Heating lamp mounting structure, heating lamp assembly and semiconductor processing equipment

Abstract

The invention discloses a heating lamp mounting structure, a heating lamp assembly and semiconductor processing equipment, and the heating lamp mounting structure comprises a mounting bottom plate which is grounded; the lamp holder is used for mounting a heating lamp; the heating lamp is electrically connected with a power supply through the lamp holder; the lamp holder is fixedly mounted on the mounting bottom plate through the insulating block; the insulating block enables the lamp holder and the mounting bottom plate to be spaced by a first distance, so that arc discharge between the lamp holder and the mounting bottom plate is avoided. The insulating block is arranged between the lamp holder and the mounting bottom plate, so that conduction of high potential at the joint of the heating lamp and the lamp holder to low potential of the mounting bottom plate can be blocked, and arc discharge between the lamp holder and the mounting bottom plate is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a heating lamp mounting structure, a heating lamp assembly, and a semiconductor processing device. Background Art

[0002] In the semiconductor epitaxy process, a wafer in a reaction chamber is heated by a heating lamp disposed in a low-pressure chamber; wherein, both the upper and lower parts of the reaction chamber are made of transparent quartz or the whole is made of transparent quartz; the low-pressure chamber is installed above the reaction chamber to form a double-chamber structure.

[0003] Currently, the lamp holder of the heating lamp is directly mounted on the mounting bottom plate of the low-pressure chamber. The connection between the lamp holder and the mounting bottom plate is metal and the mounting bottom plate is grounded, so that the mounting surface of the lamp holder is in close contact with the grounding surface. However, different from the atmospheric pressure environment, the gas in the low-pressure chamber is relatively thin; the high-voltage terminal (i.e., the plug) of the heating lamp installed in the low-pressure chamber is bare metal, and the potential of the high-voltage terminal of the heating lamp is relatively high when it works under high-voltage power supply; since the potential of the low-pressure chamber is relatively low, the high potential of the heating lamp will break down the thin gas to the mounting surface of the lamp holder and the mounting bottom plate, resulting in discharge and sparking, generating an arc, and causing the machine to stop or parts to be damaged. Therefore, it is necessary to adjust the mounting structure of the heating lamp. Summary of the Invention

[0004] The purpose of the present invention is to provide a heating lamp mounting structure, a heating lamp assembly, and a semiconductor processing device. By providing an insulating block between the lamp holder and the mounting bottom plate, the conduction of the high potential at the connection of the heating lamp and the lamp holder to the low potential of the mounting bottom plate can be blocked, thereby avoiding arc discharge between the lamp holder and the mounting bottom plate.

[0005] To achieve the above purpose, the present invention is realized through the following technical solutions:

[0006] A heating lamp mounting structure, comprising:

[0007] A mounting bottom plate, the mounting bottom plate being grounded;

[0008] A lamp holder for mounting a heating lamp; the heating lamp is electrically connected to a power source through the lamp holder;

[0009] The heating lamp mounting structure further comprises:

[0010] An insulating block, the lamp holder is fixedly mounted on the mounting bottom plate through the insulating block; the insulating block spaces the lamp holder and the mounting bottom plate by a first distance to avoid arc discharge between the lamp holder and the mounting bottom plate.

[0011] Optionally, the mounting bottom plate is fixed in the low-pressure chamber.

[0012] Optionally, the insulating block is fixedly connected to the mounting base plate by fasteners.

[0013] Optionally, the length of the fastener is less than the thickness of the insulating block, so as to form a gap between the upper surface of the fastener and the lower surface of the lamp socket; and the depth of the gap has a second distance to avoid arc discharge between the fastener and the lamp socket.

[0014] Optionally, the second distance is not less than 5 mm.

[0015] Optionally, the gap is filled with an insulating plug.

[0016] Optionally, the insulating block and the insulating plug are made of a thermally conductive insulating material.

[0017] Optionally, the fastener is made of a thermally conductive insulating material.

[0018] Optionally, the lamp socket is electrically connected to the power supply through a terminal, and an insulating layer is provided on the surface of the terminal.

[0019] Optionally, the insulating layer is made of a thermally conductive insulating material.

[0020] On the other hand, the present invention also provides a heating lamp assembly, including the heating lamp mounting structure as described above; and a heating lamp, the heating lamp includes a lamp body and a plug connected to the lamp body; the plug is pluggably and electrically connected to the lamp socket.

[0021] On the other hand, the present invention also provides a semiconductor processing device, including:

[0022] A reaction chamber;

[0023] A low-pressure chamber, located above and / or below the reaction chamber; and

[0024] The heating lamp assembly as described above, the heating lamp assembly is disposed in the low-pressure chamber for radiatively heating a wafer in the reaction chamber.

