High-precision multichannel electronic component test system

Abstract

The invention discloses a high-precision multi-channel electronic component testing system, which belongs to the technical field of electronic component testing and comprises a bearing frame, two groups of transmission columns are rotatably mounted in the bearing frame, two groups of conveying belts sleeve the outer surfaces of the two groups of transmission columns, and three groups of placement grooves are formed in the outer surfaces of the two groups of conveying belts in an embedded manner; connecting cylinders are fixedly installed in the two sets of conveying belts and abut against the upper surfaces and the lower surfaces of the interiors of the conveying belts, two sets of positioning detection mechanisms are fixedly installed on the upper surface in the bearing frame, removing mechanisms are fixedly installed in the two sets of connecting cylinders, and the blowing ends of the removing mechanisms penetrate through the upper surfaces of the connecting cylinders and communicate with the air holes. Through the design of the positioning detection mechanism and the rejection mechanism, a series of automatic processes from conveying, positioning and detection of electronic components to rejection of unqualified products are realized, manual intervention is reduced, the production efficiency and the test continuity are remarkably improved, and the device is particularly suitable for large-scale batch detection scenes.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing, and specifically to a high-precision multi-channel electronic component testing system. Background Art

[0002] Electronic components are components of electronic elements and small electrical machines and instruments. They are usually composed of several parts and can be used interchangeably in similar products. They often refer to certain parts in industries such as electrical appliances, radio, and instruments, such as capacitors, transistors, hairsprings, mainsprings, etc., which are the general term for electronic devices. Common ones include diodes, etc. Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, base substrates for printed circuits, special materials for electronic functional processes, electronic glue (tape) products, electronic chemical materials and parts, etc.

[0003] For example, a Chinese patent with the publication number CN119667319A discloses an electronic component testing system and method. The electronic component testing system includes: a test board, which includes a test surface; a contact strip, which is arranged on one side of the test surface of the test board, and the contact strip provides at least a first contact surface to the connection part of the device to be tested; a transfer point, which is connected to the contact strip through a connecting wire, and the transfer point is located on one side of the test surface and provides at least a second contact surface to the test device; wherein the wiring of the connecting wire is arranged inside the test board. By using the disconnection and connection between the connection part of the device to be tested and the contact strip, it is avoided that pressing and connecting to fix the device to be tested causes damage to the internal chip or bonding wire of the device to be tested. At the same time, the contact strip, the transfer point and the connecting wire are used as a whole to realize pin reconstruction for the device to be tested, and effectively perform I-V curve testing and electrical performance testing on the opened device to be tested, meeting the general tooling for I-V curve testing and electrical performance testing of the device to be tested.

[0004] However, for the above-mentioned electronic component testing system, when detecting unqualified electronic components, it cannot automatically remove and discharge them from the installation slot, and during the detection of electronic components, it cannot also make the probe automatically trace the contacts of the electronic components to achieve precise connection, making it difficult to be integrated into an automated production line and unable to meet some complex testing scenarios with higher requirements for testing accuracy and efficiency. Summary of the Invention

[0005] The object of the present invention is to provide a high-precision multi-channel electronic component testing system to solve the automatic rejection problem of unqualified electronic components from the installation slots and the problem of automatic detection that the probes cannot automatically track the contacts of the electronic components for precise connection during the detection process as proposed in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: A high-precision multi-channel electronic component testing system, comprising: a carrier frame, in which two drive columns are rotatably installed. Two conveyor belts are sleeved on the outer surfaces of the two drive columns. Three placement slots are recessed in the outer surfaces of the two conveyor belts. Electronic components can be placed in the placement slots. One end of one of the drive columns is fixedly installed with a first drive disk. A drive belt is sleeved on the outer surface of the first drive disk. The other end of the drive belt is sleeved on the outer surface of a second drive disk. The second drive disk is fixedly installed at one end of the output shaft of a reduction motor. The reduction motor is fixedly installed on the upper inner surface of the carrier frame. The reduction motor is controlled by a computer. The computer is fixedly installed at one end of one of the assembly plates; Wherein, connection cylinders are fixedly installed inside the two conveyor belts. The connection cylinders abut against the upper and lower surfaces inside the conveyor belts, so as to apply a supporting force to the conveyor belts to prevent collapse during the transportation of electronic components. The connection cylinders are fixedly installed at one end of the assembly plates, and the assembly plates are fixedly installed between the carrier frames; Wherein, two positioning and detecting mechanisms are fixedly installed on the upper inner surface of the carrier frame. The two positioning and detecting mechanisms slide out from between the two assembly plates. The positioning ends and detecting ends of the positioning and detecting mechanisms are both suspended above the upper surface of the conveyor belt and are flush with the multiple placement slots. The signal transmitting end of the detecting end in the positioning and detecting mechanism is connected to the signal receiving end of the computer through a USB. The positioning ends and detecting ends of the two positioning and detecting mechanisms can be inserted into the placement slots by pulling back. The insertion of the two positioning ends can push the electronic components placed in the placement slots towards the center synchronously by sliding towards the center, so that the insertion of the detecting end can precisely contact the contacts of the electronic components, enabling the detecting end to preliminarily detect the conductivity, insulation, etc. of the electronic components; Wherein, rejection mechanisms are fixedly installed inside the two connection cylinders. The blowing ends of the rejection mechanisms penetrate through the upper surfaces of the connection cylinders and are communicated with air holes, and the air holes are opened in the placement slots, so that the rejection mechanisms can blow out and reject the unqualified electronic components detected by the positioning and detecting mechanisms from the placement slots.

[0007] Preferably, pressure plates are fixedly installed on the upper surfaces of the two groups of connecting cylinders. The pressure plates cover the upper surface of the conveyor belt, so as to limit the electronic components placed in the placement grooves and prevent them from tilting when being pushed by the positioning ends of the positioning and detecting mechanism.

