Automatic chip mounting device for semiconductor laser

Abstract

The invention relates to an automatic chip mounting device for a semiconductor laser, and the device comprises a first conveying mechanism, a second conveying mechanism and a chip mounting mechanism which are disposed on a workbench, the chip mounting mechanism comprises a displacement module, a displacement seat, a mounting plate, a lifting cylinder, a suction nozzle device and a calibration device, and the mounting plate is rotatably provided with the suction nozzle device through a rotating seat. The suction nozzle device comprises a turntable seat, suction nozzles, a rotating assembly and a driving assembly, a plurality of interfaces are formed in the end wall of the turntable seat, and each interface is connected with the corresponding suction nozzle; the turntable seat is driven to rotate through the rotating assembly; a casing pipe is arranged on one side of the rotary disc seat, a movable pipe is embedded in the casing pipe and is driven by a driving assembly to move, a sealing plate piece is arranged at one end of the movable pipe, and when the movable pipe moves, one connector is opened or closed through the sealing plate piece, so that the functions of continuous suction and continuous surface mounting are achieved, and frequent returning to a material taking original point is not needed. The reciprocating idle stroke time of the suction nozzle between the loading disc and the laser shell is reduced, and the problem of low efficiency in the traditional chip mounting process is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser packaging technology, and particularly to an automatic semiconductor laser chip mounter. Background Art

[0002] The packaging and chip mounting process of semiconductor lasers refers to the process of accurately mounting semiconductor laser chips onto a heat sink or substrate through solder. Currently, the traditional chip mounting process has the following defects: (1) During the chip mounting process, only one component can be picked up and placed each time, resulting in repeated picking and placing for each mounting, which seriously affects production efficiency; (2) The mounter needs to perform a calibration process between the component picking and placing processes. By moving the suction nozzle to the position of the calibration camera, the camera takes a picture to determine whether there is a deviation in the position of the picked-up component and the deviation value, and then corrects it during chip mounting. The suction nozzle needs to travel back and forth multiple times during this process, increasing the ineffective travel, making the movement path of the suction nozzle redundant, and further affecting the chip mounting efficiency. Therefore, in view of the existing problems, it is necessary for those skilled in the art to make improvements. Summary of the Invention

[0003] In view of the above problems, the present invention discloses an automatic semiconductor laser chip mounter, which uses a rotatable suction nozzle device to continuously pick up multiple components and calibrates each picked-up component through an integrated calibration device.

[0004] The specific technical solutions are as follows:

[0005] An automatic semiconductor laser chip mounter includes a first feeding mechanism, a second feeding mechanism, and a chip mounting mechanism arranged on a workbench. The first feeding mechanism and the second feeding mechanism are arranged on the workbench and respectively convey a carrier plate carrying a laser housing and a carrier plate carrying components; the chip mounting mechanism is used to take out components one by one and sequentially place them on a heat sink inside the laser housing;

[0006] The patch mechanism includes a displacement module, a displacement seat, a mounting plate, a lifting cylinder, a nozzle device, and a calibration device. The displacement seat is movably arranged on the displacement module. One side surface of the displacement seat is longitudinally slidably provided with a mounting plate through a guide rail. The mounting plate is driven to lift by a lifting cylinder on the displacement seat. The nozzle device is rotatably arranged on the mounting plate through a rotating seat. The nozzle device includes a turntable seat, nozzles, a rotating assembly, and a driving assembly. A plurality of interfaces are evenly distributed along the circumferential direction on the end wall of the turntable seat, and each interface is respectively connected to a nozzle. A rotating shaft is arranged on one side of the turntable seat, and the rotating shaft is driven to rotate by the rotating assembly. A sleeve communicated with the inner cavity of the turntable seat is arranged on the other side of the turntable seat. The sleeve is rotatably arranged on the rotating seat. A movable tube is embedded in the sleeve. One end of the movable tube is rotatably connected to a gas path joint. The gas path joint is driven by the driving assembly and drives the movable tube to perform a horizontal displacement together. The other end of the movable tube extends into the inner cavity of the turntable seat, and a sealing plate is arranged at the other end of the movable tube, so that when the movable tube is displaced, the lowermost interface is opened or closed by the sealing plate. The calibration device includes a mounting frame and a calibration camera. One end of the mounting frame is fixedly connected to the rotating support, and the mounting frame extends along the radial direction of the movable tube. The other end of the mounting frame is bent in an L shape and mounts the calibration camera, and the lens of the calibration camera faces one of the nozzles and takes a first shot of the components on the nozzle.

