Micro light-emitting diode self-assembly mass transfer device and method thereof
By designing a self-assembled huge transfer device for micro-light emitting diodes, using the combination of centrifuge and substrate, the problems of low efficiency, poor accuracy and complex operation in the prior art are solved, and more efficient and higher precision huge transfer is achieved.
Patent Information
- Application Number
- CN202510339522.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2025-06-17
AI Technical Summary
The existing micro-light emitting diode massive transfer devices have problems such as low efficiency, poor accuracy and complex operation, resulting in low production efficiency.
A micro-light emitting diode self-assembled huge transfer device is designed, using a combination of a centrifuge and multiple substrates to bond the chip and limit the chip through the adhesive layer on the substrate and the limit block, and use the gas channels on both sides of the centrifuge to inhale the chip so that the chip is constantly approaching the fixed part during rotation.
It achieves a huge amount of transfer with higher efficiency and higher accuracy, shortens production time and improves operation simplicity.
Smart Images
Figure CN120166828A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a micro light-emitting diode self-assembly mass transfer device and method thereof. Background Art
[0002] Currently, as a popular display technology, micro light-emitting diodes are used in many displays, including televisions, computer screens, tablet computers, smart wearable watches, or vehicle-mounted devices, etc. Generally, mass transfer is adopted to mass-produce and control the production yield of micro light-emitting diodes.
[0003] However, the existing micro light-emitting diode mass transfer devices and methods thereof have problems of low efficiency, poor precision, and complex operation. Taking an existing mass transfer method as an example, an 8K screen of micro light-emitting diodes has more than 33 million micro light-emitting diode pixel points, and it usually takes several days or even several months to complete a mass transfer.
[0004] Therefore, how to propose a micro light-emitting diode self-assembly mass transfer device and method thereof that can solve the above problems is one of the problems that the industry is eager to invest in research and development resources to solve currently. Summary of the Invention
[0005] In view of this, an object of the present disclosure is to propose a micro light-emitting diode self-assembly mass transfer device and method thereof that can effectively solve the above problems.
[0006] To achieve the above object, according to an embodiment of the present disclosure, a micro light-emitting diode self-assembly mass transfer device includes a centrifuge and a plurality of substrates. The centrifuge has an inner surface and an outer surface, and a chamber is jointly formed between the inner surface and the outer surface. The centrifuge further includes a plurality of fixing parts, two chip inlets and outlets, two gas channels, and a plurality of air holes. The fixing parts are arranged on the inner surface. The two chip inlets and outlets are respectively arranged on the opposite first side and second side of the centrifuge. The two gas channels are respectively arranged on the opposite third side and fourth side of the centrifuge, communicating the outer surface with the chamber. The air holes communicate the inner surface with the chamber. The substrates are arranged on the fixing parts.
[0007] In one or more embodiments of the present disclosure, a bonding layer and a limiting block are included above the substrate. The bonding layer is configured to bond the chips. And the limiting block is configured to limit the lateral movement of the chips.
[0008] In one or more embodiments of the present disclosure, the bonding layers of adjacent substrates among the substrates are configured to bond the chips. And the chips are limited between the limiting blocks of adjacent substrates among the substrates.
[0009] In one or more embodiments of the present disclosure, the fixing parts have a plurality of gaps, and the gaps are arranged on the air holes.
[0010] In one or more embodiments of the present disclosure, the centrifuge further includes two air-blocking blocks disposed in the chamber. The two air-blocking blocks are respectively disposed on the opposite fifth side and sixth side of the centrifuge, and are configured to divide the chamber into two sub-chambers.
[0011] According to another embodiment of the present disclosure, a method for self-assembled mass transfer of micro light-emitting diodes includes providing a centrifuge. The centrifuge has an inner surface and an outer surface, and a chamber is jointly formed between the inner surface and the outer surface. The centrifuge further includes a plurality of fixing parts, two chip inlets and outlets, and a plurality of substrates. The fixing parts are disposed on the inner surface. The two chip inlets and outlets communicate the outer surface, the chamber, and the inner surface. And the substrates are disposed on the fixing parts. A plurality of chips are placed into the centrifuge through the two chip inlets and outlets. And the centrifuge is rotated to cause the chips to fall onto the substrates.
