Microfine circuit imprinting method for flexible circuit board

Abstract

The present application belongs to the technical field of circuit board printing manufacturing, and proposes a micro-fine circuit imprinting method for flexible circuit board, which comprises the following steps: pretreating the flexible circuit board substrate and placing it in the imprinting device; obtaining the pressure and temperature received by the flexible circuit board substrate through the sensor during the imprinting process, and generating a temperature distribution map and a pressure distribution map; obtaining a constant pressure balance value according to the temperature distribution map and the pressure distribution map; and judging whether to force cooling or natural cooling for the imprinted flexible circuit board substrate according to the constant pressure balance value. According to the circuit imprinting method of the present application, the temperature pressure imbalance caused by local temperature difference and uneven thermal expansion can be avoided, thereby ensuring the quality and stability of the flexible circuit board.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit board manufacturing, and in particular relates to a fine circuit printing method for a flexible circuit board. Background Art

[0002] During the flexible circuit board (FPCB) manufacturing process, temperature and pressure fluctuations have a significant impact on the substrate's performance. Due to thermal expansion and contraction, different areas of the substrate may experience varying degrees of thermal deformation. In particular, uneven temperature distribution can cause localized differential thermal expansion, leading to stresses on the substrate surface or within it. These stresses not only degrade the substrate's mechanical properties but can also cause cracks, compromising its long-term stability.

[0003] When heat and pressure cause the substrate to expand or contract, particularly in sensitive areas, crack formation and growth can be severe, especially if these cracks grow over time and through repeated stamping. This crack growth can ultimately affect circuit integrity and even cause serious failures such as short circuits, rendering the entire board useless. Therefore, temperature control and uniform pressure distribution are crucial during the manufacturing process.

[0004] Furthermore, changes in temperature and pressure can affect other key aspects of the integrated circuit (IC) manufacturing process, particularly processes like photolithography and etching, where precise temperature and pressure management are crucial to ensuring the proper functioning of the equipment. For example, in the production of semiconductor device equipment such as specialized photolithography and etching machines, the thermal treatment phase of the manufacturing process must be precisely controlled to avoid uneven thermal expansion of the equipment's internal materials, which in turn affects the accuracy and lifespan of the overall equipment. Summary of the Invention

[0005] The present invention aims to at least partially address one of the technical problems in the related art. To this end, the present invention is directed to a method for imprinting fine circuits on flexible circuit boards that can avoid temperature and pressure imbalances caused by local temperature differences and uneven thermal expansion, thereby ensuring the quality and stability of the flexible circuit boards.

[0006] To achieve the above objectives, an embodiment of the present invention provides a method for imprinting fine circuits on a flexible circuit board, the method comprising the following steps:

[0007] S100, pre-processing the flexible circuit board substrate and placing it in an imprinting device;

[0008] S200, obtaining pressure and temperature of the flexible circuit board substrate through sensors during the printing process, and generating a temperature distribution map and a pressure distribution map;

[0009] S300, obtaining a constant-state pressure balance value according to the temperature distribution map and the pressure distribution map;

[0010] S400 , determining whether to perform forced cooling or natural cooling on the printed flexible circuit board substrate according to the constant pressure balance value.

[0011] The circuit stamping method according to the embodiment of the present invention can avoid temperature and pressure imbalance caused by local temperature differences and uneven thermal expansion, thereby ensuring the quality and stability of the flexible circuit board.

[0012] Pre-processing the flexible circuit board substrate and placing it in the imprinting device in step S100 includes:

[0013] Specifically, pretreatment involves cleaning the substrate surface to remove impurities, oil, or dust to ensure accurate and reliable circuitry during the transfer process. Suitable flexible circuit board substrates have appropriate thickness, flexibility, and surface finish to minimize deformation, cracking, or uneven transfer in high-temperature, high-pressure environments.

[0014] Furthermore, after confirming that the substrate meets the requirements for fine circuit transfer, it is placed in an imprinting device.

