Simulation assembly method and device for 3D (three-dimensional) model and PCB (printed circuit board) packaging model of component

Abstract

The invention provides a simulation assembly method and device for a component 3D model and a PCB packaging model. The method comprises the steps that the component 3D model to be simulated and assembled and the PCB packaging model to be simulated and assembled are acquired; analyzing the PCB packaging model, and repositioning the origin and direction of a coordinate system of the PCB packaging model; performing profile analysis on the 3D model to generate a plurality of mounting surface patterns, and determining a target mounting surface pattern with the highest adaptation degree with an assembly layer of the PCB packaging model in the mounting surface patterns; based on the original point and direction of the coordinate system repositioned by the PCB packaging model and the target mounting surface pattern, automatically adjusting the original point and direction of the coordinate system of the 3D model so as to align the assembly relationship between the 3D model and the PCB packaging model; and outputting the 3D digital prototype after simulation assembly based on the aligned assembly relationship. According to the invention, errors caused by inconsistent position information between the components and between the components and the PCB are eliminated, and the assembly precision and efficiency are greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product design, and more particularly, to a method and device for simulating the assembly of a 3D model of a component and a PCB package model. Background Art

[0002] In modern electronic product design, it is crucial to evaluate the assemblability and testability of the internal structure of a circuit board PCBA and component products during design. During the assembly stage, the precise positioning of components is directly related to the performance and reliability of the product.

[0003] However, the 3D models of components and PCB package models are usually modeled by different designers, resulting in inconsistent origin points and directions of the models. The traditional assembly simulation process relies on manual adjustment of the relative positions and origin point settings of the 3D models of components and PCB package models to output a correct 3D digital prototype. This not only requires too many manual steps but also easily leads to positioning errors and reduces assembly efficiency. Especially for complex multi-layer circuit boards and flexible circuit boards, the coordinated assembly of components is more difficult, further increasing the complexity and error rate of assembly. Summary of the Invention

[0004] The main objective of the present invention is to provide a method, device, electronic device, and storage medium for simulating the assembly of a 3D model of a component and a PCB package model, aiming to solve the technical problems of positioning errors and low assembly efficiency in the existing assembly simulation due to inconsistent coordinate systems of the 3D models of components and PCB package models.

[0005] In a first aspect, the present invention provides a method for simulating the assembly of a 3D model of a component and a PCB package model, including:

[0006] Obtaining the 3D model of the component and the PCB package model to be simulated for assembly;

[0007] Analyzing the PCB package model and repositioning the origin point and direction of the coordinate system of the PCB package model;

[0008] Performing a sectional analysis on the 3D model to generate a plurality of mounting surface patterns and determining a target mounting surface pattern with the highest degree of fitness for the assembly layer of the PCB package model among the mounting surface patterns;

[0009] Automatically adjusting the origin point and direction of the coordinate system of the 3D model based on the repositioned origin point and direction of the coordinate system of the PCB package model and the target mounting surface pattern to align the assembly relationship between the 3D model and the PCB package model;

[0010] Output a 3D digital prototype that has completed simulated assembly based on the assembly relationship after alignment of the 3D model and the PCB package model.

[0011] Further, the analysis of the PCB package model and the repositioning of the origin and direction of the coordinate system of the PCB package model include:

[0012] Obtain the pad information of the PCB package model by analyzing the expression structure of the PCB package model; wherein, the pad information includes the pad type, pad quantity and size, package position, package direction, package layout, and assembly layer information for the components to be soldered and installed.

[0013] Reposition the origin and direction of the coordinate system of the PCB package model based on the pad information.

[0014] Further, the repositioning of the origin and direction of the coordinate system of the PCB package model based on the pad information includes:

[0015] Determine the coordinate system update rule for the PCB package model based on the pad type in the pad information.

[0016] Reposition the origin and direction of the coordinate system of the PCB package model based on the coordinate system update rule, the assembly layer information and the package position in the pad information.

[0017] Further, the coordinate system update rule includes:

[0018] For symmetric components, set its geometric center as the origin of the coordinate system of the PCB package model; for asymmetric components, set the center point of its first pin as the origin of the coordinate system of the PCB package model.

[0019] Adjust the X-axis and Y-axis directions of the coordinate system of the PCB package model according to the relative position relationship between the center point of the first pin and its geometric center in such a way that the center point of the first pin is located at the upper left corner of the coordinate system of the PCB package model.

