes a second busbar section 130-1 and a third busbar section 130-2, the main busbar section includes a first main busbar section 131-1 and a second main busbar section 131-2, the multiple branch busbar sections shown include multiple first branch busbar sections 132-1 and multiple second branch busbar sections 132-2, the second busbar section 130-1 includes the first main busbar section 131-1 and multiple first branch busbar sections 132-1, and the third busbar section 130-2 includes the second main busbar section 131-2 and multiple second branch busbar sections 132-2;

[0126] The multiple first branch busbar sections 132-1 are respectively electrically connected to the second ends of the corresponding power devices 103-1 of the lower bridge power device group, and the first main busbar section 131-1 is electrically connected to the second power terminal 121 (DC power terminal);

[0127] The multiple second branch busbar sections 132-2 are respectively electrically connected to the second ends of the corresponding power devices 103-2 of the upper bridge power device group, and the second main busbar section 131-2 is electrically connected to the third power terminal 122 (AC power terminal);

[0128] The first end of the power device 103-1 of the lower bridge power device group is electrically connected to the second main busbar section 131-2.

[0129] As Figures 1 to 4 shown, the power module is the first embodiment, as Figure 5 、 Figure 6 shown, the power module is the second embodiment, as Figures 7 to 10 are respectively the third to sixth embodiments, as Figure 11 、 Figure 12 is the seventh embodiment, as Figure 13 、 Figure 14 is the eighth embodiment, Figures 15 to 19 is the ninth embodiment.

[0130] As Figures 1 to 8 、 Figures 11 to 17 shown, the multiple first branch busbar sections 132-1 are respectively electrically connected to the second ends of the corresponding power devices 103-1 of the lower bridge power device group through the second metal interconnection layer 112-1 of the lower bridge power device group; or, as Figure 9 or Figure 10 shown, the multiple first branch busbar sections 132-1 are respectively electrically connected to the second ends of the corresponding power devices 103-1 of the lower bridge power device group through bonding wires or bonding tapes.

[0131] As Figures 1 to 8 、 Figures 11 to 17 shown, the multiple second branch busbar sections 132-2 are respectively electrically connected to the second ends of the corresponding power devices 103-2 of the upper bridge power device group through the second metal interconnection layer 112-2 of the upper bridge power device group; or, asFigure 9 or Figure 10 As shown, a plurality of second branch busbars 132-2 are electrically connected to the second ends of the corresponding power devices 103-2 of the upper bridge power device group through bonding wires or bonding tapes respectively.

[0132] As Figures 1 to 17 shown, the first ends of the power devices of the lower bridge power device group are electrically connected to the third power terminal 122 (AC power terminal) of the power module through one of the first brazing layer 111-1, the first sintering layer 111-1, the first eutectic solder or the first conductive adhesive 111-1;

[0133] As Figures 1 to 17 shown, the first ends of the power devices of the upper bridge power device group are electrically connected to the first power terminal 120 (DC+ power terminal) of the power module through one of the second brazing layer 111-2, the second sintering layer 111-2, the second eutectic solder or the second conductive adhesive 111-2.

[0134] The first wiring layer includes a first part, a second part, a third part, a fourth part, a fifth part, and a sixth part of the first wiring layer that are isolated from each other.

[0135] As Figures 1 to 17 shown, a plurality of power devices 103-1 of the lower bridge power device group are located on the first part of the corresponding first wiring layer, and a plurality of power devices 103-2 of the upper bridge power device group are located on the fourth part of the corresponding first wiring layer.

[0136] As Figures 1 to 8 and Figures 11 to 17 shown, the second power terminal 121 and the first main busbar 131-1 are an integral metal clamp structure.

[0137] As Figures 1 to 8 and Figures 11 to 17 shown, the third power terminal 122 and the second main busbar 131-2 are an integral metal clamp structure.

[0138] The second power terminal 121 and the first main busbar 131-1 can also be a discrete metal clamp structure.

[0139] The third power terminal 122 and the second main busbar 131-2 can also be a discrete metal clamp structure.

[0140] As Figure 9 and Figure 10 shown, at least a part of the first main busbar 131-1 is a bonding wire or a bonding tape;

[0141] As Figure 9 and Figure 10As shown, at least a part of the second main busbar portion 131-2 is a bonding wire or a bonding tape.