[0012] In one or more embodiments of the present disclosure, the centrifuge further includes two gas channels and a plurality of air holes. The two gas channels communicate the outer surface and the chamber, and the air holes communicate the inner surface and the chamber. And the method further includes sucking gas through the two gas channels and the air holes, so that the chips in the centrifuge continuously approach the fixing parts during rotation.
[0013] In one or more embodiments of the present disclosure, the centrifuge further includes two air-blocking blocks. The two air-blocking blocks are disposed in the chamber and divide the chamber into two sub-chambers. And sucking gas through the two gas channels and the air holes is to separate the gas on the opposite sides of the two air-blocking blocks, so that the gas flows toward the two gas channels in the two sub-chambers respectively.
[0014] In one or more embodiments of the present disclosure, an adhesive layer and a limiting block are included above the substrate. And rotating the centrifuge causes the chips to adhere to the adhesive layers between two adjacent ones of the substrates, and limits the chips between the limiting blocks of two adjacent ones of the substrates.
[0015] In one or more embodiments of the present disclosure, the method further includes detecting the substrates, wherein the detection is automatic optical detection. Repair the substrates on which the chips are not adhered to the adhesive layers or not limited between the limiting blocks, and continuously rotate the centrifuge until the chips are fixed on the substrates.
[0016] In summary, in the micro light-emitting diode self-assembled mass transfer device and method of the present disclosure, by means of the adhesive layer and the limiting blocks on the substrate, the purpose of adhering the chips to the substrate and limiting them between the limiting blocks can be achieved. By sucking air through the gas channels on both sides of the centrifuge, the chips in the centrifuge can continuously approach the fixing parts during rotation.
[0017] The above is only used to elaborate on the problems to be solved by the present disclosure, the technical means for solving the problems, and the effects produced thereby, etc. The specific details of the present disclosure will be introduced in detail in the following embodiments and related drawings. Description of the Drawings
[0018] To make the above and other objects, features, advantages, and embodiments of the present disclosure more apparent and understandable, the description of the drawings is as follows:
[0019] Figure 1 FIG. 6 is a perspective view showing a micro light-emitting diode self-assembly mass transfer device according to an embodiment of the present disclosure.
[0020] Figure 2 FIG. Figure 1 is a sectional view showing the micro light-emitting diode self-assembly mass transfer device in FIG. 6 viewed along the cutting line 2A-2A.
[0021] Figure 3 FIG. Figure 2 is a partially enlarged view of the micro light-emitting diode self-assembly mass transfer device in FIG. 6, showing the region marked by the dashed rectangle A after the chip is fixed to the substrate.
[0022] Figure 4 FIG. Figure 2 is another partially enlarged view of the micro light-emitting diode self-assembly mass transfer device in FIG. 6, showing the region marked by the dashed rectangle A after the chip is fixed to the substrate in another embodiment.
[0023] Figure 5 FIG. Figure 2 is a partially enlarged view of the micro light-emitting diode self-assembly mass transfer device in FIG. 6, showing the substrate on the third, fourth, and fifth sides after the chip is added and rotated.
[0024] Figure 6 FIG. 34 is a flowchart showing a micro light-emitting diode self-assembly mass transfer method according to another embodiment of the present disclosure.
