Integrated power electronic device heat dissipation structure

Abstract

The invention belongs to the technical field of electronic device heat dissipation, and particularly relates to an integrated power electronic device heat dissipation structure which comprises an integrated box, and a device cavity, a heat dissipation cavity, a fixing ring, a connecting frame, a threaded rod, a disc, sector teeth, two elastic telescopic joints and a motor are fixed to the upper portion of the inner wall of the integrated box. A plurality of distribution blocks are fixed to the inner wall of the heat dissipation cavity, push-pull plates are slidably connected to the inner walls of the distribution blocks, push-pull rods are fixed to the bottom ends of the push-pull plates, the upper portions of the push-pull plates are connected with the upper portions of the inner walls of the distribution blocks through springs, through holes are formed in the upper portions of the distribution blocks, and a threaded hole is formed in the middle of the disc. According to the device, the problems that the cost is increased, installation is inconvenient, the structure is relatively complex, an external circulating pump is needed, and overall installation is inconvenient due to the fact that a circulating pump needs to be used for circulating cooling liquid for heat dissipation of an electronic device at present to dissipate heat of the electronic device are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation of electronic devices, and particularly relates to an integrated heat dissipation structure for power electronic devices. Background Art

[0002] If the heat generated by electronic components during operation cannot be discharged in time, it will cause a sharp increase in local temperature, leading to performance degradation (such as an increase in transistor leakage current) or logic errors. High temperature will also accelerate material aging and reduce the reliability of components. Therefore, it is necessary to dissipate heat from electronic components. The current heat dissipation method is to set a flow guide plate under the electronic components, and coolants are introduced into the flow guide plate through a circulation pump for circulating cooling. This cooling method requires an external circulation pump, which is large in volume and inconvenient to install. Moreover, the heat dissipation effect is single, and the heat dissipation uniformity is poor. Some areas of electronic components cannot be fully dissipated. This phenomenon has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0003] The purpose of the present invention is to provide an integrated heat dissipation structure for power electronic devices to solve the problems raised in the above background art.

[0004] To solve the above technical problems, the present invention provides the following technical solutions: An integrated heat dissipation structure for power electronic devices, including an integrated box. Above the inner wall of the integrated box, there are fixed a device cavity, a heat dissipation cavity, a fixing ring, a connecting frame, a threaded rod, a disc, fan teeth, two elastic telescopic joints, and a motor. Inside the inner wall of the heat dissipation cavity, there are fixed several distribution blocks. Inside the inner walls of the several distribution blocks, there are slidably connected push-pull plates. At the bottom end of the push-pull plate, there is fixed a push-pull rod. Above the push-pull plate and the upper part of the inner wall of the distribution block, there is a spring connection. Above the several distribution blocks, there are provided through holes. In the middle of the disc, there is a threaded hole, which is threadedly connected to the threaded rod. The threaded rod is fixedly installed at the bottom of the heat dissipation cavity. The motor is fixedly installed at the bottom of the inner wall of the integrated box. The fan teeth are fixedly connected to the output end of the motor. The fan teeth are fixedly connected to the disc through two elastic telescopic joints. The lower end of the push-pull rod is spherical and fits with the surface of the disc. The heat dissipation cavity is located below the device cavity and is connected to the fixing ring through the connecting frame. The fixing ring is fixedly installed on the inner wall of the integrated box.

[0005] The present invention further explains that at the bottom of the heat dissipation cavity, there is a square frame groove. Above the connecting frame, it is embedded in the square frame groove. The bottom end of the connecting frame is in a plum blossom shape. In the middle of the fixing ring, there is a through hole and a counterbore is provided. The counterbore of the fixing ring is in a plum blossom shape and fits with the connecting frame. Above the heat dissipation cavity, there is fixed a circular ring. At the bottom of the device cavity, there is a ring groove, and the circular ring is embedded in the ring groove.

[0006] Further illustration of the present invention: After the disc moves upward, it contacts the bottom of the connecting frame, and the connecting frame moves up and down within the square frame slot.