[0142] As Figures 1 to 4 shown, the first main busbar portion 131-1 and the first branch busbar portion 132-1 are a metal clip of an integral structure;

[0143] As Figures 1 to 4 shown, the second main busbar portion 131-2 and the second branch busbar portion 132-2 are a metal clip of an integral structure.

[0144] As Figures 5 to 8 、 Figures 11 to 17 shown, the first main busbar portion 131-1 and the first branch busbar portion 132-1 are a metal clip of a discrete structure;

[0145] As Figures 5 to 8 、 Figures 11 to 17 shown, the second main busbar portion 131-2 and the second branch busbar portion 132-2 are a metal clip of a discrete structure.

[0146] As Figures 1 to 4 、 Figure 7 、 Figure 8 、 Figures 11 to 17 shown, the first branch busbar portions 132-1 corresponding to some adjacent power devices of the lower bridge power device group are of an integral structure;

[0147] As Figures 1 to 4 、 Figure 7 、 Figure 8 、 Figures 11 to 17 shown, the second branch busbar portions 132-2 of the upper bridge power device group corresponding to some adjacent power devices of the upper bridge power device group are of an integral structure.

[0148] As Figure 5 、 Figure 6 shown, the first branch busbar portions 132-1 corresponding to all the power devices of the lower bridge power device group are of a discrete structure, and the second ends of some adjacent power devices of the lower bridge power device group are connected to each other by one of a bonding wire, a bonding tape or a discrete metal clip;

[0149] As Figure 5 、 Figure 6 shown, the second branch busbar portions 132-2 corresponding to all the power devices of the upper bridge power device group are of a discrete structure, and the second ends of some adjacent power devices of the upper bridge power device group are connected to each other by one of a bonding wire, a bonding tape or a discrete metal clip.

[0150] As Figures 1 to 17As shown, the current of the first main busbar portion 131-1 and the multiple first branch busbar portions 132-1 intersects at the first convergence end 135-1. The first main busbar portion 131-1 includes a first end and a second end. The first convergence end 135-1 is located at the first end of the first main busbar portion 131-1. The distance from the first end of the first main busbar portion 131-1 to the second power terminal 121 is greater than the distance from the second end of the first main busbar portion 131-1 to the second power terminal 121. The power module further includes a first sampling terminal 134-1. As Figures 1 to 12 , the second end of the first sampling terminal 134-1 is electrically connected to the first convergence end 135-1. As Figures 1 to 17 shown, the second sampling terminal 134-2 of the upper bridge power device group is connected to the third power terminal 122 (i.e., the AC power terminal).

[0151] As Figures 5 to 7 , Figure 9 , Figure 10 shown, the second end of the first sampling terminal 134-1 and the first convergence end 135-1 are interconnected by a bonding wire or a bonding tape.

[0152] As Figures 1 to 4 shown, the second end of the first sampling terminal 134-1 and the first convergence end 135-1 are interconnected through the third metal interconnection layer 114 and the second part of the first wiring layer 102.

[0153] Referring to Figures 1 to 4 , the third metal interconnection layer 114 can be cancelled, and the second end of the first sampling terminal and the first convergence end are directly interconnected with the second part of the first wiring layer in the area of the lower bridge power device group.

[0154] As Figure 8 , Figure 11 , Figure 12 shown, the second end of the first sampling terminal 134-1 and the first convergence end 135-1 are of an integral structure. The stability of such an integral structure is better than that of a bonding wire, avoiding the offset or collapse of the bonding wire during the production process, resulting in the change of the position of the convergence end.

[0155] The second end of the first sampling terminal can also be electrically connected to the second end of the power device of the lower bridge power device group through one of a bonding wire, a bonding tape, or a metal clip.

[0156] As Figures 13 to 17 shown, the second end of the first sampling terminal can also be electrically connected to the first branch busbar portion through one of a bonding wire, a bonding tape, or a metal clip.

[0157] As Figure 18 , Figure 19As shown, the current of the second main busbar and multiple second branch busbars intersects at the second convergence end. The second main busbar includes a first end and a second end. The second convergence end is located at the first end of the second main busbar. The distance from the first end of the second main busbar to the third power terminal is greater than the distance from the second end of the second main busbar to the third power terminal.

[0158] The power module further includes a second sampling terminal, and the second end of the second sampling terminal is electrically connected to the second convergence end.

[0159] The second end of the second sampling terminal and the second convergence end are interconnected by a bonding wire or a bonding tape;

[0160] The second end of the second sampling terminal and the second convergence end are interconnected through a fourth metal interconnection layer and a fifth part of the first wiring layer;

[0161] The second end of the second sampling terminal and the second convergence end are directly interconnected with a fifth part of the first wiring layer; or

[0162] The second end of the second sampling terminal and the second convergence end are of an integral structure.

