Chip receiving equipment for chip testing

Abstract

The invention relates to the technical field of chip testing, in particular to chip receiving equipment for chip testing. Comprising a material receiving guide rail, a material receiving rotating motor, a material receiving table, two material receiving sliding seats, a material receiving rotating disc, a material receiving middle rotating disc, a material receiving clamping jaw electric cylinder lead screw, a material receiving clamping jaw plate, a material receiving clamping jaw mechanism, a material receiving transfer carrier table, a longitudinal moving mechanism, a material receiving support, a material receiving supporting plate, a material receiving film expanding table, a material receiving film expanding plate, two C-shaped cavities, a vacuum adsorption head and a lifting basket electric cylinder lead screw. The wafer receiving device comprises a lifting basket placing plate, a wafer lifting basket, a transverse electric cylinder screw rod, a material receiving electric cylinder screw rod and a material receiving suction nozzle, a chip can be automatically sucked through the material receiving suction nozzle, a material receiving clamping jaw mechanism can automatically clamp the chip, and a material receiving rotating disc can drive a material receiving seat to rotate so as to realize operation of different stations, so that the dependence on manual intervention is reduced; and the risk of receiving errors or safety accidents caused by human factors is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a chip receiving device for chip testing. Background Art

[0002] At present, with the rapid development of electronic technology, chips, as the core components in electronic devices, their performance and quality are directly related to the performance and stability of the entire device. Therefore, chip testing technology is particularly important. The chip testing systems in the prior art already have a certain level of automation and intelligence, and can realize the testing of the basic functions, performance indicators, reliability, etc. of chips. These testing systems can automatically execute testing tasks and generate corresponding test reports through preset testing processes and testing parameters, greatly improving the testing efficiency and accuracy. At the same time, the testing systems in the prior art also have a certain degree of scalability and flexibility, and can be upgraded in function and adjusted in testing process according to actual needs, so as to better meet the needs of chip testing.

[0003] However, the existing chip receiving devices still need to be strengthened in terms of intelligence and automation levels. Most devices still require manual intervention and monitoring to ensure the smooth progress of receiving, which not only increases the labor cost, but also may cause receiving errors or safety accidents due to human factors. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip receiving device for chip testing, aiming to solve the technical problem that the existing chip receiving devices in the prior art still need to be strengthened in terms of intelligence and automation levels, and most devices still require manual intervention and monitoring to ensure the smooth progress of receiving, which not only increases the labor cost, but also may cause receiving errors or safety accidents due to human factors.

[0005] To achieve the above object, a chip receiving device for chip testing according to the present invention includes a receiving guide rail, a receiving rotating motor, and a receiving table. Two receiving sliders are slidably disposed above the receiving guide rail. Transverse electric cylinder screws are provided on both of the two receiving sliders. A receiving electric cylinder screw is provided at the moving end of the transverse electric cylinder screw, and a receiving suction nozzle is provided at the moving end of the receiving electric cylinder screw. The output end of the receiving rotating motor is provided with a receiving rotating disk. Receiving seats are provided at both ends of the receiving rotating disk. A receiving middle rotating disk is provided on the receiving seat. A receiving jaw electric cylinder screw is provided at one end of the receiving table. A receiving jaw plate is provided at the moving end of the receiving jaw electric cylinder screw. A receiving jaw mechanism is provided at one end of the receiving jaw plate. A receiving transfer carrier table is provided at the other end of the receiving table. A longitudinal moving mechanism is provided in the middle of the receiving table. A receiving support is provided at the moving end of the longitudinal moving mechanism. A receiving support plate is provided above the receiving support. A receiving film expanding table is provided above the receiving support plate. A receiving film expanding plate is provided inside the receiving film expanding table. Two C-shaped cavities are provided inside the receiving film expanding plate, and vacuum suction heads are provided in the two C-shaped cavities. A basket lifting electric cylinder screw is provided on one side of the receiving table. A basket placing plate is provided at the moving end of the basket lifting electric cylinder screw. A wafer basket is provided on the basket placing plate. The receiving guide rail is fixedly connected to the receiving table and is located on the other side of the receiving table. The receiving rotating motor is provided at the other end of the receiving table.

