Rotary driving device and chemical vapor deposition equipment
By installing elastic parts on the side walls of the support cylinder of the chemical vapor deposition equipment and forming elastic connections, the problems of damage to the support cylinder under high temperature and high speed rotation and pallet displacement are solved, which improves the deposition uniformity and reduces the risk of thermal damage.
Patent Information
- Application Number
- CN202311725577.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-14
- Publication Date
- 2025-06-17
AI Technical Summary
In existing chemical vapor deposition equipment, the support cylinder is damaged due to thermal expansion and tremor under high temperature and high speed rotation, and the pallets are displaced during rotation, resulting in a decrease in deposition uniformity.
An elastic member is provided on the side wall of the support cylinder, and fixed it to the side wall of the support cylinder through the connecting member to form an elastic connection, limiting the displacement of the support cylinder on the rotating flange, and ensuring that the tray remains stable under high temperature and high speed rotation.
The hard connection damage to the support cylinder is avoided through elastic connections, the displacement of the pallet is reduced, the deposition uniformity of the wafer surface is improved, and the risk of thermal damage to the equipment is reduced through thermal insulation measures.
Smart Images
Figure CN120158730A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor equipment, and particularly to a rotary drive device and a chemical vapor deposition equipment. Background Art
[0002] The chemical vapor deposition (CVD) process is a process technology in which reactant substances undergo chemical reactions under gaseous conditions to form solid substances deposited on the surface of a heated solid substrate, thereby obtaining solid materials. It is realized through chemical vapor deposition equipment. In the chemical vapor deposition process, especially in the metal organic chemical vapor deposition (MOCVD) process, the deposition uniformity on the wafer surface is an important index for verifying the process effect.
[0003] In the prior art, the chemical vapor deposition equipment includes a reaction chamber, which is a reaction space for performing the chemical vapor deposition process. A rotary drive device is provided in the reaction chamber. As Figure 1 shown, the rotary drive device includes a tray 10 for carrying a wafer W; a heater 20 is located below the tray 10 and is surrounded by a support cylinder 30 to form a heating area, which is used to provide heat energy to the tray 10 and transfer it to the wafer W. Among them, the top of the support cylinder 30 is used to support the tray 10, and its bottom is connected to a rotary flange 40, which is used to drive the support cylinder 30 to rotate around its own central axis to drive the tray 10 to rotate. Usually, the support cylinder 30 is rigidly connected to the rotary flange 40 using screws, or directly placed on the rotary flange 40. Further, the support cylinder 30 is generally made of a non-metallic material to prevent the thermal expansion deformation of the support cylinder 30 from being too large at high temperatures (above 1000°C) and affecting the rotation stability of the tray 10, and to prevent the heater 20 from contacting the support cylinder 30 at high temperatures and causing equipment short circuits.
[0004] During the CVD process, since the support cylinder 30 is in a state of high temperature and high-speed rotation, when the support cylinder 30 is fixedly connected to the rotary flange 40 using screws to form a rigid connection, the thermal expansion deformation and vibration generated by the high-speed rotation of the support cylinder 30 will cause damage to the support cylinder 30; if a rigid connection method is not adopted and the support cylinder 30 is directly placed on the rotary flange 40, it will cause the displacement of the support cylinder 30 to be too large during high-speed rotation, causing the tray 10 provided at the top of the support cylinder 30 to jump in the horizontal and vertical directions, thereby reducing the deposition uniformity of the CVD process on the wafer surface. Summary of the Invention
[0005] The object of the present invention is to provide a rotary drive device and a chemical vapor deposition apparatus. By providing an elastic member on the side wall of the support cylinder and fixing the elastic member to the side wall of the support cylinder through a connecting member to form an elastic connection, a hard connection between the support cylinder and the rotary flange is avoided, and at the same time, the displacement of the support cylinder in the vertical and horizontal directions on the rotary flange is restricted, so that the tray provided at the top of the support cylinder remains horizontal, thereby ensuring the stable operation of the support cylinder under high temperature and high-speed rotation and improving the uniformity of deposition on the wafer surface.
[0006] To achieve the above object, the present invention provides a rotary drive device for supporting and driving a rotary substrate tray, which includes: a support cylinder, the top of which is used to support the substrate tray, and the bottom of which is provided on the rotary flange; the side wall of the support cylinder includes an upper side wall and a lower side wall and a step surface provided between the upper side wall and the lower side wall, and the diameter of the lower side wall is larger than that of the upper side wall; an elastic member, which is provided on the step surface; a connecting member, which is arranged around the outside of the support cylinder, and a extending portion extending towards the support cylinder is provided at the top of the connecting member, and the extending portion has a connecting surface opposite to the step surface; the connecting surface presses on the elastic member to provide pressure to the elastic member so that the elastic member is tightly pressed on the step surface; the bottom of the connecting member is connected to the rotary flange, so that the support cylinder is fixed on the rotary flange by the pressure provided by the connecting member and the elastic member.
