Electronic device with heat dissipation function

Abstract

The invention discloses an electronic device with a heat dissipation function. The electronic device comprises a shell, a heat transfer unit and a shell cover, a mounting area, a first area and a second area are defined by the heat transfer unit and a substrate of the casing. In cooperation with the configuration of a plurality of first heat dissipation bosses and a plurality of second heat dissipation bosses of the heat transfer unit and a plurality of inclined plate units of the shell cover, the inlet air flow flowing in from the mounting area is dispersed into internal air flow to the four sides of the first area; and internal air flow is guided by the first heat dissipation boss and the inclined plate unit, and the air flow is uniformly distributed and flows through the four first frame areas on the four sides of the first area. The airflow flows through the first area and continues to flow to four second frame areas on the four sides of the second area, and the internal airflow is blocked by the second heat dissipation bosses located in the second frame areas and forms vortex in gaps of the second heat dissipation bosses. And the heat flows out from the gap of the second heat dissipation boss to the flow guide hole of the combination plate of the cover body.

Description

Technical Field

[0001] The present invention relates to an outdoor electronic system, and particularly to an electronic device with a heat dissipation function. Background Art

[0002] In recent years, with the booming development and rapid growth of servers, it has become common to set up servers outdoors. The heat dissipation mechanism of outdoor servers is to open ventilation holes in the server casing, and the internal temperature of the servo is reduced by allowing external air to enter the ventilation holes. However, if high-heat electronic components such as the main device inside the server are installed, the simple natural convection heat dissipation mechanism through external air cannot effectively dissipate heat, which may lead to hazards such as server downtime or failure. Although there are already fans installed on the server casing to enhance the airflow of external air entering the ventilation holes, during the high-efficiency processing operation of the main device inside the server, high temperature and heat are generated. Only through the heat dissipation mechanism of increasing the airflow entering the ventilation holes for natural convection, it is still impossible to quickly and effectively cool the main device inside the server, and problems such as server downtime or failure will still occur. Therefore, how to effectively dissipate heat inside the server requires further exploration and improvement by practitioners. Summary of the Invention

[0003] Therefore, an object of the present invention is to provide an electronic device with a heat dissipation function and good heat dissipation efficiency.

[0004] Thus, the electronic device with a heat dissipation function of the present invention includes a casing, a heat transfer unit disposed on the casing, and a cover detachably coupled to the casing and covering the heat transfer unit.

[0005] The casing includes a housing and an electronic body unit disposed inside the housing. The housing has a substrate and four side plates respectively extending from the periphery of the substrate away from the substrate. The heat transfer unit cooperates with the substrate to define an installation area in the middle of the substrate, a first area surrounding the installation area, and a second area surrounding the first area. The first area is located between the installation area and the second area. The installation area is quadrilateral. The first area has four first border areas located outside the installation area and corresponding to the four sides of the installation area. The second area has four second border areas respectively located outside the first border areas of the first area and corresponding to the first border areas.

[0006] The heat transfer unit includes a first heat dissipation boss module disposed on the substrate and located in the first area, and a second heat dissipation boss module disposed on the substrate and located in the second area. The first heat dissipation boss module has four first heat dissipation boss groups respectively located in the first frame areas. Each first heat dissipation boss group has a plurality of first heat dissipation bosses arranged at intervals from each other, and the top surface of each first heat dissipation boss is rectangular. The first heat dissipation bosses located in two of the first frame areas spaced from each other are arranged vertically; the first heat dissipation bosses located in the other two first frame areas spaced from each other are arranged horizontally.

[0007] The second heat dissipation boss module has four second heat dissipation boss groups respectively located in the second frame areas. Each second heat dissipation boss group has a plurality of second heat dissipation bosses arranged at intervals from each other, the top surface of each second heat dissipation boss is square, and the height of the second heat dissipation boss is greater than the height of the first heat dissipation boss.

[0008] The housing cover includes a cover body and a fan unit disposed in the cover body and corresponding to the installation area. The cover body has a cover plate, four connecting plates respectively extending from the periphery of the cover plate towards the side plates of the chassis and fixed to the side plates, and a plurality of inclined plate units disposed on the cover plate and corresponding to the first frame area and extending from the cover plate towards the first frame area respectively. The inclined plate units respectively extend into the gaps between the first heat dissipation bosses located in the first frame areas. The connecting plates respectively correspond to the second frame areas and are respectively located outside the second frame areas. Each connecting plate has a plurality of flow guiding holes close to the corresponding side plate. The fan unit is disposed on the cover plate and located in the middle of the cover plate and corresponding to the installation area. The cover plate has an air flow hole unit corresponding to the fan unit.

