Wafer drying device and wafer drying method

Abstract

The invention discloses a wafer drying device and a wafer drying method, and particularly relates to the technical field of wafer drying, the wafer drying device comprises a main body and a spin-drying rack, a driving part comprises an overturning frame matched with the spin-drying rack, a clamping part comprises a plurality of placing grooves formed in the spin-drying rack, each placing groove is internally provided with a plurality of pressed opening and closing pieces, and the pressing opening and closing pieces are arranged on the main body. The pressed opening and closing parts clamp and fix the wafer in the placing groove, the adjusting part comprises adjusting rods corresponding to the pressed opening and closing parts, the adjusting rods extrude the pressed opening and closing parts in a reciprocating mode when moving intermittently, so that the pressed opening and closing parts distributed on the peripheral side of the wafer are opened intermittently, and the flow guide part comprises flow guide plates symmetrically arranged on the outer sides of the pressed opening and closing parts. When the pressed opening and closing piece is opened, the two flow guide plates abut against each other, the included angle between the two flow guide plates is increased, and a formed guide channel is expanded; according to the wafer drying device, the wafer can be fixed, meanwhile, it is avoided that drying is hindered by the fixing position, and the drying efficiency and quality of the wafer are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer drying, and more specifically, to a wafer drying device and a wafer drying method. Background Art

[0002] In the manufacturing process of semiconductor integrated circuit chips, chemical mechanical planarization is the core technology for global planarization of the wafer surface. This process combines the chemical corrosion effect in the polishing slurry with the synergistic effect of mechanical polishing, and combines the physical friction of the polyurethane polishing pad to achieve nanoscale surface topography control. Since CMP belongs to a wet processing technology, a large amount of polishing slurry containing abrasive particles, polishing debris, and metal ion pollutants will be introduced during the processing, resulting in the formation of a complex heterogeneous attachment layer on the wafer surface. At the end of the CMP process, the cleaning and drying processes have a decisive impact on the device performance. If the residual pollutants are not completely removed, fatal defects such as gate oxide layer breakdown and metal interconnection short circuit will be caused.

[0003] In the prior art, for the drying treatment of the wafer surface, the method of rotary spin-drying is generally adopted. The specific operation is to place the wafer in a spin-drying rack, and by means of the centrifugal force generated by the high-speed rotation of the wafer, the cleaning liquid on its surface is removed. However, in the actual drying process, usually multiple wafers are processed simultaneously. When these wafers rotate in the spin-drying rack, on the one hand, the wafers will collide and rub against the inner groove of the spin-drying rack, and on the other hand, there is also a risk of mutual collision between multiple wafers. To solve this problem, it is necessary to fix the wafers in the spin-drying rack. However, this fixing method also brings new problems. At the position where the wafers are fixed, the cleaning liquid is likely to remain on the wafer surface. Whether it is spin-dried by centrifugal force or dried by blowing hot nitrogen, the fixing device will hinder the drying effect of the wafer, affecting the drying efficiency and quality. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer drying device and a wafer drying method to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A wafer drying device, including a main body and a spin-drying rack, further comprising: A driving part, which includes a flipping frame cooperating with the spin-drying rack; A clamping part, which includes a plurality of placement grooves opened on the spin-drying rack, and each placement groove is provided with a plurality of pressure-operated expansion and contraction members, and the pressure-operated expansion and contraction members clamp and fix the wafers in the placement groove; An adjusting part, which includes adjusting rods corresponding to the pressure-operated expansion and contraction members. When the adjusting rods move intermittently, they reciprocally extrude the pressure-operated expansion and contraction members, causing the pressure-operated expansion and contraction members distributed on the circumferential side of the wafer to intermittently open; The diversion part includes diversion plates symmetrically arranged outside the compression-expansion member. When the compression-expansion member expands, the two diversion plates push against each other, and the included angle between them increases, expanding the formed guiding channel.