[0020] Further, the profile analysis of the 3D model, generating multiple mounting surface patterns, and determining the target mounting surface pattern with the highest adaptability to the assembly layer of the PCB package model include:

[0021] Perform a profile analysis on the 3D model, and generate multiple mounting surface patterns by gradually enumerating profiles in multiple axis directions of the coordinate system of the 3D model.

[0022] Compare the PCB package model and the mounting surface pattern one by one to determine the target mounting surface pattern in the mounting surface pattern with the highest fitting degree to the assembly layer of the PCB package model; wherein, the fitting degree of the assembly layer includes shape fitting degree, size fitting degree and position fitting degree.

[0023] Further, based on the repositioned coordinate system origin and coordinate system direction of the PCB package model, and the target mounting surface pattern, automatically adjust the coordinate system origin and coordinate system direction of the 3D model to align the assembly relationship between the 3D model and the PCB package model, including:

[0024] Coincide the target mounting surface pattern with the assembly layer of the PCB package model for simulated assembly;

[0025] Calculate the relative position and direction relationship between the coordinate system of the 3D model and the repositioned coordinate system of the PCB package model;

[0026] Based on the relative position and direction relationship, rotate and translate the 3D model to align the coordinate system origin and direction of the 3D model with the repositioned coordinate system origin and direction of the PCB package model respectively, so as to align the assembly relationship between the 3D model and the PCB package model.

[0027] Further, after outputting the 3D digital prototype that has completed the simulated assembly based on the aligned assembly relationship between the 3D model and the PCB package model, the method further includes:

[0028] Generate a PCB package model and a 3D model that meet the requirements of simulated assembly.

[0029] In a second aspect, the present invention provides a simulated assembly device for a component 3D model and a PCB package model, including:

[0030] A 3D model and PCB package model acquisition module for acquiring a component 3D model and a PCB package model to be simulated for assembly;

[0031] A PCB package model repositioning module for analyzing the PCB package model and repositioning the coordinate system origin and coordinate system direction of the PCB package model;

[0032] A target mounting surface pattern determination module for performing a sectional analysis on the 3D model, generating a plurality of mounting surface patterns, and determining the target mounting surface pattern in the mounting surface patterns with the highest fitting degree to the assembly layer of the PCB package model;

[0033] A 3D model and PCB package model alignment module, which is used to automatically adjust the coordinate origin and coordinate direction of the 3D model based on the coordinate origin and coordinate direction of the repositioned PCB package model and the target mounting surface pattern, so as to align the assembly relationship between the 3D model and the PCB package model;

[0034] A 3D digital prototype output module, which is used to output a 3D digital prototype that has completed simulated assembly based on the assembly relationship after the alignment of the 3D model and the PCB package model.

[0035] In a third aspect, the present invention provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor. When the processor executes the computer program, it implements a method for simulating the assembly of a 3D model of a component and a PCB package model as described in the first aspect.

[0036] In a fourth aspect, the present invention provides a computer-readable storage medium, which stores a computer program. When the computer program runs, it controls the device where the computer-readable storage medium is located to execute a method for simulating the assembly of a 3D model of a component and a PCB package model as described in the first aspect.

[0037] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0038] By analyzing the PCB package model, repositioning the coordinate origin and coordinate direction of the PCB package model, then performing a sectional analysis on the 3D model, generating multiple mounting surface patterns, and determining the target mounting surface pattern with the highest adaptability to the assembly layer of the PCB package model, based on the updated coordinate origin and coordinate direction of the PCB package model and the target mounting surface pattern, automatically adjusting the coordinate origin and coordinate direction of the 3D model to align the assembly relationship between the 3D model and the PCB package model, and finally, based on the assembly relationship after the alignment of the 3D model and the PCB package model, outputting a 3D digital prototype that has completed simulated assembly, that is, automatically aligning the coordinate origin and direction of the 3D model and the PCB package model, and then performing assembly simulation on the 3D model of the component and the PCB package model, realizing automated coordinate system adjustment for assembly, which can effectively eliminate the errors caused by inconsistent position information between components and between components and the PCB, greatly improving the assembly accuracy and efficiency. In addition, the simulated assembly method of the present invention is executed by software algorithms, and the software algorithms replace the manual processing part, greatly reducing manual intervention, ensuring the reliability and consistency of the assembly process, providing strong technical support for the efficient production of electronic products, and will greatly promote the development of intelligent manufacturing and automated assembly. Description of the Drawings

