Tin material recovery device and tin material recovery method
By designing the tin material recycling device for tin furnace, guide limit assembly and air knife assembly, the problem of low recycling efficiency of waste tin coated solder belts is solved, and efficient tin material recycling and effective utilization of resources are achieved.
Patent Information
- Application Number
- CN202510395503.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2025-06-20
AI Technical Summary
In the prior art, the recycling efficiency of discarded tin coated solder tapes is low, resulting in waste of resources and increased production costs.
A tin material recovery device is designed, including a tin furnace, a guide limit assembly and a wind knife assembly. The tin furnace is used for hot melt flowing tin material. The guide limiting assembly ensures that multiple welding tapes are processed simultaneously without wrapping by adjusting the flow channel and direction. The air knife assembly is used to separate the hot melt tin material.
It realizes efficient tin removal of waste welding tape, improves tin material recycling efficiency, reduces resource waste, and reduces production costs.
Smart Images
Figure CN120170194A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of industrial manufacturing, and particularly to a tin material recovery device and a tin material recovery method for waste tinned solder tapes with high efficiency and high recovery rate. Background Art
[0002] Tinned solder tapes (or tinned copper tapes, PV solder tapes) are key components of mainstream photovoltaic modules. During the current production process and debugging process of tinned solder tapes, waste solder tapes will be generated. Generally, the waste solder tapes will be directly stored in the warehouse in a scrapped manner. In fact, the scrapped tinned solder tapes are alloy products after copper processing, consisting of two components, copper and tin. Direct scrapping will cause serious waste of resources and increase production costs at the same time. Summary of the Invention
[0003] To solve the above technical problems, an embodiment of this application provides a new tin material recovery device. The tin material recovery device can synchronously remove tin from multiple waste solder tapes, greatly improving the tin removal efficiency.
[0004] On the one hand, this application provides a tin material recovery device, which may include: a tin furnace; a guiding and limiting component arranged on the tin furnace; and an air knife component arranged above the tin furnace; wherein, the tin furnace is used to melt the solid tin material on the incoming tinned solder tape into molten tin; the limiting and guiding component defines the flow channel of the tinned solder tape, and / or adjusts the flow direction so that the tinned solder tape flows in from the side of the tin furnace and then flows out from above the tin furnace; the air knife component is used to separate the molten tin from the tinned solder tape flowing out from above the tin furnace.
[0005] According to some embodiments of this application, the guiding and limiting component may include a tooling rack and a guiding and limiting structure arranged on the tooling rack; the tooling rack may include side frames movably connected to the tin furnace, and the guiding and limiting structure may be arranged between the side frames; when an external force is applied to the tooling rack, the guiding and limiting structure can enter or exit the tin furnace.
[0006] According to some embodiments of this application, the guiding and limiting structure may include tooling rods arranged between the side frames and one or more protruding members arranged on the tooling rods; a first space defined between two adjacent protruding members, or a second space defined between the protruding member and the side frame of the tooling rack is used to provide the flow channel, and the tooling rods can be used to adjust the flow direction.
[0007] According to some embodiments of the present application, the guiding and limiting structure may include a tooling rod disposed between the side frames and one or more tooling guide wheels mounted on the tooling rod; the tooling guide wheels may provide the flow channel and be used to adjust the flow direction.
[0008] According to some embodiments of the present application, the guiding and limiting structure may further include a guiding rod, which may be disposed parallel to the tooling rod and be used to adjust the flow direction of the solder-removed solder tape.
[0009] According to some embodiments of the present application, the included angle between the flow direction of the solder-coated tape after flowing out of the tin furnace and the horizontal plane may be 80°-100°.
[0010] According to some embodiments of the present application, the flow direction of the solder-coated tape after flowing out of the tin furnace may be the vertical direction.
[0011] According to some embodiments of the present application, the air knife assembly may include air knives disposed on both sides of the solder-coated tape flowing out of the tin furnace, and the included angle between the blowing direction of the air knife air outlet and the solder-coated tape may be 0-90°.