[0006] Wherein, a non-conforming product placing tray is further provided at one end of the receiving table, and the non-conforming product placing tray is also located on one side of the receiving jaw electric cylinder screw.

[0007] Wherein, one of the receiving electric cylinder screws is located between the receiving transfer carrier table and the non-conforming product placing tray, and the other receiving electric cylinder screw is located between the receiving transfer carrier table and the receiving rotating disk.

[0008] Wherein, the longitudinal moving mechanism includes a longitudinal moving plate, two longitudinal guide rails, and a longitudinal motor. A longitudinal thread sleeve is provided below the longitudinal moving plate. A longitudinal slider is slidably disposed above the longitudinal guide rail. The output end of the longitudinal motor is provided with a longitudinal screw. The longitudinal moving plate is fixedly connected to the corresponding longitudinal slider and is located on the two longitudinal sliders, and the receiving support is provided on the longitudinal moving plate. The two longitudinal guide rails are respectively fixedly connected to the receiving table and are located in the middle of the receiving table. The longitudinal motor is fixedly connected to the receiving table and is located in the middle of the receiving table and is also located between the two longitudinal guide rails. The longitudinal thread sleeve is threadedly connected to the longitudinal screw and is sleeved on the longitudinal screw.

[0009] Among them, the chip receiving device for chip testing further includes a receiving flying shot camera, which is fixedly connected to the receiving table, located in the middle of the receiving table, and also located on one side of the receiving support plate.

[0010] Among them, the chip receiving device for chip testing further includes a receiving photographing camera and a receiving scanning gun. The receiving photographing camera is arranged at one end of the receiving table and also located above the corresponding receiving middle turntable. The receiving scanning cavity is arranged on one side of the receiving table and also located between the wafer basket and the receiving support plate.

[0011] Among them, four side flying shot positioning cameras are further arranged at one end of the receiving table, and the distances between the four side flying shot cameras are controlled by electric cylinder screws. A bottom flying shot positioning camera is further arranged at one end of the receiving table, and the bottom flying shot positioning box is located between the four side flying shot positioning cameras. The bottom flying shot positioning camera and the four side flying shot positioning cameras are all located between the receiving transfer carrier table and the receiving rotating disk.

[0012] Among them, the receiving gripper mechanism includes a receiving finger cylinder, a receiving gripper sliding seat, a receiving gripper fixed seat, and a receiving gripper fixing plate. A receiving upper gripper is arranged at one output end of the receiving finger cylinder. A receiving gripper stop block is arranged at one end of the receiving upper gripper. A receiving lower gripper is arranged at the other output end of the receiving finger cylinder. Two receiving gripper positioning pins are arranged on the receiving lower gripper, and the two receiving gripper positioning pins penetrate through one end of the receiving upper gripper. A receiving gripper micro optical fiber is arranged below the receiving lower gripper. A receiving gripper photoelectric sensor and a receiving gripper buffer spring are arranged below the receiving gripper fixing plate. The receiving finger cylinder is fixedly connected to the receiving gripper sliding seat and located below the receiving gripper sliding seat. The receiving gripper sliding seat is slidably connected to the receiving gripper fixed seat and located below the receiving gripper fixed seat. The receiving gripper fixed seat is fixedly connected to the receiving gripper fixing plate and located below the receiving gripper fixing plate. And the receiving gripper buffer spring is connected to one side of the receiving gripper sliding seat. The receiving gripper fixing plate is arranged at one end of the receiving gripper plate.

