A digital die cutting apparatus

Abstract

The application relates to the field of die-cutting equipment, and discloses a digital die-cutting equipment which comprises a placing platform, a negative pressure device and a cooling device. The placing platform comprises a plurality of first pipes and second pipes which are arranged side by side to form a honeycomb shape. The end side of the second pipe is provided with an air outlet. The negative pressure device is communicated with the first pipe, and the cooling device is communicated with the second pipe. The cooling device is used for conveying cold air to the second pipe, and the amount of cold air conveyed by the cooling device per unit time is greater than the amount of cold air overflowing from the air outlet. The unwinding mechanism and the winding mechanism are controlled by tension to ensure that the paper is kept stable and closely adheres to the top surface of the placing platform during the whole process, so that the paper can be effectively prevented from slipping, wrinkling or unevenly stretching during the cutting process.

Description

Technical Field

[0001] This invention relates to the field of die-cutting equipment, and more particularly to a digital die-cutting equipment. Background Technology

[0002] In modern industrial production, composite paper is widely used, especially in packaging, printing, and decoration. These composite papers are usually made of two or more layers of different types of paper bonded together by adhesives or hot pressing processes to meet specific performance requirements. For example, packaging paper is made of multiple layers of kraft paper and corrugated paper and is widely used in the manufacture of cartons and packaging boxes. In the production process of these composite boards, it is usually necessary to precisely cut their surfaces to meet product design and functional requirements. Laser die-cutting machines inherit the characteristics of high precision and non-contact processing and have become the main equipment for cutting composite boards.

[0003] Laser die-cutting machines use high-energy laser beams to cut composite boards. While they can process complex patterns and fine cuts, the following problems can occur during the cutting process: The high temperature generated during laser cutting can easily cause paper deformation, scorching, or burning, affecting the cutting quality. Specifically, due to the layered structure of composite boards and the characteristics of different materials, different types of paper have different heat absorption capabilities. When the laser acts on thick paper, the heat generated may be transferred to thinner paper. If the thinner paper has poor thermal radiation, the heat may not be effectively absorbed, leading to overheating of the thinner paper and problems such as deformation, scorching, or burning. Secondly, the thinner paper may deform due to thermal expansion or air flow during laser cutting, causing warping of the thinner paper during the cutting process, which can easily affect cutting accuracy and even further affect product quality. Summary of the Invention

[0004] The purpose of this invention is to provide a digital die-cutting device to solve the problem that when using a laser die-cutting machine to cut multi-layer paper or composite boards, the heat generated when the laser acts on the thick paper may be transferred to the thinner paper. If the thinner paper has poor thermal radiation, the heat may not be effectively absorbed, leading to overheating of the thinner paper and problems such as deformation, scorching, or burning. The specific technical solution is as follows:

[0005] A digital die-cutting device includes a placement platform, a negative pressure device, and a cooling device. The placement platform includes several first pipes and second pipes arranged side-by-side to form a honeycomb pattern. The paper to be processed is laid flat on the placement platform, covering the first and second pipes. The end of the second pipe has an air outlet. The negative pressure device is connected to the first pipe, and the cooling device is connected to the second pipe. The cooling device is used to deliver cold air to the second pipe, and the amount of cold air delivered by the cooling device per unit time is greater than the amount of cold air overflowing from the air outlet. The negative pressure device creates a negative pressure state in the first pipe and adsorbs the paper. The adsorption force formed in the first pipe is greater than the force exerted on the paper by the cold air.

[0006] As one of the improvements to the above technical solution, it also includes an unwinding mechanism, a placement platform, a laser generator, and a winding mechanism. The paper fed out by the unwinding mechanism is processed by the laser generator and then recycled by the winding mechanism. The placement platform is located below the laser generator and between the unwinding mechanism and the winding mechanism.

[0007] As an improvement to the above technical solution, the digital die-cutting equipment also includes a correction mechanism, which is disposed between the unwinding mechanism and the placement platform, and the paper is wound around the correction mechanism.

[0008] As an improvement to the above technical solution, the digital die-cutting equipment also includes a dust collector, which is disposed between the correction mechanism and the placement platform, and the paper is wound around the dust collector.

