Silicon carbide wafer laser coding machine with dust collection structure and coding method

Abstract

The invention discloses a silicon carbide wafer laser coding machine with a dust collection structure and a coding method, and belongs to the field of laser coding. The silicon carbide wafer laser coding machine with the dust collection structure comprises a working bin and a machining structure which is arranged on one side of the inner wall of the working bin and used for coding wafers, and further comprises the dust collection mechanism which is installed on the side, close to the machining structure, of the inner wall of the working bin and used for removing dust of the wafers in machining. The dust suction mechanism comprises a vacuum suction machine, the vacuum suction machine is located on the side, close to the machining structure, of the inner wall of the working bin, the transfer robot is controlled to drive the transfer arm to transfer wafers to the containing disc, the output end of the vacuum suction machine is connected with the exhaust port through a pipeline, and the vacuum suction machine is located on the side, close to the machining structure, of the inner wall of the working bin. Suction force is transmitted to the first air suction frame and the second air suction frame through the two sets of input pipes after the vacuum suction machine is started, dust on the surfaces and the side walls of the wafers is adsorbed, and the code printing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser coding, and particularly relates to a silicon carbide wafer laser coding machine with a dust suction structure and a coding method. Background Art

[0002] A laser coder is a device that uses laser technology to identify silicon carbide wafers. It is mainly used to mark permanent marks on silicon carbide wafers, which can be characters, symbols or patterns, and has the functions of anti-counterfeiting and traceability. The laser coder locally irradiates the surface of the workpiece with a laser beam with a high energy density, causing the surface material to vaporize or undergo a chemical reaction with a color change, thereby leaving a permanent mark.

[0003] The problem with the traditional technology is that the transfer process during the laser coding of wafer materials is rather cumbersome. Wafer materials are highly refined materials, and their surfaces cannot have dust during laser coding, otherwise it will affect the coding quality and may also cause damage to the wafer materials. Summary of the Invention

[0004] The purpose of the present invention is to solve the problems in the prior art, and a silicon carbide wafer laser coding machine with a dust suction structure is proposed.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions: A silicon carbide wafer laser coding machine with a dust suction structure includes a working chamber and a processing structure arranged on one side of the inner wall of the working chamber for coding the wafer, and further includes a dust suction mechanism installed on the inner wall of the working chamber close to the processing structure for removing dust from the wafer during processing. The dust suction mechanism includes: a vacuum pump, the vacuum pump is located on the inner wall of the working chamber close to the processing structure, two input pipes are arranged at the input end of the vacuum pump, one input pipe is connected with a first suction frame at the input end, the bottom input end of the first suction frame is located above one side of the wafer to be processed in the processing structure, and the other input pipe is connected with a second suction frame at the input end, and the second suction frame is located on one side of the wafer to be processed in the processing structure.

[0006] Preferably, a lifting mechanism for driving the vacuum pump to adjust its height is connected to the side wall of the vacuum pump. The lifting mechanism includes a support base, the bottom end of the support base is fixedly connected to the bottom end of the inner wall of the working chamber, a driver is installed at the top end of the support base, the output end of the driver extends into the support base and is fixedly connected with a threaded lead screw, a moving block is threadedly connected to the outer wall of the threaded lead screw, guide sliders are fixedly connected to both sides of the rear end of the moving block, and guide rails are slidably connected to the inner walls of the guide sliders, and the guide rails are longitudinally arranged on the inner wall of the support base.

[0007] Preferably, the moving block slides on the inner wall of the support base. Vertical grooves are formed on both sides of the front baffle at the front end of the support base. Convex blocks are provided on both sides of the front end of the moving block. The convex blocks are slidably connected to the inner wall of the vertical groove and fixedly connected with a connecting frame through the vertical groove. The top end of the connecting frame is fixedly connected to the outer wall of the vacuum suction machine.

[0008] Preferably, the processing structure includes: A placement seat, above which a placement tray is arranged. A vacuum chuck two for adsorbing the wafer to be processed is installed on the placement tray; and A laser coding machine installed above the placement tray. The top end of the laser coding machine is fixedly connected with a fixing frame, and the bottom end of the fixing frame is connected to the bottom end of the inner wall of the working chamber.

[0009] Preferably, a driving motor two is fixedly installed on the inner wall of the placement seat. The output end of the driving motor two passes through the placement seat and is connected to the bottom end of the placement tray.

[0010] Preferably, a U-shaped frame is arranged between the output end of the driving motor two and the bottom end of the placement tray. The bottom end of the U-shaped frame is fixedly connected to the output end of the driving motor two, and both sides of the top end of the U-shaped frame are respectively connected to both sides of the bottom end of the placement tray.

