A substrate processing apparatus

Abstract

The application relates to the technical field of electronic manufacturing, and discloses a substrate processing device which comprises a copper deposition tank, a conduction device and a transmission device are connected through one side of the copper deposition tank, a water flow monitoring device is transmissionally connected to one side of the transmission device, an automatic nozzle device is transmissionally connected to one side of the transmission device, the water flow monitoring device comprises a flow speed fan, a fan blade transmission rod is movably arranged in the flow speed fan, an expansion groove is formed in the outer side of the fan blade transmission rod, and an expansion spring is fixedly connected to the expansion groove. The water flow monitoring device is arranged to monitor the solution flow speed in the copper deposition tank and feed back to the transmission device, and the automatic nozzle device is opened and closed one by one, so that the solution flow speed is controlled. The conduction device is arranged to suck the solution and impurities deposited at the bottom of the copper deposition tank into a filtering bin, which is beneficial to the uniform distribution of the copper layer. The automatic nozzle device is arranged to agitate the solution in the copper deposition tank, so that the solution flow speed is controlled.

Description

Technical Field

[0001] This invention relates to the field of electronic manufacturing technology, and more specifically to a substrate processing apparatus. Background Technology

[0002] A substrate processing apparatus is a specialized device whose main function is to perform physical or chemical treatments on circuit board substrates, such as cleaning, etching, and coating. Its main processing steps are: cleaning and pretreatment to remove contaminants from the substrate surface; surface treatment to improve the adhesion of the substrate surface and prepare for subsequent pattern transfer and thin film deposition; pattern transfer and photolithography to transfer the designed circuit or pattern to the substrate surface; etching to remove the substrate not protected by photoresist and form the circuit or structure; electroplating and metallization to thicken the circuit wires or realize interlayer connections; solder resist and character printing to protect non-soldering areas and prevent short circuits or oxidation.

[0003] Electroplating and metallization are divided into chemical copper plating, electroplating copper plating, and conductive adhesive copper plating. Chemical copper plating is the main copper plating method nowadays. Chemical copper plating mainly involves immersing the substrate in a copper plating bath after a series of steps, and carrying out a chemical reduction reaction in the bath to deposit a copper layer on the non-conductive areas of the substrate. In particular, chemical treatment is more suitable for large-area, non-conductive substrates and complex reaction scenarios, and is the mainstream technology for semiconductor cleaning and thin film deposition.

[0004] Existing chemical copper plating equipment uses stirring to enable the chemical solution to undergo an autocatalytic reduction reaction. However, due to the substrate and impurities generated during the reduction reaction, the copper layer attached to the substrate becomes uneven and the plating becomes rough, which reduces the conductivity of the substrate.

[0005] Among them, the stirring method often uses turbine stirring. This stirring method can effectively plate copper on large areas that need to be attached. However, due to the stirring direction, small holes in the substrate cannot be uniformly plated with copper, which affects the subsequent processes.

[0006] Secondly, the stirring rate in the copper plating tank can ensure uniform solution distribution and avoid uneven copper deposition caused by excessively high or low local concentrations. Too low a flow rate may cause solution stagnation and affect reaction efficiency. However, a higher flow rate is not necessarily better. An excessively high flow rate may lead to uneven copper deposition or even wash away the uncured copper layer. Therefore, the flow rate needs to be controlled.

[0007] In summary, there is an urgent need for a substrate processing apparatus with controllable flow rate and a filtration mechanism. Summary of the Invention

[0008] In order to overcome the above-mentioned defects of the prior art, the present invention provides a substrate processing apparatus to solve the problems existing in the background art.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a substrate processing apparatus, including a copper plating tank, wherein a conduction device and a transmission device are connected through one side of the copper plating tank, a water flow monitoring device is connected to one side of the transmission device, and an automatic nozzle device is connected to one side of the transmission device.