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0040] Figure 1 It is a schematic flowchart of a method for simulating the assembly of a 3D model of a component and a PCB package model provided by an embodiment of the present invention;

[0041] Figure 2 It is a schematic diagram of the initial structure of a pad of a PCB package model provided by an embodiment of the present invention;

[0042] Figure 3 It is a schematic diagram of the structure of a pad of a PCB package model after repositioning the origin of the coordinate system provided by an embodiment of the present invention;

[0043] Figure 4 It is a schematic diagram of the structure of a pad of a PCB package model after repositioning the origin and direction of the coordinate system provided by an embodiment of the present invention;

[0044] Figure 5 It is a schematic diagram of the initial structure of a 3D model of a component provided by an embodiment of the present invention;

[0045] Figure 6 It is a schematic diagram of the cross-sectional structure of a 3D model of a component provided by an embodiment of the present invention;

[0046] Figure 7 It is a schematic diagram of the cross-sectional structure of a 3D model of a component provided by another embodiment of the present invention;

[0047] Figure 8 It is a schematic diagram of the cross-sectional structure of a 3D model of a component provided by still another embodiment of the present invention;

[0048] Figure 9 It is a schematic diagram of the overlapping structure of the target mounting surface pattern of a 3D model of a component and the assembly layer of a PCB package model provided by an embodiment of the present invention;

[0049] Figure 10 It is a schematic diagram of the structure of a 3D digital prototype after completing the simulated assembly provided by an embodiment of the present invention;

[0050] Figure 11 It is a schematic diagram of the structure of an apparatus for simulating the assembly of a 3D model of a component and a PCB package model provided by an embodiment of the present invention;

[0051] Figure 12 It is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. Detailed implementation manners

[0052] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0053] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0054] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0055] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above" and "on the top" of the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below" and "under the bottom" of the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is lower than that of the second feature.

[0056] Please refer to Figure 1 , Figure 1It is a schematic flowchart of a method for simulating the assembly of a 3D model of a component and a PCB package model provided by an embodiment of the present invention.

[0057] A method for simulating the assembly of a 3D model of a component and a PCB package model according to an embodiment of the present invention includes the following steps:

[0058] S100. Obtain the 3D model of the component and the PCB package model to be simulated for assembly.

[0059] In this embodiment, through the reading tool of electronic design automation (EDA) software, the files of the 3D model of the component and the PCB package model to be simulated for assembly are read. Please refer to Figure 2 and Figure 5 , Figure 2 which is a schematic diagram of the initial structure of the pads of a PCB package model provided by an embodiment of the present invention, Figure 5 and which is a schematic diagram of the initial structure of a 3D model of a component provided by an embodiment of the present invention. The 3D model file contains information such as the geometric shape, size, and position of the 3D model, and the PCB package model file contains information in various formats, such as text descriptions and graphic data.

[0060] S200. Analyze the PCB package model and reposition the origin and direction of the coordinate system of the PCB package model.

[0061] In this embodiment, by analyzing the expression structure of the PCB package model file, the corresponding package pad information is obtained, and then based on the package information, the origin and direction of the coordinate system of the PCB package model are repositioned.

[0062] Further, the step S200 of analyzing the PCB package model and repositioning the origin and direction of the coordinate system of the PCB package model includes the following steps:

[0063] S210. Obtain the pad information of the PCB package model by analyzing the expression structure of the PCB package model; wherein, the pad information includes the pad type, pad quantity and size, package position, package direction, package layout, and assembly layer information for welding and installing the component;

[0064] S220. Reposition the origin and direction of the coordinate system of the PCB package model based on the pad information.

[0065] In this embodiment, by analyzing the expression structure of the package file, the pad information in the PCB package model is obtained, such as the pad type and pad quantity and size for welding and installing, and at the same time, information such as the package position, direction, and layout is extracted. These pad information can be used to reposition the origin and direction of the coordinate system of the PCB package model.