[0007] Further illustration of the present invention: Gears are meshed on both the left and right sides of the sector teeth. A rotating shaft is fixed to the bottom of the gear. A sleeve is sleeved on the outer side of the rotating shaft. The sleeve is fixedly installed at the bottom inner wall of the integrated box. A fan blade is fixed above the gear. A number of air holes are formed on the surface of the disc.

[0008] Further illustration of the present invention: A first limiting block is fixed to the inner wall of the sleeve. A second limiting block is fixed to one side of the bottom of the rotating shaft. A elastic spring is connected between the first limiting block and the second limiting block.

[0009] Further illustration of the present invention: Three elastic springs are provided and are evenly arranged within the sleeve.

[0010] Further illustration of the present invention: The power of the motor remains constant.

[0011] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The heat dissipation structure adopted by the present invention enables the coolant to flow back and forth through the through holes, causing the coolant to surge within the heat dissipation cavity, improving the cooling intensity. Moreover, the coolant frequently enters and exits the distribution block, enabling the coolant to be fully dissipated, and keeping the coolant in a good cooling effect at all times.

[0012] By providing a connecting frame and a fixing ring, when the disc moves upward to contact the bottom of the connecting frame and pushes the connecting frame upward, at this time, the plum blossom-shaped part at the bottom of the connecting frame is pushed to separate from the plum blossom-shaped part of the fixing ring, and the movable part above the connecting frame slides upward within the square frame slot, thus no longer limiting the heat dissipation cavity. When the motor continues to rotate, the heat dissipation cavity can be driven to rotate by the threaded rod, and the ring rotates within the ring groove. The rotation of the motor causes the heat dissipation cavity to generate centrifugal force, enabling the internal coolant to diffuse around, so as to achieve more sufficient cooling, and being able to cool the electronic components evenly, greatly improving the cooling quality.

[0013] By providing three elastic springs, the speed of the fan blade rotating in the reverse direction quickly is increased, and the intensity of the blowing and sucking air flow is further increased. Moreover, during the rapid rotation of the motor, the resistance received when the sector teeth are meshed with the gear increases, thus avoiding the situation that when the plum blossom-shaped part at the bottom of the connecting frame is pushed to separate from the plum blossom-shaped part of the fixing ring, the rotation speed of the heat dissipation cavity is too fast and the centrifugal force continuously increases, resulting in only being able to dissipate heat from the edges of the electronic components. Through the reaction force of the three elastic springs, the rapid rotation of the motor is buffered, causing the centrifugal force to be large and small, thus facilitating uniform heat dissipation of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and form a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the accompanying drawings:

[0015] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 is a schematic diagram of the internal structure of the integrated box of the present invention;

[0017] Figure 3 is a plan view of the present invention;

[0018] Figure 4 is a schematic diagram of the position of the connection frame of the present invention located in the square frame groove;

[0019] Figure 5 is a schematic diagram of the structure of the connection frame and the fixing ring of the present invention;

[0020] Figure 6 is a schematic diagram of the meshing relationship between the sector gear and the gear of the present invention;

[0021] Figure 7 is a schematic diagram of the internal structure of the sleeve of the present invention;

[0022] In the figure: 1. Integrated box; 11. Device cavity; 111. Ring groove; 12. Heat dissipation cavity; 121. Distribution block; 122. Push-pull plate; 123. Push-pull rod; 124. Through hole; 125. Square frame groove; 126. Ring; 13. Fixing ring; 14. Connection frame; 15. Threaded rod; 16. Disc; 17. Sector gear; 171. Gear; 172. Rotating shaft; 173. Sleeve; 174. Fan blade; 175. Elastic spring; 18. Elastic telescopic joint; 19. Motor. Specific embodiments

[0023] The technical solution of the present invention will be further described in detail and non-limitingly below in conjunction with the preferred embodiments and their accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0024] Please refer to Figures 1-7 , the present invention provides a technical solution: an integrated power electronic device heat dissipation structure, including an integrated box 1, above the inner wall of the integrated box 1, a device cavity 11, a heat dissipation cavity 12, a fixing ring 13, a connection frame 14, a threaded rod 15, a disc 16, a sector gear 17, two elastic telescopic joints 18 and a motor 19 are fixed;