[0012] According to some embodiments of the present application, the solder recovery device may further include a guiding structure disposed above the air knife assembly and be used to adjust the flow direction of the solder-coated tape passing through the air knife assembly.
[0013] On the other hand, the present application provides a solder recovery method, which is based on the above-mentioned solder recovery device.
[0014] The solder recovery device disclosed in the present application can limit and adjust the flow channel and / or flow direction of the waste solder tape by setting a guiding and limiting component, can process multiple solder tapes simultaneously and avoid entanglement between the solder tapes, and improves the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0016] Figure 1 is an exemplary structural diagram of a solder recovery device shown in some embodiments of the present application;
[0017] Figure 2 is an exemplary structural diagram of a guiding and limiting component shown in some embodiments of the present application;
[0018] Figure 3 is an exemplary schematic diagram of the flow direction shown in some embodiments of the present application;
[0019] Figure 4 is an exemplary schematic diagram of an air knife assembly shown in some embodiments of the present application;
[0020] Figure 5 is an exemplary structural diagram of a solder recovery device shown in some embodiments of the present application;
[0021] Figure 6 is an exemplary schematic diagram of a pay-off section shown in some embodiments of the present application;
[0022] Figure 7 is an exemplary schematic diagram of a take-up section shown in some embodiments of the present application. Detailed Embodiments
[0023] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0024] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The terms "including" or "comprising" and the like used in the present application mean that the elements or items appearing before the word cover the elements or items listed after the word and their equivalents, without excluding other elements or items. The term "and / or" used in the present application includes any and all combinations of one or more of the related listed items.
[0025] The terms "including", "having" and their cognates used in the present application are only intended to indicate the presence of specific features, numbers, steps, operations, elements, components, or combinations of the foregoing items, and should not be construed as precluding the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items.
[0026] It should be noted that the terms "first", "second", "third", etc. used in this application are only for distinguishing descriptions and cannot be construed as indicating or implying relative importance. When a component is referred to as "fixed to", "mounted on", or "disposed on" another component, it can be directly on the other component or there may be other intermediate components. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be other intermediate components at the same time. The orientation or positional relationship indicated by "vertical", "parallel", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to this application.
[0027] Some preferred embodiments of this application will be described below. It should be noted that the following description is for illustrative purposes and is not intended to limit the protection scope of this application. Refer to Figure 1 The solder recovery device shown according to some embodiments of this application may include a solder furnace 100, a guiding and limiting assembly ( Figure 1 not shown in the figure, reference can be made to Figure 2 the exemplary structural diagram of the guiding and limiting assembly shown), and an air knife assembly 300. As Figure 1 shown, the tinned solder tape AT (that is, the aforementioned waste solder tape) flows in the solder recovery device in the direction of the arrow shown in the figure. After flowing in from the side of the solder furnace 100, the flow direction is adjusted after passing through the guiding and limiting assembly, and then flows out from the upper part of the solder furnace 100. After passing through the air knife assembly 300, it enters the next process.
[0028] The tin furnace 100 can be used to heat the solid solder on the incoming tinned solder tape AT to molten solder. Exemplarily, the tin furnace 100 can be made of high-purity quartz glass, boron nitride ceramic, or metal alloy materials such as stainless steel. An induction coil can surround its periphery for electric heating inside. Alternatively, a heating element such as a resistance wire or a burner can be provided at the bottom of the tin furnace 100 for heating inside. This does not limit the present application. The tin furnace 100 can also include a temperature sensor, such as a thermocouple disposed on the inner sidewall of the tin furnace 100, to correspondingly control the heating component based on the sensed internal temperature of the tin furnace 100. For example, heating up, maintaining, or cooling down. A feasible implementation can be that the internal temperature of the tin furnace 100 can be maintained near the melting point of tin, for example, 230°C - 235°C. In this way, after the tinned solder tape AT flows into the tin furnace 100, the solid solder thereon can be heated to become molten solder, and the adhesion to the copper tape is greatly reduced, which is beneficial for the solder to detach from the copper tape.
