Optical driving base, manufacturing method thereof, optical driving mechanism and camera module

Abstract

The invention discloses an optical driving base, and belongs to the field of camera modules, the optical driving base comprises an insulating seat and a plurality of conductive terminals, each conductive terminal comprises a connecting part embedded in the insulating seat and a welding part and a lap joint part exposed out of the insulating seat, and the connecting part is connected between the welding part and the lap joint part. The connecting parts of the at least two conductive terminals are mutually staggered and overlapped to form a multi-layer terminal structure, the multi-layer terminal structure is arranged at intervals along the thickness direction of the conductive terminals, at least one conductive terminal is provided with an isolating layer, the isolating layer is made of a non-conductive material, and the isolating layer is arranged in a staggered and overlapped area and is positioned between the mutually staggered and overlapped connecting parts; the interlaced and overlapped connecting parts are electrically isolated, so that the minimum thickness of the optical driving base is ensured, contact among multiple layers of terminals, especially at the interlaced and overlapped positions, is avoided, and the risk of short circuit among the terminals is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to an optical drive base, an optical drive mechanism including the optical drive base, a camera module including the optical drive mechanism, and a manufacturing method of the optical drive base. Background Art

[0002] Existing motor bases generally include components such as an insulating base, a metal circuit injection-molded in the insulating base, electronic components welded to the metal circuit, a coil formed by winding or assembled by mounting, and a magnetic structure that interacts with the coil.

[0003] In the prior art, during the manufacturing process of the motor base, an insulating base is further formed by injection molding on the basis of stamping a multi-layer metal circuit. One of the conductive terminals in the multi-layer metal circuit straddles another conductive terminal, and a certain gap will be formed between the two conductive terminals during the staggered overlap to avoid short-circuiting between them. To ensure the minimum thickness and overall size of the plastic base, the gap between the two conductive terminals should not be too large. However, if the gap is too small, during the injection molding process of the plastic base, they are likely to move relative to each other due to the flow impact of the plastic during injection molding and overlap each other, thereby posing a risk of short circuit. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, one of the purposes of the present invention is to provide an optical drive base that can avoid short circuits caused by overlapping terminals.

[0005] One of the purposes of the present invention is achieved by adopting the following technical solutions:

[0006] An optical drive base includes an insulating seat and a plurality of conductive terminals. Each conductive terminal includes a connecting portion embedded in the insulating seat, a welding portion and a lapping portion exposed from the insulating seat. The connecting portion is connected between the welding portion and the lapping portion. The connecting portions of at least two conductive terminals are staggered and overlapped with each other to form a multi-layer terminal structure. The multi-layer terminal structure is arranged at intervals along the thickness direction of the conductive terminal. At least one conductive terminal is provided with an isolation layer. The isolation layer is made of a non-conductive material. The isolation layer is arranged in the overlapping area and between the connecting portions that are staggered and overlapped with each other to electrically isolate the connecting portions that are staggered and overlapped with each other.

[0007] Further, the isolation layer is arranged on the side surface of at least one of the connecting portions that are staggered and overlapped and facing the other connecting portion.

[0008] Further, the isolation layer is a dotting layer formed by dotting, a silk screen layer formed by printing, an inkjet layer formed by spraying, or an electrophoresis layer formed by electrophoresis.

[0009] Further, the dispensing layer is an adhesive bonded to the surface of the conductive terminal.

[0010] Further, a gap is formed in the overlapping area between the intersecting and overlapping connecting portions, and the isolation layer is disposed in the gap.

[0011] Further, the dispensing layer bonds and electrically isolates the intersecting and overlapping connecting portions.

[0012] Further, the thickness of the isolation layer is less than the thickness of the gap. When the insulating base is injection-molded, the plastic material forming the insulating base is filled in the gap and formed between the side surfaces of the isolation layer and the corresponding connecting portion.

[0013] Further, the width of the gap in the thickness direction of the conductive terminal does not exceed 70 μm or does not exceed the thickness of the intersecting and overlapping connecting portions.

[0014] Further, chamfers are provided at the edges of one of the intersecting and overlapping connecting portions on the side surface facing the other connecting portion in the overlapping area.

[0015] Further, the intersecting and overlapping connecting portions are integrally injection-molded in the insulating base.

[0016] Further, the insulating base includes a bottom plate and side walls perpendicular to the bottom plate, and the intersecting and overlapping connecting portions are integrally injection-molded on the side walls and are spaced along the thickness direction of the side walls.

