Chip separation method, device, equipment and medium

Abstract

The invention discloses a chip separation method, device and equipment and a medium, and relates to the technical field of chip manufacturing. The method comprises the following steps of: fixing crystal bonding gummed paper on the fixing clamp, bonding a wafer on the crystal bonding gummed paper, and dividing the wafer into a plurality of chips, each chip comprising a long edge and a short edge; the wafer expanding table is controlled to ascend, so that the long-edge wafer expanding cylinder and the short-edge wafer expanding cylinder stretch the wafer bonding gummed paper; and the wafer expanding table is controlled to stop rising, and the short-edge wafer expanding cylinder is controlled to rise, so that the short-edge wafer expanding cylinder stretches the wafer bonding gummed paper. After the wafer expanding table stops ascending, the short-edge wafer expanding cylinder can be independently controlled to ascend, so that the wafer chips continue to be separated in the short-edge direction, the distance between the short edges is increased, finally the separation distance between the long edges and the short edges of the chips is the same, and the chips can be accurately grabbed conveniently when the chips are transferred subsequently.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular, to a chip separation method, device, equipment and medium. Background Art

[0002] In the existing dicing and separating technology, the wafer that has completed stealth dicing and grinding thinning is transferred to the fixed fixture of the dicing and separating equipment. As the dicing table rises, the cylinders around the dicing table will expand and pull the die bonding tape around, so as to separate the wafer and the die bonding layer into individual chips.

[0003] In the existing dicing and separating technology, the rising distance of the dicing cylinders is the same, so the expansion pulling force of the cylinders on the die bonding tape is the same. However, since the chips have long sides and short sides, under the same pulling force, the separation distance in the long side direction is greater than that in the short side direction. The greater the size difference between the long side and the short side of the chip, the more significant the non-uniformity of the separation distance. This non-uniformity will greatly reduce the accuracy and efficiency of subsequent automatic chip grasping. At the same time, the greater the size difference between the long side and the short side, the lower the separation rate in the short side direction of the chip. Summary of the Invention

[0004] Embodiments of the present invention provide a chip separation method, device, equipment and medium, aiming to solve at least one of the technical problems in the above background art.

[0005] In a first aspect, an embodiment of the present invention provides a chip separation method. The chip separation equipment includes a dicing table and a fixed fixture, and the dicing table is arranged below the fixed fixture; the dicing table includes two groups of long-side dicing cylinders and two groups of short-side dicing cylinders. The two groups of long-side dicing cylinders are arranged oppositely, and the two groups of short-side dicing cylinders are arranged oppositely. One group of the long-side dicing cylinders and one group of the short-side dicing cylinders are arranged alternately to form an annular structure surrounding the dicing table. The method includes:

[0006] Fix the die bonding tape on the fixed fixture, wherein the wafer is pasted on the die bonding tape, and the wafer is divided into multiple chips, and the chips include long sides and short sides;

[0007] Control the dicing table to rise so that the long-side dicing cylinders and the short-side dicing cylinders stretch the die bonding tape;

[0008] Control the dicing table to stop rising, and control the short-side dicing cylinders to rise so that the short-side dicing cylinders stretch the die bonding tape.

[0009] A further technical solution thereof is that the long side of the chip is arranged along the direction of the center line connection of the two groups of long-side dicing cylinders; the short side of the chip is arranged along the direction of the center line connection of the two groups of short-side dicing cylinders.

[0010] A further technical solution is that when the spacing between the chips on the wafer along the long side of the chip reaches a preset first distance, the dicing table is controlled to stop rising.

[0011] A further technical solution is that when the spacing between the chips on the wafer along the short side of the chip reaches a preset second distance, the short-side dicing cylinder is controlled to stop rising.

[0012] A further technical solution is that the chip separation device further includes a first lifting device and a second lifting device. The first lifting device is connected to the dicing table to drive the dicing table to lift; the second lifting device is connected to the short-side dicing cylinder to drive the short-side dicing cylinder to lift.

