Method and equipment for analyzing performance of copper-based copper alloy wire based on digital simulation

Abstract

The invention is applicable to the technical field of copper-based copper alloy wires, and particularly relates to a method and equipment for analyzing the performance of a copper-based copper alloy wire based on digital simulation, and the method comprises the steps: obtaining model information; wherein the model information comprises a simulation model and a comparison model; obtaining local feature information based on the model information; wherein the local feature information comprises at least one piece of area information, and the area information reflects the area range of specific areas on the simulation model and the comparison model; obtaining performance analysis information based on the local feature information and the model information; wherein the performance analysis information comprises information reflecting the performance of the copper-based copper alloy wire. According to the digital simulation-based copper-based copper alloy wire performance analysis method and equipment provided by the embodiment of the invention, the problem that the performance of the copper-based copper alloy wire is affected due to the fact that cracks appear in the copper-based copper alloy wire or on the surface of the copper-based copper alloy wire can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of copper-based copper alloy wires, and particularly relates to a method and device for analyzing the performance of copper-based copper alloy wires based on digital simulation. Background Art

[0002] Copper-based copper alloy wires are solid wire products in coils or reels obtained by using copper as the matrix, melting alloy wire blanks by adding various other metal elements, and then undergoing complex processes such as drawing and heat treatment. They combine the excellent electrical conductivity and thermal conductivity of copper with the increased strength and hardness brought by alloying elements.

[0003] However, since there are other metal elements in copper-based copper alloy wires besides copper, cracks may occur inside or on the surface of copper-based copper alloy wires during the production process due to production process problems, affecting the performance of copper-based copper alloy wires. Summary of the Invention

[0004] The embodiments of this application provide a method and device for analyzing the performance of copper-based copper alloy wires based on digital simulation, which can improve the problem that cracks occur inside or on the surface of copper-based copper alloy wires, affecting the performance of copper-based copper alloy wires.

[0005] In a first aspect, the embodiments of this application provide a method for analyzing the performance of copper-based copper alloy wires based on digital simulation, including:

[0006] Obtaining model information; wherein, the model information includes a simulation model and a comparison model, the simulation model is a model reflecting the physical characteristics of copper-based copper alloy wires, and the comparison model is a model reflecting the physical characteristics of copper-based copper alloy wires under ideal conditions;

[0007] Obtaining local feature information based on the model information; wherein, the local feature information includes at least one region information, and the region information reflects the region range of a specific region on the simulation model and the comparison model;

[0008] Obtaining performance analysis information based on the local feature information and the model information; wherein, the performance analysis information includes information reflecting the performance of the copper-based copper alloy wires.

[0009] The above technical solutions in the embodiments of this application have at least the following technical effects:

[0010] The method for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by the embodiments of the present application first obtains model information including a simulation model and a comparison model. The simulation model simulates various physical behaviors of copper-based copper alloy wires under actual working conditions, and the comparison model provides a reference in an ideal state, which helps to clarify the differences between the actual copper-based copper alloy wires and the ideal state. Then, local feature information is obtained based on the model information, and the area range reflected by the area information in the local feature information is analyzed and studied specifically to improve the analysis efficiency. Further, performance analysis information is obtained based on the local feature information and the model information to determine whether the performance of the copper-based copper alloy wires is qualified and to improve the problem that cracks appear inside or on the surface of the copper-based copper alloy wires, affecting the performance of the copper-based copper alloy wires.

[0011] In a second aspect, the embodiments of the present application provide a system for analyzing the performance of copper-based copper alloy wires based on digital simulation, including:

[0012] An acquisition unit for acquiring model information; wherein, the model information includes a simulation model and a comparison model, the simulation model is a model reflecting the physical characteristics of copper-based copper alloy wires, and the comparison model is a model reflecting the physical characteristics of copper-based copper alloy wires under ideal conditions;

[0013] A first analysis unit for obtaining local feature information based on the model information; wherein, the local feature information includes at least one area information, and the area information reflects a specific area on the simulation model and the comparison model;

[0014] A second analysis unit for obtaining performance analysis information based on the local feature information and the model information; wherein, the performance analysis information includes information reflecting the performance of the copper-based copper alloy wires.

[0015] In a third aspect, the embodiments of the present application provide a device for analyzing the performance of copper-based copper alloy wires based on digital simulation, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method described in any one of the first aspects above is implemented.

[0016] In a fourth aspect, the embodiments of the present application provide a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the method described in any one of the first aspects above is implemented.

[0017] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product runs on a copper-based copper alloy wire performance analysis device based on digital simulation, it causes the copper-based copper alloy wire performance analysis device based on digital simulation to execute the copper-based copper alloy wire performance analysis method according to any one of the above first aspects.

[0018] It can be understood that the beneficial effects of the above second to fifth aspects can be referred to the relevant descriptions in the above first aspect, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic flowchart of a copper-based copper alloy wire performance analysis method based on digital simulation provided by an embodiment of the present application;

[0021] Figure 2 It is a schematic flowchart of step S200 in the copper-based copper alloy wire performance analysis method based on digital simulation provided by an embodiment of the present application;

[0022] Figure 3 It is a schematic flowchart of step S300 in the copper-based copper alloy wire performance analysis method based on digital simulation provided by an embodiment of the present application;

[0023] Figure 4 It is a schematic structural diagram of a copper-based copper alloy wire performance analysis system provided by an embodiment of the present application;

[0024] Figure 5 It is a schematic structural diagram of a copper-based copper alloy wire performance analysis device based on digital simulation provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] In the following description, specific details such as specific system structures and technologies are proposed for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, those skilled in the art should clearly understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present application.