[0015] During the heating process, the flexible circuit board substrate will undergo thermal expansion or contraction. In particular, when the local stamping temperature is too high, the local temperature difference of the flexible circuit board substrate will lead to uneven thermal expansion in different areas, resulting in internal temperature and pressure imbalance, which increases the fragility of the flexible circuit board substrate. After stamping, the flexible circuit board substrate is unevenly heated, causing pressure-temperature crack propagation, which may lead to the scrapping of the flexible circuit board substrate. Pressure-temperature crack propagation refers to the phenomenon that cracks appear in the flexible material due to the combined effects of temperature changes and pressure during hot stamping or stamping, and the cracks further propagate over time and pressure. To address the above problems, the present invention proposes step S200.

[0016] In step S200, obtaining the pressure and temperature of the flexible film pressure sensor through the sensor during the printing process and generating a temperature distribution map and a pressure distribution map include:

[0017] The sensor includes a temperature sensor and a flexible film pressure sensor. The temperature sensor is used to obtain the temperature of the flexible circuit board substrate, and the flexible film pressure sensor is used to obtain the pressure exerted on the flexible film pressure sensor.

[0018] Obtain the temperature distribution map and pressure distribution map of the flexible circuit board substrate at every time interval L to obtain H temperature distribution maps and H pressure distribution maps, where the time interval L is set to [1, 10] seconds; TTW(Li) is denoted as the average temperature magnitude of the temperature distribution map of the flexible circuit board substrate at time Li, and TTY(Li) is denoted as the average pressure magnitude of the pressure distribution map at time Li, where Li = [(i-1)*L, i*L], i = 1, 2, ..., H, H∈[5, 100], and i is the time interval sequence number; where i = 1, Li represents the Lth second, ..., i = H represents the L×Hth second, the median of all TTW(Li) is denoted as TSM, and the median of all TTY(Li) is denoted as YSM;

[0019] Furthermore, in step S300, obtaining a steady-state pressure balance value according to the temperature distribution map and the pressure distribution map includes the following steps:

[0020] S301, obtaining a constant temperature through a temperature distribution map and a pressure distribution map;

[0021] Perform the same grid division on all temperature distribution maps and pressure distribution maps using a grid division algorithm. The grid size is 1 / 1000 of the temperature distribution map and the pressure distribution map. The temperature distribution map and the pressure distribution map are divided into K grids, where K = 1000. s(Li, j) represents the temperature value of the j-th grid of the temperature distribution map at time Li, and v(Li, j) represents the pressure value of the j-th grid of the pressure distribution map at time Li. The value of j is [1, K], and K is the number of grids after the temperature distribution map and the pressure distribution map are divided. Obtain the median of the temperature values ​​in each grid in the temperature distribution map at time Li and record it as ZD(i). The mean of ZD(i) is the steady-state temperature ZDZ.

[0022] The steady-state temperature is a stable, balanced temperature value obtained by dividing the temperature distribution map into a grid and taking the median temperature of each temperature distribution map. During the imprinting process, excessively high or low temperatures can cause thermal expansion or contraction of the material, generating thermal stress. If the steady-state temperature is relatively high, it can lead to local deformation of the substrate material and accumulation of thermal stress, which can induce the formation or expansion of pressure-temperature cracks. The steady-state temperature, combined with the pressure on the flexible circuit board substrate, can be used to assess the crack propagation of the flexible circuit board substrate after imprinting.

[0023] S302, screening out a pressure condensation grid and a temperature condensation grid;

[0024] For each grid of the temperature distribution graph and the pressure distribution graph, calculate the sum of all the average pressure values ​​in the time period L1 to LH to obtain the total pressure value, and use SFD(j) to represent the total pressure value of the j-th grid. Among all the grids, find the grid with the largest total pressure value, record it as the pressure condensation grid, and obtain the average pressure value TFDK of the pressure condensation grid in each pressure distribution graph; for each grid, calculate the sum of all the average temperature values ​​in the time period L1 to LH to obtain the total temperature value, and use VFD(j) to represent the total temperature value of the j-th grid. Among all the grids, find the grid with the largest total temperature value, record it as the temperature condensation grid, and record the average temperature value VFDK of the temperature condensation grid in each temperature distribution graph;

[0025] S303, calculating a steady-state pressure balance value using the pressure condensation grid and the temperature condensation grid;

[0026] Calculate the steady-state pressure balance value MUIY, where the value of the steady-state pressure balance value MUIY is the average value TFDK of the pressure values ​​of the pressure condensation grid in each pressure distribution diagram plus the embossed crack traction pressure value PTK, where the embossed crack traction pressure value PTK is the median YSM of each average pressure in all TTY(Li) multiplied by the temperature traction coefficient U, where the temperature traction coefficient is |1-ZDZ / 2(VFDK+TSM)|.