[0010] The water flow monitoring device includes a flow fan, with a one-way transmission buckle fixedly connected to the inner side of the flow fan. A fan blade transmission rod is movably installed inside the flow fan, and a telescopic groove is provided on the outer side of the fan blade transmission rod. A telescopic spring is fixedly connected inside the telescopic groove, and a telescopic buckle is movably connected to the top of the telescopic spring.

[0011] Furthermore, the copper plating tank includes a copper plating tank body, a nozzle transmission hole is provided on one side of the copper plating tank body, a sliding groove is provided on one side of the copper plating tank body, a fan blade transmission hole is provided on one side of the copper plating tank body, and a guide pipe groove is provided at the bottom of the copper plating tank body.

[0012] Furthermore, a guide pipe is fixedly installed inside the guide pipe groove, a pressure pump is fixedly connected to one end of the guide pipe, an output pipe is fixedly connected to the top of the pressure pump, output branch pipes are fixedly connected to both sides of the output pipe, a filter chamber is fixedly connected to the top of the output branch pipe, and a filter chamber output hole is opened on one side of the filter chamber.

[0013] Furthermore, the transmission device includes a threaded tube, a hollow telescopic rod is movably connected to the outside of the threaded tube, a hollow transmission gear is fixedly connected to one end of the hollow telescopic rod, a transmission rack is driven to the top of the hollow transmission gear, a limit plate is fixedly connected to the bottom of the transmission rack, a transmission gear is driven to the top of the transmission rack, and a fan blade transmission rod is fixedly connected to one side of the transmission gear.

[0014] Furthermore, a fixed outer shell is fixedly connected to the inner side of the copper plating tank, a fan blade fixing plate is fixedly connected to one side of the fixed outer shell, a transmission gear is fixedly connected to one side of the fan blade transmission rod, the fan blade fixing plate is movably connected to the other side of the fan blade transmission rod, and a flow fan is driven to the center of the fan blade transmission rod.

[0015] Furthermore, a transmission ring is fixedly connected to one end of the hollow telescopic rod, a clamping arm rod one is movably connected to one side of the transmission ring, a clamping arm rod two is movably connected to one end of the clamping arm rod one, a fixing rod is movably connected to the middle of the clamping arm rod two, a nozzle pipe is fixedly connected to the bottom of the fixing rod, and a nozzle is movably connected to one end of the clamping arm rod two.

[0016] Furthermore, when the nozzle is closed, the clamping arm rod one forms a 30° angle with the nozzle tube. At this time, the nozzle is tightly closed inside. When the transmission ring moves to the side where the hollow telescopic rod is located, the angle between the nozzle tube and the clamping arm rod one gradually decreases until the clamping arm rod one is parallel to the nozzle tube. At this time, the nozzle is at its maximum opening degree. One end of the clamping arm rod two is affected by the clamping arm rod one and moves up and down in the opposite direction with the fixed rod as the fulcrum. The nozzle moves synchronously with the other side of the clamping arm rod two.

[0017] Furthermore, two transmission devices are provided on the outer sidewall of the copper plating tank. A transmission rack is slidably connected to the outer wall of the copper plating tank. The transmission rack controls two automatic nozzle devices and a water flow monitoring device. When the transmission rack moves inward, it closes the automatic nozzle devices one by one from the outside to the inside. An outer limiting plate is fixedly connected to the bottom of the transmission rack. When the outer limiting plate contacts the outer hollow transmission gear, the inner bottom of the transmission rack drives the inner hollow transmission gear to move.

[0018] Furthermore, the water flow monitoring device is symmetrically installed on the inner wall of the copper plating tank, the fan blade drive rod is movably installed in the fan blade drive hole through the middle, the automatic nozzle device is provided in four places, symmetrically distributed inside the copper plating tank, and a hollow telescopic rod is movably installed inside the nozzle drive hole.