[0007] Optionally, the connecting surface is formed by extending inwards along the radial direction of the connecting member. When the connecting surface presses on the elastic member, there is a gap between the connecting member and the outside of the support cylinder.
[0008] Optionally, the height of the step surface on the side wall of the support cylinder is lower than 2 / 3 of the height of the support cylinder.
[0009] Optionally, there is an included angle between the step surface and the upper side wall or the lower side wall in the vertical direction, and the range of the included angle is 10° to 90°.
[0010] Optionally, the elastic member is an annular spring, and the annular spring is arranged around the side wall of the support cylinder for one week on the annular step surface.
[0011] Optionally, the elastic member is a plurality of columnar springs, and the columnar springs are evenly spaced along the circumferential direction of the step surface.
[0012] Optionally, each columnar spring includes a central axis, and the central axes of the plurality of columnar springs are tangentially arranged with the circle where the step surface is located, or the central axes of the plurality of columnar springs face upwards from the step surface towards the connecting surface of the connecting member.
[0013] Optionally, at least three positioning pins are circumferentially arranged on the rotary flange; at least three positioning holes corresponding to the positioning pins are provided at the bottom of the connecting member; the positioning pins are inserted into the corresponding positioning holes so that the connecting member and the rotary flange are connected to each other.
[0014] Optionally, a limiting groove is provided on the rotary flange, a limiting ring is arranged in the limiting groove, the bottom of the support cylinder presses on the limiting ring, and the thermal conductivity coefficient of the material of the limiting ring is lower than that of the support cylinder or the rotary flange.
[0015] Optionally, the width of the limiting ring is greater than the width of the bottom of the support cylinder.
[0016] Optionally, at least three limiting bosses are arranged at intervals on the limiting ring; at least three limiting grooves corresponding to the limiting bosses are provided at the bottom of the support cylinder; the limiting bosses are embedded in the corresponding limiting grooves.
[0017] Optionally, a fixing part is provided at the bottom of the connecting member; a plurality of through holes are arranged at intervals along the circumference of the fixing part; the through holes penetrate through the fixing part, and a plurality of fixing pieces pass through the through holes to fixedly connect the connecting member and the rotary flange.
[0018] Optionally, mounting holes corresponding to the through holes are provided on the rotary flange for connecting the fixing pieces.
[0019] Optionally, there is a gap between the bottom surface of the fixing part and the upper surface of the rotary flange.
[0020] Optionally, an adjusting spring is further arranged in the through hole, the bottom of the fixing piece passes through the adjusting spring and is connected to the rotary flange, the top of the fixing piece presses on the upper end of the adjusting spring, and the lower end of the adjusting spring presses on the bottom wall in the through hole of the fixing part.
[0021] Optionally, the rotary driving device further includes a driving mechanism, which is arranged below the rotary flange and is used to drive the rotary flange to rotate around its own central axis.
[0022] The present invention also provides a chemical vapor deposition device, which includes: a reaction chamber; the reaction chamber is provided with an air inlet and an air outlet for inputting and discharging process gases; the bottom of the reaction chamber is provided with the rotary driving device as described in the present invention; a heating device, which is arranged in the support cylinder and is used to heat the substrate tray to the reaction temperature.
[0023] In summary, compared with the prior art, a rotary driving device and a chemical vapor deposition device provided by the present invention have the following beneficial effects:
[0024] First, by providing elastic members on the side wall of the support cylinder, when the support cylinder undergoes thermal expansion deformation at high temperatures, the elastic members are squeezed and compressed due to the thermal expansion deformation of the support cylinder, providing a greater pressure to the support cylinder, enabling the support cylinder to be more stably fixed on the rotating flange. At the same time, when the support cylinder undergoes displacement due to high-speed rotation, the elastic members can provide pressure to limit the movement of the support cylinder on the rotating flange, thereby reducing the displacement of the support cylinder during the process and enabling the substrate tray provided on the top of the support cylinder to remain stable.
[0025] Secondly, by forming a gap between the connecting member and the outside of the support cylinder, the heat transfer between the support cylinder and the connecting member is reduced, playing a heat insulation role; this gap also provides a certain accommodation space for the deformation and displacement of the support cylinder, preventing the support cylinder from directly contacting the connecting member to form a rigid connection and causing damage to the support cylinder. At the same time, a gap is also provided between the bottom surface of the fixing portion and the upper surface of the rotating flange. When the connecting member and the rotating flange are rotating at high speed, this gap provides a redundant movement space for the connecting member, avoiding damage caused by hard contact between the connecting member and the rotating flange.