[0017] Further, positioning holes are provided in the insulating base corresponding to the overlapping area, and the side surfaces of the intersecting and overlapping connecting portions are exposed through the positioning holes.

[0018] Further, the thickness of the connecting portions is set to be 50 μm to 80 μm, and the width of the gap in the thickness direction of the insulating base is 30 μm to 60 μm.

[0019] Further, the connecting portions in the overlapping area near the outer surface of the insulating base are exposed or recessed in the outer surface of the side wall.

[0020] Further, a groove is formed on the outer surface of the side wall, and the isolation layer is formed on the outer surface of the connecting portion exposed or recessed in the outer surface of the side wall, and the isolation layer is located in the groove.

[0021] Further, the two conductive terminals are formed by stamping from the same strip or from different strips respectively, and the connecting portion of one of the conductive terminals overlaps the connecting portion of the other conductive terminal in a staggered manner by bending.

[0022] Further, it further includes an electronic component. The insulating base is provided with a receiving groove for receiving the electronic component. The overlapping portions of the two conductive terminals are exposed in the receiving groove and welded to the electronic component. The electronic component and the mutually staggered and overlapping connecting portions are arranged along the thickness direction of the conductive terminal.

[0023] Further, the insulating base includes an insulating block and an insulating body. The insulating block is formed by one-time injection molding and covers the overlapping portion of the conductive terminal. The conductive terminal is bent to form a three-dimensional structure, and the insulating body is formed by secondary injection molding on the bent conductive terminal and the insulating block.

[0024] The second object of the present invention is achieved by the following technical solution:

[0025] An optical driving mechanism includes a carrier for carrying a lens assembly, a metal housing, and any one of the above-mentioned optical driving bases. The carrier is installed in the optical driving base and can move relative to the optical driving base, and the metal housing is sleeved outside the optical driving base.

[0026] The third object of the present invention is achieved by the following technical solution:

[0027] A camera module includes a lens assembly and the above-mentioned optical driving mechanism. The lens assembly is installed on the carrier and moves relative to the optical driving base together with the carrier.

[0028] The fourth object of the present invention is achieved by the following technical solution:

[0029] An optical driving base manufacturing method for manufacturing any one of the above-mentioned optical driving bases includes the following steps:

[0030] Set an isolation layer on the connecting portion of at least one of the conductive terminals;

[0031] Bend the other conductive terminal so that the connecting portions of the two conductive terminals overlap each other in a staggered manner to form a multi-layer terminal structure. The isolation layer is located in the overlapping area and between the mutually staggered and overlapping connecting portions;

[0032] Inject and form an insulating block on the conductive terminal, and the mutually staggered and overlapping connecting portions are injected into the insulating block.

[0033] Further, it further includes the following steps:

[0034] Weld an electronic component to the overlapping part of the conductive terminal;

[0035] Bend the conductive terminal to form a three-dimensional structure;

[0036] Perform secondary injection molding on the conductive terminal and the insulating block to form an insulating body, and the welded part of the conductive terminal is exposed to the insulating body.

[0037] Compared with the prior art, the optical drive base of the present invention sets an isolation layer between multiple layers of terminals in the overlapping area, ensuring the minimum thickness of the base while preventing contact between multiple layers of terminals, especially at the staggered overlapping positions, and avoiding the risk of short circuit between terminals. Description of the Drawings

[0038] Figure 1 Is a three-dimensional view of the optical drive base of the present invention;

[0039] Figure 2 Is Figure 1 A partial three-dimensional structure view of the optical drive base of;

[0040] Figure 3 Is Figure 1 A three-dimensional view of the insulating body of the optical drive base of;

[0041] Figure 4 Is Figure 1 A three-dimensional view of the conductive terminal of the optical drive base of;

[0042] Figure 5 Is Figure 4 A three-dimensional view of the first terminal of the conductive terminal of;

[0043] Figure 6 Is Figure 4 A three-dimensional view of the second terminal of the conductive terminal of;

[0044] Figure 7 Is Figure 6 Another perspective three-dimensional view of the second terminal of;

[0045] Figure 8 Is Figure 4 An enlarged view of the conductive terminal at A of;

[0046] Figure 9 Is Figure 4 A partial three-dimensional structure view of the conductive terminal of;

[0047] Figure 10 Is Figure 1 A three-dimensional cross-sectional view of the optical drive base of;

[0048] Figure 11 Is Figure 10 An enlarged view of the optical drive base at B of;

[0049] Figure 12 is Figure 1 a three-dimensional sectional view of another angle of the optical drive base.