[0025] Wherein, the reference numerals:
[0026] 10: Micro light-emitting diode self-assembly mass transfer device
[0027] 40: Micro light-emitting diode self-assembly mass transfer method
[0028] 100: Centrifuge
[0029] 100a: First side
[0030] 100b: Second side
[0031] 100c: Third side
[0032] 100d: Fourth side
[0033] 100e: Fifth side
[0034] 100f: Sixth side
[0035] 110: Inner surface
[0036] 115: Chamber
[0037] 120: Outer surface
[0038] 130: Fixing part
[0039] 140: Chip inlet / outlet
[0040] 150: Gas channel
[0041] 160: Air hole
[0042] 170: Gas-blocking block
[0043] 200: Substrate
[0044] 200a: Substrate unit
[0045] 210: Adhesive layer
[0046] 220: Limiting block
[0047] 300,300a,300b,300c,300d: Chip
[0048] 301: Electrode terminal
[0049] 302: Non-electrode terminal
[0050] 401,402,403,404,405,406,407,408: Step
[0051] A: Partial view of the micro light-emitting diode self-assembly mass transfer device
[0052] 2A-2A: Cutting plane line
[0053] G1: First gap
[0054] G2: Second gap Detailed implementation manners
[0055] The following will disclose multiple implementation manners of the present disclosure with the accompanying drawings. For the sake of clear illustration, many practical details will be described together in the following narrative. However, it should be understood that these practical details are not used to limit the present disclosure. That is to say, in some implementation manners of the present disclosure, these practical details are not necessary. In addition, for the purpose of simplifying the accompanying drawings, some conventional structures and elements will be shown in a simple schematic manner in the accompanying drawings.
[0056] Please refer to Figure 1 and Figure 2 . Figure 1To illustrate a perspective view of a micro light-emitting diode self-assembly mass transfer device 10 according to an embodiment of the present disclosure. Figure 2 To illustrate Figure 1 a cross-sectional view of the micro light-emitting diode self-assembly mass transfer device 10 in Figure 1 and Figure 2 viewed along the cutting plane line 2A-2A. As shown in Figure 3 and Figure 3 , in this embodiment, the micro light-emitting diode self-assembly mass transfer device 10 includes a centrifuge 100 and a plurality of substrates 200, and the substrates 200 are inside the centrifuge 100. The centrifuge 100 has an inner surface 110 and an outer surface 120, and a chamber 115 is formed between the inner surface 110 and the outer surface 120. A plurality of fixing parts 130 are included on the inner surface 110 of the centrifuge 100 (refer to
[0057] ), and the substrate 200 is disposed on the fixing part 130. Two chip inlets and outlets 140 are respectively disposed on the opposite first side 100a and second side 100b of the centrifuge 100, and the chip 300 (refer to Figure 3 ) can enter the inside of the centrifuge 100 through the chip inlets and outlets 140. The micro light-emitting diode self-assembly mass transfer device 10 of the present disclosure completes a more efficient and high-precision mass transfer by rotating the centrifuge 100 so that the chip 300 falls onto the substrate 200 on the fixing part 130 during the rotation of the centrifuge 100.
[0058] Please refer to Figure 3 and Figure 4 . Figure 3 To illustrate an enlargedFigure 2 A partial enlarged view of the micro light-emitting diode self-assembly mass transfer device 10 in the area marked by the dashed rectangle A, after the chip 300 is fixed to the substrate 200. Figure 4 For illustration of the enlargement Figure 2 A partial enlarged view of the micro light-emitting diode self-assembly mass transfer device 10 in the area marked by the dashed rectangle A, in another embodiment after the chip 300 is fixed to the substrate 200. As Figure 3 And Figure 4 shown, in this embodiment, the substrate 200 includes a plurality of substrate units 200a, and the substrate unit 200a is provided with an adhesive layer 210 and a limiting block 220. The adhesive layer 210 is configured to bond the chip 300, and the limiting block 220 is configured to limit the lateral movement of the chip 300 on the substrate unit 200a. In other words, the adhesive layer 210 mainly provides sufficient adhesive force for the chip 300 to prevent the chip 300 (which can refer to the state of the chip 300a in Figure 5 ) that is completely fixed on the substrate unit 200a from falling off. The limiting block 220 mainly provides sufficient limiting block supporting force for the chip 300 (which can refer to the state of the chip 300a in Figure 5 ) that is completely fixed above the substrate unit 200a to prevent the chip 300 from falling off during the rotation of the centrifuge 100. In this embodiment, the adhesive layer 210 is a solder paste layer, but the present disclosure is not limited thereto. In this embodiment, the chip 300 includes an electrode terminal 301 and a non-electrode terminal 302. Specifically, the chip 300 that is completely fixed on the substrate unit 200a means that its electrode terminal 301 is just bonded to the adhesive layer 210 (which can refer to the state of the chip 300a in Figure 5 ).