[0066] Further, based on the pad information, the origin and direction of the coordinate system of the PCB package model are repositioned in step S220, including the following steps:

[0067] S221. Determine the coordinate system update rule of the PCB package model based on the pad type in the pad information;

[0068] S222. Reposition the origin and direction of the coordinate system of the PCB package model based on the coordinate system update rule, the assembly layer information and the package position in the pad information.

[0069] In this embodiment, based on the pad type in the pad information, it is determined whether it belongs to surface mount, through-hole mount or bolt type, etc. For example, for a surface-mounted PCB package model, information such as the shape, size, and pitch of the pads needs to be obtained; for a through-hole-mounted PCB package model, information such as the number, diameter, and length of the pins needs to be obtained. Different pad types will have different processing methods in subsequent coordinate origin positioning and assembly processes. For example, surface mount usually requires more precise planar positioning, while through-hole mount pays more attention to the fit between the pins and the holes.

[0070] Further, the coordinate system update rule includes:

[0071] For symmetric components, set its geometric center as the origin of the coordinate system of the PCB package model; for asymmetric components, set the center point of its first pin as the origin of the coordinate system of the PCB package model;

[0072] According to the relative position relationship between the center point of the first pin and its geometric center, adjust the X-axis and Y-axis directions of the coordinate system of the PCB package model in such a way that the center point of the first pin is located at the upper left corner of the coordinate system of the PCB package model.

[0073] In this embodiment, for components with symmetric geometric shapes, set its geometric center as the origin of the coordinate system. This is because the physical characteristics and assembly requirements of symmetric devices are relatively uniform in all directions. Taking the geometric center as the origin can facilitate subsequent calculations and assembly operations, ensuring positioning accuracy and symmetry in all directions.

[0074] For asymmetric components, select the center point of the first pin as the origin of the coordinate system. The first pin (pin1) is usually the pin with specific identification and function on the device. Taking it as the origin can more accurately determine the position and direction of the component, facilitating connection and assembly with other components.

[0075] Meanwhile, for both symmetric components and asymmetric components, according to the assembly layer information and packaging position in the pad information, the position of the center point of the first pin relative to the geometric center of the PCB packaging model is further calculated. Then, the X and Y axes of the coordinate system are adjusted in such a way that the center point of the first pin is located at the upper left corner of the coordinate system of the PCB packaging model, that is, the upper left corner of the PCB packaging model is the origin of the coordinate system.

[0076] Exemplarily, as Figure 2 shown, for a rectangular symmetric packaging model with a pin1 label, its original coordinate system is O0-X0Y0, and its geometric center can be determined by calculating the intersection point of the diagonals of the rectangle. The determined origin of the coordinate system is as Figure 3 shown by O1 in Figure 4 Then, according to the relative position relationship between the center point of pin1 and the geometric center, the X and Y axis directions of the coordinate system of the PCB packaging model are adjusted so that the X axis direction of the adjusted coordinate system is as ’ shown by X1 in Figure 4 and the Y axis direction of the adjusted coordinate system is as ’ shown by Y1 in ’ -X1 ’ Y1 ’ at the upper left corner. For an asymmetric packaging model with a pin1 label, with the center point of pin1 as the origin of the coordinate system, according to the relative position relationship between the center point of pin1 and the geometric center, the X and Y axis directions of the coordinate system of the PCB packaging model are adjusted so that the center point of pin1 is located at the upper left corner of the coordinate system of the PCB packaging model.

[0077] S300. Perform a sectional analysis on the 3D model to generate multiple mounting surface patterns, and determine the target mounting surface pattern with the highest degree of fit to the assembly layer of the PCB packaging model.

[0078] In this embodiment, please refer to Figures 5 to 8 . Perform a sectional analysis on the read 3D model to generate multiple mounting surface patterns. The multiple mounting surface patterns are used to respectively match the assembly layers of the PCB packaging model, so as to determine the target mounting surface pattern with the highest degree of fit. The position of the mounting surface of the 3D model corresponding to this pattern is the position with the highest degree of fit to the assembly layer of the PCB packaging model. Subsequently, by overlapping the target mounting surface pattern with the assembly layer of the PCB packaging model and then aligning the coordinate system of the 3D model with the updated coordinate system of the PCB packaging model, the alignment of the assembly relationship between the 3D model and the PCB packaging model is achieved.