[0006] Preferably, a turntable is provided inside the main body. A plurality of support blocks are fixedly connected to the top of the turntable. Each support block is rotatably connected to a corresponding flipping frame. A motor is fixedly connected to the bottom of the main body. The output end of the motor is coaxially fixedly connected to the turntable. The flipping frame is rotatably connected to the support block through a rotating shaft. A plurality of air holes are formed in the turntable, and a handle is provided on the side wall of the flipping frame.

[0007] Preferably, a plurality of sliding grooves corresponding to the compression-expansion members and communicating with the placement grooves are formed in the drying rack. A pushing plate is slidably connected in each sliding groove. The pushing plate corresponds to the adjusting rod. Each compression-expansion member includes two moving plates, and the pushing plate can drive the corresponding two moving plates to move relatively or away from each other.

[0008] Preferably, an extrusion block is fixedly connected to the bottom of the pushing plate. A baffle is provided at one end of the sliding groove facing the center of the drying rack. The baffle is connected to the side wall of the extrusion block through a first spring. The opposite ends of each group of the two moving plates are respectively connected to the side wall of the placement groove through a second spring.

[0009] Preferably, a guiding frame is fixedly connected to each end of the adjusting rod. Two swing rods are respectively rotatably connected to two side walls of the flipping frame. The two swing rods on the same side are connected through a third spring. An insertion post inserted into the corresponding guiding frame is provided at the free end of each swing rod.

[0010] Preferably, a plurality of connecting rods corresponding to the flipping frame are slidably connected to the turntable. The number of each group of connecting rods is two. Connecting frames are respectively fixedly connected to two adjusting rods on the side close to the center of the turntable. When the flipping frame flips to the inside of the main body, the connecting rods can be matched with the corresponding connecting frames.

[0011] Preferably, a fixed ring is provided inside the main body below the turntable. Two guiding grooves are formed in the side wall of the fixed ring. The lower end of the connecting rod penetrates the turntable and is provided with a guiding post inserted into the corresponding guiding groove.

[0012] Preferably, the guiding grooves undulate up and down in the horizontal direction, and the two guiding grooves are arranged in a staggered manner.

[0013] Preferably, a circular groove is formed in the moving plate. A rotating shaft is rotatably connected in the circular groove. The rotating shaft is connected to the side wall of the circular groove through a torsion spring. A diversion plate is fixedly connected to the rotating shaft.

[0014] A wafer drying method includes the following steps: S1. Place multiple wafers into the placement slots in the spin-drying rack respectively. The wafers are located between the pressure-applied expanding and contracting members. S2. Rotate the handle to make the opening of the flipping frame face upward. Place the spin-drying rack with the wafers into the flipping frame. During the placement process, the multiple pressure-applied expanding and contracting members clamp the corresponding wafers respectively. S3. Rotate the handle to complete the cooperation between the flipping frame and the connecting rod. Turn on the motor and the air supply device. The turntable drives the multiple flipping frames to rotate synchronously. At the same time, the air supply device continuously introduces hot nitrogen gas to dry the multiple wafers simultaneously. S4. While the flipping frame drives the wafers to rotate centrifugally, the pressure-applied expanding and contracting members in the same placement slot can intermittently open and close, so that the wafers are always clamped and fixed during the rotation process, and at the same time, the clamping position can be switched to avoid liquid residue at the contact between the pressure-applied expanding and contracting members and the wafers. S5. While the clamping device is opening, the two corresponding flow guiding plates in each group can change the inclination angle to form a flow guiding channel, so that the hot nitrogen gas in the main body is guided to the surface of the wafer corresponding to the pressure-applied expanding and contracting member.

[0015] Technical effects and advantages of the present invention: 1. Through the cooperative setting of the flipping frame, spin-drying rack, placement slot, pushing plate, moving plate, extrusion block, first spring and second spring, when the spin-drying rack is placed into the flipping frame, four groups of pressure-applied expanding and contracting members are provided in the same placement slot. These four groups of pressure-applied expanding and contracting members will respectively perform clamping and fixing operations on the four corners of the wafer, so as to achieve stable fixation of each wafer. In this way, it can effectively avoid the collision between wafers and prevent the friction between the wafers and the side wall of the spin-drying rack.