[0026] It should be understood that, as used in the specification of this application and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or their groups.

[0027] It should also be understood that the term "and / or" as used in the specification of this application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0028] As used in the specification of this application and the appended claims, the term "if" may be construed, depending on the context, as "when", "once", "in response to determining", or "in response to detecting". Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be construed, depending on the context, as meaning "once determined", "in response to determining", "once [the described condition or event] is detected", or "in response to detecting [the described condition or event]".

[0029] In addition, in the description of the specification of this application and the appended claims, the terms "first", "second", "third", etc. are used only for differentiating descriptions and should not be construed as indicating or implying relative importance.

[0030] Reference to "one embodiment" or "some embodiments" or the like described in the specification of this application means that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of this application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. The terms "comprising", "including", "having", and their variants all mean "including but not limited to", unless otherwise specifically emphasized in another way.

[0031] The copper-based copper alloy wire is a solid wire product in coils or reels with copper as the matrix, which is obtained by adding a variety of other metal elements to fuse into an alloy wire blank and then through complex processes such as drawing and heat treatment. It combines the excellent electrical conductivity and thermal conductivity of copper and the enhanced strength and hardness brought by alloying elements.

[0032] However, since there are other metal elements in the copper-based copper alloy wire besides copper, cracks may occur inside or on the surface of the copper-based copper alloy wire due to production process problems during production, affecting the performance of the copper-based copper alloy wire.

[0033] To solve the above problems, an embodiment of the present application provides a method and device for analyzing the performance of copper-based copper alloy wires based on digital simulation. In this method, model information including a simulation model and a comparison model is first obtained. The simulation model simulates various physical behaviors of the copper-based copper alloy wire under actual working conditions, and the comparison model provides a reference under an ideal state, which helps to clarify the differences between the actual copper-based copper alloy wire and the ideal state. Then, local feature information is obtained based on the model information, and the area range reflected by the area information in the local feature information is specifically analyzed and studied to improve the analysis efficiency. Further, performance analysis information is obtained based on the local feature information and the model information to determine whether the performance of the copper-based copper alloy wire is qualified and to improve the problem that cracks appear inside or on the surface of the copper-based copper alloy wire, affecting the performance of the copper-based copper alloy wire.

[0034] The method for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by an embodiment of the present application can be applied to a device for analyzing the performance of copper-based copper alloy wires based on digital simulation. At this time, the device for analyzing the performance of copper-based copper alloy wires based on digital simulation is the execution subject of the method for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by an embodiment of the present application. The specific type of the device for analyzing the performance of copper-based copper alloy wires based on digital simulation is not limited in any way by an embodiment of the present application.

[0035] For example, the device for analyzing the performance of copper-based copper alloy wires based on digital simulation can be a mobile phone, a tablet computer, a laptop computer, a handheld device with wireless communication functions, a computing device, or other processing devices connected to a wireless modem, etc., but is not limited thereto.

[0036] To better understand the method for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by an embodiment of the present application, the following provides an exemplary introduction to the specific implementation process of the method for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by an embodiment of the present application.

[0037] Figure 1 The schematic flowchart of the method for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by an embodiment of the present application is shown. The method for analyzing the performance of copper-based copper alloy wires based on digital simulation includes:

[0038] S100, obtaining model information; wherein, the model information includes a simulation model and a comparison model. The simulation model is a model reflecting the physical characteristics of the copper-based copper alloy wire, and the comparison model is a model reflecting the physical characteristics of the copper-based copper alloy wire under ideal conditions.

[0039] It can be understood that the method for obtaining the simulation model can be to receive the model data transmitted by the user, or to receive the data transmitted by an ultrasonic scanning device (such as an industrial CT scanner, a phased array ultrasonic scanner, etc., but not limited to this) for 3D modeling, etc., but not limited to this. The method for obtaining the comparison model can be to receive the model data transmitted by the user, or to obtain geometric parameters such as diameter and length, as well as basic mechanical property parameters such as density, elastic modulus, and Poisson's ratio, and perform modeling through modeling software (such as Deform, ANSYS, etc., but not limited to this), etc., but not limited to this. Obtaining the model information can help clarify the differences between the actual copper-based copper alloy wire and the ideal state, providing a basis for subsequent steps.

[0040] Optionally, the length and diameter of the comparison model are exactly the same as those of the simulation model in terms of length and diameter to ensure the reliability of subsequent steps.

[0041] S200, obtaining local feature information based on the model information; wherein, the local feature information includes at least one region information, and the region information reflects the region range of a specific region on the simulation model and the comparison model.

[0042] It can be understood that the method for obtaining local feature information based on the model information can be to send the model information to the user and then receive the data transmitted by the user, or to overlap the simulation model and the comparison model along the length direction and confirm the different regions between the simulation model and the comparison model as local feature information, etc., but not limited to this. Obtaining local feature information based on the model information can specifically analyze and study the region range reflected by the region information in the local feature information, improve the analysis efficiency, and provide a basis for subsequent steps.

[0043] In a possible implementation manner, please refer to Figure 2 , S200, obtaining local feature information based on the model information, including:

[0044] S210, inputting the simulation model into a defect recognition model to obtain an analysis model; wherein, the analysis model includes the simulation model and the internal defect contours marked on the simulation model.

[0045] It can be understood that the defect recognition model is trained using multiple sets of data through machine learning (such as convolutional neural network, attention mechanism model, etc.). The multiple sets of data include the first type of data and the second type of data. Each set of data in the first type of data includes: a simulation model including at least one internal defect and the contour of the internal defect in the simulation model analyzed and marked by an artificial person. Each set of data in the second type of data includes: a simulation model without internal defects and a label indicating that there are no internal defects in the simulation model marked by an artificial person. Identifying the internal defects in the simulation model through the defect recognition model can improve work efficiency and provide a basis for subsequent steps.