[0026] Furthermore, the limiting ring in the present invention is made of a material with a low thermal conductivity coefficient to achieve a heat insulation effect, reducing the heat transfer to the support cylinder, keeping the support cylinder at a relatively high temperature, reducing the heat influence on the edge of the substrate tray, ensuring the temperature uniformity of the substrate tray, and further improving the deposition uniformity of the wafers on the substrate tray. On the other hand, it avoids the defect of transferring heat to the rotating flange and causing the rotating flange to heat up, ensuring that the rotating flange is at an appropriate temperature and avoiding the influence of high temperature on the driving mechanism provided below the rotating flange.
[0027] In summary, a rotating drive device and a chemical vapor deposition device provided by the present invention, by providing elastic members on the stepped surface of the side wall of the support cylinder and pressing the elastic members by the connecting member to provide pressure to the elastic members so that the elastic members are tightly pressed on the stepped surface, enabling the support cylinder to be fixed on the rotating flange by the pressure provided by the connecting member and the elastic members, restricting the displacement of the support cylinder in the horizontal or vertical direction during rotation, ensuring the stable operation of the substrate tray provided on the top of the support cylinder under high temperature and high-speed rotation, and improving the deposition uniformity of the surface of the wafers placed on the substrate tray. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 Schematic diagram of a rotating drive device of the prior art;
[0029] Figure 2 Cross-sectional schematic diagram of an embodiment of a rotating drive device of the present invention;
[0030] Figure 3 Top view schematic diagram of a rotating drive device of the present invention with the elastic member being an annular spring;
[0031] Figure 4 The top view schematic diagram shows that the elastic member of a rotary drive device of the present invention is a columnar spring disposed tangentially to the stepped surface;
[0032] Figure 5 The top view schematic diagram shows that the elastic member of a rotary drive device of the present invention is a columnar spring facing upward from the stepped surface towards the connecting surface;
[0033] Figure 6 The top view schematic diagram of the limit ring of a rotary drive device of the present invention;
[0034] Figure 7 The cross-sectional schematic diagram of another rotary drive device of the present invention;
[0035] Figure 8 The enlarged schematic diagram of the connecting member of another rotary drive device of the present invention;
[0036] Figure 9 The schematic diagram of a chemical vapor deposition device of the present invention. Detailed implementation manners
[0037] The following will combine the attached drawings in the embodiments of the present invention Figure 1 ~Attached drawings Figure 9 to elaborate in detail on the technical solutions, structural features, achieved objectives and effects in the embodiments of the present invention.
[0038] It should be noted that the attached drawings adopt a very simplified form and all use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the implementation manners of the present invention, and are not used to limit the limiting conditions for implementing the present invention. Therefore, they do not have technical substance significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the objectives that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.
[0039] It should be noted that in the present invention, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements clearly listed, but also includes other elements not clearly listed, or also includes elements inherent to such process, method, article or device.
[0040] In the prior art, such as Figure 1As shown, the support cylinder 30 for supporting the tray 10 is rigidly connected to the rotating flange 40 by screws or directly placed on the rotating flange 40. During the process, the rotating flange 40 is driven to rotate by a driving device (not shown in the figure), thereby driving the support cylinder 30 to rotate at a high speed in a high-temperature environment. When the support cylinder 30 and the rotating flange 40 are fixedly connected by screws to form a rigid connection, the thermal expansion deformation generated by the support cylinder 30 at high temperature and the vibration generated by high-speed rotation will cause the support cylinder 30 to break; when the support cylinder 30 is directly placed on the rotating flange 40, since the support cylinder 30 is not restricted in both the horizontal and vertical directions, the vibration generated by the high-speed rotation of the rotating flange 40 will cause the support cylinder 30 to move in the horizontal or vertical direction, thereby causing the tray 10 to jump in the horizontal or vertical direction, affecting the stability of the process and resulting in a decrease in the deposition uniformity on the surface of the wafer.
[0041] In view of the above defects, the idea adopted in the present invention is to add an elastic buffer structure at the connection between the support cylinder 30 and the rotating flange 40 to avoid the rigid connection between the support cylinder 30 and the rotating flange 40; at the same time, the movement of the support cylinder 30 in the horizontal and vertical directions is restricted, so as to achieve the purpose of keeping the support cylinder 30 stable under high-speed rotation, avoiding the problem that the tray 10 jumps in the horizontal or vertical direction due to the displacement of the support cylinder 30, keeping the tray 10 in a horizontal state during the process, and thus improving the uniformity of the surface of the wafer.
