Method for using a substrate back grinding protection device

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and provides a method for using a substrate back grinding protection device, wherein a substrate back grinding protection device is disclosed, comprising a bracket for supporting a substrate, the bracket comprising a frame body, a bracket groove being provided on the top surface of the frame body, the side surface of the bracket being in contact with the side surface of the substrate, a through hole being provided on the bottom surface of the frame body, the through hole being connected to the bracket groove, and a sealing cover for sealing the through hole, the sealing cover comprising a cover body, the top surface of the cover body being in contact with the bottom surface of the frame body; in addition, a method for using a substrate back grinding protection device is provided, applicable to a substrate back grinding protection device, including a substrate loading method and a substrate disassembly method. The present invention can improve production efficiency, provide more comprehensive protection for the substrate, require low precision equipment, and is simple to operate. The temporary protective film produced can be easily peeled off from the substrate and is not prone to residue.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method for using a substrate back grinding protection device. Background Art

[0002] With the increasing application of semiconductor chips and display glass, improving yield and reliability and avoiding damage to the substrate during processing have gradually become the focus of industry attention.

[0003] To address these issues, a temporary protective film is typically formed on the substrate surface and removed after processing. This temporary protective film must meet the following requirements: a certain degree of hardness and minimal thickness variation; it must be formed quickly within the automated production line's cycle time; and after processing, it must be easily peeled off the substrate without damaging or contaminating it.

[0004] The coating composition using polyvinyl chloride resin slurry and plasticizer used in the prior art can provide certain protection for the substrate, but it still has some problems, such as low production efficiency, incomplete protection, high equipment precision requirements, complex operation, difficulty in peeling, and easy residue.

[0005] Therefore, the existing wafer back grinding protection device and method still need to be improved. Summary of the Invention

[0006] In response to the above-mentioned technical problems, a method for using a substrate back grinding protection device is provided.

[0007] The technical means adopted in the present invention are as follows:

[0008] A method for using a substrate back grinding protection device is implemented based on a substrate back grinding protection device, wherein the substrate back grinding protection device comprises: a bracket; used for supporting a substrate, the bracket comprising a frame body, a bracket groove being formed on the top surface of the frame body, the side surface of the bracket being in contact with the side surface of the substrate, and a through hole being formed on the bottom surface of the frame body, the through hole being connected to the bracket groove; a sealing cover; used for sealing the through hole, the sealing cover comprising a cover body, the top surface of the cover body being in contact with the bottom surface of the frame body; the substrate comprising a wafer and display glass; the material of the bracket and the material of the sealing cover both comprising an acrylate polymer; and a substrate loading method A comprising the following steps:

[0009] SA1: The top surface of the cover is aligned with the bottom surface of the frame, and the cover seals the through hole.

[0010] SA2: Inject shadowless adhesive into the bracket and through-hole, then place the substrate into the bracket, with the side of the bracket in contact with the side of the substrate, and the surface of the substrate to be processed facing upwards and directly above the bracket;

[0011] SA3: Irradiate the shadowless adhesive in the brackets and through holes with ultraviolet light from just below the cover until the shadowless adhesive in the brackets and through holes is completely cured. At this time, process the surface that needs to be processed on the substrate.

[0012] Furthermore, the method further includes a substrate disassembly method B, wherein the substrate disassembly method B includes the following steps:

[0013] SB1: Separate the top surface of the cover from the bottom surface of the frame. At this time, the cover no longer seals the through hole.

[0014] SB2: Place the frame into an alkaline solution, which will dissolve the shadowless adhesive in the brackets and through-holes.

[0015] SB3: When the shadowless adhesive in the bracket and through hole is completely dissolved, remove the substrate from the bracket.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] 1. In the present invention, when a temporary protective film needs to be formed on the surface of the substrate, the through hole is first sealed with the cover body, and then the shadowless glue is injected into the bracket and the through hole, so that the shadowless glue will not overflow from the through hole to the outside of the frame; after the injection of the shadowless glue is completed, the substrate is placed in the bracket, and at this time the side of the bracket is in contact with the side of the substrate, and the surface of the substrate to be processed faces upward and is located directly above the bracket, so that the temporary protective film produced by the present invention can provide comprehensive protection for the base without affecting the processing of the substrate; ultraviolet rays are irradiated from the bottom of the cover body to the shadowless glue in the bracket and the through hole until the shadowless glue in the bracket and the through hole is completely cured, and then the surface of the substrate to be processed can be processed; in addition, the present invention can improve production efficiency, the precision requirements of the required equipment are low, and the operation is simple.

