Apparatus, system and method for cooling system

Abstract

The cooling system may include a first domain (110-1) having a first fluid inlet (112-1) and a first fluid outlet (114-1). The cooling system may include a second domain (110-2) having a second fluid inlet (112-2) and a second fluid outlet (114-2). The cooling system may include a thermal barrier between the first domain and the second domain. The thermal barrier (116) includes a thermal gap separating the first domain from the second domain by 1 mm or less.

Description

Background Art

[0001] Computing devices generate a large amount of heat during use. Computing components can be vulnerable to damage from heat and generally require a cooling system to maintain component temperatures within a safe range during high-load processing or use. Different computing requirements and applications generate different amounts of thermal energy and require different amounts of thermal management. Summary of the Invention

[0002] In some aspects, the techniques described herein relate to a cold plate for use on a computing device. The cold plate includes a first domain having a first fluid inlet and a first fluid outlet. A second domain has a second fluid inlet and a second fluid outlet. A thermal barrier is located between the first domain and the second domain. The thermal barrier includes a thermal gap that separates the first domain from the second domain by 1 mm or less.

[0003] In some aspects, the techniques described herein relate to a computing system. The computing system includes a plurality of heat-generating components fixed to a base. Each of the plurality of heat-generating components has a different heat generation. The cold plate includes a plurality of domains. Each domain is associated with a heat-generating component among the plurality of heat-generating components. A thermal barrier is located between two of the plurality of domains. The thermal barrier includes an insulating material.

[0004] In some aspects, the techniques described herein relate to a method for cooling a computing device. The method includes providing a first cooling fluid to a first domain of the cold plate. The first domain is thermally connected to a first heat-generating component. A cooling system provides a second cooling fluid to a second domain of the cold plate. The second domain is thermally connected to a second heat-generating component. A thermal gradient is maintained across a thermal barrier between the first domain and the second domain. The thermal gradient is across a thermal gap between the first domain and the second domain that is 1 mm or less.

[0005] The Summary of the Invention is provided to introduce a series of concepts further described below in the Detailed Description. The Summary of the Invention is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in limiting the scope of the claimed subject matter.

[0006] Additional features and advantages of embodiments of the present disclosure will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of such embodiments. The features and advantages of such embodiments may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the appended claims. These and other features will become more apparent from the following description and the appended claims, or may be learned by practice of the embodiments set forth hereinafter. Brief Description of the Drawings

[0007] To describe implementations that can achieve the above and other features of the present disclosure, a more specific description will be presented by referring to its specific implementations illustrated in the accompanying drawings. For better understanding, in the various drawings, the same elements are denoted by the same reference numerals. Although some of the drawings may be schematic or exaggerated representations of concepts, at least some of the drawings are drawn to scale. It should be understood that the drawings depict some example implementations, and these implementations will be described and explained with additional specificity and detail by using the drawings. In the drawings:

[0008] Figure 1 is a representation of a computing system according to at least one embodiment of the present disclosure;

[0009] Figure 2 is a schematic representation of a side view of a cooling system according to at least one embodiment of the present disclosure;

[0010] Figure 3-1 is a schematic representation of a computing system according to at least one embodiment of the present disclosure;

[0011] Figure 3-2 is according to at least one embodiment of the present disclosure Figure 3-1 a schematic side view of a computing system;

[0012] Figure 4-1 is a schematic representation of a computing system according to at least one embodiment of the present disclosure;

[0013] Figure 4-2 is according to at least one embodiment of the present disclosure Figure 4-1 a schematic side view of a computing system;

[0014] Figure 5 is a schematic representation of a top - down view of a cooling system according to at least one embodiment of the present disclosure; and

[0015] Figure 6 is a flowchart of a method for cooling a computing system according to at least one embodiment of the present disclosure. Detailed Description

[0016] The present disclosure generally relates to apparatuses, systems, and methods for cooling a computing device. The computing device may include multiple heat-generating components. For example, the computing device may include a processor and a memory. The processor and the memory may each have different power requirements or may consume different amounts of power. This may result in the processor and the memory generating different amounts of heat or having different heat generations. In some cases, the different heat generations may result in a high temperature difference, including a temperature difference of up to 60°C. In some cases, the cooling system may provide a cooling capacity based on the hottest computing component. This may result in overcooling of computing components that consume less power and / or generate less heat. Overcooling may increase the cooling operating costs for the computing device and / or a computing center that includes multiple computing devices.

[0017] In accordance with at least one embodiment of the present disclosure, the cooling system may include a cold plate connected to the computing device. The cold plate may include multiple different domains. Each domain may have a different cooling capacity, and adjacent domains may cool heat-generating components with a large difference in heat generation and / or operating temperature. This may allow the cooling system to provide customized cooling, which may be customized according to the heat generation of each computing component in the computing device, including different heat generations of different computing components. Adding different domains may moderately increase the capital expenditure. In this way, the cooling system described herein may help reduce the cooling operating costs by an amount greater than the increase in capital expenditure.

[0018] In some embodiments, the respective domains of the cold plate may be separated by thermal partitions. The thermal partitions may isolate different domains of the cold plate, thereby reducing heat transfer between the domains. This may help maintain different cooling temperatures in different domains. In this way, the thermal partitions may allow the use of a warmer cooling fluid to cool computing components with a higher operating temperature. This may help reduce the cooling operating costs by reducing the amount of refrigerated cooling fluid used at the cold plate.