[0019] The technical effects and advantages of this invention are as follows:

[0020] 1. This invention incorporates a water flow monitoring device that uses a flow rate fan to monitor the flow rate of the solution inside the copper plating tank. When the solution flow rate is too fast, the fan speed increases, and vice versa. This feedback is then sent to the transmission device, which sequentially opens and closes the automatic nozzles, thereby controlling the solution flow rate. This helps reduce uneven copper layer deposition caused by excessively fast flow rates, as well as insufficient chemical reactions and solution stagnation caused by excessively slow flow rates. It ensures uniform solution distribution, avoids uneven copper deposition due to excessively high or low local concentrations, and enhances the uniformity of copper plating on the substrate.

[0021] 2. The present invention incorporates a conduction device, which uses a pressure pump to draw in the solution and impurities deposited at the bottom of the copper plating tank. The solution then passes through an output pipe and branch pipes into a filter chamber, where the impurities are filtered out. This reduces the proportion of impurities in the solution, which is beneficial for the uniform distribution of the copper layer and reduces mechanical maintenance costs and production efficiency caused by impurity blockage.

[0022] 3. This invention features an automatic nozzle device that sprays solution through the nozzles to agitate the solution in the copper plating tank. Furthermore, the arrangement and direction of the nozzles ensure better adhesion of the sprayed solution to the substrate. The water flow monitoring device sequentially closes the nozzles, controlling the solution flow rate. When the flow rate is below a threshold, the nozzles open sequentially due to water pressure, facilitating automatic control of the solution flow rate in the tank, reducing the impact of parameter adjustments, accelerating production efficiency, and improving the uniformity of copper layer adhesion. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0025] Figure 3 This is a schematic cross-sectional view of the copper plating tank of the present invention;

[0026] Figure 4 This is a schematic diagram of the conduction device of the present invention;

[0027] Figure 5 This is a schematic diagram of the transmission device of the present invention;

[0028] Figure 6 This is a schematic diagram of the water flow monitoring device of the present invention;

[0029] Figure 7 This is a schematic diagram of the fan blade transmission of the present invention;

[0030] Figure 8 For this Figure 7 Enlarged view of point A;

[0031] Figure 9 This is a schematic cross-sectional view of the fan blade drive rod of the present invention;

[0032] Figure 10 This is a schematic diagram of the automatic nozzle device of the present invention;

[0033] The attached figures are labeled as follows: 1. Copper plating tank; 101. Copper plating tank body; 102. Nozzle inlet drive hole; 103. Sliding groove; 104. Fan blade drive hole; 105. Guide pipe groove; 2. Transmission device; 201. Guide pipe; 202. Pressure pump; 203. Output pipe; 204. Output branch pipe; 205. Filter chamber; 206. Filter chamber output hole; 3. Transmission device; 301. Threaded pipe; 302. Hollow transmission gear; 303. Hollow telescopic rod; 304. Transmission... 305. Rack and pinion; 306. Limiting plate; 4. Transmission gear; 4. Water flow monitoring device; 401. Fixed housing; 402. Fan blade fixing plate; 403. Flow fan; 404. Fan blade transmission rod; 405. Telescopic buckle; 406. One-way transmission buckle; 407. Telescopic groove; 408. Telescopic spring; 5. Automatic nozzle device; 501. Transmission ring; 502. Nozzle pipe; 503. Clamping arm rod one; 504. Clamping arm rod two; 505. Fixing rod; 506. Nozzle. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. The substrate processing apparatus involved in the present invention is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Reference Figure 1 , 2 6-8, the present invention provides a substrate processing apparatus, including a copper plating tank 1, a conductive device 2 and a transmission device 3 are connected through one side of the copper plating tank 1, a water flow monitoring device 4 is connected to one side of the transmission device 3, and an automatic nozzle device 5 is connected to one side of the transmission device 3.

[0036] The solution in the copper plating tank 101 is drawn in by the conduction device 2 and diverted to the output branch pipe 204. After filtration, it enters the threaded pipe 301 and is transported to the nozzle pipe 502 by the threaded pipe 301. Then it is sprayed out from the nozzle 506. If the nozzle 506 is closed at this time, the water pressure squeezes the inner wall of the nozzle 506, forcing the nozzle 506 to be in a state about to open. However, it is restricted by the clamping arm rod 504 and remains closed. When the clamping arm rod 504 does not exert force on the nozzle 506, the nozzle 506 opens due to the water pressure, spraying the solution toward the substrate placed inside the copper plating tank 101 and agitating the solution inside the copper plating tank 101.