[0011] Preferably, a storage bin is installed at the rear left of the inner wall of the working chamber. A wafer placement bin one and a wafer placement bin two are installed on the inner wall of the storage bin to store unprocessed wafers and processed wafers respectively. A transfer robot for transferring wafers is installed on the left side of the inner wall of the working chamber. The transfer robot is located in front of the storage bin.

[0012] Preferably, the output end of the transfer robot is connected with a transfer arm, and a vacuum chuck one for adsorbing the transferred wafer is installed above the transfer arm.

[0013] Preferably, a slot is formed on the placement tray, and the inner wall of the slot is slidably connected to the outer wall of the transfer arm.

[0014] Preferably, a silicon carbide wafer laser coding machine with a dust suction structure is as follows: S1: Drive the transfer arm through the transfer robot to take out a wafer that has not been coded and processed in the wafer placement bin one and place it on the placement tray, and adsorb it through the vacuum chuck two. S2: Turn on the vacuum suction machine to generate suction and transmit it to the first suction frame and the second suction frame through two groups of input pipes respectively to adsorb the dust on the surface of the wafer placed on the placement tray. At the same time, turn on the driving motor two to drive the placement tray to rotate, expand the adsorption range, and improve the dust removal efficiency.

[0015] Compared with the prior art, the present invention provides a silicon carbide wafer laser marking machine with a dust suction structure, having the following beneficial effects: 1. For the silicon carbide wafer laser marking machine with a dust suction structure, the transfer robot is controlled to drive the transfer arm to transfer the wafer, which is transferred to the placement tray. The output end of the vacuum suction machine is connected to the exhaust port through a pipeline. The vacuum suction machine is turned on, and the suction force is transmitted to the first suction frame and the second suction frame respectively through two input pipes to adsorb the dust on the surface and side wall of the wafer, improving the marking efficiency; 2. For the silicon carbide wafer laser marking machine with a dust suction structure, a U-shaped frame is fixedly installed below the placement tray. The bottom end of the U-shaped frame is connected to the output end of the second driving motor. The second driving motor is controlled to drive the placement tray to rotate through the U-shaped frame, thereby driving the wafer on the placement tray to rotate and expanding the adsorption range.

[0016] 3. For the silicon carbide wafer laser marking machine with a dust suction structure, a lifting mechanism is connected to the side wall of the vacuum suction machine to adjust the heights of the first suction frame and the second suction frame according to the use environment, expanding the applicable range. Description of the Drawings

[0017] Figure 1 is the front view of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention; Figure 2 is the internal structure schematic diagram of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention; Figure 3 is of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention Figure 2 inner view; Figure 4 is the front view of the storage bin of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention; Figure 5 is the front view of the vacuum suction machine of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention; Figure 6 is of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention Figure 5 side view; Figure 7 is the front view of the placement seat of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention; Figure 8 is of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention Figure 7 front view; Figure 9 is the front view of the transfer arm of a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention Figure 10 For a silicon carbide wafer laser marking machine with a dust suction structure proposed by the present invention Figure 9 front view.

[0018] In the figure: 1. Working bin; 2. Stock bin; 201. First wafer placement bin; 202. Second wafer placement bin; 3. Transfer robot; 301. Lifting cylinder; 302. Connecting plate; 303. First driving motor; 304. Arm seat; 305. Driving arm; 306. Transfer arm; 307. First vacuum suction cup; 4. Fixed frame; 401. Laser marker; 5. Dust suction mechanism; 501. Vacuum pump; 502. Input pipe; 503. First suction frame; 504. Second suction frame; 6. Placement seat; 601. Second driving motor; 602. U-shaped frame; 603. Placement plate; 604. Second vacuum suction cup; 605. Slot; 606. Exhaust port; 7. Lifting mechanism; 701. Connecting frame; 702. Support seat; 703. Third driving motor; 704. Threaded lead screw; 705. Moving block; 706. Guide rail; 707. Guide sliding frame; 709. Front baffle; 710. Vertical groove. Detailed implementation manners

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0020] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0021] Referring to Figure 1-10 , a silicon carbide wafer laser marking machine with a dust suction structure includes a working bin 1 and a processing structure for marking the wafer on one side of the inner wall of the working bin 1. A stock bin 2 is installed at the rear left of the inner wall of the working bin 1. The inner wall of the stock bin 2 is provided with a first wafer placement bin 201 and a second wafer placement bin 202 for storing unprocessed wafers and processed wafers respectively. A transfer robot 3 for transferring wafers is installed on the left side of the inner wall of the working bin 1, and the transfer robot 3 is located in front of the stock bin 2.

