A three-temperature test device and a positioning-based radio frequency chip test method

Abstract

The present invention relates to a three-temperature testing device for radio frequency chips, in particular to a three-temperature testing device and a positioning-based radio frequency chip testing method, wherein the three-temperature testing device comprises: a sealed machine cover, an XYZ gantry material picking mechanism is provided in the sealed machine cover, and a mounting tube is provided on the XYZ gantry material picking mechanism; a cylinder is installed in the mounting tube, an adsorption piece is provided on the telescopic rod of the cylinder, and a negative pressure component is provided on the adsorption piece. When the cylinder pushes the adsorption piece toward the radio frequency chip, the adsorption piece can first cover and absorb the radio frequency chip. As the adsorption piece continues to move, the negative pressure component is triggered to increase the adsorption force of the adsorption piece on the radio frequency chip; a driving component is also provided on the mounting tube, and the driving component is connected to a clamping component provided on the adsorption piece through a linkage structure. When the telescopic rod moves, the driving component drives the clamping component to deflect relative to the adsorption piece, thereby clamping the radio frequency chip adsorbed by the adsorption piece.

Description

Technical Field

[0001] The present invention relates to a three-temperature testing device for a radio frequency chip, in particular to a three-temperature testing device and a radio frequency chip testing method based on positioning. Background Art

[0002] Due to the rapid development of automotive electronics, automotive-grade chips also have mandatory high and low temperature testing requirements. At the same time, clear requirements are put forward for three-temperature testing of aerospace and military devices. Due to the small size of RF chips and the complex manufacturing process, faulty RF chips may be produced. Therefore, before RF chips are put into use, they usually need to be tested to ensure the quality of RF chips. Conventional three-temperature testing machines use media to heat or cool the chip through physical contact conduction. Each time the material is taken out from the carrier and placed on the three-temperature platform, it is heated or cooled through contact conduction on the platform.

[0003] Currently, in three-temperature testing, due to the small size of RF chips and complex manufacturing processes, manual picking is usually required when removing or placing the chips. Since the test is performed at high and low temperatures, operators are prone to frostbite and burns when taking the chips. In addition, some three-temperature testing equipment is equipped with clamps. When clamping the chips, the clamping force of the chips needs to be very precise to avoid damage to the RF chips. Such clamps are expensive and need to be synchronized with precision components such as pressure sensors. These precision components are easily affected by temperature and the surrounding environment. When the sensor components are affected, the clamping force of the chip will deviate, which can easily damage the chip and lead to problems such as low test efficiency. Summary of the Invention

[0004] The object of the present invention is to provide a three-temperature testing device and a positioning-based radio frequency chip testing method to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A three-temperature testing device, comprising: a sealed machine cover, an XYZ gantry material retrieving mechanism provided in the sealed machine cover, a movable box provided on the XYZ gantry material retrieving mechanism, a material storage lifting mechanism provided on the movable box, and a mounting cylinder provided on the material storage lifting mechanism;

[0007] A cylinder is installed in the installation tube, and a suction piece is provided on the telescopic rod of the cylinder. The suction piece is provided with a negative pressure component. When the cylinder pushes the suction piece toward the RF chip, the suction piece can first cover and absorb the RF chip. As the suction piece continues to move, the negative pressure component is triggered to increase the suction force of the suction piece on the RF chip, so that when the cylinder is reset, the RF chip can move with the suction piece.

[0008] A driving assembly is also provided on the mounting tube, and the driving assembly is connected to the clamping assembly provided on the adsorption member through a linkage structure. During the movement of the telescopic rod, the driving assembly can drive the clamping assembly to deflect relative to the adsorption member, thereby clamping the RF chip adsorbed on the adsorption member.

[0009] As for the three-temperature testing equipment described above: the adsorption component includes a fixing cylinder fixedly provided on the telescopic rod, and a suction cup is fixedly provided on one end of the fixing cylinder away from the installation cylinder.

[0010] The three-temperature testing equipment as described above: the negative pressure component includes a trigger structure and a suction structure, the trigger structure includes an elastic trigger part and a passive part, the elastic trigger part includes a plug-in tube fixedly arranged on the telescopic rod, and a first spring is slidably arranged in the plug-in tube, one end of the first spring abuts against the plug-in tube, and the other end abuts against the plug-in rod slidably arranged in the plug-in tube, a trigger block is fixedly provided on one end of the plug-in rod facing the mounting tube, and an abutment disk is fixedly provided on the other end.