[0163] The power module further includes a second sampling terminal, and the second end of the second sampling terminal is electrically connected to the second end of the power device of the upper bridge power device group through one of a bonding wire, a bonding tape or a metal clip.

[0164] The power module further includes a second sampling terminal, and the second end of the second sampling terminal is electrically connected to the second branch busbar through one of a bonding wire, a bonding tape or a metal clip.

[0165] As Figures 1 to 7 、 Figure 9 、 Figure 10 For the power module shown, during the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal 136-1, the third end of each power device 103-1 in the lower bridge power device group, the second end of each power device 103-1 in the lower bridge power device group, the first branch busbar 132-1, the first main busbar 131-1, converges to the first convergence end 135-1, and then flows to the first sampling terminal 134-1 through one of the bonding wire or the bonding tape in the second part of the first wiring layer 102-1 in the area of the lower bridge power device group. Specifically, the present invention takes Figure 4Taking the power module shown as an example for illustration, where the dotted line indicates the control current path. Similarly, in the process of turning on each power device in the upper-bridge power device group of the power module of the present invention, the control current flows through the second control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar, the second main busbar, converges to the second convergence terminal, and then flows to the second sampling terminal through one of the fourth part of the first wiring layer in the lower-bridge power device group area, the bonding wire or the bonding tape.

[0166] Figure 8 、 Figure 11 、 Figure 12 Taking the power module shown as an example, in the process of turning on each power device in the lower-bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower-bridge power device group, the second terminal of each power device in the lower-bridge power device group, the first branch busbar, the first main busbar, converges to the first convergence terminal, and then flows to the first sampling terminal. Similarly, in the process of turning on each power device in the upper-bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper-bridge power device group, the second terminal of each power device in the upper-bridge power device group, the second branch busbar, the second main busbar, converges to the second convergence terminal, and then flows to the second sampling terminal.

[0167] Figures 13 to 17 Taking the power module shown as an example for illustration, where the dotted line indicates the control current path. Similarly, in the process of turning on each power device in the upper-bridge power device group, the control current flows through the second control terminal 136-2, the third terminal of each power device 103-2 in the upper-bridge power device group, the second terminal of each power device 103-2 in the upper-bridge power device group, the second branch busbar 132-2, and then flows to the second sampling terminal 134-1 through one of the bonding wire, the bonding tape or the metal clip. Specifically, the present invention takes Figure 17 Taking the power module shown as an example for illustration, where the dotted line indicates the control current path. Similarly, in the process of turning on each power device in the upper-bridge power device group, the control current flows through the second control terminal 136-2, the third terminal of each power device 103-2 in the upper-bridge power device group, the second terminal of each power device 103-2 in the upper-bridge power device group, the second branch busbar 132-2, and then flows to the second sampling terminal 134-1 through one of the bonding wire, the bonding tape or the metal clip.

[0168] Such as Figures 1 - 17For the power module shown, when each power device is turned on in the forward direction, the current flows through in sequence: the first power terminal 120 (i.e., the DC+ power terminal), the first wiring layer 102 in the area of the upper-bridge power device group, the first end of the power device in the upper-bridge power device group, the second end of the power device in the upper-bridge power device group, the second branch converging part 132-2, and then converges to the second main busbar part 131-2, the first wiring layer 102 in the area of the lower-bridge power device group, the first end of the power device in the lower-bridge power device group, the second end of the power device in the lower-bridge power device group, converges through the first branch converging part 132-1, then reaches the first main busbar part 131-1, and finally is output through the second power terminal 121 (i.e., the DC- power terminal). Specifically, the present invention takes Figure 3 the power module shown as an example for illustration, where the dotted line indicates the control current path. As can be clearly seen from Figure 3 it, based on the current sharing design of this power module, each power device only needs to bear a part (such as one-fourth) of the total current magnitude, and there is no uneven situation where an individual power device bears a large load. In the power module of the present application, the current magnitudes borne by each power device are similar, and the conductive path lengths from each power device to the main busbar area are also similar, which can effectively achieve uniform current distribution and improve system stability. Further, the converging end 135 is located at the first end of the main busbar part 131, which can reduce the influence of the main busbar part 131 on its control current

[0169] such as Figures 1 to 17 shown, the first main busbar part 131-1 is located above the power device 103-1 in the lower-bridge power device group, and the partial projection of the first main busbar part 131-1 on the first insulating substrate 101 is located between the adjacent power devices 103-1 in the lower-bridge power device group;

[0170] such as Figures 1 to 17 shown, the second main busbar part 131-2 is located above the power device 103-2 in the upper-bridge power device group, and the partial projection of the second main busbar part 131-2 on the first insulating substrate 101 is located between the adjacent power devices 103-2 in the upper-bridge power device group.

