Integrated circuit board with heat dissipation structure

Abstract

The invention relates to the field of circuit board heat dissipation, in particular to an integrated circuit board with a heat dissipation structure and an installation outer shell, a circuit board body is arranged in the installation outer shell, a shell cover is arranged on the top of the installation outer shell, and heat dissipation fins are evenly distributed on the shell cover. After the shell cover is covered, the heat dissipation fins are attached to the circuit board body for heat dissipation. By arranging the heat dissipation fins, the water pipe and the fan, when the heat of the circuit board body is too large, the fan is started, so that the heat dissipation fins, the water pipe and the fan perform heat dissipation on the circuit board body at the same time, and the heat dissipation effect is ensured.

Description

Technical Field

[0001] The present invention relates to the field of circuit board heat dissipation, and particularly to an integrated circuit board with a heat dissipation structure. Background Art

[0002] An integrated circuit board is a foundation for fixing and connecting integrated circuits and some electronic components. Generally made of insulating materials with good electrical performance and mechanical strength, as one of the core components of modern electronic devices, the performance and reliability of the integrated circuit board are crucial for the operation of the entire system.

[0003] However, with the continuous improvement of integration and the increase in component density, the heat generated by the integrated circuit board during operation is also increasing day by day. Excessive temperature will not only affect the working efficiency of the circuit, but may also cause component damage or even system failure. Therefore, we need to design an integrated circuit board with a heat dissipation structure to improve the problems existing in the prior art. Summary of the Invention

[0004] The purpose of the present invention is to provide an integrated circuit board with a heat dissipation structure to improve the problems in the prior art that as the integration continuously increases and the component density increases, the heat generated by the integrated circuit board during operation also increases day by day, and the excessive temperature affects the working efficiency of the circuit and causes component damage or even system failure.

[0005] The technical solution of the present invention is as follows: An integrated circuit board with a heat dissipation structure, an installation housing, a circuit board body is arranged inside the installation housing, a housing cover is arranged on the top of the installation housing, heat dissipation fins are evenly arranged on the housing cover, and after the housing cover is covered, the heat dissipation fins are in close contact with the circuit board body for heat dissipation.

[0006] More preferably, symmetrically distributed mounting seats are arranged inside the installation housing, and the circuit board body is fixed through the mounting seats.

[0007] More preferably, symmetrically distributed connecting columns are arranged inside the installation housing, a movable sleeve is slidably connected to the connecting columns, a connecting frame is installed on the movable sleeve, an insertion rod is arranged at one end of the connecting frame away from the movable sleeve, and the insertion rod is in plug-in fit with the mounting seat.

[0008] More preferably, a first wedge-shaped block is arranged at the bottom of the housing cover, a second wedge-shaped block is arranged on the connecting frame, and when the housing cover is closed, the first wedge-shaped block presses the second wedge-shaped block, driving the connecting frame and the insertion rod to insert into the mounting seat.

[0009] More preferably, a positioning rod is connected to the movable sleeve, a grooved ring is arranged at the lower part of the connecting column, and the positioning rod is in snap fit with the grooved ring.

[0010] More preferably, a limiting ring is provided on the movable sleeve. The limiting ring is located above the grooved circular ring and is used to limit the position of the movable sleeve.

[0011] More preferably, a torsion spring is connected between the limiting ring and the mounting housing, and a compression spring is connected between the movable sleeve and the mounting housing.

[0012] More preferably, a water pipe is provided at the bottom of the mounting housing, and the water pipe is filled with water.

[0013] More preferably, symmetrically distributed blowers are provided on the mounting housing, and symmetrically distributed filter screens are provided on the mounting housing. The filter screens are used to block dust.

[0014] More preferably, an access port is provided on the mounting housing, and the access port is used to connect the circuit board body.

[0015] Compared with the prior art, the present invention has the following advantages: 1. By providing heat dissipation fins, a water pipe and a blower, when the heat of the circuit board body is too high, the blower starts, so that the three work together to dissipate heat from the circuit board body, ensuring the heat dissipation effect;

[0016] 2. After the circuit board body is installed, the shell cover is covered, so that the first wedge block moves downward. At this time, since the clamping rod does not fit with the grooved circular ring, the second wedge block will only be squeezed and rotated by the first wedge block, causing the torsion spring to deform. When the clamping rod rotates to fit with the grooved circular ring, the second wedge block is squeezed downward by the first wedge block, thereby driving the connecting frame and the insertion rod to move downward. At this time, since the clamping rod fits with the grooved circular ring, the movable sleeve cannot rotate, and at this time, the insertion rod is directly above the slot of the mounting seat. The insertion rod moves downward to cooperate with the mounting seat to fix the circuit board body, avoiding the position of the connecting frame affecting the placement of the circuit board body during the installation of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic three-dimensional structure diagram of the first state of the present invention.