[0029] The tinned solder tape AT flowing into the tin furnace 100 from the side flows out from above the tin furnace 100 after passing through the guiding and limiting assembly. Combining Figure 2 With the exemplary structural diagram of the guiding and limiting assembly 200 shown, the guiding and limiting assembly 200 can include a tooling rack 210 and a guiding and limiting structure 220 provided on the tooling rack 210. The tooling rack 210 can include side frames 211 and connecting rods 212 connecting the two side frames 211. The side frames 211 can be movably connected to the tin furnace 100. A feasible way can be that the side frames 211 can be a two-piece structure in an "L" configuration as shown in Figure 2 . One section is connected to the sidewall of the tin furnace 100 (for example, the outer wall or the inner wall) through a rotating connector. For example, through a rolling bearing 213. A protruding portion is provided on the sidewall of the tin furnace 100, and the inner ring of the rolling bearing 213 is fixedly connected to the protruding portion. A through hole is provided on the side frame 211, and the outer ring of the rolling bearing 213 is fixedly connected to the through hole. Thus, the rotational movement of the side frame 211 relative to the tin furnace 100 is achieved. Alternatively, a recessed portion can be provided on the sidewall of the tin furnace 100 for fixedly installing the rolling bearing 213, and a protruding portion is provided on the side frame 211 for fixedly connecting to the inner ring of the rolling bearing 213. For another example, the rotational connection between the side frame 211 and the tin furnace 100 can be directly made without an intermediate member (for example, the above-mentioned rolling bearing). That is, through the cooperation between the protruding portion / protruding part and the recessed portion, a rotational connection with friction is achieved. Of course, lubricant can be used for the above rotational connection.
[0030] This section can also be slidably connected to the side wall of the soldering furnace 100. For example, grooves or bumps are respectively provided on the side frame 211 and the side wall of the soldering furnace 100, and the sliding connection is achieved through the cooperation between the two. Alternatively, it is achieved by a guide rail and a slider respectively provided on the side frame 211 and the side wall of the soldering furnace 100.
[0031] It should be noted that the above examples are only for illustration and do not limit the present application. The movable connection between the tooling rack 210 and the side wall of the soldering furnace 100 can also have other forms. For example, it is achieved through meshing gears and racks. These are all within the protection scope of the present application.
[0032] The other section of the side frame 211 can be connected by a connecting rod 212. For example, threaded through holes can be opened on this section, and both ends of the connecting rod 212 can have external thread teeth. The connection between the two side frames 211 can be achieved by screwing both ends of the connecting rod 212 into the through holes. Of course, methods such as clamping, sleeving, and welding are also applicable.
[0033] This section can also be used to set the guiding and limiting structure 220. Exemplarily, the guiding and limiting structure 220 can include a tooling rod 221 that is the same as or similar to the connecting rod 212. The tooling rod 221 can be arranged between the side frames 211 in the same or similar manner as the connecting rod 212. In this way, the guiding and limiting structure 220 can move together with the tooling rack 210. In some implementation manners, by applying an external force to the tooling rack 210, such as Figure 2 applying an upward or downward thrust to the position indicated by the arrow in the figure, the entire guiding and limiting assembly 200 will rotate counterclockwise or clockwise. In this way, the guiding and limiting assembly 200 can partially, at least the guiding and limiting structure 220 can enter or exit the soldering furnace 100. In addition, for convenient force application, a handle can be provided on the side frame 211, such as at the position indicated by the arrow.
[0034] The tooling rod 221 can also be used to adjust the flow direction of the tinned solder tape AT entering the soldering furnace 100. Refer to Figure 3 the exemplary schematic diagram of the flow direction shown. As Figure 3 shown in (a) in the figure, after the tinned solder tape AT flowing in horizontally in the arrow direction is adjusted by the tooling rod, it can flow out in the vertical direction.
[0035] The guiding and limiting assembly 200 can also be movably connected to the soldering furnace 100 in other forms. Exemplarily, the soldering furnace 100 can have a mounting bracket, such as being provided at the furnace mouth of the soldering furnace 100. The guiding and limiting assembly 200 is movably connected to the mounting bracket in the same manner as described above. Thereby, entering and exiting the soldering furnace 100 is achieved.