[0046] S220. Establish an analysis coordinate system based on the analysis model. Among them, the origin of the analysis coordinate system coincides with the center point of one end of the simulation model, the positive direction of the X-axis of the analysis coordinate system is in the same direction as the length direction of the simulation model, and the positive direction of the Y-axis of the analysis coordinate system is in the same direction as the radius direction of the cross-section of the simulation model.

[0047] It can be understood that the method for confirming the center point of one end of the simulation model can be to first obtain the image of one end of the simulation model, then perform edge detection using the Canny algorithm and extract the contour, and then calculate the moment of the contour to obtain the center point, or it can be to receive the data transmitted by the user, etc., but it is not limited to this. Establishing an analysis coordinate system based on the analysis model can provide a basis for subsequent steps.

[0048] S230. Place the comparison model in the analysis coordinate system. After the comparison model coincides with the analysis model, confirm the analysis coordinate system, the comparison model, and the analysis model as the analysis environment.

[0049] It can be understood that the way to confirm whether the comparison model coincides with the analysis model can be to determine whether the coordinates of each point on the comparison model can find corresponding points on the analysis model, or it can be to receive the data transmitted by the user, etc., but it is not limited to this. Placing the comparison model in the analysis coordinate system and, after the comparison model coincides with the analysis model, confirming the analysis coordinate system, the comparison model, and the analysis model as the analysis environment can unify the reference standard, improve the analysis efficiency, and provide a basis for subsequent steps.

[0050] S240. Obtain local feature information based on the analysis environment.

[0051] It can be understood that obtaining local feature information based on the analysis environment can be to confirm the range with defects on the simulation model and the range on the comparison model that is the same as the range with defects on the simulation model as the local feature information, or it can be to receive the data transmitted by the user, etc., but it is not limited to this. Obtaining local feature information based on the analysis environment can provide a basis for subsequent steps.

[0052] In a possible implementation, please refer to Figure 2 , S240. Obtain local feature information based on the analysis environment, including:

[0053] S241. Analyze each internal defect contour in the analysis model respectively to obtain multiple pieces of analysis numerical information corresponding to each internal defect contour respectively. Among them, the analysis numerical information includes the near-origin feature value, the far-origin feature value, and the defect length value. The near-origin feature value is the X-axis coordinate value of the point closest to the origin of the analysis coordinate system in the internal defect contour, the far-origin feature value is the X-axis coordinate value of the point farthest from the origin of the analysis coordinate system in the internal defect contour, and the defect length value is the value obtained by subtracting the near-origin feature from the far-origin feature.

[0054] It can be understood that the way to obtain the near original eigenvalue and the far original eigenvalue can be to calculate the length of each point on each internal defect contour from the origin, and confirm the X-axis coordinate of the point with the minimum length as the near original eigenvalue, and confirm the X-axis coordinate of the point with the maximum length as the far original eigenvalue. It can also be to receive data transmitted by the user, etc., but not limited to this. Obtaining multiple pieces of analytical numerical information corresponding to each internal defect contour respectively can provide a basis for subsequent steps.

[0055] Exemplarily, assume that the coordinates of the point on the internal defect contour closest to the origin are (1, 1, 1), and the coordinates of the point farthest from the origin are (2, 1, 1). Then the near original eigenvalue is 1, the far original eigenvalue is 2, and the defect length value = 2 - 1 = 1.

[0056] S242, obtain the total length; where the total length is the X-axis coordinate value of the point farthest from the origin of the analysis coordinate system in the analysis model.

[0057] It can be understood that the way to obtain the total length can be to confirm the maximum X-axis coordinate value among the points on the analysis model as the total length, or to receive data transmitted by the user, etc., but not limited to this. Obtaining the total length can provide a basis for subsequent steps.

[0058] S243, obtain local feature information based on all the analytical numerical information and the total length.

[0059] It can be understood that the way to obtain local feature information based on all the analytical numerical information and the total length can be to analyze the ratio of the defect length value corresponding to each internal defect contour to the total length, or to send all the analytical numerical information and the total length to the user and then receive the data transmitted by the user, etc., but not limited to this.

[0060] In a possible implementation manner, please refer to Figure 2 , S243, obtain local feature information based on all the analytical numerical information and the total length, including:

[0061] S2431, divide the defect length value in each piece of analytical numerical information by the total length respectively to obtain multiple expansion ratios corresponding to each piece of analytical numerical information respectively.

[0062] It can be understood that obtaining multiple expansion ratios corresponding to each piece of analytical numerical information respectively can provide a basis for subsequent steps.

[0063] Exemplarily, assume there are 2 pieces of analytical numerical information numbered 1 and 2 respectively. The defect length in the analytical numerical information numbered 1 is 4, the defect length in the analytical numerical information numbered 2 is 5, and the total length is 100. Then, the expansion ratio corresponding to the analytical numerical information numbered 1 = 4 / 100 = 0.04, and the expansion ratio corresponding to the analytical numerical information numbered 2 = 5 / 100 = 0.05.

[0064] S2432. Multiply each expansion ratio by the defect length value corresponding to the analytical numerical information to which the expansion ratio corresponds, to obtain multiple expansion values respectively corresponding to each piece of analytical numerical information.

[0065] It can be understood that obtaining multiple expansion values respectively corresponding to each piece of analytical numerical information can perform different treatments for each different defect, providing a basis for subsequent steps.

