A conveying device for glue coating and developing equipment

Abstract

The present invention provides a conveying device for a glue coating and developing device, which relates to the technical field of glue coating and developing devices, and comprises: a base; the base is fixed on the glue coating and developing device, and two first electric cylinders are fixed to the top surface of the base, and the protruding ends of the two first electric cylinders are fixed to the bottom surface of the first mounting block. Emergency adjustment function: when the first electric cylinder fails, the two third electric cylinders can be used as backup to adjust the height of the wafer by extending, so as to ensure that production is not affected, thereby improving the reliability and stability of the equipment; automatic alignment and cleaning function: the mounting frame in the auxiliary component can automatically move the wafer into the placement slot to ensure that the wafer is correctly positioned; at the same time, the cleaning block can remove dust from the surface of the wafer during its movement, thereby improving the quality of glue coating or development; airflow dust removal effect: the cleaning component realizes airflow dust removal on the top surface of the wafer through continuous air jetting of the telescopic bottle and the air jet tube, further improving the accuracy and effect of glue coating or development.

Description

Technical Field

[0001] The present invention relates to the technical field of glue coating and developing equipment, in particular to a conveying device of glue coating and developing equipment. Background Art

[0002] The glue coating and developing equipment is a key equipment used in conjunction with the photolithography machine in the photolithography process; the glue coating and developing equipment usually includes multiple parts such as a glue coating machine, a glue spraying machine and a developer; these parts play a vital role in the photolithography process, and work online with the photolithography machine to form a wafer processing and photolithography production line. The glue coating equipment is mainly used for steps such as glue coating, baking and developing. The glue coating equipment requires a conveyor to transport the wafer when coating.

[0003] The conveying device on the existing coating and developing equipment currently has the following shortcomings:

[0004] The existing device only realizes transportation, but cannot automatically return and clean the wafer during transportation; although the existing device can adjust the lifting, it cannot perform emergency adjustment when the electric cylinder used for lifting is damaged, and its practicality is low.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and a conveying device for a coating and developing device is provided to achieve a more practical purpose. Summary of the Invention

[0006] In order to solve the above technical problems, the present invention provides a conveying device for a coating and developing device to solve the problem that the existing device only realizes transportation but cannot automatically realize the return and cleaning of the wafer during transportation; although the existing device can adjust the lifting, it cannot perform emergency adjustment when the electric cylinder used for lifting is damaged, and its practicality is low.

[0007] The present invention provides a conveying device for a glue coating and developing device, which specifically includes: a base; the base is fixed on the glue coating and developing device, two first electric cylinders are fixed on the top surface of the base, the protruding ends of the two first electric cylinders are fixed on the bottom surface of a first mounting block, and a conveying component is installed on the first mounting block.

[0008] Furthermore, the transmission assembly is composed of a guide rail seat, a guide rail, a sliding block, a seat body, a second mounting block, a second electric cylinder, a third electric cylinder and a placement seat. Two guide rail seats are fixed on the top surface of the first mounting block, two guide rails are fixed in each guide rail seat, a sliding block slides on each guide rail, and two are fixed on the sliding block; a second mounting block is fixed on the two guide rail seats, a second electric cylinder is fixed on the second mounting block, and the protruding end of the second electric cylinder is fixed on the seat body.

[0009] Furthermore, two third electric cylinders are fixed on the base body, and the protruding ends of the two third electric cylinders are fixed to the bottom end surface of the placement base, and the wafer is placed in the placement groove on the placement base.

[0010] Furthermore, an auxiliary seat is fixed on the top surface of the base, and the auxiliary seat is a concave structure. Two guide rods are slid on the auxiliary seat, and the upper ends of the two guide rods are welded to the bottom surface of the first mounting block.

[0011] Furthermore, auxiliary components are installed on the two guide rail seats, and the auxiliary components consist of a mounting frame and a cleaning block. A mounting frame is fixed on the two guide rail seats, and the left open end of the mounting frame is a V-shaped structure. The bottom end surface of the mounting frame is 0.1 cm higher than the top surface of the wafer.

[0012] Furthermore, a cleaning block is fixed to the bottom end surface of the mounting frame. The cleaning block is located on the right side of the wafer, and the bottom end surface of the cleaning block is flush with the top end surface of the wafer.