[0036] The guiding and limiting structure 220 may further include one or more protruding members 222 disposed on the tooling rod 221. For example, the protruding member 222 may be a short rod, with one end fixed to the tooling rod 221. In this way, the protruding member 222 and the side frame 211 of the tooling rack 210 can be used for space separation. For example, the space between two adjacent protruding members 222 may be designated as the first space, and the space between the protruding member 222 and the side frame 211 may be designated as the second space. Each first space or second space can provide a flow channel for a tinned solder tape AT. That is to say, the tinned solder tape flows within this space without crossing the tinned solder tape AT in other spaces, avoiding solder tape entanglement. At the same time, multiple tinned solder tapes AT are allowed to flow into the soldering furnace 100, improving the processing efficiency of the solder tape. As Figure 2 shown, a total of three protruding members 222 are shown. Together with the two side frames 211, a total of four spaces are defined, including two first spaces and two second spaces. In this way, four tinned solder tapes AT can be processed simultaneously without worrying about the problem of solder tape entanglement during the processing.
[0037] Figure 2 An example of the guiding and limiting structure 220 is shown, and there may be other forms. Exemplarily, the guiding and limiting structure may include the above-mentioned tooling rod and one or more tooling guide wheels, such as groove guide wheels, mounted on the tooling rod. The flow channel of the tinned solder tape AT will be defined within the groove of the groove guide wheel. At the same time, the tooling guide wheel can also adjust the flow direction of the tinned solder tape AT. For example, similar to the tooling rod, it can be changed from horizontal to vertical (refer to Figure 3 shown in (a) therein).
[0038] It should be noted that the number of the above-mentioned protruding members 222 or tooling guide wheels can be adjusted according to the actual situation to achieve the simultaneous processing of different numbers of tinned solder tapes.
[0039] In some feasible implementation manners, the guiding and limiting structure 220 may further include a guiding rod ( Figure 2 not shown in the figure). The guiding rod may be arranged parallel to the tooling rod 221 and is used to adjust the flow direction of the tinned solder tape AT. One example may be that the guiding rod may include one or more and may be arranged between the connecting rod 212 and the tooling rod 221. The tinned solder tape flowing out of the flow channel can change its flow direction after passing through the above one or more guiding rods. Refer to Figure 3As shown in (b), there can be three guiding rods. The tinned solder tape AT flowing out of the flow channel can first flow horizontally into the first guiding rod (for example, entering from below the guiding rod), then flow out from above the second guiding rod in the direction of the arrow, enter the third guiding rod from below, and flow out vertically. Multiple guiding rods can provide greater tension for the tinned solder tape AT to unfold the tinned solder tape AT as much as possible, so that the solid solder is evenly heated and as much as possible is converted into molten solder.
[0040] Each component of the guiding and limiting assembly 200 can be made of metal or alloy. For example, iron. It has a low cost and can maintain the stability of the entire assembly compared to the temperature in the tin furnace 100 without deformation.
[0041] The tinned solder tape AT passing through the guiding and limiting assembly 200 can flow out from above the tin furnace 100. A feasible implementation can be that the flow direction of the flowing out tinned solder tape AT forms an angle of 80° - 100° with the horizontal plane. In this way, the molten solder on both sides of the tinned solder tape AT can be more easily separated due to the synergistic effect of gravity. Optionally or preferably, the flow direction of the tinned solder tape AT is the vertical direction, that is, perpendicular to the horizontal direction.