[0007] Preferably, the displacement module includes two X-direction linear modules and one Y-direction linear module. The two X-direction linear modules are horizontally arranged on the workbench through a support frame. A Y-direction linear module is movably arranged on the two X-direction linear modules. The displacement seat is slidably arranged on the Y-direction linear module.

[0008] Preferably, the rotating assembly includes a rotating motor, a driving wheel, a driven wheel, a transmission belt, and a housing. The rotating motor is installed on the mounting plate through a motor seat. The output shaft of the rotating motor extends into the upper inner cavity of the housing and is provided with the driving wheel. One end of the rotating shaft penetrates through the lower inner cavity of the housing, and the driven wheel is arranged on the rotating shaft. The driven wheel and the driving wheel are connected by a transmission belt.

[0009] Preferably, one end of the gas path joint is rotatably connected to the movable tube through a rotary joint. The driving assembly includes a driving cylinder and a connecting frame. The driving cylinder is arranged on the mounting plate and makes the movement direction of its piston rod consistent with the movement direction of the movable tube. One end of the piston rod of the driving cylinder is connected to one end of the connecting frame, and the other end of the connecting frame is fixedly connected to one end of the rotary joint close to the gas path joint.

[0010] Preferably, the inner cavity of the turntable seat is in the shape of a horizontally arranged cylinder. A plurality of said interfaces are circumferentially formed on the inner cavity side wall of the turntable seat, and the inner cavity side wall of the turntable seat is arranged in close contact with the outer wall of the movable pipe. A sealing plate piece with an arc-shaped structure horizontally extends from the lower side end surface of one end of the movable pipe, and the position of the sealing plate piece corresponds to the position of one of the interfaces at the lowermost end of the turntable seat.

[0011] Preferably, a groove is provided on the outer wall of the movable pipe and a sealing ring is installed, so that the movable pipe realizes axial sealing by fitting with the inner wall of the sleeve through the sealing ring.

[0012] Preferably, when one of the suction nozzles is in a vertical state and performs a suction operation, the position of the other suction nozzle is directly opposite to the lens of the calibration camera.

[0013] Preferably, the first feeding mechanism and the second feeding mechanism are located below the displacement module and are distributed left and right. Both the first feeding mechanism and the second feeding mechanism include conveying wheels, conveyor belts arranged on the conveying wheels, and conveying motors for driving the rotation of the conveying wheels.

[0014] The beneficial effects of the present invention are embodied in:

[0015] (1) When the suction nozzle device of the present invention rotates above the carrier plate, each suction nozzle sequentially sucks a plurality of components, and then moves to the laser housing to perform patchwork one by one, realizing continuous suction and continuous patchwork functions. There is no need to frequently return to the material taking origin, reducing the reciprocating idle stroke time of the suction nozzle between the carrier plate and the laser housing, and completing the picking and placing of multiple components in a single movement, effectively solving the problem of low efficiency in the traditional patchwork process.

[0016] (2) The present invention designs the coordinated positioning of the rotating suction nozzle and the calibration camera. By rotating the suction nozzle once, the calibration camera can take pictures of the components on one suction nozzle, thereby realizing calibration one by one. There is no need for the suction nozzle to move to the position of the calibration camera for calibration again, solving the problems of redundant movement paths of the suction nozzle and multiple round trips, and improving the patchwork efficiency. Brief Description of the Drawings

[0017] Figure 1 is a schematic structural diagram of the present invention.

[0018] Figure 2 is a side sectional view of the present invention.

[0019] Figure 3 is a schematic structural diagram of the suction nozzle device of the present invention.

[0020] Figure 4 is a partial sectional view of the suction nozzle device of the present invention.

[0021] Figure 5 is a schematic structural diagram between the sealing plate piece and the turntable seat of the present invention.

[0022] Description of reference numerals: workbench 1, first feeding mechanism 2, carrier plate 21, laser housing 22, conveying wheel 23, conveyor belt 24, conveying motor 25, second feeding mechanism 3, component 31;

[0023] Displacement module 4, X-direction linear module 41, Y-direction linear module 42, displacement seat 5, mounting plate 6, lifting cylinder 7, suction nozzle device 8, turntable seat 81, interface 811, rotating shaft 812, sleeve 813, movable tube 814, sealing plate 815, sealing ring 816, rotating seat 817, air path connector 82, rotary joint 821, suction nozzle 83, rotating motor 841, driving wheel 842, driven wheel 843, transmission belt 844, housing 845, driving cylinder 851, connecting frame 852, calibration device 9, mounting frame 91, calibration camera 92. Detailed implementation manners