[0016] 2. Through the cooperative setting of the adjusting rod, swing rod, wire frame, connecting frame, connecting rod, guiding groove and guiding column, four pressure-applied expanding and contracting members are provided in the same placement slot. Two pressure-applied expanding and contracting members on the same diagonal are in a group and are alternately switched in pairs. While ensuring good fixing effect of the wafer, it can also flexibly switch the clamping position of the wafer. In this way, it can effectively avoid the problem of cleaning liquid retention caused by the fixed clamping position, reduce the obstruction of the pressure-applied expanding and contracting members to the centrifugal drying process, and ensure that the wafer is always in a stable fixed state.

[0017] 3. Through the cooperative setting of the moving plate, circular groove, torsion spring, rotating shaft and guide plate in the present invention, when the compression-expansion component expands, the two moving plates move in opposite directions. At the same time, under the action of the torsion spring, the two guide plates gradually tilt, presenting a shape with a smaller distance at one end close to the wafer and a larger distance at the end far from the wafer, thereby forming a diversion channel. At this time, the hot nitrogen gas inside the main body converges towards the position corresponding to the compression-expansion component and the wafer under the guiding action of this diversion channel. In this way, the drying effect at this position can be enhanced, and the problem of cleaning liquid residue can be effectively avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the structure of the flipping frame and the spin-drying rack of the present invention.

[0020] Figure 3 It is a schematic diagram of the structure of the compression-expansion component and the diversion part of the present invention.

[0021] Figure 4 It is a schematic diagram of the structure inside the placement groove of the present invention.

[0022] Figure 5 For the present invention Figure 4 An enlarged view of A.

[0023] Figure 6 It is an exploded view of the diversion part of the present invention.

[0024] Figure 7 It is a schematic diagram of the structure of the connection frame and the connecting rod of the present invention.

[0025] Figure 8 It is a full-sectional front view inside the main body of the present invention.

[0026] Figure 9 It is a part drawing of the fixing ring and the guide groove of the present invention.

[0027] The reference numerals are: 1, main body; 2, drying rack; 3, driving part; 301, supporting block; 302, flipping frame; 303, motor; 304, rotating shaft; 305, handle; 306, turntable; 307, air hole; 4, clamping part; 401, pressure-receiving and expanding member; 4011, pushing plate; 4012, moving plate; 4013, extrusion block; 402, placing groove; 403, baffle; 404, first spring; 405, second spring; 5, adjusting part; 501, adjusting rod; 502, guiding frame; 503, swing rod; 504, third spring; 505, inserting post; 506, connecting rod; 507, connecting frame; 508, fixing ring; 509, guiding groove; 510, guiding post; 6, guiding part; 601, guiding plate; 602, circular groove; 603, rotating shaft; 604, torsion spring. Detailed implementation manners

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] Embodiment 1 When performing rotary drying treatment on the surface of a wafer, it is necessary to place the wafer in the drying rack 2, and by means of the centrifugal force generated by the high-speed rotation of the wafer, the cleaning liquid on its surface is removed. However, during the high-speed rotary drying process, usually multiple wafers are processed simultaneously. When these wafers rotate in the drying rack 2, on the one hand, the wafers will collide and rub against the inner groove of the drying rack 2, and on the other hand, there is also a risk of mutual collision between multiple wafers, which is very likely to cause breakage and chipping of the wafers.

[0030] To solve the above technical problems, please refer to Figures 1 to 5 As shown, the first embodiment of the present invention provides a wafer drying device, which includes a main body 1 and a drying rack 2, and also includes a driving part 3 and a clamping part 4. The driving part 3 includes a flipping frame 302 that cooperates with the drying rack 2. The clamping part 4 includes a plurality of placing grooves 402 opened on the drying rack 2, and each placing groove 402 is provided with a plurality of pressure-receiving and expanding members 401, and the pressure-receiving and expanding members 401 clamp and fix the wafers in the placing grooves 402.

