High-density QFN (quad flat no-lead) packaging lead frame and manufacturing method thereof

Abstract

The invention provides a high-density QFN packaging lead frame and a manufacturing method thereof, and relates to the technical field of QFN packaging, the high-density QFN packaging lead frame comprises a frame base body, a square base island is arranged in the center of the frame base body, four corners of the square base island are connected with connecting pins, the square base island is connected with the frame base body through the connecting pins, the connecting pins are provided with a half-etching square frame I, and the half-etching square frame I is provided with a half-etching square frame II. The center of the base island is provided with a chip, the peripheral side of the chip is provided with a semi-etching groove, and the base island is provided with a plurality of second semi-etching square frames. According to the invention, the plurality of half-etching square frames I and the plurality of half-etching square frames II are arranged, so that the contact area between a plastic package material and the frame substrate can be effectively increased during plastic package, the connection between the plastic package material and the frame substrate is more stable, and the half-etching grooves are arranged, so that when a chip is adhered to the square base island, glue liquid which possibly overflows can be effectively collected, and the service life of the chip is prolonged. And if the glue does not overflow, the half-etched groove can play a role of more stable connection.

Description

Technical Field

[0001] The present invention relates to the technical field of QFN packaging, and particularly relates to a high-density QFN packaging lead frame and a manufacturing method thereof. Background Art

[0002] At present, domestic local packaging enterprises still mainly use forms such as DIP, SOP, and QFP. Generally speaking, the lead frame products of domestic enterprises are mostly used for the packaging of discrete devices and medium- and low-grade ICs. The proportion of lead frames used for integrated circuits is relatively small, and there is currently a trend towards developing towards medium- and high-grade forms such as QFN. QFN lead frames have advantages such as good electrical conductivity and heat dissipation performance, small volume, and light weight.

[0003] For example, the patent with the publication number CN 214956863 U discloses a new type of QFN lead frame, which includes a lead frame unit, a support frame, connecting ribs, and cutting channels. Each lead frame unit includes at least one base island and four rows of pins. The four rows of pins are distributed on the four faces of the base island. The pins are directly connected to the support frame, and the four corners of the base island are connected to the support frame through connecting ribs. Locking glue holes are provided on the connecting ribs.

[0004] However, the above patent only forms an embedded structure between the locking glue holes and the plastic package to resist the delamination resistance of the overall product, and the effect of resisting delamination is still poor, and the packaging stability is still weak. In addition, when installing the chip, the glue may flow onto the base island, resulting in the plastic package material not being able to fully contact the base island, further increasing the delamination probability. Summary of the Invention

[0005] The present invention provides a high-density QFN packaging lead frame and a manufacturing method thereof to solve at least one of the problems mentioned in the above background art.

[0006] To solve the above technical problems, the present invention discloses a high-density QFN packaging lead frame, which includes a frame substrate. A square base island is arranged at the central position of the frame substrate. Connecting feet are connected to the four corners of the square base island. The square base island is connected to the frame substrate through the connecting feet. A semi-etching square one is arranged on the connecting feet. A chip is arranged at the center of the square base island. A semi-etching groove is arranged on the periphery of the chip. A plurality of semi-etching squares two are arranged on the square base island.

[0007] Preferably, a plurality of lead pins are evenly distributed on the frame substrate. The plurality of lead pins are distributed on the periphery of the square base island. The lead pins are electrically connected to the chip. A pin notch is etched on the edge of the area where the lead pins are connected to the chip.

[0008] Preferably, a manufacturing method of a high-density QFN packaging lead frame is used to manufacture a high-density QFN packaging lead frame as described above, and includes the following steps:

[0009] S1: Obtain a frame substrate, set a square base island on the frame substrate, and connect the square base island to the frame substrate through connecting feet;

[0010] S2: Etch a number of pin slots on the frame substrate; a number of semi-etched square frames II and semi-etched grooves are provided on the square base island; a semi-etched square frame I is provided on the connecting feet;

[0011] S3: Set lead pins at the pin slots, bond a chip in the center of the square base island, and electrically connect the chip to the lead pins.