[0013] In a second aspect, an embodiment of the present invention provides a chip separation device, which includes a dicing table and a fixed fixture. The dicing table is disposed below the fixed fixture; the dicing table includes two groups of long-side dicing cylinders and two groups of short-side dicing cylinders; the two groups of long-side dicing cylinders are arranged oppositely, the two groups of short-side dicing cylinders are arranged oppositely, a short-side dicing cylinder is disposed on each side of the long-side dicing cylinder, and a long-side dicing cylinder is disposed on each side of the short-side dicing cylinder.

[0014] A further technical solution is that the chip separation device further includes a first lifting device and a second lifting device. The first lifting device is connected to the dicing table to drive the dicing table to lift; the second lifting device is connected to the short-side dicing cylinder to drive the short-side dicing cylinder to lift.

[0015] In a third aspect, an embodiment of the present invention further provides a chip separation apparatus, which includes units for executing the above method.

[0016] In a fourth aspect, an embodiment of the present invention further provides a computer device, which includes a memory and a processor. A computer program is stored on the memory, and when the processor executes the computer program, the above method is implemented.

[0017] In a fifth aspect, an embodiment of the present invention further provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the above method can be implemented.

[0018] An embodiment of the present invention provides a chip separation method, apparatus, device, and medium. The chip separation device includes a dicing table and a fixing fixture, and the dicing table is disposed below the fixing fixture. The dicing table includes two groups of long-side dicing cylinders and two groups of short-side dicing cylinders. The two groups of long-side dicing cylinders are disposed opposite to each other, and the two groups of short-side dicing cylinders are disposed opposite to each other. One short-side dicing cylinder is disposed on each side of the long-side dicing cylinder, and one long-side dicing cylinder is disposed on each side of the short-side dicing cylinder. The method includes: fixing the die bonding tape on the fixing fixture, where a wafer is pasted on the die bonding tape, and the wafer is divided into multiple chips, and the chips include long sides and short sides; controlling the dicing table to rise so that the long-side dicing cylinders and the short-side dicing cylinders stretch the die bonding tape; controlling the dicing table to stop rising, and controlling the short-side dicing cylinders to rise so that the short-side dicing cylinders stretch the die bonding tape. After the dicing table stops rising, the short-side dicing cylinders can be controlled independently to rise, so that the wafer chips continue to be separated along the short-side direction, thereby increasing the short-side spacing. Finally, the separation distances of the long sides and short sides of the chips are the same, which facilitates accurately grasping the chips during subsequent chip transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic flow chart of a chip separation method provided by an embodiment of the present invention;

[0021] Figure 2 It is a schematic diagram of a dicing table of a chip separation device provided by an embodiment of the present invention;

[0022] Figure 3 It is a schematic structural diagram of a chip separation device provided by an embodiment of the present invention;

[0023] Figure 4 It is a schematic side view of a chip separation device provided by an embodiment of the present invention;

[0024] Figure 5 It is a schematic diagram of the dicing table of a chip separation device rising provided by an embodiment of the present invention;

[0025] Figure 6 It is a schematic diagram of the short-side dicing cylinders of a chip separation device rising provided by an embodiment of the present invention;

[0026] Figure 7Schematic block diagram of the computer device provided by the embodiment of the present invention.

[0027] Reference numeral

[0028] Chip expansion table 10, fixing fixture 20, long-side chip expansion cylinder 30, short-side chip expansion cylinder 40, die bonding tape 50, wafer 60, die bonding layer 70. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0030] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations.

[0031] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in this specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0032] It should be further understood that the term " / and / " used in this specification of the present invention and the appended claims refers to any combination and all possible combinations of one or more of the related listed items, and includes these combinations.