[0042] Based on the above inventive idea, an embodiment of the present invention provides a rotary drive device 100 for supporting and driving a rotating substrate tray 101, as Figure 2 and Figure 9As shown, the rotary drive device 100 includes a support cylinder 102, which has a cylindrical structure. The top is used to support the substrate tray 101, and the bottom is arranged on the rotary flange 105. A drive mechanism 109 is arranged below the rotary flange 105 for driving the rotary flange 105 to rotate around its own central axis. The side wall of the support cylinder 102 includes an upper side wall 121 and a lower side wall 122, and a stepped surface 123 arranged between the upper side wall 121 and the lower side wall 122. The diameter of the lower side wall 122 is larger than that of the upper side wall 121, so that the stepped surface 123 extends radially outward along the support cylinder 102 to form a bearing space. An elastic member 103 is arranged on the stepped surface 123. A connecting member 104 is arranged around the outside of the support cylinder 102, and an extension portion 141 extending towards the support cylinder 102 is arranged at the top of the connecting member 104. The extension portion 141 has a connecting surface 142 opposite to the stepped surface 123. The connecting surface 142 presses on the elastic member 103 to provide pressure to the elastic member 103 so that the elastic member 103 presses tightly on the stepped surface 123. The bottom of the connecting member 104 is connected to the rotary flange 105, so that the support cylinder 102 is fixed on the rotary flange 105 under the pressure provided by the connecting member 104 and the elastic member 103, restricting the jumping of the support cylinder 102 in the horizontal or vertical direction during rotation.
[0043] In the present invention, by arranging the elastic member 103 on the stepped surface 123 between the upper and lower side walls of the support cylinder 102, on the one hand, when the support cylinder 102 undergoes thermal expansion deformation at high temperature, the elastic member 103 is squeezed and compressed due to the thermal expansion deformation of the support cylinder 102. At the same time, since the support cylinder 102 is fixed on the rotary flange 105 under the pressure of the connecting member 104 and the elastic member 103, that is, there is no hard connection between the support cylinder 102 and the rotary flange 105, so the support cylinder 102 will not be damaged due to thermal expansion deformation. Further, because the elastic member 103 is squeezed and provides greater pressure to the support cylinder 102, the support cylinder 102 can be fixed on the rotary flange 105 more stably. On the other hand, when the support cylinder 102 generates displacement due to high-speed rotation, the elastic member 103 can provide pressure to limit the movement of the support cylinder 102 on the rotary flange 105, thereby reducing the displacement of the support cylinder 102 during the process and enabling the substrate tray 101 arranged at the top of the support cylinder 102 to remain stable.
[0044] Further, as Figure 2As shown, the connecting surface 142 is formed by extending radially inward along the connecting member 104. When the connecting surface 142 presses on the elastic member 103, there is a gap 106 between the connecting member 104 and the outer side of the support cylinder 102. By forming the gap 106 between the connecting member 104 and the outer side of the support cylinder 102, heat transfer can be reduced to achieve heat insulation between the support cylinder 102 and the connecting member 104. At the same time, this gap 106 also provides a certain accommodation space for the deformation and displacement of the support cylinder 102, avoiding direct contact between the support cylinder 102 and the connecting member 104 to form a rigid connection, which may cause damage to the support cylinder 102.
[0045] When the support cylinder 102 vibrates due to the high-speed rotation of the rotating flange 105, the part of the support cylinder 102 farther away from the rotating flange 105 shakes more obviously, that is, the top of the support cylinder 102 shakes more than the bottom. Therefore, in order to better limit the shaking of the support cylinder 102, the higher the height of the step surface 123 on the side wall of the support cylinder 102, the better the limiting effect. However, during the process, the area near the substrate tray 101 is in a high-temperature environment. If the height of the step surface 123 is close to the substrate tray 101, the elastic member 103 on the step surface 123 may lose its elasticity due to the high temperature. Therefore, as an alternative embodiment, as Figure 2 shown, the height of the step surface 123 on the side wall of the support cylinder 102 is lower than 2 / 3 of the height of the support cylinder 102, which can prevent the problem of the elastic member 103 on the step surface 123 failing due to the excessive height of the step surface 123 in a high-temperature environment, thereby improving the limiting effect of the elastic member 103 on the support cylinder 102 on the step surface 123.