[0019] In accordance with at least one embodiment of the present disclosure, the cooling system described herein may be used in association with any computing system. For example, a cold plate including multiple domains may be used on a server mounted on a blade in a rack. One or more servers in the rack and / or in the data center may include a cold plate having multiple domains. The fluid source of the cold plate may be shared in the data center. Adding additional piping and fluid management systems in the data center may increase the capital expenditure of the data center. However, as discussed herein, by reducing the amount of refrigerated cooling fluid for the cooling system, the overall cooling operating costs may be reduced. In some embodiments, the reduction in operating costs may be greater than the increase in capital expenditure over time. In some embodiments, the cooling system described herein may be used in any other type of computing device. For example, a cold plate including multiple domains may be used in a personal computer such as a desktop computer or a laptop computer.

[0020] As illustrated by the foregoing discussion, the present disclosure uses various terms to describe the features and advantages of a cooling system. Additional details regarding the meaning of such terms are now provided. For example, as used herein, the term "heat generating component" refers to any component in a computing system that generates heat. For example, heat generating components can include processors, circuits, integrated circuits (ICs), application specific integrated circuits (ASICs), switches, transistors, field programmable gate arrays (FPGAs), antennas, receivers, memories, random access memories (RAM), dynamic random access memories (DRAM), static random access memories (SRAM), read only memories (ROM), dual in-line memory modules (DIMMs), high density memories (HDMs), energy storage devices, batteries, supercapacitors, any other heat generating component, and combinations thereof. Heat generating components that generate more heat may be associated with higher performance heat generating components. For example, faster heat generating components may generate more total heat. In some examples, smaller heat generating components may have a higher heat flux, resulting in a higher cooling rate to maintain the operating temperature.

[0021] As used herein, the term "thermally connected" refers to a connection between two components that facilitates heat transfer between the two components. Two thermally connected components can be in direct contact (e.g., without any intervening material). Two thermally connected components can have one or more thermal connectors between them. A thermal connector can be a thermally conductive material, or can be a material that facilitates heat transfer through its mass.

[0022] As used herein, a "cooling fluid" can be any fluid used in a cooling system. The cooling fluid can be used to cool heat generating components. In some embodiments, the cooling fluid is thermally connected to the heat generating components. For example, the cooling fluid can flow through one or more pipes, ducts, tubes, or other fluid transfer systems. The cooling fluid can include any type of fluid. For example, the cooling fluid can include water or water-based fluids. In some examples, the cooling fluid can include oil or oil-based fluids.

[0023] Figure 1is a representation of a computing system 100 according to at least one embodiment of the present disclosure. The computing system 100 includes a base 102. A plurality of heat generating components (collectively 104) are coupled to the base 102. In the illustrated embodiment, the computing system 100 includes a first heat generating component 104-1 and a second heat generating component 104-2. The first heat generating component 104-1 and the second heat generating component 104-2 may be different. For example, the first heat generating component 104-1 may be a processor, while the second heat generating component 104-2 may be a memory. For example, the second heat generating component 104-2 may be a high bandwidth memory (HBM).

[0024] The first heat generating component 104-1 and the second heat generating component 104-2 may consume different amounts of power, or may have different power consumptions. In some cases, the power consumption may be related to the heat generation of the heat generating component. For example, a higher power consumption may be associated with a higher heat generation, while a lower power consumption may be associated with a lower heat generation. In some embodiments, the first heat generating component 104-1 and the second heat generating component 104-2 have different heat generations. For example, the first heat generating component 104-1 may generate more or less heat than the second heat generating component 104-2. In some examples, the first heat generating component 104-1 and the second heat generating component 104-2 may consume the same amount of power, while the first heat generating component 104-1 generates a different amount of heat from the second heat generating component 104-2.

[0025] A computing device may have an operating temperature. At a temperature above the operating temperature, the computing device may operate at a lower efficiency, be damaged, have a shorter service life, be destroyed, experience other damages, and combinations thereof. To maintain the heat generating components at or below the operating temperature, the computing system 100 may include a cooling system 106. The cooling system 106 may provide cooling for the computing system 100.

[0026] The cooling system 106 may include a cold plate 108. The cold plate 108 may include a plurality of zones (collectively 110). In the illustrated embodiment, the cold plate 108 includes a first zone 110-1 and a second zone 110-2. The zones 110 of the cold plate 108 may be associated with or thermally connected to different heat generating components 104. For example, the first zone 110-1 may be thermally connected to the first heat generating component 104-1, while the second zone 110-2 may be thermally connected to the second heat generating component 104-2. In this way, the first heat generating component 104-1 may transfer heat to the first zone 110-1 of the cold plate 108, and the second heat generating component 104-2 may transfer heat to the second zone 110-2 of the cold plate 108. The cold plate 108 may remove the transferred heat from the computing system 100, thereby cooling the heat generating components 104.

[0027] The cooling system 106 may be a fluid-cooled cooling system 106. For example, the cold plate 108 may have a cooling fluid flowing through the cold plate 108. The cooling fluid may absorb the heat transferred by the heat generating component 104, thereby warming the cooling fluid. As the warmed cooling fluid flows through the cold plate 108, the warmed cooling fluid may remove heat from the cold plate 108 and away from the computing system 100. This may help cool the heat generating components 104. In some embodiments, the temperature of the cooling fluid is associated with the cooling capacity of the cooling system 106. For example, a cooler cooling fluid may absorb more heat from the heat generating component 104, or have a higher cooling capacity.