[0013] Furthermore, a cleaning assembly is installed on the base body, and the cleaning assembly consists of a telescopic bottle, a contact rod, a mounting arm, an air jet tube and a protrusion. A telescopic bottle is fixed on the bottom end surface of the base body, and a coil spring for its own elastic reset is installed in the telescopic bottle. The telescopic bottle is connected to the air jet tube through a pipe. When the telescopic bottle is squeezed, the air jet tube is in an air jet state. The air jet tube is fixed to a guide rail seat on the front side through two mounting arms.

[0014] Furthermore, a rear end face of a front guide rail seat is welded with a protrusion in a linear array, and the protrusion is a semi-cylindrical structure; a contact rod is fixed to one end of the front side of the telescopic bottle, and the front end of the contact rod contacts the rear end face of a front guide rail seat, and when the seat body moves to the right, the contact rod and the protrusion are elastically contacted in turn.

[0015] Furthermore, a rotating assembly is installed on the placement seat, and the rotating assembly consists of a rotating shaft, a rotating wheel and a driving wheel. Two rotating shafts rotate on the seat body, and a rotating wheel is fixed to the lower end of each rotating shaft, and the outer walls of the two rotating wheels are in contact with the inner walls of the two guide rail seats respectively; a driving wheel is fixed to the upper end of each rotating shaft, and the outer walls of the two driving wheels are in contact with the outer wall of the wafer.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] Airflow dust removal effect: The cleaning component realizes airflow dust removal on the top surface of the wafer through continuous air jets from the telescopic bottle and the air jet tube, further improving the accuracy and effect of gluing or developing. The telescopic bottle does not need to be driven separately. When the wafer moves to the right, it can automatically squeeze the telescopic bottle under the action of the protrusion, saving equipment costs and improving the structure.

[0018] Flexible height and position adjustment: Through the extension and retraction of the two first electric cylinders, the equipment can easily adjust the height of the wafer to achieve the ideal processing position; at the same time, the extension and retraction of the second electric cylinder can move the wafer left and right to ensure the precise positioning of the wafer to meet the precise requirements of coating or developing.

[0019] Cost saving and convenient maintenance: The vulnerable parts in the equipment, such as the guide rail seat, guide rail and slide block, are designed to be replaced individually, without replacing the entire transmission assembly, which greatly reduces maintenance costs and downtime.

[0020] Emergency adjustment function: When the first electric cylinder fails, the two third electric cylinders can serve as backup and adjust the height of the wafer by extending, ensuring that production is not affected and improving the reliability and stability of the equipment.

[0021] Balanced force and extended service life: The design of the auxiliary seat and guide rod helps to disperse the force at the connection between the first electric cylinder and the first mounting block, avoiding damage caused by long-term force and extending the service life of the equipment.

[0022] Automatic alignment and cleaning function: The mounting frame in the auxiliary component can automatically move the wafer into the placement slot to ensure the correct wafer position; at the same time, the cleaning block can remove dust on the surface of the wafer during movement, improving the quality of coating or development.

[0023] Wafer rotation function: In Example 2, the addition of the rotating component enables the wafer to rotate while moving to the right, which not only enhances the effect of airflow dust removal, but also ensures uniform treatment of the wafer surface, thereby improving production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0025] In the attached figure:

[0026] Figure 1 It shows an axial structural schematic diagram of a conveying device of a coating and developing device according to the present invention;

[0027] Figure 2 It shows a schematic diagram of the main structure of the conveying device of the coating and developing equipment according to the present invention;

[0028] Figure 3 It shows a left side structural schematic diagram of the conveying device of the gluing and developing equipment according to the present invention;

[0029] Figure 4 It shows that according to the present invention Figure 3 A schematic diagram of the enlarged structure at point A;

[0030] Figure 5It shows that according to the present invention Figure 3 A schematic diagram of the enlarged structure at point B;

[0031] Figure 6 It shows that according to the present invention Figure 1 Schematic diagram of the axial structure after rotation;

[0032] Figure 7 It shows a schematic diagram of the axial split structure of the conveying device of the coating and developing equipment according to the present invention;

[0033] Figure 8 The figure shows a schematic diagram of the axial split structure of the mounting bracket and the cleaning block according to the present invention.