[0025] Optionally, the number of the heating lamp assemblies is multiple, and the multiple heating lamp assemblies are arranged at intervals along the circumferential direction of the wafer.

[0026] The present invention has at least one of the following advantages compared with the prior art:

[0027] A heating lamp mounting structure, a heating lamp assembly and a semiconductor processing device provided by the present invention. The heating lamp is electrically connected to a power source through a lamp holder, and the lamp holder is fixedly mounted on a mounting base plate through an insulating block. The insulating block can keep a first distance between the lamp holder and the mounting base plate, thereby blocking the conduction of the high electric potential at the connection between the heating lamp and the lamp holder to the low electric potential of the mounting base plate, that is, realizing the isolation of high and low electric potentials, and further avoiding the generation of arc discharge between the lamp holder and the mounting base plate.

[0028] In the present invention, the insulating block can be prepared from a thermally conductive insulating material, so that the insulating block has high electrical insulation while having good thermal conductivity and a temperature resistance greater than 80 degrees. This can not only avoid the generation of arc discharge between the lamp holder and the mounting base plate, but also facilitate the heat dissipation of the lamp holder and ensure the reliability of the insulating block in a high-temperature environment.

[0029] In the present invention, the insulating block is fixedly connected to the mounting base plate through a fastener, and a gap is formed between the upper surface of the fastener and the lower surface of the lamp holder. The setting of the gap can keep a second distance between the lamp holder and the fastener in the vertical direction, thereby avoiding the conduction of the electric potential at the connection between the heating lamp and the lamp holder to the fastener, and further avoiding the generation of arc discharge between the fastener and the lamp holder.

[0030] In the present invention, an insulating plug can also be filled in the gap to further avoid the generation of arc discharge between the fastener and the lamp holder. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic structural diagram of a heating lamp mounting structure provided by an embodiment of the present invention;

[0032] Figure 2 is a schematic structural diagram of a semiconductor processing device provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following further describes in detail a heating lamp mounting structure, a heating lamp assembly and a semiconductor processing device provided by the present invention in conjunction with the drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and all use non-precise scales, only for the purpose of facilitating and clearly assisting in explaining the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and understandable, please refer to the drawings. It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limiting conditions of the implementation of the present invention. Therefore, they do not have a technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purpose that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0034] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0035] Combined with the attached Figure 1 As shown in the figure, this embodiment provides a heating lamp installation structure, including: a mounting base plate 101, and the mounting base plate 101 is grounded; a lamp holder 120 for mounting a heating lamp 130; the heating lamp 130 is electrically connected to a power supply (not shown in the figure) through the lamp holder 120; the heating lamp installation structure further includes: an insulating block 110, and the lamp holder 120 is fixedly installed on the mounting base plate 101 through the insulating block 110; the insulating block 110 spaces the lamp holder 120 and the mounting base plate 101 by a first distance to prevent arc discharge between the lamp holder 120 and the mounting base plate 101.

[0036] Specifically, when the heating lamp 130 is powered on and working, the electric potential at the connection between the heating lamp 130 and the lamp holder 120 is relatively high; in the prior art, that is, when the insulating block is not provided, the lamp holder 120 is directly mounted on the mounting base plate 101. At this time, the high electric potential at the connection between the heating lamp 130 and the lamp holder 120 will conduct to the low electric potential of the mounting base plate, resulting in arc discharge between the lamp holder 120 and the mounting base plate 101. In this embodiment, the insulating block 110 is provided between the lamp holder 120 and the mounting base plate 101, and the thickness of the insulating block 110 can have a first distance, so that the insulating block 110 can space the lamp holder 120 and the mounting base plate 101 by the first distance in the vertical direction, thereby blocking the conduction of the high electric potential at the connection between the heating lamp 130 and the lamp holder 120 to the low electric potential of the mounting base plate, that is, realizing the isolation of high and low electric potentials, and further preventing arc discharge between the lamp holder 120 and the mounting base plate 101.

[0037] Further, in this embodiment, the value of the first distance can be determined according to the working environment and working voltage of the heating lamp 130; for example, the mounting base plate 101 is fixed in the low-pressure chamber 100, and the working environment of the heating lamp 130 is a low-pressure environment. In this case, the gas is relatively thin and is easily broken down to generate arc discharge, so the value of the first distance should be larger; or, the working voltage of the heating lamp 130 is relatively high, so that the electric potential at the connection between the heating lamp 130 and the lamp holder 120 will be higher. In this case, arc discharge is also likely to occur, and the value of the first distance should also be larger; optionally, the first distance is greater than 15 mm; preferably, the first distance is greater than 20 mm.