[0011] The three-temperature testing equipment as described above: the passive component includes a passive block, the passive block is slidably connected to the T-bar fixed on the telescopic rod, and a guide plate is fixedly provided on the passive block, and an oblique groove is provided on the guide plate.

[0012] The three-temperature testing equipment as described above: the suction structure includes a suction cylinder fixedly arranged on the fixed cylinder, the suction cylinder is connected to the interior of the fixed cylinder through a connecting pipe, and a suction rod is sealingly and slidingly arranged in the fixed cylinder, the suction rod is fixedly provided with a piston disk at one end facing the suction cup, and a sliding rod is fixedly provided at the other end, and the sliding rod is slidably arranged in the inclined groove.

[0013] As described above, the three-temperature testing equipment: the clamping assembly includes a deflection clamping rod rotatably mounted on the fixed cylinder, and the deflection clamping rods are arranged in two groups equidistantly along the circumferential direction of the fixed cylinder, and each group of the deflection clamping rods is connected to the drive assembly through a linkage structure.

[0014] The three-temperature testing equipment as described above: the driving assembly includes a driving rod rotatably mounted on the mounting cylinder, and the driving rods are provided in two groups, each group of driving rods is sleeved with a sleeve, and a protrusion is formed on the inner wall of the sleeve, and the protrusion is slidably arranged in an interlocking groove opened on the outer wall of the driving rod, and the driving rod is connected to the transmission rod rotatably mounted on the mounting cylinder through a bevel gear set.

[0015] As for the three-temperature testing equipment described above: the engaging groove body includes a spiral groove opened on the outer wall of the driving rod, and the two ends of the spiral groove are respectively connected to the first vertical groove and the second vertical groove.

[0016] The three-temperature testing equipment as described above: the linkage structure includes a second connecting plate hinged to the deflection clamping rod, the second connecting plate is rotatably installed with a linkage rod at one end away from the deflection clamping rod, and a first connecting plate is rotatably installed on the linkage rod, and the first connecting plate is rotatably connected to the transmission rod at one end away from the linkage rod, and the linkage rod is respectively connected to the transmission rod and the deflection clamping rod through a first linkage belt and a second linkage belt.

[0017] A positioning-based RF chip testing method, using the three-temperature testing equipment described above, includes the following steps:

[0018] Step 1: Before the test, fill the air intake of the sealed machine cover with -20℃ dry air, and then discharge it from the exhaust hole to form a circulating airflow. The temperature control host will blow air to heat or cool the three-temperature storage box and the three-temperature test box simultaneously. When the test conditions are met, the three-temperature storage box and the three-temperature test box will start working;

[0019] Step 2: After the test conditions are met, the XYZ gantry retrieving mechanism controls the material storage lifting mechanism to move above the silo and grab the RF chip in the silo;

[0020] 1. The cylinder pushes the fixed cylinder toward the RF chip. During the approach, the drive assembly can drive the deflection clamping rod to open, and the suction cup can cover and adsorb the RF chip. At the same time, the RF chip contacts and squeezes the abutment disc;

[0021] Second: The contact plate is squeezed, forcing the negative pressure component to move, and then the suction cylinder further increases the negative pressure value of the suction cup, thereby enhancing the suction cup's ability to adsorb the RF chip;

[0022] 3. Then, the cylinder retracts. During this process, the drive assembly can drive the deflected clamping rods closer to each other, thereby clamping the RF chip and preventing the RF chip from separating from the suction cup during movement.

[0023] Step 3: The XYZ gantry material picking mechanism drives the material storage lifting mechanism to move to the upper side of the test three-temperature box, and then the cylinder pushes the fixed cylinder. During this process, the drive component first moves to open the deflection clamping rod, and then the trigger structure releases the lock on the negative pressure component, and then the suction cylinder resets, causing the RF chip to fall into the test three-temperature box.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The test chamber utilizes three independently controlled storage and testing chambers, combined with the air-blowing heating / cooling capabilities of the temperature control unit (-70°C to +160°C), to simulate the performance of RF chips under different operating conditions. The circulating airflow and sealed enclosure design ensure a uniform and stable temperature field, significantly improving the reliability and consistency of test results.