[0050] In the figure: 10, insulating base; 11, insulating block; 1130, receiving groove; 12, insulating body; 120, bottom; 121, side; 122, inner plate; 13, bottom plate; 130, mounting groove; 114, positioning hole; 14, side wall; 20, conductive terminal; 21, first terminal; 211, first overlapping portion; 212, first connecting portion; 213, first welding portion; 2120, first chamfer; 22, second terminal; 221, second overlapping portion; 222, second connecting portion; 2220, second chamfer; 223, second welding portion; 23, isolation layer; 24, gap; 30, groove; 40, coil; 50, electronic component. Specific embodiments

[0051] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0052] It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be another intermediate component through which it is fixed. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be another intermediate component at the same time. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be another intermediate component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0054] The optical driving base of the present invention is a base for an optical driving mechanism, which can be applied to the optical driving mechanism of a camera module to drive a lens assembly, an aperture assembly, etc. The optical driving base can be a focusing motor base, an anti-shake motor base, an aperture assembly base, a periscope motor base, a voice coil motor base, etc. The camera module is mainly used in electronic products, such as mobile phones, tablet computers, laptop computers, etc. Please refer to Figure 1 , the optical driving base of the present invention includes an insulating base 10 and conductive terminals 20. The conductive terminals 20 are embedded in the insulating base 10 and partially exposed from the insulating base 10 to form a welding portion and a lapping portion. The welding portion is electrically connected to other external components such as a printed circuit board (PCB), and the lapping portion is used for welding an electronic component 50 such as a coil 40 and a Hall sensor (HS) or an integrated circuit (IC) containing a Hall sensor. The portion of the conductive terminal 20 embedded in the insulating base 10 is a connecting portion, and the connecting portion is connected between the welding portion and the lapping portion.

[0055] Please continue to refer to Figure 2 , the insulating base 10 includes an insulating block 11 and an insulating body 12. The insulating block 11 is injection-molded onto the conductive terminal 20 once, and the insulating body 12 is injection-molded onto the conductive terminal 20 and the insulating block 11 twice. The connecting portion and the lapping portion are embedded in the insulating block 11 injection-molded once, at least a part of the side surface of the lapping portion is exposed from the insulating block 11, and the welding portion is exposed from the insulating body 12 injection-molded twice. In other embodiments, the insulating base 10 can also be integrally formed by an injection-molding method once, and the present application does not make any restrictions.

[0056] A receiving groove 1130 is formed on the inner surface of the insulating block 11 for receiving an electronic component. The lapping portion of the conductive terminal 20 is exposed in the receiving groove 1130 and welded to the electronic component.

[0057] Specifically, in this embodiment, the number of insulating blocks 11 is one, which is used to pre-fix the conductive terminal 20 welded to the electronic component. In this embodiment, the conductive terminal 20 formed by stamping is first horizontally arranged, and then when the lapping portions of the conductive terminal 20 are all in a horizontal plane, the insulating block 11 is injection-molded onto the conductive terminal 20. After the electronic component is welded, the remaining structures outside the welding portion of the conductive terminal 20 are bent into a three-dimensional shape to form a three-dimensional terminal structure, and then the insulating body 12 is injection-molded twice onto the conductive terminal 20 and the insulating block 11. In other embodiments, the number of insulating blocks 11 can be multiple, and they respectively protrude upward from the periphery of the insulating body 12.

[0058] The insulating block 11 is provided with a positioning hole 114 and a groove 30 corresponding to the staggered overlapping area of the conductive terminals 20. When the insulating body 12 is formed by secondary injection molding, a positioning pin is used to abut against the first connection portion 212 of the first terminal 21 to prevent the first connection portion 212 from being squeezed and deformed, so as to improve the positioning accuracy of the terminals. The positioning hole 114 is formed by removing the positioning pin after the insulating body 12 is formed by secondary injection molding, that is, a positioning hole 114 for receiving the positioning pin is left on the insulating base 10. The groove 30 is located on the outer surface of the insulating block 11 corresponding to the staggered overlapping area of the conductive terminals 20. The connection portion of the outer conductive terminal 20 is located in the groove 30 or exposed on the outer surface of the insulating block 11 at the staggered overlapping position, ensuring that the thickness dimension of the side wall 14 of the insulating base 10 is minimized. While meeting the minimum thickness dimension of the side wall 14, the isolation layer 23 between the two layers of conductive terminals 20 can ensure that the mutual gap 24 between them is reduced at the staggered overlapping position, and thus reserve enough space on the outer surface to avoid contact with the metal shell. The connection portion of the outer conductive terminal 20 further forms an isolation layer 23 at the staggered overlapping position to prevent the outer layer terminal from contacting the metal shell and avoid the risk of short circuit.