[0022] The output end of the transfer robot 3 is connected to a transfer arm 306, and above the transfer arm 306, a first vacuum chuck 307 for adsorbing the transferred wafer is installed. It further includes a dust suction mechanism 5 installed on the inner wall of the working chamber 1 near the processing structure to remove dust from the wafer being processed. During use: The transfer robot 3 drives the transfer arm 306 to take out a wafer that has not been coded and processed from the first wafer placement bin 201 and place it on the placement tray 603, and adsorb it with the second vacuum chuck 604. Place it on the processing structure, and adsorb the dust on its surface through the dust suction mechanism 5. The above-mentioned processing structure includes: a placement seat 6, a placement tray 603 is arranged above the placement seat 6, and a second vacuum chuck 604 for adsorbing the wafer to be processed is installed on the placement tray 603; and a laser coder 401 installed above the placement tray 603, the top end of the laser coder 401 is fixedly connected to a fixing frame 4, and the bottom end of the fixing frame 4 is connected to the bottom end of the inner wall of the working chamber 1.

[0023] During use, the transfer robot 3 drives the transfer arm 306 to take out a wafer that has not been coded and processed and place it on the placement tray 603 on the placement seat 6, adsorb it with the second vacuum chuck 604, after adsorbing the dust on its surface through the dust suction mechanism 5, perform coding processing on it through the laser coder 401. After the coding processing is completed, disconnect the second vacuum chuck 604, and then the transfer robot 3 drives the transfer arm 306 to transfer the processed wafer to the second wafer placement bin 202. Wherein, a second driving motor 601 is fixedly installed on the inner wall of the placement seat 6, the output end of the second driving motor 601 passes through the placement seat 6 and is connected to the bottom end of the placement tray 603. Turn on the second driving motor 601 to drive the placement tray 603 to rotate, thereby driving the wafer on the placement tray 603 to rotate, expanding the dust suction range, and at the same time, the coding position of the wafer can be adjusted.

[0024] It should be noted that: a U-shaped frame 602 is provided between the output end of the second driving motor 601 and the bottom end of the placement tray 603, the bottom end of the U-shaped frame 602 is fixedly connected to the output end of the second driving motor 601, both sides of the top end of the U-shaped frame 602 are respectively connected to both sides of the bottom end of the placement tray 603, and a slot 605 is opened on the placement tray 603, and the inner wall of the slot 605 is slidably connected to the outer wall of the transfer arm 306. During use, the transfer robot 3 drives the transfer arm 306 to take out a wafer that has not been coded and processed, transfers it above the placement tray 603. The transfer arm 306 corresponds to the slot 605 opened on the placement tray 603. The transfer robot 3 drives the transfer arm 306 to descend and place the wafer adsorbed on the transfer arm 306 on the placement tray 603. The vacuum of the first vacuum chuck 307 is disconnected, and the vacuum of the second vacuum chuck 604 on the placement tray 603 is turned on to adsorb the wafer. Then, after the transfer robot 3 drives the transfer arm 306 to descend and separate from the wafer, it is withdrawn from the slot 605. By controlling the driving motor two 601, the placement tray 603 is driven to rotate, and the wafer placed above it is driven to rotate. The dust on its surface is adsorbed by the dust suction mechanism 5. After adsorption, the position of the wafer is adjusted, and then the wafer is coded and processed by the laser coder 401. After processing is completed, the driving motor two 601 is controlled to drive the wafer to return to the correct position. Then, the transfer robot 3 is controlled to drive the transfer arm 306 to extend and rise, so that the top surface of the first vacuum chuck 307 of the transfer arm 306 adsorbs the bottom surface of the wafer. The vacuum of the second vacuum chuck 604 is disconnected, and then the transfer robot 3 drives the transfer arm 306 and the adsorbed wafer to rise, separating the wafer from the second vacuum chuck 604 and the placement tray 603, taking out the processed wafer, and placing it in the wafer placement bin two 202.

[0025] The upper dust suction mechanism 5 includes: a vacuum suction machine 501, which is located on the inner wall of the working chamber 1 near the processing structure. The input end of the vacuum suction machine 501 is provided with two groups of input pipes 502. One group of input pipes 502 is connected to a first suction frame 503 at its input end. The bottom input end of the first suction frame 503 is located above one side of the wafer to be processed in the processing structure. The other group of input pipes 502 is connected to a second suction frame 504 at its input end. The second suction frame 504 is located on one side of the wafer to be processed in the processing structure.