[0013] A chip receiving device for chip testing according to the present invention includes a receiving guide rail, a receiving rotating motor, and a receiving table. Two receiving sliders are slidably arranged above the receiving guide rail. Transverse electric cylinder screws are arranged on both of the two receiving sliders. A receiving electric cylinder screw is arranged at the moving end of the transverse electric cylinder screw, and a receiving suction nozzle is arranged at the moving end of the receiving electric cylinder screw. The output end of the receiving rotating motor is provided with a receiving rotating disk. Receiving seats are arranged at both ends of the receiving rotating disk. A receiving middle rotating disk is arranged on the receiving seat. A receiving jaw electric cylinder screw is arranged at one end of the receiving table. A receiving jaw plate is arranged at the moving end of the receiving jaw electric cylinder screw. A receiving jaw mechanism is arranged at one end of the receiving jaw plate. A receiving transfer carrier table is arranged at the other end of the receiving table. A longitudinal moving mechanism is arranged in the middle of the receiving table. A receiving support is arranged at the moving end of the longitudinal moving mechanism. A receiving support plate is arranged above the receiving support. A receiving film expanding table is arranged above the receiving support plate. A receiving film expanding plate is arranged in the receiving film expanding table. Two C-shaped cavities are formed in the receiving film expanding plate, and vacuum suction heads are arranged in the two C-shaped cavities. A basket lifting electric cylinder screw is arranged on one side of the receiving table. A basket placing plate is arranged at the moving end of the basket lifting electric cylinder screw. A wafer basket is arranged on the basket placing plate. The receiving guide rail is fixedly connected to the receiving table and is located on the other side of the receiving table. The receiving rotating motor is arranged at the other end of the receiving table. The chip can be automatically sucked by the receiving suction nozzle, and the chip can be automatically clamped by the receiving jaw mechanism. The receiving rotating disk can drive the receiving seat to rotate to realize operations at different stations, etc., reducing the dependence on manual intervention. At the same time, the receiving flying shooting camera, the receiving photographing camera, the receiving scanning gun, and multiple flying shooting positioning cameras equipped in the device can perform real-time monitoring and data collection on the receiving process, helping to timely discover problems in the receiving process, reducing the risk of receiving errors or safety accidents caused by human factors, reducing the labor cost to a certain extent, and improving the intelligent and automated level of the chip receiving device. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 It is the front view of the chip receiving device for chip testing according to the present invention.

[0016] Figure 2 It is the rear view of the chip receiving device for chip testing according to the present invention.

[0017] Figure 3 It is a schematic structural diagram of the receiving electric cylinder screw rod and the receiving sliding seat in the chip receiving device for chip testing of the present invention.

[0018] Figure 4 It is a schematic structural diagram of the longitudinal movement mechanism and the receiving support plate in the chip receiving device for chip testing of the present invention.

[0019] Figure 5 It is a schematic structural diagram of the receiving flying shot camera in the chip receiving device for chip testing of the present invention.

[0020] Figure 6 It is a schematic structural diagram of the receiving rotating disk in the chip receiving device for chip testing of the present invention.

[0021] Figure 7 It is a schematic structural diagram of the side flying shot positioning camera and the bottom flying shot positioning camera in the chip receiving device for chip testing of the present invention.

[0022] Figure 8 It is a front view of the receiving jaw mechanism in the chip receiving device for chip testing of the present invention.

[0023] Figure 9 It is a rear view of the receiving jaw mechanism in the chip receiving device for chip testing of the present invention.