[0059] Please continue to refer to Figure 3 , the insulating body 12 is arranged on the insulating block 11 by secondary injection molding to form a bottom 120, a side part 121 and an inner plate 122. Bounded by the inner plate 122, the part of the insulating body 12 that is the inner plate 122 and below the upper surface of the inner plate 122 is defined as a bottom plate 13. The part of the insulating body 12 that is higher than the upper surface of the inner plate 122 is defined as the part of the side wall 14. During secondary injection molding, the part of the inner plate 122 that is higher than the inner plate 122 and the insulating block 11 together form the side wall 14 of the insulating base 10. The side wall 14 is perpendicular to the bottom plate 13. The side wall 14 and the bottom plate 13 enclose a receiving space.

[0060] An installation groove 130 is provided from the outer surface inward at the side wall 14 and / or the bottom plate 13, and a welding portion is formed by partially exposing the conductive terminal 20 in the installation groove 130 of the insulating base 10.

[0061] Please continue to refer to Figure 4, the conductive terminal 20 includes a first terminal 21 and a second terminal 22. Both the first terminal 21 and the second terminal 22 are located within the same sidewall 14 of the insulating base 10. In the field of base technology, the conductive terminals 20 disposed within the insulating base 10 are all formed by stamping a metal strip. During the stamping process, the metal strip needs to withstand the stamping deformation force and maintain the planar accuracy of the conductive terminal 20 itself. Therefore, the metal strip needs to use materials with high hardness, high strength, and high toughness as the die strip. The multiple conductive terminals 20 located within the same sidewall 14 usually need to be integrally injection-molded into the plastic material by injection molding. During this process, the conductive terminals 20 need to withstand the injection pressure during injection molding, and also need to maintain relatively accurate dimensional reference and relative electrical independence. Therefore, during injection molding, it is necessary to ensure that there is sufficient space in the middle to facilitate the pouring of the plastic material to achieve stable isolation between the two.

[0062] In Figure 4 , the first terminal 21 and the second terminal 22 are terminals formed from different strips. Part of the section of the first terminal 21 straddles the second terminal 22 in an interleaved manner and forms a gap 24 at the interleaved and overlapping position. The first terminal 21 and the second terminal 22 of the conductive terminal 20 form a multi-layer terminal structure in this interleaved and overlapping area. There can be multiple interleaved and overlapping areas. At each interleaved and overlapping area, the first terminal 21 and the second terminal 22 are arranged along the thickness direction of the insulating base 10, that is, the thickness direction of the sidewall 14 or the thickness direction of the conductive terminal 20. The thickness direction of this conductive terminal 20 is also the thickness direction of the connecting portion of the first terminal 21 and the second terminal 22 located in the interleaved and overlapping area. In Figure 12 , the first terminal 21 and the second terminal 22 can be different terminals of the same strip, and form a multi-layer terminal structure by relative bending or folding back to produce interleaved and overlapping, that is, the interleaved and overlapping area. In this interleaved and overlapping area, the projections of the first terminal 21 and the second terminal 22 along the thickness direction overlap each other.

[0063] Please continue to refer to Figure 5 , the first terminal 21 includes a first overlapping portion 211, a first connecting portion 212, and a first welding portion 213. The first connecting portion 212 connects the first overlapping portion 211 and the first welding portion 213. The first welding portion 213 extends from the first connecting portion 212 to the outer edge of the bottom plate 13 and is exposed to the mounting groove 130 for welding with other electronic components. The first terminal 21 generates an overlapping area with the second terminal 22 or generates an overlapping area with the second terminal 22 after folding back.

[0064] Please continue to refer to Figure 6 And Figure 7, the second terminal 22 includes a second overlapping portion 221, a second connecting portion 222, and a second welding portion 223. The second connecting portion 222 connects the second overlapping portion 221 and the second welding portion 223. Please continue to refer to Figure 5 and Figure 4 、 Figure 12 , in the present embodiment, the first terminal 21 straddles the second connecting portion 222 of the second terminal 22 and forms a gap 24 at the staggered overlapping position to form a multi-layer terminal structure in the staggered overlapping area. The mutually staggered and overlapping connecting portions are integrally injection-molded in the insulating base 10.