[0034] Reference Signs List

[0035] 1. Base;

[0036] 2. The first electric cylinder;

[0037] 3. First mounting block; 301. Auxiliary seat; 302. Guide rod;

[0038] 4. Conveying assembly; 401. Guide rail seat; 402. Guide rail; 403. Sliding block; 404. Seat body; 405. Second mounting block; 406. Second electric cylinder; 407. Third electric cylinder; 408. Placement seat;

[0039] 5. Wafer;

[0040] 6. Rotating assembly; 601. Rotating shaft; 602. Rotating wheel; 603. Driving wheel;

[0041] 7. Auxiliary components; 701. Mounting frame; 702. Cleaning block;

[0042] 8. Cleaning assembly; 801. Telescopic bottle; 802. Contact rod; 803. Mounting arm; 804. Air jet tube; 805. Protrusion. DETAILED DESCRIPTION

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present invention have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or highly formal sense, unless explicitly defined in this manner in the embodiments of the present invention.

[0045] The terms "first," "second," and similar terms used in the embodiments of the present invention do not indicate any order, quantity, or importance, but are simply used to distinguish different components. Terms such as "a," "an," or "the" do not indicate a limit on quantity, but rather indicate the presence of at least one. Similarly, terms such as "include" or "comprise" mean that the element or object preceding the term encompasses the elements or objects listed after the term, and their equivalents, without excluding other elements or objects. In the following description, spatial and directional terms such as "upper," "lower," "front," "back," "top," "bottom," "vertical," and "horizontal" may be used to describe embodiments of the present invention. However, it should be understood that these terms are used solely to facilitate the description of the embodiments shown in the figures and do not require that the actual device be constructed or operated in a specific orientation. In the following description, terms such as "connect," "couple," "fixed," and "attached" may refer to a direct connection between two elements or structures without any other elements or structures between them, or an indirect connection between two elements or structures through an intermediate element or structure, unless otherwise expressly stated herein. Example 1:

[0046] As attached Figure 1 To the attached Figure 8 As shown:

[0047] The present invention provides a conveying device for a glue coating and developing device, comprising: a base 1; the base 1 is fixed on the glue coating and developing device, two first electric cylinders 2 are fixed to the top surface of the base 1, the protruding ends of the two first electric cylinders 2 are fixed to the bottom surface of a first mounting block 3, a conveying assembly 4 is installed on the first mounting block 3, and when adjusting the height of a wafer 5, the two first electric cylinders 2 are driven to extend. When the two first electric cylinders 2 are extended, they can drive the first mounting block 3 and the conveying assembly 4 to move upward, thereby realizing the height adjustment of the wafer 5.

[0048] The transmission assembly 4 is composed of a guide rail seat 401, a guide rail 402, a sliding block 403, a seat body 404, a second mounting block 405, a second electric cylinder 406, a third electric cylinder 407 and a placement seat 408. Two guide rail seats 401 are fixed to the top surface of the first mounting block 3. Two guide rails 402 are fixed in each guide rail seat 401. A sliding block 403 slides on each guide rail 402, and two are fixed on the sliding block 403. A second mounting block is fixed on the two guide rail seats 401. 405. A second electric cylinder 406 is fixed on the second mounting block 405. The protruding end of the second electric cylinder 406 is fixed on the base body 404. When adjusting the left and right positions of the wafer 5, the extension and contraction of the second electric cylinder 406 can be controlled. Driven by the second electric cylinder 406, the base body 404 can be moved left and right, thereby realizing the left and right movement of the wafer 5. Moreover, through the arrangement of the guide rail base 401 and the sliding block 403, when the guide rail base 401 and the sliding block 403 are damaged, they can be replaced separately, thereby saving costs.

[0049] Among them, two third electric cylinders 407 are fixed on the base body 404, and the protruding ends of the two third electric cylinders 407 are fixed on the bottom end surface of the placement seat 408. The wafer 5 is placed in the placement groove on the placement seat 408. When the first electric cylinder 2 is damaged, the two third electric cylinders 407 are driven to extend, so that emergency adjustment of the height of the wafer 5 can be achieved.

[0050] Among them, an auxiliary seat 301 is fixed on the top surface of the base 1. The auxiliary seat 301 is a concave structure. Two guide rods 302 slide on the auxiliary seat 301. The upper ends of the two guide rods 302 are welded to the bottom end surface of the first mounting block 3. During use, the sliding of the two guide rods 302 and the first mounting block 3 can relieve the force at the connection between the first electric cylinder 2 and the first mounting block 3, thereby avoiding damage caused by long-term force at the connection between the first electric cylinder 2 and the first mounting block 3.

[0051] Among them, auxiliary components 7 are installed on the two guide rail seats 401. The auxiliary component 7 consists of a mounting frame 701 and a cleaning block 702. A mounting frame 701 is fixed on the two guide rail seats 401. The left open end of the mounting frame 701 is a V-shaped structure. The bottom end surface of the mounting frame 701 is 0.1 cm higher than the top surface of the wafer 5. When the placement seat 408 drives the wafer 5 to move to the right, the wafer 5 can be moved to the placement groove in the seat body 404 through the V-shaped opening on the left side of the mounting frame 701. Even if the wafer 5 is not initially placed in the placement groove, it will not affect the subsequent glue coating.