[0038] Specifically, in one embodiment, the insulating block 110 can be prepared from a thermally conductive insulating material, so that the insulating block 110 has high electrical insulation, good thermal conductivity and a temperature resistance greater than 80 degrees. This can not only prevent arc discharge between the lamp holder 120 and the mounting base plate 101, but also facilitate the heat dissipation of the lamp holder 120 and ensure the reliability of the insulating block 110 in a high-temperature environment. Optionally, the thermally conductive insulating material includes one or any combination of polytetrafluoroethylene (i.e., Teflon), polyvinyl chloride (PVC), polyether ether ketone (PEEK), polyimide (SP1), ceramics, quartz and nylon.

[0039] Specifically, in one embodiment, the heating lamp 130 can include a lamp body 1301 and a plug 1302 connected to the lamp body 1301; the plug 1302 is bare metal, and the plug 1302 is pluggably electrically connected to the lamp holder 120; at this time, the plug 1302 is the connection between the heating lamp 130 and the lamp holder 120.

[0040] Please continue to refer to Figure 1 , the insulating block 110 is fixedly connected to the mounting base plate 101 through a fastener 111 to realize the fixed installation of the insulating block 110 and the mounting base plate 101.

[0041] Specifically, in one embodiment, the fastener 111 can be prepared from a thermally conductive insulating material, so that the fastener 111 has high electrical insulation, good thermal conductivity and a temperature resistance greater than 80 degrees, thereby preventing the electric potential at the connection between the heating lamp 130 and the lamp holder 120 from being conducted to the fastener 111, and further preventing arc discharge between the fastener 111 and the lamp holder 120. At the same time, it is also beneficial to the heat dissipation of the lamp holder 120 and ensure the reliability of the fastener 111 in a high-temperature environment.

[0042] Specifically, in one embodiment, the length of the fastener 111 is less than the thickness of the insulating block 110, so as to form a gap 112 between the upper surface of the fastener 111 (i.e., the end face of the fastener close to the lamp socket) and the lower surface of the lamp socket 120 (i.e., the end face of the lamp socket close to the mounting base plate), and the depth of the gap 112 has a second distance. More specifically, the setting of the gap 112 can space the lamp socket 120 and the fastener 111 by the second distance in the vertical direction, thereby preventing the electric potential at the connection between the heating lamp 130 and the lamp socket 120 from being conducted to the fastener 111, and further avoiding the arc discharge between the fastener 111 and the lamp socket 120; similar to the value of the first distance, the value of the second distance can also be determined according to the working environment and working voltage of the heating lamp 130. In addition, if the gap 112 is provided, there is no limitation on the preparation material of the fastener 111, which can be prepared either from a thermally conductive insulating material or from a metal material. Optionally, the second distance is not less than 5 mm; preferably, the second distance is 10 mm.

[0043] Specifically, in one embodiment, the gap 112 is filled with an insulating plug 113 to further avoid the arc discharge between the fastener 111 and the lamp socket 120. Optionally, the insulating plug 113 is prepared from a thermally conductive insulating material, so that the insulating plug 113 has high electrical insulation, good thermal conductivity and a temperature resistance greater than 80 degrees, which can not only avoid the arc discharge between the fastener 111 and the lamp socket 120, but also facilitate the heat dissipation of the lamp socket 120 and ensure the reliability of the insulating plug 113 in a high-temperature environment.

[0044] Please continue to refer to Figure 1 , the lamp socket 120 is electrically connected to the power supply through a terminal 121, and an insulating layer 122 is provided on the surface of the terminal 121 to avoid the arc discharge between the lamp socket 120 and the mounting base plate 101 or between the lamp socket 120 and the chamber wall of its chamber.

[0045] Specifically, in one embodiment, the insulating layer 122 is prepared from a thermally conductive insulating material, so that the insulating layer 122 has high electrical insulation, good thermal conductivity and a temperature resistance greater than 80 degrees, which can not only avoid the arc discharge between the lamp socket 120 and the mounting base plate 101 or between the lamp socket 120 and the chamber wall of its chamber, but also facilitate the heat dissipation of the terminal 121 and ensure the reliability of the insulating layer 122 in a high-temperature environment.

[0046] On the other hand, in combination with the attached Figure 1 and 2As shown in the figure, the present embodiment further provides a heating lamp assembly 210, including the heating lamp mounting structure as described above; and a heating lamp 130, where the heating lamp 130 includes a lamp body 1301 and a plug 1302 connected to the lamp body 1301; the plug 1302 is pluggably and electrically connected to the lamp socket 120.

[0047] On the other hand, in combination with the attached Figure 2 As shown in the figure, the present embodiment further provides a semiconductor processing device, including: a reaction chamber 220; a low-pressure chamber 100 located above and / or below the reaction chamber 220; and the heating lamp assembly 210 as described above, where the heating lamp assembly 210 is disposed in the low-pressure chamber 100 for radiatively heating the wafer in the reaction chamber 220.