[0031] Inside the main body 1, there is a turntable 306. At the top of the turntable 306, a plurality of support blocks 301 are fixedly connected. Each support block 301 is rotatably connected to a corresponding flipping frame 302. At the bottom of the main body 1, a motor 303 is fixedly connected. The output end of the motor 303 is coaxially and fixedly connected to the turntable 306. The flipping frame 302 is rotatably connected to the support block 301 through a rotating shaft 304. A plurality of air holes 307 are provided on the turntable 306. A handle 305 is provided on the side wall of the flipping frame 302. The air holes 307 are used for introducing hot nitrogen. The nitrogen heating and feeding method is the prior art and will not be elaborated here.

[0032] A plurality of chutes corresponding to the pressure - receiving and expanding members 401 and communicating with the placement grooves 402 are provided on the drying rack 2. A push plate 4011 is slidably connected in each chute. The push plate 4011 corresponds to the adjusting rod 501. Each pressure - receiving and expanding member 401 includes two moving plates 4012. The middle part of the push plate 4011 is a hollow triangle. When the push plate 4011 moves, the inclined surface in the middle of the push plate 4011 can push the two moving plates 4012 to move relatively. The relative movement of the two moving plates 4012 can clamp and fix the corresponding wafer. The moving plates 4012 are made of rubber material and have a certain deformation buffering ability.

[0033] A pressing block 4013 is fixedly connected to the bottom of the push plate 4011. At one end of the chute facing the center of the drying rack 2, a baffle 403 is provided. The baffle 403 is connected to the side wall of the pressing block 4013 through a first spring 404. The opposite ends of each group of two moving plates 4012 are respectively connected to the side wall of the placement groove 402 through a second spring 405. The pressing block 4013 is triangularly arranged, and the outer end surface of the pressing block 4013 is inclined. During the process of placing the flipping frame 302 on the drying rack 2, the side wall of the flipping frame 302 can push the inclined surface of the pressing block 4013 to make the pressing block 4013 move.

[0034] In actual use, the wafer is placed into the placement groove 402 of the drying rack 2, and the handle 305 is rotated. The handle 305 drives the flipping frame 302 to rotate around the rotating shaft 304, making the opening of the flipping frame 302 face upward. Then the drying rack 2 is placed into the flipping frame 302. During the process of placing the drying rack 2 into the flipping frame 302, the side wall of the flipping frame 302 presses against the inclined surface of the extrusion block 4013, causing the extrusion block 4013 to move towards the center of the drying rack 2 and compress the first spring 404. The extrusion block 4013 drives the push plate 4011 to move towards the center of the drying rack 2. The inclined surface in the middle of the push plate 4011 pushes the two moving plates 4012 to move relatively and stretches the second spring 405. The two moving plates 4012 move relatively and gradually clamp and fix the corresponding wafers. When the drying rack 2 is completely placed into the flipping frame 302, the outer side of the push plate 4011 contacts the adjusting rod 501. Multiple wafers are respectively clamped and fixed into the corresponding placement grooves 402. In the same placement groove 402, there are four groups of pressure-receiving and expanding components 401, and the four groups of pressure-receiving and expanding components 401 respectively clamp and fix the four corners of the wafer, which can achieve the fixation of each wafer, avoid the mutual collision between wafers, and also avoid the friction between the wafer and the side wall of the drying rack 2.

[0035] Embodiment Two Based on the above embodiment, it is necessary to fix the wafers in the drying rack 2. However, although the above clamping and fixing method can avoid the collision and damage of the wafers, at the clamping and fixing positions of the wafers, the cleaning liquid is likely to stay on the wafer surface due to the obstruction of the pressure-receiving and expanding components 401. Whether it is dried by centrifugal force or by blowing with hot nitrogen, the clamping and fixing positions of the pressure-receiving and expanding components 401 on the wafers will hinder the drying effect of the wafers, affecting the drying efficiency and quality.