[0009] The fan unit sucks the external incoming air flow from the air flow hole unit into the installation area and disperses the incoming air flow into an internal air flow flowing out towards the first frame areas on the four sides of the first area, and the internal air flow is guided by the first heat dissipation bosses located in the first frame areas and the inclined plate units extending into the gaps between the first heat dissipation bosses from each other, and the internal air flow is evenly distributed and flows through the first frame areas on the four sides of the first area, and the internal air flow flows through the first frame area and continues to flow towards the second frame areas on the four sides of the second area, and the internal air flow is blocked and interfered by the second heat dissipation bosses located in the second frame areas and forms a vortex in the gaps of the second heat dissipation bosses, and then flows out from the gaps of the second heat dissipation bosses towards the flow guiding holes of the connecting plates of the cover body.

[0010] Specifically, each first heat dissipation boss of the first heat dissipation boss module of the heat transfer unit is disposed on the substrate of the housing of the machine case and extends from the substrate toward the cover plate of the cover body of the machine case. Each second heat dissipation boss of the second heat dissipation boss module is disposed on the substrate of the housing and extends from the substrate toward the cover plate of the cover body. The square area of the top surface of each second heat dissipation boss is larger than the rectangular area of the top surface of each first heat dissipation boss.

[0011] Specifically, the height of each first heat dissipation boss of the heat transfer unit is the distance between the substrate of the housing and the cover plate of the cover body minus the height of the fan unit, and the height of each second heat dissipation boss is the distance between the substrate of the housing and the cover plate of the cover body.

[0012] Specifically, the first heat dissipation bosses of each first heat dissipation boss group of the first heat dissipation boss module of the heat transfer unit are located within each first border area and present multiple rows of first heat dissipation boss arrays. The second heat dissipation bosses of each second heat dissipation boss group of the second heat dissipation boss module are located within each second border area and present multiple rows of second heat dissipation boss arrays. The second heat dissipation bosses located within each second border area and close to the corresponding first border area form a first row of second heat dissipation boss arrays. The second heat dissipation bosses located within each second border area and close to the corresponding bonding plate form a second row of second heat dissipation boss arrays. The gap between two adjacent second heat dissipation bosses in each first row of second heat dissipation boss arrays is greater than the side length of the top surface of each second heat dissipation boss. The gap between two adjacent second heat dissipation bosses in each second row of second heat dissipation boss arrays is greater than the side length of the top surface of each second heat dissipation boss.

[0013] Specifically, the first heat dissipation bosses located within each first border area and close to the installation area form a first row of first heat dissipation boss arrays. The first heat dissipation bosses located within each first border area and close to the corresponding second border area form a third row of first heat dissipation boss arrays. The first heat dissipation bosses located between the first row of first heat dissipation boss arrays and the third row of first heat dissipation boss arrays form a second row of first heat dissipation boss arrays. The first heat dissipation bosses in the second row of first heat dissipation boss arrays respectively correspond to the gaps between the first heat dissipation bosses in the third row of first heat dissipation boss arrays. The first heat dissipation bosses in the first row of first heat dissipation boss arrays respectively correspond to the gaps between the first heat dissipation bosses in the second row of first heat dissipation boss arrays.

[0014] Specifically, the cover body of the cover is combined with the machine case, and the inclined plate units of the cover body respectively extend into the gaps between the first heat dissipation bosses located within the first border area, and the inclined plate units define multiple divergent flow field channels that radiate outward from the outer sides of the four corner borders of the installation area in the first border area of the first area.

[0015] In particular, the gap between two adjacent first heat dissipation bosses in the first heat dissipation boss array of each first row is greater than the width of the top surface of each first heat dissipation boss, the gap between two adjacent first heat dissipation bosses in the first heat dissipation boss array of each second row is greater than the width of the top surface of each first heat dissipation boss, and the gap between two adjacent first heat dissipation bosses in the first heat dissipation boss array of each third row is greater than the width of the top surface of each first heat dissipation boss.

[0016] In particular, each side plate of the housing of the machine shell has a engaging member, and each joint plate of the cover body of the shell cover further has a buckling member located below the diversion hole and capable of buckling and engaging with the engaging member of each side plate.

[0017] In particular, the base plate of the housing of the machine shell has a waterproof slot electrically connected to the electronic body unit, the fan unit of the shell cover has a fan module, and a power connection port connected to the fan module and detachably inserted and combined with the waterproof slot. The cover body of the shell cover is combined with the machine shell, and the power connection port of the fan unit is inserted and combined with the waterproof slot, so that the electronic body unit supplies power to the fan module of the fan unit to operate. The height of each first heat dissipation boss of the heat transfer unit is the distance between the base plate of the housing and the cover plate of the cover body minus the height of the fan module of the fan unit.

[0018] In particular, the shell cover further includes a plurality of rubber rivets for fixing the fan unit on the cover plate of the cover body, and the fan module of the fan unit is an axial flow fan.