[0037] A one-way transmission buckle 406 is fixedly connected to the inner side of the flow fan 403. A fan blade transmission rod 404 is movably installed inside the flow fan 403. A telescopic groove 407 is opened on the outer side of the fan blade transmission rod 404. A telescopic spring 408 is fixedly connected inside the telescopic groove 407. A telescopic buckle 405 is movably connected to the top of the telescopic spring 408.

[0038] When the flow fan 403 is affected by the water flow and rotates the fan blades counterclockwise, the vertical surface of the telescopic buckle 405 abuts against the vertical surface of the one-way transmission buckle 406, causing the fan blade transmission rod 404 to rotate. When the fan blades rotate clockwise, the arc surface of the telescopic buckle 405 contacts the arc surface of the one-way transmission buckle 406, causing the telescopic buckle 405 to retract downward. When the contact ends, the telescopic buckle 405 is subjected to the tension of the telescopic spring 408 and returns to its original position.

[0039] Reference Figure 3 The copper plating tank 1 includes a copper plating tank body 101. A nozzle transmission hole 102 is provided on one side of the copper plating tank body 101, a sliding groove 103 is provided on one side of the copper plating tank body 101, a fan blade transmission hole 104 is provided on one side of the copper plating tank body 101, and a guide pipe groove 105 is provided at the bottom of the copper plating tank body 101. All holes on the side of the copper plating tank 1 are sealed. This sealing treatment is existing technology and is not shown in the figure. This sealing treatment prevents the leakage of chemical liquid in the copper plating tank 1. The bottom of the copper plating tank body 101 is set in a "V" shape, and the suction port of the guide pipe 201 is set at the lowest point of the "V" shaped bottom.

[0040] Reference Figure 4 This invention provides a substrate processing device. A guide pipe 201 is fixedly installed inside a guide pipe groove 105. A pressure pump 202 is fixedly connected to one end of the guide pipe 201. An output pipe 203 is fixedly connected to the top of the pressure pump 202. Output branch pipes 204 are fixedly connected to both sides of the output pipe 203. A filter chamber 205 is fixedly connected to the top of the output branch pipe 204. A filter chamber output hole 206 is opened on one side of the filter chamber 205. The liquid in the groove is subjected to the suction generated by the pressure pump 202, passes through the guide pipe 201 and the output pipe 203, enters the output branch pipe 204, and is filtered by the filter chamber 205. The filter chamber 205 is provided with a filter grid inside. The filtered liquid then flows out through the filter chamber output hole 206.

[0041] Reference Figure 5This invention provides a substrate processing apparatus. The transmission device 3 includes a threaded tube 301, a hollow telescopic rod 303 movably connected to the outer side of the threaded tube 301, a hollow transmission gear 302 fixedly connected to one end of the hollow telescopic rod 303, a transmission rack 304 drivingly connected to the top of the hollow transmission gear 302, a limit plate 305 fixedly connected to the bottom of the transmission rack 304, a transmission gear 306 drivingly connected to the top of the transmission rack 304, and a fan blade transmission rod 404 fixedly connected to one side of the transmission gear 306. The hollow transmission gear 302 drives the threaded tube 301... When the fan blade drive rod 404 drives the drive gear 306 to rotate, the drive gear 306 drives the drive rack 304, causing the drive rack 304 to slide along the sliding groove 103 with the two ends of the sliding groove 103 as the limit endpoints. The bottom of the drive rack 304 drives the hollow drive gear 302 and the hollow telescopic rod 303 to rotate. The hollow telescopic rod 303 has a threaded groove on its inner side, so that the hollow telescopic rod 303 moves along the thread on the surface of the threaded tube 301. The length of the sliding groove 103 does not exceed half the width of the side of the copper plating tank 101, and the two sliding grooves 103 are not connected.