[0012] Preferably, the chip is bonded in the center of the square base island through a bonding mechanism. The bonding mechanism includes a working box. One end of the working box is fixedly provided with a vertical plate, and a horizontal plate is fixedly provided on the vertical plate. A through groove is provided in the center of the horizontal plate, and a moving block is slidably arranged in the through groove. A glue application box is arranged on the lower side of the moving block, and an installation block is arranged on the working box for installing the frame substrate.

[0013] Preferably, a linear driving member I is fixedly connected to the left side of the through groove. The right output end of the linear driving member I is fixedly connected to a push rod, and the push rod is fixedly connected to the moving block. A driving motor is arranged on the moving block. The lower output end of the driving motor is fixedly provided with a rotating rod, and the rotating rod rotates through the moving block. A glue storage cylinder is fixedly arranged on the lower side of the moving block, and the rotating rod rotates and extends into the glue storage cylinder, and a number of stirring rods are fixedly arranged on the rotating rod.

[0014] Preferably, a rotating shaft is also rotatably arranged through the moving block. A pulley II is arranged on the rotating shaft, and a pulley I is arranged on the rotating rod. A belt is wound around the pulley I and the pulley II; a reciprocating lead screw is arranged on the rotating shaft, and the glue application box is threadedly connected to the reciprocating lead screw. A fixing plate is also fixedly arranged on the lower surface of the moving block, and the glue application box is slidably arranged on the fixing plate. An output box is fixedly arranged on the right inner wall of the glue application box, and an output head is connected to the lower end of the output box in a penetrating manner.

[0015] Preferably, an extension rod is fixedly connected to the lower right side of the fixing plate, and a convex block is fixedly arranged at the right end of the extension rod. A penetrating groove is arranged at the eccentric position on the left side of the glue application box, and the extension rod and the convex block extend into the glue application box through the penetrating groove. A pair of push plates are arranged symmetrically in the front and back in the glue application box, and the push plates are slidably connected to the left inner wall of the glue application box. A number of springs are arranged on the side where the push plates are away from each other, and the springs are fixedly connected to the glue application box. An L-shaped connecting rod I is fixedly arranged on the right side of one of the push plates, and a collecting cylinder is fixedly arranged on the L-shaped connecting rod I. A glue outlet hole is also opened on the lower surface of the glue application box.

[0016] Preferably, two L-shaped connecting rods are fixedly provided on the front and rear sides of the glue coating box, and an abutment wheel is provided on the side of the two L-shaped connecting rods close to each other, and the abutment wheel is in contact with a fixed plate, and a fixed block is fixedly provided on the upper end of the fixed plate, and the fixed block is fixedly connected to the moving block, and a connecting plate is provided at the other end of the two L-shaped connecting rods, and a front-to-back symmetrical limit rod is penetrated through the connecting plate, and a limit square frame is fixedly provided on the limit rod, and a plurality of limit grooves are provided on the fixed plate, and the limit square frame cooperates with the limit grooves, and a linear drive component two is provided on the connecting plate, and the left output end of the two linear drive components is fixedly connected to the limit plate, and the limit plate is fixedly connected to the limit rod.

[0017] Preferably, a telescopic rod is fixedly connected to the left side of the connecting plate, a pushing wedge is fixedly connected to the left side of the telescopic rod, the pushing wedge is slidably connected to the vertical plate, a linkage box is provided in the working box, and the pushing wedge slides and extends into the linkage box.