[0036] Please refer to Figures 1 to 9 As shown, the adjusting part 5 includes the corresponding adjusting rod 501. When the adjusting rod 501 moves intermittently, it reciprocally presses the pressure-receiving and expanding components 401, causing the pressure-receiving and expanding components 401 distributed on the circumferential side of the wafer to intermittently open.

[0037] Two guide frames 502 are respectively fixedly connected to both ends of each adjusting rod 501. Two swing rods 503 are respectively rotatably connected to two side walls of the flipping frame 302. The two swing rods 503 are distributed in an X shape. The two swing rods 503 on the same side are connected by a third spring 504. An insertion post 505 inserted into the corresponding guide frame 502 is respectively provided at the free end of each swing rod 503.

[0038] A plurality of connecting rods 506 corresponding to the flipping frame 302 are slidably connected to the turntable 306. The number of each group of connecting rods 506 is two. Connecting frames 507 are fixedly connected to the two adjusting rods 501 on the side closer to the center of the turntable 306. When the flipping frame 302 flips into the main body 1, the connecting rods 506 can cooperate with the corresponding connecting frames 507.

[0039] A fixed ring 508 is provided in the main body 1 below the turntable 306. Two guiding grooves 509 are formed on the side wall of the fixed ring 508. The lower ends of the connecting rods 506 penetrate through the turntable 306 and are provided with guiding columns 510 inserted into the corresponding guiding grooves 509. The guiding column 510 on the side away from the center of the turntable 306 is inserted into the upper guiding groove 509, and the guiding column 510 on the side closer to the center of the turntable 306 is inserted into the lower guiding groove 509.

[0040] As Figure 9 shown, the guiding grooves 509 undulate up and down in the horizontal direction. The two guiding grooves 509 are arranged in a staggered manner. The guiding grooves 509 are annular grooves.

[0041] For the convenience of description, the center of the turntable 306 is used as a reference point. The side closer to the center of the turntable 306 is the inner side, and the side away from the center of the turntable 306 is the outer side. In its initial state, the connecting rods 506 move upward to the limit position. After the drying rack 2 and the flipping frame 302 are assembled, the handle 305 is rotated. The handle 305 drives the flipping frame 302 to rotate around the rotating shaft 304, so that the flipping frame 302 rotates into the main body 1. At the same time, the flipping frame 302 drives the two connecting frames 507 to rotate to directly below, so that the connecting rods 506 are inserted into the corresponding connecting frames 507, and the connecting rods 506 cooperate with the connecting frames 507. At the same time, the position of the flipping frame 302 is limited. By repeating the above operations, multiple drying racks 2 are loaded into the flipping frame 302. The motor 303 is started, and hot nitrogen is introduced into the ventilation holes 307. The motor 303 drives the turntable 306 to rotate. The turntable 306 drives a plurality of flipping frames 302 and drying racks 2 to rotate through the support plate. The drying racks 2 drive a plurality of wafers to rotate in the main body 1. The moisture on the wafer surface is thrown out by the action of centrifugal force. At the same time, the introduced hot nitrogen further enhances the drying effect of the wafer.