[0028] Traditionally, the computing system 100 may include a single cold plate 108 having a single zone. This may cool all of the heat generating components 104 to the same temperature. For example, the cold plate 108 may have the same cooling fluid flowing through the cold plate 108 at the same temperature. An operator may prepare the cold plate 108 with a cooling capacity based on the heat generating component 104 that generates the most heat. This may cause one or more of the heat generating components 104 to be cooled below their operating temperature. Cooling the heat generating component 104 below its operating temperature may increase the cooling operating cost of the computing system 100.

[0029] In accordance with at least one embodiment of the present disclosure, the different zones 110 of the cold plate 108 may cool each of the heat generating components 104 to its operating temperature. For example, the first zone 110-1 may cool the first heat generating component 104-1 to a first operating temperature, while the second zone 110-2 may cool the second heat generating component 104-2 to a second operating temperature. The first operating temperature of the first heat generating component 104-1 may be different from the second operating temperature of the second heat generating component 104-2. This may help reduce the cooling operating cost.

[0030] As discussed herein, the cold plate 108 can allow a cooling fluid to flow through the cold plate 108 to cool the heat generating component 104. In the illustrated embodiment, different flows of the cooling fluid flow through each of the regions 110 in the flow-through region 110. For example, a first flow of a first cooling fluid flows through the first region 110-1, while a second flow of a second cooling fluid flows through the second region 110-2. The first flow of the first cooling fluid can flow into the first region 110-1 through the first inlet 112-1 and flow out of the first region 110-1 through the first outlet 114-1. The second flow of the second cooling fluid can flow into the second region 110-2 through the second inlet 112-2 and flow out of the second region 110-2 through the second outlet 114-2.

[0031] The first inlet 112-1 can be fluidly connected to a first cooling fluid source, and the second outlet 114-2 can be fluidly connected to a second cooling fluid source. This can allow the first cooling fluid to have a different cooling capacity than the second cooling fluid. For example, the first cooling fluid can have a different temperature than the second cooling fluid. In some examples, the first cooling fluid can be of a different type than the second cooling fluid. In some examples, the first cooling fluid can flow through the first region 110-1 at a different flow rate (e.g., volumetric flow rate, fluid velocity, fluid pressure) than the second cooling fluid flows through the second region 110-2.

[0032] The cooling capacity of the region 110 can be based on the heat generation of the heat generating component 104. For example, compared to the second heat generating component 104-2, the first heat generating component 104-1 can generate less heat and / or have a higher operating temperature. The cooling capacity of the first region 110-1 can have a lower cooling capacity than the second region 110-2. For example, the first cooling fluid can have a higher temperature than the second cooling fluid. In some examples, the second cooling fluid can be refrigerated. The first cooling fluid can be unrefrigerated (e.g., the first cooling fluid can be unrefrigerated), or can be refrigerated to a lower temperature than the second cooling fluid. In some examples, the first cooling fluid can be tap water, process water, wastewater from other applications, provided from another unrefrigerated fluid source, and combinations thereof. The process of refrigerating the cooling fluid can be expensive, and using an unrefrigerated cooling fluid can help reduce the cooling operating cost. In some embodiments, using an unrefrigerated cooling fluid for a heat generating component 104 with lower heat generation and / or higher operating temperature can reduce the cooling operating cost of the computing system 100 by up to 3 times.

[0033] The first heat generating component 104-1 may have a first operating temperature, and there is a temperature difference between the first operating temperature and the second operating temperature of the second heat generating component 104-2. In some embodiments, the temperature difference may be within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, including any of 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, or any value therebetween. For example, the temperature difference may be greater than 5°C. In another example, the temperature difference may be less than 70°C. In still other examples, the temperature difference may be any value within the range between 5°C and 70°C. In some embodiments, a temperature difference of about 25°C may be crucial to increase cost savings by utilizing different cooling fluids in different domains 110.

[0034] The first cooling fluid may have a first cooling temperature, and there is a cooling fluid temperature difference between the first cooling temperature and the second cooling temperature of the second cooling fluid. In some embodiments, the temperature difference may be within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, including any of 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, or any value therebetween. For example, the cooling fluid temperature difference may be greater than 5°C. In another example, the cooling fluid temperature difference may be less than 70°C. In still other examples, the cooling fluid temperature difference may be any value within the range between 5°C and 70°C. In some embodiments, a cooling fluid temperature difference of about 20°C may be crucial to increase cost savings by utilizing different cooling fluids in different domains 110.

[0035] According to at least one embodiment of the present disclosure, the first domain 110-1 may be isolated from the second domain 110-2. For example, the first domain 110-1 may not be thermally connected to the second domain 110-2. The first domain 110-1 may be separated from the second domain 110-2 by a thermal partition 116. The thermal partition 116 may thermally separate the first domain 110-1 from the second domain 110-2. This may help reduce or prevent heat transfer between the first domain 110-1 and the second domain 110-2. For example, the first cooling temperature of the first cooling fluid in the first domain 110-1 may be greater than the second cooling temperature of the second cooling fluid in the second domain 110-2. The heat of the first cooling fluid may be transferred to the second domain 110-2, thereby reducing the cooling efficiency of the second domain 110-2. The thermal partition 116 may reduce or prevent heat transfer between the domains 110. In this way, the temperature difference and / or the cooling fluid temperature difference may be greater, and / or have a lower impact on the cooling capacity of the cooling system 106. This may help further reduce the cooling operation cost by allowing a greater temperature difference and / or cooling temperature difference.