[0026] During use, the output end of the vacuum suction machine 501 is connected to the exhaust port 606 through a pipeline. The suction of the vacuum suction machine 501 is turned on and transmitted to the first suction frame 503 and the second suction frame 504 respectively through the two groups of input pipes 502 to adsorb the dust on the surface and side walls of the wafer; A lifting mechanism 7 for driving the up and down height adjustment is connected to the side wall of the upper suction vacuum machine 501. The lifting mechanism 7 includes a support base 702. The bottom end of the support base 702 is fixedly connected to the inner bottom end of the working bin 1. A driving motor three 703 is installed at the top end of the support base 702. The output end of the driving motor three 703 extends into the support base 702 and is fixedly connected with a threaded lead screw 704. A moving block 705 is threadedly connected to the outer wall of the threaded lead screw 704. Guide sliding frames 707 are fixedly connected to both sides of the rear end of the moving block 705. A guide rail 706 is slidably connected to the inner wall of the guide sliding frame 707. The guide rail 706 is longitudinally arranged on the inner wall of the support base 702; The moving block 705 slides on the inner wall of the support base 702. Vertical grooves 710 are opened on both sides of the front baffle 709 at the front end of the support base 702. Protrusions are provided on both sides of the front end of the moving block 705. The protrusions are slidably connected to the inner walls of the vertical grooves 710 and fixedly connected with a connecting frame 701 through the vertical grooves 710. The top end of the connecting frame 701 is fixedly connected to the outer wall of the vacuum machine 501.

[0027] During use, when the height of the vacuum machine 501 needs to be adjusted, control the driving motor three 703 to drive the threaded lead screw 704 to rotate. Through the threaded connection between the threaded lead screw 704 and the inner side of the moving block 705, drive the moving block 705 to move along the inner wall of the support base 702. The moving block 705 drives the connecting frame 701 and the vacuum machine 501 fixed on the connecting frame 701 to move, adjust the height, expand the use range, and at the same time drive the guide sliding frames 707 fixedly connected to both sides of the rear end of the moving block 705 to move along the guide rail 706 to guide the up and down movement of the moving block 705; In the above, the transfer robot 3 includes a lifting cylinder 301. The lifting cylinder 301 is fixedly installed at the lower left side of the inner wall of the working bin 1. The output end of the lifting cylinder 301 is connected with a connecting plate 302. A driving motor one 303 is fixedly installed at the top end of the connecting plate 302. The output end of the driving motor one 303 is connected with an arm seat 304. The output end of the arm seat 304 is connected with a driving arm 305. The output end of the driving arm 305 is connected with a transfer arm 306; During use, control the driving motor 1 303 to drive the arm seat 304 and the driving arm 305 to rotate, adjust the orientation of the driving arm 305, move to the first wafer placement bin 201, control the lifting cylinder 301 to drive the driving motor 1 303, the arm seat 304, the driving arm 305 and the transfer arm 306 to lift, so that the top of the transfer arm 306 is located below the wafer to be picked up, control the arm seat 304 and the driving arm 305 to drive the transfer arm 306 to linearly move horizontally into the first wafer placement bin 201, control the lifting cylinder 301 to drive the transfer arm 306 to rise, so that the first vacuum chuck 307 adsorbs the wafer, and then drives it to rise. After that, control the arm seat 304 and the driving arm 305 to drive the wafer adsorbed on the transfer arm 306 to be withdrawn, control the driving motor 1 303 to rotate to adjust the orientation of the wafer adsorbed on the transfer arm 306 to make it correspond to the placement tray 603. At this time, the height of the wafer is higher than the placement tray 603. Control the arm seat 304 and the driving arm 305 to drive the wafer adsorbed on the transfer arm 306 to extend, control the lifting cylinder 301 to drive the wafer adsorbed on the transfer arm 306 to descend, place the wafer on the placement tray 603, then turn on the second vacuum chuck 604, disconnect the first vacuum chuck 307, control the lifting cylinder 301 to drive the transfer arm 306 to continue to descend so that the first vacuum chuck 307 is separated from the wafer, and then control the arm seat 304 and the driving arm 305 to withdraw the transfer arm 306. Subsequently, perform dust removal and coding. After coding, control the lifting cylinder 301, the driving motor 1 303, the arm seat 304, the driving arm 305 and the transfer arm 306 to transfer the coded wafer into the second wafer placement bin 202. Repeat the process, which is convenient to use.

[0028] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present invention.