[0027] The steady-state pressure balance value is a physical quantity used to evaluate the interaction between temperature and pressure during the FPC stamping process. The steady-state pressure balance value reflects the impact of temperature changes on the pressure distribution by combining the average pressure value of the pressure condensation grid and the temperature traction coefficient. By fitting the relationship between pressure and temperature, it can be used to determine whether crack propagation or other adverse effects may occur during the stamping process. Furthermore, the temperature traction coefficient is a coefficient used to quantify the traction effect of temperature changes on material pressure, reflecting the impact of local temperature changes on stress and pressure distribution.

[0028] The beneficial effects of this step are as follows: By comprehensively considering the interaction between temperature and pressure to calculate the steady-state pressure balance value MUIY, the problems of uneven thermal expansion and stress concentration caused by local temperature differences during the imprinting process can be effectively solved. In traditional imprinting processes, only the control of pressure or temperature is often focused on, ignoring the coupling effect between the two. However, MUIY not only accurately evaluates the influence of temperature changes in the local area on the pressure distribution by introducing the temperature traction coefficient and the average pressure value of the pressure condensation grid, but also predicts the risk of crack propagation that the temperature difference may cause to the material. When the combination of temperature and pressure is inappropriate, it can be judged through MUIY whether forced cooling needs to be triggered to avoid crack generation. By accurately analyzing the temperature and pressure balance state, this method ensures the uniformity and stability of the flexible printed circuit board substrate under high-temperature and high-pressure environments, fundamentally reducing the propagation of temperature-pressure cracks in the material and improving the reliability and durability of the finished product.

[0029] S400. Judge whether to perform forced cooling or natural cooling on the imprinted flexible printed circuit board substrate according to the steady-state pressure balance value;

[0030] Compare the magnitudes of MUIY and YSM. If MUIY ≥ YSM, it indicates that under the current temperature and pressure combination, there are conflicts between temperature and pressure or the local temperature and pressure are too high, and there is a risk of crack propagation. It is necessary to perform forced cooling on the imprinted flexible printed circuit board to avoid more serious propagation of temperature-pressure cracks. The methods of forced cooling include: using a fan or a cooling air system to blow hot air onto the surfaces of the substrate and the mold to accelerate cooling, absorbing the heat of the substrate and the mold through circulating coolant for accelerated cooling, or directly placing the mold or the substrate on a cooling bed to perform rapid cooling through contact conduction.

[0031] If MUIY < YSM, the imprinted flexible printed circuit board is naturally cooled;

[0032] Specifically, when MUIY < YSM, it means that the current temperature and pressure distribution have been in a relatively balanced state, and there is no obvious conflict between temperature and pressure. If forced cooling is performed in this case, the temperature of the flexible printed circuit board will suddenly drop, resulting in excessive temperature differences inside the material, interfering with the uniform expansion or contraction process of the material, and this rapid temperature change will instead break the stable state of temperature and pressure, leading to crack generation and even affecting the performance and stability of the circuit. Therefore, when MUIY < YSM, natural cooling can ensure that the flexible printed circuit board can be naturally cooled under appropriate temperature and pressure conditions, reducing unnecessary mechanical stress and thermal stress.