[0042] Meanwhile, due to the rotation of the turntable 306, the turntable 306 drives a plurality of connecting rods 506 to rotate, causing the connecting rods 506 to drive the guide posts 510 to move within the guide grooves 509 in the fixed ring 508. Since the guide grooves 509 undulate up and down in the horizontal direction and the guide grooves 509 are annular grooves, the connecting rods 506 can reciprocate in the vertical direction while moving in a circular motion along with the turntable 306. When the outer connecting rod 506 moves downward driven by the guide post 510, the outer connecting rod 506 drives the adjusting rod 501 to move downward through the connecting frame 507. The outer adjusting rod 501 drives the outer guide frame 502 to move downward. The outer guide frame 502 drives the swing rod 503 to rotate and compress the third spring 504 through the insertion post 505. The insertion post 505 on the upper side of the swing rod 503 drives the inner adjusting rod 501 at the upper end to move upward. The two adjusting rods 501 arranged diagonally move away from each other, so that the adjusting rod 501 no longer blocks the corresponding push plate 4011. The push plate 4011 moves in a direction away from the center of the drying rack 2 under the reset action of the first spring 404. The inclined surface in the middle of the push plate 4011 moves in a direction away from the center of the drying rack 2. Its corresponding two moving plates 4012 move away from each other under the reset action of the second spring 405. The opposite ends of the two moving plates 4012 contact the inclined surface in the middle of the push plate 4011 under the action of the second spring 405, so that the moving plates 4012 no longer clamp the wafer. In the same placement groove 402, the two pressure-receiving and expanding members 401 arranged diagonally open. Since the guide post 510 inside does not undergo a vertical displacement at this time and its corresponding adjusting rod 501 does not undergo a displacement, there are still two pressure-receiving and expanding members 401 arranged diagonally closed in the same placement groove 402, still fixing the wafer. As the turntable 306 rotates, when the outer guide post 510 moves upward to the initial position, the inner guide post 510 moves upward. As described above, when the inner guide post 510 moves upward, the other two adjusting rods 501 arranged diagonally move away from each other. Feedback to the same placement groove 402, the four pressure-receiving and expanding members 401, taking the diagonal as a group, alternate in pairs. While ensuring the fixing effect of the wafer, the switching of the clamping position of the wafer is completed, which can effectively avoid the retention of the cleaning liquid caused by the clamping position, weaken the obstruction of the pressure-receiving and expanding members 401 to centrifugal drying, and at the same time ensure the fixing effect of the wafer.

[0043] Embodiment III On the basis of the above embodiments, when the wafer is rotated and spin-dried, the pressure-actuated opening and closing member 401 will be in an intermittent opening state. After the pressure-actuated opening and closing member 401 opens, the moving plate 4012 is in a parallel positional relationship with the wafer. Moreover, after the pressure-actuated opening and closing member 401 opens, due to the previous clamping state, the cleaning liquid will remain on the surface of the wafer at its corresponding position. At this time, although the pressure-actuated opening and closing member 401 is no longer in contact with the wafer surface, its presence will still interfere with the blowing effect of the hot nitrogen, thereby reducing the efficiency of wafer drying and affecting the drying quality.

[0044] Please refer to Figures 1 to 9 As shown, the flow guiding portion 6 includes flow guiding plates 601 symmetrically arranged outside the pressure-actuated opening and closing member 401. When the pressure-actuated opening and closing member 401 opens, the two flow guiding plates 601 push against each other, and the included angle between them increases, and the formed guiding channel expands.

[0045] A circular groove 602 is formed in the moving plate 4012, and a rotating shaft 603 is rotatably connected in the circular groove 602. The rotating shaft 603 is connected to the side wall of the circular groove 602 via a torsion spring 604, and a flow guiding plate 601 is fixedly connected to the rotating shaft 603.