[0042] Reference Figure 6-9 The present invention provides a substrate processing apparatus, wherein a fixed housing 401 is fixedly connected to the inner side of a copper plating tank 101, a fan blade fixing plate 402 is fixedly connected to one side of the fixed housing 401, a transmission gear 306 is fixedly connected to one side of a fan blade transmission rod 404, the fan blade fixing plate 402 is movably connected to the other side of the fan blade transmission rod 404, and a flow fan 403 is drivenly connected to the center of the fan blade transmission rod 404.

[0043] Reference Figure 10 This invention provides a substrate processing apparatus. One end of a hollow telescopic rod 303 is fixedly connected to a transmission ring 501. One side of the transmission ring 501 is movably connected to a clamping arm 503. One end of the clamping arm 503 is movably connected to a clamping arm 504. A fixing rod 505 is movably connected to the middle of the clamping arm 504. A nozzle pipe 502 is fixedly connected to the bottom of the fixing rod 505. One end of the clamping arm 504 is movably connected to a nozzle 506. The hollow telescopic rod 303 pushes the transmission ring 501 to move towards the nozzle, squeezing the clamping arm 503. The connection between the clamping arm 503 and the clamping arm 504 moves outward. Due to the fixing rod 505, the other end of the clamping arm 504 moves downward, causing the nozzle 506 to close. When the hollow telescopic rod 303 moves to the other end, the nozzle 506 opens.

[0044] Reference Figure 10When the nozzle 506 is closed, the clamping arm 503 forms a 30° angle with the nozzle pipe 502. At this time, the inner side of the nozzle 506 is tightly pressed and closed. When the transmission ring 501 moves to the side where the hollow telescopic rod 303 is located, the angle between the nozzle pipe 502 and the clamping arm 503 gradually decreases until the clamping arm 503 is parallel to the nozzle pipe 502. At this time, the nozzle 506 is at its maximum opening. One end of the clamping arm 504 is affected by the clamping arm 503 and moves up and down in the opposite direction with the fixed rod 505 as the fulcrum. The nozzle 506 moves synchronously with the other side of the clamping arm 504. The degree of opening of 506 is proportional to the flow velocity of the solution in 101. When all four 506s are closed, the solution tends to be static.

[0045] Reference Figure 2 , 3 5. Two transmission devices 3 are provided on the outer side wall of the copper plating tank 101. A transmission rack 304 is slidably connected to the outer wall of the copper plating tank 101. The transmission rack 304 controls two automatic nozzle devices 5 and a water flow monitoring device 4. The transmission rack 304 moves inward and closes the automatic nozzle devices 5 one by one from the outside to the inside. An outer limiting plate 305 is fixedly connected to the bottom of the transmission rack 304. When the outer limiting plate 305 contacts the outer hollow transmission gear 302, the inner bottom of the transmission rack 304 drives the inner hollow transmission gear 302 to move. The outer nozzle 506 is closed first. The inner nozzle 506 is closer to the substrate placed in the copper plating tank 101. When the solution flow rate is too high, the outer nozzle 506 is closed, reducing the solution flow rate in the copper plating tank 101.

[0046] Reference Figure 1 , 3 The water flow monitoring device 4 is symmetrically installed on the inner wall of the copper plating tank 101. The fan blade drive rod 404 is movably installed in the fan blade drive hole 104 through the middle. The automatic nozzle device 5 is provided in four places, symmetrically distributed inside the copper plating tank 101. The hollow telescopic rod 303 is movably installed inside the nozzle drive hole 102. The two ends of the nozzle drive hole 102 are not the same size. The inner size is the same as the diameter of the hollow telescopic rod 303. The outer size is the same as the maximum diameter of the hollow drive gear 302 in order to accommodate the extension and retraction of the hollow drive gear 302. Its depth is the same as the length of the hollow drive gear 302. The fan blade drive hole 104 is the same as the diameter of the fan blade drive rod 404. Both the inner walls of the fan blade drive hole 104 and the nozzle drive hole 102 have anti-leakage measures.