[0033] The beneficial effects of this invention are as follows: by optimizing the temperature field distribution and the coordinated pressure control mechanism, the phenomenon of temperature and pressure imbalance caused by local temperature differences and differences in thermal expansion coefficients during processing can be effectively suppressed. In the manufacturing of specialized equipment for semiconductor devices, this imprinting method can improve the imprinting accuracy of submicron circuit patterns by dynamically compensating for nanoscale deformation deviations in flexible circuit boards. For the manufacture of key components of etching machines, this thermal expansion balance control technology can reduce the risk of micro-deformation of plasma chamber materials in high-temperature etching environments, thereby ensuring the uniformity of the atomic layer etching process. This innovative method achieves coordinated thermodynamic control of the entire process by establishing a multi-physics field coupling model, meeting the thermal matching requirements of advanced packaging technology for heterogeneous integration of flexible substrates and silicon-based chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Shown is a flow chart of a method for imprinting fine circuits on a flexible circuit board. DETAILED DESCRIPTION

[0035] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0036] Figure 1 Shown is a flow chart of a method for imprinting fine circuits on a flexible circuit board.

[0037] Reference Figure 1 The present invention provides a method for printing fine circuits on a flexible circuit board, the method comprising the following steps:

[0038] S100, pre-processing the flexible circuit board substrate and placing it in an imprinting device;

[0039] S200, obtaining pressure and temperature of the flexible circuit board substrate through sensors during the printing process, and generating a temperature distribution map and a pressure distribution map;

[0040] S300, obtaining a constant-state pressure balance value according to the temperature distribution map and the pressure distribution map;

[0041] S400 , determining whether to perform forced cooling or natural cooling on the printed flexible circuit board substrate according to the constant pressure balance value.

[0042] The circuit stamping method according to the embodiment of the present invention can avoid temperature and pressure imbalance caused by local temperature differences and uneven thermal expansion, thereby ensuring the quality and stability of the flexible circuit board.

[0043] Pre-processing the flexible circuit board substrate and placing it in the imprinting device in step S100 includes:

[0044] Specifically, pretreatment involves cleaning the substrate surface to remove impurities, oil, or dust to ensure accurate and reliable circuitry during the transfer process. Suitable flexible circuit board substrates have appropriate thickness, flexibility, and surface finish to minimize deformation, cracking, or uneven transfer in high-temperature, high-pressure environments.

[0045] Furthermore, after confirming that the substrate meets the requirements for fine circuit transfer, it is placed in an imprinting device.

[0046] During the heating process, the flexible circuit board substrate will undergo thermal expansion or contraction. In particular, when the local stamping temperature is too high, the local temperature difference of the flexible circuit board substrate will lead to uneven thermal expansion in different areas, resulting in internal temperature and pressure imbalance, which increases the fragility of the flexible circuit board substrate. After stamping, the flexible circuit board substrate is unevenly heated, causing pressure-temperature crack propagation, which may lead to the scrapping of the flexible circuit board substrate. Pressure-temperature crack propagation refers to the phenomenon that cracks appear in the flexible material due to the combined effects of temperature changes and pressure during hot stamping or stamping, and the cracks further propagate over time and pressure. To address the above problems, the present invention proposes step S200.

[0047] In step S200, obtaining the pressure and temperature of the flexible circuit board substrate through the sensor during the printing process and generating the temperature distribution map and the pressure distribution map include:

[0048] Obtain the temperature distribution map and pressure distribution map of the flexible circuit board substrate at every time interval L to obtain H temperature distribution maps and H pressure distribution maps, wherein the time interval L is set to [3] seconds; TTW(Li) is recorded as the average temperature of the temperature distribution map of the flexible circuit board substrate at time Li, and TTY(Li) is recorded as the average pressure of the pressure distribution map at time Li, wherein Li = [(i-1)*L, i*L], i = 1, 2, ..., H, H is 50, and i is the time interval sequence number; wherein, when i = 1, Li represents the Lth second, ..., when i = H, it represents the L×Hth second, the median of all TTW(Li) is recorded as TSM, and the median of all TTY(Li) is recorded as YSM;

[0049] Furthermore, in step S300, obtaining a steady-state pressure balance value according to the temperature distribution map and the pressure distribution map includes the following steps:

[0050] S301, obtaining a constant temperature through a temperature distribution map and a pressure distribution map;

[0051] Perform the same grid division on all temperature distribution maps and pressure distribution maps using a grid division algorithm. The grid size is 1 / 1000 of the temperature distribution map and the pressure distribution map. The temperature distribution map and the pressure distribution map are divided into K grids, where K = 1000. s(Li, j) represents the temperature value of the j-th grid of the temperature distribution map at time Li, and v(Li, j) represents the pressure value of the j-th grid of the pressure distribution map at time Li. The value of j is [1, K], and K is the number of grids after the temperature distribution map and the pressure distribution map are divided. Obtain the median of the temperature values ​​in each grid in the temperature distribution map at time Li and record it as ZD(i). The mean of ZD(i) is the steady-state temperature ZDZ.