[0046] Furthermore, there is an angle between the step surface 123 and the upper side wall 121 or the lower side wall 122 in the vertical direction, and the angle range is 10° to 90° to form a bearing space for placing the elastic member 103. In this embodiment, as Figure 2As shown, the included angle formed by the stepped surface 123 and the upper side wall 121 in the vertical direction is 90°, that is, the included angle between the stepped surface 123 and the lower side wall in the vertical direction is 90°; at this time, the connecting surface 142 of the connecting member 104 is perpendicular to the side wall of the support cylinder 102, so that the connecting surface 142 is arranged parallel to the stepped surface 123. When the connecting surface 142 presses on the elastic member 103 arranged on the stepped surface 123, the connecting surface 142 provides a vertically downward pressure to press the elastic member 103 on the stepped surface 123. In other embodiments, if the included angle formed by the stepped surface 123 and the lower side wall 122 in the vertical direction is less than 90°, that is, the stepped surface 123 is inclined downward, the connecting surface 142 can be arranged perpendicular to the side wall of the support cylinder 102 or parallel to the stepped surface 123. At this time, the elastic member 103 arranged on the stepped surface 123 is subjected to the pressure provided by the connecting surface 142, part of which is the pressure perpendicular to the stepped surface 123, and the other part is the pressure in the horizontal direction, and the elastic member 103 is fixed between the stepped surface 123 and the connecting surface 142.
[0047] As an alternative embodiment, as Figure 3 shown, the elastic member 103 is an annular spring, and the annular spring is arranged on the annular stepped surface 123 around the side wall of the support cylinder 102 for one week. When the annular spring is arranged along the annular stepped surface 123, it is ensured that the support cylinder 102 is fixed downward by the uniform elastic force provided by a circle of annular springs, optimizing the vertical jump of the support cylinder 102 and avoiding the offset of the support cylinder 102 on the rotating flange 105 caused by different pressures received by the stepped surface 123. Optionally, the elastic member 103 is made of stainless steel or nickel alloy material, which can effectively prevent the elastic force failure of the elastic member 103 caused by the process temperature, and at the same time can also prevent the corrosion of the process gas.
[0048] In another alternative embodiment, as Figure 4 and Figure 5 shown, the elastic member 103 is a plurality of columnar springs, and the columnar springs are evenly spaced along the circumferential direction of the annular stepped surface 123. In this embodiment, 7 columnar springs are evenly spaced along the circumferential direction of the stepped surface 123. Further, as Figure 4 shown, each columnar spring includes a central axis, and the central axes of the plurality of columnar springs are tangentially arranged with the circle where the stepped surface 123 is located, that is, the central axes of the columnar springs are arranged parallel to the stepped surface 123; or as Figure 5As shown, the central axes of multiple columnar springs face upward from the step surface 123 toward the connection surface 142 of the connector 104, that is, the central axes of the columnar springs are perpendicularly arranged with respect to the step surface 123. By providing multiple separately arranged columnar springs, pressure can be provided to specific positions in the circumferential direction of the support cylinder 102 according to requirements, thereby better restricting the displacement of the support cylinder 102 in the horizontal and vertical directions; at the same time, the separately arranged columnar springs are convenient to replace. When one of the columnar springs fails or cannot meet the elastic force requirements, only the failed or non-compliant columnar spring needs to be replaced, reducing production costs while ensuring the process effect.
[0049] Furthermore, since three points can determine a circle, at least three positioning pins 108 are circumferentially arranged on the rotating flange 105; at least three positioning holes corresponding to the positioning pins 108 are provided at the bottom of the connector 104; the positioning pins 108 are inserted into the corresponding positioning holes, enabling the connector 104 and the rotating flange 105 to be connected to each other, ensuring the concentric arrangement of the connector 104 and the rotating flange 105. In this embodiment, as Figures 3 to 5 shown, 3 positioning pins 108 are circumferentially arranged on the rotating flange 105, ensuring that the support cylinder 102 rotates concentrically with the connector 104 and the rotating flange 105 during rotation, while improving the fixed connection between the connector 104 and the rotating flange 105, and further restricting the movement of the support cylinder 102 in the horizontal direction.
[0050] To further restrict the displacement of the support cylinder 102 in the horizontal direction of the rotating flange 105, as Figure 2 shown, a limiting groove 151 is provided on the rotating flange 105, and a limiting ring 152 is arranged in the limiting groove 151. The bottom of the support cylinder 102 presses on the limiting ring 152, and the width of the limiting ring 152 is greater than the width of the bottom of the support cylinder 102, providing a sliding space for the horizontal sliding generated by the support cylinder 102 during high-speed rotation. At the same time, as Figure 6As shown, at least three limiting bosses 153 are arranged at intervals on the limiting ring 152 (4 limiting bosses are arranged in this embodiment); at least three limiting grooves corresponding to the limiting bosses 153 are provided at the bottom of the support cylinder 102, and the limiting bosses 153 are embedded in the corresponding limiting grooves to further limit the horizontal displacement of the support cylinder 102. However, since both the limiting grooves and the limiting bosses 153 are manufactured mechanically, there are inevitable manufacturing errors in actual applications, resulting in gaps when the limiting bosses 153 are embedded in the limiting grooves. When the support cylinder 102 is in a high-speed rotation state, the support cylinder 102 will have a slight horizontal sliding displacement on the limiting ring 152. Since the width of the limiting ring 152 is greater than the width of the bottom of the support cylinder 102, the width of the limiting ring 152 can accommodate the horizontal sliding displacement of the support cylinder 102, reducing the risk of damage to the support cylinder 102.