[0018] Preferably, a fixed block is fixedly provided in the linkage box, a sliding wedge is slidably provided on the fixed block and penetrates through it, the left side of the sliding wedge cooperates with the pushing wedge, a sliding block is fixedly provided on the sliding wedge, the sliding block is slidably connected to the inner wall of the linkage box, a reset piece is provided between the sliding block and the fixed block, a jacking wedge is also provided in the linkage box, a connecting rod is fixedly provided on the right side of the jacking wedge, the connecting rod is slidably connected to the right inner wall of the linkage box, a suction part is provided on the jacking wedge, and a through groove is opened at the corresponding positions of the linkage box and the working box, and the through groove is located below the mounting block.

[0019] Compared with the prior art, the present invention provides a high-density QFN package lead frame and a manufacturing method thereof. By setting a plurality of half-etched square frames 1 and a plurality of half-etched square frames 2, the contact area between the plastic encapsulation material and the frame substrate can be effectively increased during plastic encapsulation, and the connection between the plastic encapsulation material and the frame substrate is more stable. By setting a half-etched groove, when the chip is bonded to the square base island, the glue that may overflow can be effectively collected. If there is no glue overflow, the half-etched groove can also increase the contact area between the plastic encapsulation material and the frame substrate, further reducing the probability of delamination, and achieving a more stable connection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 It is a structural schematic diagram of the bonding mechanism of the present invention;

[0023] Figure 3 It is a partial structural schematic diagram of the bonding mechanism of the present invention;

[0024] Figure 4 Top view of the horizontal plate of the present invention;

[0025] Figure 5 Left view of the glue application box of the present invention;

[0026] Figure 6 Top view of the glue application box of the present invention;

[0027] Figure 7 Top view of the fixing plate of the present invention;

[0028] Figure 8 Top view of the linkage box of the present invention;

[0029] Figure 9 Left view of the fixing plate of the present invention.

[0030] In the figure: 1. Frame base; 2. Pin notch; 3. Lead pin; 4. Chip; 5. Half-etching groove; 6. First half-etching square; 7. Square base island; 8. Connecting foot; 9. Second half-etching square; 10. Working box; 11. Linkage box; 12. Sliding wedge; 13. Pushing wedge; 14. Vertical plate; 15. Telescopic rod; 16. Horizontal plate; 17. Fixing plate; 18. Belt; 19. Driving motor; 20. Rotating shaft; 21. Glue storage cylinder; 22. Glue application box; 23. Telescopic hose; 24. Stirring rod; 25. Rotating rod; 26. Output box; 27. Output head; 28. Extending rod; 29. Protrusion; 30. Push rod; 31. Moving block; 32. Through groove; 33. Second pulley; 34. First linear driving member; 35. Pushing plate; 36. First L-shaped connecting rod; 37. Spring; 38. Collection cylinder; 39. Second L-shaped connecting rod; 40. Fixed block; 41. Limiting square; 42. Connecting plate; 43. Limiting rod; 44. Second linear driving member; 45. Limiting plate; 46. Limiting groove; 47. Fixed block; 48. Contact wheel; 49. Sliding block; 50. Reset member; 51. Lifting wedge; 52. Connecting rod; 53. Suction portion. Detailed implementation manners

[0031] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not intended to limit the present invention.

[0032] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes, and do not particularly refer to the meaning of order or sequence, nor are they used to limit the present invention. They are merely used to distinguish components or operations described with the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions and technical features between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] Embodiment 1

[0034] An embodiment of the present invention provides a high-density QFN package lead frame, as Figure 1 shown, including a frame substrate 1. A square base island 7 is arranged at the central position of the frame substrate 1. Connecting feet 8 are connected to the four corners of the square base island 7. The square base island 7 is connected to the frame substrate 1 through the connecting feet 8. A semi-etching square frame one 6 is arranged on the connecting feet 8. A chip 4 is arranged at the center of the square base island 7. A semi-etching groove 5 is arranged on the periphery of the chip 4. A number of semi-etching square frames two 9 are arranged on the square base island.