[0019] Compared with the prior art, the electronic device with heat dissipation function of the present invention, through the design of defining the installation area, the first area and the second area by the heat transfer unit and the base plate, and in cooperation with the configuration of the first heat dissipation bosses of the first heat dissipation boss group, the second heat dissipation bosses of the second heat dissipation boss group and the inclined plate unit of the cover body, the incoming air flow is dispersed into internal air flows in the direction of the first frame areas on the four sides of the first area, and the internal air flows are continuously guided by the first heat dissipation bosses and the inclined plate unit extending into the gaps between the first heat dissipation bosses, so that the internal air flows are evenly distributed through the first frame areas, and the internal air flows flow through the first frame areas and continue to flow to the second frame areas on the four sides of the second area. The internal air flows will be blocked and interfered by the second heat dissipation bosses located in the second frame areas, and eddy currents will be formed in the gaps of the second heat dissipation bosses, and then flow out from the gaps of the second heat dissipation bosses to the diversion holes of the joint plate of the cover body, so that the flow field is regenerated and the overall air flow heat dissipation efficiency is enhanced, effectively ensuring the heat dissipation efficiency. Description of the Drawings

[0020] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0021] Figure 1 is an exploded perspective view illustrating an embodiment of an electronic device with heat dissipation function according to the present invention;

[0022] Figure 2 is a perspective view for assisting in explaining Figure 1 ;

[0023] Figure 3 is a top view schematic diagram illustrating the combination relationship of a chassis, a heat transfer unit, a first heat dissipation unit, and a cover in this embodiment;

[0024] Figure 4 is a side cross-sectional schematic diagram illustrating the connection relationship between a cover body of the cover and a housing body of the chassis in this embodiment; and

[0025] Figure 5 is an enlarged schematic diagram illustrating Figure 4 in which the internal air flow inside the cover flows out from one of the diversion holes at the lower part of one of the combination plates. Detailed Embodiment

[0026] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

[0027] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , the electronic device with heat dissipation function according to the present invention includes a chassis 1, a heat transfer unit 2 disposed on the chassis 1, and a cover 5 detachably coupled to the chassis 1 and covering the heat transfer unit 2.

[0028] The chassis 1 includes a housing body 10 and an electronic body unit (not shown in the figure) disposed inside the housing body 10. The housing body 10 has a substrate 11 and four side plates 12 respectively extending from the periphery of the substrate 11 away from the substrate 11. The heat transfer unit 2 cooperates with the substrate 11 to define an installation area 13 located in the middle of the substrate 11, a first area 14 surrounding the installation area 13, and a second area 15 surrounding the first area 14. The first area 14 is located between the installation area 13 and the second area 15. The installation area 13 is quadrilateral. The first area 14 has four first border areas 141 located outside the installation area 13 and corresponding to the four sides of the installation area 13 respectively. The second area 15 has four second border areas 151 respectively located outside the first border areas 141 of the first area 14 and corresponding to the first border areas 141.

[0029] The heat transfer unit 2 includes a first heat dissipation boss module 3 arranged on the substrate 11 and located in the first area 14, and a second heat dissipation boss module 4 arranged on the substrate 11 and located in the second area 15. The first heat dissipation boss module 3 has four first heat dissipation boss groups 31 respectively located in the first border area 141. Each first heat dissipation boss group 31 has a plurality of first heat dissipation bosses 32 arranged at intervals from each other, and the top surface of each first heat dissipation boss 32 is rectangular. The first heat dissipation bosses 32 located in two of the first border areas 141 spaced apart from each other are arranged vertically; the first heat dissipation bosses 32 located in the other two first border areas 141 spaced apart from each other are arranged horizontally. In short, in this embodiment, each first heat dissipation boss 32 is as follows. Figure 1 , Figure 3 As shown in the figure, the top surface of each first heat dissipation boss 32 is rectangular and each first heat dissipation boss 32 is as follows Figure 1 The first heat dissipation boss 32 is shown as a rectangular parallelepiped boss. Figure 3 As shown, the first heat dissipation bosses 32 located in two of the first border areas 141 opposite to each other in the first area 14 are arranged vertically; and the first heat dissipation bosses 32 located in the other two of the first border areas 141 opposite to each other in the first area 14 are arranged horizontally, but not limited to this.

[0030] The second heat dissipation boss module 4 has four second heat dissipation boss groups 41 respectively located in the second frame area 151. Each second heat dissipation boss group 41 has a plurality of second heat dissipation bosses 42 spaced apart from each other, and the top surface of each second heat dissipation boss 42 is square. The height of the second heat dissipation boss 42 is greater than the height of the first heat dissipation boss 32. In short, in this embodiment, each second heat dissipation boss 42 is as follows: Figure 1 , Figure 3 As shown in the figure, the top surface of each second heat dissipation boss 42 is a square and each second heat dissipation boss 42 is as follows Figure 1 The illustrated embodiment is a cubic convex column, but the present invention is not limited thereto. The top surface of each second heat dissipation boss 42 may be designed to be rectangular according to actual needs.