[0066] Exemplarily, assume there are 2 pieces of analytical numerical information numbered 1 and 2 respectively. The defect length in the analytical numerical information numbered 1 is 4 and the expansion ratio is 0.04, the defect length in the analytical numerical information numbered 2 is 5 and the expansion ratio is 0.05. Then, the expansion value corresponding to the analytical numerical information numbered 1 is 4 * 0.04 = 0.16, and the expansion value corresponding to the analytical numerical information numbered 2 is 5 * 0.05 = 0.25.

[0067] S2433. After respectively subtracting the expansion value corresponding to the analytical numerical information from the near original feature value in each piece of analytical numerical information, the obtained value is confirmed as the regional near value, and after adding the expansion value corresponding to the analytical numerical information to the far original feature value, the obtained value is confirmed as the regional far value, to obtain multiple regional ranges; wherein, the regional range is a numerical interval formed between the regional near value and the regional far value.

[0068] It can be understood that obtaining multiple regional ranges can perform different treatments for each different defect, providing a basis for subsequent steps.

[0069] Exemplarily, assume the near original feature value of a certain piece of analytical numerical information is 1, the far original feature value is 2, and the expansion value corresponding to the analytical numerical information is 0.25. Then, the regional near value corresponding to this piece of analytical numerical information = 1 - 0.25 = 0.75, the regional far value corresponding to this piece of analytical numerical information = 2 + 0.25 = 2.25, and the regional range corresponding to this piece of analytical numerical information is (0.75, 2.25).

[0070] S2434. On the X-axis of the analytical coordinate system in the analytical environment, respectively confirm the analytical model and the comparison model within each regional range as regional information.

[0071] It can be understood that on the X-axis of the analysis coordinate system in the analysis environment, the analysis models and comparison models within each region range are respectively confirmed as regional information, which can clearly define the analysis range and provide a basis for subsequent steps.

[0072] Exemplarily, assuming a certain region range is (0.75, 2.25), then the analysis models and comparison models with X-axis coordinate values within (0.75, 2.25) are confirmed as regional information.

[0073] S2435, confirm all the regional information as local feature information.

[0074] It can be understood that confirming all the regional information as local feature information can specifically analyze and study the region range reflected by the regional information in the local feature information, improving the analysis efficiency.

[0075] S300, obtain performance analysis information based on the local feature information and model information; among them, the performance analysis information includes information reflecting the performance of the copper-based copper alloy wire.

[0076] It can be understood that it can be obtained by performing simulation analysis on the analysis model through simulation software and then analyzing according to the force curves of each regional information in the local feature information, or by receiving data transmitted by the user, etc., but not limited to this. Obtaining performance analysis information including information reflecting the performance of the copper-based copper alloy wire based on the local feature information and model information can determine whether the performance of the copper-based copper alloy wire is qualified and improve problems such as cracks appearing inside or on the surface of the copper-based copper alloy wire, which affect the performance of the copper-based copper alloy wire.

[0077] In a possible implementation manner, please refer to Figure 3 , S300, obtaining performance analysis information based on the local feature information and model information, includes:

[0078] S310, obtain grid model information based on the local feature information and model information; among them, the grid model information includes an analysis grid model and a comparison grid model, the analysis grid model is the grid model of the analysis model, and the comparison grid model is the grid model of the comparison model.

[0079] It can be understood that the method of obtaining grid model information based on the local feature information and model information can be to perform finite element filling processing on the analysis model and the comparison model with tetrahedral elements or hexahedral elements through simulation modeling software (such as Gmsh, ANSYS Meshing, etc., but not limited to this), or to receive finite element model data transmitted by the user, etc., but not limited to this. Obtaining grid model information based on the local feature information and model information can provide a basis for subsequent steps.

[0080] In a possible implementation manner, please refer to Figure 3, S310, Obtain the mesh model information based on the local feature information and the model information, including:

[0081] S311, Input the analysis model and the comparison model into the simulation analysis software.

[0082] It can be understood that the simulation analysis software can be Ansys, Abaqus, etc., but not limited to this.

[0083] S312, Instruct the simulation analysis software to perform mesh division on the analysis model and the comparison model, so that in the analysis model and the comparison model, the mesh density in the area corresponding to each area information is a preset multiple of the mesh density in other areas of the analysis model and the comparison model.

[0084] It can be understood that the preset multiple can be 2 times, 5 times, etc., but not limited to this. Instructing the simulation analysis software to perform mesh division on the analysis model and the comparison model, so that the mesh density in the area corresponding to each area information in the analysis model and the comparison model is a preset multiple of the mesh density in other areas of the analysis model and the comparison model can analyze the gaps in the model, thereby avoiding waste of computing power resources and improving work efficiency at the same time.

[0085] Exemplarily, assuming the preset multiple is 2 times, when the mesh density (element size) in the area corresponding to the area information is 0.05 mm, the mesh density in other areas of the analysis model and the comparison model is 0.05 * 2 = 0.1 mm.

[0086] S313, Confirm the analysis model after mesh division as the analysis mesh model, and confirm the comparison model after mesh division as the comparison mesh model.

[0087] It can be understood that confirming the analysis model after mesh division as the analysis mesh model and confirming the comparison model after mesh division as the comparison mesh model can provide a basis for subsequent steps.

[0088] S314, Confirm the analysis mesh model and the comparison mesh model as the mesh model information.

[0089] It can be understood that confirming the analysis mesh model and the comparison mesh model as the mesh model information can provide a basis for subsequent steps.