[0048] Specifically, in one embodiment, the reaction chamber 220 includes an upper cover 2201 and a lower cover 2202 hermetically connected to the upper cover 2201, and both the upper cover 2201 and the lower cover 2202 can be made of transparent quartz. The low-pressure chamber 100 can be disposed above the upper cover 2201, and the number of the heating lamp assemblies 210 in the low-pressure chamber 100 is multiple, and the multiple heating lamp assemblies 210 can be arranged at intervals along the circumferential direction of the wafer 200 to uniformly heat the wafer 200; optionally, the mounting bottom plate 101 can be fixed to the side wall of the low-pressure chamber 100. In some embodiments, the heating lamp assembly 210 may not be disposed in the low-pressure chamber 100.

[0049] In summary, the present embodiment provides a heating lamp mounting structure, a heating lamp assembly, and a semiconductor processing device. The heating lamp is electrically connected to a power source through a lamp socket, and the lamp socket is fixedly mounted on a mounting bottom plate through an insulating block; wherein the insulating block can keep a first distance between the lamp socket and the mounting bottom plate, thereby blocking the conduction of the high electric potential at the connection between the heating lamp and the lamp socket to the low electric potential of the mounting bottom plate, that is, realizing the isolation of high and low electric potentials, and further avoiding arc discharge between the lamp socket and the mounting bottom plate. In the present embodiment, the insulating block can be made of a thermally conductive insulating material, so that the insulating block has high electrical insulation while having good thermal conductivity and a temperature resistance greater than 80 degrees, which can not only avoid arc discharge between the lamp socket and the mounting bottom plate, but also facilitate the heat dissipation of the lamp socket and ensure the reliability of the insulating block in a high-temperature environment. The insulating block is fixedly connected to the mounting bottom plate through a fastener, and a gap is formed between the upper surface of the fastener and the lower surface of the lamp socket. The setting of the gap can keep a second distance between the lamp socket and the fastener in the vertical direction, thereby avoiding the conduction of the electric potential at the connection between the heating lamp and the lamp socket to the fastener, and further avoiding arc discharge between the fastener and the lamp socket. In addition, an insulating plug can be filled in the gap to further avoid arc discharge between the fastener and the lamp socket.

[0050] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A heating lamp mounting structure, comprising: a mounting base plate, the mounting base plate being grounded; a lamp holder for mounting a heating lamp; the heating lamp is electrically connected to a power supply through the lamp holder; wherein the heating lamp mounting structure further comprises: an insulating block, the lamp holder is fixedly mounted on the mounting base plate through the insulating block; the insulating block spaces a first distance between the lamp holder and the mounting base plate to prevent arc discharge between the lamp holder and the mounting base plate.

2. The heating lamp mounting structure according to claim 1, wherein, the mounting base plate is fixed in a low-pressure chamber.

3. The heating lamp mounting structure according to claim 1, wherein, the insulating block is fixedly connected to the mounting base plate through a fastener.

4. The heating lamp mounting structure according to claim 3, wherein, the length of the fastener is less than the thickness of the insulating block, so that a gap is formed between the upper surface of the fastener and the lower surface of the lamp holder; and the depth of the gap has a second distance to prevent arc discharge between the fastener and the lamp holder.

5. The heating lamp mounting structure according to claim 4, wherein, the second distance is not less than 5 mm.

6. The heating lamp mounting structure according to claim 4, wherein, the gap is filled with an insulating plug.

7. The heating lamp mounting structure according to claim 6, wherein, the insulating block and the insulating plug are made of a thermally conductive insulating material.

8. The heating lamp mounting structure according to claim 3, wherein, the fastener is made of a thermally conductive insulating material.

9. The heating lamp mounting structure according to claim 1, wherein, the lamp holder is electrically connected to the power supply through a terminal, and an insulating layer is provided on the surface of the terminal.

10. The heating lamp mounting structure according to claim 9, wherein, the insulating layer is made of a thermally conductive insulating material.

11. A heating lamp assembly, wherein, comprises the heating lamp mounting structure according to any one of claims 1 to 10; and a heating lamp, the heating lamp comprising a lamp body and a plug connected to the lamp body; the plug is pluggably and electrically connected to the lamp holder.

12. A semiconductor processing apparatus, wherein, comprises: a reaction chamber; a low-pressure chamber located above and / or below the reaction chamber; and the heating lamp assembly according to claim 11, the heating lamp assembly is disposed in the low-pressure chamber for radiatively heating a wafer in the reaction chamber.

13. The semiconductor processing apparatus according to claim 12, wherein, the number of the heating lamp assemblies is plural, and the plural heating lamp assemblies are spaced apart along the circumferential direction of the wafer.

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