[0018] 2. In the present invention, when the temporary protective film needs to be removed from the surface of the substrate, the cover body is first made to no longer seal the through-hole, and then the frame body is placed in an alkaline solution, so that the alkaline solution can come into contact with the shadowless adhesive in the bracket and the through-hole; when the shadowless adhesive in the bracket and the through-hole is completely dissolved, the processed substrate can be taken out of the bracket; in addition, the temporary protective film produced by the present invention can be easily peeled off from the substrate and is not likely to leave residue.

[0019] 3. In the present invention, the material of the bracket and the material of the sealing cover both include acrylic polymers, which have the advantages of good transparency, strong chemical resistance, high mechanical strength, and good resistance to ultraviolet aging. At the same time, the material has strong adaptability and the equipment can be adjusted at any time according to the raw materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] Figure 1 This is an overall structural diagram of a substrate back grinding protection device in the present invention;

[0022] Figure 2 Schematic diagram of the bracket, sealing cover, substrate, shadowless adhesive and ultraviolet light in the present invention;

[0023] Figure 3 1 is an overall flow chart of the substrate loading method A of the present invention;

[0024] Figure 4 This is an overall flow chart of the substrate disassembly method B of the present invention;

[0025] In the figure: 1- bracket; 2- sealing cover; 101- frame body; 102- bracket; 103- through hole; 201- wall body; 202- cover body. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0029] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values described in these embodiments do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0030] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0031] For ease of description, spatially relative terms such as "above," "above," "on the upper surface of," and "above" may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "on top of" another device or structure would then be positioned as "below" or "below" the other device or structure. Thus, the exemplary term "above" may include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0032] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0033] Example 1:

[0034] like Figures 1 to 3 As shown, a method for using a substrate back grinding protection device is implemented based on a substrate back grinding protection device, and the substrate back grinding protection device includes:

[0035] Bracket 1; used to support the substrate, the bracket 1 includes a frame body 101, a bracket 102 is provided on the top surface of the frame body 101, the side of the bracket 102 is in contact with the side of the substrate, and a through hole 103 is provided on the bottom surface of the frame body 101, the through hole 103 is connected to the bracket 102; sealing cover 2; used to seal the through hole 103, the sealing cover 2 includes a cover body 202, the top surface of the cover body 202 is in contact with the bottom surface of the frame body 101.

[0036] Specifically, the frame 101 , the bracket 102 and the through hole 103 are all cylindrical structures. There are a plurality of through holes 103 , and all of the through holes 103 are evenly distributed and opened on the bottom surface of the frame 101 .

[0037] In addition, the cover body 202 is a cylindrical structure, and the sealing cover 2 also includes a wall body 201, which is a circular ring structure. The inner diameter of the wall body 201 is equal to the diameter of the frame body 101, and the outer diameter of the wall body 201 is equal to the diameter of the cover body 202. The bottom surface of the wall body 201 is coaxial and fixedly installed on the top surface of the cover body 202; when the top surface of the cover body 202 is in contact with the bottom surface of the frame body 101, the side surface of the frame body 101 is in contact with the inner surface of the wall body 201, thereby limiting the frame body 101.

[0038] The substrate includes a wafer and a display glass; the material of the bracket 1 and the material of the sealing cover 2 both include acrylic polymer.

[0039] Specifically, the material of the bracket 1 and the material of the sealing cover 2 only need to meet the requirements of good transparency, strong chemical resistance, high mechanical strength, and good resistance to ultraviolet aging, and are not limited to acrylic polymers; good transparency, strong optical properties and certain resistance to ultraviolet aging, so that the bracket 1 and the sealing cover 2 will not be affected by the material itself during the process of curing the shadowless adhesive (i.e., UV adhesive) by irradiating ultraviolet rays (i.e., UV light); good chemical resistance, so that the bracket 1 and the sealing cover 2 will not be corroded during the process of soaking the cured shadowless adhesive (i.e., UV adhesive) in an alkaline solution for degumming, and can be recycled; high mechanical strength and hardness, so that the bracket 1 and the sealing cover 2 will not be deformed or damaged due to external force during the processing of the substrate.