[0008] Preferably, the rejection mechanism includes two groups of high-pressure air pumps. The two groups of high-pressure air pumps are respectively fixedly installed in the two groups of connecting cylinders. The air outlet ends of the high-pressure air pumps are communicated and installed with TY four-way pipes. The other three pipes of the TY four-way pipes penetrate to the upper surface of the connecting cylinders and can be opposite to and communicated with the air holes of the three placement grooves. Solenoid valves are communicated and installed in the middle parts of the three pipes of the TY four-way pipes. The high-pressure air pumps and the solenoid valves are both controlled by a computer.

[0009] Preferably, trapezoidal blocks are fixedly installed on the upper surfaces of the two pressure plates. Three photoelectric sensors are respectively fixedly installed on the upper surfaces of the two trapezoidal blocks. The detection ends of the three photoelectric sensors all penetrate to the lower surface of the pressure plate and are flush with the placement grooves, so that the photoelectric sensors can detect the conveyed electronic components and count. Until the unqualified electronic components are conveyed, the photoelectric sensors can be connected to the computer through the ADC module of the signal transmitting end through the USB interface, enabling the computer to control the high-pressure air pumps in real time and open the corresponding solenoid valves to blow high-pressure gas into the corresponding placement grooves. The model of the photoelectric sensor is E3Z-L61.

[0010] Preferably, a guiding pipe is fixedly installed at one end of the pressure plate. The inlet of the guiding pipe is flush with the air outlet ends of the other three pipes of the TY four-way pipe and also covers the upper surface of the conveyor belt. The other end of the guiding pipe is communicated and installed with a storage box, and the storage box is arranged at one end of the bearing frame.

[0011] Preferably, the positioning and detecting mechanism includes two groups of linear modules. The two groups of linear modules are oppositely arranged and fixedly installed at both ends of the inner upper surface of the bearing frame. Connecting plates are fixedly installed on the upper surfaces of the moving blocks of the two groups of linear modules. A first electric push rod and a second electric push rod are respectively fixedly installed at both ends of the connecting plate. The piston rods of the first electric push rod and the second electric push rod slide out from between the two groups of connecting cylinders, and a raking plate is fixedly installed on the upper surface of the first electric push rod. The raking plate is suspended above the conveyor belt and is flush with the placement grooves. Among them, the first electric push rod, the second electric push rod and the linear module are also controlled by a computer.

[0012] Preferably, the two groups of inserting rake plates can be driven to be inserted into the placement groove by the retraction of the first electric push rod, and can be driven again by the two linear modules through the moving blocks to synchronously slide the two groups of inserting rake plates towards the center in the placement groove, so as to realize the synchronous pushing and approaching of the electronic components placed in the placement groove towards the center.

[0013] Preferably, an installation plate is fixedly installed on the upper surface of the piston rod of the second electric push rod, a frame is fixedly installed on the upper surface of the installation plate, an electronic load tester is fixedly installed in the frame, and the detection probe of the electronic load tester penetrates through the lower surface of the installation plate to be flush with the placement groove, so that the detection probe can be connected to the contact of the electronic component by the retraction of the second electric push rod.

[0014] Preferably, a CCD camera is fixedly installed at one end of the installation plate, the CCD camera is connected to the USB port of the computer through a USB cable, and the computer can identify and install the corresponding image acquisition driver program.

[0015] Preferably, through the image acquisition program, the CCD camera can perform operations such as image filtering, edge detection, feature extraction, and target recognition. According to the preset algorithms and rules, it calculates the position and attitude information of the detection probe relative to the target object, and feeds back the result to the computer to achieve the purpose of precise visual positioning of the detection probe.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Realization of automated process: Through the collaborative work of the conveyor belt, positioning and detection mechanism, rejection mechanism, etc., an automated process for electronic components from transportation, positioning, detection to rejection of unqualified products is realized, reducing manual intervention and improving production efficiency.

[0017] 2. Precise detection: The design of the positioning and detection mechanism can achieve precise detection of electronic components. By synchronously pushing and approaching the electronic components, the detection end is in precise contact with the contacts of the electronic components. By applying voltage or current signals, basic electrical performance problems such as short circuit and open circuit are judged, improving the test accuracy.

[0018] 3. Automatic rejection and collection of unqualified products: By using a high-pressure air pump, solenoid valve, photoelectric sensor, etc., the automatic rejection and collection of unqualified electronic components can be realized, avoiding the mixing of unqualified products into qualified products, ensuring product quality and the continuity of the production process, and without manual input, reducing the risk of manual operation errors.

[0019] 4. Image Recognition and Precise Positioning: The design of linear modules, electric push rods, CCD cameras, etc. enables precise positioning and detection of electronic components. The CCD camera captures images, and the computer calculates the position and attitude information of the detection probe through image recognition, enabling the detection probe to be precisely connected to the contacts of the electronic component. The electronic load tester performs electrical performance detection. At the same time, the CCD camera detects whether there are cracks and scratches on the surface of the electronic component, achieving rapid batch detection and improving production efficiency. Brief Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of the high-precision multi-channel electronic component testing system of the present invention; Figure 2 It is a schematic diagram of the structure of the conveyor belt and the placement groove of the present invention; Figure 3 It is a schematic diagram of the structure of the pressure plate covering the surface of the conveyor belt of the present invention; Figure 4 It is a schematic diagram of the structure of the rejection mechanism of the present invention; Figure 5 It is a schematic diagram of the structure of the TY four-way pipe opposite to the guide pipe of the present invention; Figure 6 It is a schematic diagram of the structure of the positioning and detection mechanism of the present invention; Figure 7 It is a schematic diagram of the structure of the detection probe flush with the placement groove of the present invention.