[0035] Among them, preferably, a number of lead pins 3 are evenly distributed on the frame substrate 1. The number of lead pins 3 is distributed on the periphery of the square base island 7. The lead pins 3 are electrically connected to the chip 4. A pin notch 2 is etched at the edge of the area where the lead pins 3 are connected to the chip 4.

[0036] The working principle and beneficial effects of the above technical solution are as follows: A square base island 7 is arranged at the central position of the frame substrate 1. The square base island 7 is connected to the frame substrate 1 through the connecting feet 8. Then, a number of pin notches 2 are etched on the frame substrate 1. A number of semi-etching square frames two 9 and a semi-etching groove 5 are arranged on the square base island 7. A semi-etching square frame one 6 is arranged on the connecting feet 8. Lead pins 3 are arranged at the pin notches 2. The chip 4 is bonded to the center of the square base island 7. The chip 4 is electrically connected to the lead pins 3. Then, plastic encapsulation can be carried out.

[0037] By providing a number of semi-etching square frames one 6 and a number of semi-etching square frames two 9, during plastic encapsulation, the contact area between the plastic encapsulant and the frame substrate 1 can be effectively increased, and the connection between the plastic encapsulant and the frame substrate 1 is more stable. By providing the semi-etching groove 5, when the chip is bonded to the square base island 7, the possibly overflowing glue can be effectively collected. If there is no glue overflow, the semi-etching groove 5 can also increase the contact area between the plastic encapsulant and the frame substrate 1, further reducing the probability of delamination and achieving a more stable connection effect.

[0038] Example 2

[0039] This embodiment provides a manufacturing method for a lead frame of a high-density QFN package, which is used to manufacture a lead frame of a high-density QFN package as described above. As Figures 2 - 9 shown, it includes the following steps:

[0040] S1: Obtain the frame substrate 1, set a square base island 7 on the frame substrate 1, and connect the square base island 7 to the frame substrate 1 through a connecting pin 8;

[0041] S2: Etch a number of pin notches 2 on the frame substrate 1; a number of semi-etched squares II 9 and semi-etched grooves 5 are provided on the square base island 7; a semi-etched square I 6 is provided on the connecting pin 8;

[0042] S3: Set lead pins 3 at the pin notches 2, bond a chip 4 in the center of the square base island 7, and electrically connect the chip 4 to the lead pins 3.

[0043] The working principle and beneficial effects of the above technical solution are as follows: First, obtain the frame substrate 1, set a square base island 7 on the frame substrate 1, and connect the square base island 7 to the frame substrate 1 through a connecting pin 8; then, etch a number of pin notches 2 on the frame substrate 1; a number of semi-etched squares II 9 and semi-etched grooves 5 are provided on the square base island 7; a semi-etched square I 6 is provided on the connecting pin 8; then set lead pins 3 at the pin notches 2, bond a chip 4 in the center of the square base island 7, and electrically connect the chip 4 to the lead pins 3; through the above steps, the installation and production of the lead frame can be completed quickly, effectively resisting delamination and making the connection more stable.

[0044] Example 3

[0045] On the basis of the above Example 2, as Figures 2 - 4 shown, the chip 4 is bonded in the center of the square base island 7 through a bonding mechanism. The bonding mechanism includes a working box 10. A vertical plate 14 is fixedly arranged at one end of the working box 10. A horizontal plate 16 is fixedly arranged on the vertical plate 14. A through groove 32 is arranged in the center of the horizontal plate 16. A moving block 31 is slidably arranged in the through groove 32. A glue application box 22 is arranged on the lower side of the moving block 31. An installation block is arranged on the working box 10 for installing the frame substrate 1.