[0079] Further, step S300 performs a sectional analysis on the 3D model to generate multiple mounting surface patterns and determine a target mounting surface pattern with the highest degree of fit to the assembly layer of the PCB package model, including the following steps:

[0080] S310. Perform a sectional analysis on the 3D model, and gradually enumerate sections in multiple axis directions of the coordinate system of the 3D model to generate multiple mounting surface patterns;

[0081] S320. Compare the PCB package model and the mounting surface patterns one by one, and determine a target mounting surface pattern with the highest degree of fit to the assembly layer of the PCB package model; wherein, the degree of fit of the assembly layer includes shape fit, size fit, and position fit.

[0082] In this embodiment, a sectional analysis is performed on the 3D model. By gradually enumerating sections in three axis directions (X, Y, and Z axes) of the 3D model coordinate system, multiple mounting surface patterns are generated, as Figures 6 to 8 shown. For example, in the X-axis direction, starting from one end of the 3D model, sections are gradually intercepted at a certain interval; similar operations are also performed in the Y-axis and Z-axis directions. In this way, multiple sectional mounting surface patterns at different positions and directions can be obtained for simulating assembly analysis.

[0083] Then, compare the PCB package model and the mounting surface patterns of the 3D model one by one to find the position of the target mounting surface with the highest degree of fit to the assembly layer of the PCB package model in the 3D model. During the comparison process, factors such as the shape, size, and position of the mounting surface pattern, as well as the matching degree between the pads of the PCB package model and the corresponding positions on the 3D model, are considered, and a fit score is calculated. The higher the score, the higher the degree of fit of the mounting surface pattern. Then, the mounting surface pattern with the highest fit score is found from all the mounting surface patterns. Exemplarily, as Figure 4 shown, for the case where the pad layout of a PCB package model is rectangular, search for a rectangular target mounting surface pattern with a shape and size match in the multiple mounting surface patterns of the 3D model Figures 6 to 8 Obviously Figure 8 is more in line with the requirements, then Figure 8 shown is the target mounting surface pattern.

[0084] S400. Based on the repositioned coordinate system origin and coordinate system direction of the PCB package model, and the target mounting surface pattern, automatically adjust the coordinate system origin and coordinate system direction of the 3D model to align the assembly relationship between the 3D model and the PCB package model.

[0085] In this embodiment, the assembly relationship alignment between the 3D model and the PCB package model is achieved by overlapping the target mounting surface pattern with the assembly layer of the PCB package model and then aligning the coordinate system of the 3D model with the updated coordinate system of the PCB package model.

[0086] Further, step S400 automatically adjusts the origin and direction of the coordinate system of the 3D model based on the repositioned origin and direction of the coordinate system of the PCB package model and the target mounting surface pattern to align the assembly relationship between the 3D model and the PCB package model, including the following steps:

[0087] S410: Overlap the target mounting surface pattern with the assembly layer of the PCB package model for simulated assembly;

[0088] S420: Calculate the relative position and direction relationship between the coordinate system of the 3D model and the repositioned coordinate system of the PCB package model;

[0089] S430: Based on the relative position and direction relationship, rotate and translate the 3D model to align the origin and direction of the coordinate system of the 3D model with the repositioned origin and direction of the coordinate system of the PCB package model, thereby aligning the assembly relationship between the 3D model and the PCB package model.

[0090] Please refer to Figure 9 , in this embodiment, the target mounting surface pattern is overlapped with the assembly layer of the PCB package model, and the relative position and direction relationship between the coordinate system of the 3D model and the updated coordinate system of the PCB package model are calculated at this time. The rotation angle to be rotated is calculated, and then based on the rotation angle and the rotation axis, a rotation matrix is constructed, and the coordinate system of the 3D model is rotated through the rotation matrix to make the coordinate axis directions of the 3D model as consistent as possible with those of the PCB package model. During the rotation process, the origin of the coordinate system of the 3D model is used as the rotation center to ensure the relative stability of the position of the 3D model. Then, based on the rotation adjustment, the translation distance required for the 3D model is calculated. When the coordinate axis needs to be translated, a translation matrix (a translation matrix is a matrix composed of an identity matrix plus a translation vector) is constructed, and the 3D model is translated through the translation vector so that the origin of the coordinate system of the 3D model coincides with the origin of the coordinate system of the PCB package model, and the target mounting surface of the 3D model is completely aligned with the assembly layer of the package model. At this time, the coordinate system of the target mounting surface is also O1 ’ -X1 ’ Y1 ’ .