[0052] Among them, a cleaning block 702 is fixed on the bottom end face of the mounting frame 701. The cleaning block 702 is located on the right side of the wafer 5. The bottom end face of the cleaning block 702 is flush with the top end face of the wafer 5. When the wafer 5 moves to the right to the cleaning block 702, the top end face of the wafer 5 can be cleaned by the cleaning block 702, thereby avoiding the presence of dust on the top end face of the wafer 5, which in turn affects the subsequent gluing effect.

[0053] Among them, a cleaning component 8 is installed on the base body 404, and the cleaning component 8 consists of a telescopic bottle 801, a contact rod 802, a mounting arm 803, an air jet tube 804 and a protrusion 805. A telescopic bottle 801 is fixed on the bottom end surface of the base body 404, and a coil spring for its own elastic reset is installed in the telescopic bottle 801. The telescopic bottle 801 is connected to the air jet tube 804 through a pipe. When the telescopic bottle 801 is squeezed, the air jet tube 804 is in an air jet state. The air jet tube 804 is fixed to a guide rail seat 401 on the front side through two mounting arms 803.

[0054] Among them, the rear end face of a front guide rail seat 401 is welded with a protrusion 805 in a linear array, and the protrusion 805 is a semi-cylindrical structure; a contact rod 802 is fixed to one end of the front side of the telescopic bottle 801, and the front end of the contact rod 802 contacts the rear end face of a front guide rail seat 401. When the seat body 404 moves to the right, the contact rod 802 and the protrusion 805 elastically contact in turn. During use, the continuous squeezing of the contact rod 802 by the protrusion 805 realizes the continuous squeezing of the telescopic bottle 801, and finally realizes the continuous jetting of the jet pipe 804. When gas is ejected from the jet pipe 804, airflow dust removal can be achieved on the top surface of the wafer 5. Example 2:

[0055] On the basis of Example 1, it also includes: a rotating component 6 is installed on the placement seat 408, and the rotating component 6 is composed of a rotating shaft 601, a rotating wheel 602 and a driving wheel 603. Two rotating shafts 601 rotate on the seat body 404, and a rotating wheel 602 is fixed at the lower end of each rotating shaft 601, and the outer walls of the two rotating wheels 602 are in contact with the inner walls of the two guide rail seats 401 respectively; a driving wheel 603 is fixed at the upper end of each rotating shaft 601, and the outer walls of the two driving wheels 603 are in contact with the outer wall of the wafer 5. When the seat body 404 drives the wafer 5 to move to the right, the rotation of the wafer 5 can be achieved under the action of the rotating wheel 602 and the driving wheel 603, and at this time the airflow dust removal effect of the jet pipe 804 on the wafer 5 is guaranteed.

[0056] The specific usage and function of this embodiment are as follows:

[0057] First, the device is installed on the glue coating and developing equipment, wherein the base 1 serves as the supporting structure of the entire device to ensure the stability of the device; when the wafer 5 needs to be processed, the wafer 5 is first placed in the placement groove of the placement seat 408; the device drives the first mounting block 3 and the conveying assembly 4 installed on the first mounting block 3 to move up and down through the extension or contraction of the two first electric cylinders 2, thereby adjusting the height of the wafer 5; if the first electric cylinder 2 fails, the emergency adjustment of the height of the wafer 5 can also be achieved by driving the two third electric cylinders 407 to extend or contract. ; The second electric cylinder 406 in the conveying component 4 extends, driving the base 404 and the wafer 5 placed on the base 404 to move to the right, and moving the wafer 5 to the glue coating position; in the process of the wafer 5 moving to the right, it will first be moved to the placement groove in the base 404 through the V-shaped opening on the left side of the mounting frame 701 in the auxiliary component 7 to ensure that the wafer 5 is placed correctly; then, the wafer 5 will move to the cleaning block 702, and the cleaning block 702 will physically clean the top surface of the wafer 5 to remove dust; when the wafer 5 continues to move to the right, it will trigger the cleaning component 8 to work. When the seat body 404 moves to the right, the contact rod 802 elastically contacts the protrusion 805 on the rear end surface of the guide rail seat 401 in turn, continuously squeezing the telescopic bottle 801, causing the jet tube 804 to continuously spray air to clean the wafer 5; at the same time, in the process of the wafer 5 moving to the right, the rotating wheel 602 and the driving wheel 603 in the rotating assembly 6 start to work; under the rolling action of the inner wall of the guide rail seat 401, the rotating wheel 602 drives the rotating shaft 601 and the driving wheel 603 above to rotate.