[0065] Please continue to refer to Figure 8 and Figure 9 , in the present embodiment, the second connecting portion 222 of the second terminal 22 and the first connecting portion 212 of the first terminal 21 are both embedded in the insulating block 11 on the side wall 14 and the second connecting portion 222 and the first connecting portion 212 are staggered and overlapped. A gap 24 is formed between the second connecting portion 222 and the first connecting portion 212. In order to make the thickness of the side wall 14 as small as possible and facilitate the reduction of the size of the base, the width of the gap 24 also needs to be as small as possible. This results in relative movement between the first terminal 21 and the second terminal 22 during the injection molding process due to the flow impact of the plastic, causing mutual overlap, or uneven plastic filling between the first terminal 21 and the second terminal 22, thereby posing a risk of short circuit between the conductive terminals 20.

[0066] Therefore, the conductive terminal 20 of the present application also includes an isolation layer 23, which is arranged in the staggered overlapping area and between the first terminal 21 and the second terminal 22. The isolation layer 23 is arranged on a side surface of the first conductive terminal 21 and / or the second conductive terminal 22, specifically, on the side surface of the second terminal 22 facing the first terminal 21 and / or the side surface of the first terminal 21 facing the second terminal 22. The isolation layer 23 can be one or more of a dispensing layer formed after dispensing, a silk-screen layer formed by printing, an inkjet layer formed by spraying, or an electrophoretic layer formed by electrophoresis, or can be other attachment structures suitable for attaching to the surface of the metal terminal to achieve electrical isolation. When the isolation layer 23 is a dispensing layer, the dispensing layer is an adhesive bonded to the surface of the conductive terminal 20, which can be a thermosetting adhesive such as silicone or a UV curing adhesive such as shadowless adhesive, UV adhesive, ultraviolet adhesive, or UV-thermosetting dual-curing adhesive. The glue layer can be glued on the surface of the second terminal 22 and cured, and then the first terminal 21 is bent and installed to the specified position, and then injection molding is formed to form the insulating body 12, so as to prevent the first terminal 21 from touching the uncured glue layer and overlapping and short-circuiting with the second terminal 22 when installing. In other schemes, if the glue layer thickness is sufficient, the glue layer can also be glued on the surface of the second terminal 22 and the first terminal 21 is bent and installed to the specified position before curing, and then the glue layer is cured, and then injection molding is formed to form the insulating body 12. In this way, the cured glue layer can bond the first terminal 21 and the second terminal 22 together and electrically isolate them, thereby increasing the positioning accuracy between the conductive terminals, preventing deformation between the conductive terminals 20 when the insulating body 12 is injection molded, and improving the electrical stability between the conductive terminals 20.

[0067] The thickness of the isolation layer 23 along the side wall 14 or the thickness direction of the conductive terminal 20 is smaller than the gap between the first terminal 21 and the second terminal 22, that is, the gap 24 between the first connecting portion 212 and the second connecting portion 222, so that the gap 24 can be further filled with plastic to prevent the conductive terminal 20 from bending, the plane reference accuracy of the conductive terminal 20 is poor, or the short circuit between the conductive terminals 20 is caused by burrs on the conductive terminal 20 when the conductive terminal 20 is stamped or the isolation layer 23 is unevenly distributed, thereby further improving the reliability of insulation between the conductive terminals 20.

[0068] The first connection portion 212 is provided with a first chamfer 2120 at the surface edge of the staggered overlapping region facing the second connection portion 222, and the second connection portion 222 is provided with a second chamfer 2220 at the surface edge of the staggered overlapping region facing the first connection portion 212, so as to further avoid the formation of burrs at the angle region, thereby causing the burrs to directly overlap and contact with the first terminal 21 and then be electrically connected. The isolation layer 23 covers the first chamfer 2120 and / or the second chamfer 2220.