[0052] S302, screening out a pressure condensation grid and a temperature condensation grid;

[0053] For each grid of the temperature distribution graph and the pressure distribution graph, calculate the sum of all the average pressure values ​​in the time period L1 to LH to obtain the total pressure value, and use SFD(j) to represent the total pressure value of the j-th grid. Among all the grids, find the grid with the largest total pressure value, record it as the pressure condensation grid, and obtain the average pressure value TFDK of the pressure condensation grid in each pressure distribution graph; for each grid, calculate the sum of all the average temperature values ​​in the time period L1 to LH to obtain the total temperature value, and use VFD(j) to represent the total temperature value of the j-th grid. Among all the grids, find the grid with the largest total temperature value, record it as the temperature condensation grid, and record the average temperature value VFDK of the temperature condensation grid in each temperature distribution graph;

[0054] S303, calculating a steady-state pressure balance value using the pressure condensation grid and the temperature condensation grid;

[0055] Calculate the steady-state pressure balance value MUIY, where the value of the steady-state pressure balance value MUIY is the average value TFDK of the pressure values ​​of the pressure condensation grid in each pressure distribution diagram plus the embossed crack traction pressure value PTK, where the embossed crack traction pressure value PTK is the median YSM of each average pressure in all TTY(Li) multiplied by the temperature traction coefficient U, where the temperature traction coefficient is |1-ZDZ / 2(VFDK+TSM)|.

[0056] Among them, the steady-state pressure balance value is a physical quantity used to evaluate the interaction between temperature and pressure during the imprinting process of a flexible printed circuit board. The principle of the steady-state pressure balance value is to reflect the influence of temperature changes on the pressure distribution by combining the average pressure value of the pressure condensation grid and the temperature traction coefficient, and to judge whether crack propagation or other adverse effects may occur during the imprinting process by fitting the relationship between pressure and temperature. Further, the temperature traction coefficient is a coefficient used to quantify the traction effect of temperature changes on the material pressure, and is used to reflect the influence of local temperature changes on the stress and pressure distributions.

[0057] S400, judge whether to perform forced cooling or natural cooling on the imprinted flexible printed circuit board substrate according to the steady-state pressure balance value;

[0058] Compare the magnitudes of MUIY and YSM. If MUIY ≥ YSM, it indicates that there is a conflict between temperature and pressure or the local temperature and pressure are too high under the current temperature and pressure combination, which is likely to cause crack propagation. Therefore, it is necessary to perform forced cooling on the imprinted flexible printed circuit board to avoid more serious temperature-pressure crack propagation. The forced cooling methods include: using a fan or a cooling air system to blow hot air onto the surfaces of the substrate and the mold to accelerate cooling, absorbing the heat of the substrate and the mold through circulating coolant for accelerated cooling, or directly placing the mold or the substrate on a cooling bed for rapid cooling through contact conduction.

[0059] If MUIY < YSM, it means that the current temperature and pressure control is appropriate and forced cooling is not required, and the imprinted flexible printed circuit board is naturally cooled.

[0060] It should be noted that the logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device), or in conjunction with such instruction execution system, apparatus, or device. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transmit a program for use by an instruction execution system, apparatus, or device, or in conjunction with such instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection portion having one or more wires (electronic device), a portable computer disk cartridge (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and programmable read-only memory (EPROM or flash memory), fiber optic devices, and portable compact disc read-only memory (CDROM). Furthermore, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or processing it in another suitable manner if necessary, and then storing it in a computer memory.