[0036] Figure 2 It is a schematic representation of a side view of a cooling system 200 according to at least one embodiment of the present disclosure. The illustrated cooling system 200 includes a base 202, heat generating components (collectively 204), and a cooling system 206 thermally connected to the heat generating components 204. The cooling system 206 includes a cold plate 208 having a plurality of domains (collectively 210). The cold plate 208 includes a first domain 210-1 thermally connected to a first heat generating component 204-1 and a second domain 210-2 thermally connected to a second heat generating component 204-2. A first cooling fluid may flow through a first channel 218-1 in the first domain 210-1, while a second cooling fluid may flow through a second channel 218-2 in the second domain 210-2.

[0037] As discussed herein, the first heat generating component 204-1 may have a different heat generation and / or operating temperature than the second heat generating component 204-2. To cool the heat generating components 204, the first cooling capacity of the first domain 210-1 may be different from the second cooling capacity of the second domain 210-2. For example, the first cooling temperature of the first cooling fluid in the first channel 218-1 may be different from the second cooling temperature of the second cooling fluid in the second channel 218-2. This may result in a different temperature between the first domain 210-1 and the second domain 210-2.

[0038] The different temperatures between the domains 210 may cause heat transfer between the domains 210. This may reduce the effectiveness of the domain 210 with the higher cooling capacity. For example, heat transfer between the domains 210 may increase the temperature of the domain 210 with the lower cooling temperature.

[0039] According to at least one embodiment of the present disclosure, the first domain 210-1 may be thermally isolated from the second domain 210-2 using a thermal barrier 216. The thermal barrier 216 may reduce or prevent heat transfer between the domains 210. For example, the thermal barrier 216 may reduce or prevent heat transfer from the warmer portion of the domain 210 to the cooler portion of the domain 210. This may help improve the cooling effectiveness of the cooler portion of the domain 210.

[0040] The thermal barrier 216 may be made of an insulating material. The insulating material of the thermal barrier 216 may be any type of insulating material. For example, the insulating material may include ceramic materials, metals (e.g., copper, steel, stainless steel), metal alloys, liquids, gases (e.g., air, nitrogen), silica glass, carbon fiber, fiberglass mesh, neoprene, any other insulating material having a medium to high thermal resistance value, and combinations thereof. In some embodiments, the thermal barrier 216 may be formed of multiple insulating materials. For example, the thermal barrier 216 may be formed of layers and / or composites of insulating materials.

[0041] In some embodiments, a thermal break 216 can be formed in the thermal gap. The thermal gap can have a gap width 220. Generally, a smaller distance between two heat generating components can result in more heat transfer between the heat generating components. When a first heat generating component having a higher operating temperature is adjacent to a second heat generating component having a lower operating temperature, the heat from the first heat generating component can raise the temperature of the second heat generating component, which may reduce the operation of the second heat generating component. In other words, a larger distance between the two heat generating components is desirable. However, as can be understood, the proximity of the heat generating component 204 and its associated domain 210 can be based on the geometry of the computing device.

[0042] The gap width 220 of the thermal gap can be the distance between a first domain 210-1 and a second domain 210-2. In some embodiments, the size of the gap width 220 can be determined based on the size of the cooling system 200. For example, the gap width 220 can be the width between a first heat generating component 204-1 and a second heat generating component 204-2. In some embodiments, the gap width 220 can be less than the distance between the first heat generating component 204-1 and the second heat generating component 204-2. In some embodiments, the gap width 220 can be within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, including any of 0.8mm, 0.9mm, 1.0mm, 1.5mm, 2.0mm, or any value therebetween. For example, the gap width 220 can be greater than 0.8mm. In another example, the gap width 220 can be less than 2.0mm. In other examples, the gap width 220 can be any value within the range between 0.8mm and 2.0mm. In some embodiments, it may be crucial for the gap width 220 of the thermal gap to be 1mm or less to allow the domains 210 to be positioned adjacent to each other while individually cooling the heat generating components 204. In some embodiments, the gap width 220 of the thermal gap can be completely filled with an insulating material. In some embodiments, the gap width 220 of the thermal gap can be partially filled with an insulating material.

[0043] The heat generating components 204 have a component distance 221 therebetween. For example, the first heat generating component 204-1 may be separated from the second heat generating component 204-2 by the component distance 221. In some embodiments, the component distance 221 may be within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, including any of 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.5 mm, 2.0 mm, or any value therebetween. For example, the component distance 221 may be greater than 0.1 mm. In another example, the component distance 221 may be less than 2.0 mm. In some examples, the component distance 221 may be greater than 2.0 mm. In other additional examples, the component distance 221 may be any value within the range between 0.1 mm and 2.0 mm. In some embodiments, it may be crucial for the component distance 221 to be 1 mm or less to allow the domains 210 to be positioned adjacent to each other while separately cooling the heat generating components 204. As discussed herein, in some embodiments, the component distance 221 may be the same as the gap width 220. In some embodiments, the component distance 221 may be greater than the gap width 220. In some embodiments, the component distance 221 may be less than the gap width 220.