[0059] As Figure 3 shown, in this embodiment, each chip 300 includes two electrode terminals 301, and the two electrode terminals 301 of the same chip 300 will be respectively connected to the two adhesive layers 210 on two adjacent substrate units 200a, and the two electrode terminals 301 will be respectively limited between the two limiting blocks 220 on two adjacent substrate units 200a. In other words, one of the two electrode terminals 301 of each of the two chips 300 will be bonded to each substrate unit 200a. As Figure 4 shown, in this embodiment, different from the substrate unit 200a in Figure 3 , each substrate unit 200a may bond only one of the electrode terminals 301 of one chip 300. In other words, in this embodiment, each substrate unit 200a includes only one adhesive layer 210 and one limiting block 220. Compared with Figure 4 , Figure 3 the substrate 200 in has a higher chip density.
[0060] As Figure 3 shown in Figure 4 , in the present embodiment, the fixing portion 130 has a surface that is nearly flush on the side connecting the substrate 200, so that the substrate 200 can be disposed more flatly on the fixing portion 130. There is a first gap G1 between the fixing portion 130 and an adjacent fixing portion 130, and there is a second gap G2 between the substrate unit 200a and an adjacent substrate unit 200a. In the present embodiment, each second gap G2 communicates with the first gap G1, and the first gap G1 is disposed on the air hole 160. Therefore, during the process of the gas passage 150 sucking air, the gas in the centrifuge 100 can more easily pass through the substrate unit 200a and the fixing portion 130 via the first gap G1 and the second gap G2 and flow into the air hole 160. It should be particularly noted that although the first gap G1 and the second gap G2 are shown as having specific numbers and spacings in Figure 3 and Figure 4 , the present disclosure is not limited thereto. In some embodiments, the number and the spacing size of the first gap G1 and the second gap G2 can also be adjusted according to the required suction force intensity (for example, if it is necessary to enhance the gas flow to increase the suction force, the number and the spacing of the first gap G1 and the second gap G2 can be increased).
[0061] As Figure 1 and Figure 2 shown in Figure 1 , in the present embodiment, the centrifuge 100 further includes two air-blocking blocks 170 disposed in the chamber 115. The two air-blocking blocks 170 are respectively disposed on the opposite fifth side 100e and sixth side 100f of the centrifuge 100, and divide the chamber 115 into two sub-chambers. The air-blocking blocks 170 can separate the suction forces of the two gas passages 150 respectively, and reduce the mutual influence of the suction forces between the two gas passages 150 during suction. As Figure 2 shown in
[0062] Please refer to Figure 5 , which shows an enlarged Figure 2The partial enlarged view of the substrate 200 on the third side 100c, the fourth side 100d, and the fifth side 100e of the micro light-emitting diode self-assembly mass transfer device 10 in [it], after adding the chip 300 and rotating. In this embodiment, the centrifuge 100 includes a total of 12 substrates 200 on the fixing portion 130, but the present disclosure is not limited thereto. In some embodiments, the centrifuge 100 may also include a greater or lesser number of substrates 200 inside. It should be particularly noted that, for the convenience of explanation and understanding of the present disclosure, in this embodiment, the adjacent interfaces between the substrate 200 and the adjacent substrate 200 are shown as slightly steep adjacent surfaces, but the present disclosure is not limited thereto. In some embodiments, the adjacent interfaces between the substrate 200 and the adjacent substrate 200 can be almost completely adhered to ensure the stability of the chip 300 when crossing the adjacent substrate 200 and avoid falling off.