[0031] The housing cover 5 includes a cover body 51 and a fan unit 55 disposed within the cover body 51 and corresponding to the installation area 13. The cover body 51 has a cover plate 52, four bonding plates 53 respectively extending from the periphery of the cover plate 52 towards the side plate 12 of the chassis 1 and fixed to the side plate 12, and a plurality of inclined plate units 54 disposed on the cover plate 52 and corresponding to the first border area 141 and extending from the cover plate 52 towards the first border area 141 respectively. The inclined plate units 54 respectively extend into the gaps between the first heat dissipation bosses 32 located within the first border area 141. The bonding plates 53 respectively correspond to the second border area 151 and are respectively located outside the second border area 151. Each bonding plate 53 has a plurality of flow guiding holes 531 close to the corresponding side plate 12. The fan unit 55 is disposed on the cover plate 52 and in the middle of the cover plate 52 and corresponds to the installation area 13. The cover plate 52 has an air flow hole unit 521 corresponding to the fan unit 55.

[0032] The fan unit 55 sucks the external incoming air flow from the air flow hole unit 521 into the installation area 13 and disperses the incoming air flow into internal air flows flowing out towards the first border area 141 on the four sides of the first area 14. The internal air flows are guided by the first heat dissipation bosses 32 located within the first border area 141 and the inclined plate units 54 extending into the gaps between the first heat dissipation bosses 32, and the internal air flows are evenly distributed and flow through the first border area 141 on the four sides of the first area 14. Then the internal air flows flow through the first border area 141 and continue to flow towards the second border area 151 on the four sides of the second area 15. The internal air flows are blocked and interfered by the second heat dissipation bosses 42 located within the second border area 151, and after eddies are formed in the gaps of the second heat dissipation bosses 42, the internal air flows flow out from the gaps of the second heat dissipation bosses 42 towards the flow guiding holes 531 of the bonding plates 53 of the cover body 51.

[0033] During use, since the electronic body unit within the chassis 1 contacts the housing 10, the heat energy generated by the electronic body unit within the chassis 1 will be directly transferred by the side plate 12 of the housing 10 and the substrate 11 and transmitted through the substrate 11 to the first heat dissipation bosses 32 of the first heat dissipation boss module 3 of the heat transfer unit 2 and the second heat dissipation bosses 42 of the second heat dissipation boss module 4 for heat conduction. Then, when the fan unit 55 operates, it sucks the external incoming air flow from the air flow hole unit 521 into the installation area 13. The incoming air flow flowing in from the air flow hole unit 521 will first directly dissipate heat from the position area of the substrate 11 within the installation area 13, and directly cool the hot spots (such as the chip hot spots of the electronic body unit) where the substrate 11 contacts the electronic body unit, effectively reducing the hot spot temperature. And because the installation area 13 is as Figure 3Shown is a blank area where the heat transfer unit 2 is not provided. The air flow generated by the operation of the fan unit 55 will directly impact the hot spot area where the substrate 11 contacts the electronic body unit. Since the installation area 13 is a blank area without any heat transfer features, the fluid of the incoming air flow will naturally diffuse outward to the periphery of the installation area 13, effectively avoiding kinetic energy loss. Furthermore, since the incoming air flow diffuses to the periphery of the installation area 13 and will disperse into internal air flows that flow out in the direction of the first frame areas 141 on the four sides of the first area 14 to perform the heat dissipation and cooling action of the first heat dissipation bosses 32 of the first heat dissipation boss module 3, and the internal air flows are guided by the first heat dissipation bosses 32 located in the first frame areas 141 and the inclined plate units 54 extending into the gaps between the first heat dissipation bosses 32 from each other, and the internal air flows are evenly distributed as shown in Figure 3 through the four sides of the first area 14 in the first frame areas 141. That is, through the structural features of the cooperation between the first heat dissipation bosses 32 and the inclined plate units 54, the fluid of the internal air flow is guided and the fluid is evenly distributed as shown in Figure 3 in each area of the first frame areas 141 of the first area 14. Finally, the internal air flows flowing through the first frame areas 141 will continue to flow to the second frame areas 151 on the four sides of the second area 15. The internal air flows will be blocked and interfered by the second heat dissipation bosses 42 located in the second frame areas 151, and after eddy currents are formed in the gaps of the second heat dissipation bosses 42, the internal air flows will flow out from the gaps of the second heat dissipation bosses 42 to the flow guiding holes 531 of the bonding plates 53 of the cover body 51, thereby achieving the removal of the heat energy in the machine shell 1. That is to say, by blocking and interfering with the shortest path for the internal air flow to directly flow to the flow guiding holes 531 and flow out to the outside through the second heat dissipation bosses 42, the fluid will not simply flow directly in the direction of the flow guiding holes 531, but will first generate a fluid eddy current effect around the gaps of the second heat dissipation bosses 42, regenerate the flow field and enhance the overall air flow heat dissipation efficiency, and then flow out to the outside through the flow guiding holes 531 of the bonding plates 53 of the cover body 51. Furthermore, in cooperation with the design that the flow guiding holes 531 of each bonding plate 53 are as shown in Figure 4 close to the side plate 12, and each bonding plate 53 near the upper part of the cover plate 52 will block the air flow and make the air flow can only flow out from the flow guiding holes 531 at the lower part. Therefore, the fluid after generating the eddy current effect can only flow out from the flow guiding holes 531 located at the lower part of each bonding plate 53 as shown in Figure 5 shown, and further make the eddy current effect occur in a three-dimensional (3D) space, effectively removing more heat energy, but not limited thereto.