[0046] On the basis of the above Embodiment 2, when the pressure-actuated opening and closing member 401 clamps and fixes the wafer, the two moving plates 4012 drive the two flow guiding plates 601 to move relatively. Since the flow guiding plates 601 are inclined, one end of the flow guiding plate 601 contacts the wafer first. As the two moving plates 4012 move relatively to clamp the wafer, the two flow guiding plates 601 gradually swing to a position parallel to the moving plate 4012, causing the flow guiding plates 601 to rotate relative to the moving plate 4012. The flow guiding plates 601 drive the rotating shaft 603 to rotate and stretch the torsion spring 604. This is the clamping state. When the pressure-actuated opening and closing member 401 opens, the two moving plates 4012 move away from each other. As the two moving plates 4012 move away from each other, the two flow guiding plates 601 start to incline under the reset action of the torsion spring 604. The distance between the ends of the two flow guiding plates 601 close to the wafer is smaller, and the distance between the ends of the two flow guiding plates 601 far from the wafer is larger, forming a flow guiding channel. At this time, the hot nitrogen in the main body 1 converges toward the position corresponding to the pressure-actuated opening and closing member 401 and the wafer under the guiding action of the flow guiding channel. Since this position was the contact position between the pressure-actuated opening and closing member 401 and the wafer before, there is relatively more cleaning liquid remaining at this position. The flow guiding channel formed by the two flow guiding plates 601 can further converge the hot nitrogen, strengthen the drying effect here, and avoid the residue of the cleaning liquid.

[0047] Embodiment 4 This embodiment provides a wafer drying method, including the following steps: S1. Place multiple wafers into the placement grooves 402 in the spin-drying rack 2 respectively, and the wafers are located between the pressure-actuated opening and closing members 401; S2. Rotate the handle 305 to make the opening of the flipping frame 302 face upward, and place the drying rack 2 with wafers into the flipping frame 302. During the placement process, multiple pressure-actuated clamping and releasing members 401 clamp the corresponding wafers respectively. S3. Rotate the handle 305, which will cause the flipping frame 302 to cooperate with the connecting rod 506. Then turn on the motor 303 and the air supply device. The turntable 306 drives multiple flipping frames 302 to rotate synchronously, and at the same time, the air supply device continuously introduces hot nitrogen gas to dry multiple wafers simultaneously. S4. While the flipping frame 302 drives the wafers to rotate centrifugally, the pressure-actuated clamping and releasing members 401 in the same placement groove 402 can intermittently open and close, so that the wafers are always clamped and fixed during the rotation process, and at the same time, the clamping position can be switched to avoid liquid residue at the contact between the pressure-actuated clamping and releasing members 401 and the wafers. S5. While the clamping device is opening, the two corresponding flow guide plates 601 in each group can change the inclination angle to form a flow guide channel, so that the hot nitrogen gas in the main body 1 is guided to the surface of the wafers corresponding to the pressure-actuated clamping and releasing members 401.

[0048] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A wafer drying device, comprising a main body (1) and a drying rack (2), characterized in that: Also includes: A driving unit (3), comprising a turning frame (302) matched with the spin-drying rack (2); A clamping portion (4), comprising a plurality of placement slots (402) provided on the spin-drying rack (2), each placement slot (402) being provided with a plurality of pressure-bearing stretching and closing members (401), the pressure-bearing stretching and closing members (401) clamping and fixing the wafers in the placement slots (402); An adjusting portion (5), comprising an adjusting rod (501) corresponding to the pressurized stretching and closing member (401), wherein when the adjusting rod (501) moves intermittently, the pressurized stretching and closing member (401) is reciprocally pressed, so that the pressurized stretching and closing members (401) distributed on the circumferential side of the wafer are intermittently opened; The guide portion (6) comprises guide plates (601) symmetrically arranged outside the pressurized stretching member (401); when the pressurized stretching member (401) is opened, the two guide plates (601) push against each other, the angle between the two increases, and the guide channel formed is enlarged.

2. The wafer drying device according to claim 1, characterized in that: A rotating disk (306) is provided inside the main body (1), a plurality of supporting blocks (301) are fixedly connected to the top of the rotating disk (306), each of the supporting blocks (301) is rotatably connected to a corresponding flip frame (302), a motor (303) is fixedly connected to the bottom of the main body (1), an output end of the motor (303) is coaxially fixedly connected to the rotating disk (306), the flip frame (302) is rotatably connected to the supporting blocks (301) via a rotating shaft (304), a plurality of air holes (307) are provided on the rotating disk (306), and a handle (305) is provided on a side wall of the flip frame (302).