[0024] To make the technical solutions of the present invention clearer and more definite, the present invention will be further described below with reference to the accompanying drawings. Any solutions obtained by equivalent substitution of the technical features of the technical solutions of the present invention and through conventional reasoning fall within the protection scope of the present invention. The fixed connections and fixed settings mentioned in the present invention are all common connection methods in the mechanical field, and welding, bolt and nut connection, and screw connection are all applicable.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0026] Please refer to the attached Figures 1-5 , this embodiment provides a semiconductor laser automatic chip mounting device, including a first feeding mechanism 2, a second feeding mechanism 3, and a chip mounting mechanism arranged on the workbench 1. The first feeding mechanism 2 and the second feeding mechanism 3 are arranged on the workbench 1 and respectively convey the laser housing 22 and the carrier plate 21 carrying the components. The first feeding mechanism 2 and the second feeding mechanism 3 are located below the chip mounting mechanism and are distributed left and right. Both the first feeding mechanism 2 and the second feeding mechanism 3 include a conveying wheel 23, a conveyor belt 24 arranged on the conveying wheel 23, and a conveying motor 25 for driving the conveying wheel 23 to rotate.

[0027] The chip placement mechanism is used to pick up components one by one and sequentially place them on the heat sink inside the laser housing 22. The chip placement mechanism includes a displacement module 4, a displacement seat 5, a mounting plate 6, a lifting cylinder 7, a nozzle device 8, and a calibration device 9. A displacement seat 5 is movably arranged on the displacement module 4. A mounting plate 6 is longitudinally slidably arranged on one side surface of the displacement seat 5 through a guide rail. The mounting plate 6 is driven to lift by the lifting cylinder 7 on the displacement seat 5. A nozzle device 8 is rotatably arranged on the mounting plate 6 through a rotating seat 817. The nozzle device 8 includes a turntable seat 81, a nozzle 83, a rotating assembly, and a driving assembly. Four interfaces 811 are evenly distributed along the circumferential direction on the end wall of the turntable seat 81, and a nozzle 83 is connected to each interface 811; a rotating shaft 812 is arranged on one side of the turntable seat 81, and the rotating shaft 812 is driven to rotate by the rotating assembly. As Figure 1 shown, the turntable seat 81 and the nozzle 83 are driven by the rotating assembly to rotate counterclockwise, so as to sequentially perform suction operations through each nozzle 83. A sleeve 813 communicating with its inner cavity is arranged on the other side of the turntable seat 81. The sleeve 813 is rotatably arranged on the rotating seat 817. A movable tube 814 is embedded in the sleeve 813. One end of the movable tube 814 is rotatably connected to a gas path joint 82. The gas path joint 82 is connected to an external suction source and provides adsorption force for the four nozzles 83. And the gas path joint 82 is driven by the driving assembly to drive the movable tube 814 to perform a horizontal displacement together. The other end of the movable tube 814 extends into the inner cavity of the turntable seat 81, and a sealing plate 815 is arranged at the other end of the movable tube 814, so that when the movable tube 814 is displaced, the lowermost interface 811 is opened or closed by the sealing plate 815; the calibration device 9 includes a mounting frame 91 and a calibration camera 92. One end of the mounting frame 91 is fixedly connected to the rotating support, and the mounting frame 91 extends radially along the movable tube 814. The other end of the mounting frame 91 is bent in an L shape and the calibration camera 92 is installed. The lens of the calibration camera 92 faces one of the nozzles 83 and takes a picture of the component on the nozzle 83. And when one of the nozzles 83 is in a vertical state and performs a suction operation, the position of another one of the nozzles 83 is just right in front of the lens of the calibration camera 92.

[0028] In this embodiment, the displacement module 4 includes two X-direction linear modules 41 and one Y-direction linear module 42. The two X-direction linear modules 41 are horizontally arranged on the workbench 1 through a support frame. A Y-direction linear module 42 is movably arranged on the two X-direction linear modules 41. A displacement seat 5 is slidably arranged on the Y-direction linear module 42.

[0029] In this embodiment, the rotating assembly includes a rotating motor 841, a driving wheel 842, a driven wheel 843, a transmission belt 844, and a housing 845. The rotating motor 841 is mounted on the mounting plate 6 through a motor base. The output shaft of the rotating motor 841 extends into the upper inner cavity of the housing 845 and is provided with the driving wheel 842. One end of a rotating shaft 812 penetrates through the lower inner cavity of the housing 845, and the driven wheel 843 is arranged on the rotating shaft 812. The driven wheel 843 and the driving wheel 842 are connected by the transmission belt 844 for transmission, so as to drive the turntable base 81 to rotate by the rotating motor 841.