[0044] The domains 210 have a thermal gradient therebetween. The thermal gradient may have a temperature difference that varies with distance. In some embodiments, the thermal gradient may be within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, including any of 5 °C / mm, 10 °C / mm, 15 °C / mm, 20 °C / mm, 25 °C / mm, 30 °C / mm, 35 °C / mm, 40 °C / mm, 45 °C / mm, 50 °C / mm, 55 °C / mm, 60 °C / mm, 65 °C / mm, 70 °C / mm, 75 °C / mm, 80 °C / mm, 85 °C / mm, or any value therebetween. For example, the thermal gradient may be greater than 5 °C / mm. In another example, the thermal gradient may be less than 85 °C / mm. In other additional examples, the thermal gradient may be any value between 5 °C / mm and 85 °C / mm. In some embodiments, it may be crucial for the thermal gradient to be greater than 30 °C / mm to increase the cost savings in cooling operation by utilizing different cooling capabilities for different domains 210.

[0045] The thermal barrier 216 has a thermal resistance. The thermal resistance can be the resistance to heat transfer of the thermal barrier 216. For example, the thermal resistance can be the resistance to heat transfer across the thermal barrier 216 between the first domain 210-1 and the second domain 210-2. In some embodiments, the thermal resistance can be within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, including any of 0.001 w / mk, 0.005 w / mk, 0.01 w / mk, 0.02 w / mk, 0.03 w / mk, 0.04 w / mk, 0.05 w / mk, 0.06 w / mk, 0.07 w / mk, 0.08 w / mk, 0.09 w / mk, 0.10 w / mk, or any value therebetween. For example, the thermal resistance can be greater than 0.001°w / mk. In another example, the thermal resistance can be less than 0.10 w / mk. In other examples, the thermal resistance can be any value within the range of 0.001°w / mk to 0.10 w / mk. In some embodiments, a thermal resistance of approximately 0.01 w / mk can be crucial to reduce the heat flow between the domains 210.

[0046] In some embodiments, the domains 210 are physically connected. For example, the first domain 210-1 can be physically connected to the second domain 210-2. For example, the first domain 210-1 can be connected to the second domain 210-2 using one or more mechanical fasteners (such as screws, bolts, or mechanical fixtures). In some examples, the first domain 210-1 can be connected to the second domain 210-2 using an adhesive. In some examples, the first domain 210-1 can be connected to the second domain 210-2 using a brazing connection. In some examples, the first domain 210-1 can be connected to the second domain 210-2 using any type of connection.

[0047] In some embodiments, the domains 210 can be connected by the thermal barrier 216. For example, the first domain 210-1 can be connected to the thermal barrier 216, while the second domain 210-2 can be connected to the thermal barrier 216. The domains 210 can be connected to the thermal barrier 216 in any manner. For example, the first domain 210-1 and the second domain 210-2 can be connected to the thermal barrier 216 using mechanical fasteners, adhesives, brazing connections, any other type of connection, and combinations thereof. In some examples, the first domain 210-1 and the second domain 210-2 can be connected to the thermal barrier 216 using the same type of connection. In some examples, the first domain 210-1 and the second domain 210-2 can be connected to the thermal barrier 216 using different types of connections.

[0048] In some embodiments, domain 210 is not physically connected. For example, domain 210 can be independently connected to the cooling system 200. In some embodiments, domain 210 abuts the thermal partition 216 without being physically connected. This can allow for relative movement between one or more of the first domain 210-1, the second domain 210-2, and the thermal partition 216, such as a change in magnitude based on differences in thermal expansion. In some embodiments, the thermal partition 216 can be air, and the domains 210 can be separated without contact, but rather by an air gap. This can allow for relative movement between the first domain 210-1 and the second domain 210-2, such as a change in magnitude based on differences in thermal expansion.

[0049] In accordance with at least one embodiment of the present disclosure, the cooling system 200 can include a first domain 210-1 and a second domain 210-2 separated by a gap width 220 of less than 1 mm. The component distance 221 between the first heat generating component 204-1 and the second heat generating component 204-2 can be less than 1 mm. The temperature difference between the first heat generating component 204-1 and the second heat generating component 204-2 can be greater than 50 °C. The fluid difference between the first cooling fluid of the first domain 210-1 and the second cooling fluid of the second domain 210-2 can be greater than 50 °C. The thermal gradient between the first domain 210-1 and the second domain 210-2 can be greater than 1 °C / mm. This can help allow the domains 210 to provide separate cooling for their respective heat generating components 204.

[0050] Figure 3-1 is a schematic representation of a top-down view of a cooling system 300 in accordance with at least one embodiment of the present disclosure. The illustrated cooling system 300 includes a base 302, heat generating components (collectively 304), and a cooling system 306 thermally connected to the heat generating components 304. The cooling system 306 includes a cold plate 308 having a plurality of domains (collectively 310). The cold plate 308 includes a first domain 310-1 thermally connected to the first heat generating component 304-1 and a second domain 310-2 thermally connected to the second heat generating component 304-2. A first cooling fluid can flow through a first channel 318-1 in the first domain 310-1, while a second cooling fluid can flow through a second channel 318-2 in the second domain 310-2. The first domain 310-1 and the second domain 310-2 can be separated by a thermal partition 316.

[0051] The cold plate 308 is fixed to the heat generating component 304 and / or the base 302. The cold plate 308 can be fixed to the heat generating component 304 and / or the base 302 in any manner. In the illustrated embodiment, the cold plate 308 is connected to the base 302 using a bolt connection 322 that includes mechanical fasteners 324. The mechanical fasteners 324 can include any type of mechanical fastener. For example, the mechanical fasteners 324 can include bolts, screws, posts, pins, any other mechanical fastener, and combinations thereof.