[0026] By utilizing the linkage control of the XYZ gantry material picking mechanism, the mobile box, and the material storage lifting mechanism, the entire process of grabbing, transferring, testing, and resetting the RF chip from the silo is automated. Through the cooperation of the cylinder-driven adsorption component and the negative pressure component, when the suction cup is deformed to generate a basic negative pressure, the suction cylinder further increases the negative pressure value in the suction cup through the mechanical transmission of the slide rod and the inclined groove, so that the suction cup can stably adsorb the RF chip. The double protection mechanism ensures the adsorption stability of the chip in high-speed movement and sudden temperature changes. In addition, after the negative pressure component completes the adsorption operation, the limiter cooperates with the sensing structure to lock the state of the negative pressure component to prevent the first spring from rebounding and causing the negative pressure to disappear, thereby maintaining a stable connection between the RF chip and the suction cup, reducing manual intervention and operating errors, and improving test efficiency.

[0027] At the same time, by setting up a driving component and a clamping component and utilizing the mechanical linkage between the two, when the suction cup descends, the deflection clamping rod is driven to open to avoid the chip; during the subsequent rising process of the suction cup, the deflection clamping rod is gradually tightened through the cooperation of the interlocking groove and the protrusion, so that the deflection clamping rod maintains a clamping state and the clamping claw is located under the RF chip, ensuring that the chip remains stably fixed to the suction cup during the transfer process, effectively avoiding the risk of chip falling off due to equipment vibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural diagram of the three-temperature test equipment.

[0029] Figure 2 Schematic diagram of the structure inside the sealed hood in the three-temperature test equipment.

[0030] Figure 3 This is a schematic diagram of the structure of the mobile box in the three-temperature testing equipment.

[0031] Figure 4 This is a structural diagram of the material storage lifting mechanism in the three-temperature testing equipment.

[0032] Figure 5 This is a structural diagram of the other side of the material storage lifting mechanism in the three-temperature testing equipment.

[0033] Figure 6 This is a schematic diagram of the structure inside the installation cylinder in the three-temperature testing equipment.

[0034] Figure 7 This is a schematic diagram of the structure inside the fixed cylinder in the three-temperature testing equipment.

[0035] Figure 8 This is a schematic diagram of the structure of the negative pressure component in the three-temperature testing equipment.

[0036] Figure 9 This is a schematic diagram of the suction structure in the three-temperature test equipment.

[0037] Figure 10 This is a schematic diagram of the structure of the passive components in the three-temperature test equipment.

[0038] Figure 11 Schematic diagram of the elastic trigger structure in the three-temperature testing equipment.

[0039] Figure 12 This is a schematic diagram of the linkage structure in the three-temperature test equipment.

[0040] Figure 13 This is a schematic diagram of the structure of the drive component in the three-temperature test equipment.

[0041] Figure 14 It is a structural diagram of the embedded slot body in the three-temperature test equipment.

[0042] Figure 15 This is a schematic diagram of the structure of the socket in the three-temperature testing equipment.

[0043] In the figure: 1. Sealing cover; 2. Air inlet; 3. Exhaust hole; 4. XYZ gantry reclaiming mechanism; 5. Testing mechanism; 6. Three-temperature test chamber; 7. Three-temperature storage chamber; 8. Material silo; 9. Temperature control unit; 10. Switch valve; 11. Moving chamber; 12. Mounting cylinder; 13. Fixed cylinder; 1301. Suction cup; 14. Storage lifting mechanism; 15. Telescopic rod; 1501. Slide; 1502. T-bar; 1503. Mounting piece; 16. Deflection clamping rod; 17. Suction cylinder; 18. Driving rod; 1801. First vertical slot; 1802. Spiral slot; 1803. Second vertical slot. 19. Cylinder; 20. Socket; 2001. Protrusion; 21. Guide plate; 2101. Inclined groove; 22. Passive block; 2201. Trigger surface; 2202. T-slot; 23. Trigger block; 2301. Abutment surface; 24. Connecting cylinder; 25. Connecting rod; 2501. Abutment disk; 26. Suction rod; 2601. Sliding rod; 27. Limiting member; 28. Limiting plate; 29. ​​First spring; 30. Bevel gear set; 31. Linking rod; 32. First connecting plate; 33. First linkage belt; 34. Second linkage belt; 35. Second connecting plate; 36. Connecting rod; 37. Transmission rod; 38. Second spring. DETAILED DESCRIPTION

[0044] Various exemplary embodiments, features, and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0045] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0046] In addition, numerous specific details are provided in the following specific examples to better illustrate the present application. Those skilled in the art will appreciate that the present application can be practiced without certain specific details. In some instances, methods, means, and components well known to those skilled in the art are not described in detail in order to highlight the main purpose of the present application.