[0025] A plurality of distribution blocks 121 are fixed to the inner wall of the heat dissipation cavity 12. A push-pull plate 122 is slidably connected to the inner walls of the plurality of distribution blocks 121. A push-pull rod 123 is fixed to the bottom end of the push-pull plate 122. The upper part of the push-pull plate 122 is connected to the upper part of the inner wall of the distribution block 121 by a spring. A through hole 124 is provided above the plurality of distribution blocks 121. A threaded hole is provided in the middle of the disk 16, and it is threadedly connected to the threaded rod 15. The threaded rod 15 is fixedly installed at the bottom of the heat dissipation cavity 12. The motor 19 is fixedly installed at the bottom of the inner wall of the integrated box 1. The fan teeth 17 are fixedly connected to the output end of the motor 19. The fan teeth 17 are fixedly connected to the disk 16 through two elastic telescopic joints 18. The lower end of the push-pull rod 123 is spherical and is in mutual contact with the surface of the disk 16. The heat dissipation cavity 12 is located below the device cavity 11 and is connected to the fixed ring 13 through a connecting frame 14. The fixed ring 13 is fixedly installed on the inner wall of the integrated box 1;

[0026] Coolant is injected into the heat dissipation cavity 12 to cool the electronic components in the device cavity 11, thereby preventing the electronic components from being damaged due to excessive temperature. During the natural cooling process of the coolant, the motor 19 operates to drive the fan teeth 17 to rotate. The fan teeth 17 drive the disk 16 to rotate through two elastic telescopic joints 18. The disk 16 rotates and moves upward along the threaded rod 15 through the threaded hole in the middle. The elastic telescopic joint 18 is stretched. The upper surface of the disk 16 contacts the bottom end of the push-pull rod 123 and pushes the push-pull rod 123 upward. The push-pull rod 123 drives the push-pull plate 122 to slide upward along the inner wall of the distribution block 121. The coolant above it is squeezed out through the through hole 124. At the same time, the spring is deformed by force. Then the motor 19 rotates in the reverse direction to drive the disk 16 to reset. The spring generates a reaction force to make the push-pull plate 122 reset and re-extract the coolant in the heat dissipation cavity 12 into the distribution block 121. Repeat the above operations to make the coolant flow back and forth through the through hole 124, causing the coolant to surge in the heat dissipation cavity 12, improving the cooling intensity, and the coolant frequently enters and exits the distribution block 121, enabling the coolant to be fully cooled and keeping the coolant in a good cooling effect at all times.

[0027] A square frame groove 125 is provided at the bottom of the heat dissipation cavity 12. The upper part of the connecting frame 14 is embedded in the square frame groove 125. The bottom end of the connecting frame 14 is in a plum blossom shape. The middle of the fixed ring 13 is in a through shape and is provided with a counterbore. The counterbore of the fixed ring 13 is in a plum blossom shape and fits with the connecting frame 14;

[0028] A ring 126 is fixed above the heat dissipation cavity 12. A ring groove 111 is provided at the bottom of the device cavity 11, and the ring 126 is embedded in the ring groove 111.

[0029] After the disk 16 moves upward, it contacts the bottom of the connecting frame 14, and the connecting frame 14 moves up and down in the square frame groove 125;