[0030] In this embodiment, one end of an air path joint 82 is rotatably connected to a movable pipe 814 through a rotary joint 821, so that the turntable base 81 and the movable pipe 814 will not affect the air path joint 82 when rotating. The driving assembly includes a driving cylinder 851 and a connecting frame 852. The driving cylinder 851 is arranged on the mounting plate 6 and its piston rod moves in the same direction as the movement direction of the movable pipe 814. One end of the piston rod of the driving cylinder 851 is connected to one end of the connecting frame 852, and the other end of the connecting frame 852 is fixedly connected to one end of the rotary joint 821 close to the air path joint 82. When the driving cylinder 851 pushes the connecting frame 852 to displace, it can drive the air path joint 82, the rotary joint 821, and the movable rod to translate, so that the sealing plate 815 seals the interface 811.

[0031] In this embodiment, the inner cavity of the turntable base 81 is horizontally arranged in a cylindrical shape. Four interfaces 811 are circumferentially formed on the inner cavity side wall of the turntable base 81. The outer wall of the movable pipe 814 is attached to the inner cavity side wall of the turntable base 81. An arc-shaped sealing plate 815 horizontally extends on the lower side end surface of one end of the movable pipe 814, and the position of the sealing plate 815 corresponds to the position of one of the lowermost interfaces 811 of the turntable base 81. The bottom end of the sealing plate 815 is attached to the inner cavity of the turntable base 81, so as to seal the lowermost interface 811. When the turntable base 81 rotates, the sealing plate always adheres to the inner wall of the turntable base 81. When mounting components, when the lower interface 811 is sealed by the sealing plate 815, the adsorption force on the components can be cut off, so that the components can fall on the heat sink at the designated position.

[0032] In this embodiment, a groove is provided on the outer wall of the movable pipe 814 and a sealing ring 816 is installed, so that the movable pipe 814 realizes axial sealing by the sealing ring 816 fitting with the inner wall of the sleeve 813.

[0033] Working method of the patch device of the present invention: During operation, first perform the suction step. The displacement module 4 drives the nozzle device 8 to move to the designated position, and aligns one of the nozzles 83 with one of the chip components. Subsequently, the lifting cylinder 7 drives the mounting plate 6 to descend, and the nozzle 83 sucks the chip component. After the suction is completed, it rises. Then, the displacement module 4 drives the nozzle device 8 to move above another chip component. At this time, the rotating assembly drives the turntable seat 81 to rotate, causing another nozzle 83 to move to the suction position and then descend to suck the chip component. After the suction is completed, it rises until all the nozzles 83 have sucked the chips; during the rotation of the turntable seat 81, each nozzle 83 moves to the calibration station, and a calibration camera 92 takes a photo record of the chip component on the nozzle 83, and sends the image to the computer for image processing to determine whether there is a deviation in its position and the deviation value when sucking the component. Subsequently, during patching, it is corrected by controlling the displacement module 4.

[0034] Then perform the placement step. The displacement module 4 drives the nozzle device 8 to move to the designated position and then descend for placement. Subsequently, it rises, rotates, and then descends for patching, successively patching each chip component to the designated position. Finally, repeat the above steps until all the components are patched, and finally complete the patching operation.

[0035] As described above, it is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A semiconductor laser automatic chip placement device, comprising a first material feeding mechanism (2), a second material feeding mechanism (3), and a chip placement mechanism arranged on a workbench (1), wherein the first material feeding mechanism (2) and the second material feeding mechanism (3) are arranged on the workbench (1) and respectively transport a carrier plate (21) carrying a laser housing (22) and a component; the chip placement mechanism is used to take out the components (31) one by one and place them on a heat sink in the laser housing (22) in sequence; characterized in that: The patch mechanism comprises a displacement module (4), a displacement seat (5), a mounting plate (6), a lifting cylinder (7), a suction nozzle device (8) and a calibration device (9); the displacement seat (5) is movably arranged on the displacement module (4); a mounting plate (6) is longitudinally slidably arranged on one side surface of the displacement seat (5) via a guide rail; the mounting plate (6) is driven to rise and fall by the lifting cylinder (7) on the displacement seat (5); the suction nozzle device (8) is rotatably arranged on the mounting plate (6) via a rotating seat (817) The suction nozzle device (8) comprises a turntable seat (81), a suction nozzle (83), a rotating assembly and a driving assembly. A plurality of interfaces (811) are evenly distributed along the circumferential direction on the end wall of the turntable seat (81), and each interface (811) is connected to a suction nozzle (83). A rotating shaft (812) is provided on one side of the turntable seat (81), and the rotating shaft (812) is driven to rotate by the rotating assembly. A sleeve (813) is provided on the other side of the turntable seat (81) and is connected to its inner cavity. The sleeve (813) is rotated to rotate. The movable tube (814) is placed on a rotating seat (817), and a sleeve (813) is embedded with a movable tube (814). One end of the movable tube (814) is rotatably connected to a gas path connector (82). The gas path connector (82) is driven by a driving assembly and drives the movable tube (814) to move horizontally. The other end of the movable tube (814) extends into the inner cavity of the turntable seat (81), and a sealing plate (815) is provided at the other end of the movable tube (814), so that when the movable tube (814) moves, the sealing plate (815) ) opens or closes a lowermost interface (811); the calibration device (9) comprises a mounting frame (91) and a calibration camera (92), one end of the mounting frame (91) is fixedly connected to a rotating support, and the mounting frame (91) extends radially along the movable tube (814), the other end of the mounting frame (91) is bent in an L-shape and the calibration camera (92) is mounted thereon, and the lens of the calibration camera (92) is facing one of the suction nozzles (83) and takes a picture of a component on the suction nozzle (83).