[0091] After completing the preliminary coordinate system adjustment, the assembly relationship between the 3D model and the PCB package model can be checked again, and parameters such as the distances and angles between key feature points can be calculated to verify whether the expected alignment effect has been achieved. If the ideal alignment state is not reached, further fine-tuning optimization can be carried out according to the error situation until the set assembly accuracy requirements are met.

[0092] S500. Output a 3D digital prototype of the completed simulated assembly based on the assembly relationship after the alignment of the 3D model and the PCB package model.

[0093] Please refer to Figure 10 , in this embodiment, output an effect diagram of the 3D digital prototype of the completed simulated assembly, visually showing the state after the assembly of the 3D model and the PCB package model, including information such as the positions and directions of various components.

[0094] Further, after outputting the 3D digital prototype of the completed simulated assembly based on the assembly relationship after the alignment of the 3D model and the PCB package model, the method further includes the following steps:

[0095] S600. Generate a PCB package model and a 3D model that meet the requirements of simulated assembly.

[0096] In this embodiment, PCB package model and 3D model files that meet the origin and direction of the coordinate system for assembly will also be generated, and these files can be used for subsequent design, manufacturing, and other processes.

[0097] In summary, the simulation assembly method for a component 3D model and a PCB package model provided by the embodiments of the present invention analyzes the PCB package model, relocates the origin and direction of the coordinate system of the PCB package model, then performs a sectional analysis on the 3D model to generate multiple mounting surface patterns, and determines the target mounting surface pattern with the highest fitting degree to the assembly layer of the PCB package model. Based on the updated origin and direction of the coordinate system of the PCB package model and the target mounting surface pattern, the origin and direction of the coordinate system of the 3D model are automatically adjusted to align the assembly relationship between the 3D model and the PCB package model. Finally, based on the aligned assembly relationship between the 3D model and the PCB package model, a 3D digital prototype of the completed simulation assembly is output, that is, the origin and direction of the coordinate system of the 3D model and the PCB package model are automatically aligned, and then the assembly simulation of the 3D model of the component and the PCB package model is carried out to realize the assembly of automatically adjusting the coordinate system, which can effectively eliminate the errors caused by inconsistent position information between components and between components and the PCB, and greatly improve the assembly accuracy and efficiency. In addition, the simulation assembly method of the present invention is executed by a software algorithm, and the software algorithm replaces the manual processing part, greatly reducing manual intervention, ensuring the reliability and consistency of the assembly process, providing strong technical support for the efficient production of electronic products, and will greatly promote the development of intelligent manufacturing and automated assembly.

[0098] Please refer to Figure 11 , Figure 11 which is a schematic structural diagram of a simulation assembly device for a component 3D model and a PCB package model provided by an embodiment of the present invention.

[0099] A simulation assembly device for a component 3D model and a PCB package model according to an embodiment of the present invention includes:

[0100] A 3D model and PCB package model acquisition module 11, configured to acquire a component 3D model and a PCB package model to be simulated for assembly;

[0101] A PCB package model relocation module 12, configured to analyze the PCB package model and relocate the origin and direction of the coordinate system of the PCB package model;

[0102] A target mounting surface pattern determination module 13, configured to perform a sectional analysis on the 3D model to generate multiple mounting surface patterns, and determine a target mounting surface pattern with the highest fitting degree to the assembly layer of the PCB package model;

[0103] The 3D model and PCB package model alignment module 14 is used to automatically adjust the origin and direction of the coordinate system of the 3D model based on the origin and direction of the coordinate system repositioned based on the PCB package model and the target mounting surface pattern, so as to align the assembly relationship between the 3D model and the PCB package model;

[0104] The 3D digital prototype output module 15 is used to output a 3D digital prototype that has completed simulated assembly based on the assembly relationship after the alignment of the 3D model and the PCB package model.

[0105] The simulated assembly device for the component 3D model and the PCB package model provided by the embodiment of the present invention can execute all the steps and functions of the simulated assembly method for the component 3D model and the PCB package model provided by any of the above embodiments, and the specific functions of this device will not be elaborated here.