[0046] Among them, preferably, a first linear driving member 34 is fixedly connected to the left side of the through groove 32. The right output end of the first linear driving member 34 is fixedly connected to a push rod 30. The push rod 30 is fixedly connected to the moving block 31. A driving motor 19 is arranged on the moving block 31. The lower output end of the driving motor 19 is fixedly provided with a rotating rod 25. The rotating rod 25 rotatably penetrates through the moving block 31. A glue storage cylinder 21 is fixedly arranged on the lower side of the moving block 31. A telescopic hose 23 is connected through the glue storage cylinder 21. The other end of the telescopic hose 23 extends into the glue application box 22. The rotating rod 25 rotatably extends into the glue storage cylinder 21, and a plurality of stirring rods 24 are fixedly arranged on the rotating rod 25.

[0047] Among them, preferably, a rotating shaft 20 also rotatably penetrates through the moving block 31. A second pulley 33 is arranged on the rotating shaft 20. A first pulley is arranged on the rotating rod 25. A belt 18 is wound around the first pulley and the second pulley 33; a reciprocating lead screw is arranged on the rotating shaft 20. The glue application box 22 is threadedly connected to the reciprocating lead screw. A fixing plate 17 is also fixedly arranged on the lower surface of the moving block 31. The glue application box 22 is slidably arranged on the fixing plate 17. An output box 26 is fixedly arranged on the right inner wall of the glue application box 22. The other end of the telescopic hose 23 is connected through the output box 26. The lower end of the output box 26 is connected through an output head 27.

[0048] The working principle and beneficial effects of the above technical solution are as follows: The frame base 1 is installed on the mounting block, and then the first linear driving member 34 is started. The first linear driving member 34 drives the moving block 31 to move. The moving block 31 drives the glue application box 22 to move above the frame base 1. Then the driving motor 19 is started. The driving motor 19 drives the rotating rod 25 to rotate. The plurality of stirring rods 24 on the rotating rod 25 stir the glue liquid in the glue storage cylinder 21, which can effectively prevent the glue liquid from solidifying; then the glue liquid is conveyed into the output box 26 through the telescopic hose 23 (a pump body can be arranged on the output box 26 to convey the liquid in the glue storage cylinder 21 into the output box 26). When the rotating rod 25 rotates, the first pulley is driven to rotate through the belt 18, the rotating shaft 20 rotates, the rotating shaft 20 drives the reciprocating lead screw to rotate, the reciprocating lead screw drives the glue application box 22 to move downward, the glue application box 22 drives the output box 26 to move downward, and the glue liquid in the output box 26 is applied to the frame base 1 through the output head 27; through the cooperation of the above structure, the output box 26 will be closer to the frame base 1, thereby reducing the sputtering of the glue liquid and having stronger practicability.

[0049] Embodiment 4

[0050] On the basis of the above Embodiment 3, as Figures 2 - 3 、 Figures 5 - 6As shown in the figure, a protruding rod 28 is fixedly connected to the right side of the lower end of the fixed plate 17. A convex block 29 is fixedly arranged at the right end of the protruding rod 28. A through groove is arranged at an eccentric position on the left side of the glue application box 22. The protruding rod 28 and the convex block 29 extend into the glue application box 22 from the through groove. In the glue application box 22, there are symmetrically arranged push plates 35 in the front and back. The push plates 35 are slidably connected to the left inner wall of the glue application box 22. On the side where the push plates 35 are away from each other, there are a number of springs 37. The springs 37 are fixedly connected to the glue application box 22. A first L-shaped connecting rod 36 is fixedly arranged on the right side of one of the push plates 35. A collecting cylinder 38 is fixedly arranged on the first L-shaped connecting rod 36. A glue outlet hole is also opened on the lower surface of the glue application box 22.

[0051] The working principle and beneficial effects of the above technical solution are as follows: When the glue application box 22 moves downward, the convex block 29 and the protruding rod 28 will enter the glue application box 22. The convex block 29 pushes the two push plates 35 to move in opposite directions. The push plates 35 drive the first L-shaped connecting rod 36 to move. The first L-shaped connecting rod 36 drives the collecting cylinder 38 to move. The collecting cylinder 38 moves away from the positions of the glue outlet hole and the output head 27, so as to facilitate the output head 27 to discharge the glue. When the glue discharge is completed once, the glue application box 22 moves upward, and the collecting cylinder 38 will return to the positions of the glue outlet hole and the output head 27, so as to collect the glue that may leak from the output head 27. The cleaning degree is higher and the practicability is stronger.