[0018] Figure 2 It is a schematic three-dimensional structure diagram of the second state of the present invention.

[0019] Figure 3 It is a schematic three-dimensional structure diagram of components such as the mounting housing, the circuit board body and the filter screen of the present invention.

[0020] Figure 4 It is a schematic three-dimensional structure diagram of components such as the mounting housing, the water pipe and the mounting seat of the present invention.

[0021] Figure 5 This is a three-dimensional structural schematic diagram of components such as the movable sleeve, limit ring, and torsion spring of the present invention.

[0022] Figure 6 This is a three-dimensional structural schematic diagram of components such as the movable sleeve, connecting frame, and insertion rod of the present invention.

[0023] Reference numerals: 1, mounting housing; 2, circuit board body; 3, housing cover; 4, heat dissipation fins; 5, mounting seat; 6, connecting column; 7, movable sleeve; 8, connecting frame; 9, insertion rod; 10, first wedge block; 11, second wedge block; 12, positioning rod; 13, grooved ring; 14, limit ring; 15, torsion spring; 16, compression spring; 17, water pipe; 18, fan; 19, filter screen; 20, access port. Detailed implementation manners

[0024] The following will, in conjunction with the drawings and embodiments, elaborate in detail on the implementation manners of the present invention, so as to fully understand how the present invention applies technical means to solve technical problems and achieve the realization process of technical effects and implement accordingly.

[0025] In the description of the present invention, it should be noted that for orientation terms, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and position relationships indicated are based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

[0026] In addition, for the terms "first" and "second", they are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, for the terms "assembled", "connected", and "joined", they should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may also be a mechanical connection; it may be directly connected, or connected through an intermediate medium, and may be internally connected and communicated between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0029] It should also be understood that the terms used in the specification of the embodiments of the present invention are merely for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the specification of the embodiments of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms.

[0030] Embodiment 1: An integrated circuit board with a heat dissipation structure, as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 shown, an installation housing 1 is provided, a circuit board body 2 is arranged inside the installation housing 1, a housing cover 3 is arranged on the top of the installation housing 1, heat dissipation fins 4 are evenly distributed on the housing cover 3, and after the housing cover 3 is covered, the heat dissipation fins 4 are in close contact with the circuit board body 2 for heat dissipation.

[0031] Furthermore, a water pipe 17 is arranged at the bottom of the installation housing 1, water is contained in the water pipe 17, and the water in the water pipe 17 can be replaced.

[0032] Furthermore, symmetrically distributed fans 18 are arranged on the installation housing 1, and symmetrically distributed filter screens 19 are arranged on the installation housing 1. The filter screens 19 are used to block dust.

[0033] By providing heat dissipation fins 4, a water pipe 4, and fans 18, when the heat of the circuit board body 2 is too high, the fans 18 are started, so that the three work together to dissipate heat from the circuit board body 2, ensuring the heat dissipation effect.

[0034] Embodiment 2: On the basis of Embodiment 1, as Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 shown, symmetrically distributed mounting seats 5 are arranged inside the installation housing 1, the circuit board body 2 is fixed by being inserted into the mounting seats 5, symmetrically distributed connecting columns 6 are arranged inside the installation housing 1, a movable sleeve 7 is slidably connected to the connecting columns 6, a connecting frame 8 is mounted on the movable sleeve 7, an insertion rod 9 is arranged at one end of the connecting frame 8 away from the movable sleeve 7, and the insertion rod 9 is in plug-in fit with the mounting seat 5.

[0035] Wherein, a rubber block or a sponge block is arranged around the insertion rod 9 at the bottom of the connecting frame 8 to fit and press against the circuit board body 2 for fixing it, and buffer through the rubber block or the sponge block to prevent the four corners of the placement fixing from being damaged.

[0036] Furthermore, a first wedge-shaped block 10 is arranged at the bottom of the shell cover 3, and a second wedge-shaped block 11 is arranged on the connecting frame 8. When the shell cover 3 is closed, the first wedge-shaped block 10 squeezes the second wedge-shaped block 11 to drive the connecting frame 8 and the insertion rod 9 to be inserted into the mounting seat 5.