[0021] In the figure: 1, bearing frame; 101, transmission column; 102, computer; 103, conveyor belt; 104, placement groove; 105, pressure plate; 106, reduction motor; 107, first transmission disc; 108, transmission belt; 109, second transmission disc; 110, connecting cylinder; 2, positioning and detection mechanism; 201, linear module; 202, connecting plate; 203, first electric push rod; 204, second electric push rod; 205, CCD camera; 206, inserting rake plate; 207, detection probe; 208, mounting plate; 209, frame; 210, electronic load tester; 3, rejection mechanism; 301, high-pressure air pump; 302, TY four-way pipe; 303, solenoid valve; 304, photoelectric sensor; 305, trapezoidal block; 306, guide pipe; 307, storage box; 4, assembling plate. Detailed Embodiment

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0023] Please refer to Figures 1-7 , the following technical solutions are provided in this embodiment: As Figures 1-2 shown, a high-precision multi-channel electronic component testing system includes: a carrier 1, two drive columns 101 are rotatably installed in the carrier 1, two conveyor belts 103 are sleeved on the outer surfaces of the two drive columns 101, and three placement grooves 104 are inlaid on the outer surfaces of the two conveyor belts 103. Electronic components can be placed in the placement grooves 104. One end of one of the drive columns 101 is fixedly installed with a first drive disk 107. A drive belt 108 is sleeved on the outer surface of the first drive disk 107. The other end of the drive belt 108 is sleeved on the outer surface of the second drive disk 109. The second drive disk 109 is fixedly installed at one end of the output shaft of the reduction motor 106. The reduction motor 106 is fixedly installed on the upper surface inside the carrier 1. The reduction motor 106 is controlled by a computer 102. The computer 102 is fixedly installed at one end of one of the assembly plates 4; Among them, connection cylinders 110 are fixedly installed in both of the two conveyor belts 103. The connection cylinders 110 abut against the upper and lower surfaces inside the conveyor belts 103, so as to apply a supporting force to the conveyor belts 103 to prevent collapse during the transportation of electronic components. The connection cylinders 110 are fixedly installed at one end of the assembly plates 4, and the assembly plates 4 are fixedly installed between the carriers 1; Among them, two positioning and detecting mechanisms 2 are fixedly installed on the upper surface inside the carrier 1. The two positioning and detecting mechanisms 2 both slide out from between the two assembly plates 4. The positioning ends and detecting ends of the positioning and detecting mechanisms 2 are both suspended above the upper surface of the conveyor belt 103 and are flush with the multiple placement grooves 104. The signal transmitting end of the detecting end in the positioning and detecting mechanism 2 is connected to the signal receiving end of the computer 102 through a USB. The positioning ends and detecting ends of the two positioning and detecting mechanisms 2 can be inserted into the placement grooves 104 by pulling back. The insertion of the two positioning ends can push the electronic components placed in the placement grooves 104 towards the center synchronously by sliding towards the center, so that the insertion of the detecting end can precisely contact the contacts of the electronic components, enabling the detecting end to initially detect the conductivity, insulation, etc. of the electronic components; Among them, rejection mechanisms 3 are fixedly installed in both of the two connection cylinders 110. The blowing ends of the rejection mechanisms 3 penetrate through to the upper surface of the connection cylinders 110 and are communicated with air holes. The air holes are opened in the placement grooves 104, so that the rejection mechanisms 3 can blow out and reject the unqualified electronic components detected by the positioning and detecting mechanisms 2 from the placement grooves 104. Pressure plates 105 are fixedly installed on the upper surfaces of the two connection cylinders 110. The pressure plates cover the upper surface of the conveyor belt 103, so as to limit the electronic components placed in the placement grooves 104 and prevent them from tilting when being pushed by the positioning ends of the positioning and detecting mechanisms 2.

[0024] Through the design of the conveyor belt 103, the placement slot 104, the pressure plate 105, the positioning detection mechanism 2 and the rejection mechanism 3, when in use, the produced electronic components can be guided into the placement slot 104 of the conveyor belt 103, and as the conveyor belt 103 is transported, the electronic components in the placement slot 104 can be transported to the lower end of the pressure plate 105, so that the pressure plate 105 can limit the electronic components in the placement slot 104, until the conveyor belt 103 is transported to a specific stroke, the reduction motor 106 can be controlled by the computer 102 to stop, and the positioning detection mechanism 2 is started at the same time to return By pulling, the positioning end and the detection end of the positioning detection mechanism 2 can be inserted into the placement groove 104 by pulling back, and the insertion of the two sets of positioning ends can realize the synchronous pushing and closing of the electronic components placed in the placement groove 104 toward the center by sliding toward the center synchronously, and the restriction of the pressure plate 105 can prevent the electronic components that are close to each other from tilting up, and then the insertion of the detection end can make precise contact with the contacts of the electronic components, and because the electronic components are close to each other, the stroke of the detection end moving each time can be the same, so that the probe can be driven to accurately contact the contacts of the electronic components, so that the detection end By applying a certain voltage or current signal, the response of the electronic components is measured to determine whether there are basic electrical performance problems such as short circuit and open circuit. If the detected electronic components have problems, the positioning detection mechanism 2 can first determine which group of placement slots 104 the components are in, and then determine the position of the unqualified electronic components according to the number of times the detection end moves from left to right or from right to left in sequence. After the detection of this batch of electronic components is completed, the computer 102 can start the reduction motor 106 again to continue conveying the conveyor belt 103, and as the conveyor belt 103 conveys the detected electronic components When leaving the conveyor belt 103, they will be detected and counted by the rejection mechanism 3, and the counted electronic components are conveyed from the lower end of the pressure plate 105. After the unqualified electronic components are output, the rejection mechanism 3 can blow air into the air holes opened in the corresponding placement slots 104 to blow the unqualified electronic components out of the placement slots 104 and reject them. Through the coordinated work of the positioning detection mechanism 2 and the rejection mechanism 3, a series of automated processes from the transportation, positioning, detection to the rejection of unqualified products of electronic components are realized, which reduces manual intervention and improves production efficiency and test accuracy.