[0052] The bolt connection 322 can include a plurality of mechanical fasteners 324. As discussed herein, the cold plate 308 can be a single structure that includes a first domain 310-1 and a second domain 310-2. For example, the cold plate 308 can include a chassis to which the domains 310 are connected. The chassis can be fixed to the base 302 using the bolt connection 322. In some embodiments, a single bolt connection 322 can fix the cold plate 308 and the chassis of the cold plate 308, including the first domain 310-1 and the second domain 310-2, to the base 302. In some embodiments, the domains 310 are connected to the base 302 individually. For example, the first domain 310-1 can include a first set of mechanical fasteners 324. The first set of mechanical fasteners 324 can fix the first domain 310-1 to the base 302. In some examples, the second domain 310-2 can include a second set of mechanical fasteners 324. The second set of mechanical fasteners 324 can fix the second domain 310-2 to the base 302 independently of the first domain 310-1. Fixing the first domain 310-1 and the second domain 310-2 to the base 302 individually can help reduce the stress and / or strain on the cold plate 308 caused by differential thermal expansion and / or contraction of the domains 310.

[0053] Figure 3-2 is Figure 3-1 A schematic side view of the cooling system 300. As can be seen, the mechanical fasteners 324 can fix the domains 310 to the base 302. For example, the mechanical fasteners 324 can extend from the domains 310 into the base 302. The mechanical fasteners 324 can be tightened to fix the cold plate 308 to the base 302. This can help prevent movement of the cold plate 308 during operation of the cooling system 300.

[0054] Figure 4-14 is a schematic representation of a top-down view of a cooling system 400 according to at least one embodiment of the present disclosure. The cooling system 400 shown includes a base 402, a heat generating component (collectively referred to as 404), and a cooling system 406 thermally connected to the heat generating component 404. The cooling system 406 includes a cold plate 408 having multiple domains (collectively referred to as 410). The cold plate 408 includes a first domain 410-1 thermally connected to a first heat generating component 404-1 and a second domain 410-2 thermally connected to a second heat generating component 404-2. A first cooling fluid can flow through a first channel 418-1 in the first domain 410-1, and a second cooling fluid can flow through a second channel 418-2 in the second domain 410-2. The first domain 410-1 and the second domain 410-2 can be separated by a thermal isolation 416.

[0055] The cold plate 408 can be connected or secured to the heat generating assembly 404 and / or the base 402 using a fixture 426. The fixture 426 can include one or more plate supports 428. The plate supports 428 can support the cold plate 408 and connect the cold plate 408 to the base 402. For example, the one or more plate supports 428 can include a rail on which the cold plate 408 can slide. In some examples, the one or more plate supports 428 can include a snap-fit ​​connection, a friction fit connection, an interference fit connection, any other type of connection, and combinations thereof.

[0056] In some embodiments, the cold plate 408 includes a chassis to which the first domain 410-1 and the second domain 410-2 are connected. The chassis of the cold plate 408 can be fixed to the base 402 using a fixture 426. In some embodiments, the first domain 410-1 and the second domain 410-2 are independently fixed to the base 402 using separate fixtures 426. For example, the first domain 410-1 can include a first board support 428. The first board support 428 can fix the first domain 410-1 to the base 402. In some examples, the second domain 410-2 can include a second board support 428. The second board support 428 can fix the second domain 410-2 to the base 402 independently of the first domain 410-1. Separately fixing the first domain 410-1 and the second domain 410-2 to the base 402 can help reduce stress and / or strain on the cold plate 408 caused by differential thermal expansion and / or contraction of the domains 410.

[0057] Figure 4-2 yes Figure 4-1Schematic side view of the cooling system 400. As can be seen, the plate support 428 can fix the domain 410 to the base 402. For example, the plate support 428 can extend from the domain 410 into the base 402. During assembly, the cold plate 408 can be connected to the plate support 428, such as by sliding the cold plate 408 onto the plate support 428, snapping the cold plate 408 onto the plate support 428, or otherwise connecting the cold plate 408 to the base 402.

[0058] Figure 5 Is a schematic representation of a top-down view of a cooling system 500 according to at least one embodiment of the present disclosure. The illustrated cooling system 500 includes a base 502, a plurality of heat generating components (collectively 504), and a cooling system 506 thermally connected to the heat generating components 504. The cooling system 506 includes a cold plate 508 having a plurality of domains (collectively 510). The domains 510 can be thermally connected to the heat generating components 504. A cooling fluid can flow through the domains 510 of the cold plate 508. The domains 510 can be separated by thermal partitions (collectively 516).

[0059] In the illustrated embodiment, the cooling system 500 includes a first heat generating component 504-1, a second heat generating component 504-2, and a third heat generating component 504-3. The heat generating components 504 can have different heat generations. For example, at least two of the first heat generating component 504-1, the second heat generating component 504-2, and the third heat generating component 504-3 can have different heat generations.