[0024] 301 - Receiving guide rail, 302 - Receiving rotating motor, 303 - Receiving table, 304 - Receiving sliding seat, 305 - Receiving electric cylinder screw rod, 306 - Receiving suction nozzle, 307 - Receiving rotating disk, 308 - Receiving seat, 309 - Receiving middle rotating disk, 310 - Receiving gripper electric cylinder screw rod, 311 - Receiving gripper plate, 312 - Receiving gripper mechanism, 313 - Receiving transfer carrier table, 314 - Longitudinal moving mechanism, 315 - Receiving support, 316 - Receiving support plate, 317 - Receiving film expanding table, 318 - Receiving film expanding plate, 319 - C-shaped cavity, 320 - Basket electric cylinder screw rod, 321 - Basket placement plate, 322 - Wafer basket, 323 - Reject placement tray, 324 - Longitudinal moving plate, 325 - Longitudinal guide rail, 326 - Longitudinal motor, 327 - Longitudinal threaded sleeve, 328 - Longitudinal sliding seat, 329 - Longitudinal screw rod, 330 - Receiving flying shooting camera, 331 - Receiving photographing camera, 332 - Receiving scanning gun, 333 - Side flying shooting positioning camera, 334 - Bottom flying shooting positioning camera, 335 - Receiving finger cylinder, 336 - Receiving gripper sliding seat, 337 - Receiving gripper fixed seat, 338 - Receiving gripper fixing plate, 339 - Receiving upper gripper, 340 - Receiving gripper stop block, 341 - Receiving lower gripper, 342 - Receiving gripper positioning pin, 343 - Receiving gripper micro optical fiber, 344 - Receiving gripper photoelectric sensor, 345 - Receiving gripper buffer spring, 346 - Transverse electric cylinder screw rod. Detailed implementation manners

[0025] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0026] Please refer to Figures 1 to 9, the present invention provides a chip receiving device for chip testing, including a receiving guide rail 301, a receiving rotating motor 302 and a receiving table 303. Two receiving sliders 304 are slidably arranged above the receiving guide rail 301. A transverse electric cylinder screw 346 is arranged on each of the two receiving sliders 304. The movable end of the transverse electric cylinder screw 346 is provided with a receiving electric cylinder screw 305, and the movable end of the receiving electric cylinder screw 305 is provided with a receiving suction nozzle 306. The output end of the receiving rotating motor 302 is provided with a receiving rotating disk 307. Receiving seats 308 are arranged at both ends of the receiving rotating disk 307. A receiving middle rotating disk 309 is arranged on the receiving seat 308. A receiving jaw electric cylinder screw 310 is arranged at one end of the receiving table 303. The movable end of the receiving jaw electric cylinder screw 310 is provided with a receiving jaw plate 311. A receiving jaw mechanism 312 is arranged at one end of the receiving jaw plate 311. A receiving transfer carrier table 313 is arranged at the other end of the receiving table 303. A longitudinal moving mechanism 314 is arranged in the middle of the receiving table 303. The movable end of the longitudinal moving mechanism 314 is provided with a receiving support 315. A receiving support plate 316 is arranged above the receiving support 315. A receiving film expanding table 317 is arranged above the receiving support plate 316. A receiving film expanding plate 318 is arranged in the receiving film expanding table 317. Two C-shaped cavities 319 are formed in the receiving film expanding plate 318, and vacuum suction heads are arranged in the two C-shaped cavities 319. A basket lifting electric cylinder screw 320 is arranged on one side of the receiving table 303. The movable end of the basket lifting electric cylinder screw 320 is provided with a basket placing plate 321. A wafer basket 322 is arranged on the basket placing plate 321. The receiving guide rail 301 is fixedly connected to the receiving table 303 and is located on the other side of the receiving table 303. The receiving rotating motor 302 is arranged at the other end of the receiving table 303.

[0027] In this embodiment, through the cooperation of the material receiving guide rail 301 and the material receiving slide block 304, the lateral electric cylinder screw rod 346 drives the material receiving electric cylinder screw rod 305 to drive the material receiving suction nozzle 306 to move flexibly, enabling precise suction of chips at different positions. The material receiving rotating motor 302 drives the material receiving rotating disk 307 to rotate, driving the two ends of the material receiving seats 308 to switch between different workstations, improving the material receiving efficiency. The material receiving middle rotating disk 309 facilitates the transfer of chips. The material receiving gripper electric cylinder screw rod 310 cooperates with the material receiving gripper mechanism 312 to achieve the gripping operation of chips. The material receiving transfer carrier table 313 can be used for chip transfer. The longitudinal moving mechanism 314 drives the material receiving bracket 315 and related components to move longitudinally to adapt to the material receiving requirements at different heights. The material receiving film expanding table 317 and the internal vacuum suction heads can position and fix the chip tray. The basket electric cylinder screw rod 320 cooperates with the basket placement plate 321 to achieve the lifting of the wafer basket 322, facilitating the storage and picking of chips. The overall structure realizes the automation and high efficiency of the chip material receiving process.