[0040] In addition, the material of the bracket 1 and the sealing cover 2 must also meet the requirements of being solvent-free, volatile-free, and non-polluting to the ambient air.

[0041] The method comprises a substrate loading method A, wherein the substrate loading method A comprises the following steps:

[0042] SA1: The top surface of the cover 202 is aligned with the bottom surface of the frame 101 . The cover 202 seals the through hole 103 .

[0043] SA2: Inject shadowless glue (i.e., UV glue) into the bracket 102 and the through hole 103, and then place the substrate into the bracket 102. At this time, the side of the bracket 102 is in contact with the side of the substrate, and the surface of the substrate to be processed faces upward and is located directly above the bracket 102.

[0044] SA3: Expose ultraviolet light (i.e., UV light) to the shadowless adhesive (i.e., UV adhesive) in the bracket 102 and the through hole 103 from directly below the cover 202 until the shadowless adhesive (i.e., UV adhesive) in the bracket 102 and the through hole 103 is completely cured. At this time, the surface that needs to be processed on the substrate is processed (i.e., grinding, polishing, etching, etc.).

[0045] In this embodiment, Figure 4 As shown, the method further includes a substrate disassembly method B, which includes the following steps:

[0046] SB1: Separate the top surface of the cover 202 from the bottom surface of the frame 101. At this time, the cover 202 no longer seals the through hole 103.

[0047] SB2: Place the frame 101 in an alkaline solution, which dissolves the shadowless adhesive (i.e., UV adhesive) in the brackets 102 and through-holes 103;

[0048] SB3: When the shadowless adhesive (ie, UV adhesive) in the bracket 102 and the through hole 103 is completely dissolved, the substrate is removed from the bracket 102 .

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for using a substrate back grinding protection device, characterized in that: It is realized based on a substrate back grinding protection device, which includes: A bracket (1); used for supporting a substrate, the bracket (1) comprising a frame body (101), a bracket groove (102) being provided on the top surface of the frame body (101), a side surface of the bracket groove (102) being in contact with a side surface of the substrate, and a through hole (103) being provided on the bottom surface of the frame body (101), the through hole (103) being in communication with the bracket groove (102); A sealing cover (2); used for sealing the through hole (103); the sealing cover (2) comprises a cover body (202); the top surface of the cover body (202) is in contact with the bottom surface of the frame body (101); The substrate includes a wafer and display glass; The material of the bracket (1) and the material of the sealing cover (2) both comprise acrylic polymers; The method comprises a substrate loading method A, wherein the substrate loading method A comprises the following steps: SA1: The top surface of the cover (202) is fitted with the bottom surface of the frame (101), and the cover (202) seals the through hole (103); SA2: injecting shadowless glue into the bracket (102) and the through hole (103), and then placing the substrate into the bracket (102), at which time the side of the bracket (102) is in contact with the side of the substrate, and the surface to be processed on the substrate faces upward and is located directly above the bracket (102); SA3: Expose ultraviolet light to the shadowless adhesive in the bracket (102) and the through hole (103) from directly below the cover (202) until the shadowless adhesive in the bracket (102) and the through hole (103) is completely cured, and then process the surface on the substrate that needs to be processed.

2. The method for using the substrate back grinding protection device according to claim 1, characterized in that: Also included is a substrate disassembly method B, wherein the substrate disassembly method B The following steps are involved: SB1: Separating the top surface of the cover (202) from the bottom surface of the frame (101), whereby the cover (202) no longer seals the through hole (103); SB2: placing the frame (101) into an alkaline solution, where the alkaline solution dissolves the shadowless adhesive in the bracket (102) and the through hole (103); SB3: When the shadowless adhesive in the bracket (102) and the through hole (103) is completely dissolved, the substrate is removed from the bracket (102).

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