[0009] As an improvement to the above technical solution, a recycling mechanism is provided between the placement platform and the winding mechanism. The recycling mechanism includes a peeling roller with adhesive tape wound on it. The peeling roller is positioned close to the paper's transport path. By rotating the peeling roller, the adhesive tape is continuously bonded to or separated from the paper.

[0010] As an improvement to the above technical solution, the recycling mechanism further includes a barrier plate. The peeling roller is set below the placement platform. The paper between the placement platform and the peeling roller is inclined downwards. The barrier plate is set between the placement platform and the peeling roller, and the barrier plate is set close to the top surface of the paper. The distance between the barrier plate and the paper is less than 1 mm.

[0011] As an improvement to the above technical solution, the recycling mechanism further includes a tape roll and a recycling roller. The tape roll pulls out the tape and wraps it around the stripping roller, and the recycling roller is used to recycle the tape.

[0012] As an improvement to the above technical solution, the digital die-cutting equipment also includes a displacement mechanism, which includes a transverse slide rail and a longitudinal slide rail. The longitudinal slide rail is slidably connected to the transverse slide rail, and the laser generator is slidably connected to the longitudinal slide rail.

[0013] The beneficial effects of this invention are as follows: The unwinding and rewinding mechanisms not only feed and retract the paper, but also ensure that the paper remains stable and closely adheres to the top surface of the placement platform throughout the process through tension control. This effectively prevents the paper from slipping, wrinkling, or unevenly stretching during the cutting process, thereby ensuring the equipment stability and cutting quality. The suction force generated by the negative pressure device can firmly fix the paper on the placement platform, preventing the paper from shifting or warping due to thermal expansion, airflow disturbance, or the action of the laser beam during laser cutting. In this way, the paper can maintain a stable position throughout the cutting process, ensuring a precise and consistent cutting path. The cooling device can evenly deliver cold air to the surface of the paper. Since the paper has been completely fixed on the platform, the cooling airflow can directly contact the surface of the paper, carrying away the heat generated during the laser cutting process.

[0014] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the placement platform of the present invention.

[0018] Figure 3 This is another structural schematic diagram of the placement platform of the present invention.

[0019] Figure 4 This is a schematic diagram of the branch pipe structure of the present invention.

[0020] Figure 5 This is a schematic diagram of the structure of the second pipe of the present invention.

[0021] In the diagram: 1. Unwinding mechanism; 2. Placement platform; 3. Rewinding mechanism; 4. Laser generator; 5. Negative pressure device; 6. Cooling device; 7. First pipe; 8. Second pipe; 9. Branch pipe; 10. Solenoid valve; 11. Correction mechanism; 12. Dust collector; 131. Stripping roller; 132. Recycling roller; 133. Tape roll; 134. Barrier plate; 135. Tape; 21. First opening; 22. Second opening; 41. Transverse slide rail; 42. Longitudinal slide rail. Detailed Implementation

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Please see Figures 1-5 In this embodiment of the invention, a digital die-cutting device includes an unwinding mechanism 1, a placement platform 2, a laser generator 4, and a winding mechanism 3. The paper fed out by the unwinding mechanism 1 is processed by the laser generator 4 and then recycled by the winding mechanism 3. The unwinding mechanism 1 and the winding mechanism 3 pull the paper to adhere to the top surface of the placement platform 2.

[0024] The unwinding mechanism 1 and the rewinding mechanism 3 not only feed and rewind the paper, but more importantly, they ensure that the paper remains stable and closely adheres to the top surface of the placement platform 2 throughout the process through tension control. By adjusting and controlling the tension, the paper can be effectively prevented from slipping, wrinkling or uneven stretching during the cutting process, thereby ensuring the equipment stability of the cutting quality.

[0025] Preferably, the digital die-cutting equipment further includes a displacement mechanism, which includes a transverse slide rail 41 and a longitudinal slide rail 42. The longitudinal slide rail 42 is slidably connected to the transverse slide rail 41, and the laser generator 4 is slidably connected to the longitudinal slide rail 42. The position of the laser generator 4 is adjusted by setting the displacement mechanism, and the laser generator 4 is moved along a predetermined trajectory by driving the transverse slide rail 41 and the longitudinal slide rail 42.