[0028] Further, a non-conforming product placement tray 323 is also provided at one end of the material receiving table 303, and the non-conforming product placement tray 323 is also located on one side of the material receiving gripper electric cylinder screw rod 310.

[0029] In this embodiment, when non-conforming chips are found, the material receiving gripper mechanism 312 can directly place the non-conforming chips into the non-conforming product placement tray 323, realizing the rapid classification of non-conforming products and qualified products, improving the material receiving quality and subsequent processing efficiency, preventing non-conforming products from being mixed into qualified products, and reducing subsequent screening work.

[0030] Further, one of the material receiving electric cylinder screw rods 305 is located between the material receiving transfer carrier table 313 and the non-conforming product placement tray 323, and the other material receiving electric cylinder screw rod 305 is located between the material receiving transfer carrier table 313 and the material receiving rotating disk 307.

[0031] In this embodiment, through such a layout, after the material receiving suction nozzle 306 sucks the chips, it can flexibly place the chips into the material receiving transfer carrier table 313 and the non-conforming product placement tray 323 according to different material receiving processes, optimizing the path of the chips in the material receiving process, and improving the flexibility and efficiency of the material receiving operation.

[0032] Further, the longitudinal moving mechanism 314 includes a longitudinal moving plate 324, two longitudinal guide rails 325 and a longitudinal motor 326. A longitudinal thread sleeve 327 is provided below the longitudinal moving plate 324. A longitudinal sliding seat 328 is slidably provided above the longitudinal guide rail 325. A longitudinal screw 329 is provided at the output end of the longitudinal motor 326. The longitudinal moving plate 324 is fixedly connected to the corresponding longitudinal sliding seat 328, is located on the two longitudinal sliding seats 328, and the material receiving bracket 315 is provided on the longitudinal moving plate 324. The two longitudinal guide rails 325 are respectively fixedly connected to the material receiving table 303 and are located in the middle of the material receiving table 303. The longitudinal motor 326 is fixedly connected to the material receiving table 303, is located in the middle of the material receiving table 303, and is also located between the two longitudinal guide rails 325. The longitudinal thread sleeve 327 is threadedly connected to the longitudinal screw 329 and is sleeved on the longitudinal screw 329.

[0033] In this embodiment, driven by the longitudinal motor 326, the longitudinal moving plate 324 can move longitudinally along the longitudinal guide rail 325, thereby driving the material receiving bracket 315 and related components to move longitudinally, improving the versatility and flexibility of the equipment, and better adapting to the material receiving operations of chips of different specifications.

[0034] Further, the chip material receiving equipment for chip testing further includes a material receiving flying shooting camera 330. The material receiving flying shooting camera 330 is fixedly connected to the material receiving table 303, is located in the middle of the material receiving table 303, and is also located on one side of the material receiving support plate 316.

[0035] In this embodiment, through the material receiving flying shooting camera 330, chip images can be quickly taken during the chip material receiving process, and information such as the position and state of the chips can be obtained in real time, facilitating precise positioning and state monitoring of the chips, and promptly discovering problems such as whether the chips are offset or damaged during the material receiving process, improving the accuracy and reliability of material receiving.

[0036] Further, the chip material receiving equipment for chip testing further includes a material receiving photographing camera 331 and a material receiving scanning gun 332. The material receiving photographing camera 331 is provided at one end of the material receiving table 303 and is also located above the corresponding material receiving middle turntable 309. The material receiving scanning cavity is provided on one side of the material receiving table 303 and is also located between the wafer basket 322 and the material receiving support plate 316.