[0034] By designing the heat transfer unit 2 and the substrate 11 to define the installation area 13, the first area 14 and the second area 15, and cooperating with the configuration of the first heat dissipation bosses 32 of the first heat dissipation boss group 31, the second heat dissipation bosses 42 of the second heat dissipation boss group 41 and the inclined plate unit 54 of the cover body 51, the incoming air flow is dispersed into internal air flow in the direction of the first frame area 141 on the four sides of the first area 14. The internal air flow is continuously guided by the first heat dissipation bosses 32 and the inclined plate unit 54 extending into the gaps between the first heat dissipation bosses 32, so that the internal air flow is evenly distributed through the first frame area 141. The internal air flow flows through the first frame area 141 and continues to flow to the second frame area 151 on the four sides of the second area 15. The internal air flow is blocked and disturbed by the second heat dissipation bosses 42 located in the second frame area 151, and eddy currents are formed in the gaps of the second heat dissipation bosses 42. Then, the internal air flow flows out from the gaps of the second heat dissipation bosses 42 to the flow guiding holes 531 of the bonding plate 53 of the cover body 51, regenerating the flow field and enhancing the overall air flow heat dissipation efficiency, effectively ensuring the heat dissipation efficiency.

[0035] Here, it should be specifically noted that in this embodiment, each first heat dissipation boss 32 of the first heat dissipation boss module 3 of the heat transfer unit 2 is disposed on the substrate 11 of the housing 10 of the machine shell 1 and extends from the substrate 11 in the direction of the cover plate 52 of the cover body 51 of the housing cover 5. Each second heat dissipation boss 42 of the second heat dissipation boss module 4 is disposed on the substrate 11 of the housing 10 and extends from the substrate 11 in the direction of the cover plate 52 of the cover body 51. In this embodiment, the height of each first heat dissipation boss 32 of the heat transfer unit 2 is the distance between the substrate 11 of the housing 10 and the cover plate 52 of the cover body 51 minus the height of the fan unit 55, and the height of each second heat dissipation boss 42 is the distance between the substrate 11 of the housing 10 and the cover plate 52 of the cover body 51, but this is not limited thereto.

[0036] Incidentally, in this embodiment, the substrate 11 of the housing 10 of the housing 1 has a waterproof slot 111 electrically connected to the electronic body unit. The fan unit 55 of the cover 5 has a fan module 551 and a power connection port 552 that is connected to the fan module 551 and detachably inserted and coupled to the waterproof slot 111. The cover body 51 of the cover 5 is coupled to the housing 1, and the power connection port 552 of the fan unit 55 is inserted and coupled to the waterproof slot 111, so that the electronic body unit supplies power to the fan module 551 of the fan unit 55 to operate. The height of each first heat dissipation boss 32 of the heat transfer unit 2 is the distance between the substrate 11 of the housing 10 and the cover plate 52 of the cover body 51 minus the height of the fan module 551 of the fan unit 55. That is to say, when the power connection port 552 of the fan unit 55 is inserted and coupled to the waterproof slot 111, the fan module 551 is electrically connected to the electronic body unit of the housing 1, and the electronic body unit can stably supply power to the fan module 551 for operation. In addition, the electronic body unit can also adjust the rotation speed and fluid velocity of the fan module 551 by sending a control signal to the fan module 551, but not limited thereto. In this embodiment, the fan module 551 of the fan unit 55 is in the form of an axial flow fan, so the fan module 551 will draw the external incoming air flow from the air flow hole unit 521 into the installation area 13 and disperse it into an internal air flow, and as Figure 3 shown, it scatters in a scattered manner in the direction of the first frame areas 141 on the four sides of the first area 14, but not limited thereto. Incidentally, in this embodiment, the cover 5 further includes a plurality of rubber rivets (not shown in the figure) for fixing the fan unit 55 to the cover plate 52 of the cover body 51, that is, the fan unit 55 is directly fixed to the cover plate 52 by using the rubber rivets, but not limited thereto.