[0052] Embodiment 5

[0053] On the basis of the above Embodiment 4, as Figure 1 、 Figure 7 and Figure 9 shown in the figure, second L-shaped connecting rods 39 are fixedly arranged on the front and back sides of the glue application box 22. Contact wheels 48 are arranged on the sides where the second L-shaped connecting rods 39 are close to each other. The contact wheels 48 are in contact with the fixed plate 17. A fixed block 40 is fixedly arranged at the upper end of the fixed plate 17. The fixed block 40 is fixedly connected to the moving block 31. The other end of the second L-shaped connecting rod 39 is provided with a connecting plate 42. Symmetrically arranged limiting rods 43 in the front and back directions are arranged through the connecting plate 42. A limiting square frame 41 is fixedly arranged on the limiting rods 43. A number of limiting grooves 46 are arranged on the fixed plate 17. The limiting square frame 41 is matched with the limiting grooves 46. A second linear driving member 44 is arranged on the connecting plate 42. The left output end of the second linear driving member 44 is fixedly connected to a limiting plate 45. The limiting plate 45 is fixedly connected to the limiting rods 43.

[0054] The working principle and beneficial effects of the above technical solution are as follows: When the glue application box 22 moves, the glue application box 22 drives the second L-shaped connecting rod 39 to move, and the second L-shaped connecting rod 39 drives the abutting wheel 48 to rotate, making the movement of the glue application box 22 more stable; before the glue application box 22 moves, the second linear driving member 44 is first started, so that the limiting plate 45 moves, the limiting plate 45 drives the limiting rod 43 to move, and the limiting rod 43 makes the limiting square frame 41 leave the limiting groove 46. When the glue application box 22 moves in place, the second linear driving member 44 is started, so that the limiting square frame 41 enters the lower limiting groove 46 (as Figure 9 shown), when the glue application box 22 moves in place and starts to apply glue, the stability is stronger, the glue application position is more accurate, and the practicability is stronger.

[0055] Embodiment 6

[0056] On the basis of the above Embodiment 5, as Figure 2 and Figure 8 shown, a telescopic rod 15 is fixedly connected to the left side of the connecting plate 42, a pushing wedge 13 is fixedly connected to the left side of the telescopic rod 15, the pushing wedge 13 is slidably connected to the vertical plate 14, a linkage box 11 is arranged in the working box 10, and the pushing wedge 13 slidably extends into the linkage box 11.

[0057] Among them, preferably, a fixed block 47 is fixedly arranged in the linkage box 11, a sliding wedge 12 is slidably penetrated through the fixed block 47, the left side of the sliding wedge 12 is matched with the pushing wedge 13, a sliding block 49 is fixedly arranged on the sliding wedge 12, the sliding block 49 is slidably connected to the inner wall of the linkage box 11, a reset member 50 is arranged between the sliding block 49 and the fixed block 47, a jacking wedge 51 is further arranged in the linkage box 11, a connecting rod 52 is fixedly arranged on the right side of the jacking wedge 51, the connecting rod 52 is slidably connected to the right inner wall of the linkage box 11, a suction part 53 is arranged on the jacking wedge 51, and through grooves are formed at the corresponding positions of the linkage box 11 and the working box 10, and the through grooves are located below the mounting block.