[0025] like Figures 3-5As shown in the figure, the rejection mechanism 3 includes two groups of high-pressure air pumps 301. The two groups of high-pressure air pumps 301 are respectively fixedly installed in the two groups of connecting cylinders 110. One end of the air outlet of the high-pressure air pump 301 is connected and installed with a TY four-way pipe 302. The other three pipes of the TY four-way pipe 302 penetrate to the upper surface of the connecting cylinder 110 and can be opposite to and communicate with the air holes of the three placing grooves 104. Solenoid valves 303 are connected and installed in the middle parts of the three pipes of the TY four-way pipe 302. Both the high-pressure air pump 301 and the solenoid valve 303 are controlled by the computer 102. Trapezoidal blocks 305 are fixedly installed on the upper surfaces of the two pressure plates 105. Three photoelectric sensors 304 are respectively fixedly installed on the upper surfaces of the two trapezoidal blocks 305. The detection ends of the three photoelectric sensors 304 penetrate to the lower surface of the pressure plate 105 and are flush with the placing groove 104, so that the photoelectric sensors 304 can detect the conveyed electronic components and count. Until the unqualified electronic components are conveyed, the photoelectric sensors 304 can be connected to the computer 102 through the ADC module of the signal transmitting end through the USB interface, enabling the computer 102 to control the high-pressure air pump 301 in real time and open the corresponding solenoid valve 303 to blow high-pressure gas into the corresponding placing groove 104. The model of the photoelectric sensor 304 is E3Z-L61.

[0026] Among them, a guide pipe 306 is fixedly installed at one end of the pressure plate 105. The inlet of the guide pipe 306 is flush with the air outlets of the other three pipes of the TY four-way pipe 302 and also covers the upper surface of the conveyor belt 103 at the same time. The other end of the guide pipe 306 is connected and installed with a storage box 307. The storage box 307 is placed at one end of the carrier 1.

[0027] Through the design of the high-pressure air pump 301, TY four-way pipe 302, solenoid valve 303, photoelectric sensor 304, guiding pipe 306 and storage box 307, the positioning and detection mechanism 2 can first determine which group of placement slots 104 it is in. Then, according to the number of times the detection end moves from left to right or from right to left in sequence, the position of the unqualified electronic components can be determined. After that, the computer 102 can start the reduction motor 106 to continue transporting the conveyor belt 103. As the conveyor belt 103 transports the tested electronic components out of the conveyor belt 103, they will all be transported out from the lower end of the pressure plate 105. And a photoelectric sensor 304 is arranged at the lower end of the pressure plate 105, so that the transported electronic components can all be detected when passing through the lower end of the photoelectric sensor 304. Every time a group of electronic components is detected, the photoelectric sensor 304 will convert the optical signal into an electrical signal. After analog-to-digital conversion through the ADC module, the data is transmitted to the computer 102 through the USB interface, enabling the computer 102 to count the passed electronic components. When the unqualified electronic components are transported through the photoelectric sensor 304, the photoelectric sensor 304 also transmits the signal to the computer 102. The computer 102 judges that the currently passing electronic component is unqualified according to the counting information. At this time, the computer 102 immediately issues a control instruction, and at the same time controls the high-pressure air pump 301 to start and the solenoid valve 303 on the pipeline connected to the air hole of the corresponding placement slot 104 to open. The high-pressure gas generated by the high-pressure air pump 301 is shunted through the TY four-way pipe 302 and enters the air hole of the corresponding placement slot 104 through the opened solenoid valve 303, allowing the high-pressure gas to spray out from the air hole, forming a strong air flow impact force to blow out the unqualified electronic components in the placement slot 104. The blown-out unqualified electronic components will enter the guiding pipe 306 under the push of the high-pressure gas. The guiding pipe 306 guides the unqualified electronic components, making them slide along a specific path into the storage box 307 for collection and storage. In this way, the automatic rejection and collection of unqualified electronic components are realized, avoiding the mixing of unqualified products into qualified products, ensuring the product quality and the continuity of the production process. At the same time, the system continues to detect the subsequent electronic components and reject the unqualified products until the detection of the entire batch of electronic components is completed. The process does not require manual input, reduces the risk of manual operation errors, significantly improves the production efficiency and test continuity, and is especially suitable for large-scale batch detection scenarios.

[0028] Such as Figures 6-7As shown in the figure, the positioning and detection mechanism 2 includes two sets of linear modules 201. The two sets of linear modules 201 are relatively arranged and fixedly installed at both ends of the inner upper surface of the carrier 1. The upper surfaces of the moving blocks of the two sets of linear modules 201 are fixedly installed with connecting plates 202. The two ends of the connecting plate 202 are respectively fixedly installed with a first electric push rod 203 and a second electric push rod 204. The piston rods of the first electric push rod 203 and the second electric push rod 204 slide out between the two sets of connecting cylinders 110. And the upper surface of the first electric push rod 203 is fixedly installed with an inserting rake plate 206. The inserting rake plate 206 is suspended above the upper end of the conveyor belt 103 and is flush with the placing groove 104. Among them, the first electric push rod 203, the second electric push rod 204 and the linear module 201 are also controlled by the computer 102. The two sets of inserting rake plates 206 can be driven to be inserted into the placing groove 104 by the retraction of the first electric push rod 203, and can be driven again by the two sets of linear modules 201 through the moving blocks to synchronously slide the two sets of inserting rake plates 206 towards the center in the placing groove 104. Furthermore, it can realize the synchronous pushing and approaching of the electronic components placed in the placing groove 104 towards the center. The upper surface of the piston rod of the second electric push rod 204 is fixedly installed with a mounting plate 208. The upper surface of the mounting plate 208 is fixedly installed with a frame 209. An electronic load tester 210 is fixedly installed in the frame 209. The detection probe 207 of the electronic load tester 210 penetrates through the lower surface of the mounting plate 208 and is flush with the placing groove 104, so that the detection probe 207 can be connected to the contact of the electronic component by the retraction of the second electric push rod 204. One end of the mounting plate 208 is fixedly installed with a CCD camera 205. The CCD camera 205 is connected to the USB port of the computer 102 through a USB cable, and enables the computer 102 to identify and install the corresponding image acquisition driver program.

[0029] The CCD camera 205 can perform operations such as image filtering, edge detection, feature extraction, and target recognition through the image acquisition program. According to the preset algorithms and rules, it calculates the position and attitude information of the detection probe 207 relative to the target object, and feeds the result back to the computer 102 to achieve the purpose of accurately visually positioning the detection probe 207.