[0051] Wherein, the base plate tray 101 and the support cylinder 102 are made of graphite. When both the base plate tray 101 and the support cylinder 102 are made of graphite, since their thermal expansion coefficients are equal, the distance between the edge of the base plate tray 101 and the side wall of the support cylinder 102 can be set very small, thereby reducing the movable distance generated when the edge of the base plate tray 101 overlaps on the top of the support cylinder 102. At the same time, it will not cause different deformation amounts due to different thermal expansion coefficients, avoiding the problem of hard contact and damage caused by different deformation amounts between the two.
[0052] Furthermore, the thermal conductivity coefficient of the material of the limiting ring 152 is lower than that of the material of the support cylinder 102 or the rotating flange 105 to achieve a heat insulation effect. On the one hand, when the heat of the base plate tray 101 is transmitted downward along the support cylinder 102 to the limiting ring 152, due to the low thermal conductivity coefficient of the material of the limiting ring 152, the heat transfer and diffusion are reduced, keeping the support cylinder 102 at a higher temperature, reducing the heat transmitted downward from the edge of the base plate tray 101, ensuring the temperature uniformity of the base plate tray 101, and thus improving the deposition uniformity of the wafers on the base plate tray 101. On the other hand, the low thermal conductivity coefficient of the material of the limiting ring 152 reduces the heat transfer and also avoids the problem of heating the rotating flange 105 by transferring heat to the rotating flange 105, ensuring that the rotating flange 105 is at an appropriate temperature and avoiding the influence of high temperature on the driving mechanism arranged below the rotating flange 105.
[0053] Furthermore, as Figure 2As shown, a fixing portion 143 is provided at the bottom of the connecting member 104, and the fixing portion 143 is annular and parallel to the upper surface of the rotating flange 105; a plurality of through holes are provided at intervals along the circumference of the fixing portion 143; the through hole passes through the fixing portion 143, and the rotating flange 105 is provided with a mounting hole corresponding to the through hole, and a plurality of fixing members 144 pass through the through hole and the mounting hole in sequence to fix the connecting member 104 with the rotating flange 105. In this embodiment, the inner wall of the through hole and the inner wall of the mounting hole are provided with threads, and a step screw is used as the fixing member 144, and the step screw is screwed into the through hole and the mounting hole in sequence, and the connecting member 104 is fixedly connected with the rotating flange 105 through threaded engagement.
[0054] Among them, Figure 7 As shown, there is a gap between the bottom surface of the fixing portion 143 and the upper surface of the rotating flange 105 to prevent the connection member 104 from directly contacting the rotating flange 105 and forming a hard connection. By setting the gap between the bottom surface of the fixing portion 143 and the upper surface of the rotating flange 105, when the connection member 104 and the rotating flange 105 are in high-speed rotation, the gap provides a redundant space for movement for the connection member 104, thereby avoiding damage caused by hard contact between the fixing portion 143 and the rotating flange 105.
[0055] Further, if Figure 7 and Figure 8 As shown, an adjusting spring 145 is also arranged in the through hole on the fixing part 143, the bottom of the fixing member 144 passes through the adjusting spring 145 and is connected to the rotating flange 105, the top of the fixing member 144 presses on the upper end of the adjusting spring 145, and the lower end of the adjusting spring 145 presses on the bottom wall of the through hole of the fixing part 143, and the elastic coefficient of the adjusting spring 145 is adjusted to more accurately control the pressure provided by the connecting member 104 to the elastic member 103. By setting the adjusting spring 145 and cooperating with the elastic member 103, the elastic coefficient of the adjusting spring 145 and the structure, quantity and elastic coefficient of the elastic member 103 can be changed according to actual needs, so that the displacement of the supporting cylinder 102 in the horizontal and vertical directions can be more accurately limited, thereby reducing the jumping of the substrate tray 101 and improving the process stability. In addition, the existence of the gap between the fixing portion 143 and the rotating flange can also reduce the conduction heat that reaches the rotating flange 105 downward through the fixing portion 143, so that the heat reaching the fixing portion 143 needs to be transferred upward through the adjustment spring 145 in sequence, and then transferred downward through the fixing member 144, and finally reaches the rotating flange 105 below that maintains a low temperature through an extremely long distance. Therefore, the structural design of the present invention can greatly reduce the heat transfer between the support tube 102 and the rotating flange 105, that is, improve the temperature distribution of the upper substrate tray and reduce the cooling pressure of the rotating flange.