[0026] In this invention, the tension control of the paper is coordinated with the placement platform 2. Specifically, the top surface of the placement platform 2 is provided with a plurality of first openings 21 and second openings 22, which are alternately arranged to form a honeycomb structure. It also includes a negative pressure device 5 and a cooling device 6. The negative pressure device 5 is connected to the first openings 21, and the cooling device 6 is connected to the second openings 22. It is understood that during the laser cutting process, paper is prone to warping, movement, or deformation due to heat, especially in the cutting of thin or multi-layer paper. These problems not only affect the cutting quality but also increase the maintenance and production costs of the equipment. Therefore, the presence of the cutting platform with the negative pressure device 5 and the cooling device 6 can effectively solve these problems and improve the overall performance of the equipment. The first openings 21 and the second openings 22 are arranged in a honeycomb structure, which can evenly distribute the negative pressure and cooling, keeping the paper flat during the cutting process and minimizing the thermal expansion caused by laser cutting.

[0027] By controlling the tension of the paper, the paper is made to adhere to the top surface of the placement platform 2. Then, after the paper is laid flat on the top surface of the placement platform 2, the negative pressure device 5 is activated to create a negative pressure environment in the first opening 21, which further enhances the fixing force of the paper. Specifically, the negative pressure device 5 generates negative pressure suction to firmly adsorb the paper onto the placement platform 2. The suction generated by the negative pressure device 5 can firmly fix the paper onto the placement platform 2, preventing the paper from shifting or warping due to heat expansion, airflow disturbance or the action of the laser beam during the laser cutting process. In this way, the paper can maintain a stable position throughout the cutting process, ensuring that the cutting path is accurate and consistent.

[0028] In some embodiments, after the paper is firmly fixed on the placement platform 2 by the negative pressure device 5, the cold air from the cooling device 6 can act more effectively on the paper, avoiding leakage or waste of cold air. The cooling device 6 is connected to the second opening 22 on the placement platform 2 to uniformly deliver cold air to the surface of the paper. Since the paper has been completely fixed on the platform, the cooling airflow can directly contact the surface of the paper and remove the heat generated during the laser cutting process. Preferably, the cooling device 6 is a cold air generator. The cold air generated by the cold air generator is a dry gas. Using this embodiment can ensure the efficient use of the cooling airflow, avoid cold air loss, improve cooling efficiency, and also reduce temperature fluctuations caused by uneven cold air, thereby ensuring cutting quality.

[0029] Regarding the cooling device 6, laser cutting technology uses a laser beam to irradiate the paper surface with high energy, which causes a rapid increase in the local temperature of the paper. Due to the high temperature of the laser beam, the paper may melt, evaporate, or carbonize in the area being cut. This heat not only affects the cutting effect but may also have negative effects on the paper itself. For example, overheating: excessive heat accumulation may cause the paper to overheat, resulting in scorching, discoloration, or even burning; thermal expansion: when heat is concentrated on the paper surface, local expansion of the paper may cause the cutting path to deviate, affecting cutting accuracy; uneven temperature: uneven heat distribution can lead to temperature differences between the paper surface and the underlying layer, causing the paper to warp and deform, further affecting the cutting quality. Therefore, by setting up the cooling device 6, the above situations can be avoided or mitigated.

[0030] During laser cutting, the contact area between the laser beam and the paper is very small, and heat hardly diffuses into the surrounding area. Therefore, only the cutting area needs cooling, while other areas of the paper are not subjected to high temperatures and experience minimal temperature changes. To address this, the present invention provides several embodiments: a first pipe 7 connects the negative pressure device 5 to the first opening 21, creating negative pressure within the first opening 21 to ensure the paper adheres tightly to the placement platform 2; a second pipe 8 connects the cooling device 6 to the second opening 22, with an air outlet at the end of the second pipe 8; the amount of cold air delivered by the cooling device 6 per unit time is greater than the amount of cold air overflowing from the air outlet; the negative pressure device 5 creates a negative pressure state within the first pipe 7, adsorbing the paper; the adsorption force within the first pipe 7 is greater than the force exerted on the paper by the cold air; and the cooling device 6 delivers cold air into the second opening 22. Each second opening 22 is connected to a branch pipe 9, and a solenoid valve 10 for controlling the branch pipe 9 is connected to the branch pipe 9. Several branch pipes 9 are respectively connected to the second pipe 8. It can be understood that since the laser generator 4 is set to cut the path before operation, the cold air delivery method can be optimized. For example, only the solenoid valve 10 of the branch pipe 9 close to the cutting path can be opened to make efficient use of cold air. Preferably, the ratio of adsorption force and cold air volume can also be adjusted according to the cutting path. Taking the first pipe 7 and the second pipe 8 far away from the cutting path as an example, the ratio of the cold air volume input to the first pipe 7 to the adsorption force of the second pipe 8 is 1:1, while the ratio of the cold air volume input to the first pipe 7 and the adsorption force of the second pipe 8 close to the cutting path is 1:1.25 (while considering the increase in cold air input and the cold air outflow of the air outlet).