[0090] S320, Obtain the simulation information based on the simulation analysis software and the mesh model information; among them, the simulation information includes tensile simulation information and bending simulation information, the tensile simulation information reflects the tensile performance of the copper-based copper alloy wire corresponding to the analysis model, and the bending simulation information reflects the bending performance of the copper-based copper alloy wire corresponding to the analysis model.

[0091] It can be understood that the method of obtaining simulation information based on the simulation analysis software and the grid model information can be obtained by performing a simulation of the analysis grid model and the comparison grid model through the simulation analysis software while performing a force analysis on the analysis grid model and the comparison grid model, or by sending the simulation data obtained by the analysis grid model and the comparison grid model during the simulation to the user and then receiving the data transmitted by the user, etc., but not limited to this. Obtaining simulation information based on the simulation analysis software and the grid model information can provide data support for determining whether the performance of the copper-based copper alloy wire is qualified.

[0092] In a possible implementation manner, please refer to Figure 3 , S320, obtaining simulation information based on the simulation analysis software and the grid model information, including:

[0093] S321, obtaining tensile simulation information; wherein, the tensile simulation information includes a plurality of tensile information and tensile comparison information. The tensile information reflects the relationship between the stress and displacement within the range of the area information when the analysis grid model is stretched to a preset displacement along the length direction, and the tensile comparison information reflects the relationship between the stress and displacement when the comparison grid model is stretched to a preset displacement along the length direction.

[0094] It can be understood that the preset displacement can be 0.5 mm, 0.6 mm, etc., but not limited to this. The method of obtaining the tensile simulation information can be receiving the stress-strain curve transmitted by the simulation analysis software when stretching the analysis grid model, or receiving the cloud map showing the stress distribution transmitted by the simulation analysis software, etc., but not limited to this. Obtaining the tensile simulation information including a plurality of tensile information and tensile comparison information can provide a basis for subsequent steps.

[0095] S322, obtaining tensile simulation information based on the tensile simulation information.

[0096] It can be understood that obtaining the tensile simulation information based on the tensile simulation information can be obtained by analyzing according to the stress-strain curve transmitted by the simulation analysis software, or by sending the data transmitted by the simulation analysis software to the user and then receiving the data transmitted by the user, etc., but not limited to this. Obtaining the tensile simulation information based on the tensile simulation information can provide a basis for judging the tensile performance of the copper-based copper alloy wire.

[0097] In a possible implementation manner, please refer to Figure 3 , S322, obtaining tensile simulation information based on the tensile simulation information, including:

[0098] S3221, obtaining the average stress based on the comparison information; wherein, the average stress reflects the average stress of the comparison grid model when it is stretched to a preset displacement along the length direction.

[0099] It can be understood that the method of obtaining the average stress based on the comparison information can be to receive the data transmitted by the simulation analysis software, or to receive the data transmitted by the user, etc., but is not limited thereto. Obtaining the average stress based on the comparison information can provide a basis for subsequent steps.

[0100] Exemplarily, assume that the data of the comparison grid model is: a thin copper wire with a length L = 100 mm and a diameter d = 0.5 mm, the material is pure copper, its elastic modulus E = 110 GPa, Poisson's ratio ν = 0.34, yield strength σ_y = 200 MPa. When the displacement ΔL = 0.5 mm, through the finite element calculation of the simulation analysis software, the stress distribution of the overall comparison grid model is relatively uniform, and the average stress = E×(ΔL / L) = 110×10 3 MPa×(0.5 / 100) = 550 MPa.

[0101] S3222, obtain multiple tip stresses respectively based on each tensile information; wherein, the tip stress reflects the maximum stress borne by the tip of the internal defect in the region range during tensile.

[0102] It can be understood that obtaining multiple tip stresses based on each tensile information can provide a basis for subsequent steps.

[0103] S3223, respectively confirm the values obtained by dividing each tip stress by the average stress as the stress concentration coefficient.

[0104] It can be understood that the larger the stress concentration coefficient, the lower the bearing capacity and the overall mechanical properties of the analysis grid model. Confirming the stress concentration coefficient can provide a basis for analyzing the influence of the gap on the overall model.

[0105] Exemplarily, assume that the average stress is 550 MPa and the tip stress is 1500 MPa, then the stress concentration coefficient = 1500 / 550 ≈ 2.73 (rounded to two decimal places).

[0106] S3224, respectively judge whether each stress concentration coefficient is greater than the preset tensile coefficient. If there is a stress concentration coefficient greater than the preset tensile coefficient, then obtain the tensile simulation information reflecting unqualified tensile performance. If there is no stress concentration coefficient greater than the preset tensile coefficient, then confirm the stress concentration coefficient with the largest value among the stress concentration coefficients as the tensile simulation information.

[0107] It can be understood that the preset tensile coefficient can be 0.8, 0.9, etc., but is not limited thereto. If there is a stress concentration coefficient greater than the preset tensile coefficient, it means that there is a gap seriously affecting the tensile performance of the copper-based copper alloy wire. If there is no stress concentration coefficient greater than the preset tensile coefficient, then the stress concentration coefficient with the largest value among all the stress concentration coefficients can best reflect the tensile performance of the copper-based copper alloy wire.

[0108] S323. Obtain bending simulation information, where the bending simulation information includes multiple bending comparison information, and the bending comparison information reflects the relationship between the bending moment and the stress when the analysis grid model and the comparison grid model are bent simultaneously with the area corresponding to the same area information as the bending point.

[0109] It can be understood that the way to obtain the bending simulation information can be to receive the stress-strain curve transmitted by the simulation analysis software when bending the analysis grid model, or to receive the cloud map showing the stress distribution transmitted by the simulation analysis software, etc., but not limited to this. Obtaining the bending simulation information can provide a basis for judging the bending performance of the copper-based copper alloy wire.