[0047] See also Figures 1-15 In an embodiment of the present invention, a three-temperature testing device includes:

[0048] A sealed machine cover 1 is provided with an XYZ gantry material retrieving mechanism 4 in the sealed machine cover 1, a movable box 11 is provided on the XYZ gantry material retrieving mechanism 4, a material storage lifting mechanism 14 is provided on the movable box 11, and a mounting cylinder 12 is provided on the material storage lifting mechanism 14;

[0049] Specifically, see Figure 1、 Figure 2 The sealed machine cover 1 is provided with an air inlet 2 and an exhaust hole 3. A material bin 8, a material storage three-temperature box 7, a test three-temperature box 6 and a temperature control host 9 are provided in the sealed machine cover 1. The temperature control host 9 is connected to the switch valve 10. Before the test, -20°C dry air is filled into the air inlet 2 of the sealed machine cover 1, and after it is full, it is discharged from the exhaust hole 3 to form a circulating airflow; the temperature control host 9 cooperates with the switch valve 10 to blow air to heat (+160°C) or cool (-70°C) the material storage three-temperature box 7 and the test three-temperature box 6 synchronously. After the test conditions are met, the material storage three-temperature box 7 and the test three-temperature box 6 start to work, which can store or work the RF chip at different temperatures, thereby performing quality inspection on the RF chip.

[0050] When the test conditions are met, the XYZ gantry retrieving mechanism 4 controls the storage and lifting mechanism 14 to move above the hopper 8 and grab the RF chip inside. The grabbed RF chip is then driven by the XYZ gantry retrieving mechanism 4 toward the test chamber 6. During this movement, the testing mechanism 5 locates the RF chip and places it inside the test chamber 6. The temperature control host 9 then controls the temperature of the test chamber 6, and the final test results are fed back to the temperature control host 9. The temperature control host 9 then stores the test results and controls the test chamber 6 to terminate the test.

[0051] A cylinder 19 is installed in the installation tube 12. A suction piece is provided on the telescopic rod 15 of the cylinder 19. The suction piece is provided with a negative pressure component. When the cylinder 19 pushes the suction piece toward the RF chip, the suction piece can first cover and absorb the RF chip. As the suction piece continues to move, the negative pressure component is triggered to increase the suction force of the suction piece on the RF chip, so that when the cylinder 19 is reset, the RF chip can move with the suction piece.

[0052] The adsorption member includes a fixing cylinder 13 fixedly arranged on the telescopic rod 15, and a suction cup 1301 is fixedly arranged on one end of the fixing cylinder 13 away from the mounting cylinder 12;

[0053] See also Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10, in the initial state, the telescopic rod 15 is in a retracted state. When the mobile box 11 moves to the top of the silo 8, the cylinder 19 starts to move, and then the telescopic rod 15 pushes the fixed cylinder 13 toward the RF chip in the silo 8. As the fixed cylinder 13 continues to approach, the suction cup 1301 can first contact the RF chip and cover the top of it (the suction cup 1301 can completely cover the RF chip). Subsequently, the suction cup 1301 continues to descend and contact the platform where the RF chip is placed. The negative pressure generated by the deformation can adsorb the RF chip. In this way, when the mobile box 11 is driven to move by the XYZ gantry material picking mechanism 4, it drives the RF chip to move synchronously, and finally completes the transfer action of the RF chip.

[0054] For further information, see Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 The negative pressure assembly includes a trigger structure and a suction structure. The trigger structure includes an elastic trigger member and a passive member. The elastic trigger member includes a plug-in tube 24 fixedly arranged on the telescopic rod 15. A first spring 29 is slidably arranged in the plug-in tube 24. One end of the first spring 29 abuts against the plug-in tube 24, and the other end abuts against a plug-in rod 25 slidably arranged in the plug-in tube 24. A trigger block 23 is fixedly provided at one end of the plug-in rod 25 facing the mounting tube 12, and an abutment disk 2501 is fixedly provided at the other end.

[0055] In particular, the first spring 29 is always in a compressed energy storage state. The first spring 29 in the compressed state can push the contact plate 2501 away from the mounting tube 12 and make the trigger block 23 contact the fixed tube 13. The plug rod 25 is slidably arranged in the slide groove 1501 provided on the telescopic rod 15. Figure 11 Due to the connection between the trigger block 23 and the plug rod 25, the plug rod 25 can only slide in the axial direction along the telescopic rod 15.