[0030] When the disk 16 rotates upward while moving upward, the bottom plum blossom shape of the connecting frame 14 fits with the plum blossom shape of the fixed ring 13. At the same time, the square frame groove 125 catches the upper end of the connecting frame 14, so that the heat dissipation cavity 12 stops stably, maintaining stable heat dissipation, stably dissipating heat from the electronic components, facilitating the smooth upward movement of the disk 16. When the disk 16 moves upward to contact the bottom of the connecting frame 14 and pushes the connecting frame 14 upward, the plum blossom-shaped part at the bottom of the connecting frame 14 is pushed to disengage from the plum blossom-shaped part of the fixed ring 13, and the movable part above the connecting frame 14 slides upward in the square frame groove 125, thus no longer limiting the heat dissipation cavity 12. When the motor 19 continues to rotate, the heat dissipation cavity 12 can be driven to rotate by the threaded rod 15, and the circular ring 126 rotates in the ring groove 111. The rotation of the motor 19 causes the heat dissipation cavity 12 to generate centrifugal force, and the internal coolant can diffuse to the surrounding, making the cooling more sufficient, cooling the electronic components evenly, and greatly improving the cooling quality;

[0031] When the motor 19 rotates in the reverse direction later, the high-speed rotation causes the disk 16 to be loosened from the threaded rod 15 under the action of centrifugal force, so that it rotates slightly in the reverse direction and moves downward, making the connecting frame 14 re-engage with the fixed ring 13, facilitating the re-limiting of the heat dissipation cavity 12, enabling the disk 16 to be reset smoothly, and thus continuously and reciprocally performing the high-efficiency coolant surging work.

[0032] Both the left and right sides of the fan teeth 17 are engaged with gears 171. The bottom of the gear 171 is fixed with a rotating shaft 172. The outer side of the rotating shaft 172 is sleeved with a sleeve 173. The sleeve 173 is fixedly installed at the bottom of the inner wall of the integrated box 1. The upper part of the gear 171 is fixed with a fan blade 174. A number of air holes are provided on the surface of the disk 16;

[0033] When the fan teeth 17 rotate, they drive the gears 171 to rotate through meshing. The gears 171 rotate above the sleeve 173 through the rotating shafts 172, thereby driving the fan blades 174 to rotate. The rotation of the fan blades 174 generates an air flow, and the air flow blows and sucks the heat at the bottom of the heat dissipation cavity 12 back and forth through the air holes, so as to avoid relying solely on the continuous cooling of the coolant. On the one hand, it avoids the reduction of the cooling effect due to the ineffective heat dissipation of the coolant temperature. On the other hand, it can increase the cooling speed of the electronic components, prevent the rapid increase in temperature caused by the high-power operation of the electrical components, and thus play a role in rapid cooling.

[0034] A limiting block one is fixed on the inner wall of the sleeve 173. A limiting block two is fixed on one side of the bottom of the rotating shaft 172. A elastic spring 175 is connected between the limiting block one and the limiting block two;

[0035] When the sector gear 17 rotates, it drives the gear 171 to drive the second limiting block to rotate around its center through the rotating shaft 172. Limited by the first limiting block, the elastic spring 175 deforms. Then, the sector gear 17 disengages from the gear 171, and the elastic spring 175 generates a reaction force to push the rotating shaft 172 to quickly reset. As a result, the fan blade 174 first rotates slowly forward and then quickly reversely, increasing the intensity of blowing and sucking air back and forth, enhancing the cooling intensity, and achieving a more obvious cooling effect, especially for the cooling effect when electronic components are operating at high intensity.

[0036] Three elastic springs 175 are provided and are evenly arranged in the sleeve 173;

[0037] By setting three elastic springs 175, the speed of the fan blade 174 rotating quickly in the reverse direction is increased, and the intensity of the blowing and sucking air flow is further increased. Moreover, during the rapid rotation of the motor 19, the resistance when the sector gear 17 meshes with the gear 171 increases, thus preventing the speed of the heat dissipation cavity 12 from rotating too fast and the centrifugal force from continuously increasing when the plum blossom-shaped part at the bottom of the connection frame 14 is pushed to disengage from the plum blossom-shaped part of the fixed ring 13, so that only the edge of the electronic component can be cooled. Through the reaction force of the three elastic springs 175, the rapid rotation of the motor 19 is buffered, making the centrifugal force change suddenly, thus facilitating the uniform cooling of the electronic components.