[0069] The width L of the gap 24 is smaller than the thicknesses of the first connecting portion 212 and the second connecting portion 222, ensuring the minimization of the thickness dimension of the side wall 14 of the base. The thickness of the electronic component accounts for more than 50% of the thickness of the side wall 14 of the base (since the electronic component needs to be embedded inside the side wall 14 for welding with the overlapping portion; and the electronic component cannot protrude too high beyond the inner surface of the side wall 14, otherwise it will affect the spatial distribution and installation of other components inside the insulating base 10). While ensuring the embedding thickness of the electronic component, the gap 24 between the first terminal 21 and the second terminal 22 is minimized as much as possible, thereby maximizing the reduction of the size of the base and being beneficial to the miniaturization of the base. In this specific embodiment, the thicknesses of both the first terminal 21 and the second terminal 22 are 50 um to 80 um, preferably 60 um. The width of the gap 23 between the first terminal 21 and the second terminal 22 in the thickness direction of the conductive terminal 20 does not exceed 70 um, and can be 30 um to 60 um, preferably 40 um. The thickness of the side wall 14 is 400 um to 1000 um, the thickness of the coil is 300 um to 700 um, and the thickness between the bottom of the receiving groove and the outer surface is 180 um to 280 um, preferably 180 um. The above thickness ranges all include the endpoint values. Through the above combinations of various dimensions, the electronic component occupies more than 70% of the thickness space of the side wall 14. In this application, the coil is used to interact with the magnetic component to achieve the driving of the lens or the driving of the blades in the aperture assembly. The IC or the printed circuit board integrating the IC is used to achieve the sensing or operation control function to realize the fine control of the lens or the blades. To increase the magnetic strength when the coil is energized, more turns of the coil need to be wound, which inevitably increases the thickness of the coil. In the case where the thickness space of the side wall 14 is limited and the thicknesses of electronic components such as the coil need to be ensured, only by minimizing the gap between the multi-layer terminal structures as much as possible can the development trend of miniaturization be met.

[0070] Please continue to refer to Figure 10 and Figure 11, the first connecting portion 212 is located at a relatively inner position of the side wall 14, and the second connecting portion 222 is located at a relatively outer position of the side wall 14 compared with the first connecting portion 212. At the overlapping area of the staggered side walls 14, the second connecting portion 222 is exposed on or slightly recessed from the outer surface of the side wall 14, ensuring the minimization of the thickness dimension of the base. While meeting the requirement of minimizing the thickness dimension of the base, the design of slightly recessing from the outer surface of the side wall 14 can reserve sufficient space on the outer surface of the second connecting portion 222 to avoid contact with the metal housing. In this embodiment, a groove 30 is formed on the outer surface of the side wall 14 at the second connecting portion 222 of the second terminal 22 to directly expose the second terminal 22, ensuring the minimization of the thickness dimension of the side wall 14 of the insulating base 10. While meeting the requirement of minimizing the thickness dimension of the side wall 14, the isolation layer 23 between the first terminal 21 and the second terminal 22 can ensure the reduction of the mutual gap 24 at the overlapping position, and further reserve sufficient space on the outer surface to avoid contact with the metal housing. There is no need to injection-mold the insulating base 10 at the groove 30, which can avoid the problem that the thickness of the insulating base 20 designed outside the second terminal 22 is too thin, resulting in the inability of the insulating base 10 to evenly cover the outer side surface of the second terminal 22. To reduce the risk of exposing the second terminal 22, an isolation layer 23 is further formed on the outer surface of the second connecting portion 222 of the second terminal 22 in the overlapping area to prevent the second terminal 22 from contacting the metal housing and avoid the risk of short circuit.

[0071] Please refer to Figure 12 , the first connecting portion 212 of the first terminal 21 is further exposed in the receiving groove 1130, and the outer surface of the first connecting portion 212 away from the second connecting portion 222 is flush with the bottom surface of the receiving groove 1130. The bottom surface of the coil 40 abuts against the outer surface of the first connecting portion 212 and is arranged in sequence with the first connecting portion 212 and the second connecting portion 22 along the thickness direction of the conductive terminal 20. The second connecting portion 222 of the second terminal 22 crosses the first connecting portion 212 by a 180-degree fold and forms an overlapping area with the first connecting portion 212 along the thickness direction of the conductive terminal 20, so that the first overlapping portion 211 of the first terminal 21 and the second overlapping portion 221 of the second terminal 22 are located in the same plane to complete welding with the same electronic component (such as IC50). The second connecting portion 222 of the second terminal 22 forms a gap 24 with the first connecting portion 212 in the overlapping area during the folding or bending process. However, the setting of the isolation layer 23 can minimize the width of the gap 24 as much as possible while reducing the thickness space of the side wall 14 occupied by the first connecting portion 212 and the second connecting portion 222 to the greatest extent, and at the same time create extra space for the isolation layer 23 provided on the side wall 14 to further accommodate the outer surface of the second connecting portion 222 away from the first connecting portion 212, thereby preventing interference or contact between the second connecting portion 222 and other components such as the metal housing and generating the risk of short circuit.