[0110] S324. Obtain bending simulation information based on the bending simulation information.

[0111] It can be understood that the way to obtain the bending simulation information based on the bending simulation information can be to analyze according to the stress-bending moment curve transmitted by the simulation analysis software, or to send the data transmitted by the simulation analysis software to the user and then receive the data transmitted by the user, etc., but not limited to this. Obtaining the bending simulation information based on the bending simulation information can provide a basis for judging the bending performance of the copper-based copper alloy wire.

[0112] In a possible implementation, please refer to Figure 3 , S324. Obtain bending simulation information based on the bending simulation information, including:

[0113] S3241. For each bending comparison information, the value obtained by dividing the absolute value of the difference between the stress of the analysis grid model and the stress of the comparison grid model at the same bending moment by the stress of the comparison grid model is confirmed as the deformation rate.

[0114] It can be understood that the stress of the analysis grid model at the same bending moment can be the average stress within the area corresponding to the area information, or the maximum stress within the area corresponding to the area information, etc., but not limited to this. Calculating the value obtained by dividing the absolute value of the difference between the stress of the analysis grid model and the stress of the comparison grid model at the same bending moment by the stress of the comparison grid model for each bending comparison information and confirming it as the deformation rate can provide a basis for the subsequent steps.

[0115] Exemplarily, assuming that at the same bending moment, the stress of the analysis grid model is 550 MPa and the stress of the comparison grid model is 500 MPa, then the deformation rate = (550 - 500) / 500 = 0.1.

[0116] S3242. Respectively judge whether each deformation rate is within the preset deformation range. If there is a deformation rate not within the preset deformation range, obtain the bending simulation information indicating that the bending performance does not meet the expectation.

[0117] It can be understood that the preset deformation range can be (-0.05, 0.05), or (-0.1, 0.1), etc., but it is not limited thereto. If the deformation rate is not within the preset deformation range, it means that the bending performance of the copper-based copper alloy wire does not meet the expectation.

[0118] S3243. If each deformation rate is within the preset deformation range, then the stress of the analysis grid model corresponding to the deformation rate with the largest value in the deformation rates is confirmed as the bending simulation information.

[0119] It can be understood that if each deformation rate is within the preset deformation range, it means that the bending performance of the copper-based copper alloy wire is qualified, and the stress of the analysis grid model corresponding to the deformation rate with the largest value in the deformation rates is the stress threshold when the copper-based copper alloy wire is bent.

[0120] S325. Confirm the tensile simulation information and the bending simulation information as the simulation and simulation information.

[0121] It can be understood that confirming the tensile simulation information and the bending simulation information as the simulation and simulation information can provide a basis for subsequent steps.

[0122] S330. Obtain the performance analysis information based on the simulation and simulation information.

[0123] It can be understood that the way to obtain the performance analysis information based on the simulation and simulation information can be obtained by judging the content in the tensile simulation information and the bending simulation information, or by sending the simulation and simulation information to the user and then receiving the data transmitted by the user, etc., but it is not limited thereto. Obtaining the performance analysis information based on the simulation and simulation information can provide a basis for judging whether the performance of the copper-based copper alloy wire is qualified, and improve the problem that cracks appear inside or on the surface of the copper-based copper alloy wire, affecting the performance of the copper-based copper alloy wire.

[0124] In a possible implementation manner, please refer to Figure 3 , S330. Obtain the performance analysis information based on the simulation and simulation information, including:

[0125] S331. If the tensile simulation information reflects that the tensile performance is unqualified, and / or the bending simulation information reflects that the bending performance does not meet the expectation, then obtain the performance analysis information reflecting that the performance of the copper-based copper alloy wire corresponding to the analysis grid model is unqualified.

[0126] It can be understood that if the tensile simulation information reflects that the tensile performance is unqualified, and / or the bending simulation information reflects that the bending performance does not meet the expectation, it means that the performance of the copper-based copper alloy wire cannot meet the user's expectation.

[0127] S331. If the stretching simulation information does not reflect unqualified stretching performance and the bending simulation information does not reflect unexpected bending performance, then the stretching simulation information and the bending simulation information are confirmed as performance analysis information.

[0128] It can be understood that confirming the stretching simulation information and the bending simulation information as performance analysis information can provide data support for users to further analyze the stretching performance and bending performance of copper-based copper alloy wires.

[0129] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0130] Corresponding to the method for analyzing the performance of copper-based copper alloy wires based on digital simulation described in the above embodiments, an embodiment of the present application also provides a system for analyzing the performance of copper-based copper alloy wires based on digital simulation. Each unit of this system can implement each step of the method for analyzing the performance of copper-based copper alloy wires based on digital simulation. Figure 4 The block diagram of the system for analyzing the performance of copper-based copper alloy wires based on digital simulation provided by the embodiment of the present application is shown. For the sake of convenience of description, only the parts related to the embodiment of the present application are shown.

[0131] Refer to Figure 4 , this system includes:

[0132] An acquisition unit, configured to acquire model information; wherein, the model information includes a simulation model and a comparison model, the simulation model is a model reflecting the physical characteristics of the copper-based copper alloy wire, and the comparison model is a model reflecting the physical characteristics of the copper-based copper alloy wire under ideal conditions.

[0133] A first analysis unit; configured to obtain local feature information based on the model information; wherein, the local feature information includes at least one region information, and the region information reflects a specific region on the simulation model and the comparison model.