[0061] It should be understood that various parts of the present invention can be implemented using hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one of the following technologies known in the art or a combination thereof can be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application-specific integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0062] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0063] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0064] In addition, the terms "first" and "second" used in the embodiments of the present invention are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in this embodiment. Therefore, the features defined by the terms "first" and "second" in the embodiments of the present invention can explicitly or implicitly indicate that the embodiment includes at least one of such features. In the description of the present invention, the word "plurality" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0065] In the present invention, unless otherwise clearly specified or limited in the embodiments, the terms "installed," "connected," "connect," and "fixed" appearing in the embodiments should be understood in a broad sense. For example, the connection may be a fixed connection, a detachable connection, or an integral connection. It can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements, or an interaction between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood based on the specific implementation.

[0066] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0067] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A fine circuit imprinting method for a flexible circuit board, characterized in that: The method comprises the following steps: S100, pre-processing the flexible circuit board substrate and placing it in an imprinting device; S200, obtaining pressure and temperature of the flexible circuit board substrate through sensors during the printing process, and generating a temperature distribution map and a pressure distribution map; S300, obtaining a steady-state pressure balance value based on the temperature distribution map and the pressure distribution map; wherein step S300 includes: S301, obtaining a steady-state temperature based on the temperature distribution map and the pressure distribution map; S302, screening out a pressure condensation grid and a temperature condensation grid; S303, calculating a steady-state pressure balance value based on the pressure condensation grid and the temperature condensation grid; S400 , determining whether to perform forced cooling or natural cooling on the printed flexible circuit board substrate according to the constant pressure balance value.

2. The method according to claim 1, characterized in that In step S100 , the flexible circuit board substrate is pre-treated and placed in an imprinting device. The pre-treatment process includes cleaning the substrate surface to remove impurities, oil stains or dust.

3. The method according to claim 1, characterized in that Step S200 includes: Obtain the temperature distribution map and pressure distribution map of the flexible circuit board substrate at every time interval L to obtain H temperature distribution maps and H pressure distribution maps, where the time interval L is set to [1, 10] seconds; TTW(Li) is denoted as the average temperature magnitude of the temperature distribution map of the flexible circuit board substrate at time Li, and TTY(Li) is denoted as the average pressure magnitude of the pressure distribution map at time Li, where Li=[(i-1)*L, i*L], i=1, 2, …, H, H∈[5, 100], and i is the time interval serial number; where i=1, Li represents the Lth second, …, i=H represents the L×Hth second, the median of all TTW(Li) is denoted as TSM, and the median of all TTY(Li) is denoted as YSM.

4. The method according to claim 3, characterized in that Step S301 includes: performing the same grid division on all temperature distribution maps and pressure distribution maps using a grid division algorithm, dividing the temperature distribution map and the pressure distribution map into K grids, where K=1000; obtaining the median of the temperature values ​​in each grid in the temperature distribution map at time Li and recording it as ZD(i), and recording the mean of ZD(i) as the steady-state temperature ZDZ.

5. The method according to claim 4, characterized in that Step S302 includes: for each grid in the temperature distribution map and the pressure distribution map, calculating the sum of all average pressure values ​​and the sum of all average temperature values ​​in the time period L1 to LH to obtain a total pressure value and a total temperature value; finding a grid with the largest total pressure value among all grids, recording it as the pressure condensation grid, and obtaining the average pressure value TFDK of the pressure condensation grid in each pressure distribution map; finding a grid with the largest total temperature value among all grids, recording it as the temperature condensation grid, and recording the average temperature value VFDK of the temperature condensation grid in each temperature distribution map.

6. The method according to claim 5, characterized in that In step S303, calculating the steady-state pressure balance value using the pressure condensation grid and the temperature condensation grid includes: Calculate the steady-state pressure balance value MUIY, where the value of the steady-state pressure balance value MUIY is the average value TFDK of the pressure values ​​of the pressure condensation grid in each pressure distribution diagram plus the embossed crack traction pressure value PTK, where the embossed crack traction pressure value PTK is the median YSM of each average pressure in all TTY(Li) multiplied by the temperature traction coefficient.

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