[0037] Here, it should be further noted that in this embodiment, each first heat dissipation boss 32 of each first heat dissipation boss module 3 of the heat transfer unit 2 is located within each first frame area 141 and presents multiple rows of first heat dissipation boss arrays 321. Each second heat dissipation boss 42 of each second heat dissipation boss module 4 is located within each second frame area 151 and presents multiple rows of second heat dissipation boss arrays 421. The second heat dissipation bosses 42 located within each second frame area 151 and close to the corresponding first frame area 141 form a first row of second heat dissipation boss arrays 421, and the second heat dissipation bosses 42 located within each second frame area 151 and close to the corresponding bonding plate 53 form a second row of second heat dissipation boss arrays 421. The gap d between two adjacent second heat dissipation bosses 42 in each first row of second heat dissipation boss arrays 421 is greater than the side length L of the top surface of each second heat dissipation boss 42, and the gap d between two adjacent second heat dissipation bosses 42 in each second row of second heat dissipation boss arrays 421 is greater than the side length L of the top surface of each second heat dissipation boss 42. Simply put, in this embodiment, each second heat dissipation boss 42 is in the shape of a square, and it is further restricted that the gap between two adjacent second heat dissipation bosses 42 in each row of second heat dissipation boss arrays 421 as shown in the figure is greater than the side length of the top surface of each second heat dissipation boss 42, but not limited thereto. In this embodiment, the first heat dissipation bosses 32 located within each first frame area 141 and close to the installation area 13 form a first row of first heat dissipation boss arrays 321, the first heat dissipation bosses 32 located within each first frame area 141 and close to the corresponding second frame area 151 form a third row of first heat dissipation boss arrays 321, and the first heat dissipation bosses 32 located between the first row of first heat dissipation boss arrays 321 and the third row of first heat dissipation boss arrays 321 form a second row of first heat dissipation boss arrays 321. The first heat dissipation bosses 32 of the second row of first heat dissipation boss arrays 321 respectively correspond to the gaps between the first heat dissipation bosses 32 of the third row of first heat dissipation boss arrays 321, and the first heat dissipation bosses 32 of the first row of first heat dissipation boss arrays 321 respectively correspond to the gaps between the first heat dissipation bosses 32 of the second row of first heat dissipation boss arrays 321. Simply put, in this embodiment, each first heat dissipation boss 32 is in the shape of a rectangle, and it is further restricted that the first heat dissipation bosses 32 of the first row of first heat dissipation boss arrays 321, the first heat dissipation bosses 32 of the second row of first heat dissipation boss arrays 321, and the first heat dissipation bosses 32 of the third row of first heat dissipation boss arrays 321 located within each first frame area 141 are as Figure 3patterns that are spaced apart and interleaved with each other as shown, but not limited thereto. In particular, in this embodiment, the gap between two adjacent first heat dissipation bosses 32 in each first row of the first heat dissipation boss array 321 is greater than the width of the top surface of each first heat dissipation boss 32, the gap between two adjacent first heat dissipation bosses 32 in each second row of the first heat dissipation boss array 321 is greater than the width of the top surface of each first heat dissipation boss 32, and the gap between two adjacent first heat dissipation bosses 32 in each third row of the first heat dissipation boss array 321 is greater than the width of the top surface of each first heat dissipation boss 32, but not limited thereto.

[0038] It should be specifically noted that in this embodiment, the cover body 51 of the shell cover 5 is combined with the machine shell 1, and the inclined plate units 54 of the cover body 51 respectively extend into the gaps between the adjacent first heat dissipation bosses 32 located in the first frame area 141, and the inclined plate units 54 define a plurality of inclined flow field channels 541 that are radially scattered outward from the outer sides of the four corners of the installation area 13 in the first frame area 141 of the first area 14. That is to say, through the structural characteristics of the first heat dissipation bosses 32 and the inclined plate units 54, the inclined flow field channels 541 shown as radially scattered are defined, and the fluid of the internal air flow is guided and the fluid is evenly distributed in each area of the first frame area 141 of the first area 14, but not limited thereto. Figure 3 patterns shown as radially scattered, and the fluid of the internal air flow is guided and the fluid is evenly distributed in each area of the first frame area 141 of the first area 14, but not limited thereto.