[0030] Through the design of the linear module 201, the first electric push rod 203, the second electric push rod 204, the CCD camera 205, the insertion rake plate 206, the detection probe 207 and the electronic load tester 210, the produced electronic components are guided into the placement groove 104 of the conveyor belt 103. As the conveyor belt 103 operates, the electronic components are transported to the lower end of the pressing plate 105, and the pressing plate 105 applies a limit to the electronic components in the placement groove 104 to prevent them from shifting or tilting during subsequent operations. When transported to a specific position, the computer 102 controls the reduction motor 106 to stop, causing the electronic components to stay at the detection station. Subsequently, the computer 102 can issue an instruction to control the two linear modules 201 to start, causing the moving blocks of the two linear modules 201 to drive the connecting plate 202 to move outward synchronously. At the same time, the first electric push rod 203 on the connecting plate 202 starts, and the piston rod retracts, driving the insertion rake plate 206 to insert downward into the placement groove 104. Subsequently, the two linear modules 201 drive the two insertion rake plates 206 to slide synchronously towards the center in the placement groove 104, thereby realizing pushing and approaching the electronic components in the placement groove 104 towards the center synchronously, completing precise positioning, and ensuring that the electronic components are in a suitable detection position. While the insertion rake plate 206 completes the positioning, the CCD camera 205 at one end of the mounting plate 208 starts to work. The CCD camera 205 is connected to the computer 102 through a USB cable. After the computer 102 automatically identifies and installs the image acquisition driver program, the CCD camera 205 acquires the image of the electronic components in the placement groove 104. The computer 102 runs the image acquisition program to perform operations such as image filtering, edge detection, feature extraction, and target recognition on the acquired image. According to the preset algorithms and rules, it calculates the position and attitude information of the detection probe 207 relative to the contacts of the electronic components and feeds the result back to the computer 102, enabling the computer 102 to control the second electric push rod 204 to start based on the position and attitude information fed back by the CCD camera 205, causing the piston rod of the second electric push rod 204 to retract, driving the mounting plate 208 and the frame 209, the electronic load tester 210 and the detection probe 207 fixed thereon to move downward, so that the detection probe 207 is precisely connected to the contacts of the electronic components. After the detection probe 207 is connected to the contacts of the electronic components, the electronic load tester 210 starts to work. The electronic load tester 210 applies a specific voltage or current signal to the electronic components and simultaneously measures the response of the electronic components, such as parameters like voltage drop and current value. By analyzing these parameters, it determines whether there are basic electrical performance problems such as short circuit, open circuit, and unqualified performance in the electronic components and feeds the detection data and results back to the computer 102. At this time, the CCD camera 205 will also detect the surface of the electronic components for cracks and scratches. After the computer 102 receives the data fed back by the electronic load tester 210, it will judge the electronic components according to the preset qualified standards to determine whether they are qualified. At the same time,The computer 102 records the detection results and position information of each electronic component for subsequent processing. After the detection is completed, the computer 102 controls the first electric push rod 203, the second electric push rod 204 and the linear module 201 to reset, so that the insertion rake plate 206 and the detection probe 207 return to their initial positions. Subsequently, the computer 102 starts the reduction motor 106 again, and the conveyor belt 103 continues to operate, conveying the detected electronic components out, and at the same time conveying the next batch of electronic components to be detected to the detection station. The above detection process is repeated, enabling the connection of each link to be orderly through an automated process, allowing it to complete a detection process in a short time. With the continuous operation of the conveyor belt 103, rapid batch detection of electronic components can be achieved, improving production efficiency.

[0031] Specifically, the specific solutions of the preset algorithms and rules in this embodiment are as follows: 1. Image processing and probe positioning algorithm (1)Image preprocessing and filtering Gaussian filtering: Perform Gaussian blur on the original image collected by the CCD camera to eliminate noise interference.

[0032] Histogram equalization: Enhance the image contrast to highlight the contact points and contour features of the electronic components.

[0033] (2)Edge detection and feature extraction Canny edge detection: Extract the edge contours of the electronic components and contact points.

[0034] Hough transform: Identify the geometric shapes of the contact points (such as circles or rectangles) and locate the center coordinates of the contact points.

[0035] Contour analysis: Screen the effective contact point areas through parameters such as contour area and aspect ratio.

[0036] (3)Object recognition and positioning Template matching: Preset a standard contact point template and match the contact point positions in the actual image through the normalized cross-correlation (NCC) algorithm.

[0037] Coordinate system calibration: Camera calibration: Use the checkerboard calibration method to obtain the internal parameter matrix and distortion coefficient of the CCD camera.

[0038] Eye-in-hand calibration: Establish the mapping relationship between the image coordinate system and the mechanical motion coordinate system, and calculate the movement path of the detection probe through the perspective transformation (PnP algorithm).

[0039] (4)Pose estimation and path planning Least squares fitting: Fit the best contact path of the probe according to the contact point coordinates to ensure synchronous alignment of multiple contact points.

[0040] Motion interpolation algorithm: Generate the motion trajectory of the linear module 201 to achieve smooth movement of the probe to the target position.

[0041] 2. Rules for Analyzing Electronic Load Test Data (1) Conductivity Test Rule: Apply a constant current (such as 10 mA), measure the voltage drop between contacts, and calculate the resistance value.

[0042] Passing Criterion: Resistance value R ≤ Rmax (such as Rmax = 50 Ω).

[0043] (2) Insulation Test Rule: Apply a high voltage (such as 500 VDC), measure the leakage current, and calculate the insulation resistance.

[0044] Passing Criterion: Insulation resistance Rins ≥ Rmin (such as Rmin = 10 MΩ).

[0045] (3) Dynamic Performance Test Rule: Apply a step current / voltage signal and measure the response time (such as trise ≤ 1 ms).

[0046] Frequency Domain Analysis: Detect the frequency response characteristics through FFT to ensure that the bandwidth meets the specifications.

[0047] (4) Multi-channel Data Synchronization Rule: Process data from multiple placement slots in parallel, independently judge the qualification of each channel, and avoid cross-interference.

[0048] 3. Surface Defect Detection Algorithm (Assisted by CCD Camera) Scratch Detection: Histogram of Oriented Gradients (HOG): Extract the texture features of the scratch area.

[0049] Morphological Operation: Separate scratches from background noise through opening operation.

[0050] Crack Detection: Image Difference Method: Compare with the image of the standard component to detect missing areas.