[0037] In this embodiment, the chip on the middle turntable can be photographed in detail by the receiving material photographing camera 331 to obtain high-definition image information of the chip for subsequent quality inspection and analysis. The receiving material scanning gun 332 can quickly scan the identification information on the wafer basket 322 or the chip to realize the informatization management of the chip, facilitating the recording and tracing of information such as the source and batch of the chip.

[0038] Furthermore, four side flying shot positioning cameras 333 are provided at one end of the receiving material table 303, and the distances between the four side flying shot cameras are controlled by electric cylinder lead screws. A bottom flying shot positioning camera 334 is also provided at one end of the receiving material table 303, and the bottom flying shot positioning box is located between the four side flying shot positioning cameras 333. The bottom flying shot positioning camera 334 and the four side flying shot positioning cameras 333 are both located between the receiving material transfer carrier table 313 and the receiving material rotating disk 307.

[0039] In this embodiment, by positioning and photographing the chip from different angles by multiple flying shot positioning cameras, the position and posture of the chip can be determined more accurately, improving the positioning accuracy of chip receiving. By controlling the distance between the side flying shot positioning cameras 333 with electric cylinder lead screws, the positioning requirements of chips of different sizes can be adapted, enhancing the versatility of the equipment.

[0040] Furthermore, the receiving material clamping jaw mechanism 312 includes a receiving material finger cylinder 335, a receiving material clamping jaw sliding seat 336, a receiving material clamping jaw fixing seat 337, and a receiving material clamping jaw fixing plate 338. A receiving material upper clamping jaw 339 is provided at one output end of the receiving material finger cylinder 335. A receiving material clamping jaw stopper 340 is provided at one end of the receiving material upper clamping jaw 339. A receiving material lower clamping jaw 341 is provided at the other output end of the receiving material finger cylinder 335. Two receiving material clamping jaw positioning pins 342 are provided on the receiving material lower clamping jaw 341, and the two receiving material clamping jaw positioning pins 342 penetrate through one end of the receiving material upper clamping jaw 339. A receiving material clamping jaw micro optical fiber 343 is provided below the receiving material lower clamping jaw 341. A receiving material clamping jaw photoelectric sensor 344 and a receiving material clamping jaw buffer spring 345 are provided below the receiving material clamping jaw fixing plate 338. The receiving material finger cylinder 335 is fixedly connected to the receiving material clamping jaw sliding seat 336 and is located below the receiving material clamping jaw sliding seat 336. The receiving material clamping jaw sliding seat 336 is slidably connected to the receiving material clamping jaw fixing seat 337 and is located below the receiving material clamping jaw fixing seat 337. The receiving material clamping jaw fixing seat 337 is fixedly connected to the receiving material clamping jaw fixing plate 338 and is located below the receiving material clamping jaw fixing plate 338. The receiving material clamping jaw buffer spring 345 is connected to one side of the receiving material clamping jaw sliding seat 336. The receiving material clamping jaw fixing plate 338 is provided at one end of the receiving material clamping jaw plate 311.

[0041] In this embodiment, the receiving finger cylinder 335 drives the upper receiving jaw 339 and the lower receiving jaw 341 to perform opening and closing actions. The receiving jaw stopper 340 can prevent the chip from falling during the picking process. The receiving jaw positioning pin 342 ensures the accurate alignment of the upper and lower jaws. The receiving jaw micro optical fiber 343 can be used to detect whether the chip is in place. The receiving jaw photoelectric sensor 344 can detect the working state of the jaw. The receiving jaw buffer spring 345 plays a buffering role to protect the chip and the jaw mechanism. The entire jaw mechanism is reasonably designed, and each component works together to stably and accurately pick up the chip, improving the success rate and quality of chip receiving.

[0042] In the present invention, the guide rail and the slide seat used in this design are both driven electrically.