[0056] The present invention also provides a chemical vapor deposition apparatus 200, as Figure 9 shown, which includes: a reaction chamber 201; an inlet 202 and an outlet 203 are provided on the reaction chamber 201 for inputting and discharging process gases; the above-mentioned rotary driving device 100 is disposed at the bottom of the reaction chamber 201; a heating device 204, which is disposed within the support cylinder 102, is used to heat the substrate tray 101 to the reaction temperature. For the same reason, the chemical vapor deposition apparatus 200 provided by the present invention can reduce the movement of the support cylinder 102 in the vertical and horizontal directions, and at the same time can avoid damage to the support cylinder 102 caused by the hard connection between the support cylinder 102 and the rotary flange 105.
[0057] Wherein, as Figure 9 shown, in this embodiment, the inlet 202 and the outlet 203 are symmetrically disposed on the side wall of the reaction chamber 201. In other embodiments, the inlet 202 may be disposed at the top of the reaction chamber 201, and the outlet 203 may be disposed at the bottom of the reaction chamber 201. The inlet 203 is connected to a gas source for supplying process gases. The outlet 203 is configured to discharge gas from the interior of the reaction chamber 201 (including both the waste gas generated by the reaction and the part of the gas that has not had time to participate in the reaction), and the outlet 203 is communicated with an air extraction pump (not shown in the figure), and the air extraction pump is disposed outside the reaction chamber 201 to provide the gas flow power through the air extraction pump.
[0058] The rotary driving device 100 provided by the present invention is provided with an elastic member 103 on the side wall of the support cylinder 102. When the support cylinder 102 undergoes thermal expansion deformation at high temperature, the elastic member 103 is compressed by the thermal expansion deformation of the support cylinder 102, providing a greater pressure to the support cylinder 102, so that the support cylinder 102 can be more stably fixed on the rotary flange 105. At the same time, when the support cylinder 102 generates displacement due to high-speed rotation, the elastic member 103 can provide pressure to limit the movement of the support cylinder 102 on the rotary flange 105, thereby reducing the displacement of the support cylinder 102 during the process and enabling the substrate tray 101 disposed on the top of the support cylinder 102 to remain stable.
[0059] Secondly, the rotation driving device 100 provided by the present invention forms a gap 106 between the connecting member 104 and the outer side of the support cylinder 102, reducing the heat transfer between the support cylinder 102 and the connecting member 104 and achieving a heat insulation effect; this gap 106 also provides a certain accommodation space for the deformation and displacement of the support cylinder 102, preventing the support cylinder 102 from directly contacting the connecting member 104 to form a rigid connection and causing damage to the support cylinder 102. At the same time, a gap is also provided between the bottom surface of the fixing portion 143 and the upper surface of the rotating flange 105. When the connecting member 104 and the rotating flange 105 are rotating at high speed, this gap provides a redundant moving space for the connecting member 104, avoiding damage caused by hard contact between the connecting member 143 and the rotating flange 105.
[0060] Furthermore, the limiting ring 152 in the present invention is made of a material with a low thermal conductivity coefficient to achieve a heat insulation effect, reducing the heat transfer downward from the support cylinder 102, keeping the support cylinder 102 at a relatively high temperature, reducing the heat influence on the edge of the substrate tray 101, ensuring the temperature uniformity of the substrate tray 101, and further improving the deposition uniformity of the wafers on the substrate tray 101. On the other hand, it avoids the defect of transferring heat to the rotating flange 105 and causing the rotating flange 105 to heat up, ensuring that the rotating flange 105 is at an appropriate temperature and avoiding the influence of high temperature on the driving mechanism arranged below the rotating flange 105.
[0061] In summary, a rotation driving device and a chemical vapor deposition device provided by the present invention set an elastic member on the stepped surface of the side wall of the support cylinder, and the connecting member presses on the elastic member to provide pressure on the elastic member so that the elastic member tightly presses on the stepped surface, enabling the support cylinder to be fixed on the rotating flange by the pressure provided by the connecting member and the elastic member, restricting the displacement of the support cylinder in the horizontal or vertical direction during rotation, ensuring the stable operation of the substrate tray arranged at the top of the support cylinder under high temperature and high-speed rotation, and improving the deposition uniformity of the surface of the wafers placed on the substrate tray.
[0062] It should be noted that in the embodiments of the present invention, the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner side", "outer side", "radial direction", "circumferential direction", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention.