[0051] Deep Learning Model: Train a lightweight CNN classifier (such as MobileNet) to identify defects such as cracks and missing corners.

[0052] 4. Rejection Decision and Control Logic (1) Rejection Judgment Rules Comprehensive Criterion: Rejection is triggered if any test item (conductivity, insulation, dynamic performance, surface defects) fails to meet the standard.

[0053] Priority Setting: Electrical performance defects take precedence over appearance defects.

[0054] (2) Elimination Trigger Mechanism Counting Matching: Count through the photoelectric sensor 304 to locate the serial number of the placement slot 104 where the unqualified product is located.

[0055] Timing Control: Calculate the delay according to the conveyor belt speed and accurately trigger the corresponding solenoid valve 303 to blow air.

[0056] (3) Fault Tolerance and Calibration Mechanism Dynamic Threshold Adjustment: Adaptively update the qualified threshold according to historical test data (such as the 3σ principle).

[0057] Periodic Self - inspection: Start the probe contact impedance calibration and CCD camera white balance correction every day.

[0058] 5. Software Architecture and Data Flow Modular Design: Image Processing Module: Implement real - time image analysis based on OpenCV.

[0059] Motion Control Module: Control the accuracy of the linear module 201 and the electric push rod through the PID algorithm (error ≤ 0.1mm).

[0060] Data Management Module: Record the test results (timestamp, batch number, parameter value) and generate an SPC chart.

[0061] Communication Protocol: USB Transmission: CCD image data and photoelectric sensor signals.

[0062] Modbus / TCP: Control the high - pressure air pump 301, solenoid valve 303 and linear module 201.

[0063] Advantages of the Solution High - precision Positioning: Combining vision and mechanical calibration, the probe contact error ≤ 0.05mm.

[0064] Real - time Performance: The single - detection cycle ≤ 2s (including image processing, testing, and elimination decision).

[0065] Flexibility: Configure test parameters through the computer 102 interface to adapt to different types of components.

[0066] Reliability: Redundant design (such as double - photoelectric sensor verification) ensures that the elimination accuracy rate ≥ 99.9%.

[0067] This solution realizes the fully automated and highly reliable testing and sorting of electronic components through multi - algorithm collaboration and rule - based decision - making, significantly improving the production line efficiency and product yield.

[0068] Among them, the preset algorithm also includes a dynamic probe contact error compensation equation (DEC), and its expression is: ;

[0069] Wherein: Δ n is the probe position compensation amount at the nth detection; e n−1 is the error between the actual contact position and the target position at the (n - 1)th detection; α is the recent error weight coefficient, and β is the historical error decay coefficient; γ is the time decay factor, and λ is the non - linear perturbation term coefficient; The computer 102 calculates the compensation amount in real - time according to this equation, and corrects the movement path of the detection probe 207 through the linear module 201 to achieve error convergence; The value range of the time decay factor γ is 0.8 - 0.95, which is used for exponential weight decay of historical errors; the non - linear perturbation term coefficient λ eliminates mechanical vibration interference within ±0.03 mm through the sign function sgn(e n−1 ); The equation realizes error compensation through the following process: 1. The CCD camera 205 collects the contact image between the detection probe 207 and the electronic component, and calculates the position error e n ; 2. The computer 102 substitutes e n into the DEC equation to generate the compensation amount Δ n+1 ; 3. The linear module 201 adjusts the moving coordinates of the detection probe 207 according to Δ n+1 ; 4. Repeat the iteration until the error converges within 0.02 mm.

[0070] Example scenario: The detection probe needs to compensate for the positioning errors of the previous 3 times at the 4th detection.

[0071] Known parameters: α = 0.7, β = 0.2, γ = 0.9, λ = 0.03; Historical error sequence: e1 = 0.15 mm, e2 = 0.10 mm, e3 = 0.08 mm; Calculate Δ4 = 0.1443 mm; Result: At the 4th detection, the probe position needs to be compensated by 0.1443 mm to offset the cumulative error.

[0072] The equation passes through γ n−k−1Exponential decay historical error weight to avoid long-term error accumulation, making the total error converge exponentially as the number of detections increases; compared with traditional PID control, the error of the DEC equation is reduced to less than 0.02 mm after 10 iterations (0.05 mm for the traditional method); the λ·sgn(e n−1 ) term eliminates the tiny jitter caused by mechanical vibration or environmental temperature (the disturbance within ±0.03 mm is completely suppressed); when the probe wears and causes α to be dynamically adjusted, the α and β parameters can be updated through an online learning algorithm (such as RL) to adapt to hardware degradation.

[0073] Application scenario verification Case: In a production line for testing a chip resistor, the original positioning error was ±0.1 mm. After applying the DEC equation: Test results: The error sequence for the 1st to 5th times: 0.10 mm → 0.07 mm → 0.04 mm → 0.02 mm → 0.01 mm; the yield rate increased from 98.2% to 99.6% (the misjudgment caused by poor contact decreased).

[0074] Data comparison table: This equation solves the problem of cumulative probe positioning error in the testing of electronic components through dynamic weight allocation and nonlinear disturbance suppression, significantly improving the detection accuracy and system stability, and has strong engineering interpretability, and can be extended to precision mechanical positioning scenarios.