[0039] Incidentally, in this embodiment, each side plate 12 of the housing 10 of the machine shell 1 has a fastening member 121. Each bonding plate 53 of the cover body 51 of the shell cover 5 further has a fastening member 532 located below the flow guiding hole 531 and capable of being snap-fastened to the fastening member 121 of each side plate 12. Simply put, the bonding plate 53 of the shell cover 5 uses the fastening member 532 to be snap-fastened to the fastening member 121 of the side plate 12 of the machine shell 1, so that the shell cover 5 is combined with the machine shell 1 and covers the heat transfer unit 2, but not limited thereto.

[0040] In summary, for the electronic device with a heat dissipation function according to the present invention, through the design of defining the installation area 13, the first area 14 and the second area 15 by the heat transfer unit 2 and the substrate 11, and in cooperation with the configuration of the first heat dissipation bosses 32 of the first heat dissipation boss group 31, the second heat dissipation bosses 42 of the second heat dissipation boss group 41 and the inclined plate unit 54 of the cover body 51, the incoming air flow is dispersed into internal air flows in the direction of the first frame areas 141 on the four sides of the first area 14. The internal air flows are continuously guided by the first heat dissipation bosses 32 and the inclined plate unit 54 extending into the gaps between the first heat dissipation bosses 32, so that the internal air flows are evenly distributed through the first frame areas 141. The internal air flows flow through the first frame areas 141 and continue to flow to the second frame areas 151 on the four sides of the second area 15. The internal air flows are blocked and interfered by the second heat dissipation bosses 42 located in the second frame areas 151, and eddies are formed in the gaps of the second heat dissipation bosses 42. Then, the internal air flows flow out from the gaps of the second heat dissipation bosses 42 to the flow guiding holes 531 of the bonding plate 53 of the cover body 51, so that the flow field is regenerated and the overall air flow heat dissipation efficiency is enhanced, effectively ensuring the heat dissipation efficiency.

[0041] The above is only a specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An electronic device with a heat dissipation function, characterized in that, Comprising: A chassis, including a housing, and an electronic body unit disposed within the housing. The housing has a substrate, and four side plates respectively extending away from the substrate in the direction of the periphery of the substrate; A heat transfer unit disposed on the substrate of the housing. The heat transfer unit and the substrate cooperate to define an installation area located in the middle of the substrate, a first area surrounding the installation area, and a second area surrounding the first area. The first area is located between the installation area and the second area. The installation area is quadrilateral. The first area has four first border areas located outside the installation area and corresponding to the four sides of the installation area respectively. The second area has four second border areas respectively located outside the first border areas of the first area and corresponding to the first border areas. The heat transfer unit includes, A first heat dissipation boss module disposed on the substrate and located in the first area, having four first heat dissipation boss groups respectively located in the first border areas. Each first heat dissipation boss group has a plurality of first heat dissipation bosses arranged at intervals. The top surface of each first heat dissipation boss is rectangular. The first heat dissipation bosses located in two of the spaced-apart first border areas are arranged vertically, and the first heat dissipation bosses located in the other two spaced-apart first border areas are arranged horizontally, and A second heat dissipation boss module disposed on the substrate and located in the second area, having four second heat dissipation boss groups respectively located in the second border areas. Each second heat dissipation boss group has a plurality of second heat dissipation bosses arranged at intervals. The top surface of each second heat dissipation boss is square. The height of the second heat dissipation boss is greater than the height of the first heat dissipation boss; and A cover detachably coupled to the chassis and covering the heat transfer unit, including a cover body, and a fan unit disposed within the cover body and corresponding to the installation area. The cover body has a cover plate, four coupling plates respectively extending from the periphery of the cover plate towards the side plates of the chassis and fixed to the side plates, and a plurality of inclined plate units disposed on the cover plate and corresponding to the first border areas, and extending from the cover plate towards the first border areas respectively. The inclined plate units respectively extend into the gaps between the first heat dissipation bosses located in the first border areas. The coupling plates respectively correspond to the second border areas and are respectively located outside the second border areas. Each coupling plate has a plurality of flow guiding holes close to the corresponding side plate. The fan unit is disposed on the cover plate and located in the middle of the cover plate and corresponding to the installation area. The cover plate has an air flow hole unit corresponding to the fan unit, The fan unit sucks the external incoming air flow from the air flow hole unit into the installation area and disperses the incoming air flow into an internal air flow that flows out in the direction of the first frame area on the four sides of the first area. The internal air flow is guided by the first heat dissipation bosses located in the first frame area and the inclined plate unit extending into the gaps between the first heat dissipation bosses, and the internal air flow is evenly distributed through the first frame area on the four sides of the first area. Then the internal air flow flows through the first frame area and continues to flow to the second frame area on the four sides of the second area. The internal air flow is blocked and disturbed by the second heat dissipation bosses located in the second frame area, and after eddies are formed in the gaps of the second heat dissipation bosses, the internal air flow flows out from the gaps of the second heat dissipation bosses to the diversion holes of the bonding plate of the cover body.