[0063] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.
Claims
1. A rotary drive device for supporting and driving a rotary substrate tray, characterized in that, Comprising: A support cylinder, the top of which is used to support the substrate tray, and the bottom of which is arranged on the rotating flange; the side wall of the support cylinder includes an upper side wall and a lower side wall and a stepped surface arranged between the upper side wall and the lower side wall, and the diameter of the lower side wall is larger than that of the upper side wall; An elastic member, which is arranged on the stepped surface; A connecting member, which is arranged around the outside of the support cylinder, and an extending portion extending towards the support cylinder is provided at the top of the connecting member, and the extending portion has a connecting surface opposite to the stepped surface; the connecting surface presses on the elastic member to provide pressure to the elastic member so that the elastic member presses tightly on the stepped surface; The bottom of the connecting member is connected to the rotating flange, so that the support cylinder is fixed on the rotating flange by the pressure provided by the connecting member and the elastic member.
2. The rotary drive device according to claim 1, characterized in that, The connecting surface is formed by extending inwards along the radial direction of the connecting member. When the connecting surface presses on the elastic member, there is a gap between the connecting member and the outside of the support cylinder.
3. The rotary drive device according to claim 1, characterized in that, The height of the stepped surface on the side wall of the support cylinder is lower than 2 / 3 of the height of the support cylinder.
4. The rotary drive device according to claim 1, characterized in that, An included angle is formed between the stepped surface and the upper side wall or the lower side wall in the vertical direction, and the range of the included angle is 10° to 90°.
5. The rotary drive device according to claim 1, characterized in that, The elastic member is an annular spring, and the annular spring is arranged around the side wall of the support cylinder for one week on the circular stepped surface.
6. The rotary drive device according to claim 1, characterized in that, The elastic member is a plurality of columnar springs, and the columnar springs are evenly spaced along the circumferential direction of the stepped surface.
7. The rotary drive device according to claim 6, characterized in that, Each of the columnar springs includes a central axis, and the central axes of the plurality of columnar springs are tangentially arranged with the circle where the stepped surface is located, or the central axes of the plurality of columnar springs face upwards from the stepped surface towards the connecting surface of the connecting member.
8. The rotary drive device according to claim 1, characterized in that, At least three positioning pins are arranged circumferentially on the rotating flange; at least three positioning holes corresponding to the positioning pins are provided at the bottom of the connecting member; the positioning pins are inserted into the corresponding positioning holes so that the connecting member and the rotating flange are connected to each other.
9. The rotary drive device according to claim 1, characterized in that, A limiting groove is arranged on the rotating flange, and a limiting ring is arranged in the limiting groove. The bottom of the support cylinder presses on the limiting ring, and the thermal conductivity coefficient of the material of the limiting ring is lower than that of the material of the support cylinder or the rotating flange.
10. The rotary drive device according to claim 9, characterized in that, The width of the limiting ring is larger than the width of the bottom of the support cylinder.
11. The rotary drive device according to claim 9, characterized in that, At least three limiting protrusions are arranged at intervals on the limiting ring; at least three limiting grooves corresponding to the limiting protrusions are provided at the bottom of the support cylinder; the limiting protrusions are embedded in the corresponding limiting grooves.
12. The rotary drive device according to claim 1, characterized in that, A fixing portion is arranged at the bottom of the connecting member; a plurality of through holes are arranged at intervals along the circumferential direction of the fixing portion; the through holes penetrate through the fixing portion, and a plurality of fixing members pass through the through holes to fixedly connect the connecting member and the rotating flange.
13. The rotary drive device according to claim 12, characterized in that, Mounting holes corresponding to the through holes are provided on the rotating flange for connecting the fixing members.
14. The rotary drive device according to claim 12, characterized in that, A gap exists between the bottom surface of the fixing portion and the upper surface of the rotating flange.
15. The rotary drive device according to claim 12, characterized in that, An adjusting spring is further arranged in the through hole. The bottom of the fixing member passes through the adjusting spring and is connected to the rotating flange. The top of the fixing member presses on the upper end of the adjusting spring, and the lower end of the adjusting spring presses on the bottom wall in the through hole of the fixing portion.
16. The rotary drive device according to claim 1, characterized in that, It further includes a driving mechanism, which is arranged below the rotating flange and is used to drive the rotating flange to rotate around its own central axis.
17. A chemical vapor deposition device, characterized in that, It includes: A reaction chamber; The reaction chamber is provided with an air inlet and an air outlet for input and discharge of process gas; The bottom of the reaction chamber is provided with the rotating driving device according to any one of claims 1 to 16; A heating device, which is arranged in the support cylinder and is used to heat the substrate tray to the reaction temperature.