3. The wafer drying device according to claim 2, characterized in that: The spin drying rack (2) is provided with a plurality of slide grooves corresponding to the pressure-absorbing and stretching parts (401) and connected to the placement groove (402), each of the slide grooves is slidably connected with a push plate (4011), the push plate (4011) corresponds to the adjustment rod (501), each of the pressure-absorbing and stretching parts (401) includes two movable plates (4012), and the push plate (4011) can drive the corresponding two movable plates (4012) to move relative to or away from each other.

4. The wafer drying device according to claim 3, characterized in that: The bottom of the push plate (4011) is fixedly connected to an extrusion block (4013); an end of the slide groove facing the center of the spin-drying rack (2) is provided with a baffle (403); the baffle (403) is connected to the side wall of the extrusion block (4013) via a first spring (404); and the opposite ends of each group of two movable plates (4012) are connected to the side wall of the placement groove (402) via a second spring (405).

5. The wafer drying device according to claim 4, characterized in that: Both ends of each adjusting rod (501) are respectively fixedly connected to a guide frame (502); two side walls of the flip frame (302) are respectively rotatably connected to two swing rods (503); the two swing rods (503) on the same side are connected via a third spring (504); and a plug post (505) is respectively provided at the free end of each swing rod (503) for insertion into the corresponding guide frame (502).

6. The wafer drying device according to claim 5, characterized in that: The rotating disk (306) is slidably connected to a plurality of connection rods (506) corresponding to the flip frames (302); two adjustment rods (501) located on one side close to the center of the rotating disk (306) are respectively fixedly connected to connection frames (507); when the flip frame (302) is flipped to the inside of the main body (1), the connection rods (506) can cooperate with the corresponding connection frames (507).

7. The wafer drying device according to claim 6, characterized in that: The main body (1) is provided with a fixing ring (508) located below the rotating disk (306), and two guide grooves (509) are provided on the side wall of the fixing ring (508). The lower end of the connecting rod (506) passes through the rotating disk (306) and is provided with a guide column (510) inserted into the corresponding guide groove (509).

8. The wafer drying device according to claim 7, characterized in that: The guide groove (509) rises and falls in a horizontal direction, and the two guide grooves (509) are arranged in a staggered manner.

9. The wafer drying device according to claim 8, characterized in that: The movable plate (4012) is provided with a circular groove (602), a rotating shaft (603) is rotatably connected in the circular groove (602), the rotating shaft (603) is connected to the side wall of the circular groove (602) via a torsion spring (604), and a guide plate (601) is fixedly connected to the rotating shaft (603).

10. A method for drying a wafer using the wafer drying device according to claims 1 to 9, characterized in that: The drying method comprises the following steps: S1, placing a plurality of wafers into placement slots (402) in a spin drying rack (2); S2, turning the handle (305) so that the opening of the flip frame (302) faces upward, and placing the spin-drying rack (2) containing the wafers into the flip frame (302). During the placing process, the plurality of pressurized tensioning and closing members (401) respectively clamp the corresponding wafers; S3, turning the handle (305) to make the flip frame (302) and the connecting rod (506) cooperate, turning on the motor (303) and the air supply device, the turntable (306) drives the multiple flip frames (302) to rotate synchronously, and the air supply device continuously introduces hot nitrogen to dry the multiple wafers at the same time; S4. While the flip frame (302) drives the wafer to rotate centrifugally, the pressure-absorbing and stretching member (401) in the same placement slot (402) can be intermittently opened and closed, so that the wafer is always clamped and fixed during the rotation process, and the clamping position can be switched to avoid liquid residue at the contact point between the pressure-absorbing and stretching member (401) and the wafer; S5. When the clamping device is opened, the two guide plates (601) corresponding to each group can change their inclination angle to form a guide channel, so that the hot nitrogen in the main body (1) is guided to the wafer surface corresponding to the pressurized tensioning member (401).

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