[0037] Furthermore, a clamping rod 12 is connected to the movable sleeve 7, a grooved ring 13 is arranged in the middle of the connecting column 6, and the clamping rod 12 is in clamping fit with the grooved ring 13. A torsion spring 15 is connected between the limiting ring 14 and the mounting shell 1, and a compression spring 16 is connected between the movable sleeve 7 and the mounting shell 1. In order to prevent the position of the connecting frame 8 from affecting the placement of the circuit board body 2 when the circuit board body 2 is installed, in the initial state, that is, when the shell cover 3 is not closed, the movable sleeve 7 is located near the edge of the mounting shell 1. After the circuit board body 2 is installed, the shell cover 3 is covered, so that the first wedge-shaped block 10 moves downward. At this time, since the clamping rod 12 and the grooved ring 13 are not engaged, the second wedge-shaped block 11 will only be squeezed and rotated by the first wedge-shaped block 10, causing the torsion spring 15 to deform. When the clamping rod 12 rotates to be engaged with the grooved ring 13, the second wedge-shaped block 11 is squeezed downward by the first wedge-shaped block 10, thereby driving the connecting frame 8 and the insertion rod 9 to move downward. At this time, since the clamping rod 12 and the grooved ring 13 are engaged, the movable sleeve 7 cannot rotate, and at this time, the insertion rod 9 is directly above the slot of the mounting seat 5. The insertion rod 9 moves downward to cooperate with the mounting seat 5 to fix the circuit board body 2, and the compression spring 16 deforms.

[0038] Furthermore, a limiting ring 14 is arranged on the movable sleeve 7. The limiting ring 14 is located above the grooved ring 13 and has an inner diameter smaller than the outer diameter of the grooved ring 13. The limiting ring 14 is used to limit the position of the movable sleeve 7 to prevent the movable sleeve 7 from moving downward excessively.

[0039] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes all fall within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. An integrated circuit board with a heat dissipation structure, characterized in that: A mounting shell (1) is provided with a circuit board body (2) in the mounting shell (1), a shell cover (3) is provided on the top of the mounting shell (1), and evenly distributed heat dissipation fins (4) are provided on the shell cover (3); after the shell cover (3) is covered, the heat dissipation fins (4) and the circuit board body (2) are close together to dissipate heat.

2. The integrated circuit board with a heat dissipation structure according to claim 1, characterized in that: Symmetrically distributed mounting seats (5) are provided in the mounting shell (1), and the circuit board body (2) is fixed by means of the mounting seats (5).

3. The integrated circuit board with a heat dissipation structure according to claim 2, characterized in that: The installation shell (1) is provided with symmetrically distributed connecting columns (6), a movable sleeve (7) is slidably connected to the connecting columns (6), a connecting frame (8) is installed on the movable sleeve (7), and an insertion rod (9) is provided at one end of the connecting frame (8) away from the movable sleeve (7), and the insertion rod (9) is plugged into and matched with the installation seat (5).

4. The integrated circuit board with a heat dissipation structure according to claim 3, characterized in that: A first wedge block (10) is arranged at the bottom of the shell cover (3), and a second wedge block (11) is arranged on the connecting frame (8). When the shell cover (3) is closed, the first wedge block (10) squeezes the second wedge block (11), thereby driving the connecting frame (8) and the insertion rod (9) to be inserted into the mounting seat (5).

5. The integrated circuit board with a heat dissipation structure according to claim 4, characterized in that: The movable sleeve (7) is connected with a locking rod (12), the lower part of the connecting column (6) is provided with a grooved ring (13), and the locking rod (12) is engaged with the grooved ring (13).

6. The integrated circuit board with a heat dissipation structure according to claim 5, characterized in that: A limiting ring (14) is provided on the movable sleeve (7), the limiting ring (14) is located on the upper side of the grooved circular ring (13), and the limiting ring (14) is used to limit the position of the movable sleeve (7).

7. The integrated circuit board with a heat dissipation structure according to claim 6, characterized in that: A torsion spring (15) is connected between the limiting ring (14) and the mounting shell (1), and a compression spring (16) is connected between the movable sleeve (7) and the mounting shell (1).

8. The integrated circuit board with a heat dissipation structure according to claim 7, characterized in that: A water pipe (17) is provided at the bottom of the installation housing (1), and water is contained in the water pipe (17).

9. The integrated circuit board with a heat dissipation structure according to claim 8, characterized in that: The installation shell (1) is provided with symmetrically distributed fans (18), and the installation shell (1) is provided with symmetrically distributed filters (19), and the filters (19) are used to block dust.

10. The integrated circuit board with a heat dissipation structure according to claim 1, characterized in that: The installation housing (1) is provided with an access port (20), and the access port (20) is used to connect the circuit board body (2).

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