[0056] The passive component includes a passive block 22, which is slidably connected to the T-shaped rod 1502 fixed on the telescopic rod 15, and a guide plate 21 is fixedly provided on the passive block 22, and an inclined groove 2101 is opened on the guide plate 21;

[0057] For additional information, please refer to Figure 8 、 Figure 9 、 Figure 10 , the passive block 22 is provided with a T-slot 2202, and the T-slot 2202 cooperates with the T-bar 1502 so that the passive block 22 can only slide along the radial direction of the fixed cylinder 13;

[0058] The passive block 22 and the trigger block 23 are both configured to be a “right-angled trapezoid” structure, and the inclined surfaces are respectively configured to be a trigger surface 2201 and a contact surface 2301 .

[0059] The suction structure includes a suction cylinder 17 fixedly arranged on the fixed cylinder 13, the suction cylinder 17 is connected to the interior of the fixed cylinder 13 through a connecting pipe, and a suction rod 26 is sealed and slidably arranged in the fixed cylinder 13, the suction rod 26 is fixedly provided with a piston disc at one end facing the suction cup 1301, and a sliding rod 2601 is fixedly provided at the other end, and the sliding rod 2601 is slidably arranged in the inclined groove 2101;

[0060] For details, please refer to Figure 9 The suction rod 26 is also provided with a second spring 38, one end of the second spring 38 abuts against the piston disc, and the other end abuts against the upper bottom surface of the suction cylinder 17. In the initial state, the second spring 38 is in a compressed energy storage state. At this time, the piston disc abuts against the lower bottom surface of the suction cylinder 17, and the slide rod 2601 is located at the end of the stroke of the inclined groove 2101 away from the passive block 22.

[0061] In combination with the above, in the initial state, the trigger block 23 and the passive block 22 are away from each other. When the suction cup 1301 is driven by the cylinder 19 to approach the RF chip, the abutment plate 2501 contacts the RF chip. Subsequently, as the suction cup 1301 continues to approach, the RF chip squeezes the abutment plate 2501, forcing the trigger block 23 to move toward the passive block 22. In this process, the trigger surface 2201 can first contact the abutment surface 2301. Subsequently, the contact and squeezing of the trigger surface 2201 on the abutment surface 2301 can force the passive block 22 to drive the guide plate 21 to move toward the right (refer to FIG. 1). Figure 8 Description), at this time, the compression of the sliding rod 2601 by the wall of the inclined groove 2101 can force the suction rod 26 to rise. At any time, the suction cylinder 17 can increase the negative pressure value generated by the suction cup 1301, thereby increasing the suction force of the suction cup 1301 on the RF chip;

[0062] In addition, when the cylinder 19 controls the fixed cylinder 13 to descend to the lowest height, the rising height of the trigger block 23 reaches the maximum. At this time, the limit member 27 set on the fixed cylinder 13 receives the induction, which can drive the limit plate 28 in the limit member 27 to protrude outward. The protruding limit plate 28 can block the trigger block 23, thereby preventing the trigger block 23 from retracting under the action of the elastic potential energy stored in the first spring 29, ensuring that the suction cup 1301 always maintains a negative pressure state, and preventing the RF chip from detaching from the suction cup 1301 due to vibration when the movable box 11 moves.

[0063] Furthermore, the mounting tube 12 is further provided with a driving assembly, which is connected to a clamping assembly provided on the adsorption member through a linkage structure. During the movement of the telescopic rod 15, the driving assembly can drive the clamping assembly to deflect relative to the adsorption member, thereby clamping the RF chip adsorbed by the adsorption member;

[0064] The clamping assembly includes a deflection clamping rod 16 rotatably mounted on the fixed cylinder 13. The deflection clamping rod 16 is arranged in two groups equidistantly along the circumference of the fixed cylinder 13, and each group of the deflection clamping rod 16 is connected to the driving assembly through a linkage structure.

[0065] The drive assembly includes a drive rod 18 rotatably mounted on the mounting cylinder 12. The drive rod 18 is provided in two groups. Each group of the drive rods 18 is sleeved with a sleeve 20. A protrusion 2001 is formed on the inner wall of the sleeve 20. The protrusion 2001 is slidably disposed in a fitting groove formed on the outer wall of the drive rod 18. The drive rod 18 is connected to a transmission rod 37 rotatably mounted on the mounting cylinder 12 via a bevel gear set 30.