[0058] The working principle and beneficial effects of the above technical solution are as follows: When the glue application box 22 moves, the connecting plate 42 drives the telescopic rod 15 to move, the telescopic rod 15 drives the pushing wedge 13 to move, the pushing wedge 13 drives the sliding wedge 12 to move to the right, the sliding wedge 12 drives the jacking wedge 51 to move upward, and the jacking wedge 51 drives the suction part 53 to adsorb the frame base body 1 in the mounting block, so as to further stabilize the position of the frame base body 1, making the whole glue application process more stable. When the glue application box 22 descends, the collecting cylinder 38 will leave the positions of the glue outlet hole and the output head 27; in addition, the suction part 53 can adsorb the frame base body 1 in the mounting block, and the abutting wheel 48 can make the movement of the glue application box 22 more stable. The whole structure has a high degree of cooperation, and the stability and practicability are strong.

[0059] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. If these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A high-density QFN package lead frame, characterized in that: The invention comprises a frame base (1), wherein a square base island (7) is arranged at the central position of the frame base (1), four corners of the square base island (7) are connected to connecting pins (8), the square base island (7) is connected to the frame base (1) via the connecting pins (8), a semi-etched square frame 1 (6) is arranged on the connecting pins (8), a chip (4) is arranged at the center of the square base island (7), a semi-etched groove (5) is arranged on the peripheral side of the chip (4), and a plurality of semi-etched square frames 2 (9) are arranged on the square base island.

2. A high-density QFN package lead frame according to claim 1, characterized in that: A plurality of lead pins (3) are evenly distributed on the frame base (1), the plurality of lead pins (3) are distributed around the square base island (7), the lead pins (3) are electrically connected to the chip (4), and a pin notch (2) is etched on the edge of the area where the lead pins (3) are connected to the chip (4).

3. A method for manufacturing a high-density QFN package lead frame, used to manufacture a high-density QFN package lead frame as claimed in claim 2, characterized in that: The following steps are involved: S1: obtaining a frame base (1), arranging a square base island (7) on the frame base (1), and connecting the square base island (7) to the frame base (1) via connecting legs (8); S2: etching a plurality of pin notches (2) on the frame base (1); providing a plurality of half-etched square frames (9) and half-etched grooves (5) on the square base island (7); and providing a half-etched square frame (6) on the connecting pin (8); S3: a lead pin (3) is arranged at the pin notch (2), a chip (4) is bonded to the center of the square base island (7), and the chip (4) is electrically connected to the lead pin (3).

4. The method for manufacturing a high-density QFN package lead frame according to claim 3, characterized in that: The chip (4) is bonded to the center of the square base island (7) by a bonding mechanism, the bonding mechanism comprising a working box (10), a vertical plate (14) is fixedly arranged at one end of the working box (10), a horizontal plate (16) is fixedly arranged on the vertical plate (14), a through groove (32) is arranged in the center of the horizontal plate (16), a moving block (31) is slidably arranged in the through groove (32), a glue coating box (22) is arranged at the lower side of the moving block (31), and a mounting block is arranged on the working box (10), and the mounting block is used to mount the frame base (1).

5. The method for manufacturing a high-density QFN package lead frame according to claim 4, characterized in that: A linear drive member (34) is fixedly connected to the left side of the through slot (32), a push rod (30) is fixedly connected to the right output end of the linear drive member (34), the push rod (30) is fixedly connected to the moving block (31), a driving motor (19) is arranged on the moving block (31), a rotating rod (25) is fixedly arranged at the lower output end of the driving motor (19), the rotating rod (25) rotates and penetrates the moving block (31), a glue storage cylinder (21) is fixedly arranged on the lower side of the moving block (31), a telescopic hose (23) is connected to the glue storage cylinder (21), the other end of the telescopic hose (23) extends into the glue coating box (22), the rotating rod (25) rotates and extends into the glue storage cylinder (21), and a plurality of stirring rods (24) are fixedly arranged on the rotating rod (25).