[0042] The air knife assembly 300 can include air knives arranged on both sides of the tinned solder tape AT flowing out of the tin furnace 100. The air knife can be a strip-shaped air knife, and the air outlet can cover multiple parallel tinned solder tapes AT flowing out of the tin furnace 100 at the same time to blow multiple tinned solder tapes AT at the same time, and blow the molten material from the base tape (that is, the copper tape) into the tin furnace 100 for collection. In some feasible implementations, the angle between the blowing direction of the air knife outlet and the tinned solder tape AT can be 0° - 90°. Refer to Figure 4 The exemplary schematic diagram of the air knife assembly shown. As Figure 4 shown in (a) of, the two air knives are respectively arranged on both sides of the tinned solder tape AT, and the dotted line can represent the blowing direction of the air knife. For example, the horizontal blowing shown in the figure. The air knife can be installed through a rotating member (for example, through a spherical joint, etc.), so that the air knife can rotate after installation to adjust the blowing direction. As Figure 4 shown by the double-headed arrow in (a) of, the air knife can rotate. For example, rotate the left air knife clockwise and the right air knife counterclockwise, so that the blowing direction of the air knife will form an angle between 0° - 90° with the tinned solder tape AT, as Figure 4 shown in (b) of. Through this setting, the air knife can be adjusted to a suitable blowing direction to perform desoldering with the highest efficiency.
[0043] Return to reference Figure 1, the solder recovery device may further include a steering guide wheel 400. The steering guide wheel 400 can be used to steer the tinned solder tape AT flowing upward, for example Figure 1 to the nearly horizontal direction shown in, so as to facilitate the subsequent recovery of the solder tape AT. In some examples, the steering guide wheel 400 can be a multi-groove guide wheel, and each groove can be used for steering one tinned solder tape AT.
[0044] Figure 5 shows a solder recovery device according to some embodiments of the present application. As Figure 5 shown, the solder recovery device 500 may include a wire pay-off mechanism 510, a desoldering mechanism 520 and a wire rewinding mechanism 530. The wire pay-off mechanism 510 and the wire rewinding mechanism 530 can be respectively arranged before and after the desoldering mechanism 520. Among them, "wire pay-off" and "wire rewinding" can be understood as the coordinated traction and transmission of the tinned solder tape. For example, the tinned solder tape is pulled out from the wire pay-off mechanism 510, flows to the desoldering mechanism 520, and then is recovered by the wire rewinding mechanism 530. The desoldering mechanism 520 can be the solder recovery device as described above. The tinned solder tape runs (that is, the aforementioned flow) into the tin furnace, turns after being melted by heat, flows out, and the molten solder is peeled off by the air pressure blowing of the air knife and recovered into the tin furnace.
[0045] The wire pay-off mechanism 510 may include a wire pay-off rack 511 and a bracket 512. One end of the wire pay-off rod 511 is fixedly connected to the bracket 512, and the other ends of the above two are fixedly connected to the mounting base plate. The exemplary structure of the wire pay-off rack 511 can refer to Figure 6 , on which a plurality of wire pay-off rods 610 can be provided, and each wire pay-off rod 610 can be used to place a tinned solder tape wound on a reel, for example, sleeved on the wire pay-off rod 610. The number of tinned solder tapes processed simultaneously can be adjusted by adjusting the number of reels placed.
[0046] The desoldering mechanism 520 can be the solder recovery device as described above, and the specific reference can be made to the foregoing description, which will not be elaborated here.
[0047] The wire rewinding structure 530 may include a traction bracket 531, a traction wheel 532, a traction wheel 533 and a traction motor 534. The exemplary structure can refer to Figure 7 , the traction wheels 720 (including the traction wheel 721 and the traction wheel 722) can be respectively connected to the traction bracket 710 in a stacked-up and down manner. The upper and lower traction wheels can be connected and driven by a belt B1, and the lower traction wheel and the traction motor 730 bracket can also be connected and driven by a belt B2.
[0048] It should be noted that the above description is merely exemplary and not restrictive. Different settings can be made according to actual needs without departing from the inventive concept of the present application. For example, the wire pay-off mechanism 510 can be passive pay-off or pay-off realized by motor drive. Another example is that the wire take-up mechanism 530 can be replaced with methods such as shaft take-up and coil take-up for solder tape recovery.