[0031] In some embodiments, the digital die-cutting equipment further includes a web-correcting mechanism 11 and a dust collector 12. The web-correcting mechanism 11 is disposed between the unwinding mechanism 1 and the placement platform 2, and the paper is wound around the web-correcting mechanism 11. The dust collector 12 is disposed between the web-correcting mechanism 11 and the placement platform 2, and the paper is wound around the dust collector 12. The web-correcting mechanism 11 is a traditional web-correcting device, while the dust collector 12 is similar to a vacuum cleaner, removing dust from both sides of the paper. It is understood that the paper needs to be fed smoothly during laser cutting, especially during long-term cutting operations. The paper may shift due to uneven tension, equipment vibration, or improper operation, leading to a decrease in cutting accuracy. This seriously affects cutting quality and production efficiency. In addition, in mass production, paper misalignment may affect the quality of the entire batch of products, leading to inconsistent dimensions and cutting errors, thereby increasing production costs and rework rates. Therefore, a correction mechanism 11 is required to keep the paper in the accurate position. If there is dust and impurities on the paper, they may absorb or scatter the laser. When the laser beam is irradiated, it will be partially absorbed or scattered by these particles, thereby reducing the energy transfer efficiency of the laser. This will lead to uneven cutting depth, uneven cutting lines, and may even cause cutting failure in some areas. Therefore, a corresponding dust collector 12 needs to be set up before laser cutting to remove dust and ensure smooth cutting.

[0032] During laser cutting, the energy of the laser beam causes the cut portion of the paper to heat up rapidly and melt or vaporize, typically leaving some tiny debris or scattered material around the cut area. Although laser cutting is a precise cutting method, debris is unavoidable due to variations in paper's fiber structure, thickness, and composition.

[0033] For handling small debris, the present invention provides several embodiments. A recycling mechanism is provided between the placement platform 2 and the winding mechanism 3. The recycling mechanism includes a peeling roller 131 on which adhesive tape 135 is wound. The peeling roller 131 is positioned close to the paper's transport path. By rotating the peeling roller 131, the adhesive tape 135 is continuously bonded to or separated from the paper. Preferably, the recycling mechanism further includes an adhesive tape roll 133 and a recycling roller 132. The adhesive tape roll 133 pulls out the adhesive tape 135 and winds it around the peeling roller 131. The recycling roller 132 is used to recycle the adhesive tape 135. The adhesive tape wound on the peeling roller 131... The tape 135 has a certain degree of stickiness, which can effectively adhere to the debris and particles remaining on the paper surface. Specifically, the rotation of the peeling roller 131 ensures continuous contact and separation between the tape 135 and the paper, so that the debris, particles and other substances on the paper surface can be adhered to the tape 135 and carried away with the movement of the tape 135. The stickiness of the tape 135 can be adjusted according to actual needs. A tape 135 with strong stickiness can be selected to remove debris that is difficult to peel off, or a tape 135 with moderate stickiness can be selected to ensure that the debris is effectively recycled without damaging the paper surface.