6. The method for manufacturing a high-density QFN package lead frame according to claim 5, characterized in that: The moving block (31) is also provided with a rotating shaft (20) which is rotatably penetrated, the rotating shaft (20) is provided with a second pulley (33), the rotating rod (25) is provided with a first pulley, and a belt (18) is wound around the first pulley and the second pulley (33); a reciprocating screw is provided on the rotating shaft (20), the reciprocating screw is threadedly connected to the glue coating box (22), a fixing plate (17) is also fixedly provided on the lower surface of the moving block (31), the glue coating box (22) is slidably provided on the fixing plate (17), an output box (26) is fixedly provided on the right inner wall of the glue coating box (22), the other end of the telescopic hose (23) is connected to the output box (26), and the lower end of the output box (26) is connected to the output head (27).

7. The method for manufacturing a high-density QFN package lead frame according to claim 6, characterized in that: A protruding rod (28) is fixedly connected to the right side of the lower end of the fixed plate (17), and a protruding block (29) is fixedly arranged on the right end of the protruding rod (28). A through groove is arranged at an eccentric position on the left side of the glue coating box (22), and the protruding rod (28) and the protruding block (29) extend from the through groove into the glue coating box (22). A front-to-back symmetrical pushing plate (35) is arranged in the glue coating box (22), and the pushing plate (35) is slidably connected to the left inner wall of the glue coating box (22). A plurality of springs (37) are arranged on the side of the pushing plate (35) away from each other, and the springs (37) are fixedly connected to the glue coating box (22). An L-shaped connecting rod (36) is fixedly arranged on the right side of one of the pushing plates (35), and a collecting cylinder (38) is fixedly arranged on the L-shaped connecting rod (36). A glue outlet hole is also opened on the lower surface of the glue coating box (22).

8. The method for manufacturing a high-density QFN package lead frame according to claim 7, characterized in that: The glue coating box (22) is fixedly provided with two L-shaped connecting rods (39) at the front and rear sides, and an abutment wheel (48) is provided on the side of the two L-shaped connecting rods (39) close to each other, and the abutment wheel (48) contacts the fixed plate (17). A fixed block (40) is fixedly provided on the upper end of the fixed plate (17), and the fixed block (40) is fixedly connected to the moving block (31). A connecting plate (42) is provided at the other end of the two L-shaped connecting rods (39), and a connecting plate (42) is provided through the connecting plate (42). A front-to-back symmetrical limiting rod (43) is provided, a limiting square frame (41) is fixedly arranged on the limiting rod (43), a plurality of limiting grooves (46) are arranged on the fixing plate (17), the limiting square frame (41) matches the limiting grooves (46), a second linear driving member (44) is arranged on the connecting plate (42), a left output end of the second linear driving member (44) is fixedly connected to a limiting plate (45), and the limiting plate (45) is fixedly connected to the limiting rod (43).

9. The method for manufacturing a high-density QFN package lead frame according to claim 8, characterized in that: A telescopic rod (15) is fixedly connected to the left side of the connecting plate (42), a pushing wedge (13) is fixedly connected to the left side of the telescopic rod (15), the pushing wedge (13) is slidably connected to the vertical plate (14), a linkage box (11) is arranged in the working box (10), and the pushing wedge (13) slides and extends into the linkage box (11).

10. The method for manufacturing a high-density QFN package lead frame according to claim 9, characterized in that: A fixed block (47) is fixedly arranged in the linkage box (11), a sliding wedge (12) is slidably arranged on the fixed block (47), the left side of the sliding wedge (12) cooperates with the pushing wedge (13), a sliding block (49) is fixedly arranged on the sliding wedge (12), the sliding block (49) is slidably connected to the inner wall of the linkage box (11), a reset member (50) is arranged between the sliding block (49) and the fixed block (47), a lifting wedge (51) is also arranged in the linkage box (11), a connecting rod (52) is fixedly arranged on the right side of the lifting wedge (51), the connecting rod (52) is slidably connected to the right inner wall of the linkage box (11), a suction portion (53) is arranged on the lifting wedge (51), and a through groove is opened at the corresponding position of the linkage box (11) and the working box (10), and the through groove is located below the mounting block.

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