[0047] The working principle of this invention is as follows: After the pressure pump 202 starts to operate, the chemical liquid in the copper plating tank 101 is drawn into the output pipe 203 through the guide pipe 201, and then distributed to the four branch pipes of the output branch pipe 204 through the top of the output pipe 203, and enters the filter chamber 205. The impurities brought by the substrate are filtered through the output hole 206 of the filter chamber. When the "V" shaped groove of the copper plating tank 101 is stationary, the impurities will settle. When the pressure pump 202 is running, the impurities will be drawn into the filter. The filter chamber 205 is equipped with a replaceable filter grid.

[0048] The filtered chemical liquid enters the threaded pipe 301 and the nozzle pipe 502. Under the pressure applied by the pressure pump 202, the nozzle 506 opens, spraying the filtered liquid into the copper sink 101. When the nozzle 506 opens, the transmission clamping arm rod 2 504 and the clamping arm rod 1 503 push the transmission ring 501 and the hollow telescopic rod 303 to move backward. The hollow telescopic rod 303 rotates along the thread on the threaded pipe 301, driving the hollow transmission gear 302 to rotate, driving the transmission rack 304 to move to one side and causing the transmission gear 306 and the fan blade transmission rod 404 to move, so that the arc surface of the telescopic buckle 405 and the one-way transmission buckle 406 contacts. The telescopic buckle 405 retracts into the fan blade transmission rod 404 and does not drive the flow fan 403 to rotate.

[0049] After the chemical liquid is sprayed out of the nozzle 506, the liquid flow rate inside the copper plating tank 101 increases, which affects the rotation of the flow fan 403, causing the flow fan 403 to rotate faster. When the liquid flow rate exceeds the required liquid flow rate for the copper plating step, that is, when the flow fan 403 is rotated by the water flow, the vertical surface of the one-way transmission buckle 406 contacts the vertical surface of the telescopic buckle 405, driving the fan blade transmission rod 404 and the transmission gear 306 to rotate. Under the rotation of the transmission gear 306, the transmission rack 304 moves. The movement of the transmission rack 304 first affects the outer nozzle 506. The bottom teeth of the transmission rack 304 push the hollow transmission gear 302 toward the nozzle 506. After the hollow transmission gear 302 moves to a certain position, it can no longer move forward. At this time, the limiting plate 305 also reaches the tail end of the hollow transmission gear 302 and limits it.

[0050] The hollow transmission gear 302 drives the hollow telescopic rod 303 and pushes the transmission ring 501 to move towards the nozzle, squeezing the clamping arm rod 503. The connection between the clamping arm rod 503 and the clamping arm rod 504 moves outward. Due to the fixed rod 505, the other end of the clamping arm rod 504 moves downward, causing the nozzle 506 to close. After the nozzle 506 closes, another tooth at the bottom of the transmission rack 304 will act on another hollow transmission gear 302.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A substrate processing apparatus, comprising a copper plating tank (1), characterized in that: A conductive device (2) and a transmission device (3) are connected through one side of the copper sink (1). A water flow monitoring device (4) is connected to one side of the transmission device (3). An automatic nozzle device (5) is connected to one side of the transmission device (3). The water flow monitoring device (4) includes a flow fan (403), a one-way transmission buckle (406) is fixedly connected to the inner side of the flow fan (403), a fan blade transmission rod (404) is movably installed inside the flow fan (403), a telescopic groove (407) is provided on the outer side of the fan blade transmission rod (404), a telescopic spring (408) is fixedly connected inside the telescopic groove (407), and a telescopic buckle (405) is movably connected to the top of the telescopic spring (408). The copper plating tank (1) includes a copper plating tank body (101), a nozzle transmission hole (102) is provided on one side of the copper plating tank body (101), a sliding groove (103) is provided on one side of the copper plating tank body (101), a fan blade transmission hole (104) is provided on one side of the copper plating tank body (101), and a guide pipe groove (105) is provided at the bottom of the copper plating tank body (101). A guide pipe (201) is fixedly installed inside the guide pipe groove (105). A pressure pump (202) is fixedly connected to one end of the guide pipe (201). An output pipe (203) is fixedly connected to the top of the pressure pump (202). Output branch pipes (204) are fixedly connected to both sides of the output pipe (203). A filter chamber (205) is fixedly connected to the top of the output branch pipe (204). A filter chamber output hole (206) is opened on one side of the filter chamber (205). The transmission device (3) includes a threaded tube (301), a hollow telescopic rod (303) is movably connected to the outside of the threaded tube (301), a hollow transmission gear (302) is fixedly connected to one end of the hollow telescopic rod (303), a transmission rack (304) is connected to the top of the hollow transmission gear (302), a limit plate (305) is fixedly connected to the bottom of the transmission rack (304), a transmission gear (306) is connected to the top of the transmission rack (304), and a fan blade transmission rod (404) is fixedly connected to one side of the transmission gear (306).

