Manufacturing method of waterproof capacitive sensor

Abstract

The invention relates to the technical field of capacitive sensors, in particular to a manufacturing method of a waterproof capacitive sensor, which comprises the following steps: S1, preparing materials; s2, soaking in an organic solution; s3, performing ultraviolet irradiation; and S4, cleaning. According to the manufacturing method of the waterproof capacitive sensor provided by the invention, the organic mixed solution of SBS and BP is attached to the surface of the capacitive sensor, and then in-situ free radical polymerization reaction is induced through ultraviolet irradiation, so that a compact flexible waterproof layer can be formed on the surface of the capacitive sensor; the waterproof effect of the capacitive sensor is greatly improved, and the soaking mechanism is specially arranged, so that when the capacitive sensor is soaked in an organic solution in the first forming die and the second forming die, the organic solution can be uniformly distributed, and a uniform and compact flexible waterproof layer is formed.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitive sensors, and specifically to a manufacturing method of a waterproof capacitive sensor. Background Art

[0002] Capacitive sensors made of ITO, nanosilver wires, copper metal grids, or even some hydrogels often require corresponding protective measures on their surfaces, such as applying glue or oxidizing with a protective potion to form a dense oxide layer, etc. However, they can only be used to block moisture in the air and may fail if directly immersed in water. For example, flexible transparent electrodes on some underwater exploration equipment, diving equipment, or mining equipment at the bottom of rivers or the sea are very likely to need to be exposed to water for operation. At this time, simple waterproof treatment can no longer adapt to long-term use, so it is necessary to improve this, and a better waterproof treatment method is required. Summary of the Invention

[0003] The purpose of the present invention is to provide a manufacturing method of a waterproof capacitive sensor to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solution: A manufacturing method of a waterproof capacitive sensor includes the following steps:

[0005] S1: Material preparation, obtaining conductive electrodes of ITO / nanosilver wires / copper metal grids using different processes;

[0006] S2: Immerse in an organic solution, immerse the conductive electrodes obtained in the previous step in an organic mixed solution of SBS and BP;

[0007] S3: Ultraviolet light irradiation, irradiate through ultraviolet light to induce the polymerization reaction of organic solution free radicals, and form a dense flexible waterproof layer on the surface of the capacitive sensor;

[0008] S4: Cleaning, directly rinse the surface of the electrode with water to remove the excess unreacted organic solution.

[0009] Preferably, the concentration range of BP as a photoinitiator is between 0.1% and 5%, specifically depending on the molecular weight of SBS and the required crosslinking density; for products with higher flexibility requirements, a lower initiator concentration may be required, such as 0.5% to 1%. If a higher crosslinking density is required, the initiator concentration can be appropriately increased, but attention should be paid not to be too high to avoid making the material too hard.

[0010] Preferably, the concentration of the SBS is 10% to 50%. The concentration is usually relatively high because it is the main material for forming the product. In a solution system, the concentration of the SBS can vary from 10% to 50%, depending specifically on the type of solvent and the required processing conditions.

[0011] Preferably, an immersion mechanism is required to immerse the organic solution in the S2. The immersion mechanism is used to place the capacitance sensor so that the organic solvent outside the capacitance sensor can be evenly distributed.

[0012] Preferably, the immersion mechanism includes a first forming die. The first forming die is fixedly connected to a fixed mounting block, and the fixed mounting block is fixedly mounted on a support column. A cross plate is provided on one side wall of the fixed mounting block. A telescopic rod is installed on the cross plate, and the end of the telescopic rod is connected to a bracket. A docking groove is provided on the first forming die, and the bracket is correspondingly embedded in the docking groove;

[0013] A sliding frame is provided on the fixed mounting block. A movable mounting block is slidably provided on the sliding frame. One side wall of the movable mounting block is connected to a second forming die. The second forming die corresponds to the first forming die. A threaded hole is opened in the movable mounting block. An adjustment motor is installed on the bottom surface of the fixed mounting block. The output end of the adjustment motor is connected to a lead screw. The lead screw passes through the fixed mounting block and is in threaded connection with the threaded hole in the movable mounting block. Controlling the start of the adjustment motor is used to adjust the distance between the movable mounting block and the fixed mounting block, thereby controlling the combination or separation of the first forming die and the second forming die.

[0014] Preferably, one end of the support column is connected to an adjustment device. The adjustment device is used to adjust the position of the support column and can also rotate the support column.

[0015] Preferably, the bracket is embedded in the docking groove to place the capacitance sensor. The capacitance sensor is separated from the inner wall of the first forming die by a certain distance, and the distance between each surface of the capacitance sensor and the inner wall of the first forming die is equal. The separated space is used to fill the organic solvent.