[0043] In the present invention, the receiving rotation motor 302 drives the receiving rotating disk 307 to rotate, driving the two receiving seats 308 at both ends to switch between different workstations. The two receiving slide seats 304 on the receiving guide rail 301 can slide, and the transverse electric cylinder screw rod 346 thereon drives the receiving electric cylinder screw rod 305 to move horizontally. The receiving electric cylinder screw rod 305 drives the receiving suction nozzle 306 to move and pick up the chip onto the receiving transfer carrier table 313. Another receiving electric cylinder screw rod 305 drives the receiving suction nozzle 306 to pick up the chip on the receiving transfer carrier table 313 and place it into the wafer tray. If there are defective chips, they will be placed in the defective product placement tray 323. During this process, the receiving flying shot camera 330, the receiving camera, and multiple flying shot positioning cameras are respectively used to capture the chip image and locate the chip position. Subsequently, the receiving jaw electric cylinder screw rod 310 drives the receiving jaw plate 311 and the jaw mechanism to pick up the wafer disk and move it into the wafer basket 322. During this process, the receiving scanning gun 332 scans the identification information. The longitudinal motor 326 of the longitudinal moving mechanism 314 cooperates with the longitudinal screw rod 329 and the longitudinal threaded sleeve 327 to make the longitudinal moving plate 324 drive the receiving support 315 and related components to move longitudinally, thereby driving the receiving support plate 316 to move towards the wafer basket 322 for placing the wafer disk. The vacuum suction head can perform vacuum suction on the wafer disk. The basket electric cylinder screw rod 320 drives the basket placement plate 321 to lift and lower, facilitating the storage and picking of the wafer basket 322.

[0044] The above-disclosed is only a preferred embodiment of the present invention. Of course, it cannot be used to limit the scope of the rights of the present invention. Those of ordinary skill in the art can understand the entire or partial processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present invention still fall within the scope covered by the invention.

Claims

1. A chip receiving device for chip testing, characterized in that: It includes a material receiving guide rail, a material receiving rotating motor and a material receiving platform, two material receiving slides are slidably arranged above the material receiving guide rail, and a transverse electric cylinder screw rod is arranged on the two material receiving slides, and a material receiving electric cylinder screw rod is arranged at the moving end of the transverse electric cylinder screw rod, and a material receiving suction nozzle is arranged at the moving end of the material receiving electric cylinder screw rod, a material receiving rotating disk is arranged at the output end of the material receiving rotating motor, and material receiving seats are arranged at both ends of the material receiving rotating disk, and a material receiving turntable is arranged on the material receiving seat, a material receiving clamping electric cylinder screw rod is arranged at one end of the material receiving platform, a material receiving clamping plate is arranged at the moving end of the material receiving clamping electric cylinder screw rod, a material receiving clamping mechanism is arranged at one end of the material receiving platform, and a material receiving adapter is arranged at the other end of the material receiving platform. A carrier table, a longitudinal moving mechanism is provided in the middle of the material receiving table, a material receiving bracket is provided at the moving end of the longitudinal moving mechanism, a material receiving support plate is provided above the material receiving support plate, a material receiving and film expanding table is provided above the material receiving and film expanding table, a material receiving and film expanding plate is provided in the material receiving and film expanding table, two C-shaped cavities are provided in the material receiving and film expanding plate, and vacuum adsorption heads are provided in the two C-shaped cavities, a basket lifting electric cylinder screw rod is provided on one side of the material receiving table, a basket lifting placement plate is provided at the moving end of the basket lifting electric cylinder screw rod, a wafer lifting basket is provided on the basket lifting placement plate, the material receiving guide rail is fixedly connected to the material receiving table and is located on the other side of the material receiving table, and the material receiving rotating motor is provided at the other end of the material receiving table.

2. The chip receiving device for chip testing according to claim 1, characterized in that: A defective product placement tray is also provided at one end of the material receiving platform, and the defective product placement tray is also located on one side of the lead screw of the material receiving clamping claw electric cylinder.