[0049] The solder recovery device disclosed in the present application remelts the solder on the waste solder tape in a solder furnace and blows and winds the solder. By continuously driving the front and rear of the waste solder tape, the product can be continuously driven in the solder furnace to remove the solder, and a solder recovery rate of more than 90% can be achieved.
[0050] The solder recovery device provided by the present application can limit and adjust the flow channel and / or flow direction of the waste solder tape by setting a guiding and limiting component, can process multiple solder tapes simultaneously and avoid entanglement between the solder tapes, and improves the processing efficiency.
[0051] The present application also discloses a solder recovery method, which can use the above solder recovery device to recover the solder on the waste solder tape.
[0052] The present application has described the basic concepts. Obviously, for those skilled in the art, the above detailed disclosure is merely an example and does not constitute a limitation to the present application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to the present application. Such modifications, improvements, and corrections are proposed in the present application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of the present application.
[0053] At the same time, the present application uses specific terms to describe the embodiments of the present application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in the present application is not necessarily the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.
[0054] Similarly, it should be noted that, in order to simplify the expression of the present application disclosure and thus help the understanding of one or more inventive embodiments, in the foregoing description of the embodiments of the present application, sometimes multiple features are merged into one embodiment or its description. However, this disclosure method does not mean that the features required by the object of the present application are more than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.
[0055] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application may be considered to be consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly presented and described in this application. The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.
Claims
1. A tin material recovery device for tin-coated solder strip, characterized in that: The tin material recovery device comprises: Tin furnace; A guide and limit assembly provided on the tin furnace; and An air knife assembly is arranged above the tin furnace; wherein, The tin furnace is used to heat-melt the solid tin material on the tin-coated solder strip entering into the tin furnace into the hot-melting tin material; the limiting guide assembly defines the flow channel of the tin-coated solder strip, and / or adjusts the flow direction so that the tin-coated solder strip flows into the tin furnace from the side and then flows out from the top of the tin furnace; The air knife assembly is used to separate the hot melt tin material on the tin-coated solder strip flowing out from above the tin furnace.
2. The tin material recovery device according to claim 1, characterized in that: The guide and limit assembly includes a tooling frame and a guide and limit structure arranged on the tooling frame; the tooling frame includes side frames movably connected to the tin furnace, and the guide and limit structure is arranged between the side frames; when external force is applied to the tooling frame, the guide and limit structure can enter or exit the tin furnace.
3. The tin material recovery device according to claim 2, characterized in that: The guide and limiting structure includes a tooling rod arranged between the side frames and one or more protrusions arranged on the tooling rod; the first space defined between two adjacent protrusions, or the second space defined between the protrusion and the side frame of the tooling frame is used to provide the flow channel, and the tooling rod is used to adjust the flow direction.
4. The tin material recovery device according to claim 2, characterized in that: The guide and limiting structure includes a tooling rod disposed between the side frames and one or more tooling guide wheels mounted on the tooling rod; the tooling guide wheels provide the flow channel and are used to adjust the flow direction.
5. The tin material recovery device according to claim 3 or 4, characterized in that: The guide and limiting structure further comprises a guide rod, which is arranged parallel to the tooling rod and is used for adjusting the flow direction of the detinning solder strip.
6. The tin material recovery device according to claim 1, characterized in that: The angle between the flow direction of the tin-coated solder strip after it flows out of the tin furnace and the horizontal plane is 80°-100°.
7. The tin material recovery device according to claim 6, characterized in that: The flow direction of the tin-coated solder strip after flowing out of the tin furnace is a vertical direction.
8. The tin material recovery device according to claim 1, characterized in that: The air knife assembly includes air knives arranged on both sides of the tin-coated solder strip flowing out of the tin furnace, and the angle between the blowing direction of the air knife outlet and the tin-coated solder strip is 0-90°.
9. The tin material recovery device according to claim 1, characterized in that: The tin material recovery device also includes a guiding structure arranged above the air knife assembly, which is used to adjust the flow direction of the tin-coated solder strip passing through the air knife assembly.
10. A tin material recovery method, characterized in that: The tin material recovery method is carried out based on the tin material recovery device according to any one of claims 1 to 9.