[0016] Preferably, a main material pipe is connected to each of the fixed mounting block and the movable mounting block. The main material pipe is used to transport the organic solution.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] A manufacturing method of a waterproof capacitive sensor proposed by the present invention. By attaching an organic mixed solution of SBS and BP to the surface of the capacitive sensor, and then inducing an in-situ free radical polymerization reaction through ultraviolet light irradiation, a dense flexible waterproof layer can be formed on the surface of the capacitive sensor, thereby greatly improving the waterproof effect of the capacitive sensor. And a soaking mechanism is specially provided. When the capacitive sensor soaks in the organic solution in the first forming die and the second forming die, the organic solution can be evenly distributed, so as to form a uniform and dense flexible waterproof layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the soaking mechanism of the present invention.

[0020] Figure 2 It is a schematic structural diagram of the bracket connection of the present invention.

[0021] In the figure: the first forming die 1, the fixed mounting block 2, the support column 3, the main material pipe 4, the cross plate 5, the telescopic rod 6, the bracket 7, the sliding frame 8, the movable mounting block 9, the adjusting motor 10, the lead screw 11, the second forming die 12. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0023] Please refer to Figures 1 to 2 , the present invention provides a technical solution: a manufacturing method of a waterproof capacitive sensor, including the following steps:

[0024] S1: Material preparation, obtaining a conductive electrode of ITO / nano silver wire / metal mesh copper using different processes;

[0025] S2: Soaking the organic solution, soaking the conductive electrode obtained in the previous step in an organic mixed solution of SBS and BP;

[0026] S3: Ultraviolet light irradiation, irradiating through ultraviolet light to induce the free radicals in the organic solution to undergo a polymerization reaction, forming a dense flexible waterproof layer on the surface of the capacitive sensor;

[0027] S4: Cleaning, directly rinsing the surface of the electrode with water to remove the excess unreacted organic solution.

[0028] The concentration range of BP as a photoinitiator is between 0.1% and 5%, depending on the molecular weight of SBS and the required crosslinking density; for products with higher flexibility requirements, a lower initiator concentration may be required, such as 0.5% to 1%. If a higher crosslinking density is needed, the initiator concentration can be appropriately increased, but care should be taken not to make it too high to avoid making the material too hard.

[0029] The concentration of SBS is 10% to 50%. The concentration is usually relatively high because it is the main material to form the product. In a solution system, the concentration of SBS can vary from 10% to 50%, depending on the type of solvent and the required processing conditions.

[0030] When soaking the organic solution in S2, a soaking mechanism is required. The soaking mechanism is used to place the capacitive sensor so that the organic solvent outside the capacitive sensor can be evenly distributed.

[0031] The soaking mechanism includes a first forming die 1. The material of the bracket 7 can be penetrated by ultraviolet rays. The first forming die 1 is fixedly connected to the fixed mounting block 2, and the fixed mounting block 2 is fixedly installed on the support column 3. A cross plate 5 is arranged on one side wall of the fixed mounting block 2. A telescopic rod 6 is installed on the cross plate 5, and the end of the telescopic rod 6 is connected to the bracket 7. A docking groove is arranged on the first forming die 1, and the bracket 7 is correspondingly embedded in the docking groove; a sliding frame 8 is arranged on the fixed mounting block 2, and a movable mounting block 9 is slidably arranged on the sliding frame 8. A second forming die 12 is connected to one side wall of the movable mounting block 9. The second forming die 12 corresponds to the first forming die 1. A threaded hole is opened in the movable mounting block 9, and an adjusting motor 10 is installed on the bottom surface of the fixed mounting block 2. The output end of the adjusting motor 10 is connected to a lead screw 11. The lead screw 11 passes through the fixed mounting block 2 and is in threaded connection with the threaded hole in the movable mounting block 9. Starting the adjusting motor 10 is used to adjust the distance between the movable mounting block 9 and the fixed mounting block 2, thereby controlling the combination or separation of the first forming die 1 and the second forming die 12.

[0032] One end of the support column 3 is connected to an adjusting device. The adjusting device is used to adjust the position of the support column 3 and can also rotate the support column 3. Under the existing technology, this function is relatively simple to achieve, so it is not elaborated here.

[0033] The bracket 7 is embedded in the docking groove to place the capacitive sensor. The capacitive sensor is separated from the inner wall of the first forming die 1 by a certain distance, and the distance between each surface of the capacitive sensor and the inner wall of the first forming die 1 is equal. The separated space is used to fill the organic solvent.

[0034] A main material pipe 4 is connected to each of the fixed mounting block 2 and the movable mounting block 9. The main material pipe 4 is used to transport the organic solution.