[0171] such as Figures 5 to 14 shown:

[0172] The second busbar part 130-1 further includes a second insulating substrate and a second wiring layer 141-1. The second wiring layer is located on the second insulating substrate, the second insulating substrate is located on the first wiring layer, the second insulating substrate and the second wiring layer 141-1 are located between some adjacent power devices in the lower-bridge power device group, and the second wiring layer is electrically connected to a plurality of first branch busbar parts 132-1 and the first main busbar part 131-1;

[0173] The third bus bar 130-2 further includes a third insulating substrate and a third wiring layer 141-2. The third wiring layer is located on the third insulating substrate, the third insulating substrate is located on the first wiring layer, the third insulating substrate and the third wiring layer 141-2 are located between some adjacent power devices of the upper-bridge power device group, and the third wiring layer is electrically connected to a plurality of second branch bus bars 132-2 and a second main bus bar 131-2.

[0174] As Figures 5 to 14 shown in the power module, during the turn-on process of each power device in the lower-bridge power device group, after controlling the current to flow through the first branch bus bar, it further flows through the second wiring layer and then to the first main bus bar. As Figures 5 to 14 shown in the power module, during the turn-on process of each power device in the upper-bridge power device group, after controlling the current to flow through the second branch bus bar, it further flows through the third wiring layer and then to the second main bus bar.

[0175] The second bus bar 130-1 further includes a fourth wiring layer independent of the first wiring layer. The fourth wiring layer is located between some adjacent power devices 103-1. The first surface of the fourth wiring layer is electrically connected to a plurality of first branch bus bars 132-1 and a first main bus bar 131-1, and the second surface of the fourth wiring layer is located on the first insulating substrate 101.

[0176] The third bus bar 130-2 further includes a fifth wiring layer independent of the first wiring layer. The fifth wiring layer is located between some adjacent power devices 103-1. The first surface of the fifth wiring layer is electrically connected to a plurality of second branch bus bars 132-1 and a second main bus bar 131-1, and the second surface of the fifth wiring layer is located on the first insulating substrate 101.

[0177] During the turn-on process of each power device in the lower-bridge power device group, after controlling the current to flow through the first branch bus bar, it further flows through the fourth wiring layer and then to the first main bus bar; and / or

[0178] During the turn-on process of each power device in the upper-bridge power device group, after controlling the current to flow through the second branch bus bar, it further flows through the fifth wiring layer and then to the second main bus bar.

[0179] As Figures 1 to 17As shown, the power devices 103-1 of the lower-bridge power device group are arranged in two columns; the power devices 103-2 of the upper-bridge power device group are arranged in two columns. There are four power devices 103-1 in the lower-bridge power device group, and the power devices 103-1 in the lower-bridge power device group are arranged in two columns and two rows. The first branch busbar 132-1 includes four first connection ends, and each first connection end is connected to the second ends of the four power devices in the lower-bridge power device group; there are four power devices 103-2 in the upper-bridge power device group, and the second branch busbar 132-2 includes four second connection ends, and each second connection end is connected to the second ends of the four power devices in the upper-bridge power device group.

[0180] As Figures 1 to 17 shown, the first insulating substrate 101 further includes a first heat dissipation bottom plate, and the first heat dissipation bottom plate is exposed on the lower surface of the plastic package.

[0181] The power devices in the lower-bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors, but the power devices in this application are not limited by this embodiment. The first power terminal 120 of the power module is a DC+ power terminal, the second power terminal 121 is a DC- power terminal, and the third power terminal is an AC power terminal. The first end of the power device in the lower-bridge power device group is the drain, the second end of the power device in the lower-bridge power device group is the source, the third end of the power device in the lower-bridge power device group is the gate, the first end of the power device in the upper-bridge power device group is the drain, the second end of the power device in the upper-bridge power device group is the source, and the third end of the power device in the upper-bridge power device group is the gate.