[0063] In this embodiment, when the chip 300 is first placed into the centrifuge 100, the chip 300 will first fall onto the substrate 200 on the fourth side 100d of the centrifuge 100 under the influence of gravity. In this embodiment, the centrifuge 100 rotates in a clockwise direction. In other words, the substrate 200 on the fourth side 100d of the centrifuge 100 will sequentially rotate to the fifth side 100e, the third side 100c, the sixth side 100f and then return to the fourth side 100d again, and continuously rotate clockwise until almost all the chips 300 enter the completely adhered state (such as the chip 300a), but the present disclosure is not limited thereto. In some embodiments, the centrifuge 100 can also rotate in a counterclockwise direction. In this embodiment, the chip 300a is the state where the mass transfer is completed. The remaining chips 300b, 300c, and 300d will fall off again and fall above the substrate 200 on the fourth side 100d during the rotation of the centrifuge 100 because they are not correctly adhered to the adhesive layer 210 and not fixed between the limiting blocks 220.
[0064] In this embodiment, the chip 300 in the centrifuge 100 is mainly affected by four acting forces: the suction force of the two gas channels 150, the gravity of the chip 300 itself, the supporting force provided by the limiting block 220, and the adhesive force of the adhesive layer 210. Taking the chip 300 on the substrate 200 on the fifth side 100e of the centrifuge 100 as an example, the chip 300a can be continuously fixed on the substrate 200 during the rotation of the centrifuge 100 because the four acting forces of the adhesive force of the adhesive layer 210, the supporting force of the limiting block 220, the gravity of the chip 300 itself, and the suction force of the gas channel 150 are in a balanced state. On the contrary, the remaining chips 300b, 300c, and 300d fall back onto the substrate 200 on the fourth side 100d during the rotation of the centrifuge 100 because the above four acting forces are not balanced.
[0065] Please refer toFigure 6 It is a flowchart showing a self-assembly mass transfer method 40 of micro light-emitting diodes according to another embodiment of the present disclosure. In this embodiment, a self-assembly mass transfer method 40 of micro light-emitting diodes includes the following steps: First, a centrifuge 100 is provided (step 401). The centrifuge 100 has an inner surface 110 and an outer surface 120, and there is a chamber 115 between the inner surface 110 and the outer surface 120. The centrifuge 100 further includes a fixing part 130, a chip inlet / outlet 140, a gas channel 150, air holes 160, a gas blocking block 170, and a substrate 200. The gas channel 150 communicates the outer surface 120 with the chamber 115, the air holes 160 communicate the inner surface 110 with the chamber 115, and the gas blocking block 170 is disposed in the chamber 115 to divide the chamber 115 into two sub-chambers. And above the substrate 200, there are an adhesive layer 210 and a limiting block 220. Then, the chip 300 is placed into the centrifuge 100 through the chip inlet / outlet 140 (step 402). Then, the centrifuge 100 is rotated, causing the chip 300 to fall onto the substrate 200 and adhere to the adhesive layer 210 between two adjacent ones on the substrate 200 and be limited between the limiting blocks 220 of two adjacent ones on the substrate 200 (step 403). Then, the gas channel 150 and the air holes 160 inhale gas. The two gas blocking blocks 170 separate the gas on opposite sides of the two gas blocking blocks 170, causing the gas to flow towards the two gas channels 150 in the two sub-chambers respectively, causing the chip 300 in the centrifuge 100 to continuously approach the fixing part 130 during the rotation process (step 404).
[0066] In this embodiment, the self-assembly mass transfer method 40 of micro light-emitting diodes further includes detecting the mass transfer state of the chips 300 above the substrate 200 by automatic optical inspection after the centrifuge 100 rotates for a continuous period of time (step 405). Then, when detecting the substrate 200, if it is found that there are chips 300 on the substrate 200 that are not adhered to the adhesive layer 210 or not limited between the limiting blocks 220 (refer to the chips 300b, 300c, and 300d in Figure 4 ), then the multiple chips 300 are repaired (step 406) and the centrifuge 100 is continuously rotated until the chips 300 are fixed to the substrate 200 (step 407) to complete the mass transfer (step 408).