[0033] As used in this specification and the appended claims, the term "if" can be interpreted as "when", "once", "in response to determining" or "in response to detecting" according to the context. Similarly, the phrase "if determined" or "if detecting [the described condition or event]" can be interpreted as meaning "once determined", "in response to determining", "once detecting [the described condition or event]" or "in response to detecting [the described condition or event]" according to the context.

[0034] Please refer to Figures 2-6 , the embodiment of the present invention provides a chip separation device, and the chip separation device includes a chip expansion table 10 and a fixing fixture 20, which are specifically introduced as follows:

[0035] The chip expanding table 10 is arranged below the fixed fixture 20; the fixed fixture 20 is used for clamping and fixing the die bonding tape 50, the wafer 60 is pasted on the die bonding tape 50, the wafer 60 is divided into multiple chips, and the chips include long sides and short sides. Specifically, the wafer 60 can be pasted on the die bonding tape 50 through the die bonding layer 70. The material of the die bonding layer 70 can be an adhesive.

[0036] The chip expanding table 10 includes two groups of long side expanding cylinders 30 and two groups of short side expanding cylinders 40; each group of long side expanding cylinders 30 can include multiple long side expanding cylinders 30, for example, 4 in this embodiment, and each group of short side expanding cylinders 40 can include multiple short side expanding cylinders 40, for example, 4 in this embodiment.

[0037] The two groups of long side expanding cylinders 30 are arranged oppositely, the two groups of short side expanding cylinders 40 are arranged oppositely, and one group of the long side expanding cylinders 30 and one group of short side expanding cylinders 40 are arranged alternately to form an annular structure surrounding the chip expanding table 10. Specifically, in this embodiment, the two groups of long side expanding cylinders 30 and the two groups of short side expanding cylinders 40 are arranged alternately to jointly enclose a circle and are arranged on the outer periphery of the chip expanding table 10.

[0038] Furthermore, the chip separating device further includes a first lifting device and a second lifting device. The first lifting device is connected to the chip expanding table 10 and is used for driving the chip expanding table 10 to lift; the second lifting device is connected to the short side expanding cylinders 40 and is used for driving the short side expanding cylinders 40 to lift.

[0039] In this embodiment, the lifting of the chip expanding table 10 is controlled by the first lifting device, and the lifting of the short side expanding cylinders 40 is controlled by the second lifting device. Through the first lifting device, the chip expanding table 10 can be controlled to rise to stretch the die bonding tape 50, so that the chips of the wafer 60 are separated; through the second lifting device, the short side expanding cylinders 40 can be controlled to rise to stretch the die bonding tape 50, so that the chips of the wafer 60 are separated along the short side direction of the chips. Thus, after the chip expanding table 10 stops rising, the short side expanding cylinders 40 can be separately controlled to rise, so that the chips of the wafer 60 continue to be separated along the short side direction, thereby increasing the short side spacing, and finally making the separation distances of the long side and the short side of the chips the same, so as to facilitate accurately grasping the chips during subsequent chip transfer.

[0040] The structures of the first lifting device and the second lifting device can be the same, and can specifically include a motor, a transmission mechanism and a guiding module. The transmission mechanism can specifically be a ball screw, a gear rack, etc., and the guiding module can specifically be a guide rail. The present invention does not specifically limit this. The second lifting device can be arranged on the chip expanding table 10 and move together with the chip expanding table 10.

[0041] See Figure 1 and in combination with Figures 2-6, an embodiment of the present invention provides a chip separation method, which is applied to the above chip separation device. The chip separation method includes the following steps:

[0042] S1, fix the die bonding tape 50 on the fixing fixture 20. Among them, the wafer 60 is pasted on the die bonding tape 50, and the wafer 60 is divided into multiple chips, and the chips include long sides and short sides.

[0043] In a specific implementation, transfer and fix the die bonding tape 50 on the fixing fixture 20, and the fixing fixture 20 reliably fixes the die bonding tape 50. The wafer 60 is pasted on the die bonding tape 50, and the wafer 60 is divided into multiple chips, and the chips include long sides and short sides. Specifically, the wafer 60 can be pasted on the die bonding tape 50 through the die bonding layer 70.