[0182] As Figures 1 to 17 shown, the power module further includes a plastic package 106-1 or 106. The plastic package at least covers the first insulating substrate 101, the power devices 103-1 in the lower-bridge power device group, and the power devices 103-2 in the upper-bridge power device group. The plastic package includes opposite first and second sides and opposite third and fourth sides, and the first side and the third side of the plastic package are perpendicular; the second power terminal 121, the first control terminal of the lower-bridge power device group, and the first sampling terminal of the lower-bridge power device group extend from the first side of the plastic package, and the third power terminal 122, the second control terminal of the upper-bridge power device group, and the second sampling terminal of the upper-bridge power device group extend from the second side of the plastic package.

[0183] As Figures 1 to 17 shown, the first power terminal 120 is led out from the first surface of the plastic package, and the first surface of the plastic package is parallel to the first insulating substrate. However, the first power terminal of the present invention is not limited by Figures 1 to 17 the embodiment shown.

[0184] The power devices adjacent to each other in the power module part can be the power devices in the same row.

[0185] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power module, characterized in that: include: a first insulating substrate; a first wiring layer, the first wiring layer being located on the first insulating substrate; A lower bridge power device group, the lower bridge power device group includes a plurality of power devices, the plurality of power devices of the lower bridge power device group are located on the corresponding first wiring layer, and each power device of the lower bridge power device group includes a first end, a second end and a third end; An upper bridge power device group, the upper bridge power device group includes a plurality of power devices, the plurality of power devices of the upper bridge power device group are located on the corresponding first wiring layer, and each power device of the upper bridge power device group includes a first end, a second end and a third end; A confluence portion, the confluence portion comprising a main confluence portion and a plurality of branch confluence portions; The plurality of branch bus portions are respectively electrically connected to second ends of corresponding power devices of the lower bridge power device group, and / or the plurality of branch bus portions are respectively electrically connected to second ends of corresponding power devices of the upper bridge power device group.

2. The power module according to claim 1, characterized in that: The second end of the power device of the lower bridge power device group is electrically connected to the second power terminal of the power module, and the third end of the power device of the lower bridge power device group is electrically connected to the first control terminal; The first end of the power device of the upper bridge power device group is electrically connected to the first power terminal of the power module, the second end of the power device of the upper bridge power device group is electrically connected to the third power terminal of the power module, and the third end of the power device of the upper bridge power device group is electrically connected to the second control terminal; The confluence portion includes a second confluence portion and a third confluence portion, the main confluence portion includes a first main confluence portion and a second main confluence portion, the plurality of branch confluence portions include a plurality of first branch confluence portions and a plurality of second branch confluence portions, the second confluence portion includes the first main confluence portion and the plurality of first branch confluence portions, and the third confluence portion includes a second main confluence portion and a plurality of second branch confluence portions; The multiple first branch bus parts are respectively electrically connected to the second ends of the corresponding power devices of the lower bridge power device group, and the first main bus part is electrically connected to the second power terminal; the multiple second branch bus parts are respectively electrically connected to the second ends of the corresponding power devices of the upper bridge power device group, the second main bus part is electrically connected to the third power terminal, and the first ends of the power devices of the lower bridge power device group are electrically connected to the second main bus part.

3. The power module according to claim 2, characterized in that: The plurality of first branch confluence portions are electrically connected to the second ends of the corresponding power devices of the lower bridge power device group respectively through one of the second metal interconnection layer, bonding wire or bonding tape of the lower bridge power device group; and / or The plurality of second branch bus portions are electrically connected to the second ends of the corresponding power devices of the upper bridge power device group through one of the second metal interconnection layer, bonding wires or bonding ribbons of the upper bridge power device group.

4. The power module according to claim 2, characterized in that: The first end of the power device of the lower bridge power device group is electrically connected to the third power terminal of the power module through one of a first soldering layer, a first sintering layer, a first eutectic solder or a first conductive adhesive; and / or The first end of the power device of the upper bridge power device group is electrically connected to the first power terminal of the power module through one of the second soldering layer, the second sintering layer, the second eutectic soldering layer or the second conductive adhesive of the upper bridge power device group.

5. The power module according to claim 2, characterized in that: The first wiring layer includes a first portion of the first wiring layer, a second portion of the first wiring layer, a third portion of the first wiring layer, a fourth portion of the first wiring layer, a fifth portion of the first wiring layer, and a sixth portion of the first wiring layer that are isolated from each other.