[0106] Please refer to Figure 12 , Figure 12 which is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. The electronic device includes:

[0107] A processor 100, a memory 200, and a computer program stored in the memory 200 and configured to be executed by the processor 100. When the processor 100 executes the computer program, it implements the simulated assembly method for the component 3D model and the PCB package model in any of the above embodiments.

[0108] The processor 100 can be implemented in a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., and is used to execute relevant programs to implement the technical solutions provided by the embodiments of the present invention;

[0109] The memory 200 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM), etc. The memory 200 can store an operating system and other application programs. When implementing the technical solutions provided by the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory 200 and are called by the processor 100 to execute the simulated assembly method for the component 3D model and the PCB package model of the embodiments of the present invention;

[0110] The input / output interface 300 is used to implement information input and output;

[0111] A communication interface 400 is used to implement communication and interaction between this device and other devices. It can achieve communication through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.);

[0112] A bus 500 transmits information between various components of the device (such as a processor 100, a memory 200, an input / output interface 300, and a communication interface 400);

[0113] Among them, the processor 100, the memory 200, the input / output interface 300, and the communication interface 400 are communicatively connected to each other inside the device through the bus 500.

[0114] The embodiment of the present invention also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program. Among them, when the computer program runs, it controls the device where the computer-readable storage medium is located to execute the simulation assembly method of a component 3D model and a PCB package model in each of the above embodiments.

[0115] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely set relative to the processor, and these remote memories can be connected to the processor through a network. Examples of the above network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0116] The embodiments described in the embodiments of the present invention are for more clearly explaining the technical solutions of the embodiments of the present invention, and do not constitute a limitation on the technical solutions provided by the embodiments of the present invention. Those skilled in the art know that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present invention are equally applicable to similar technical problems.

[0117] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present invention, and may include more or fewer steps than those shown, or combine some steps, or different steps.

[0118] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0119] Those of ordinary skill in the art can understand that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, and their appropriate combinations.

[0120] In the description of the present invention and the above accompanying drawings, the terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0121] It should be understood that in the present invention, "at least one (item)" means one or more, and "a plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that there can be three relationships. For example, "A and / or B" can mean: only A exists, only B exists, and both A and B exist at the same time. Among them, A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship. "At least one (one) of the following" or its similar expression means any combination of these items, including any combination of single items (ones) or plural items (ones). For example, at least one (one) of a, b, or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0122] In several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the above division of units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces. The indirect coupling or communication connection of devices or units can be in electrical, mechanical, or other forms.

[0123] The units described above as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0124] In addition, each functional unit in various embodiments of the present invention may be integrated in a processing unit, may exist separately as individual physical units, or two or more units may be integrated in one unit. The above-mentioned integrated units may be implemented in the form of hardware or in the form of software functional units.

[0125] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in various embodiments of the present invention. The aforementioned storage medium includes: USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks, or optical discs and other various media that can store programs.

[0126] The preferred embodiments of the embodiments of the present invention have been described above with reference to the accompanying drawings. However, this does not limit the scope of the rights of the embodiments of the present invention. Any modifications, equivalent replacements, and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present invention shall fall within the scope of the rights of the embodiments of the present invention.

Claims

1. A method for simulating assembly of a component 3D model and a PCB packaging model, characterized in that: include: Obtain the 3D model of components and PCB package model to be simulated and assembled; Analyze the PCB packaging model and reposition the coordinate system origin and coordinate system direction of the PCB packaging model; Performing a cross-sectional analysis on the 3D model to generate a plurality of mounting surface patterns, and determining a target mounting surface pattern among the mounting surface patterns that has the highest degree of fit with the assembly layer of the PCB packaging model; Based on the relocated coordinate system origin and coordinate system direction of the PCB package model and the target mounting surface pattern, automatically adjusting the coordinate system origin and coordinate system direction of the 3D model to align the assembly relationship between the 3D model and the PCB package model; Based on the assembly relationship after the 3D model and the PCB packaging model are aligned, a 3D digital prototype that completes the simulated assembly is output.

2. The method for simulating assembly of a component 3D model and a PCB packaging model according to claim 1, characterized in that: The analyzing the PCB packaging model and relocating the coordinate system origin and coordinate system direction of the PCB packaging model includes: By analyzing the expression structure of the PCB package model, the pad information of the PCB package model is obtained; wherein the pad information includes the pad type, pad quantity, package position, package direction, package layout and assembly layer information of the components used for welding and installation; Based on the pad information, the coordinate system origin and coordinate system direction of the PCB package model are repositioned.