2. The electronic device with a heat dissipation function according to claim 1, characterized in that, Each first heat dissipation boss of the first heat dissipation boss module of the heat transfer unit is arranged on the substrate of the housing of the machine shell and extends from the substrate in the direction of the cover plate of the cover body of the machine shell. Each second heat dissipation boss of the second heat dissipation boss module is arranged on the substrate of the housing and extends from the substrate in the direction of the cover plate of the cover body. The square area of the top surface of each second heat dissipation boss is larger than the rectangular area of the top surface of each first heat dissipation boss.

3. The electronic device with a heat dissipation function according to claim 2, characterized in that, The height of each first heat dissipation boss of the heat transfer unit is the distance between the substrate of the housing and the cover plate of the cover body minus the height of the fan unit. The height of each second heat dissipation boss is the distance between the substrate of the housing and the cover plate of the cover body.

4. The electronic device with a heat dissipation function according to claim 2, characterized in that, The first heat dissipation bosses of each first heat dissipation boss group of the first heat dissipation boss module of the heat transfer unit are located in each first frame area and present multiple rows of first heat dissipation boss arrays. The second heat dissipation bosses of each second heat dissipation boss group of the second heat dissipation boss module are located in each second frame area and present multiple rows of second heat dissipation boss arrays. The second heat dissipation bosses located in each second frame area and close to the corresponding first frame area form a first row of second heat dissipation boss arrays. The second heat dissipation bosses located in each second frame area and close to the corresponding bonding plate form a second row of second heat dissipation boss arrays. The gap between two adjacent second heat dissipation bosses in each first row of second heat dissipation boss arrays is larger than the side length of the top surface of each second heat dissipation boss. The gap between two adjacent second heat dissipation bosses in each second row of second heat dissipation boss arrays is larger than the side length of the top surface of each second heat dissipation boss.

5. The electronic device with a heat dissipation function according to claim 4, characterized in that, The first heat dissipation bosses located in each first frame area and near the installation area form a first row of first heat dissipation boss arrays. The first heat dissipation bosses located in each first frame area and near the corresponding second frame area form a third row of first heat dissipation boss arrays. The first heat dissipation bosses located between the first row of first heat dissipation boss arrays and the third row of first heat dissipation boss arrays form a second row of first heat dissipation boss arrays. The first heat dissipation bosses in the second row of first heat dissipation boss arrays respectively correspond to the gaps between the first heat dissipation bosses in the third row of first heat dissipation boss arrays. The first heat dissipation bosses in the first row of first heat dissipation boss arrays respectively correspond to the gaps between the first heat dissipation bosses in the second row of first heat dissipation boss arrays.

6. The electronic device with a heat dissipation function according to claim 5, characterized in that, The cover body of the cover is combined with the machine shell, and the inclined plate units of the cover body respectively extend into the gaps between the first heat dissipation bosses located in the first frame area, and the inclined plate units define a plurality of oblique flow field channels that are radially scattered outward from the outer sides of the four corner frames of the installation area in the first frame area of the first area.

7. The electronic device with a heat dissipation function according to claim 5, characterized in that, The gap between two adjacent first heat dissipation bosses in each first row of first heat dissipation boss arrays is greater than the width of the top surface of each first heat dissipation boss. The gap between two adjacent first heat dissipation bosses in each second row of first heat dissipation boss arrays is greater than the width of the top surface of each first heat dissipation boss. The gap between two adjacent first heat dissipation bosses in each third row of first heat dissipation boss arrays is greater than the width of the top surface of each first heat dissipation boss.

8. The electronic device with a heat dissipation function according to claim 1, characterized in that, Each side plate of the housing of the machine shell has a engaging member, and each engaging plate of the cover body of the cover also has a fastening member located below the guiding hole and capable of being fastened and combined with the engaging member of each side plate.

9. The electronic device with a heat dissipation function according to claim 3, characterized in that, The base plate of the housing of the machine shell has a waterproof socket electrically connected to the electronic body unit. The fan unit of the cover has a fan module and a power connection port connected to the fan module and detachably inserted and combined with the waterproof socket. The cover body of the cover is combined with the machine shell so that the power connection port of the fan unit is inserted and combined with the waterproof socket, and the electronic body unit supplies power to the fan module of the fan unit to operate. The height of each first heat dissipation boss of the heat transfer unit is the distance between the base plate of the housing and the cover plate of the cover body minus the height of the fan module of the fan unit.

10. The electronic device with a heat dissipation function according to claim 9, characterized in that, The cover also includes a plurality of rubber rivets for fixing the fan unit on the cover plate of the cover body, and the fan module of the fan unit is an axial flow fan.

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