6. The power module according to claim 5, characterized in that: The multiple power devices of the lower bridge power device group are located on the first portion of the corresponding first wiring layer, and the multiple power devices of the lower bridge power device group are located on the fourth portion of the corresponding first wiring layer.

7. The power module according to claim 2, characterized in that The second power terminal and the first main bus portion are metal clips of an integral structure.

8. The power module according to claim 2, characterized in that The third power terminal and the second main bus portion are metal clips of an integral structure.

9. The power module according to claim 2, characterized in that The second power terminal and the first main bus portion are metal clips with separate structures.

10. The power module according to claim 2, characterized in that The third power terminal and the second main bus portion are metal clips with separate structures.

11. The power module according to claim 2, characterized in that At least a portion of the first main conduit portion is a bonding wire or a bonding ribbon; and / or At least a portion of the second main conduit portion is a bonding wire or a bonding ribbon.

12. The power module according to claim 2, characterized in that The first main conduit portion and the first branch conduit portion are metal clips of an integrated structure; and / or The second main conduit portion and the second branch conduit portion are metal clips of an integrated structure.

13. The power module according to claim 2, characterized in that The first main conduit portion and the first branch conduit portion are metal clips with separate structures; and / or The second main conduit portion and the second branch conduit portion are metal clips with separate structures.

14. The power module according to claim 2, characterized in that The first branch confluence parts corresponding to some adjacent power devices of the lower bridge power device group are an integrated structure; and / or The second branch confluence parts of the upper bridge power device group corresponding to some adjacent power devices of the upper bridge power device group are an integrated structure.

15. The power module according to claim 2, characterized in that The first branch confluence portions corresponding to the partially adjacent power devices of the lower bridge power device group are discrete structures, and the second ends of the partially adjacent power devices of the lower bridge power device group are interconnected by one of bonding wires, bonding tapes or discrete metal clips; and / or The second branch confluence parts corresponding to some adjacent power devices in the upper bridge power device group are discrete structures, and the second ends of some adjacent power devices in the upper bridge power device group are interconnected by one of bonding wires, bonding tapes or discrete metal clips.

16. The power module according to claim 2, characterized in that: The currents of the first main bus and the multiple first branch buss intersect at a first converging end. The first main bus includes a first end and a second end. The first converging end is located at the first end of the first main bus. The distance from the first end of the first main bus to the second power terminal is greater than the distance from the second end of the first main bus to the second power terminal.

17. The power module according to claim 16, characterized in that: The power module further includes a first sampling terminal, a second end of which is electrically connected to the first converging end.

18. The power module according to claim 17, characterized in that: The second end of the first sampling terminal is electrically connected to the first collecting end in one of the following ways: (1) The second end of the first sampling terminal is interconnected with the first converging end through a bonding wire or a bonding tape; (2) The second end of the first sampling terminal is interconnected with the first converging end and the second part of the first wiring layer through a third metal interconnection layer; (3) the second end of the first sampling terminal and the first converging end are directly interconnected with the second part of the first wiring layer in the lower bridge power device group region; or (4) The second end of the first sampling terminal and the first converging end are an integrated structure.

19. The power module according to claim 2, further comprising a first sampling terminal, a second end of the first sampling terminal being electrically connected to a second end of a power device of the lower bridge power device group through one of a bonding wire, a bonding ribbon or a metal clip. 20 . The power module according to claim 2 , further comprising a first sampling terminal, wherein a second end of the first sampling terminal is electrically connected to the first branch bus portion through one of a bonding wire, a bonding ribbon, or a metal clip.

21. The power module according to claim 2, characterized in that: The currents of the second main bus and the multiple second branch buss intersect at a second converging end, the second main bus includes a first end and a second end, the second converging end is located at the first end of the second main bus, and the distance from the first end of the second main bus to the third power terminal is greater than the distance from the second end of the second main bus to the third power terminal.

22. The power module according to claim 21, characterized in that: The power module further includes a second sampling terminal, and a second end of the second sampling terminal is electrically connected to the second collecting end.