[0034] For handling larger debris, the present invention also provides some embodiments. The recycling mechanism further includes a baffle plate 134. The peeling roller 131 is positioned below the placement platform 2. The paper between the placement platform 2 and the peeling roller 131 is inclined downwards. The baffle plate 134 is positioned between the placement platform 2 and the peeling roller 131, and is close to the top surface of the paper. The distance between the baffle plate 134 and the paper is less than 1 mm. The recycling mechanism also includes a tape roll 133 and a recycling roller 132. The tape roll 133 pulls out the tape 135 and wraps it around the peeling roller 131. The recycling roller 132 is used to recycle the tape 135. The purpose of setting the baffle plate 134 is to intercept larger debris in advance. It is understood that larger debris on the paper may cover smaller debris. If larger debris is adhered to by the tape 135 on the peeling roller 131, then the larger debris will be peeled off. The tape 135 on the stripping roller 131 cannot adhere to smaller debris located below larger debris. Therefore, a baffle plate 134 needs to be designed to intercept or collect larger debris in advance. Setting the stripping roller 131 below the placement platform 2 allows the paper pulled from the platform to tilt downwards. Under the influence of gravity, larger debris will automatically fall until it lands on the baffle plate 134. The purpose of limiting the distance between the baffle plate 134 and the paper to less than 1 mm is that most paper is relatively thin, and the baffle plate 134 can only achieve the interception effect if it is set close to the paper. Preferably, the baffle plate 134 can be set on the sliding mechanism, so that the position of the baffle plate 134 can be flexibly adjusted as needed. By adopting the above embodiment, omissions in the entire recycling process can be avoided, which would affect subsequent processing procedures and improve product quality.

[0035] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. A digitized die cutting apparatus characterized by, The device comprises a placing platform, a negative pressure device and a cooling device. The placing platform comprises a plurality of first pipes and second pipes which are arranged in a honeycomb shape. Paper to be processed is laid on the placing platform and covers the first pipes and the second pipes. The end side of the second pipes is provided with air outlets. The negative pressure device is connected with the first pipes. The cooling device is connected with the second pipes and is used to deliver cold air to the second pipes. The amount of cold air delivered by the cooling device per unit time is greater than the amount of cold air overflowing from the air outlets. The negative pressure device forms a negative pressure state in the first pipes and adsorbs the paper. The adsorption force formed in the first pipes is greater than the force exerted on the paper by the cold air. The device further comprises an unwinding mechanism, a placing platform, a laser generator and a winding mechanism. The paper delivered by the unwinding mechanism is processed by the laser generator and then recycled by the winding mechanism. The placing platform is arranged below the laser generator and between the unwinding mechanism and the winding mechanism.

2. A digital die cutting apparatus as claimed in claim 1, wherein: The digital die-cutting device further comprises a deviation rectifying mechanism arranged between the unwinding mechanism and the placing platform. The paper is wound around the deviation rectifying mechanism.

3. A digital die cutting apparatus as claimed in claim 2, wherein: The digital die-cutting device further comprises a dust remover arranged between the deviation rectifying mechanism and the placing platform. The paper is wound around the dust remover.

4. A digital die cutting apparatus as claimed in claim 3, wherein: A recycling mechanism is arranged between the placing platform and the winding mechanism. The recycling mechanism comprises a stripping roller around which an adhesive tape is wound. The stripping roller is arranged close to the transmission path of the paper. The adhesive tape is continuously bonded to or separated from the paper by rotating the stripping roller.

5. A digital die cutting apparatus as claimed in claim 4, wherein: The recycling mechanism further comprises a blocking plate. The stripping roller is arranged below the placing platform. The paper between the placing platform and the stripping roller is arranged in a downward inclination. The blocking plate is arranged between the placing platform and the stripping roller and close to the top surface of the paper. The distance between the blocking plate and the paper is less than 1 mm.

6. A digital die cutting apparatus as claimed in claim 5, wherein: The recycling mechanism further comprises an adhesive tape roll and a recycling roller. The adhesive tape roll draws the adhesive tape and winds the adhesive tape around the stripping roller. The recycling roller is used to recycle the adhesive tape.

7. A digital die cutting apparatus as claimed in claim 6, wherein: The digital die-cutting device further comprises a displacement mechanism. The displacement mechanism comprises a transverse slide rail and a longitudinal slide rail. The longitudinal slide rail is slidingly connected with the transverse slide rail. The laser generator is slidingly connected with the longitudinal slide rail.

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