[0044] When specifically placing, the long side of the chip is arranged along the direction of the center line connecting the centers of the two groups of long side expanding cylinders 30, so that when the long side expanding cylinder 30 rises, the chips of the wafer 60 are separated along the long side direction of the chip; the short side of the chip is arranged along the direction of the center line connecting the centers of the two groups of short side expanding cylinders 40, so that when the short side expanding cylinder 40 rises, the chips of the wafer 60 are separated along the short side direction of the chip.

[0045] In this embodiment, a group of long side expanding cylinders 30 includes four long side expanding cylinders 30, so there are two long side expanding cylinders 30 on each side of the center of a group of long side expanding cylinders 30; a group of short side expanding cylinders 40 includes four short side expanding cylinders 40, so there are two short side expanding cylinders 40 on each side of the center of a group of short side expanding cylinders 40.

[0046] S2, control the expanding table 10 to rise so that the long side expanding cylinder 30 and the short side expanding cylinder 40 stretch the die bonding tape 50.

[0047] In a specific implementation, control the expanding table 10 to rise so that the long side expanding cylinder 30 and the short side expanding cylinder 40 stretch the die bonding tape 50, and the chips on the wafer 60 are separated along the long side and the short side at the same time; the lifting of the expanding table 10 can be driven by a first lifting device.

[0048] Further, when the separation distance of the chips on the wafer 60 along the long side of the chip reaches a preset first distance, control the expanding table 10 to stop rising. The first distance can be set by those skilled in the art, and the present invention does not specifically limit this. The first distance needs to ensure that the chips can be grabbed in the long side direction of the chip.

[0049] S3, control the expanding table 10 to stop rising, and control the short side expanding cylinder 40 to rise so that the short side expanding cylinder 40 stretches the die bonding tape 50.

[0050] In specific implementation, control the expansion table 10 to stop rising, and control the short-side expansion cylinder 40 to rise, so that the short-side expansion cylinder 40 stretches the die bonding tape 50, and the chips of the wafer 60 are separated along the short sides of the chips. Specifically, the lifting of the short-side expansion cylinder 40 can be driven by a second lifting device.

[0051] When the separation distance of the chips of the wafer 60 along the short sides of the chips reaches a preset second distance, control the short-side expansion cylinder 40 to stop rising. The second distance can be set by those skilled in the art, and the present invention does not specifically limit this. The second distance needs to ensure that the chips can be grasped in the short-side direction of the chips. The first distance can be the same as the second distance.

[0052] An embodiment of the present invention provides a chip separation method. The chip separation device includes an expansion table 10 and a fixed fixture 20. The expansion table 10 is arranged below the fixed fixture 20. The expansion table 10 includes two groups of long-side expansion cylinders 30 and two groups of short-side expansion cylinders 40. The two groups of long-side expansion cylinders 30 are arranged oppositely, and the two groups of short-side expansion cylinders 40 are arranged oppositely. One short-side expansion cylinder 40 is arranged on each side of the long-side expansion cylinder 30, and one long-side expansion cylinder 30 is arranged on each side of the short-side expansion cylinder 40. The method includes: fixing the die bonding tape 50 on the fixed fixture 20, wherein the wafer 60 is pasted on the die bonding tape 50, and the wafer 60 is divided into multiple chips, and the chips include long sides and short sides; controlling the expansion table 10 to rise, so that the long-side expansion cylinders 30 and the short-side expansion cylinders 40 stretch the die bonding tape 50; controlling the expansion table 10 to stop rising, and controlling the short-side expansion cylinder 40 to rise, so that the short-side expansion cylinder 40 stretches the die bonding tape 50. After the expansion table 10 stops rising, the short-side expansion cylinder 40 can also be controlled to rise alone, so that the chips of the wafer 60 continue to be separated along the short sides of the chips, increasing the separation distance of the short sides of the chips. Eventually, the separation distances of the long sides and the short sides of the chips can be the same, so as to facilitate accurately grasping the chips during subsequent chip transfer.