[0072] In the present application, an isolation layer 23 is provided between the first terminal 21 and the second terminal 22 in the overlapping area of the side wall 14, which eliminates the contact between the multi-layer terminals, especially at the staggered overlapping positions, while ensuring the minimum thickness of the base, and avoids the short-circuit risk between the terminals. By further forming an isolation layer 23 on the outer surface of the second connection portion 222 of the second terminal 22 at the staggered overlapping position, the second terminal 22 is prevented from contacting the metal housing, thus avoiding the short-circuit risk.

[0073] The present application further relates to an optical driving mechanism, including a carrier for carrying a lens assembly, a metal housing, and the above-mentioned optical driving base. The carrier is installed in the optical driving base and can move relative to the optical driving base. The metal housing is sleeved outside the optical driving base and is isolated from the second connection portion 222 of the second terminal 22 by the isolation layer 23 to prevent the metal housing from contacting the second terminal 22 and causing a short circuit.

[0074] The present application further relates to a camera module, including a lens assembly and the above-mentioned optical driving mechanism. The lens assembly is mounted on the carrier and moves relative to the optical driving base together with the carrier.

[0075] The present application further relates to a method for manufacturing an optical driving base for manufacturing any of the above optical driving bases, including the following steps:

[0076] An isolation layer 23 is provided at the connection portion of at least one conductive terminal 20;

[0077] Another conductive terminal 20 is bent so that the connection portions of the two conductive terminals 20 overlap each other staggeredly to form a multi-layer terminal structure, and the isolation layer 23 is located in the overlapping area and between the staggeredly overlapping connection portions;

[0078] An insulating block 11 is formed by injection molding on the conductive terminal 20 at one time, and the staggeredly overlapping connection portions are injected into the insulating block 11;

[0079] An electronic component is welded to the overlapping portion of the conductive terminal 20;

[0080] The conductive terminal 20 is bent to form a three-dimensional structure;

[0081] A second injection molding is performed on the conductive terminal 20 and the insulating block 11 to form an insulating body 12, and the welded portion of the conductive terminal 20 is exposed to the insulating body 12.

[0082] Specifically, when the isolation layer 23 is a glue layer, the glue layer is an adhesive bonded to the surface of the conductive terminal 20, and can be a heat-curing glue such as silicone or UV-curing glue such as shadowless glue, UV glue, ultraviolet glue or UV-thermosetting dual-curing glue, etc. After the glue layer is glued and cured on the surface of the second terminal 22, the first terminal 21 is bent and installed to a specified position, and then injection molding is formed to form the insulating body 12, so as to prevent the first terminal 21 from touching the uncured glue layer when installing and causing overlapping short circuit with the second terminal 22. In other schemes, if the thickness of the glue layer is sufficient, the glue layer can also be glued on the surface of the second terminal 22 and the first terminal 21 is bent and installed to the specified position before curing, and then the glue layer is cured, and then injection molding is performed to form the insulating body 12. The cured glue layer can bond the first terminal 21 and the second terminal 22 together and electrically isolate them, thereby increasing the positioning accuracy between the conductive terminals, preventing deformation of the conductive terminals 20 during injection molding of the insulating body 12, and improving the electrical stability of the conductive terminals 20.

[0083] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which are equivalent modifications and improvements made to the above embodiments based on the essential technology of the present invention, and all of them belong to the protection scope of the present invention.

Claims

1. An optical driving base, comprising an insulating base and a plurality of conductive terminals, each of the conductive terminals comprising a connecting portion embedded in the insulating base, a welding portion and a lap portion exposed to the insulating base, the connecting portion being connected between the welding portion and the lap portion, the connecting portions of at least two of the conductive terminals being staggered and overlapped to form a multi-layer terminal structure, the multi-layer terminal structure being arranged at intervals along the thickness direction of the conductive terminals, characterized in that: At least one of the conductive terminals is further provided with an isolation layer, which is made of a non-conductive material. The isolation layer is arranged in the interlaced and overlapping area and between the interlaced and overlapping connecting parts to electrically isolate the interlaced and overlapping connecting parts.

2. The optical drive base according to claim 1, characterized in that: The isolation layer is disposed on a side surface of at least one of the connecting portions that are staggered and overlapped with each other and that faces the other connecting portion.

3. The optical drive base according to claim 1, wherein: The isolation layer is a dispensing layer formed by dispensing, a silk-screen layer formed by printing, an inkjet layer formed by spraying, or an electrophoretic layer formed by electrophoresis.

4. The optical driving base according to claim 3, characterized in that: The glue dispensing layer is an adhesive bonded to the surface of the conductive terminal.