[0134] A second analysis unit, configured to obtain performance analysis information based on the local feature information and the model information; wherein, the performance analysis information includes information reflecting the performance of the copper-based copper alloy wire.

[0135] It should be noted that for the information interaction, execution process, etc. between the above units, since they are based on the same concept as the method embodiment of the present application, for their specific functions and the technical effects brought, reference can be specifically made to the method embodiment part, and details are not described herein again.

[0136] Those skilled in the art can clearly understand that, for the convenience and conciseness of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the system is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of this application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiment and will not be elaborated here.

[0137] An embodiment of this application also provides a performance analysis device for copper-based copper alloy wires based on digital simulation. Figure 5 FIG. is a schematic structural diagram of a performance analysis device for copper-based copper alloy wires based on digital simulation provided by an embodiment of this application. As Figure 5 shown, the performance analysis device for copper-based copper alloy wires based on digital simulation in this embodiment includes a control device 6. Among them, the control device 6 includes: at least one processor 60 ( Figure 5 only one is shown in the figure), at least one memory 61 ( Figure 5 only one is shown in the figure), and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, the performance analysis device for copper-based copper alloy wires based on digital simulation implements the steps in any of the above-mentioned embodiments of the performance analysis method for copper-based copper alloy wires based on digital simulation, or enables the performance analysis device for copper-based copper alloy wires based on digital simulation to implement the functions of each unit in the above-mentioned system embodiments.

[0138] Exemplarily, the computer program 62 can be divided into one or more modules / units. The one or more modules / units are stored in the memory 61 and executed by the processor 60 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of completing specific functions, and these instruction segments are used to describe the execution process of the computer program 62 in the control device 6.

[0139] The control device 6 can be a computing device such as a desktop computer, a notebook, a palm computer, and a cloud server. The control device 6 may include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art can understand that Figure 5This is only an example of the performance analysis device for copper-based copper alloy wires based on digital simulation, and does not limit the performance analysis device for copper-based copper alloy wires based on digital simulation. It may include more or fewer components than those shown, or combine certain components, or different components. For example, it may also include input / output devices, network access devices, buses, etc.

[0140] The processor 60 may be a central processing unit (CPU), and the processor 60 may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0141] In some embodiments, the memory 61 may be an internal storage unit of the control device 6, such as the hard disk or memory of the control device 6. In other embodiments, the memory 61 may also be an external storage device of the control device 6, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 6. Further, the memory 61 may also include both the internal storage unit and the external storage device of the control device 6. The memory 61 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program, etc. The memory 61 may also be used to temporarily store data that has been output or will be output.

[0142] An embodiment of the present application also provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0143] An embodiment of the present application provides a computer program product, and when the computer program product runs on a performance analysis device for copper-based copper alloy wires based on digital simulation, the performance analysis device for copper-based copper alloy wires based on digital simulation implements the steps in any of the above method embodiments.

[0144] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above-described embodiment methods of this application, a computer program can be used to instruct relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-described method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file, or some intermediate form, etc. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the copper-based copper alloy wire performance analysis device based on digital simulation, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk, or an optical disc, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable medium cannot be an electrical carrier signal and a telecommunication signal.

[0145] In the above embodiments, the descriptions of the various embodiments have their own emphases. For parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0146] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0147] In the embodiments provided in this application, it should be understood that the disclosed copper-based copper alloy wire performance analysis system, device, and method based on digital simulation can be implemented in other ways. For example, the copper-based copper alloy wire performance analysis system and device embodiments described above are only illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces, and the indirect couplings or communication connections of devices or units can be in electrical, mechanical, or other forms.

[0148] The unit described as a separation component may or may not be physically separated. The component displayed as a unit may or may not be a physical unit, that is, it may be located in one place or may be distributed over multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0149] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included within the protection scope of the present application.

Claims

1. A method for analyzing the performance of copper-based copper alloy wire based on digital simulation, characterized in that: include: Acquire model information; wherein the model information includes a simulation model and a comparison model, the simulation model is a model reflecting the physical characteristics of the copper-based copper alloy wire, and the comparison model is a model reflecting the physical characteristics of the copper-based copper alloy wire under ideal conditions; Obtaining local feature information based on the model information; wherein the local feature information includes at least one area information, and the area information reflects the area range of a specific area on the simulation model and the comparison model; Performance analysis information is obtained based on the local feature information and the model information; wherein the performance analysis information includes information reflecting the performance of the copper-based copper alloy wire.

2. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 1, characterized in that: The obtaining of local feature information based on the model information includes: Inputting the simulation model into a defect recognition model to obtain an analysis model; wherein the analysis model includes the simulation model and an internal defect contour annotated on the simulation model; An analysis coordinate system is established based on the analysis model; wherein the origin of the analysis coordinate system coincides with the center point of one end of the simulation model, the positive direction of the X-axis of the analysis coordinate system is in the same direction as the length direction of the simulation model, and the positive direction of the Y-axis of the analysis coordinate system is in the same direction as the radius direction of the cross section of the simulation model; Placing the comparison model in the analysis coordinate system so that the comparison model and the analysis model coincide with each other, and then confirming the analysis coordinate system, the comparison model and the analysis model as an analysis environment; The local feature information is obtained based on the analysis environment.

3. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 2, characterized in that: The obtaining the local feature information based on the analysis environment includes: Analyze each of the internal defect contours in the analysis model respectively to obtain a plurality of analysis numerical information corresponding to each of the internal defect contours; wherein the analysis numerical information includes a near-origin characteristic value, a far-origin characteristic value, and a defect length value, wherein the near-origin characteristic value is the X-axis coordinate value of the point in the internal defect contour that is closest to the origin of the analysis coordinate system, the far-origin characteristic value is the X-axis coordinate value of the point in the internal defect contour that is farthest from the origin of the analysis coordinate system, and the defect length value is the value obtained by subtracting the near-origin characteristic value from the far-origin characteristic value; Obtaining a total length; wherein the total length is the X-axis coordinate value of the point in the analysis model that is farthest from the origin of the analysis coordinate system; The local feature information is obtained based on all of the analysis value information and the total length.

4. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 3, characterized in that: The obtaining of the local feature information based on all the analyzed numerical information and the total length includes: Dividing the defect length value in each of the analysis numerical information by the total length respectively, to obtain a plurality of expansion ratios respectively corresponding to each of the analysis numerical information; Multiplying each of the expansion ratios by the defect length value corresponding to the analysis numerical information corresponding to the expansion ratio, respectively, to obtain a plurality of expansion values ​​corresponding to each of the analysis numerical information; The numerical value obtained by subtracting the expanded value corresponding to the analysis numerical information corresponding to the near-original eigenvalue from the near-original eigenvalue in each of the analysis numerical information is confirmed as the regional near value, and the numerical value obtained by adding the expanded value corresponding to the analysis numerical information corresponding to the far-original eigenvalue to the far-original eigenvalue is confirmed as the regional far value, thereby obtaining a plurality of regional ranges; wherein the regional range is a numerical interval formed between the regional near value and the regional far value; On the X-axis of the analysis coordinate system in the analysis environment, the analysis model and the comparison model within each of the regional ranges are respectively confirmed as regional information; All of the area information is confirmed as the local feature information.

5. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 2, characterized in that: The obtaining of performance analysis information based on the local feature information and the model information includes: Obtaining mesh model information based on the local feature information and the model information; wherein the mesh model information includes an analysis mesh model and a comparison mesh model, the analysis mesh model is a mesh model of the analysis model, and the comparison mesh model is a mesh model of the comparison model; Simulation information is obtained based on the simulation analysis software and the grid model information; wherein the simulation information includes stretching simulation information and bending simulation information, the stretching simulation information reflects the tensile properties of the copper-based copper alloy wire corresponding to the analysis model, and the bending simulation information reflects the bending properties of the copper-based copper alloy wire corresponding to the analysis model; The performance analysis information is obtained based on the simulation information.

6. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 5, characterized in that: The obtaining of mesh model information based on the local feature information and the model information includes: Inputting the analysis model and the comparison model into simulation analysis software; Instructing the simulation analysis software to perform mesh division on the analysis model and the comparison model so that the mesh density in the region corresponding to each of the region information in the analysis model and the comparison model is a preset multiple of the mesh density of other regions in the analysis model and the comparison model; confirming the analysis model after the meshing is completed as the analysis mesh model, and confirming the comparison model after the meshing is completed as the comparison mesh model; The analysis grid model and the comparison grid model are confirmed as the grid model information.

7. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 5, characterized in that: The obtaining of simulation information based on the simulation analysis software and the grid model information includes: Acquire stretch simulation information; wherein the stretch simulation information includes a plurality of stretch information and stretch comparison information, wherein the stretch information reflects the relationship between stress and displacement within the region reflected by the region information when the analysis grid model is stretched to a preset displacement along the length direction, and the stretch comparison information reflects the relationship between stress and displacement when the comparison grid model is stretched to the preset displacement along the length direction; Obtaining the stretching simulation information based on the stretching simulation information; Acquire bending simulation information; wherein the bending simulation information includes a plurality of bending comparison information, and the bending comparison information reflects the relationship between the bending moment and the stress when the analysis grid model and the comparison grid model are bent at the same time with the region corresponding to the same region information as the bending point; Obtaining the bending simulation information based on the bending simulation information; The stretching simulation information and the bending simulation information are confirmed as the simulation information.

8. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 7, characterized in that: The obtaining the stretching simulation information based on the stretching simulation information includes: Obtaining an average stress based on the comparison information; wherein the average stress reflects the average stress of the comparison grid model when it is stretched to the preset displacement along the length direction; A plurality of tip stresses are obtained based on each of the stretching information; wherein the tip stress reflects the maximum stress borne by the tip of the internal defect in the region when stretched; The values ​​obtained by dividing each of the tip stresses by the average stress are respectively confirmed as stress concentration factors; It is judged whether each stress concentration coefficient is greater than the preset tensile coefficient respectively. If there is a stress concentration coefficient greater than the preset tensile coefficient, the tensile simulation information reflecting that the tensile performance is unqualified is obtained. If there is no stress concentration coefficient greater than the preset tensile coefficient, the stress concentration coefficient with the largest value among the stress concentration coefficients is confirmed as the tensile simulation information.

9. The copper-based copper alloy wire performance analysis method based on digital simulation according to claim 7, characterized in that: The obtaining the bending simulation information based on the bending simulation information includes: Calculating in each of the bending comparison information, respectively, the absolute value of the value obtained by subtracting the stress of the analysis grid model from the stress of the comparison grid model at the same bending moment and dividing it by the stress of the comparison grid model to obtain a value as the deformation rate; respectively judging whether each of the deformation rates is within a preset deformation range, and if there is a deformation rate that is not within the preset deformation range, obtaining the bending simulation information reflecting that the bending performance does not meet expectations; If all the deformation rates are within the preset deformation range, the stress of the analysis grid model corresponding to the deformation rate with the largest value among the deformation rates is confirmed as the bending simulation information.

10. A copper-based copper alloy wire performance analysis device based on digital simulation, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 9 is implemented.

Images