[0053] The present invention also provides a chip separation device. The chip separation device includes a unit for executing the above chip separation method. The chip separation device can be configured in terminals such as desktop computers, tablet computers, and laptop computers. Specifically, the chip separation device includes:

[0054] A fixing unit for fixing the die bonding tape on the fixed fixture, wherein the wafer is pasted on the die bonding tape, and the wafer is divided into multiple chips, and the chips include long sides and short sides;

[0055] A first lifting unit for controlling the lifting of the dicing table so that the long-side dicing cylinders and the short-side dicing cylinders stretch the die bonding tape.

[0056] A second lifting unit for controlling the dicing table to stop rising and controlling the short-side dicing cylinders to rise so that the short-side dicing cylinders stretch the die bonding tape.

[0057] In some embodiments, such as this embodiment, the long side of the chip is arranged along the direction of the center connection line of two groups of long-side dicing cylinders; the short side of the chip is arranged along the direction of the center connection line of two groups of short-side dicing cylinders.

[0058] In some embodiments, such as this embodiment, when the separation distance of the chips on the wafer along the long side of the chip reaches a preset first distance, the lifting of the dicing table is controlled to stop.

[0059] In some embodiments, such as this embodiment, when the separation distance of the chips on the wafer along the short side of the chip reaches a preset second distance, the lifting of the short-side dicing cylinders is controlled to stop.

[0060] In some embodiments, such as this embodiment, the chip separation device further includes a first lifting device and a second lifting device. The first lifting device is connected to the dicing table for driving the lifting of the dicing table; the second lifting device is connected to the short-side dicing cylinders for driving the lifting of the short-side dicing cylinders.

[0061] It should be noted that those skilled in the art can clearly understand that the specific implementation processes of the above chip separation device and each unit can refer to the corresponding descriptions in the foregoing method embodiments. For the sake of convenience and brevity of description, they will not be elaborated here.

[0062] The above chip separation device can be implemented in the form of a computer program, and this computer program can run on a computer device as shown in Figure 7 shown.

[0063] Please refer to Figure 7 , Figure 7 which is a schematic block diagram of a computer device provided by an embodiment of the present invention. The computer device 500 can be a terminal or a server. Among them, the terminal can be an electronic device with a communication function such as a smart phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, and a wearable device. The server can be an independent server or a server cluster composed of multiple servers.

[0064] The computer device 500 includes a processor 502, a memory, and a network interface 505 connected through a system bus 501. Among them, the memory can include a non-volatile storage medium 503 and an internal memory 504.

[0065] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. When the computer program 5032 is executed, it can cause the processor 502 to execute a chip separation method.

[0066] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500.

[0067] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, it can cause the processor 502 to execute a chip separation method.

[0068] The network interface 505 is used for network communication with other devices. Those skilled in the art can understand that the above structure is only a block diagram of some structures related to the solution of the present invention, and does not constitute a limitation on the computer device 500 to which the solution of the present invention is applied. The specific computer device 500 may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0069] Wherein, the processor 502 is used to run the computer program 5032 stored in the memory to implement the steps of a chip separation method proposed in any embodiment of the present invention.

[0070] It should be understood that in the embodiment of the present invention, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0071] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a storage medium, and the storage medium is a computer-readable storage medium. The computer program is executed by at least one processor in the computer system to implement the process steps of the embodiments of the above method.

[0072] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program. When the computer program is executed by a processor, the processor is caused to execute the steps of a chip separation method as proposed in any embodiment of the present invention.

[0073] The storage medium is a physical, non-transitory storage medium, for example, it may be various physical storage media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disc, etc., which can store program codes. The computer-readable storage medium may be non-volatile or volatile.