3. The chip receiving device for chip testing according to claim 2, characterized in that: One of the material receiving electric cylinder screw rods is located between the material receiving transfer carrier platform and the defective product placement plate, and the other material receiving electric cylinder screw rod is located between the material receiving transfer carrier platform and the material receiving rotating plate.

4. The chip receiving device for chip testing according to claim 3, characterized in that: The longitudinal moving mechanism includes a longitudinal moving plate, two longitudinal guide rails and a longitudinal motor. A longitudinal threaded sleeve is arranged at the bottom of the longitudinal moving plate, a longitudinal slide seat is slidably arranged above the longitudinal guide rail, and a longitudinal screw is arranged at the output end of the longitudinal motor. The longitudinal moving plate is fixedly connected to the corresponding longitudinal slide seats and is located on the two longitudinal slide seats, and the material receiving bracket is arranged on the longitudinal moving plate. The two longitudinal guide rails are respectively fixedly connected to the material receiving table and are located in the middle of the material receiving table. The longitudinal motor is fixedly connected to the material receiving table and is located in the middle of the material receiving table, and is also located between the two longitudinal guide rails. The longitudinal threaded sleeve is threadedly connected to the longitudinal screw and is sleeved on the longitudinal screw.

5. The chip receiving device for chip testing according to claim 4, characterized in that: The chip receiving device for chip testing also includes a receiving flying camera, which is fixedly connected to the receiving platform and is located in the middle of the receiving platform and is also located on one side of the receiving support plate.

6. The chip receiving device for chip testing according to claim 5, characterized in that: The chip receiving equipment for chip testing also includes a receiving camera and a receiving scanning gun. The receiving camera is arranged at one end of the receiving platform and is also located above the corresponding receiving turntable. The receiving scanning cavity is arranged on one side of the receiving platform and is also located between the wafer basket and the receiving support plate.

7. The chip receiving device for chip testing according to claim 6, characterized in that: Four side flying camera positioning cameras are also arranged at one end of the material receiving platform, and the spacing between the four side flying cameras is controlled by an electric cylinder screw rod. A bottom flying camera is also arranged at one end of the material receiving platform, and the bottom flying camera positioning box is located between the four side flying camera positioning cameras. The bottom flying camera positioning camera and the four side flying camera positioning cameras are all located between the material receiving transfer carrier platform and the material receiving rotating disk.

8. The chip receiving device for chip testing according to claim 7, characterized in that: The material receiving clamp mechanism includes a material receiving finger cylinder, a material receiving clamp sliding seat, a material receiving clamp fixing seat and a material receiving clamp fixing plate, one of the output ends of the material receiving finger cylinder is provided with an upper material receiving clamp, one end of the upper material receiving clamp is provided with a material receiving clamp stopper, the other output end of the material receiving finger cylinder is provided with a lower material receiving clamp, two material receiving clamp positioning pins are provided on the lower material receiving clamp, and the two material receiving clamp positioning pins pass through one end of the upper material receiving clamp, a material receiving clamp micro optical fiber is provided below the lower material receiving clamp, and below the material receiving clamp fixing plate A photoelectric sensor for the receiving clamping jaw and a buffer spring for the receiving clamping jaw are provided, the receiving finger cylinder is fixedly connected to the receiving clamping jaw sliding seat and is located below the receiving clamping jaw sliding seat, the receiving clamping jaw sliding seat is slidably connected to the receiving clamping jaw fixed seat and is located below the receiving clamping jaw fixed seat, the receiving clamping jaw fixed seat is fixedly connected to the receiving clamping jaw fixed plate and is located below the receiving clamping jaw fixed plate, and the receiving clamping jaw buffer spring is connected to one side of the receiving clamping jaw sliding seat, and the receiving clamping jaw fixed plate is provided at one end of the receiving clamping jaw plate.

Images