Claims

1. A silicon carbide wafer laser coding machine with a dust suction structure, comprising a working chamber (1) and a processing structure arranged on one side of the inner wall of the working chamber (1) for coding the wafer, characterized in that: It also includes a dust collection mechanism (5) installed on the inner wall of the working chamber (1) close to the processing structure to remove dust from the wafer being processed; The dust suction mechanism (5) comprises: a vacuum suction machine (501), the vacuum suction machine (501) being located on the inner wall of the working chamber (1) close to the processing structure, the input end of the vacuum suction machine (501) being provided with two groups of input pipes (502), the input end of one group of input pipes (502) being connected to a first suction frame (503), the bottom input end of the first suction frame (503) being located above a wafer to be processed in the processing structure, and the input end of the other group of input pipes (502) being connected to a second suction frame (504), the second suction frame (504) being located on a side of the wafer to be processed in the processing structure.

2. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 1, characterized in that: The side wall of the vacuum suction machine (501) is connected to a lifting mechanism (7) for driving the vacuum suction machine (501) to be lifted and lowered to adjust its height. The lifting mechanism (7) comprises a support seat (702). The bottom end of the support seat (702) is fixedly connected to the bottom end of the inner wall of the working chamber (1). A driver is installed on the top of the support seat (702). The output end of the driver extends to the support seat (702) and is fixedly connected to a threaded screw (704). The outer wall of the threaded screw (704) is threadedly connected to a moving block (705). Both sides of the rear end of the moving block (705) are fixedly connected to guide slide frames (707). The inner wall of the guide slide frame (707) is slidably connected to a guide rail (706). The guide rail (706) is longitudinally arranged on the inner wall of the support seat (702).

3. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 2, characterized in that: The moving block (705) slides on the inner wall of the support seat (702), and vertical grooves (710) are provided on both sides of the front baffle plate (709) at the front end of the support seat (702). The moving block (705) is provided with protrusions on both sides of the front end, and the protrusions are slidably connected to the inner wall of the vertical groove (710), and a connecting frame (701) is fixedly connected through the vertical groove (710), and the top end of the connecting frame (701) is fixedly connected to the outer wall of the vacuum suction machine (501).

4. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 3, characterized in that: The processing structure comprises: A placement seat (6), a placement plate (603) is arranged above the placement seat (6), and a second vacuum suction cup (604) for adsorbing a wafer to be processed is installed on the placement plate (603); and A laser code marker (401) is installed above the placement plate (603), wherein the top end of the laser code marker (401) is fixedly connected to a fixing frame (4), and the bottom end of the fixing frame (4) is connected to the bottom end of the inner wall of the working chamber (1).

5. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 4, characterized in that: A second driving motor (601) is fixedly mounted on the inner wall of the placement seat (6), and an output end of the second driving motor (601) passes through the placement seat (6) and is connected to the bottom end of the placement plate (603).

6. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 5, characterized in that: A U-shaped frame (602) is provided between the output end of the second driving motor (601) and the bottom end of the placement plate (603); the bottom end of the U-shaped frame (602) is fixedly connected to the output end of the second driving motor (601); and the top ends of the U-shaped frame (602) are respectively connected to the bottom ends of the placement plate (603).

7. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 6, characterized in that: A storage bin (2) is installed at the rear left side of the inner wall of the working bin (1); a wafer placement bin 1 (201) and a wafer placement bin 2 (202) are installed on the inner wall of the storage bin (2) for storing unprocessed wafers and processed wafers respectively; a transfer robot (3) for transferring wafers is installed on the left side of the inner wall of the working bin (1); the transfer robot (3) is located at the front side of the storage bin (2).

8. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 7, characterized in that: The output end of the transfer robot (3) is connected to a transfer arm (306), and a vacuum suction cup (307) for adsorbing the transferred wafer is installed above the transfer arm (306).

9. The silicon carbide wafer laser marking machine with a dust suction structure according to claim 8, characterized in that: The placement plate (603) is provided with a slot (605), and the inner wall of the slot (605) is slidably connected to the outer wall of the transfer arm (306).

10. A coding method for a silicon carbide wafer laser coding machine, applied to a silicon carbide wafer laser coding machine with a dust suction structure as described in claims 1-9, characterized in that: The specific steps are as follows: S1: The transfer robot (3) drives the transfer arm (306) to take out a wafer that has not been coded and is placed in the wafer placement chamber (201), and places it on the placement plate (603), and adsorbs it by the vacuum suction cup (604); S2: Turn on the vacuum suction machine (501) to generate suction force which is transmitted to the first suction frame (503) and the second suction frame (504) through two sets of input pipes (502) respectively, so as to absorb dust on the surface of the wafer placed on the placement plate (603). At the same time, turn on the second drive motor (601) to drive the placement plate (603) to rotate, thereby expanding the suction range and improving the dust removal efficiency.

Images