[0074] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described according to their functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0075] In several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of each unit is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0076] The steps in the method embodiments of the present invention can be adjusted, combined, and deleted according to actual needs. The units in the device embodiments of the present invention can be combined, divided, and deleted according to actual needs. In addition, in each embodiment of the present invention, the functional units can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0077] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a terminal, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention.

[0078] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0079] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, provided that these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications therein.

[0080] As described above, the above are only the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A chip separation method, characterized in that: The chip separation device comprises a wafer expansion platform and a fixing fixture, wherein the wafer expansion platform is arranged at the lower side of the fixing fixture; the wafer expansion platform comprises two groups of long-side wafer expansion cylinders and two groups of short-side wafer expansion cylinders, the two groups of long-side wafer expansion cylinders are arranged opposite to each other, the two groups of short-side wafer expansion cylinders are arranged opposite to each other, one group of the long-side wafer expansion cylinders and one group of the short-side wafer expansion cylinders are alternately arranged to form a ring structure surrounding the wafer expansion platform, and the method comprises: Fixing the die-bonding tape on the fixing fixture, wherein the wafer is attached to the die-bonding tape, and the wafer is divided into a plurality of chips, each of which includes a long side and a short side; Controlling the expansion platform to rise so that the long-side expansion cylinder and the short-side expansion cylinder stretch the die-bonding adhesive tape; The film expansion platform is controlled to stop rising, and the short-side film expansion cylinder is controlled to rise, so that the short-side film expansion cylinder stretches the die-bonding adhesive tape.

2. The chip separation method according to claim 1, characterized in that: The long side of the chip is arranged along the direction of the line connecting the centers of the two groups of long-side expansion cylinders; the short side of the chip is arranged along the direction of the line connecting the centers of the two groups of short-side expansion cylinders.

3. The chip separation method according to claim 1, characterized in that: When the interval between the chips of the wafer separated along the long sides of the chips reaches a preset first distance, the wafer expansion stage is controlled to stop rising.

4. The chip separation method according to claim 1, characterized in that: When the interval between the chips of the wafer and the short sides of the chips reaches a preset second distance, the short side expansion cylinder is controlled to stop rising.

5. The chip separation method according to claim 1, characterized in that: The chip separation equipment also includes a first lifting device and a second lifting device. The first lifting device is connected to the wafer expansion stage to drive the wafer expansion stage to rise and fall; the second lifting device is connected to the short-side wafer expansion cylinder to drive the short-side wafer expansion cylinder to rise and fall.

6. A chip separation device, characterized in that: The chip separation device is used to execute the chip separation method as described in any one of claims 1 to 5, and the chip separation device includes a wafer expansion stage and a fixing fixture, wherein the wafer expansion stage is arranged at the lower side of the fixing fixture; the wafer expansion stage includes two groups of long-side wafer expansion cylinders and two groups of short-side wafer expansion cylinders; the two groups of long-side wafer expansion cylinders are arranged opposite to each other, and the two groups of short-side wafer expansion cylinders are arranged opposite to each other, and one short-side wafer expansion cylinder is respectively arranged on both sides of the long-side wafer expansion cylinder, and one long-side wafer expansion cylinder is respectively arranged on both sides of the short-side wafer expansion cylinder.

7. The chip separation device according to claim 6, characterized in that: The chip separation equipment also includes a first lifting device and a second lifting device. The first lifting device is connected to the wafer expansion stage to drive the wafer expansion stage to rise and fall; the second lifting device is connected to the short-side wafer expansion cylinder to drive the short-side wafer expansion cylinder to rise and fall.

8. A chip separation device, characterized in that: The method comprises a unit for executing the method according to any one of claims 1 to 5.

9. A computer device, characterized in that: The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the method according to any one of claims 1 to 5 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 5 can be implemented.

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