[0066] For details, please refer to Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 12 、 Figure 13 、 Figure 14 The two sets of sleeves 20 are connected to the mounting member 1503 fixed on the telescopic rod 15 through the connecting rod 36. Under the cooperation of the mounting member 1503 and the connecting rod 36, the sleeves 20 can only be raised and lowered along the axial direction of the driving rod 18.

[0067] In addition, the above-mentioned bevel gear group 30 includes a first bevel gear and a second bevel gear. The first bevel gear is coaxially fixed to the drive rod 18, and the second bevel gear is coaxially fixed to the transmission rod 37. When the telescopic rod 15 moves, the protrusion 2001 on the inner wall of the sleeve 20 cooperates with the interlocking groove body, which can force the drive rod 18 to rotate. At the same time, the rotating drive rod 18, with the cooperation of the bevel gear group 30 and the linkage structure, can drive the deflection clamping rod 16 to be adsorbed on the suction cup 1301.

[0068] For details, please refer to Figure 14 The engaging groove body includes a spiral groove 1802 formed on the outer wall of the driving rod 18, and the two ends of the spiral groove 1802 are respectively connected to a first vertical groove 1801 and a second vertical groove 1803;

[0069] The linkage structure includes a second connecting plate 35 hingedly connected to a convex shaft integrally provided with one end of the deflection clamping rod 16, a linkage rod 31 being rotatably mounted on the end of the second connecting plate 35 away from the deflection clamping rod 16, a first connecting plate 32 being rotatably mounted on the linkage rod 31, an end of the first connecting plate 32 away from the linkage rod 31 being rotatably connected to the transmission rod 37, and the linkage rod 31 being connected to the transmission rod 37 and the convex shaft at one end of the deflection clamping rod 16 via a first linkage belt 33 and a second linkage belt 34, respectively;

[0070] Specifically, the first linkage belt 33 connects the transmission rod 37 and the linkage rod 31, and the second linkage belt 34 connects the linkage rod 31 and the cam shaft;

[0071] When the transmission rod 37 rotates, the first linkage belt 33 can drive the linkage rod 31 to rotate, and the linkage rod 31 then drives the cam shaft to rotate through the second linkage belt 34, and finally the deflection clamping rod 16 rotates around the cam shaft; when the two symmetrically arranged clamping rods 16 rotate around the cam shafts at their respective ends and separate from each other, an opening action is performed; correspondingly, when the two clamping rods 16 rotate around the cam shafts at their respective ends and approach each other, a closing action is performed.

[0072] In combination with the above structure, in the initial state, the protrusion 2001 is located at the end of the travel of the first vertical groove 1801 away from the spiral groove 1802, and the two sets of deflection clamping rods 16 are in a clamping state. When the cylinder 19 pushes the fixed cylinder 13 toward the RF chip, the mounting member 1503 and the connecting rod 36 pull the sleeve cylinder 20 down along the axial direction of the telescopic rod 15. During this process, the protrusion 2001 first slides along the first vertical groove 1801; then, the protrusion 2001 engages with the spiral groove 1802, and as the telescopic rod 15 continues to descend, the protrusion 2001 cooperates with the spiral groove 1802 to drive the driving rod 18 to rotate clockwise (by Figure 12 Taking the left drive rod 18 as an example, the right drive rod 18 performs the reverse action. Subsequently, under the action of the bevel gear set 30 and the linkage structure, the drive rod 18 drives the deflection clamping rods 16 to rotate clockwise, causing the two sets of deflection clamping rods 16 to open to their maximum angle (after the protrusion 2001 separates from the spiral groove 1802). Thereafter, the protrusion 2001 slides along the second vertical groove 1803, and the deflection clamping rods 16 remain in the open state.

[0073] At the same time, the suction cup 1301 completes the negative pressure adsorption of the RF chip through the cooperation of the negative pressure component and the limiter 27. When the telescopic rod 15 drops to the lowest position, the suction cup 1301 completes the absorption of the RF chip.

[0074] Subsequently, the cylinder 19 pulls the telescopic rod 15 back, and during the retraction process, the suction cup 1301 drives the RF chip to rise. The protrusion 2001 first slides along the second vertical groove 1803 until it is combined with the spiral groove 1802; when continuing to retract, the protrusion 2001 cooperates with the spiral groove 1802 to drive the deflection clamping rod 16 to retract, thereby clamping the RF chip on the suction cup 1301. After the protrusion 2001 is separated from the spiral groove 1802, the deflection clamping rod 16 is completely tightened, and then the protrusion 2001 slides along the first vertical groove 1801 to the initial position. At this time, the deflection clamping rod 16 maintains the clamping state and the clamping claw is located below the RF chip, further preventing the chip from separating from the suction cup 1301.