2. A semiconductor laser automatic chip placement device as claimed in claim 1, characterized in that: The displacement module (4) comprises two X-direction linear modules (41) and one Y-direction linear module (42); the two X-direction linear modules (41) are transversely arranged on the workbench (1) via a support frame; a Y-direction linear module (42) is movably arranged on the two X-direction linear modules (41); and the displacement seat (5) is slidably arranged on the Y-direction linear module (42).

3. A semiconductor laser automatic chip placement device as claimed in claim 1, characterized in that: The rotating assembly comprises a rotating motor (841), a driving wheel (842), a driven wheel (843), a transmission belt (844) and a cover (845); the rotating motor (841) is mounted on a mounting plate (6) via a motor seat; the output shaft of the rotating motor (841) extends into an inner cavity at an upper end of the cover (845) and is provided with the driving wheel (842); the inner cavity at a lower end of the cover (845) is penetrated by one end of a rotating shaft (812), and the driven wheel (843) is provided on the rotating shaft (812); the driven wheel (843) and the driving wheel (842) are connected to each other via a transmission belt (844).

4. A semiconductor laser automatic chip placement device as claimed in claim 1, characterized in that: One end of the gas circuit joint (82) is rotatably connected to the movable tube (814) via a rotary joint (821); the driving assembly comprises a driving cylinder (851) and a connecting frame (852); the driving cylinder (851) is arranged on the mounting plate (6) and the movement direction of its piston rod is consistent with the movement direction of the movable tube (814); one end of the piston rod of the driving cylinder (851) is connected to one end of the connecting frame (852); the other end of the connecting frame (852) is connected and fixed to one end of the rotary joint (821) close to the gas circuit joint (82).

5. A semiconductor laser automatic chip placement device as claimed in claim 1, characterized in that: The inner cavity of the turntable seat (81) is in the shape of a horizontally arranged cylinder, and a plurality of interfaces (811) are provided on the side wall of the inner cavity of the turntable seat (81) in a circumferential direction, and the side wall of the inner cavity of the turntable seat (81) is arranged in close contact with the outer wall of the movable tube (814), and a sealing plate (815) extending horizontally and forming an arc-shaped structure is provided on the lower end surface of one end of the movable tube (814), and the position of the sealing plate (815) corresponds to the position of one of the interfaces (811) at the lowest end of the turntable seat (81).

6. A semiconductor laser automatic chip placement device as claimed in claim 5, characterized in that: The outer wall of the movable tube (814) is provided with a circle of grooves and is provided with a sealing ring (816), so that the movable tube (814) is fitted with the inner wall of the sleeve (813) through the sealing ring (816) to achieve axial sealing.

7. A semiconductor laser automatic chip mounting device as claimed in claim 1, characterized in that: When one of the suction nozzles (83) is in a vertical position and performing a suction operation, the position of the other suction nozzle (83) is directly facing the lens of the calibration camera (92).

8. A semiconductor laser automatic chip mounting device as claimed in claim 1, characterized in that: The first feeding mechanism (2) and the second feeding mechanism (3) are located below the displacement module (4) and are distributed on the left and right sides. The first feeding mechanism (2) and the second feeding mechanism (3) both comprise a conveying wheel (23), a conveying belt (24) arranged on the conveying wheel (23), and a conveying motor (25) for driving the conveying wheel (23) to rotate.

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