[0038] The power of the motor 19 remains constant;

[0039] Since the output current of the motor 19 is stable and the operating power of the motor 19 is stable, at this time, through the meshing of the sector gear 17 and the gear 171, the elastic spring 175 exerts a force, causing the disc 16 to rotate quickly first and then slowly. When the push-pull plate 122 moves upward, it first impacts quickly and then moves slowly, and the intensity of the coolant surging out above it will not continue to be too large, thus preventing the continuous high-intensity surging of the coolant from accelerating the evaporation speed of the coolant, increasing the service life of the coolant, and avoiding the reduction of the heat dissipation effect caused by the fast evaporation speed of the coolant.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated power electronic device heat dissipation structure, comprising an integrated box (1), characterized in that: A device cavity (11), a heat dissipation cavity (12), a fixing ring (13), a connection frame (14), a threaded rod (15), a disc (16), a fan tooth (17), two elastic expansion joints (18) and a motor (19) are fixed above the inner wall of the integrated box (1); A plurality of distribution blocks (121) are fixed to the inner wall of the heat dissipation cavity (12), and the inner walls of the plurality of distribution blocks (121) are slidably connected with push-pull plates (122). A push-pull rod (123) is fixed to the bottom end of the push-pull plate (122), and the upper part of the push-pull plate (122) is connected to the upper part of the inner wall of the distribution block (121) by a spring. A through hole (124) is provided on the upper part of the plurality of distribution blocks (121), and a threaded hole is provided in the middle of the disk (16), and is threadedly connected to the threaded rod (15), and the threaded rod (15) is fixedly installed in the heat dissipation cavity. The motor (19) is fixedly mounted on the bottom of the inner wall of the integrated box (1); the fan tooth (17) is fixedly connected to the output end of the motor (19); the fan tooth (17) is fixedly connected to the disc (16) via two elastic expansion joints (18); the lower end of the push-pull rod (123) is spherical and fits the surface of the disc (16); the heat dissipation cavity (12) is located below the device cavity (11) and is connected to the fixing ring (13) via a connecting frame (14); and the fixing ring (13) is fixedly mounted on the inner wall of the integrated box (1).

2. The integrated power electronic device heat dissipation structure according to claim 1, characterized in that: The bottom of the heat dissipation cavity (12) is provided with a square frame groove (125), the top of the connection frame (14) is embedded in the square frame groove (125), the bottom end of the connection frame (14) is in a plum blossom shape, the middle of the fixing ring (13) is in a through shape and is provided with a countersunk hole, the countersunk hole of the fixing ring (13) is in a plum blossom shape and fits with the connection frame (14); A circular ring (126) is fixed above the heat dissipation cavity (12), a circular groove (111) is provided at the bottom of the device cavity (11), and the circular ring (126) is embedded in the circular groove (111).

3. The integrated power electronic device heat dissipation structure according to claim 2, characterized in that: After the disc (16) moves upward, it contacts the bottom of the connection frame (14), and the connection frame (14) moves up and down in the square frame groove (125).

4. The integrated power electronic device heat dissipation structure according to claim 3, characterized in that: Gears (171) are meshed on both the left and right sides of the fan teeth (17); a rotating shaft (172) is fixed to the bottom of the gear (171); a sleeve (173) is sleeved on the outer side of the rotating shaft (172); the sleeve (173) is fixedly mounted on the bottom of the inner wall of the integrated box (1); a fan blade (174) is fixed above the gear (171); and a plurality of air holes are provided on the surface of the disc (16).

5. The integrated power electronic device heat dissipation structure according to claim 4, characterized in that: A first limiting block is fixed on the inner wall of the sleeve (173), a second limiting block is fixed on one side of the bottom of the rotating shaft (172), and an elastic spring (175) is connected between the first limiting block and the second limiting block.

6. The integrated power electronic device heat dissipation structure according to claim 5, characterized in that: Three elastic springs (175) are provided and are evenly arranged in the sleeve (173).

7. The integrated power electronic device heat dissipation structure according to claim 6, characterized in that: The power of the motor (19) remains constant.

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