[0075] When the telescopic rod 15 returns to its initial position, the XYZ gantry retrieving mechanism 4 drives the movable box 11 toward the test three-temperature chamber 6. When the test mechanism 5 detects that the RF chip sucked by the suction cup 1301 has moved directly above the test three-temperature chamber 6, the XYZ gantry retrieving mechanism 4 stops; then the cylinder 19 pushes the suction cup 1301 down to its lowest position, and the drive assembly first causes the deflection clamping rod 16 to release the RF chip. Then, the limiter 27, under the control of the test mechanism 5, retracts the limit plate 28. The first spring 29 releases its elastic potential energy to push the abutment plate 2501 and the trigger block 23 down, synchronously driving the second spring 38 to reset the suction rod 26. After the negative pressure disappears, the RF chip detaches from the suction cup 1301 and falls into the test three-temperature chamber 6.

[0076] After the RF chips are placed in the test three-temperature chamber 6, the cylinder 19 retracts, driving the deflection clamping rod 16 to reset. The XYZ gantry material removal mechanism 4 again drives the movable box 11 back to the top of the hopper 8. After the current batch of test three-temperature chamber 6 is completed and the internal chips are removed, the cylinder 19 repeats the above action process until all RF chips have been tested.

[0077] A positioning-based RF chip testing method, using the three-temperature testing equipment described above, includes the following steps:

[0078] Step 1: Before the test, -20℃ dry air is filled into the air inlet 2 of the sealed machine cover 1. After it is full, it is discharged from the exhaust hole 3 to form a circulating airflow. The temperature control host 9 blows air to heat (+160℃) or cool (-70℃) the storage three-temperature box 7 and the test three-temperature box 6 simultaneously. After the test conditions are met, the storage three-temperature box 7 and the test three-temperature box 6 start working;

[0079] Step 2: After the test conditions are met, the XYZ gantry picking mechanism 4 controls the storage lifting mechanism 14 to move above the silo 8 and grab the RF chip in the silo 8: (In the initial state, the cylinder 19 retracts and the deflected clamping rods 16 move closer to each other);

[0080] First, the cylinder 19 pushes the fixed cylinder 13 toward the RF chip. During the approach process, the driving assembly can drive the deflection clamping rod 16 to open, and the suction cup 1301 can cover and absorb the RF chip. At the same time, the RF chip contacts and presses the abutment plate 2501.

[0081] Second: The contact plate 2501 is squeezed, forcing the negative pressure component to move, and then the suction cylinder 17 further increases the negative pressure value of the suction cup 1301, thereby enhancing the suction capacity of the suction cup 1301 to the RF chip;

[0082] Three: Subsequently, the cylinder 19 retracts. During this process, the drive assembly can drive the deflected clamping rods 16 to move closer to each other, thereby clamping the RF chip and preventing the RF chip from separating from the suction cup 1301 during the movement;

[0083] Step 3: The XYZ gantry material picking mechanism 4 drives the material storage lifting mechanism 14 to move to the upper side of the test three-temperature box 6, and then the cylinder 19 pushes the fixed cylinder 13. During this process, the driving component first moves to open the deflection clamping rod 16, and then the trigger structure releases the lock on the negative pressure component, and then the suction cylinder 17 resets, causing the RF chip to fall into the test three-temperature box 6.