5. The optical driving base according to claim 4, characterized in that: A gap is formed between the mutually staggered and overlapped connection parts in the staggered and overlapped area, and the isolation layer is arranged in the gap.

6. The optical driving base according to claim 4, characterized in that: The glue dispensing layer bonds and electrically isolates the mutually staggered and overlapped connection parts.

7. The optical drive base according to claim 5, characterized in that: The thickness of the isolation layer is smaller than the thickness of the gap. When the insulating seat is injection molded, the plastic material forming the insulating base is filled in the gap and formed between the isolation layer and the side surface of the corresponding connecting portion.

8. The optical drive base according to claim 1, characterized in that: The width of the gap along the thickness direction of the conductive terminal does not exceed 70 um or does not exceed the thickness of the interlaced and overlapped connecting parts.

9. The optical driving base according to claim 1, characterized in that: One of the connecting portions that overlap each other is provided with a chamfer at an edge of a side surface facing the other connecting portion in an overlapping area.

10. The optical drive base according to claim 1, characterized in that: The connecting parts which are staggered and overlapped with each other are integrally injection-molded on the insulating seat.

11. The optical driving base according to claim 10, characterized in that: The insulating seat comprises a bottom plate and side walls arranged perpendicular to the bottom plate, and the mutually staggered and overlapped connecting parts are integrally injection-molded on the side walls and are arranged at intervals along the thickness direction of the side walls.

12. The optical drive base according to claim 1, wherein: The insulating seat is provided with a positioning hole corresponding to the overlapping area, and the positioning hole exposes the side surface of the staggered and overlapping connecting parts.

13. The optical drive base according to claim 5, characterized in that: The thickness of the connecting portion is set to be 50um-80um, and the width of the gap along the thickness direction of the conductive terminal is 30um-60um.

14. The optical drive base according to claim 11, wherein: The connection portion in the staggered overlapping area close to the outer surface of the insulating seat is exposed on or recessed in the outer surface of the side wall.

15. The optical drive base according to claim 14, characterized in that: A groove is formed on the outer surface of the side wall, and the isolation layer is formed on the outer surface of the connecting portion exposed on or recessed in the outer surface of the side wall. The isolation layer is located in the groove.

16. The optical drive base according to claim 1, wherein: The two conductive terminals are stamped out of the same material strip at one time or are stamped out of different material strips respectively, wherein the connecting portion of one conductive terminal overlaps the connecting portion of the other conductive terminal in an interlaced manner by bending.

17. The optical drive base according to claim 1, wherein: It also includes an electronic component, the insulating seat is provided with a receiving groove for receiving the electronic component, the overlapping parts of the two conductive terminals are exposed in the receiving groove and welded to the electronic component, and the electronic component and the connecting parts that are staggered and overlapped with each other are arranged along the thickness direction of the conductive terminal.

18. The optical drive base according to claim 1, wherein: The insulating seat includes an insulating block and an insulating body. The insulating block is formed by one-time injection molding and covers the overlapping portion of the conductive terminal. The conductive terminal is bent to form a three-dimensional structure. The insulating body is formed by two-time injection molding on the bent conductive terminal and the insulating block.

19. An optical drive mechanism, comprising a carrier for carrying a lens assembly and a metal housing, characterized in that: It also includes the optical driving base according to any one of claims 1 to 16, the carrier is installed in the optical driving base and can move relative to the optical driving base, and the metal shell is sleeved outside the optical driving base.

20. A camera module, including a lens assembly, characterized in that: The optical driving mechanism as claimed in claim 19, wherein the lens assembly is mounted on the carrier and moves relative to the optical driving base together with the carrier.

21. A method for manufacturing an optical driving base, used to manufacture the optical driving base as claimed in any one of claims 1 to 18, characterized in that: The following steps are involved: Disposing an isolation layer at a connection portion of at least one of the conductive terminals; Bending another conductive terminal so that the connecting portions of the two conductive terminals overlap each other to form a multi-layer terminal structure, wherein the isolation layer is located in the overlapping region and between the overlapping connecting portions; An insulating block is formed by injection molding on the conductive terminal at one time, and the mutually staggered and overlapped connecting parts are injection molded in the insulating block.

22. The method for manufacturing an optical driving base according to claim 21, wherein: The following steps are also included: welding electronic components at the overlapping portions of the conductive terminals; Bending the conductive terminal to form a three-dimensional structure; Secondary injection molding is performed on the conductive terminal and the insulating block to form an insulating body, and the welding portion of the conductive terminal is exposed to the insulating body.

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