[0060] The cold plate 508 can include a plurality of domains 510. The first domain 510-1 can be thermally connected to the first heat generating component 504-1, the second domain 510-2 can be thermally connected to the second heat generating component 504-2, and the third domain 510-3 can be thermally connected to the third heat generating component 504-3. Although Figure 5 Three types of heat generating components 504 and three domains 510 are shown, it should be understood that the cooling system 500 can include any number of heat generating components 504 and / or domains 510. In some embodiments, the number of domains 510 is equal to the number of heat generating components 504. In some embodiments, the number of domains 510 is different from the number of heat generating components 504. For example, a single domain 510 can cover multiple heat generating components 504.

[0061] As discussed herein, the domains 510 can be thermally separated by the thermal partitions 516. For example, the first domain 510-1 and the second domain 510-2 can be thermally separated by the first thermal partition 516-1, while the second domain 510-2 and the third domain 510-3 can be thermally separated by the second thermal partition 516-2. This can help isolate the domains 510 from each other's cooling systems or cooling fluids.

[0062] As discussed herein, a cooling fluid can flow through the cold plate 508. In some embodiments, each domain has a separate fluid path. For example, a first fluid flow of a first cooling fluid can flow from a first inlet 512-1 through a first domain 510-1 to a first outlet 514-1. A second fluid flow of a second cooling fluid can flow from a second inlet 512-2 through a second domain 510-2 to a second outlet 514-2. A third fluid flow of a third cooling fluid can flow from a third inlet 512-3 through a third domain 510-3 to a third outlet 514-3.

[0063] As discussed herein, the cooling fluid can have different cooling fluid temperatures. The cooling fluid can originate from different sources (collectively referred to as 530) or fluid tanks. For example, a first cooling fluid can originate from a first fluid source 530-1, a second cooling fluid can originate from a second fluid source 530-2, and a third cooling fluid can originate from a third fluid source 530-3. Different fluid sources 530 can cause the inlets 512 of the domains 510 to be fluidly separated. For example, the first inlet 512-1, the second inlet 512-2, and the third inlet 512-3 can be fluidly separated. Fluidly separated inlets 512 may not have any hydraulic path between them to allow the cooling fluid to flow from one inlet to another.

[0064] In some embodiments, two or more of the domains 510 can have a cooling fluid originating from the same fluid source 530 that flows through two or more of the domains 510. For example, the first domain 510-1 and the third domain 510-3 can have a cooling fluid from the same fluid source 530. This can cause the inlets 512 to be fluidly connected.

[0065] The fluid can be transferred from the fluid source 530 to the cold plate 508. For example, the fluid can pass through a pipe 532 from the fluid source 530 to the cold plate 508. In some embodiments, the cooling fluid can be recycled. For example, the cooling fluid can be transferred into the cold plate 508. Heat transfer from the heat generating component 504 can warm the cooling fluid, and the warmed cooling fluid can return to the fluid source 530 through the pipe 532. In some embodiments, the warmed cooling fluid can be refrigerated or cooled before the cooling fluid is recycled through the cold plate 508. For example, the fluid source 530 can include a refrigerator that can cool the fluid to a cooling temperature. In some examples, the refrigerator can be separate from the fluid source 530.

[0066] In some embodiments, the cooling fluid is not recycled. For example, the warmed cooling fluid can be discarded, redirected to another process, or otherwise not recycled after exiting the cold plate 508.

[0067] As discussed herein, utilizing different fluid sources 530 can allow the cooling system 506 to use a fluid source customized according to the heat generation of the heat generation component 504 in the associated domain. For example, a heat generation component 504 having a higher operating temperature and / or lower heat generation can be cooled by a cooling fluid having a higher cooling temperature. In some embodiments, one or more of the fluid sources 530 may not include a refrigerator. For example, tap water and / or other unrefrigerated process water can be used to cool a heat generation component 504 having a higher operating temperature. In some embodiments, the unrefrigerated cooling fluid used in a particular domain 510 may include warmed cooling fluid from another domain 510. Such unrefrigerated cooling fluid can reduce the cooling operating cost. In some embodiments, by utilizing unrefrigerated cooling fluid, the cooling operating cost can be reduced by 3 times or more.

[0068] Figure 6 FIG. 640 is a flow chart of a method 640 for cooling a computing system according to at least one embodiment of the present disclosure. At 642, the cooling system can supply a first cooling fluid to a first domain of the cold plate. The first domain can be thermally connected to a first heat generation component of the computing device. The first heat generation component can have a first power consumption, operating temperature, heat generation, and combinations thereof. At step 644, the cooling system can supply a second cooling fluid to a second domain of the cold plate. The second domain can be thermally connected to a second heat generation component of the computing device. The second heat generation component can have a second power consumption, operating temperature, heat generation, and combinations thereof that are different from those of the first heat generation component.

[0069] At step 646, the cooling system can maintain a thermal gradient across the thermal partition between the first domain and the second domain. The thermal gradient is located across a thermal gap of 1 mm or less between the first domain and the second domain. As discussed herein, maintaining the thermal gradient can help allow the first domain and the second domain of the cold plate to have different cooling capabilities.

[0070] One or more specific embodiments of the present disclosure are described herein. These described embodiments are examples of the technology disclosed herein. In addition, in order to provide a brief description of these embodiments, not all features of the actual embodiments may be described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions will be made to achieve the developer's specific goals, such as complying with system-related and business-related constraints, which may vary from embodiment to embodiment. In addition, it should be appreciated that such development operations may be complex and time-consuming, but would still be routine operations of design, fabrication, and manufacture for those of ordinary skill in the art who benefit from the present disclosure.