[0084] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0085] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A three-temperature testing device, characterized in that: include: A sealed machine cover, wherein an XYZ gantry material retrieving mechanism is provided in the sealed machine cover, a movable box is provided on the XYZ gantry material retrieving mechanism, a material storage lifting mechanism is provided on the movable box, and a mounting cylinder is provided on the material storage lifting mechanism; A cylinder is installed in the installation tube, and a suction piece is provided on the telescopic rod of the cylinder. The suction piece is provided with a negative pressure component. When the cylinder pushes the suction piece toward the RF chip, the suction piece can first cover and absorb the RF chip. As the suction piece continues to move, the negative pressure component is triggered to increase the suction force of the suction piece on the RF chip, so that when the cylinder is reset, the RF chip can move with the suction piece. The mounting tube is further provided with a driving assembly, which is connected to a clamping assembly provided on the adsorption member through a linkage structure. During the movement of the telescopic rod, the driving assembly can drive the clamping assembly to deflect relative to the adsorption member, thereby clamping the RF chip adsorbed by the adsorption member; The adsorption member includes a fixing cylinder fixedly arranged on the telescopic rod, and a suction cup is fixedly arranged on one end of the fixing cylinder away from the mounting cylinder; The negative pressure assembly includes a trigger structure and a suction structure, the trigger structure includes an elastic trigger member and a passive member, the elastic trigger member includes a plug-in tube fixedly arranged on the telescopic rod, a first spring is slidably arranged in the plug-in tube, one end of the first spring abuts against the plug-in tube, and the other end abuts against the plug-in rod slidably arranged in the plug-in tube, a trigger block is fixedly provided on one end of the plug-in rod facing the mounting tube, and an abutment disk is fixedly provided on the other end; The passive component includes a passive block, the passive block is slidably connected to a T-shaped rod fixed on the telescopic rod, and a guide plate is fixedly provided on the passive block, and an oblique groove is provided on the guide plate; The suction structure includes a suction cylinder fixedly arranged on the fixed cylinder, the suction cylinder is connected to the interior of the fixed cylinder through a connecting pipe, and a suction rod is sealingly and slidably arranged in the fixed cylinder, one end of the suction rod facing the suction cup is fixedly provided with a piston disk, and the other end is fixedly provided with a sliding rod, and the sliding rod is slidably arranged in the inclined groove; The clamping assembly includes a deflection clamping rod rotatably mounted on the fixed cylinder. Two groups of deflection clamping rods are equidistantly arranged along the circumferential direction of the fixed cylinder, and each group of deflection clamping rods is connected to the driving assembly through a linkage structure.

2. A three-temperature testing device according to claim 1, characterized in that: The driving assembly includes a driving rod rotatably mounted on the mounting cylinder. The driving rod is provided with two groups. Each group of driving rods is provided with a sleeve cylinder. A protrusion is formed on the inner wall of the sleeve cylinder. The protrusion is slidably arranged in an interlocking groove opened on the outer wall of the driving rod, and the driving rod is connected to the transmission rod rotatably mounted on the mounting cylinder through a bevel gear set.

3. The three-temperature testing equipment according to claim 2, characterized in that: The engaging groove body includes a spiral groove opened on the outer wall of the driving rod, and two ends of the spiral groove are respectively connected to a first vertical groove and a second vertical groove.

4. The three-temperature testing equipment according to claim 3, characterized in that: The linkage structure includes a second connecting plate hinged to the deflection clamping rod, and the second connecting plate is rotatably installed with a linkage rod at one end away from the deflection clamping rod. A first connecting plate is rotatably installed on the linkage rod, and the first connecting plate is rotatably connected to the transmission rod at one end away from the linkage rod, and the linkage rod is respectively connected to the transmission rod and the deflection clamping rod through a first linkage belt and a second linkage belt.

5. A positioning-based RF chip testing method, using a three-temperature testing device according to any one of claims 1 to 4, characterized in that: The steps include: Step 1: Before the test, fill the air intake of the sealed machine cover with -20℃ dry air, and then discharge it from the exhaust hole to form a circulating airflow. The temperature control host will blow air to heat or cool the three-temperature storage box and the three-temperature test box simultaneously. When the test conditions are met, the three-temperature storage box and the three-temperature test box will start working; Step 2: After the test conditions are met, the XYZ gantry retrieving mechanism controls the material storage lifting mechanism to move above the silo and grab the RF chip in the silo; 1. The cylinder pushes the fixed cylinder toward the RF chip. During the approach, the drive assembly can drive the deflection clamping rod to open, and the suction cup can cover and adsorb the RF chip. At the same time, the RF chip contacts and squeezes the abutment disc; Second: The contact plate is squeezed, forcing the negative pressure component to move, and then the suction cylinder further increases the negative pressure value of the suction cup, thereby enhancing the suction cup's ability to adsorb the RF chip; 3. Then, the cylinder retracts. During this process, the drive assembly can drive the deflected clamping rods closer to each other, thereby clamping the RF chip and preventing the RF chip from separating from the suction cup during movement. Step 3: The XYZ gantry material picking mechanism drives the material storage lifting mechanism to move to the upper side of the test three-temperature box, and then the cylinder pushes the fixed cylinder. During this process, the drive component first moves to open the deflection clamping rod, and then the trigger structure releases the lock on the negative pressure component, and then the suction cylinder resets, causing the RF chip to fall into the test three-temperature box.

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