[0058] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A conveying device for a coating and developing device, characterized in that: include: Base (1); the base (1) is fixed on the coating and developing device, two first electric cylinders (2) are fixed on the top surface of the base (1), the protruding ends of the two first electric cylinders (2) are fixed on the bottom surface of the first mounting block (3), and a transmission component (4) is installed on the first mounting block (3); the transmission component (4) consists of a guide rail seat (401), a guide rail (402), a sliding block (403), a seat body (404), a second mounting block (405), a second electric cylinder (406), a third electric cylinder (407) and a placement seat (4 08), two guide rail seats (401) are fixed on the top surface of the first mounting block (3), two guide rails (402) are fixed in each guide rail seat (401), a sliding block (403) slides on each guide rail (402), and the two are fixed on the sliding block (403); a second mounting block (405) is fixed on the two guide rail seats (401), a second electric cylinder (406) is fixed on the second mounting block (405), and the protruding end of the second electric cylinder (406) is fixed on the seat body (404); An auxiliary component (7) is mounted on the two guide rail seats (401), and the auxiliary component (7) is composed of a mounting frame (701) and a cleaning block (702). A mounting frame (701) is fixed on the two guide rail seats (401), and the left open end of the mounting frame (701) is a V-shaped structure, and the bottom end surface of the mounting frame (701) is 0.1 cm higher than the top end surface of the wafer (5); A cleaning block (702) is fixed to the bottom end surface of the mounting frame (701), and the cleaning block (702) is located on the right side of the wafer (5), and the bottom end surface of the cleaning block (702) is flush with the top end surface of the wafer (5).

2. A conveying device for a coating and developing device as claimed in claim 1, characterized in that: Two third electric cylinders (407) are fixed on the base (404), and the protruding ends of the two third electric cylinders (407) are fixed to the bottom end surface of the placement base (408), and a wafer (5) is placed in the placement groove on the placement base (408).

3. A conveying device for a coating and developing device as claimed in claim 2, characterized in that: An auxiliary seat (301) is fixed on the top surface of the base (1). The auxiliary seat (301) is a concave structure. Two guide rods (302) slide on the auxiliary seat (301). The upper ends of the two guide rods (302) are welded to the bottom surface of the first mounting block (3).

4. A conveying device for a coating and developing device as claimed in claim 3, characterized in that: A cleaning assembly (8) is mounted on the base (404). The cleaning assembly (8) is composed of a telescopic bottle (801), a contact rod (802), a mounting arm (803), an air jet tube (804), and a protrusion (805). A telescopic bottle (801) is fixed to the bottom end surface of the base (404). A coil spring for elastic reset is mounted in the telescopic bottle (801). The telescopic bottle (801) is connected to the air jet tube (804) via a pipe. When the telescopic bottle (801) is squeezed, the air jet tube (804) is in an air jet state. The air jet tube (804) is fixed to a guide rail base (401) on the front side via two mounting arms (803).

5. A conveying device for a coating and developing device as claimed in claim 4, characterized in that: A rear end face of one of the guide rail seats (401) on the front side is welded with a protrusion (805) in a linear array shape, and the protrusion (805) is a semi-cylindrical structure; a contact rod (802) is fixed to one end of the front side of the telescopic bottle (801), and the front end of the contact rod (802) contacts the rear end face of one of the guide rail seats (401) on the front side. When the seat body (404) moves to the right, the contact rod (802) and the protrusion (805) are elastically contacted in sequence.

6. A conveying device for a coating and developing device as claimed in claim 5, characterized in that: A rotating assembly (6) is installed on the placement seat (408), and the rotating assembly (6) consists of a rotating shaft (601), a rotating wheel (602) and a driving wheel (603). Two rotating shafts (601) rotate on the seat body (404), and a rotating wheel (602) is fixed to the lower end of each rotating shaft (601), and the outer walls of the two rotating wheels (602) are in contact with the inner walls of the two guide rail seats (401) respectively; a driving wheel (603) is fixed to the upper end of each rotating shaft (601), and the outer walls of the two driving wheels (603) are in contact with the outer wall of the wafer (5).

Images