3. The method for simulating assembly of a component 3D model and a PCB packaging model according to claim 2, characterized in that: The repositioning of the coordinate system origin and the coordinate system direction of the PCB package model based on the pad information includes: Based on the pad type in the pad information, determining a coordinate system update rule of the PCB package model; Based on the coordinate system update rule, the assembly layer information and the package position in the pad information, the coordinate system origin and the coordinate system direction of the PCB package model are relocated.

4. The method for simulating assembly of a component 3D model and a PCB packaging model according to claim 3, characterized in that: The coordinate system update rules include: For symmetrical components, their geometric center is set as the origin of the coordinate system of the PCB packaging model; for asymmetrical components, the center point of their first pin is set as the origin of the coordinate system of the PCB packaging model; According to the relative position relationship between the center point of the first pin and its geometric center, the X-axis and Y-axis directions of the coordinate system of the PCB packaging model are adjusted in such a way that the center point of the first pin is located in the upper left corner of the coordinate system of the PCB packaging model.

5. The method for simulating assembly of a component 3D model and a PCB packaging model according to claim 1, characterized in that: The step of performing cross-section analysis on the 3D model to generate a plurality of mounting surface patterns, and determining a target mounting surface pattern among the mounting surface patterns that has the highest degree of fit with the assembly layer of the PCB packaging model, comprises: Performing cross-sectional analysis on the 3D model, by gradually enumerating cross-sections in multiple axis directions of the coordinate system of the 3D model to generate multiple mounting surface patterns; The PCB package model and the mounting surface patterns are compared one by one to determine the target mounting surface pattern among the mounting surface patterns that has the highest assembly layer fitness with the PCB package model; wherein the assembly layer fitness includes shape fitness, size fitness and position fitness.

6. The method for simulating assembly of a component 3D model and a PCB packaging model according to claim 5, characterized in that: The method of automatically adjusting the coordinate system origin and the coordinate system direction of the 3D model based on the repositioned coordinate system origin and the coordinate system direction of the PCB packaging model and the target mounting surface pattern to align the assembly relationship between the 3D model and the PCB packaging model includes: Overlapping the target mounting surface pattern with the assembly layer of the PCB package model to perform simulated assembly; Calculating the relative position and direction relationship between the coordinate system of the 3D model and the coordinate system of the relocated PCB packaging model; Based on the relative position and direction relationship, the 3D model is rotated and translated to align the coordinate system origin and direction of the 3D model with the repositioned coordinate system origin and direction of the PCB packaging model, thereby aligning the assembly relationship between the 3D model and the PCB packaging model.

7. A method for simulating assembly of a component 3D model and a PCB package model according to any one of claims 1 to 6, characterized in that: After outputting the 3D digital prototype after the simulated assembly is completed based on the assembly relationship after the 3D model and the PCB package model are aligned, the method further includes: Generate PCB package models and 3D models that meet simulation assembly requirements.

8. A simulation assembly device for a component 3D model and a PCB packaging model, characterized in that: include: 3D model and PCB package model acquisition module, used to acquire the 3D model of components and PCB package model to be simulated and assembled; A PCB package model repositioning module, used to analyze the PCB package model and reposition the coordinate system origin and coordinate system direction of the PCB package model; A target mounting surface pattern determination module is used to perform a profile analysis on the 3D model, generate a plurality of mounting surface patterns, and determine a target mounting surface pattern among the mounting surface patterns that has the highest degree of fit with the assembly layer of the PCB packaging model; A 3D model and PCB package model alignment module, for automatically adjusting the coordinate system origin and coordinate system direction of the 3D model based on the repositioned coordinate system origin and coordinate system direction of the PCB package model and the target mounting surface pattern, so as to align the assembly relationship between the 3D model and the PCB package model; The 3D digital prototype output module is used to output a 3D digital prototype that has completed the simulation assembly based on the assembly relationship after the 3D model and the PCB packaging model are aligned.

9. An electronic device, characterized in that: include: A processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein when the processor executes the computer program, a simulation assembly method for a component 3D model and a PCB packaging model as described in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute a simulation assembly method of a component 3D model and a PCB packaging model as described in any one of claims 1 to 7.

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