[0067] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the self-assembly mass transfer device and method of micro light-emitting diodes of the present disclosure, through the adhesive layer and the limiting blocks on the substrate, the purpose of adhering the chips to the substrate and limiting them between the limiting blocks can be achieved. By inhaling gas through the gas channels on both sides of the centrifuge, the chips in the centrifuge can continuously approach the fixing part during the rotation process.
[0068] Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to that defined by the appended patent application scope.
Claims
1. A micro-LED self-assembly mass transfer device, characterized in that: Include: A centrifuge having an inner surface and an outer surface, wherein the inner surface and the outer surface together form a chamber, and comprising: A plurality of fixing parts are disposed on the inner surface; Two chip inlets and outlets are respectively disposed on a first side and a second side opposite to each other of the centrifuge; Two gas channels are respectively disposed on a third side and a fourth side opposite to the centrifuge, connecting the outer surface and the chamber; as well as A plurality of air holes connecting the inner surface and the chamber; as well as A plurality of substrates are disposed on the plurality of fixing parts.
2. The micro-LED self-assembly mass transfer device according to claim 1, characterized in that: The plurality of substrates include an adhesive layer and a limiting block above them. The adhesive layer is configured to adhere a chip, and the limiting block is configured to limit a lateral movement of the chip.
3. The micro-LED self-assembly mass transfer device according to claim 2, characterized in that: The plurality of adhesive layers of two adjacent substrates are configured to adhere the chip, and the chip is limited between the plurality of limiting blocks of the two adjacent substrates.
4. The micro-LED self-assembly mass transfer device according to claim 1, characterized in that: The plurality of fixing parts have a plurality of gaps, and the plurality of gaps are arranged on the plurality of air holes.
5. The micro-LED self-assembly mass transfer device according to claim 1, characterized in that: The centrifuge further comprises two air blocking blocks arranged in the chamber, the two air blocking blocks are respectively arranged on a fifth side and a sixth side opposite to each other of the centrifuge, and are configured to separate the chamber into two sub-chambers.
6. A method for mass transfer of micro-LED self-assembly, characterized in that: Include: A centrifuge is provided, the centrifuge having an inner surface and an outer surface, the inner surface and the outer surface together forming a chamber, and comprising a plurality of fixing parts, two chip inlets and outlets, and a plurality of substrates, the plurality of fixing parts being arranged on the inner surface, the two chip inlets and outlets communicating with the outer surface, the chamber, and the inner surface, and the plurality of substrates being arranged on the plurality of fixing parts; Putting a plurality of chips into the centrifuge through the two chip inlets and outlets; as well as The centrifuge is rotated to cause the plurality of chips to fall onto the plurality of substrates.
7. The method according to claim 6, characterized in that The centrifuge further comprises two gas channels and a plurality of gas holes, the two gas channels communicate with the outer surface and the chamber, the plurality of gas holes communicate with the inner surface and the chamber, and the method further comprises: The two gas channels and the plurality of gas holes are made to absorb a gas, so that the plurality of chips in the centrifuge are continuously moved closer to the plurality of fixing parts during the rotation process.
8. The method according to claim 7, characterized in that The centrifuge further comprises two gas blocking blocks, which are arranged in the chamber to separate the chamber into two sub-chambers, and the two gas channels and the plurality of air holes are made to absorb the gas by separating the gas on opposite sides of the two gas blocking blocks, so that the gas flows toward the two gas channels in the two sub-chambers respectively.
9. The method according to claim 8, characterized in that The plurality of substrates include an adhesive layer and a limiting block above them, and the centrifuge is rotated so that the plurality of chips are adhered to the plurality of adhesive layers of two adjacent substrates, and the plurality of chips are limited between the plurality of limiting blocks of the two adjacent substrates.
10. The method according to claim 9, characterized in that The method further comprises: Inspecting the plurality of substrates, wherein the inspection is an automated optical inspection; and The plurality of substrates where the plurality of chips are not bonded to the plurality of bonding layers or are not limited between the plurality of limiting blocks are repaired, and the centrifuge is continuously rotated until the plurality of chips are fixed to the plurality of substrates.