23. The power module according to claim 21, characterized in that: The second end of the second sampling terminal is electrically connected to the second collecting end in one of the following ways: (1) The second end of the second sampling terminal and the second converging end are interconnected by a bonding wire or a bonding ribbon; (2) The second end of the second sampling terminal and the second converging end are interconnected with the fifth portion of the first wiring layer through a fourth metal interconnection layer; (3) the second end of the second sampling terminal and the second converging end are directly interconnected with the fifth portion of the first wiring layer; or (4) The second end of the second sampling terminal and the second converging end are an integrated structure. 24 . The power module according to claim 2 , further comprising a second sampling terminal, a second end of the second sampling terminal being electrically connected to a second end of a power device of the upper bridge power device group through one of a bonding wire, a bonding ribbon or a metal clip. 25 . The power module according to claim 2 , further comprising a second sampling terminal, wherein a second end of the second sampling terminal is electrically connected to the second branch bus portion through one of a bonding wire, a bonding ribbon, or a metal clip.

26. The power module according to claim 18, characterized in that: During the turning-on process of each power device of the lower bridge power device group, the control current flows through the first control terminal, the third end of each power device of the lower bridge power device group, the second end of each power device of the lower bridge power device group, the first branch confluence, the first main confluence, converges to the first convergence end, and then flows to the first sampling terminal through the second part of the first wiring layer of the lower bridge power device group area, one of the bonding wires or the bonding tape.

27. The power module according to claim 18, characterized in that: During the turning-on process of each power device of the lower bridge power device group, the control current flows through the first control terminal, the third end of each power device of the lower bridge power device group, the second end of each power device of the lower bridge power device group, the first branch confluence, the first main confluence, converges to the first convergence end, and then flows to the first sampling terminal.

28. The power module according to claim 20, characterized in that: During the turning-on process of each power device of the lower bridge power device group, the control current flows through the first control terminal, the third end of each power device of the lower bridge power device group, the second end of each power device of the lower bridge power device group, the first branch confluence part, and then flows to the first sampling terminal through one of the bonding wire, the bonding tape or the metal clip.

29. The power module according to claim 23, characterized in that: During the turning-on process of each power device of the upper bridge power device group, the control current flows through the first control terminal, the third end of each power device of the upper bridge power device group, the second end of each power device of the upper bridge power device group, the second branch confluence, the second main confluence, converges to the second convergence end, and then flows to the second sampling terminal through the fifth part of the first wiring layer of the upper bridge power device group area, one of the bonding wire or the bonding tape.

30. The power module according to claim 23, characterized in that: During the turning-on process of each power device of the upper bridge power device group, the control current flows through the second control terminal, the third end of each power device of the upper bridge power device group, the second end of each power device of the upper bridge power device group, the second branch confluence part, the second main confluence part, converges to the second convergence end, and then flows to the second sampling terminal.

31. The power module according to claim 24, characterized in that: During the turning-on process of each power device of the upper bridge power device group, the control current flows through the second control terminal, the third end of each power device of the upper bridge power device group, the second end of each power device of the upper bridge power device group, the second branch confluence portion, and then flows to the second sampling terminal through one of a bonding wire, a bonding tape or a metal clip.

32. The power module according to claim 6, characterized in that: When each power device is turned on in the forward direction, the current flows in sequence through: the first power terminal, the fourth part of the first wiring layer of the upper bridge power device group area, the first end of the power device of the upper bridge power device group, the second end of the power device of the upper bridge power device group, the second branch confluence part, and then converges to the second main confluence part, the second part of the first wiring layer of the lower bridge power device group area, the first end of the power device of the lower bridge power device group, the second end of the power device of the lower bridge power device group, the first branch confluence part, and then to the first main confluence part, and finally output through the second power terminal.

33. The power module according to claim 2, characterized in that: The first main confluence portion is located above the power device of the lower bridge power device group, and the partial projection of the first main confluence portion on the first insulating substrate is located between the partially adjacent power devices of the lower bridge power device group; and / or The second main conduit portion is located above the power devices of the upper bridge power device group, and a partial projection of the second main conduit portion on the first insulating substrate is located between partially adjacent power devices of the upper bridge power device group.

34. The power module according to claim 2, characterized in that: The second bus portion further includes a second insulating substrate and a second wiring layer, the second wiring layer is located on the second insulating substrate, the second insulating substrate is located on the first wiring layer, the second insulating substrate and the second wiring layer are located between some adjacent power devices of the lower bridge power device group, and the second wiring layer is electrically connected to the plurality of first branch bus portions and the first main bus portion; and / or, The third bus portion also includes a third insulating substrate and a third wiring layer, the third wiring layer is located on the third insulating substrate, the third insulating substrate is located on the first wiring layer, the third insulating substrate and the third wiring layer are located between some adjacent power devices of the upper bridge power device group, and the third wiring layer is electrically connected to the multiple second branch bus portions and the second main bus portion.