2. The substrate processing apparatus according to claim 1, characterized in that: The inner side of the copper plating tank (101) is fixedly connected to a fixed housing (401), and a fan blade fixing plate (402) is fixedly connected to one side of the fixed housing (401). A transmission gear (306) is fixedly connected to one side of the fan blade transmission rod (404), and the fan blade fixing plate (402) is movably connected to the other side of the fan blade transmission rod (404). The center of the fan blade transmission rod (404) is connected to a flow fan (403).

3. The substrate processing apparatus according to claim 1, characterized in that: One end of the hollow telescopic rod (303) is fixedly connected to a transmission ring (501), one side of the transmission ring (501) is movably connected to a clamping arm rod one (503), one end of the clamping arm rod one (503) is movably connected to a clamping arm rod two (504), the middle of the clamping arm rod two (504) is movably connected to a fixing rod (505), the bottom of the fixing rod (505) is fixedly connected to a nozzle pipe (502), and one end of the clamping arm rod two (504) is movably connected to a nozzle (506).

4. The substrate processing apparatus according to claim 3, characterized in that: When the nozzle (506) is closed, the clamping arm rod one (503) forms a 30° angle with the nozzle tube (502). At this time, the nozzle (506) is tightly closed on the inside. When the transmission ring (501) moves to the side where the hollow telescopic rod (303) is located, the angle formed by the nozzle tube (502) and the clamping arm rod one (503) gradually decreases until the clamping arm rod one (503) is parallel to the nozzle tube (502). At this time, the nozzle (506) is at its maximum opening degree. One end of the clamping arm rod two (504) is affected by the clamping arm rod one (503). With the fixed rod (505) as the fulcrum, the other side moves up and down in the opposite direction. The nozzle (506) and the other side of the clamping arm rod two (504) move synchronously.

5. The substrate processing apparatus according to claim 1, characterized in that: Two transmission devices (3) are provided on the outer sidewall of the copper plating tank (101). A transmission rack (304) is slidably connected to the outer wall of the copper plating tank (101). The transmission rack (304) controls two automatic nozzle devices (5) and a water flow monitoring device (4). The transmission rack (304) moves inward and closes the automatic nozzle devices (5) one by one from the outside to the inside. An outer limiting plate is fixedly connected to the bottom of the transmission rack (304). When the outer limiting plate contacts the outer hollow transmission gear, the inner bottom of the transmission rack (304) drives the inner hollow transmission gear to move.

6. The substrate processing apparatus according to claim 2, characterized in that: The water flow monitoring device (4) is symmetrically installed on the inner wall of the copper plating tank (101). The fan blade transmission rod (404) is movably installed in the fan blade transmission hole (104) through the middle. The automatic nozzle device (5) is provided in four places, symmetrically distributed inside the copper plating tank (101). The nozzle transmission hole (102) is movably installed with a hollow telescopic rod through the inside.

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