[0075] Summarize and sort out the working steps of this solution according to the above technical solution: When in use, the produced electronic components can be guided into the placement groove 104 of the conveyor belt 103, and the reduction motor 106 is started to drive the conveyor belt 108 on the outer surface of the second transmission disc 109 to drive the first transmission disc 107 to rotate. Thus, the first transmission disc 107 can drive the two conveyor belts 103 sleeved on the outer surface of the transmission column 101 to drive. With the conveyance of the conveyor belt 103, the electronic components in the placement groove 104 can be conveyed to the lower end of the pressure plate 105, so that the pressure plate 105 can play a limiting role on the electronic components in the placement groove 104. Until the conveyor belt 103 is conveyed to a specific stroke, the reduction motor 106 can be controlled to stop by the computer 102, and at the same time, the computer 102 issues an instruction to control the start of the two linear modules 201, so that the moving blocks of the two linear modules 201 drive the connecting plate 202 to move outward synchronously. At the same time, the first electric push rod 203 on the connecting plate 202 is started, and the piston rod retracts, driving the inserting rake plate 206 to insert downward into the placement groove 104. Subsequently, the two linear modules 201 drive the two inserting rake plates 206 to slide synchronously towards the center in the placement groove 104 through the moving blocks, so as to realize pushing and approaching the electronic components in the placement groove 104 towards the center synchronously, complete precise positioning, and ensure that the electronic components are in a suitable detection position. While the inserting rake plate 206 completes the positioning, the CCD camera 205 at one end of the mounting plate 208 starts to work. The CCD camera 205 is connected to the computer 102 through a USB cable. After the computer 102 automatically identifies and installs the image acquisition driver program, the CCD camera 205 acquires the image of the electronic components in the placement groove 104. The computer 102 runs the image acquisition program to perform operations such as image filtering, edge detection, feature extraction, and target recognition on the acquired image. According to the preset algorithms and rules, calculate the position and attitude information of the detection probe 207 relative to the contact points of the electronic components, and feedback the result to the computer 102, so that the computer 102 controls the start of the second electric push rod 204 according to the position and attitude information fed back by the CCD camera 205, and the piston rod of the second electric push rod 204 retracts, driving the mounting plate 208 and the frame 209, electronic load tester 210 and detection probe 207 fixed thereon to move downward, so that the detection probe 207 is precisely connected to the contact points of the electronic components. After the detection probe 207 is connected to the contact points of the electronic components, the electronic load tester 210 starts to work. The electronic load tester 210 applies a specific voltage or current signal to the electronic components, and at the same time measures the response of the electronic components, such as parameters such as voltage drop and current value. By analyzing these parameters, judge whether the electronic components have basic electrical performance problems such as short circuit, open circuit, and unqualified performance, and feedback the detection data and results to the computer 102. At this time, the CCD camera 205 will also detect the surface of the electronic components for breakage and scratches at the same time.After the computer 102 receives the data fed back by the electronic load tester 210, it will determine the electronic components according to the preset qualified standards to determine whether they are qualified. At the same time, the computer 102 records the detection results and position information of each electronic component for subsequent processing. After the detection is completed, the computer 102 controls the first electric push rod 203, the second electric push rod 204 and the linear module 201 to reset, so that the insertion rake plate 206 and the detection probe 207 return to the initial position. Subsequently, the computer 102 starts the reduction motor 106 again, and the conveyor belt 103 continues to operate, conveying the detected electronic components out, and at the same time conveying the next batch of electronic components to be detected to the detection station, repeating the above detection process. As the conveyor belt 103 conveys the detected electronic components out of the conveyor belt 103, they will all be conveyed out from the lower end of the pressure plate 105. And a photoelectric sensor 304 is provided at the lower end of the pressure plate 105, so that the conveyed electronic components can all be detected when passing through the lower end of the photoelectric sensor 304. Every time a group of electronic components is detected, the photoelectric sensor 304 will convert the optical signal into an electrical signal, and after analog-to-digital conversion through the ADC module, the data will be transmitted to the computer 102 through the USB interface, so that the computer 102 can count the passed electronic components. When the unqualified electronic components are conveyed past the photoelectric sensor 304, the photoelectric sensor 304 also transmits the signal to the computer 102. The computer 102 judges that the currently passing electronic component is unqualified according to the counting information. At this time, the computer 102 immediately issues a control instruction, and at the same time controls the high-pressure air pump 301 to start and the solenoid valve 303 on the pipeline connected to the air hole of the corresponding placement groove 104 to open. The high-pressure gas generated by the high-pressure air pump 301 is shunted through the TY four-way pipe 302 and enters the air hole of the corresponding placement groove 104 through the opened solenoid valve 303, so that the high-pressure gas is ejected from the air hole, forming a strong air flow impact force, and blowing out the unqualified electronic components in the placement groove 104. The blown-out unqualified electronic components will enter the guide pipe 306 under the push of the high-pressure gas, and the guide pipe 306 plays a guiding role for the unqualified electronic components, so that they slide along a specific path into the storage box 307 for collection and storage. In this way, the automatic rejection and collection of unqualified electronic components are realized.

[0076] In summary, the high-precision multi-channel electronic component testing system realizes a series of automated processes from the transportation, positioning, detection of electronic components to the rejection of unqualified products, reduces manual intervention, significantly improves production efficiency and test continuity, and is especially suitable for large-scale batch detection scenarios.

[0077] Parts not involved in the present invention are the same as or can be implemented by the prior art. Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision multi-channel electronic component testing system, characterized in that: include: A carrier frame (1), wherein two groups of transmission columns (101) are rotatably mounted in the carrier frame (1), two groups of conveyor belts (103) are sleeved on the outer surfaces of the two groups of transmission columns (101), the outer surfaces of the two groups of conveyor belts (103) are both embedded with three groups of placement grooves (104), electronic components can be placed in the placement grooves (104), and a first transmission disc (107) is fixedly mounted on one end of one group of transmission columns (101), a transmission belt (108) is sleeved on the outer surface of the first transmission disc (107), the other end of the transmission belt (108) is sleeved on the outer surface of a second transmission disc (109), the second transmission disc (109) is fixedly mounted on one end of the output shaft of a reduction motor (106), the reduction motor (106) is fixedly mounted on the inner upper surface of the carrier frame (1), the reduction motor (106) is controlled by a computer (102), and the computer (102) is fixedly mounted on one end of one group of assembly plates (4).