35. The power module according to claim 34, characterized in that: During the turning-on process of each power device of the lower bridge power device group, the control current flows through the first branch current collector and then flows through the second wiring layer to the first main current collector.

36. The power module according to claim 34, characterized in that: During the turning-on process of each power device of the upper bridge power device group, the control current flows through the second branch current collector and then flows through the third wiring layer to the second main current collector.

37. The power module according to claim 2, characterized in that: The second busbar further includes a fourth wiring layer independent of the first wiring layer, the fourth wiring layer is located between some of the adjacent power devices, a first surface of the fourth wiring layer is electrically connected to the plurality of first branch busbars and the first main busbar, and a second surface of the fourth wiring layer is located on the first insulating substrate; and / or The third busbar also includes a fifth wiring layer that is independent of the first wiring layer, and the fifth wiring layer is located between some adjacent power devices. The first surface of the fifth wiring layer is electrically connected to the multiple second branch busbars and the second main busbar, and the second surface of the fifth wiring layer is located on the first insulating substrate.

38. The power module according to claim 37, characterized in that: During the turning-on process of each power device of the lower bridge power device group, the control current flows through the first branch current collector and then flows through the fourth wiring layer to the first main current collector.

39. The power module according to claim 37, characterized in that: During the turning-on process of each power device of the upper bridge power device group, the control current flows through the second branch current collector and then flows through the fifth wiring layer to the second main current collector.

40. The power module according to claim 2, characterized in that: The first branch confluence portion is one of a bonding wire, a bonding ribbon or a metal clip; and / or The second branch confluence portion is one of a bonding wire, a bonding ribbon or a metal clip.

41. The power module according to claim 2, characterized in that: The power devices of the lower bridge power device group are arranged into two rows; the power devices of the upper bridge power device group are arranged into two rows.

42. The power module according to claim 2, characterized in that: The lower bridge power device group includes four power devices, the first branch bus includes four first connection ends, and the first connection ends of the first branch bus are respectively connected to the second ends of the four power devices of the lower bridge power device group; the upper bridge power device group includes four power devices, the second branch bus includes four second connection ends, and the second connection ends of the second branch bus are respectively connected to the second ends of the four power devices of the upper bridge power device group.

43. The power module according to claim 2, characterized in that: The first insulating substrate also includes a first heat dissipation bottom plate, and the first heat dissipation bottom plate is exposed on the lower surface of the plastic package body.

44. The power module according to claim 2, characterized in that: The power devices of the lower bridge power device group are metal oxide semiconductor field effect transistors or silicon carbide metal oxide semiconductor field effect transistors; the power devices of the upper bridge power device group are metal oxide semiconductor field effect transistors or silicon carbide metal oxide semiconductor field effect transistors.

45. The power module according to claim 2, characterized in that: The first power terminal is a DC+ power terminal, the second power terminal is a DC- power terminal, and the third power terminal is an AC power terminal.

46. ​​The power module according to claim 42, characterized in that The first end of the power device of the lower bridge power device group is a drain, the second end of the power device of the lower bridge power device group is a source, and the third end of the power device of the lower bridge power device group is a gate. The first end of the power device of the upper bridge power device group is a drain, the second end of the power device of the upper bridge power device group is a source, and the third end of the power device of the upper bridge power device group is a gate.

47. The power module according to claim 2, characterized in that: The power module also includes a plastic package, which at least covers the first insulating substrate, the first wiring layer, the power device of the lower bridge power device group and the power device of the upper bridge power device group. The plastic package includes a first side and a second side relative to each other and a third side and a fourth side relative to each other, and the first side and the third side of the plastic package are perpendicular to each other; the second power terminal, the first control terminal of the lower bridge power device group, and the first sampling terminal of the lower bridge power device group extend from the first side of the plastic package, and the third power terminal, the second control terminal of the upper bridge power device group, and the second sampling terminal of the upper bridge power device group extend from the second side of the plastic package.

48. The power module according to claim 2, characterized in that The first power terminal is led out from a first surface of the plastic package body, and the first surface of the plastic package body is parallel to the first insulating substrate.

49. The power module according to any one of claims 14, 15, 33, 34, or 27, characterized in that The partially adjacent power devices are power devices in the same row.

50. A power module, characterized in that: The power module adopts the power module described in any one of claims 1 to 49.

51. A method for packaging a power module, characterized in that: The power module adopts the power module described in any one of claims 1 to 49.

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