[0071] The terms "a", "an", and "the" are intended to mean that there is one or more of the elements in the foregoing description. The terms "comprising", "including", and "having" are intended to be inclusive and mean that additional elements may exist in addition to the listed elements. Further, it should be understood that references to "one embodiment" or "an embodiment" of the present disclosure are not to be construed as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described herein with respect to an embodiment can be combined with any element of any other embodiment described herein. As would be appreciated by one of ordinary skill in the art in the field covered by the embodiments of the present disclosure, the numbers, percentages, ratios, or other values recited herein are intended to include that value, as well as other values that are "about" or "approximately" the recited value. Accordingly, the recited values should be interpreted broadly enough to encompass at least values that are sufficiently close to the recited values to perform the desired function or achieve the desired result. The recited values include at least the variations expected in a suitable manufacturing or production process and can include values within 5%, 1%, 0.1%, or 0.01% of the recited value.

[0072] Those skilled in the art will recognize that, given the present disclosure, equivalent structures do not depart from the spirit and scope of the present disclosure, and various changes, substitutions, and alterations can be made to the embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent structures, including functional "means-plus-function" clauses, are intended to cover structures described herein as performing the recited function, including both structural equivalents that operate in the same manner and equivalent structures that provide the same function. The applicant's express intent is that, except for claims in which the phrase "means for" appears in conjunction with the associated function, no means-plus-function or other functional claims are invoked in any claim. Any additions, deletions, and modifications to the embodiments that fall within the meaning and scope of the claims are to be encompassed by the claims.

[0073] As used herein, the terms "about", "approximately", and "substantially" denote an amount that is close to the recited amount and that can still perform the desired function or achieve the desired result. For example, "about", "approximately", and "substantially" can refer to an amount that is within less than 5%, less than 1%, less than 0.1%, and less than 0.01% of the recited amount. Further, it should be understood that any direction or frame of reference in the foregoing description is merely a relative direction or movement. For example, any reference to "up" and "down" or "above" or "below" is merely a description of the relative position or movement of the relevant elements.

[0074] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered illustrative rather than restrictive. Accordingly, the scope of the present disclosure is indicated by the appended claims rather than by the foregoing description. Changes within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A cold plate for use on a computing device, comprising: a first domain having a first inlet and a first outlet; a second domain having a second inlet and a second outlet; and a thermal barrier between the first domain and the second domain, the thermal barrier including a thermal gap that separates the first domain and the second domain by 1 mm or less.

2. The cold plate according to claim 1, wherein the thermal gap is filled with air.

3. The cold plate according to claim 1 or claim 2, wherein the thermal gap includes a ceramic material.

4. The cold plate according to any one of claims 1 to 3, wherein the thermal gap includes stainless steel.

5. The cold plate according to any one of claims 1 to 4, wherein the cold plate includes a chassis, and wherein the first domain and the second domain are connected to the chassis.

6. The cold plate according to any one of claims 1 to 5, wherein the first inlet and the second inlet are fluidly separated.

7. The cold plate according to claim 6, wherein the first inlet and the second inlet have different fluid sources.

8. The cold plate according to claim 7, wherein the fluid source among the different fluid sources includes a refrigerator.

9. The cold plate according to any one of claims 1 to 8, wherein the first domain and the second domain are fixed to the thermal barrier.

10. A computing system, comprising: a plurality of heat generating components fixed to a base, each heat generating component among the plurality of heat generating components having different heat generation; and a cold plate including: a plurality of domains, each domain associated with a heat generating component among the plurality of heat generating components; and a thermal barrier between two domains among the plurality of domains, the thermal barrier including an insulating material.

11. The computing system according to claim 10, wherein the base includes a fixing device, and the plurality of domains are fixed to the base at the fixing device.

12. The computing system according to claim 10 or claim 11, wherein the plurality of heat generating components comprise: a first heat generating component having a first operating temperature; a second heat generating component having a second operating temperature different from the first operating temperature; and wherein the plurality of domains include: a first domain thermally connected to the first heat generating component, the first domain having a first cooling capacity; and a second domain thermally connected to the second heat generating component, the second domain having a second cooling capacity different from the first cooling capacity.

13. The computing system according to claim 12, wherein the thermal barrier maintains a thermal gradient greater than 30 °C / mm.

14. The computing system according to claim 12 or claim 13, wherein the first domain is connected to a first fluid source and the second domain is connected to a second fluid source.

15. The computing system according to claim 14, wherein the first fluid source is unrefrigerated.

16. The computing system of any one of claims 12 to 15, wherein the first cooling capacity maintains the first heat generating component at the first operating temperature while the second cooling capacity maintains the second heat generating component at the second operating temperature.

17. The computing system of any one of claims 12 to 16, wherein the first heat generating component comprises a high bandwidth memory.

18. A method for cooling a computing device, include: providing a first cooling fluid to a first domain of a cold plate, the first domain being thermally connected to a first heat generating component; providing a second cooling fluid to a second domain of the cold plate, the second domain being thermally connected to a second heat generating component; as well as A thermal gradient is maintained across a thermal break between the first domain and the second domain, the thermal gradient being located at a thermal gap of 1 mm or less between the first domain and the second domain.

19. The method of claim 18, wherein providing the first cooling fluid comprises providing the first cooling fluid from an unrefrigerated fluid source.

20. The method of claim 18 or claim 19, wherein maintaining the thermal gradient comprises maintaining the thermal gradient greater than 30°C.

Images