[0035] When soaking in an organic solvent, place the capacitance sensor on the bracket 7, then adjust the motor 10 to start and drive the screw rod 11 to rotate, so that the movable mounting block 9 drives the second forming die 12 to descend. The second forming die 12 and the first forming die 1 are combined together to enclose the capacitance sensor in a sealed cavity. Inject the organic solvent into the cavity through the main material pipe 4, and then use an ultraviolet lamp to irradiate it omnidirectionally. The ultraviolet light-induced in-situ free radical polymerization reaction can form a dense flexible waterproof layer on the surface of the capacitance sensor. Then adjust the device to drive the support column 3 to rotate so that the first forming die 1 and the second forming die 12 are turned over, and the cross plate 5 contracts to pull the bracket 7 upward. There will be a notch in the position of the original bracket 7 on the flexible waterproof layer. Then inject a certain amount of organic solution into the notch through the lower main material pipe 4 and irradiate this place with an ultraviolet lamp to repair the notch.

[0036] A manufacturing method of a waterproof capacitance sensor proposed by the present invention attaches an organic mixed solution of SBS and BP on the surface of the capacitance sensor, and then through the ultraviolet light-induced in-situ free radical polymerization reaction, a dense flexible waterproof layer can be formed on the surface of the capacitance sensor, thereby greatly improving the waterproof effect of the capacitance sensor. And a soaking mechanism is specifically provided. When the capacitance sensor soaks in the organic solution in the first forming die 1 and the second forming die 12, the organic solution can be evenly distributed, so as to form a uniform and dense flexible waterproof layer.

[0037] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for manufacturing a waterproof capacitive sensor, characterized in that: The following steps are included: S1: Material preparation, using different processes to obtain conductive electrodes; S2: soaking in an organic solution, soaking the conductive electrode obtained in the previous step in an organic mixed solution of SBS and BP; S3: UV light irradiation, inducing the polymerization reaction of free radicals in the organic solution by UV light irradiation, and forming a dense flexible waterproof layer on the surface of the capacitive sensor; S4: Cleaning: rinse the electrode surface directly with water to remove excess unreacted organic solution.

2. The method for manufacturing a waterproof capacitive sensor according to claim 1, characterized in that: The concentration of BP as a photoinitiator ranges from 0.1% to 5%.

3. The method for manufacturing a waterproof capacitive sensor according to claim 1, characterized in that: The concentration of the SBS is 10% to 50%.

4. The method for manufacturing a waterproof capacitive sensor according to claim 1, characterized in that: The immersion of the organic solution in S2 requires the use of an immersion mechanism, which is used to place the capacitive sensor so that the organic solvent outside the capacitive sensor can be evenly distributed.

5. The method for manufacturing a waterproof capacitive sensor according to claim 4, characterized in that: The soaking mechanism comprises a first forming mold (1), the first forming mold (1) is fixedly connected to a fixed mounting block (2), the fixed mounting block (2) is fixedly mounted on a supporting column (3), a transverse plate (5) is arranged on a side wall of the fixed mounting block (2), a telescopic rod (6) is mounted on the transverse plate (5), the end of the telescopic rod (6) is connected to a bracket (7), a docking groove is arranged on the first forming mold (1), and the bracket (7) is correspondingly embedded in the docking groove; The fixed mounting block (2) is provided with a sliding frame (8), a movable mounting block (9) is slidably provided on the sliding frame (8), a side wall of the movable mounting block (9) is connected with a second molding die (12), the second molding die (12) corresponds to the first molding die (1), a threaded hole is provided on the movable mounting block (9), an adjusting motor (10) is installed on the bottom surface of the fixed mounting block (2), an output end of the adjusting motor (10) is connected with a screw rod (11), the screw rod (11) passes through the fixed mounting block (2) and is matched and connected with the threaded hole in the movable mounting block (9), and the adjusting motor (10) is controlled to start to adjust the spacing between the movable mounting block (9) and the fixed mounting block (2), thereby controlling the first molding die (1) and the second molding die (12) to merge or separate.

6. The method for manufacturing a waterproof capacitive sensor according to claim 5, characterized in that: One end of the support column (3) is connected to an adjusting device, and the adjusting device is used to adjust the position of the support column (3) and can also rotate the support column (3).

7. The method for manufacturing a waterproof capacitive sensor according to claim 5, characterized in that: The bracket (7) is embedded in the docking groove to place the capacitive sensor, the capacitive sensor and the inner wall of the first molding die (1) are separated by a distance, and the distances between each surface of the capacitive sensor and the inner wall of the first molding die (1) are equal, and the separated space is used to fill the organic solvent.

8. The method for manufacturing a waterproof capacitive sensor according to claim 5, characterized in that: The fixed installation block (2) and the movable installation block (9) are each connected to a main material pipe (4), and the main material pipe (4) is used to transport the organic solution.

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