2. A high-precision multi-channel electronic component testing system according to claim 1, characterized in that: A connecting cylinder (110) is fixedly installed in both groups of the conveyor belts (103), and the connecting cylinder (110) contacts the upper and lower surfaces inside the conveyor belt (103), thereby applying a supporting force to the conveyor belt (103) to prevent the electronic components from collapsing during transportation. The connecting cylinder (110) is fixedly installed at one end of the assembly plate (4), and the assembly plate (4) is fixedly installed between the carrier frames (1); Two groups of positioning detection mechanisms (2) are fixedly installed on the inner upper surface of the carrier frame (1). Both groups of the positioning detection mechanisms (2) slide out from between the two groups of assembly plates (4), and the positioning ends and detection ends of the positioning detection mechanisms (2) are suspended on the upper surface of the conveyor belt (103) and are flush with the plurality of placement slots (104). The signal transmitting end of the detection end in the positioning detection mechanism (2) is connected to the signal receiving end of the computer (102) via a USB. Both the positioning ends and detection ends of the two groups of the positioning detection mechanisms (2) can be inserted into the placement slots (104) by pulling back. The insertion of the two groups of positioning ends can synchronously push the electronic components placed in the placement slots (104) toward the center by sliding synchronously toward the center, so that the inserted detection ends can accurately contact the contacts of the electronic components, allowing the detection ends to preliminarily detect the conductivity and insulation of the electronic components. A rejection mechanism (3) is fixedly installed in both groups of the connecting tubes (110), and an air blowing end of the rejection mechanism (3) penetrates the upper surface of the connecting tube (110) and communicates with an air hole, and the air hole is provided in the placement groove (104), so that the rejection mechanism (3) can blow out and reject unqualified electronic components detected by the positioning detection mechanism (2) from the placement groove (104); A pressure plate (105) is fixedly mounted on the upper surface of the two groups of connecting tubes (110), and the pressure plate covers the upper surface of the conveyor belt (103), thereby limiting the electronic components placed in the placement groove (104) to avoid tilting when being pushed by the positioning end of the positioning detection mechanism (2).

3. A high-precision multi-channel electronic component testing system according to claim 2, characterized in that: The rejection mechanism (3) comprises two groups of high-pressure air pumps (301), the two groups of high-pressure air pumps (301) are respectively fixedly installed in two groups of connecting tubes (110), one end of the air outlet of the high-pressure air pump (301) is connected to a TY four-way pipe (302), the other three groups of pipes of the TY four-way pipe (302) penetrate to the upper surface of the connecting tube (110) and can be opposite to and connected to the air holes of the three groups of placement grooves (104), the middle sections of the three groups of pipes of the TY four-way pipe (302) are all connected to a solenoid valve (303), and the high-pressure air pump (301) and the solenoid valve (303) are both controlled by a computer (102).

4. A high-precision multi-channel electronic component testing system according to claim 3, characterized in that: Trapezoidal blocks (305) are fixedly mounted on the upper surfaces of the two groups of pressure plates (105), and three groups of photoelectric sensors (304) are respectively fixedly mounted on the upper surfaces of the two groups of trapezoidal blocks (305). The detection ends of the three groups of photoelectric sensors (304) extend through the lower surface of the pressure plate (105) and are flush with the placement slot (104), so that the photoelectric sensors (304) can detect and count the electronic components that have been transported, and after the unqualified electronic components have been transported, the photoelectric sensors (304) can be connected to the computer (102) through the ADC module at the signal transmitting end through the USB interface, so that the computer (102) can control the high-pressure air pump (301) in real time and open the corresponding solenoid valve (303) to blow high-pressure gas into the corresponding placement slot (104).

5. A high-precision multi-channel electronic component testing system according to claim 4, characterized in that: A guide tube (306) is fixedly mounted on one end of the pressure plate (105); the inlet of the guide tube (306) is flush with the air outlets of the other three groups of pipes of the TY four-way pipe (302), and also covers the upper surface of the conveyor belt (103); the other end of the guide tube (306) is connected to a storage box (307) mounted thereon; the storage box (307) is arranged at one end of the carrier frame (1).

6. A high-precision multi-channel electronic component testing system according to claim 5, characterized in that: The positioning detection mechanism (2) comprises two groups of linear modules (201), the two groups of linear modules (201) are arranged opposite to each other and fixedly mounted on the two ends of the inner upper surface of the carrier frame (1), the upper surfaces of the movable blocks of the two groups of linear modules (201) are fixedly mounted with connecting plates (202), the two ends of the connecting plates (202) are respectively fixedly mounted with a first electric push rod (203) and a second electric push rod (204), the piston rods of the first electric push rod (203) and the second electric push rod (204) are slidably passed through between the two groups of connecting cylinders (110), and a rake plate (206) is fixedly mounted on the upper surface of the first electric push rod (203), and the rake plate (206) is suspended above the upper end of the conveyor belt (103) and is flush with the placement groove (104); The first electric push rod (203), the second electric push rod (204) and the linear module (201) are also controlled by the computer (102).

7. A high-precision multi-channel electronic component testing system according to claim 6, characterized in that: The two groups of rake plates (206) can be driven to be inserted into the placement slot (104) by the pullback of the first electric push rod (203), and can again be driven by the two groups of linear modules (201) through the moving blocks to synchronously slide the two groups of rake plates (206) in the placement slot (104) toward the center, thereby synchronously pushing the electronic components placed in the placement slot (104) toward the center.

8. A high-precision multi-channel electronic component testing system according to claim 7, characterized in that: A mounting plate (208) is fixedly mounted on the upper surface of the piston rod of the second electric push rod (204), a frame (209) is fixedly mounted on the upper surface of the mounting plate (208), an electronic load tester (210) is fixedly mounted inside the frame (209), and a detection probe (207) of the electronic load tester (210) penetrates through the lower surface of the mounting plate (208) and is flush with the placement groove (104), so that the detection probe (207) can be connected to the contact of the electronic component by being pulled back by the second electric push rod (204).

9. A high-precision multi-channel electronic component testing system according to claim 8, characterized in that: A CCD camera (205) is fixedly mounted on one end of the mounting plate (208); the CCD camera (205) is connected to a USB port of a computer (102) via a USB cable, and enables the computer (102) to identify and install a corresponding image acquisition driver.

10. A high-precision multi-channel electronic component testing system according to claim 9, characterized in that: The CCD camera (205) performs image filtering, edge detection, feature extraction, and target recognition operations through an image acquisition program, calculates the position and posture information of the detection probe (207) relative to the target object according to a preset algorithm and rules, and feeds the result back to the computer (102) to achieve the purpose of accurate visual positioning of the detection probe (207).

Images